Display device and light emitting element transfer method

Abstract

The present application provides a method for transferring a display device and a light-emitting element, wherein the display device includes: a driving backplane; a plurality of light-emitting elements, spaced apart on the driving backplane, and the plurality of light-emitting elements are of different heights, and a preset height difference exists between the light-emitting element with the highest height and the light-emitting element with the lowest height among the plurality of light-emitting elements; a transparent adhesive layer, located on the side of at least some of the light-emitting elements facing away from the driving backplane, and covering at least part of the side surfaces of at least some of the light-emitting elements; wherein the height of the transparent adhesive layer is greater than or equal to the preset height difference, and the higher the height of the light-emitting element, the deeper its side surface is embedded in the transparent adhesive layer, so that the plurality of light-emitting elements are located on the same plane facing the driving backplane. Through the above-mentioned design method, light-emitting elements of different heights can be electrically connected to the driving backplane at the same time.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and specifically relates to a display device and a method for transferring a light-emitting element. Background Art

[0002] With the development of traditional flat-panel and micro-projection display technologies, Micro-LED (micro-light-emitting diode) technology, a promising future mainstream display technology, is attracting increasing attention due to its significant performance advantages. Micro-LEDs, which can be viewed as miniaturized LEDs that can be individually illuminated, offer advantages such as low power consumption, high brightness, high definition, and long life. They are poised to become a new display technology rivaling AMOLED displays.

[0003] To achieve full-color display, the Micro-LEDs installed on the driver backplane generally include red Micro-LEDs, blue Micro-LEDs, and green Micro-LEDs. Due to the different heights of Micro-LEDs of different luminous colors, when Micro-LEDs of different heights are transferred to the driver backplane at the same time, the Micro-LEDs of different luminous colors will be subjected to uneven force, making it difficult for Micro-LEDs of different luminous colors to form an electrical connection with the driver backplane at the same time. Summary of the Invention

[0004] The present application provides a display device and a method for transferring light-emitting elements, so that light-emitting elements of different heights can be electrically connected to a driving backplane at the same time.

[0005] In order to solve the above technical problems, a technical solution adopted in the present application is: providing a display device, comprising: a driving backplane; a plurality of light-emitting elements, arranged at intervals on the driving backplane, and the plurality of light-emitting elements are of different heights, and a preset height difference is formed between the light-emitting element with the highest height and the light-emitting element with the lowest height among the plurality of light-emitting elements; a transparent adhesive layer, located on a side of at least some of the light-emitting elements facing away from the driving backplane, and covering at least part of the side surfaces of at least some of the light-emitting elements; wherein the height of the transparent adhesive layer is greater than or equal to the preset height difference, and the higher the height of the light-emitting element, the deeper the side surface of the light-emitting element is embedded in the transparent adhesive layer, so that the plurality of light-emitting elements are located on the same plane facing the side of the driving backplane.

[0006] To solve the above technical problems, another technical solution adopted by the present application is to provide a method for transferring light-emitting elements, comprising: providing a transfer substrate provided with a transparent adhesive layer; wherein the transparent adhesive layer is not fully cured; disposing a plurality of light-emitting elements on the transparent adhesive layer at intervals; wherein the plurality of light-emitting elements are of different heights, a predetermined height difference exists between the tallest light-emitting element and the shortest light-emitting element among the plurality of light-emitting elements, and the height of the transparent adhesive layer is greater than or equal to the predetermined height difference; disposing a pressing plate on a side of the plurality of light-emitting elements facing away from the transparent adhesive layer, and driving the pressing plate to press down the plurality of light-emitting elements so that at least part of the side surfaces of at least some of the light-emitting elements are embedded in the transparent adhesive layer; wherein the higher the height of the light-emitting element, the deeper the side surfaces are embedded in the transparent adhesive layer, and the plurality of light-emitting elements are located on the same plane on the sides facing away from the transfer substrate; fully curing the transparent adhesive layer and removing the pressing plate; and disposing the side of the transfer substrate provided with the plurality of light-emitting elements opposite to a driver backplane, and electrically connecting the plurality of light-emitting elements facing the driver backplane to the driver backplane.

[0007] Different from the prior art, the beneficial effects of the present application are as follows: a transparent adhesive layer is provided in the display device provided by the present application, and the transparent adhesive layer is located on the side of at least part of the light-emitting elements facing away from the driving backplane, and covers at least part of the side surfaces of at least part of the light-emitting elements; wherein the height of the transparent adhesive layer is greater than or equal to the preset height difference between the highest light-emitting element and the lowest light-emitting element in the display device, and the higher the height of the light-emitting element, the deeper it is embedded in the transparent adhesive layer, thereby making it possible for multiple light-emitting elements to be located on the same plane facing the driving backplane. In the above design, the transparent adhesive layer is used to fix the positions of multiple light-emitting elements, and light-emitting elements of different heights can be embedded in the transparent adhesive layer so that all light-emitting elements facing the driving backplane are located on the same plane, thereby making it possible for all light-emitting elements facing the driving backplane to contact the solder at the same time to form an electrical connection synchronously. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive work, among which:

[0009] Figure 1 This is a schematic structural diagram of an embodiment of a display device of the present application;

[0010] Figure 2 This is a schematic structural diagram of another embodiment of the display device of the present application;

[0011] Figure 3 This is a schematic structural diagram of another embodiment of the display device of the present application;

[0012] Figure 4 This is a schematic structural diagram of another embodiment of the display device of the present application;

[0013] Figure 5 This is a schematic structural diagram of another embodiment of the display device of the present application;

[0014] Figure 6 for Figure 5 A schematic structural diagram of an embodiment of an anti-crosstalk component within the middle dotted frame;

[0015] Figure 7 This is a schematic structural diagram of another embodiment of the display device of the present application;

[0016] Figure 8 Schematic diagram of a process for transferring a light-emitting element according to an embodiment of the present invention;

[0017] Figure 9a for Figure 8 A structural diagram of an embodiment corresponding to step S101;

[0018] Figure 9b for Figure 8 A structural diagram of an embodiment corresponding to step S102;

[0019] Figure 9c for Figure 8 A structural diagram of an embodiment corresponding to step S103;

[0020] Figure 9d for Figure 8 A structural diagram of an embodiment corresponding to step S104;

[0021] Figure 9e for Figure 8 A structural diagram of an embodiment corresponding to step S105;

[0022] Figure 10 for Figure 8 A structural diagram of an implementation method corresponding to step S104 and step S105. DETAILED DESCRIPTION

[0023] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0024] See also Figure 1 , Figure 1 This is a structural diagram of an embodiment of a display device of the present application. The display device 1 can be a mobile phone, a tablet, etc. The display device 1 specifically includes a driving backplane 10, a plurality of light-emitting elements 12 and a transparent adhesive layer 14.

[0025] The driver backplane 10 is provided with a driving circuit, and the plurality of light-emitting elements 12 are electrically connected to the driving circuit and emit light under the action of the driving circuit. Optionally, the driving circuit may include a plurality of solder pads (not shown), and the plurality of solder pads are exposed from the side of the driver backplane 10 facing the plurality of light-emitting elements 12. The plurality of light-emitting elements 12 can be bonded to the solder pads at corresponding positions.

[0026] In this embodiment, the light emitting element 12 may be a Micro-LED, etc., and a plurality of light emitting elements 12 are arranged at intervals on the driver backplane 10, and the plurality of light emitting elements 12 are not of the same height, that is, the heights of the plurality of light emitting elements 12 are not completely the same or completely different. Figure 1 As shown in FIG, the plurality of light emitting elements 12 include a red light emitting element R, a green light emitting element G, and a blue light emitting element B. The red light emitting element R is generally made of a material system different from that of the green light emitting element G and the blue light emitting element B. Therefore, it is very difficult to achieve the same height for the red light emitting element R, the green light emitting element G, and the blue light emitting element B. The height of the red light emitting element R is generally greater than that of the green light emitting element G or the blue light emitting element B. Among them, the light emitting element 12 with the highest height among the plurality of light emitting elements 12 (for example, Figure 1 The red light emitting element R) and the light emitting element 12 with the lowest height (for example, Figure 1 There is a preset height difference D1 between the blue light emitting elements B).

[0027] The transparent adhesive layer 14 is located on the side of at least a portion of the light-emitting element 12 facing away from the driver backplane 10, and covers at least a portion of the side surfaces of at least a portion of the light-emitting element 12. In this embodiment, the material of the transparent adhesive layer 14 can be organic, for example, the material of the transparent adhesive layer 14 can be polyurethane, or epoxy resin, etc., and the light emitted by the light-emitting element 12 can be emitted after passing through the transparent adhesive layer 14. The height D2 of the transparent adhesive layer 14 is greater than or equal to the preset height difference D1, and the higher the height of the light-emitting element 12, the deeper its side surface is embedded in the transparent adhesive layer 14, so that multiple light-emitting elements 12 are located on the same plane facing the driver backplane 10. In addition, as Figure 1As shown in FIG, the side of the plurality of light-emitting elements 12 facing the driving backplate 10 is closer to the driving backplate 10 than the side of the transparent adhesive layer 14 facing the driving backplate 10, so that the side of the plurality of light-emitting elements 12 facing the driving backplate 10 is exposed from the transparent adhesive layer 14, and the side of the plurality of light-emitting elements 12 facing the driving backplate 10 is electrically connected to the driving backplate 10. Of course, in other embodiments, the side of the plurality of light-emitting elements 12 facing the driving backplate 10 may also be flush with the side of the transparent adhesive layer 14 facing the driving backplate 10, and the side of the plurality of light-emitting elements 12 facing the driving backplate 10 is electrically connected to the driving backplate 10. As for the side of the plurality of light-emitting elements 12 facing away from the driving backplate 10, the side of the light-emitting element 12 with the highest height among the plurality of light-emitting elements 12 facing away from the driving backplate 10 may be flush with the side of the transparent adhesive layer 14 facing away from the driving backplate 10; alternatively, the side of the light-emitting element 12 with the highest height among the plurality of light-emitting elements 12 facing away from the driving backplate 10 may be closer to the driving backplate 10 than the side of the transparent adhesive layer 14 facing away from the driving backplate 10.

[0028] For example, Figure 1 As shown in , when the height D2 of the transparent adhesive layer 14 is equal to the preset height difference D1, and the height of the red light-emitting element R is greater than the height of the green light-emitting element G, and the height of the green light-emitting element G is greater than the height of the blue light-emitting element B, in order to achieve that the red light-emitting element R, the green light-emitting element G and the blue light-emitting element B are located on the same plane facing the side of the driving backplane 10, the red light-emitting element R and the green light-emitting element G can be embedded in the transparent adhesive layer 14, and the embedding depth of the red light-emitting element R is greater than the depth of the green light-emitting element G.

[0029] For example, Figure 2 As shown in , when the height D2 of the transparent adhesive layer 14 is greater than the preset height difference D1, and the height of the red light-emitting element R is greater than the height of the green light-emitting element G, and the height of the green light-emitting element G is greater than the height of the blue light-emitting element B, in order to achieve that the red light-emitting element R, the green light-emitting element G and the blue light-emitting element B are located on the same plane facing the side of the driving backplane 10, the red light-emitting element R, the green light-emitting element G and the blue light-emitting element B can all be embedded in the transparent adhesive layer 14, and the embedding depth of the red light-emitting element R is greater than the depth of the green light-emitting element G, and the embedding depth of the green light-emitting element G is greater than the depth of the blue light-emitting element B.

[0030] In the above-mentioned design, a transparent adhesive layer 14 is used to fix the positions of the plurality of light-emitting elements 12, and the light-emitting elements 12 of different heights can be embedded in the transparent adhesive layer 14 so that all the light-emitting elements 12 facing the driving backplane 10 are located on the same plane, thereby making the sides of all the light-emitting elements 12 facing the driving backplane 10 contact the solder at the same time to form electrical connections synchronously.

[0031] In one embodiment, Figure 2As shown in , the light-emitting element 12 provided in the present application can be a horizontal light-emitting element, that is, the light-emitting element 12 includes a light-emitting body 122 and a first electrode 120a and a second electrode 120b located on the same side of the light-emitting body 122. The first electrode 120a and the second electrode 120b are exposed from the transparent adhesive layer 14 on the side facing the driving backplane 10. The first electrode 120a and the second electrode 120b are electrically connected to the driving backplane 10, and the first electrodes 120a and the second electrodes 120b of all light-emitting elements 12 are located on the same plane on the side facing the driving backplane 10. Optionally, in this embodiment, the surface of the transparent adhesive layer 14 facing the driving backplane 10 is flush with the surfaces of the first electrodes 120a and the second electrodes 120b facing the driving backplane 10, or the surface of the transparent adhesive layer 14 facing the driving backplane 10 is further away from the driving backplane 10 than the surfaces of the first electrodes 120a and the second electrodes 120b facing the driving backplane 10. The structure of the horizontal light-emitting element 12 is relatively simple, the process is easy to manufacture, and the manufacturing process complexity of the display device 1 can be reduced. On this basis, if Figure 3 As shown in Figure 3 This is a schematic diagram of the structure of another embodiment of the display device of the present application. The display device 1 provided in the present application may also include a transparent substrate 16, located on the side of the transparent adhesive layer 14 facing away from the driver backplane 10. The transparent substrate 16 may be made of glass or the like and may function as a cover plate, protecting the light-emitting elements 12. During the manufacturing process, the transparent substrate 16 may serve as a transfer substrate for the transparent adhesive layer 14 and the plurality of light-emitting elements 12. After the light-emitting elements 12 are electrically connected to the driver backplane 10, the transparent substrate 16 does not need to be removed, thereby reducing the complexity of the manufacturing process.

[0032] Of course, in other embodiments, such as Figure 4 As shown in Figure 4This is a schematic structural diagram of another embodiment of the display device of the present application; the light-emitting element 12 provided in the present application can also be a vertical light-emitting element, that is, the light-emitting element 12 includes a light-emitting body 122 and a first electrode 120a and a second electrode 120b located on opposite sides of the light-emitting body 122, and the first electrode 120a is electrically connected to the driving backplane 10, and the first electrodes 120a of all light-emitting elements 12 are located on the same plane facing the driving backplane 10. Optionally, in this embodiment, the surface of the transparent adhesive layer 14 facing the driving backplane 10 is flush with the surface of the first electrode 120a facing the driving backplane 10, or the surface of the transparent adhesive layer 14 facing the driving backplane 10 is farther away from the driving backplane 10 than the surface of the first electrode 120a facing the driving backplane 10. As for the side of the second electrode 120b, the surface of the transparent adhesive layer 14 facing away from the driving backplane 10 is flush with the surface of the second electrode 120b of the highest light-emitting element 12 facing away from the driving backplane 10, or the surface of the transparent adhesive layer 14 facing away from the driving backplane 10 is relatively far away from the driving backplane 10 relative to the surface of the second electrode 120b of the highest light-emitting element 12 facing away from the driving backplane 10; in this case, the transparent adhesive layer 14 can be provided with an opening at the position corresponding to the second electrode 120b, so that the second electrode 120b is exposed from the transparent adhesive layer 14. The structure of the above-mentioned vertical light-emitting element 12 is relatively simple, and the process is easy to prepare and form. On this basis, the display device provided by the present application can also include other electrical connection structures, which can be electrically connected to the second electrode 120b.

[0033] Also, see Figure 5 , Figure 5 This is a schematic diagram of the structure of another embodiment of the display device of the present application. A groove 140 is provided on the surface of the transparent adhesive layer 14 facing the driver backplane 10, and one such groove 140 is provided between adjacent light-emitting elements 12. The display device 1 provided herein also includes an anti-crosstalk member 18 located within the groove 140. The provision of the anti-crosstalk member 18 reduces the probability of light mixing between light of different colors emitted by adjacent light-emitting elements 12, thereby reducing light crosstalk.

[0034] Optionally, in this embodiment, if Figure 5 As shown in FIG, an anti-crosstalk member 18 is disposed on a sidewall (not shown) of the groove 140 and includes a reflective metal layer (e.g., a mirrored metal layer). Due to the opacity of the reflective metal layer, the probability of light crosstalk is reduced; and due to the reflective properties of the reflective metal layer, light emitted by adjacent light-emitting elements 12 can be reflected to the front surface 124 of the light-emitting element 12, thereby increasing the display brightness of the light-emitting element 12.

[0035] Alternatively, in this embodiment, please refer to Figure 5 and Figure 6 , Figure 6 for Figure 5 The dashed box in the middle shows a schematic diagram of the structure of an embodiment of an anti-crosstalk member. The anti-crosstalk member 18 is disposed on the sidewall of the groove 140. The anti-crosstalk member 18 includes at least one set of alternating low-refractive index film layers 180 and high-refractive index film layers 182, with the low-refractive index film layers 180 being closer to the sidewall of the groove 140 than the high-refractive index film layers 182. For example, the low-refractive index film layers 180 can be made of silicon oxide, and the high-refractive index film layers 182 can be made of silicon nitride, etc. A total internal reflection interface can be formed between the low-refractive index film layers 180 and the high-refractive index film layers 182. After light emitted by adjacent light-emitting elements 12 passes through this total internal reflection interface, most of the light is reflected to the front surface 124 of the light-emitting element 12, thereby reducing the probability of light crosstalk and increasing the display brightness of the light-emitting element 12. Furthermore, the refractive index of the transparent adhesive layer 14 can be greater than that of the low-refractive-index film layer 180 , and a total reflection interface can be formed between the transparent adhesive layer 14 and the low-refractive-index film layer 180 to further reduce the probability of light crosstalk and further increase the display brightness of the light-emitting element 12 .

[0036] Further, based on the anti-crosstalk member 18 in the above two embodiments, as Figure 5 As shown in , a first preset angle α is formed between the sidewall of the groove 140 and the first surface 142 of the transparent adhesive layer 14 on the side facing away from the driver backplane 10. The first preset angle α is in the range of 20°-70°; for example, the first preset angle α is 30°, 45°, 60°, etc. The setting of the above-mentioned first preset angle α can enable the light reflected by the anti-crosstalk member 18 to be emitted from the front surface 124 of the light-emitting element 12 as much as possible, thereby increasing the light intensity emitted from the front surface 124 of the light-emitting element 12. Optionally, in this embodiment, the vertical cross-section of the groove 140 in the direction from the driver backplane 10 to the transparent adhesive layer 14 is an inverted V-shape or a trapezoidal shape.

[0037] Of course, in other embodiments, such as Figure 7 As shown, Figure 7 This is a schematic diagram of the structure of another embodiment of the display device of the present application. The anti-crosstalk member 18 comprises a black insulating block that fills the groove 140. The black insulating block is relatively simple to manufacture and can absorb light emitted by adjacent light-emitting elements 12, reducing the probability of crosstalk. Optionally, in this embodiment, the vertical cross-section of the groove 140, in the direction from the driver backplane 10 to the transparent adhesive layer 14, is rectangular.

[0038] In addition, in this embodiment, Figure 5 or Figure 7As shown, the height of the transparent adhesive layer 14 is equal to the height of the light-emitting body 122 of the tallest light-emitting element 12, and the side surfaces of the light-emitting bodies 122 of all light-emitting elements 12 are embedded in the transparent adhesive layer 14. Alternatively, in other embodiments, the height of the transparent adhesive layer 14 may be greater than the height of the light-emitting body 122 of the tallest light-emitting element 12, in which case the side surfaces of the light-emitting bodies 122 of all light-emitting elements 12 are also embedded in the transparent adhesive layer 14. This design approach allows the transparent adhesive layer 14 to provide sufficient protection for the light-emitting elements 12; and when anti-crosstalk members 18 are provided within the transparent adhesive layer 14, this design approach can reduce the probability of crosstalk between adjacent light-emitting elements 12. Furthermore, on this basis, when grooves 140 are provided within the transparent adhesive layer 14, the depth of the grooves 140 can be greater than or equal to the depth of the tallest light-emitting element 12 embedded within the transparent adhesive layer 14; this design approach allows the anti-crosstalk members 18 to be provided around the sides of the light-emitting elements 12 embedded within the transparent adhesive layer 14, thereby improving the anti-crosstalk effect.

[0039] The following is a further explanation of the solution provided in this application from the perspective of method. Figure 8 , Figure 8 FIG. 1 is a flow chart of an embodiment of a method for transferring a light-emitting element of the present application. The method specifically includes:

[0040] S101 : providing a transfer substrate 11 provided with a transparent adhesive layer 14 ; wherein the transparent adhesive layer 14 is not completely cured.

[0041] Specifically, see Figure 9a , Figure 9a for Figure 8 In this embodiment, a transparent adhesive layer 14 can be formed on the surface of the transfer substrate 11 by using a glue coating device; at this time, the transparent adhesive layer 14 is not completely cured and its shape can change under the action of external force.

[0042] S102: Dispose a plurality of light emitting elements 12 on a transparent adhesive layer 14 at intervals; wherein a predetermined height difference D1 exists between the highest light emitting element 12 and the lowest light emitting element 12 among the plurality of light emitting elements 12, and a height D2 of the transparent adhesive layer 14 is greater than or equal to the predetermined height difference D1.

[0043] Specifically, see Figure 9b , Figure 9b for Figure 8 In this embodiment, a transfer device can be used to transfer the light emitting elements 12 of different colors to the surface of the transparent adhesive layer 14.

[0044] S103: A pressing plate 13 is provided on a side of the plurality of light-emitting elements 12 facing away from the transparent adhesive layer 14, and the pressing plate 13 is driven to press down the plurality of light-emitting elements 12 so that at least part of the side surfaces of at least part of the light-emitting elements 12 are embedded in the transparent adhesive layer 14; wherein, the higher the height of the light-emitting element 12, the deeper the side surfaces thereof are embedded in the transparent adhesive layer 14, and the plurality of light-emitting elements 12 are located on the same plane facing away from the transfer substrate 11.

[0045] Specifically, see Figure 9c , Figure 9c for Figure 8 In this embodiment, the pressing plate 13 can be set on the side of the plurality of light-emitting elements 12 facing away from the transfer substrate 11, and a vertical downward force is applied to the pressing plate 13, so that the pressing plate 13 drives at least some of the light-emitting elements 12 to be embedded in the transparent adhesive layer 14 until all the light-emitting elements 12 facing away from the transfer substrate 11 are located on the same plane. Figure 9c As shown in FIG, when the height D2 of the transparent adhesive layer 14 is less than the height D3 of the tallest light-emitting element 12, the surface of the transparent adhesive layer 14 near the pressing plate 13 is farther away from the pressing plate 13 than the surface of the tallest light-emitting element 12 near the pressing plate 13. In other embodiments, when the height D2 of the transparent adhesive layer 14 is greater than or equal to the height D3 of the tallest light-emitting element 12, the surface of the transparent adhesive layer 14 near the pressing plate 13 is flush with the surface of the tallest light-emitting element 12 near the pressing plate 13.

[0046] S104: The transparent adhesive layer 14 is completely cured, and the pressing plate 13 is removed.

[0047] Specifically, see Figure 9d , Figure 9d for Figure 8 In this embodiment, the transparent adhesive layer 14 can be completely cured and hardened by heating.

[0048] S105 : The side of the transfer substrate 11 provided with the plurality of light emitting elements 12 is arranged opposite to the driving backplane 10 , and the side of the plurality of light emitting elements 12 facing the driving backplane 10 is electrically connected to the driving backplane 10 .

[0049] Specifically, see Figure 9e , Figure 9e for Figure 8 A structural diagram of an embodiment corresponding to step S105 in FIG. In this embodiment, Figure 9d The structure in FIG is inverted on a driving backplane 10 provided with solder, and the light emitting element 12 is electrically connected to the driving backplane 10 by heating and pressurizing.

[0050] In the above design, through the combined action of the pressure plate 13 and the transparent adhesive layer 14 , multiple light-emitting elements 12 can be located on the same plane facing the driving backplane 10 , thereby enabling multiple light-emitting elements 12 to be electrically connected to the driving backplane 10 at the same time.

[0051] Also, see Figure 10 , Figure 10 for Figure 8 Schematic diagram of the structure of an embodiment corresponding to step S104 and step S105 in FIG. Between steps S104 and S105, the method provided herein may further include: forming a groove 140 in the transparent adhesive layer 14 between adjacent light-emitting elements 12; and forming an anti-crosstalk member 18 within the groove 140. In this design, the introduction of the anti-crosstalk member 18 reduces the probability of crosstalk between adjacent light-emitting elements 12.

[0052] In some cases, when the transfer substrate 11 is a transparent substrate and the light-emitting element 12 is a horizontal light-emitting element 12, the transfer substrate 11 can be retained after the above step S105 without being removed. When the transfer substrate 11 is a non-transparent substrate, or the light-emitting element 12 is a vertical light-emitting element 12 (that is, when the light-emitting element 12 is only provided with a first electrode on the side facing the driving backplane 10), after the above step S105, the transfer method provided in the present application further includes: removing the transfer substrate 11. Furthermore, when the light-emitting element 12 is covered by a transparent adhesive layer 14 on the side facing away from the driving backplane 10, after the above-mentioned removal of the transfer substrate 11, an opening can also be formed in the transparent adhesive layer 14 on the side of the light-emitting element 12 facing away from the driving backplane 10, and other electrical connection structures can be subsequently formed in the opening.

[0053] The above description is merely an embodiment of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A display device, characterized in that: include: Driver backplane; A plurality of light-emitting elements are arranged at intervals on the driving backplane, and the plurality of light-emitting elements are of different heights, and a preset height difference is formed between the light-emitting element with the highest height and the light-emitting element with the lowest height among the plurality of light-emitting elements; a transparent adhesive layer located on a side of at least some of the light-emitting elements facing away from the driver backplane and covering at least a portion of the side surfaces of at least some of the light-emitting elements; wherein the height of the transparent adhesive layer is greater than or equal to the predetermined height difference, and the higher the height of the light-emitting element, the deeper the side surface of the light-emitting element is embedded in the transparent adhesive layer, so that the light-emitting elements facing the driver backplane are located on the same plane; The transparent adhesive layer is provided with a plurality of grooves on a surface facing the driving back plate, and one groove is provided between two adjacent light-emitting elements; the display device further includes an anti-crosstalk component located in the groove; The anti-crosstalk component is disposed on the sidewall of the groove, and the anti-crosstalk component includes at least one set of alternating low-refractive index film layers and high-refractive index film layers, and the low-refractive index film layers are closer to the sidewall than the high-refractive index film layers; or the anti-crosstalk component includes a black insulating block, and the black insulating block fills the groove; The light-emitting element includes a light-emitting body, the height of the transparent adhesive layer is greater than or equal to the height of the light-emitting body of the light-emitting element with the highest height, and all side surfaces of the light-emitting body are embedded in the transparent adhesive layer; The depth of the groove is greater than or equal to the depth of the light emitting element with the highest height embedded in the transparent adhesive layer.

2. The display device according to claim 1, wherein The anti-crosstalk component is arranged on the side wall of the groove, and the anti-crosstalk component includes at least one group of alternating low-refractive index film layers and high-refractive index film layers, and the low-refractive index film layer is closer to the side wall relative to the high-refractive index film layer; the refractive index of the transparent adhesive layer is greater than the refractive index of the low-refractive index film layer.

3. The display device according to claim 2, wherein: A first preset angle is formed between the sidewall of the groove and the first surface of the transparent adhesive layer facing away from the driving back plate, and the first preset angle is within the range of 20°-70°.

4. The display device according to claim 1, wherein The light-emitting element further includes a first electrode and a second electrode located on the same side of the light-emitting body, the first electrode and the second electrode are electrically connected to the driving backplane respectively, and the first electrode and the second electrode of all the light-emitting elements are located on the same plane facing the driving backplane.

5. The display device according to claim 4, wherein: The display device further includes a transparent substrate located on a side of the transparent adhesive layer away from the driving backplane.

6. The display device according to claim 2, wherein: The light-emitting element further includes a first electrode and a second electrode located on opposite sides of the light-emitting body; and the first electrode is electrically connected to the driving backplane, and the first electrodes of all the light-emitting elements are located on the same plane facing the driving backplane.

7. A method for transferring a light-emitting element, characterized in that: include: Providing a transfer substrate provided with a transparent adhesive layer; wherein the transparent adhesive layer is not completely cured; A plurality of light-emitting elements are spaced apart and disposed on the transparent adhesive layer; wherein the plurality of light-emitting elements are of different heights, a predetermined height difference exists between the tallest light-emitting element and the shortest light-emitting element, and the height of the transparent adhesive layer is greater than or equal to the predetermined height difference; the light-emitting elements include light-emitting bodies, the height of the transparent adhesive layer is greater than or equal to the height of the light-emitting body of the tallest light-emitting element, and the side surfaces of all the light-emitting bodies are embedded in the transparent adhesive layer; A pressing plate is provided on a side of the plurality of light-emitting elements facing away from the transparent adhesive layer, and the pressing plate is driven to press down the plurality of light-emitting elements so that at least part of the side surfaces of at least some of the light-emitting elements are embedded in the transparent adhesive layer; wherein the higher the height of the light-emitting element, the deeper the side surfaces are embedded in the transparent adhesive layer, and the plurality of light-emitting elements are located on the same plane facing away from the transfer substrate; Completely solidifying the transparent adhesive layer and removing the pressing plate; The side of the transfer substrate provided with the plurality of light-emitting elements is arranged opposite to the driving backplane, and the side of the plurality of light-emitting elements facing the driving backplane is electrically connected to the driving backplane; Before the step of arranging the side of the transfer substrate provided with the plurality of light-emitting elements opposite to the driving backplane, the method includes: forming a groove on the transparent adhesive layer between adjacent light-emitting elements; wherein the depth of the groove is greater than or equal to the depth of the light-emitting element with the highest height embedded in the transparent adhesive layer; An anti-crosstalk member is formed in the groove, wherein the anti-crosstalk member is arranged on the side wall of the groove, the anti-crosstalk member includes at least one group of alternating low-refractive index film layers and high-refractive index film layers, and the low-refractive index film layers are closer to the side wall relative to the high-refractive index film layers; or, the anti-crosstalk member includes a black insulating block, and the black insulating block fills the groove.

8. The transfer method according to claim 7, characterized in that In response to the transfer substrate being a non-transparent substrate, or the light-emitting element having only a first electrode provided on the side facing the driving backplane, after the step of electrically connecting the multiple light-emitting elements facing the driving backplane to the driving backplane, the step further includes: removing the transfer substrate.

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