Composite board with electromagnetic shielding function and composite floor thereof

By adopting a compressed layer structure of the first material and the second material in the composite board, electromagnetic shielding and gluing plane are provided, the problems of poor gluing strength and interlayer misalignment in the prior art are solved, and an electromagnetic shielding floor with stability and convenient installation is achieved.

CN115726537BActive Publication Date: 2025-10-03ZHEJIANG SHIYOU TIMBER
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Patent Information

Application Number
CN202211557306.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-12-06
Publication Date
2025-10-03
Estimated Expiration
2042-12-06

AI Technical Summary

Technical Problem

In the existing technology, floors with electromagnetic shielding function have problems such as poor bonding strength between the metal sheet layer or metal mesh and the decorative layer and base material layer, and the differences in the material's swelling and shrinkage properties lead to easy misalignment between layers, or the metal mesh easily leaves marks when stepped on.

Method used

A compression layer structure composed of a first material and a second material is adopted. The functional layer is provided with electromagnetic shielding by the first material, and the leveling layer is provided with a bonding plane by the second material. The two are connected by mechanical locking and bonding. The functional layer is wrapped in the leveling layer, and the cutting avoidance part is used for milling the locking structure.

Benefits of technology

The bonding strength and stability between the composite board and other boards are improved, and the continuity of the electromagnetic shielding effect and convenient installation and construction are achieved.

✦ Generated by Eureka AI based on patent content.

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Abstract

An embodiment of the present application discloses a composite board and a composite flooring thereof with electromagnetic shielding function. The composite board is a compressed layer composed of a first material and a second material, including a functional layer located in a core layer and formed by mixing and compressing the first and second materials, and a leveling layer located above and below the functional layer and formed by compressing the second material; the functional layer is suitable for providing electromagnetic shielding through the first material, and the thickness of the functional layer is 0.5 to 1.0 mm; the leveling layer is suitable for providing a bonding plane, and the thickness of the leveling layer is 0.2 to 1.0 mm.
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Description

Technical Field

[0001] The present invention relates to the technical field of panels, and more particularly to a composite panel with electromagnetic shielding function, and a composite floor made from the composite panel. Background Art

[0002] Floor heating is a relatively common heating method in homes or public places, including water heating and electric heating. The water heating method is to coil water pipes on the ground and pave them with cement, and then pave and cover them with floor paving materials, and the hot water in the water pipes is heated by gas or electricity. The electric heating method is to lay multiple heat sinks (such as graphene printed sheets) on the ground and connect them in series to an external power supply, and then pave and cover them with floor paving materials. Obviously, compared with the water heating method, the installation and construction of electric heating are more convenient and the cost is relatively lower. But what is unsatisfactory is that because electric heating requires laying wires and cables under the floor paving materials, a certain amount of electromagnetic radiation enters the room during use.

[0003] In order to protect users and some possible electronic devices in the room from the influence of electromagnetic radiation, some floorings with electromagnetic shielding function have appeared on the market. In the Chinese patent database, the invention patent with publication number CN202577874U and the name of "Composite flooring with electromagnetic shielding function" records a technical solution in which a shielding layer is provided between the decorative layer and the substrate, or between the substrate and the balancing layer, or below the balancing layer, or in the middle of the substrate, and the shielding layer is made of copper, zinc, stainless steel, iron, or aluminum metal sheets or metal mesh with shielding function. In the above technical solution, the composite flooring has the function of electromagnetic shielding by laminating and bonding metal sheets or metal mesh in the composite board. However, the above solution has the following problems: (1) the bonding strength between the metal sheet layer or metal mesh and the decorative layer, substrate layer, or balancing layer is relatively poor, resulting in the problem that the composite flooring is easy to debond; and (2) if metal sheets are used, the difference in the wet expansion and contraction properties and the thermal expansion and contraction properties of metal materials and wooden materials is completely opposite, resulting in the problem that the layers are easily misaligned during use; or if metal mesh is used, the metal mesh is easily left on the decorative layer due to the effect of stepping or other pressure.

[0004] In summary, the prior art lacks a functional composite board that performs electromagnetic shielding and has relatively good bonding performance with the wooden layer. Summary of the Invention

[0005] The purpose of the present invention is to overcome the above technical problems and provide a composite floor with a dissipative layer and electromagnetic shielding function.

[0006] To achieve the above objectives, one aspect of the present invention provides a composite panel with electromagnetic shielding function, wherein the composite panel is a compressed layer composed of a first material and a second material, including a functional layer located in a core layer and formed by mixing and compressing the first and second materials, and a leveling layer located above and below the functional layer and formed by compressing the second material.

[0007] The functional layer is made of the first material so as to be suitable for providing electromagnetic shielding, and the thickness of the functional layer is 0.5 to 1.0 mm;

[0008] The leveling layer is suitable for providing a gluing surface, and the thickness of the leveling layer is 0.2-1.0 mm.

[0009] Preferably, in the functional layer, the first materials overlap and cross to form a network, and the second material is filled in the network.

[0010] Preferably, the second material is combined with the network in a manner including mechanical locking and / or adhesive connection.

[0011] Preferably, the first material is metal fiber, and the second material is one or a mixture of wood fiber, wood shavings, and wood-plastic particles wrapped with an adhesive.

[0012] Preferably, the functional layer is wrapped in the leveling layer.

[0013] Preferably, the leveling layer extends along its length and width directions respectively, and is bent and extended from the side of the functional layer to form a cutting avoidance portion.

[0014] Preferably, the cutting avoidance portion is located on one side in a width direction and one side in a length direction of the functional layer.

[0015] Another aspect of the present invention provides a composite floor using the composite board having electromagnetic shielding function, comprising the composite board and a main body layer laminated and bonded to each other.

[0016] Preferably, the first surface of the composite board is bonded to the main layer, and the second surface of the dissipation layer is bonded to an additional layer, wherein the additional layer is a decorative layer or a balancing backplane.

[0017] Preferably, the leveling layer extends along its length and width directions respectively, and is bent and extended from the side of the functional layer to form a cutting avoidance portion, and the cutting avoidance portion is located on one side in a width direction and one side in a length direction of the functional layer; the composite floor is milled on one side where the cutting avoidance portion is located to form a locking female tenon, and is milled on the other side to form a locking male tenon. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative labor.

[0019] Figure 1 Schematic diagram of the end cross section of the composite plate of Example 1 of the present application.

[0020] Figure 2 This is an enlarged schematic diagram of the functional layer of Example 1 of the present application.

[0021] Figure 3 This is a schematic diagram of an end cross-section of the composite plate of Example 4 of the present application.

[0022] Figure 4 This is a schematic diagram of another end cross section of the composite plate of Example 4 of the present application.

[0023] Figure 5 This is a schematic diagram of the end cross-section of the composite flooring of Example 5 of the present application.

[0024] Figure 6 This is a schematic diagram of the end cross-section of the composite flooring of Example 6 of the present application.

[0025] Figure 7 This is a schematic diagram of the end cross-section of the composite flooring of Example 7 of the present application.

[0026] Figure 8 This is a schematic diagram of the end cross-section of the composite flooring of Example 8 of the present application.

[0027] In the figure: 100, composite board, 200, decorative layer, 300, main layer, 400, balancing layer, 500, connecting groove, 600, locking male tenon, 700, locking female tenon, 800, metal buckle, 101, first material, 102, second material, 110, functional layer, 120, leveling layer, 121, cutting avoidance part. DETAILED DESCRIPTION

[0028] In order to enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of this application.

[0029] Example 1

[0030] Reference Figure 1 and Figure 2 The composite panel 100 shown has an electromagnetic shielding function and is a rectangular panel having a length, width, and thickness, with specifications of 1200 mm × 120 mm × 1 mm (length × width × thickness). In particular, the composite panel 100 is a compressed layer composed of a first material 101 and a second material 102. In other words, the composite panel 100 is a layered structure obtained by paving the first material 101 and the second material 102 in a certain form and then pressing them. The layered composite panel 100 includes a functional layer 110 located in the core layer and formed by mixing and compressing the first material 101 and the second material 102, and a leveling layer 120 located above and below the functional layer 110 and formed by compressing the second material 102. In the composite panel 100, the functional layer 110 is suitable for providing electromagnetic shielding through the first material 101, and the leveling layer 120 is suitable for providing a bonding surface. The total thickness of the composite panel 100 of this embodiment is 1.0 mm, wherein the thickness of the functional layer 110 is approximately 0.6 mm (0.6±0.02 mm), and the thickness of the single-layer leveling layer 120 is approximately 0.2 mm (0.2±0.02 mm).

[0031] Through the above-described structure, this embodiment provides a composite panel 100 with relatively high internal bonding strength, relatively good stability, and relatively good compatibility with other sheet materials. First, in the functional layer 110, the first material 101 and the second material 102 suitable for providing electromagnetic shielding are mixed together, resulting in relatively good bonding strength between the first material 101 and the second material 102. Furthermore, the second material 102 in the functional layer 110 and the second material 102 in the leveling layer 120 are formed by pressing and bonding the same material together, thereby improving the bonding between the functional layer 110 and the leveling layer 120, resulting in the composite panel 100 of this embodiment having relatively good internal bonding strength. Second, the mixing of the first material 101 and the second material 102 results in the stability of the functional layer 110 being derived from the combined properties of the two materials. Furthermore, the functional layer 110 is sandwiched between the two leveling layers 120, resulting in relatively good stability for the composite panel 100 of this embodiment. Finally, because the leveling layer 120 can provide a flat bonding surface, (1) the composite panel 100 of this embodiment can form relatively good bonding strength with other panels (such as decorative panels, substrates or balancing layers, etc.), and (2) through the isolation of the leveling layer 120, the form, shape, contour, etc. of the first material 101 in the functional layer 110 will not be reflected on the surface of other panels bonded and bonded with the composite panel 100, so that the composite panel 100 of this embodiment has relatively good compatibility with other panels.

[0032] In a preferred embodiment, first material 101 is a metal fiber with a specific aspect ratio, such as copper fiber with a diameter of 0.02-0.03 mm and a length of 4-5 mm. First material 101 is curled, so that it can form a network after being laid. Second material 102 is wood fiber coated with a phenolic resin adhesive. The wood fiber has a diameter of 0.02-0.03 mm and a length of 1-3 mm.

[0033] The purpose of this application is not to improve the production process, but the description of the production process can help readers further understand the structure of the composite board 100 of this embodiment and how to achieve the above technical effects through this structure.

[0034] Using a conventional continuous paving machine, a layer of second material 102 is first applied to the paving belt, forming a first second material layer approximately 1.0 mm thick. Next, first material 101 is applied over the first second material layer. Under the influence of gravity, some of the first material 101 in contact with the first second material 102 layer becomes intermingled with the second material 102, while the remaining portion forms a first material layer composed entirely of the first material 101. The thickness of the first material layer is approximately 0.8 mm. Because the first material is a coiled metal microfibril, after application, the first material 101 intersects and overlaps to form a network of metal microfibrils. Next, the second material 102 is applied to the first material layer. Under the influence of gravity, some of the second material 102 in contact with the first material layer becomes intermingled with the first material 101 and, within the first material layer, connects with the second material 102 in the first second material layer. This ensures that the network of metal microfibrils in the first material layer is relatively evenly filled with the second material 102. The remaining portion forms a second second material layer composed entirely of the second material 102, with a thickness of approximately 0.8 mm. Finally, the paved blank is pressed to produce the composite panel 100 of this embodiment, which has a total thickness of 1.0 mm and includes a functional layer 110 located on the core layer and leveling layers 120 located above and below the functional layer 110.

[0035] In the above-mentioned further preferred technical solution, since (1) the first material 101 can form a dense network during the spreading, paving and pressing process, the second material 102 is filled in the network and is blocked by the network so that the second material 102 forms a mechanical lock with the network; (2) the outside of the second material 102 is wrapped with adhesive, so the second material 102 is simultaneously bonded to the network. Thus, the second material 102 forms a relatively tight and firm connection with the network. Furthermore, the second material 102 in the network and the leveling layer 120 are wood compression materials formed by pressing, and are bonded by adhesives, van der Waals forces between wood fibers, etc., and also have a relatively tight and firm connection. Thus, through the above-mentioned structure, the composite board 100 can have a relatively high internal bonding strength. The leveling layer 120 is actually a high-density fiberboard with a smooth surface, relatively high strength and a large number of micropores. It is an ideal bonding plane and cushioning material, so it can form a good bonding effect with other boards, and can also functionally isolate the form, shape, contour, etc. of the first material 101 in the functional layer 110 so that they will not be reflected on the surface of other boards bonded and compounded with the composite board 100.

[0036] The composite board 100 of this embodiment is an independent board and can therefore be produced, processed and sold separately.

[0037] Example 2

[0038] Example 2 differs from Example 1 in that the second material 102 is wood shavings coated with a phenolic resin adhesive. The wood shavings are 1-2 mm wide, 2-3 mm long, and 0.2-0.3 mm thick. The total thickness of the composite panel 100 is 2.0 mm, of which the functional layer 110 is approximately 0.6 mm (0.6 ± 0.02 mm) thick, and the leveling layer 120 is approximately 0.7 mm (0.2 ± 0.02 mm) thick.

[0039] Example 3

[0040] Example 3 differs from Example 1 in that the second material 102 is wood-plastic particles, which have a diameter of 1 to 2 mm and a length of 2 to 3 mm. The total thickness of the composite board 100 is 2.5 mm, of which the thickness of the functional layer 110 is approximately 0.9 mm (0.7 ± 0.02 mm), and the thickness of the leveling layer 120 is approximately 0.8 mm (0.8 ± 0.02 mm).

[0041] Those skilled in the art will appreciate that the thicknesses of the functional layer 110 and the leveling layer 120 can be controlled and adjusted by controlling the amounts of the first material 101 and the second material 102 spread during the paving process, which will not be elaborated herein.

[0042] Example 4

[0043] Reference Figure 3 As shown, Example 4 differs from Example 1 in that the functional layer 110 is encased within the leveling layer 120. Specifically, the leveling layer 120 extends along its length and width, and extends and bends from the side edges of the functional layer 110 to form a cutting avoidance portion 121. In other words, the cutting avoidance portion 121 is also a compressed portion of the second material 102 and is an extension of the leveling layer 120.

[0044] After composite board 100 is combined with other board materials to form a composite floor, a locking structure is generally required around the perimeter of the composite floor to facilitate assembly with adjacent floorboards. In the prior art, because the functional layer providing electromagnetic shielding cannot be milled, either a non-locking structure is employed, such as a combination of back grooves and metal buckles; or additional locking structures are assembled around the perimeter of the composite floor, as described in the aforementioned invention patent CN202577874U, entitled "Composite Flooring with Electromagnetic Shielding." However, neither of these methods is a conventional production and installation solution, increasing the difficulty of processing and on-site installation.

[0045] In this embodiment, by setting the cutting avoidance portion 121, the portion can be suitable for milling processing to process the locking structure, so that the composite floor made using the composite board 100 of this embodiment can be produced according to the conventional production methods and on-site installation and construction of the prior art, which is obviously more convenient.

[0046] Based on the simplicity of the process and the requirements of symmetry of the structure of the composite board 100, the cutting avoidance portion 121 should be located around the functional layer 110. Although the production process of the composite board 100 is not an improvement of the present application, a simple introduction to the production process will help readers further understand the structure of the composite board 100 of this embodiment. By making the width of the sprinkling port of the first material 101 smaller than the width of the sprinkling port of the second material 102, the width of the cutting avoidance portion 121 can be adjusted and controlled. For example, a second material 102 sprinkling port with a width of 120 mm is used to pave the first layer of the second material layer, a first material 101 sprinkling port with a width of 100 mm is used to spread the first material layer to the first layer of the second material layer, and finally, a second material 102 sprinkling port with a width of 120 mm is used to spread the second layer of the second material layer to the first material layer, thereby forming a cutting avoidance portion 121 with a width of 10 mm on each side. Furthermore, after the 1200 mm long blank is laid, the first material 101 is dispensing and only the second material 102 is laid, thereby forming a cutting avoidance portion 121 with a width of 10 mm at each end. Of course, in order to ensure that the cutting avoidance portion 121 is completely processed into a locking structure during milling, a person skilled in the art will know that the appropriate width of the cutting avoidance portion 121 should be 6 to 8 mm.

[0047] Considering that some locking structures are in the form of buckles, including locking male tenons and locking female tenons that are mirror images of each other, in some other embodiments, reference is made to Figure 4 As shown, the cutting avoidance portion 121 is located on one side in a width direction and one side in a length direction of the functional layer 110 .

[0048] Example 5

[0049] Reference Figure 5 As shown, the composite flooring of Example 5 is produced by bonding a composite decorative layer 200 to the surface of the composite board 100 of Example 1 and a composite main layer 300 to the back. The decorative layer 200 is a hardwood veneer, and the main layer 300 is a multi-layer composite substrate. In this embodiment, a 0.6mm thick peeled veneer of Asian rosewood and a 14mm thick multi-layer composite substrate of poplar are used, respectively. Of course, in other embodiments, the decorative layer can be peeled, sliced, or sawn veneer of other wood species and thicknesses, and the main layer 130 can be a medium / high-density fiberboard, particleboard, wood-plastic board, PVC, or other board materials that provide a composite adhesive surface.

[0050] Since the functional layer 110 covers the entire width of the composite floor and cannot be milled, a connecting groove 500 is provided on the back of the composite floor in this embodiment for engaging with the metal buckle 800 of the prior art to achieve assembly of adjacent composite floors.

[0051] Example 6

[0052] Reference Figure 6 As shown, the composite flooring of Example 6 is produced by bonding a composite main layer 300 to the front surface of the composite board 100 of Example 1, bonding a composite balancing layer 400 to the back surface, and further bonding a composite decorative layer 200 to the surface of the main layer 300. The decorative layer 200 is a 0.6 mm thick hardwood veneer, the main layer 300 is a 14 mm thick multi-layer composite substrate, and the balancing layer is a 2 mm thick fast-growing wood veneer.

[0053] Example 7

[0054] Reference Figure 7 As shown, the composite flooring of Example 7 is made by bonding a composite decorative layer 200 to the surface of the composite board 100 of Example 4 and a composite main layer 300 to the back. The width of the cut-away portion 121 is 8 mm and is located around the functional layer 110. The cut width of the locking structures 600 and 700 is 6 mm.

[0055] Example 8

[0056] Reference Figure 8As shown, Example 8 differs from Example 7 in that a cutout relief portion 121 is provided on one widthwise side and one lengthwise side of the functional layer 110. The cutout relief portion 121 is 8 mm wide. The locking structure of this embodiment is a snap-on structure, whereby a 6 mm wide male locking tenon 600 is milled on the side without the cutout relief portion 121, and a 6 mm wide female locking tenon 700 is milled on the side with the cutout relief portion 121.

[0057] After the composite flooring of this embodiment is spliced, the locking male tenon 600 is only cut below the thickness of the composite flooring. Therefore, no cutting avoidance portion 121 is provided on this side, so that the locking male tenon 600 can also have electromagnetic shielding, and the spliced ​​locking structure can have electromagnetic shielding, thereby forming a relatively complete and continuous electromagnetic shielding surface indoors.

[0058] Of course, although the width of the cutting avoidance portion 121 is the same as the width of the milling of the locking structure, which is most conducive to forming a continuous electromagnetic shielding surface, the processing error during paving and the danger of cutting metal materials in the continuous production line must be taken into account, so a certain margin should be left to ensure that the cutting avoidance portion 121 is always cut during the milling process.

[0059] The above description is intended to be illustrative and not limiting. Many embodiments and applications beyond the examples provided will be apparent to those skilled in the art upon reading the above description. Therefore, the scope of the present teachings should not be determined with reference to the above description, but rather with reference to the appended claims and the full scope of equivalents to which such claims are entitled. For the purpose of completeness, all articles and references, including disclosures of patent applications and publications, are incorporated herein by reference. The omission of any aspect of the subject matter disclosed herein from the preceding claims is not a disclaimer of such subject matter, nor should it be considered that the applicants did not consider such subject matter to be part of the disclosed subject matter.

Claims

1. A composite board with electromagnetic shielding function, characterized in that: The composite panel is a compressed layer composed of a first material and a second material, including a functional layer located in a core layer and formed by mixing and compressing the first and second materials, and a leveling layer located above and below the functional layer and formed by compressing the second material. The functional layer is suitable for providing electromagnetic shielding due to the first material, and the thickness of the functional layer is 0.5-1.0 mm. The leveling layer is suitable for providing a bonding surface, and the thickness of the leveling layer is 0.2-1.0 mm. In the functional layer, the first materials overlap and cross to form a network, and the second material is filled in the network; The second material and the network are combined in a manner including mechanical locking and / or adhesive connection; The first material is a curled metal fiber, and the second material is one or a mixture of wood fiber, wood shavings, and wood-plastic particles wrapped with an adhesive; The composite board production method comprises: firstly spreading a layer of the second material on a paving belt to form a first layer of the second material; then spreading the first material on top of the first layer of the second material; under the action of gravity, some of the first material in contact with the first layer of the second material is mixed with the second material, while the remaining portion forms a first material layer composed entirely of the first material; Then, the second material is continued to be spread on the first material layer. Under the action of gravity, some of the second material in contact with the first material layer will be mixed with the first material and connected with the second material in the first layer of the second material layer in the first material layer, so that the metal fiber network in the first material layer is relatively filled with the second material, and the other part forms a second layer of the second material layer completely composed of the second material; finally, the above-mentioned paving blank is pressed to obtain the composite plate.

2. The composite plate with electromagnetic shielding function according to claim 1, characterized in that: The functional layer is wrapped in the leveling layer.

3. The composite plate with electromagnetic shielding function according to claim 2, characterized in that: The leveling layer extends along its length and width directions respectively, and is bent and extended from the side of the functional layer to form a cutting avoidance portion.

4. The composite plate with electromagnetic shielding function according to claim 3, characterized in that: The cutting avoidance portion is located on one side in a width direction and one side in a length direction of the functional layer.

Citation Information

Patent Citations

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