A heat dissipation system

Abstract

This application provides a heat dissipation system. In this embodiment, the heat dissipation system includes: a heat dissipation box with a first cooling port on its sidewall, a heat dissipation channel, and a device to be cooled placed in the heat dissipation box. The device to be cooled has a second cooling port on its carrier. The first cooling port and the second cooling port are connected. One end of the heat dissipation channel is connected to the second cooling port, and the other end of the heat dissipation channel extends to the device to be cooled, directly dissipating heat for the device. This effectively improves the problem of low overall flow rate and inability to locally accelerate flow in immersion liquid cooling. Furthermore, by utilizing the fluid in the heat dissipation channel to centrally dissipate heat for the corresponding device, the problem of energy saving due to increased overall flow rate is avoided, ensuring improved heat dissipation capacity while achieving energy saving.

Description

Technical Field

[0001] This application relates to the field of equipment heat dissipation, and more particularly to a heat dissipation system. Background Technology

[0002] Immersion liquid cooling refers to placing the entire device to be cooled into a cooling tank filled with refrigerant. The refrigerant flows upward from the bottom of the tank at a uniform flow rate, thus dissipating heat from the device. However, different devices have different power consumptions, and the uniform flow rate design of immersion liquid cooling cannot provide different flow rates for devices with varying power consumptions. If the flow rate of all liquids in the cooling tank is significantly increased for a few high-power devices, it greatly increases the power consumption of the water pump, resulting in poor energy efficiency. Summary of the Invention

[0003] In view of this, the present application provides a heat dissipation system to dissipate heat on the corresponding device to be cooled through a heat dissipation channel, thereby providing different flow rates for devices with different power consumption, avoiding the problem of greatly increasing the power consumption of the water pump and poor energy efficiency by increasing the overall flow rate.

[0004] According to a first aspect of the embodiments of this application, a heat dissipation system is provided, the heat dissipation system comprising: a heat dissipation box, a heat dissipation channel, and a device to be cooled placed in the heat dissipation box.

[0005] The heat sink has a first cooling vent on its side wall.

[0006] The device to be cooled has a second cooling port on its carrier, and the first cooling port is connected to the second cooling port; one end of the heat dissipation channel is connected to the second cooling port, and the other end of the heat dissipation channel extends to the device to be cooled.

[0007] Optionally, a quick-connect male connector is provided at the first cooling port, and a quick-connect female connector is provided at the second cooling port; or a quick-connect male connector is provided at the second cooling port, and a quick-connect female connector is provided at the first cooling port; the quick-connect male connector and the quick-connect female connector are plugged in to connect the first cooling port and the second cooling port.

[0008] Optionally, the heat dissipation channel is formed in the hollow part of the connecting pipe, one end of the connecting pipe is connected to the second cooling port, and the other end of the connecting pipe extends to the device to be cooled.

[0009] Optionally, the connecting pipeline includes: a pipeline body and a distributor, the pipeline body being connected to the distributor, and the distributor having at least two outlets, each outlet facing the device to be cooled.

[0010] Optionally, the connecting pipeline includes: a main pipeline and at least two branch pipelines, wherein the at least two branch pipelines are connected in parallel and are all connected to the main pipeline.

[0011] Optionally, the connecting pipeline is a rigid pipeline or a flexible pipeline.

[0012] Optionally, the carrier of the device to be cooled is provided with at least two partitions, the at least two partitions are spaced apart, and the heat dissipation channel is formed in the gap between the at least two partitions.

[0013] Optionally, the second cooling port includes a second cooling port I, which faces the device to be cooled, and the heat dissipation channel extends from the second cooling port I in a straight line to the device to be cooled; and / or

[0014] The second cooling port includes a second cooling port II, which is not directly opposite the device to be cooled, and the heat dissipation channel extends from the second cooling port II along a curved direction to the device to be cooled.

[0015] Optionally, the heat dissipation system further includes: a cold head, which is disposed on the carrier of the device to be cooled, and the cold head is connected to at least two connecting pipes, at least one connecting pipe for conveying fluid to the cold head, and at least one connecting pipe for conveying fluid flowing out of the cold head.

[0016] Optionally, multiple first cooling ports are provided, and the multiple first cooling ports are provided on the same side wall or different side walls of the heat sink.

[0017] Optionally, the device to be cooled includes: device I and device II, wherein the power of device I is greater than the power of device II, and the heat dissipation channel includes heat dissipation channel I and heat dissipation channel II, wherein heat dissipation channel I extends to device I and heat dissipation channel II extends to device II, and the flow area of ​​heat dissipation channel I is greater than the flow area of ​​heat dissipation channel II.

[0018] Optionally, the heat dissipation system further includes a first motor pump and a second motor pump. The device to be cooled includes: device I and device II, wherein the power of device I is greater than the power of device II. The heat dissipation channel includes heat dissipation channel I and heat dissipation channel II, wherein heat dissipation channel I extends to device I and heat dissipation channel II extend to device II. The first motor pump is used to drive the fluid in heat dissipation channel I; the second motor pump is used to drive the fluid in heat dissipation channel II, wherein the power of the first motor pump is greater than the power of the second motor pump.

[0019] Optionally, a third cooling port is provided on the carrier of the device to be cooled, and the third cooling port is connected to the space where the device to be cooled is located.

[0020] Optionally, the carrier of the device to be cooled includes multiple sidewalls, and at least two sidewalls are provided with a third cooling port; and / or

[0021] The carrier of the device to be cooled includes multiple sidewalls, and at least one sidewall is covered with the third cooling port.

[0022] The technical solutions provided in this application embodiment may include the following beneficial effects:

[0023] In this embodiment of the application, the heat dissipation system includes: a heat dissipation box with a first cooling port on the side wall, a heat dissipation channel, and a device to be cooled placed in the heat dissipation box. The device to be cooled has a second cooling port on its carrier. The first cooling port is connected to the second cooling port. One end of the heat dissipation channel is connected to the second cooling port, and the other end of the heat dissipation channel extends to the device to be cooled, directly dissipating heat for the device to be cooled. This can effectively improve the problem of low overall flow rate and inability to accelerate local flow in immersion liquid cooling.

[0024] Furthermore, by utilizing the fluid in the heat dissipation channel to centrally dissipate heat for the corresponding equipment, the problem of energy saving by increasing the overall flow rate is avoided, thus ensuring the improvement of heat dissipation capacity while achieving energy saving. Attached Figure Description

[0025] Figure 1 This is a block diagram of the heat dissipation system provided in the embodiments of this application.

[0026] Figure 2 This is a block diagram of the heat sink provided in an embodiment of this application.

[0027] Figure 3 This is a block diagram of the heat dissipation device provided in the embodiments of this application.

[0028] Figure 4 This is a block diagram illustrating a specific example of quick-connect female connector deployment provided in this application embodiment.

[0029] Figure 5 This is a block diagram of a heat dissipation device with a shunt provided in an embodiment of this application.

[0030] Figure 6 This is a block diagram of a connecting pipeline including a main pipeline and branch pipelines, provided in an embodiment of this application.

[0031] Figure 7 This is a block diagram of a heat dissipation device with a partition provided in an embodiment of this application.

[0032] Figure 8This is a block diagram of a heat dissipation device with a cold head provided in an embodiment of this application. Detailed Implementation

[0033] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0034] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “the,” and “the” used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0035] It should be understood that although the terms first, second, third, etc., may be used in this application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to determination."

[0036] The embodiments of this application will now be described in detail.

[0037] like Figure 1 As shown, Figure 1 This is a block diagram of a heat dissipation system shown in an embodiment of this application. The heat dissipation system includes: a heat dissipation box 11, a heat dissipation channel, and a device 12 to be cooled placed in the heat dissipation box.

[0038] For example, in this embodiment, such as Figure 2 As shown, the heat sink 11 has a first cooling port 111 on its side wall. Here, the heat sink 11 can be a box without a cover, and the side wall can be any side wall of the heat sink. This application embodiment does not specifically limit the specific side wall.

[0039] For example, such as Figure 2 As shown, the side wall of the first cooling port 111 is set as the bottom of the heat sink 11.

[0040] In this embodiment, there can be multiple first cooling ports 111. Multiple first cooling ports 111 are disposed on the same side wall or different side walls of the heat dissipation box 11, and are used to dissipate heat for multiple devices 12 to be cooled at the same time. As an example, the same device 12 to be cooled can be cooled by multiple first cooling ports 111.

[0041] For example, such as Figure 3 As shown, in this embodiment, a second cooling port 123 is provided on the carrier of the device to be cooled 12, and the first cooling port 111 is connected to the second cooling port 123; one end of the heat dissipation channel 13 is connected to the second cooling port 123, and the other end of the heat dissipation channel 13 extends to the device to be cooled 12.

[0042] In this embodiment, the aforementioned heat dissipation device 12 refers to a device that needs to be cooled, such as a chip, engine, electric pump, etc. This application embodiment is not specifically limited.

[0043] The number of the aforementioned heat dissipation devices 12 can be at least one, and this application embodiment does not specifically limit it.

[0044] In this embodiment, the carrier of the heat dissipation device 12 can be of many kinds, such as a housing, a PCB board, etc. That is, the heat dissipation device 12 is placed in a housing or on a PCB board. This application embodiment does not specifically limit the types of carriers.

[0045] Of course, the carrier of the heat dissipation device 12 can be the heat dissipation device 12 itself. In this case, the carrier of the heat dissipation device is provided with a second cooling port 123, the first cooling port 111 is connected to the second cooling port 123, one end of the heat dissipation channel is connected to the second cooling port 123, and the fluid flowing out from the other end of the heat dissipation channel dissipates heat from the heat dissipation device 12.

[0046] It should be noted that when the carrier of the device to be cooled is a shell or a PCB board, the carrier of the device to be cooled 12 can support only one device to be cooled 12 or multiple devices to be cooled 12. This application embodiment does not specifically limit this.

[0047] This application embodiment only uses the carrier of the heat dissipation device 12 as an example for illustration.

[0048] In this embodiment, as Figure 3 As shown, the second cooling port 123 is disposed on the side wall of the housing 121, and the side wall can be any side wall of the housing 121. The number of the second cooling ports 123 can be the same as the number of the devices to be cooled 12, or it can be different from the number of the devices to be cooled 12. This embodiment of the application does not specifically limit the number of the cooling ports 123.

[0049] Here, when there are multiple second cooling ports 123, the multiple second cooling ports 123 are disposed on the same side wall or different side walls of the housing 121, which is not specifically limited in this embodiment.

[0050] In this embodiment, the heat dissipation channel 13 is disposed on the carrier of the device to be cooled. Specifically, one end of the heat dissipation channel 13 is connected to the second cooling port 123, and the other end of the heat dissipation channel 13 extends to the device 12 to be cooled. There are many ways to implement the heat dissipation channel 13. For example, the heat dissipation channel 13 is formed in the hollow part of the connecting pipe, or the heat dissipation channel 13 is formed in the gap between at least two partitions disposed on the carrier of the device to be cooled. This embodiment of the application is not specifically limited.

[0051] The following embodiments illustrate the heat dissipation channel 13, which will not be elaborated upon here.

[0052] In this embodiment, the fluid used for heat dissipation in the heat dissipation channel 13 can be either liquid or gas, and this embodiment of the application is not specifically limited.

[0053] This concludes the process. Figure 1 Description of the block diagram shown.

[0054] pass Figure 1 As shown in the block diagram, in this embodiment of the application, the heat dissipation system includes: a heat dissipation box with a first cooling port on the side wall, a heat dissipation channel, and a device to be cooled placed in the heat dissipation box. The device to be cooled has a second cooling port on its carrier. The first cooling port is connected to the second cooling port. One end of the heat dissipation channel is connected to the second cooling port, and the other end of the heat dissipation channel extends to the device to be cooled, directly dissipating heat for the device to be cooled. This can effectively improve the problem of low overall flow rate and inability to accelerate local flow in immersion liquid cooling.

[0055] Furthermore, by utilizing the fluid in the heat dissipation channel to centrally dissipate heat for the corresponding equipment, the problem of energy saving by increasing the overall flow rate is avoided, thus ensuring the improvement of heat dissipation capacity while achieving energy saving.

[0056] As an optional embodiment of this application, a quick-connect male connector is provided at the first cooling port 111 and a quick-connect female connector is provided at the second cooling port 123; or a quick-connect male connector is provided at the second cooling port 123 and a quick-connect female connector is provided at the first cooling port 111; the quick-connect male connector and the quick-connect female connector are plugged in so that the first cooling port 111 and the second cooling port 123 are connected.

[0057] For example, a quick disconnect (QD), also known as a quick-release connector, is a flexible pipe connection structure that allows for easy connection and disconnection of pipes. It includes a male quick-connect fitting and a female quick-connect fitting for use. Figure 4(This is a specific example of a quick-connect female connector), where the diameter of the quick-connect female connector is larger than the diameter of the quick-connect male connector.

[0058] In this embodiment, the quick-connect male and female connectors are used to improve the connection between the first cooling port 111 and the second cooling port 123.

[0059] As one example, quick-connect fittings can be self-sealing or non-self-sealing. Here, self-sealing means that when the quick-connect fitting is disconnected, the female and / or male fittings automatically close to prevent fluid leakage. Non-self-sealing means that when the quick-connect fitting is disconnected, neither the female nor the male fitting has an automatic closing function.

[0060] As an optional implementation of this application, the heat dissipation channel 13 is formed in the hollow part of the connecting pipe, one end of the connecting pipe is connected to the second cooling port 123, and the other end of the connecting pipe extends to the device to be cooled 12.

[0061] For example, in this embodiment, the connecting pipe can be a rigid pipe or a flexible pipe. A rigid pipe refers to a pipe that will not bend or deform, while a flexible pipe refers to a pipe that can bend or deform.

[0062] In this embodiment, the material of the connecting pipe does not undergo chemical changes with the fluid in the heat dissipation channel 13.

[0063] As an optional implementation method of this application, such as Figure 5 As shown, the connecting pipeline includes: pipeline body 131 and distributor 132. Pipeline body 131 is connected to distributor 132. Distributor 132 is provided with at least two outlets, each of which faces the device 12 to be cooled.

[0064] For example, in this embodiment, the flow channel inside the flow divider 132 is designed to distribute the flow according to the needs of different heat dissipation devices 12, and each outlet of the flow divider 132 is directed toward the heat dissipation device 12.

[0065] Figure 5 The example shown is that liquid is introduced into the distributor 132 through one heat dissipation channel 13, and the distributor 132 has two outlets.

[0066] In this embodiment, the liquid is distributed to the carrier of the device to be cooled by the distributor 132, which can dissipate heat for multiple devices 12 when the number of the first cooling port 111 and / or the second cooling port 123 is insufficient.

[0067] As an optional implementation method of this application, such as Figure 6As shown, the above-mentioned connecting pipeline includes: a main pipeline 133 and at least two branch pipelines 134, wherein the at least two branch pipelines 134 are connected in parallel and are all connected to the main pipeline 133.

[0068] For example, in this embodiment, such as Figure 6 As shown, the above-mentioned connecting pipeline includes: a main pipeline 133 and at least two branch pipelines 134. Figure 6 (Taking a branch pipeline as an example with 2 branches as an example), at least 2 branch pipelines 134 are connected in parallel and both are connected to the main pipeline 133.

[0069] This application embodiment achieves secondary distribution of liquid after it reaches the carrier of the device to be cooled by setting multiple branch pipes 134, which can dissipate heat for multiple devices 12 when the number of first cooling ports 111 and / or second cooling ports 123 is insufficient.

[0070] It should be noted that when the liquid is distributed a second time after it reaches the carrier of the heat dissipation device, in addition to the above-mentioned branch pipe 134 and flow divider 132, other devices that can achieve flow distribution can also be used. This application embodiment does not specifically limit the use of such devices.

[0071] As an optional implementation method of this application, such as Figure 7 As shown, the carrier of the above-mentioned heat dissipation device is provided with at least two partitions 135, which are spaced apart, and the heat dissipation channel 13 is formed in the gap between the at least two partitions 135.

[0072] For example, in this embodiment, in addition to using connecting pipes to form a heat dissipation channel 13, an open heat dissipation channel 13 design can also be used. Taking the housing 121 as the carrier of the device to be cooled as an example, such as... Figure 7 As shown, at least two partitions 135 are provided on the housing 121. Here, the partitions 135 can be provided on one side wall of the housing 121, or they can be provided on opposite side walls of the housing 121. This application embodiment does not specifically limit the scope.

[0073] In this embodiment, liquid direction guidance and flow distribution can be achieved by setting baffles of different sizes and shapes on the carrier of the device to be cooled, and the outlet of the heat dissipation channel 13 is located at the device to be cooled 12.

[0074] In this embodiment, a quick-connect female connector can be provided at the second cooling port 123 to connect with a quick-connect male connector at the first cooling port 111 of the heat sink 11. Of course, it is also possible to omit both the quick-connect female and male connectors and simply retain the second cooling port 123.

[0075] As an optional embodiment of this application, the second cooling port 123 includes a second cooling port I, which is directly opposite to the device 12 to be cooled, and a heat dissipation channel 13 extends from the second cooling port I to the device 12 in a straight line; and / or

[0076] The second cooling port 123 includes a second cooling port II, which is not directly opposite the device 12 to be cooled. The heat dissipation channel 13 extends from the second cooling port II along a curved direction to the device 12 to be cooled.

[0077] For example, in this embodiment, taking the housing 121 as the carrier of the device to be cooled, the second cooling port is located at the bottom of the housing 121. The second cooling port I being directly opposite the device 12 means that the line connecting the second cooling port I and the device 12 is perpendicular to the plane of the side wall where the second cooling port I is located. Correspondingly, the second cooling port II not being directly opposite the device 12 means that the line connecting the second cooling port II and the device 12 intersects the plane of the side wall where the second cooling port I is located.

[0078] As an optional implementation method of this application, such as Figure 8 As shown, the above-mentioned heat dissipation system further includes: a cold head 14, which is disposed on the carrier of the device to be cooled 12. The cold head 14 is connected to at least two connecting pipes, at least one connecting pipe for conveying fluid to the cold head 14, and at least one connecting pipe for conveying fluid flowing out of the cold head 14.

[0079] For example, in this embodiment, in addition to using an open outlet, the connecting pipe can also use a closed loop. For example, a cold head 14 is designed on the carrier of the device to be cooled 12. Here, the cold head 14 includes a cavity that can contain fluid. Specifically, at least two connecting pipes are connected to the cold head. At least one connecting pipe is used to transport fluid to the cold head 14, and at least one connecting pipe is used to transport fluid flowing out of the cold head 14, forming a closed loop. At the same time, the quick-connect female and quick-connect male use self-sealing quick connectors. That is, when the quick-connect female and quick-connect male are disconnected, the quick-connect female and quick-connect male automatically seal and there will be no leakage or fluid communication with the heat sink 11. This loop has independent supply and return. The fluid in the loop can be the same as or different from the fluid in the heat sink 11. This application embodiment does not specifically limit this.

[0080] In this embodiment, the cold head 14 and at least two connecting pipes form a closed loop, which enables different heat dissipation devices 12 to use different fluids for heat dissipation. This can adapt to heat dissipation devices 12 with different power, greatly increasing the flexibility of heat dissipation.

[0081] As an optional embodiment of this application, the heat dissipation device 12 includes: heat dissipation device I and heat dissipation device II, wherein the power of heat dissipation device I is greater than the power of heat dissipation device II; the heat dissipation channel 13 includes heat dissipation channel I and heat dissipation channel II, wherein heat dissipation channel I extends to heat dissipation device I and heat dissipation channel II extends to heat dissipation device II, and the flow area of ​​heat dissipation channel I is greater than the flow area of ​​heat dissipation channel II; and / or

[0082] The heat dissipation system also includes a first motor pump and a second motor pump. The device to be cooled 12 includes a device to be cooled I and a device to be cooled II, wherein the power of device to be cooled I is greater than the power of device to be cooled II. The heat dissipation channel 13 includes a heat dissipation channel I and a heat dissipation channel II, wherein heat dissipation channel I extends to device to be cooled I and heat dissipation channel II extends to device to be cooled II. The first motor pump is used to drive the fluid in heat dissipation channel I; the second motor pump is used to drive the fluid in heat dissipation channel II, wherein the power of the first motor pump is greater than the power of the second motor pump.

[0083] For example, in this embodiment, the power of the device 12 to be cooled is different. Therefore, different degrees of heat dissipation can be performed for different devices 12 to be cooled. Here, different degrees of heat dissipation can be achieved in a variety of ways, such as different fluid flow rates, different fluid areas, etc. This application embodiment does not specifically limit the specific methods.

[0084] For example, when different degrees of heat dissipation are achieved through different fluid areas, the heat dissipation device 12 includes: heat dissipation device I and heat dissipation device II, the power of heat dissipation device I is greater than the power of heat dissipation device II, the heat dissipation channel 13 includes heat dissipation channel I and heat dissipation channel II, heat dissipation channel I extends to heat dissipation device I, heat dissipation channel II extends to heat dissipation device II, and the flow area of ​​heat dissipation channel I is greater than the flow area of ​​heat dissipation channel II.

[0085] For example, when different degrees of heat dissipation are achieved through different fluid flow rates, the heat dissipation system also includes a first motor pump and a second motor pump. Both the first motor pump and the second motor pump can be installed in the heat dissipation box 11. The device to be cooled 12 includes: device I to be cooled and device II to be cooled. The power of device I to be cooled is greater than the power of device II to be cooled. The heat dissipation channel 13 includes heat dissipation channel I and heat dissipation channel II. Heat dissipation channel I extends to device I to be cooled, and heat dissipation channel II extends to device II to be cooled. The first motor pump is used to drive the fluid in heat dissipation channel I; the second motor pump is used to drive the fluid in heat dissipation channel II. The power of the first motor pump is greater than the power of the second motor pump.

[0086] As an optional implementation of this application, a third cooling port is provided on the carrier of the device to be cooled, and the third cooling port is connected to the space where the device 12 to be cooled is located.

[0087] For example, in this embodiment, when the carrier of the device to be cooled is the housing 121, such as Figure 2 As shown, in addition to the first cooling port 111, the side wall of the housing 121 also includes a third cooling port. The number of third cooling ports is multiple, and this embodiment does not specifically limit the number.

[0088] In this embodiment, the sidewall of the third cooling port can be the same as or different from the sidewall of the first cooling port 111. This embodiment of the application does not specifically limit this.

[0089] In this embodiment of the application, at least two sidewalls are provided with third cooling ports; and / or at least one sidewall is covered with third cooling ports. Here, "sidewall covered with third cooling ports" means that the sidewall is provided with a number of third cooling ports, and the third cooling ports fill the sidewall, ensuring that the fluid can fully enter the heat dissipation device 12 and ensure that the heat dissipation device 12 in the heat dissipation device 12 can dissipate heat fully.

[0090] In this embodiment, after setting a high-speed or large-area fluid for the high-power heat dissipation device 12, a fluid with a lower flow rate can be used for heat dissipation of the low-power heat dissipation device 12, thereby reducing the power consumption of the heat dissipation box 11.

[0091] The foregoing has described specific embodiments of this specification. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims may be performed in a different order than that shown in the embodiments and may still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require the specific or sequential order shown to achieve the desired result. In some embodiments, multitasking and parallel processing are possible or may be advantageous.

[0092] Other embodiments of this specification will readily occur to those skilled in the art upon consideration of the specification and practice of the invention claimed herein. This specification is intended to cover any variations, uses, or adaptations that follow the general principles of this specification and include common knowledge or customary techniques in the art not claimed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this specification are indicated by the following claims.

[0093] It should be understood that this specification is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this specification is limited only by the appended claims.

[0094] The above description is merely a preferred embodiment of this specification and is not intended to limit this specification. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this specification should be included within the scope of protection of this specification.

Claims

1. A heat dissipation system, characterized by, The heat dissipation system comprises a heat dissipation box, a heat dissipation channel and a device to be cooled arranged in the heat dissipation box, The side wall of the heat dissipation box is provided with a first cooling port. The device to be cooled is provided with a second cooling port on the carrier of the device to be cooled, the first cooling port and the second cooling port are in communication, one end of the heat dissipation channel is in communication with the second cooling port, and the other end of the heat dissipation channel extends to the device to be cooled; wherein the number of the first cooling port is multiple; the carrier of the device to be cooled carries at least one device to be cooled; the same device to be cooled can be cooled by multiple first cooling ports; the second cooling port comprises a second cooling port I, the second cooling port I is opposite to the device to be cooled, and the heat dissipation channel extends to the device to be cooled in a straight line direction from the second cooling port I; and / or the second cooling port comprises a second cooling port II, the second cooling port II is not opposite to the device to be cooled, and the heat dissipation channel extends to the device to be cooled in a curve direction from the second cooling port II; the carrier of the device to be cooled is provided with at least two partitions, the at least two partitions are arranged at intervals, and the heat dissipation channel is formed at the gap between the at least two partitions; the carrier of the device to be cooled is provided with a third cooling port, and the third cooling port is in communication with the space where the device to be cooled is located.

2. The heat dissipation system of claim 1, wherein, The first cooling port is provided with a quick plug male head, and the second cooling port is provided with a quick plug female head; or the second cooling port is provided with a quick plug male head, and the first cooling port is provided with a quick plug female head; the quick plug male head and the quick plug female head are inserted to make the first cooling port and the second cooling port in communication.

3. The heat dissipation system of claim 1, wherein, The heat dissipation channel is formed in the hollow of the connecting pipeline, one end of the connecting pipeline is connected with the second cooling port, and the other end of the connecting pipeline extends to the device to be cooled.

4. The heat dissipation system of claim 3, wherein, The connecting pipeline comprises a pipeline body and a flow divider, the pipeline body is in communication with the flow divider, and the flow divider is provided with at least two outlets, each outlet is directed to the device to be cooled.

5. The heat dissipation system of claim 3, wherein, The connecting pipeline comprises a main pipeline and at least two branch pipelines, the at least two branch pipelines are connected in parallel and are in communication with the main pipeline.

6. The heat dissipation system according to any one of claims 3-5, wherein, The connecting pipeline is a rigid pipeline or a flexible pipeline.

7. The heat dissipation system of claim 3, wherein, The heat dissipation system further comprises a cold head arranged on the carrier of the device to be cooled, the cold head is connected with at least two connecting pipelines, at least one connecting pipeline is used to deliver fluid to the cold head, and at least one connecting pipeline is used to deliver fluid out of the cold head.

8. The heat dissipation system according to any one of claims 1-5, and 7, wherein, The first cooling port is provided with multiple, and multiple first cooling ports are arranged on the same side wall or different side walls of the heat dissipation box.

9. The heat dissipation system of claim 1, wherein, The device to be cooled comprises a device to be cooled I and a device to be cooled II, the power of the device to be cooled I is greater than the power of the device to be cooled II, the heat dissipation channel comprises a heat dissipation channel I and a heat dissipation channel II, the heat dissipation channel I extends to the device to be cooled I, the heat dissipation channel II extends to the device to be cooled II, and the flow area of the heat dissipation channel I is greater than the flow area of the heat dissipation channel II.

10. The heat dissipation system of claim 1 or 9, wherein, The heat dissipation system further comprises a first motor pump and a second motor pump, the equipment to be cooled comprises: equipment to be cooled I and equipment to be cooled II, the power of the equipment to be cooled I is greater than the power of the equipment to be cooled II, the heat dissipation channel comprises a heat dissipation channel I and a heat dissipation channel II, the heat dissipation channel I extends to the equipment to be cooled I, the heat dissipation channel II extends to the equipment to be cooled II, the first motor pump is used to drive the fluid in the heat dissipation channel I; the second motor pump is used to drive the fluid in the heat dissipation channel II, the power of the first motor pump is greater than the power of the second motor pump.

11. The heat dissipation system of claim 1, wherein, The carrier of the equipment to be cooled comprises a plurality of side walls, at least two side walls are provided with third cooling openings; and / or The carrier of the equipment to be cooled comprises a plurality of side walls, at least one side wall is covered with the third cooling openings.

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