Simple semiconductor refrigeration mobile air conditioner

Abstract

The application discloses a simple semiconductor refrigeration mobile air conditioner, which comprises a bottom shell, a rear shell and a joint, a top shell is arranged at the top front end of the bottom shell, a main water tank is arranged at the inner front side of the top shell, and four universal wheels are symmetrically arranged at the bottom of the bottom shell; in the application, the heat transfer plates and the cooling pipes are connected with one side of the semiconductor refrigeration plate, and the end of each heat transfer plate is provided with a cooling pipe; the inner wall of the cooling pipe is provided with a plurality of copper sheets for increasing the surface area; the heat transfer plates and the cooling pipes are made of brass and have good heat conduction effect; a plurality of heat insulation pipes are arranged, the heat insulation pipes guide the water flow, the water flow is kept uniform and small in unit time, the heat exchange efficiency and the refrigeration effect in the initial stage of starting can be improved, and the inner wall and the outer wall of the heat insulation pipe are hollow structures and have good heat preservation effect.

Description

Technical Field

[0001] This invention relates to the field of air conditioning technology, and in particular to a simple semiconductor refrigeration portable air conditioner. Background Technology

[0002] An air conditioner, also known as an air conditioner, is a device that uses artificial means to regulate and control parameters such as temperature, humidity, and airflow of the air in a building or structure. It generally includes several major parts such as cold / heat source equipment, cold / heat medium distribution system, terminal devices, and other auxiliary equipment. The main components include a refrigeration unit, water pump, fan, and piping system. The terminal devices are responsible for using the distributed cold or heat to specifically process the air conditioner so that the air parameters of the target environment meet certain requirements. Portable air conditioners are a type of air conditioner.

[0003] Existing portable air conditioners typically require the use of a compressor for cooling. The built-in compressor is noisy and energy-intensive during operation, and its production cost is also high. In some semiconductor-type portable air conditioners, the semiconductor cooling chip is usually directly inserted into the water tank. Because there is a lot of water in contact with the cooling chip, the cooling time required during startup is long. Furthermore, portable air conditioners are usually split-type exhaust pipes. If the pipe joints become loose during use, the continuous release of hot air into the room will greatly affect the cooling efficiency. Therefore, there are drawbacks in their use. Summary of the Invention

[0004] In view of the above, the present invention addresses the shortcomings of the existing technology, and its main objective is to provide a simple semiconductor-cooled portable air conditioner to solve the problems mentioned in the background. Existing portable air conditioners usually require the use of a compressor for cooling. The built-in compressor is noisy and energy-intensive during operation, and has a high production cost. In some semiconductor-type portable air conditioners, the semiconductor cooling chip is usually directly inserted into the water tank. Because there is a lot of water in contact with the cooling chip, the cooling time required during the start-up phase is long. In addition, the exhaust pipe of portable air conditioners is usually a split type. If the pipe joint is loose during use, the continuous discharge of hot air into the room will greatly affect the cooling efficiency. Therefore, there are drawbacks in use.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A simple semiconductor-cooled portable air conditioner includes a bottom shell, a rear shell, and a connector. A top shell is mounted on the front top of the bottom shell, and a main water tank is mounted on the front inner side of the top shell. Four casters are symmetrically mounted on the bottom of the bottom shell. An inner shell is mounted inside the main water tank, and a secondary water tank is mounted on one side of the main water tank. A partition is provided between the main water tank and the inner shell, and the partition is fixed to the bottom inner side of the bottom shell. A monitoring module is mounted on the upper part of the outer wall of one side of the main water tank. A water valve is installed at the bottom of the main water tank, and a drain pipe is installed at the bottom of the water valve, with the end of the drain pipe penetrating the rear side of the bottom shell. A heat insulation pipe is provided between the partition and the inner shell, and several heat insulation pipes are evenly spaced. The top of each heat insulation pipe is connected to the main water tank, and the side of each heat insulation pipe is connected to the inner shell. The bottom of each heat insulation pipe is connected to a first cold water pipe. The top shell is connected to a circulating water pump, which is installed on one side of the bottom of the bottom shell. A water delivery pipe is installed at the top of the circulating water pump. The top of the water delivery pipe passes through the top of the bottom shell and connects to one end of a second cold water pipe, which is located at the bottom inner side of the top shell. A heat exchange tube is located on the rear inner side of the top shell, with several heat exchange tubes spaced at equal intervals. One end of each heat exchange tube is connected to the top of the second cold water pipe, and the other end of each heat exchange tube is connected to the top of a hot water pipe, which is installed on the front inner bottom side of the top shell. A return water pipe is installed at the bottom of the hot water pipe, with several return water pipes spaced at equal intervals. The end of each return water pipe extends through the top of the main water tank to the bottom inner side of the main water tank. A turbine fan is installed inside the top shell, located inside the heat exchange tubes. The rear shell is installed on the rear inner side of the bottom shell. One end of the connector has an external thread structure.

[0007] Furthermore, guide vanes are installed on the front side of the top shell, and several guide vanes are arranged at equal intervals. The guide vanes are connected to the top shell by a rotatable connection. A drive motor is installed on one side of the top shell, and the output shaft of the drive motor is connected to one end of the turbine fan. An air intake window is installed on the other side of the top shell.

[0008] Furthermore, a first heat insulation cotton is installed on one side of the partition, and the first heat insulation cotton is located between the partition and the main water tank; a second heat insulation cotton is installed on the other side of the partition, and the second heat insulation cotton is located between the inner shell and the partition, while one side of the second heat insulation cotton is partially wrapped around the outer wall of the heat insulation pipe.

[0009] Furthermore, a semiconductor cooling plate is installed inside the inner shell, and a heat transfer plate is installed at one end of the semiconductor cooling plate; several heat transfer plates are arranged at equal intervals, and the number of heat transfer plates is the same as the number of heat insulation pipes. At the same time, the end of each heat transfer plate extends into the interior of a heat insulation pipe and connects to a cooling pipe; the upper and lower ends of the cooling pipe are interconnected, and the outer diameter of the cooling pipe is smaller than the inner diameter of the heat insulation pipe.

[0010] Furthermore, the heat exchange tube includes heat exchange plates, and several heat exchange plates are arranged at equal intervals, while the heat exchange plates and the turbine fan do not contact each other.

[0011] Furthermore, the end of the turbine fan connected to the output shaft of the drive motor is a closed structure, while the other end of the turbine fan is an open structure. At the same time, the end of the turbine fan away from the drive motor is rotatably connected to the inner wall of the air intake window.

[0012] Furthermore, the rear shell is equipped with heat dissipation pipes, and three heat dissipation pipes are arranged at equal intervals. At the same time, one end of each of the three heat dissipation pipes passes through the rear shell and the inner shell and is connected to the semiconductor cooling plate. The bottom of the rear shell is equipped with cooling fans, and three cooling fans are arranged at equal intervals. The three cooling fans are distributed corresponding to the three heat dissipation pipes.

[0013] Furthermore, the top of the rear shell is connected to the bottom of the air outlet pipe, and the air outlet pipe is installed on the top rear side of the bottom shell; an air outlet is provided on the rear side of the air outlet pipe, and a limiting plate is installed on the rear outer wall of the air outlet pipe, while a "U"-shaped groove structure is provided on the rear side of the limiting plate.

[0014] Furthermore, the limiting plate has a pressure plate inside, and the front side of the pressure plate is connected to the air outlet pipe with a reset spring; the reset spring is arranged in two sets symmetrically about the transverse axis of the air outlet, and each set of air outlets is arranged in two sets symmetrically about the transverse axis of the air outlet; a safety switch is installed on the rear side of the air outlet pipe, and the end of the movable mechanism of the safety switch is connected to the inner section of the pressure plate. At the same time, the pressure plate, the reset spring and the movable mechanism of the safety switch form a telescopic structure.

[0015] Compared with the prior art, the present invention has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution:

[0016] 1. In this invention, a semiconductor cooling plate, a heat transfer plate, a cooling pipe, and a heat insulation pipe are provided. The heat transfer plate and the cooling pipe are both connected to the cooling side of the semiconductor cooling plate, and a cooling pipe is installed at the end of each heat transfer plate. The inner wall of the cooling pipe is provided with multiple copper sheets to increase the surface area. The heat transfer plate and the cooling pipe are both made of brass, which has good heat conduction effect. By setting multiple heat insulation pipes, the water flow is diverted and guided through the heat insulation pipes, so that a uniform and small amount of water flows through the cooling pipes per unit time, which can improve the heat exchange efficiency and the cooling effect in the initial stage of start-up. At the same time, the inner wall and the outer wall of the heat insulation pipe are hollow, which has a good heat preservation effect.

[0017] 2. In this invention, a main water tank and a return water pipe are provided. During use, the hot water after heat exchange is injected into the bottom of the main water tank through the return water pipe. The hot water rises naturally to form a convection effect, which keeps the water temperature in all parts of the main water tank constant and prevents cold water from accumulating at the bottom of the main water tank, thus preventing it from participating in circulation well. The cross-sectional area of ​​the top of the main water tank is larger than that of the bottom. At the same time, the main water tank is kept in a relatively sealed state during the operation of the device, resulting in low loss and long-term non-refilling. In addition, the interior is pre-filled with ultrapure water, which can reduce the rate of scale formation during use.

[0018] 3. In this invention, a heat exchange tube, heat exchange plates, and a turbine fan are provided. The overall shape of the heat exchange tube is similar to a semicircle, and the axis of the semicircle and the axis of the turbine fan are on the same horizontal straight line. At the same time, the inner wall of the top shell is also arc-shaped. After the airflow is driven by the turbine fan to enter the interior of the turbine fan through the air inlet, it can pass evenly through the heat exchange tube and heat exchange plates during the process of being blown out from the surface of the turbine fan, forming a circulating airflow in the top shell, and finally being discharged through the guide vanes. Compared with flat plate heat exchange plates, this design reduces the overall volume while maintaining a relatively large heat exchange area. In addition, the traditional flat plate heat exchange plates are used with planar fans, which form a cylindrical airflow. With planar heat exchange plates, there are heat exchange dead zones. However, the annular airflow with annular heat exchange plates can minimize the heat exchange dead zone problem and improve heat exchange efficiency.

[0019] 4. In this invention, three heat dissipation pipes are provided, each connected to the heat-dissipating end of the semiconductor cooling plate. These three heat dissipation pipes absorb and exchange the heat emitted by the semiconductor cooling plate with the air. Each heat dissipation pipe has a semi-circular structure and contains multiple metal plates to increase its heat dissipation area. The cylindrical shape of the heat dissipation pipes, combined with the vertical airflow generated by the three cooling fans, ensures maximum contact between the airflow and the heat dissipation pipes, maximizing heat exchange efficiency and maximizing the use of the device's internal space.

[0020] 5. In this invention, a pressure plate, a return spring, a safety switch, and a connector are provided. The end of the connector has a threaded structure, which facilitates the selection of connecting cylindrical or flat exhaust pipes according to requirements. After the connector is connected to the limiting plate, the two flanges at the top of the connector are locked between the limiting plate and the pressure plate, squeezing the pressure plate and the return spring. At the same time, the safety switch is pushed inward to form an electrical circuit. The device can only work normally when the safety switch is connected. When the connector is separated from the limiting plate, the return spring pushes the pressure plate and the safety switch to reset, so that the safety switch automatically disconnects, improving the safety of use. After the connector is connected to the limiting plate, the rebound force formed by the squeezed return spring pushes the pressure plate to cooperate with the limiting plate to clamp the top of the connector. The outer section of the pressure plate is provided with a sealing ring, which can improve the tightness of the connection between the pressure plate and the connector.

[0021] To more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0022] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0023] Figure 2 This is the present invention. Figure 1 A bottom view;

[0024] Figure 3 This is the present invention. Figure 1 Rear view;

[0025] Figure 4 This is a three-dimensional structural diagram of the main water tank in this invention;

[0026] Figure 5 This is the present invention. Figure 4 A bottom view;

[0027] Figure 6 This is the present invention. Figure 4 Rear view;

[0028] Figure 7 This is a schematic diagram of the front view of the main water tank in this invention;

[0029] Figure 8 This is a schematic diagram of the planar top view structure of the present invention;

[0030] Figure 9 This is the present invention. Figure 7 Cross-sectional view in the AA direction;

[0031] Figure 10 This is the present invention. Figure 7 Cross-sectional view in the middle BB direction;

[0032] Figure 11 This is the present invention. Figure 8 Cross-sectional view in the CC direction;

[0033] Figure 12 This is the present invention. Figure 3 Enlarged view of point D in the image;

[0034] Figure 13 This is a three-dimensional structural diagram of the connector in this invention;

[0035] Figure 14 This is the present invention. Figure 13 The rear view in the image.

[0036] The attached figures are labeled as follows:

[0037] 1. Bottom shell; 2. Top shell; 3. Partition plate; 4. Main water tank; 5. First insulation cotton; 6. Auxiliary water tank; 7. Inner shell; 8. Second insulation cotton; 9. Semiconductor cooling plate; 10. Heat transfer plate; 11. Cooling pipe; 12. Insulation pipe; 13. First cold water pipe; 14. Circulating water pump; 15. Water supply pipe; 16. Second cold water pipe; 17. Heat exchange pipe; 1701. Heat exchange plate; 18. Hot water pipe; 19. Return water pipe; 20. Turbine fan; 21. Drive motor; 22. Heat dissipation pipe; 23. Air inlet; 24. Guide vane; 25. Rear shell; 26. Cooling fan; 27. Air outlet pipe; 28. Air outlet; 29. ​​Limiting plate; 30. Pressure plate; 31. Return spring; 32. Safety switch; 33. Connector; 34. Water valve; 35. Drain pipe; 36. Caster wheel; 37. Monitoring module. Detailed Implementation

[0038] Please refer to Figures 1 to 14The diagram illustrates the specific structure of a preferred embodiment of the present invention: a simple semiconductor-cooled portable air conditioner, comprising a bottom shell 1, a rear shell 25, and a connector 33. A top shell 2 is mounted on the front top of the bottom shell 1, and a main water tank 4 is mounted on the front interior side of the top shell 2. Four casters 36 are symmetrically mounted on the bottom of the bottom shell 1. An inner shell 7 is mounted inside the main water tank 4, and a secondary water tank 6 is mounted on one side of the main water tank 4. A partition 3 is provided between the main water tank 4 and the inner shell 7, and the partition 3 is fixed to the bottom inner side of the bottom shell 1. Meanwhile, a monitoring module 37 is installed on the upper part of one side of the outer wall of the main water tank 4; a water valve 34 is installed at the bottom of the main water tank 4, and a drain pipe 35 is installed at the bottom of the water valve 34, with the end of the drain pipe 35 penetrating the rear side of the bottom shell 1; a heat insulation pipe 12 is provided between the partition 3 and the inner shell 7, and several heat insulation pipes 12 are provided at equal intervals; the top of each heat insulation pipe 12 is connected to the main water tank 4, and the side of each heat insulation pipe 12 is connected to the inner shell 7, while the bottom of each heat insulation pipe 12 is connected to the first cold water pipe 13; One end of the first cold water pipe 13 is connected to the circulating water pump 14, which is installed on the bottom side of the bottom shell 1. A water delivery pipe 15 is installed at the top of the circulating water pump 14. The top of the water delivery pipe 15 passes through the top of the bottom shell 1 and is connected to one end of the second cold water pipe 16, which is located at the bottom inner side of the top shell 2. A heat exchange pipe 17 is provided on the rear inner side of the top shell 2, and several heat exchange pipes 17 are arranged at equal intervals. One end of each heat exchange pipe 17 is connected to the top of the second cold water pipe 16, and each heat exchange pipe... The other end of pipe 17 is connected to the top of hot water pipe 18, and hot water pipe 18 is installed on the inner bottom front side of top shell 2; a return water pipe 19 is installed at the bottom of hot water pipe 18, and several return water pipes 19 are arranged at equal intervals, and the end of each return water pipe 19 extends through the top of main water tank 4 to the inner bottom of main water tank 4; a turbine fan 20 is installed inside top shell 2, and the turbine fan 20 is located inside heat exchange pipe 17; rear shell 25 is installed on the inner rear side of bottom shell 1; one end of connector 33 has an external thread structure.

[0039] More specifically, the auxiliary water tank 6 installed on the side of the main water tank 4 has a glass window at its end. The water level inside the main water tank 4 can be observed through the auxiliary water tank 6. When the water level is lower than the top of the glass window, it means that water needs to be added to ensure a good circulation effect. By activating the water valve 34 in conjunction with the drain pipe 35, water can be drained or added as needed.

[0040] As a further explanation of this embodiment, the four casters 36 at the bottom of the base 1 facilitate quick movement of the device's location, improving ease of use.

[0041] In this embodiment, a guide vane 24 is installed on the front side of the top shell 2, and several guide vanes 24 are arranged at equal intervals. The guide vane 24 is connected to the top shell 2 by a rotatable connection. A drive motor 21 is installed on one side of the top shell 2, and the output shaft of the drive motor 21 is connected to one end of the turbine fan 20. An air intake window 23 is installed on the other side of the top shell 2.

[0042] More specifically, the connection between the air intake window 23 and the top shell 2 is a separate type, which can be disassembled and installed independently for easy cleaning or replacement.

[0043] As a further explanation of this embodiment, all guide vanes 24 can rotate independently, and the connection between the guide vanes 24 and the top shell 2 maintains a certain damping, allowing for stepless adjustment of their position.

[0044] In this embodiment, a first heat insulation cotton 5 is installed on one side of the partition 3, and the first heat insulation cotton 5 is located between the partition 3 and the main water tank 4; a second heat insulation cotton 8 is installed on the other side of the partition 3, and the second heat insulation cotton 8 is located between the inner shell 7 and the partition 3, while one side of the second heat insulation cotton 8 is partially wrapped around the outer wall of the heat insulation pipe 12.

[0045] More specifically, the first insulation cotton 5, together with the partition 3 and the second insulation cotton 8, can effectively improve the insulation effect between the main water tank 4 and the insulation pipe 12.

[0046] As a further explanation of this embodiment, the first heat insulation cotton 5 and the second heat insulation cotton 8 also have a certain anti-vibration effect, reducing the shaking sensation generated by the device during operation.

[0047] In this embodiment, a semiconductor cooling plate 9 is installed inside the inner shell 7, and a heat transfer plate 10 is installed at one end of the semiconductor cooling plate 9; several heat transfer plates 10 are arranged at equal intervals, and the number of heat transfer plates 10 is the same as the number of heat insulation pipes 12. At the same time, the end of each heat transfer plate 10 extends into the interior of a heat insulation pipe 12 and connects to a cooling pipe 11; the upper and lower ends of the cooling pipe 11 are interconnected, and the outer diameter of the cooling pipe 11 is smaller than the inner diameter of the heat insulation pipe 12.

[0048] More specifically, each cooling pipe 11 has multiple thin copper sheets arranged at equal intervals on its inner wall, which increases the overall surface area of ​​the cooling pipe 11 and improves the heat exchange efficiency. At the same time, the outer wall and inner wall of the heat insulation pipe 12 have a hollow structure, which has a good heat insulation effect.

[0049] As a further illustration of this embodiment, both the heat transfer plate 10 and the cooling pipe 11 are made of brass, which has good heat conduction effect.

[0050] In this embodiment, the heat exchange tube 17 includes heat exchange plates 1701, and several heat exchange plates 1701 are arranged at equal intervals. At the same time, the heat exchange plates 1701 and the turbine fan 20 do not contact each other.

[0051] More specifically, the heat exchange tube 17 is shaped like a semi-circular structure, and the axis of the semi-circular structure is on the same horizontal straight line as the axis of the turbine fan 20. When the turbine fan 20 rotates, it can drive the airflow to pass evenly between the heat exchange tube 17 and the heat exchange plate 1701 to complete the heat exchange, improve the heat exchange efficiency, and reduce the overall volume.

[0052] As a further explanation of this embodiment, the heat exchange plate 1701 is welded to the outer wall of the heat exchange tube 17. The heat exchange plate 1701 increases the heat exchange area of ​​the heat exchange tube 17, thereby improving the heat exchange efficiency.

[0053] In this embodiment, the end of the turbine fan 20 connected to the output shaft of the drive motor 21 is a closed structure, and the other end of the turbine fan 20 is an open structure. At the same time, the end of the turbine fan 20 away from the drive motor 21 is rotatably connected to the inner wall of the air intake window 23.

[0054] More specifically, when the turbine fan 20 rotates, it drives the external airflow through the air intake window 23 into the interior of the turbine fan 20, and then discharges it through the side of the turbine fan 20 into the top shell 2 to form an annular airflow. This allows the airflow to fully contact the heat exchange fins 1701 and the heat exchange tubes 17, avoiding heat exchange dead zones and improving heat exchange efficiency.

[0055] As a further explanation of this embodiment, the top of the air intake window 23 is provided with a split cover structure, and the surface of the cover structure is covered with a dustproof net. At the same time, the cover structure can be disassembled independently for easy cleaning or replacement.

[0056] In this embodiment, a heat dissipation pipe 22 is installed inside the rear shell 25, and three heat dissipation pipes 22 are arranged at equal intervals. At the same time, one end of each of the three heat dissipation pipes 22 passes through the rear shell 25 and the inner shell 7 and is connected to the semiconductor cooling plate 9. A cooling fan 26 is installed at the bottom of the rear shell 25, and three cooling fans 26 are arranged at equal intervals. The three cooling fans 26 are respectively distributed corresponding to the three heat dissipation pipes 22.

[0057] More specifically, all three heat dissipation pipes 22 are connected to the heat dissipation end of the semiconductor cooling plate 9. The heat dissipation pipes 22 absorb and exchange the heat emitted by the semiconductor cooling plate 9 with the air. Each heat dissipation pipe 22 has a semi-circular structure and multiple metal plates inside each heat dissipation pipe 22 to increase the heat dissipation area. At the same time, the cylindrical heat dissipation pipes 22, together with the vertical airflow formed by the three cooling fans 26, can ensure that the airflow can fully contact the heat dissipation pipes 22 to ensure the heat exchange effect, while making the most of the internal space of the device.

[0058] As a further explanation of this embodiment, the heat pipe 22 is made of brass, which has good heat conduction effect.

[0059] In this embodiment, the top of the rear shell 25 is connected to the bottom of the air outlet pipe 27, and the air outlet pipe 27 is installed on the top rear side of the bottom shell 1; an air outlet 28 is provided on the rear side of the air outlet pipe 27, and a limiting plate 29 is installed on the rear outer wall of the air outlet pipe 27, while a "U"-shaped groove structure is provided on the rear side of the limiting plate 29.

[0060] More specifically, the top of the rear shell 25 has a tapered design to facilitate more concentrated airflow, and the limiting plate 29, in conjunction with the "U"-shaped groove structure, facilitates the fixing of the connecting connector 33.

[0061] As a further explanation of this embodiment, the top of the limiting plate 29 has an open structure, which facilitates the insertion of the connector 33 into the limiting plate 29.

[0062] In this embodiment, the limiting plate 29 is provided with a pressure plate 30 inside, and the front side of the pressure plate 30 is connected to the air outlet pipe 27 in conjunction with the reset spring 31; the reset spring 31 is provided in two sets symmetrically about the transverse axis of the air outlet 28, and each set of air outlets 28 is provided in two sets symmetrically about the transverse axis of the air outlet 28; a safety switch 32 is installed on the rear side of the air outlet pipe 27, and the end of the movable mechanism of the safety switch 32 is connected to the inner section of the pressure plate 30. At the same time, the pressure plate 30, the reset spring 31 and the movable mechanism of the safety switch 32 form a telescopic structure.

[0063] More specifically, the pressure plate 30 remains tightly pressed against the inner wall of the limiting plate 29 under the rebound action of the return spring 31. The moving mechanism of the safety switch 32 moves synchronously with the pressure plate 30. When the pressure plate 30 is pressed against the inner wall of the limiting plate 29, the safety switch 32 is in the open state. When the pressure plate 30 is squeezed by the connector 33, the pressure plate 30 drives the safety switch 32 to retract. At this time, the safety switch 32 is in the closed state, so that the connection state of the safety switch 32 is related to the connection state of the limiting plate 29 and the connector 33.

[0064] As a further explanation of this embodiment, the safety switch 32 is a fuse circuit for the internal working circuit. The device can only start working normally when the safety switch 32 is closed.

[0065] The working principle of this invention is as follows: First, the device is moved to the designated location. Then, the threaded part of the connector 33 is connected to the suitable exhaust pipe. The top end of the connector 33 is slid from top to bottom into the limiting plate 29. The connector 33 pushes the pressure plate 30 to squeeze the return spring 31, and pushes the movable mechanism of the safety switch 32 to slide inward so that the safety switch 32 is in the connected state. The rebound force generated by the squeezed return spring 31 pushes the pressure plate 30 to cooperate with the limiting plate 29 to press the connector 33 tightly. Then, the external power supply is connected, and the circulating water pump 14 is started. Water from the top of the main water tank 4 is pumped into the second cold water pipe 16 through the first cold water pipe 13 and the heat insulation pipe 12. The water flows through the heat exchange pipe 17 into the hot water pipe 18 and then through the return water pipe 19 into the main water tank 4 to form a water circulation. At the same time, the semiconductor cooling plate 9 is started, so that the heat transfer plate 10 and the cooling pipe 11 begin to cool down. At the same time, the heat dissipation pipe 22 begins to heat up. The water flows through the heat exchange pipe 17 into the hot water pipe 18 and then into the main water tank 4 to form a water circulation. During the process of heat pipe 12, heat exchange and cooling occur with cooling pipe 11. After cooling, the water flows through heat exchange pipe 17 and heat exchange plate 1701, and the drive motor 21 is started simultaneously to drive turbine fan 20 to start rotating. External airflow passes through air inlet window 23 and enters the interior of turbine fan 20, then passes through the side wall of turbine fan 20 and enters the interior of top shell 2. The airflow forms cold air as it passes through heat exchange pipe 17 and heat exchange plate 1701 and then passes through guide vane 24 to be discharged. Three cooling fans 26 are started to drive airflow vertically upward through three heat dissipation pipes 22, so that the airflow carries the heat of heat dissipation pipes 22 and is discharged through air outlet pipe 27 and connector 33. During use, monitoring module 37 is started simultaneously to monitor the temperature of water inside main water tank 4. When the water temperature inside main water tank 4 is lower than the set threshold, the power of semiconductor cooling plate 9 is automatically reduced.

[0066] The above description is merely a preferred embodiment of the present invention and does not constitute any limitation on the technical scope of the present invention. Therefore, any minor modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present invention shall still fall within the scope of the technical solution of the present invention.

Claims

1. A simple semiconductor-cooled portable air conditioner, characterized in that: The device includes a bottom shell (1), a rear shell (25), and a connector (33). A top shell (2) is installed at the top front end of the bottom shell (1), and a main water tank (4) is installed inside the front side of the top shell (2). At the same time, four casters (36) are symmetrically installed at the bottom of the bottom shell (1). An inner shell (7) is installed inside the main water tank (4), and a secondary water tank (6) is installed on one side of the main water tank (4). A partition (3) is provided between the main water tank (4) and the inner shell (7), and the partition (3) is fixed to the bottom inside the bottom shell (1). At the same time, a monitoring module (37) is installed on the upper part of the outer wall of one side of the main water tank (4). A water valve (34) is installed at the bottom of the main water tank (4), and a drain pipe (35) is installed at the bottom of the water valve (34). The end of the drain pipe (35) passes through the rear side of the bottom shell (1). A heat insulation pipe (12) is provided between the partition (3) and the inner shell (7), and several heat insulation pipes (12) are provided at equal intervals. The top of each heat insulation pipe (12) is connected to the main water tank (4), and the side of each heat insulation pipe (12) is connected to the inner shell (7). The bottom of each heat insulation pipe (12) is connected to the first cold water pipe (13). One end of the first cold water pipe (13) is connected to the circulation... A water pump (14) is connected to the bottom of the bottom shell (1), and a water delivery pipe (15) is installed at the top of the water pump (14). The top of the water delivery pipe (15) passes through the top of the bottom shell (1) and is connected to one end of the second cold water pipe (16), which is located at the bottom of the inner side of the top shell (2). A heat exchange pipe (17) is provided on the rear side of the inner side of the top shell (2), and several heat exchange pipes (17) are arranged at equal intervals. One end of each heat exchange pipe (17) is connected to the top of the second cold water pipe (16), and the other end of each heat exchange pipe (17) is connected to the top of the second cold water pipe (16). All are connected to the top of the hot water pipe (18), and the hot water pipe (18) is installed on the inner bottom front side of the top shell (2); the bottom of the hot water pipe (18) is equipped with a return water pipe (19), and there are several return water pipes (19) at equal intervals, and the end of each return water pipe (19) extends through the top of the main water tank (4) to the inner bottom of the main water tank (4); the top shell (2) is equipped with a turbine fan (20), and the turbine fan (20) is located inside the heat exchange tube (17); the rear shell (25) is installed on the inner rear side of the bottom shell (1); one end of the connector (33) has an external thread structure. The inner shell (7) is equipped with a semiconductor cooling plate (9), and a heat transfer plate (10) is installed at one end of the semiconductor cooling plate (9); the heat transfer plates (10) are arranged at equal intervals, and the number of heat transfer plates (10) is the same as the number of heat insulation pipes (12). At the same time, the end of each heat transfer plate (10) extends into the interior of a heat insulation pipe (12) and connects to a cooling pipe (11); the upper and lower ends of the cooling pipe (11) are connected to each other, and the outer diameter of the cooling pipe (11) is smaller than the inner diameter of the heat insulation pipe (12).

2. The simplified semiconductor refrigeration portable air conditioner according to claim 1, characterized in that: The top shell (2) is equipped with guide vanes (24) on its front side, and the guide vanes (24) are arranged at equal intervals. The guide vanes (24) are connected to the top shell (2) by rotation. A drive motor (21) is installed on one side of the top shell (2), and the output shaft of the drive motor (21) is connected to one end of the turbine fan (20). An air intake window (23) is installed on the other side of the top shell (2).

3. The simplified semiconductor refrigeration portable air conditioner according to claim 1, characterized in that: A first heat insulation cotton (5) is installed on one side of the partition (3), and the first heat insulation cotton (5) is located between the partition (3) and the main water tank (4); a second heat insulation cotton (8) is installed on the other side of the partition (3), and the second heat insulation cotton (8) is located between the inner shell (7) and the partition (3), while one side of the second heat insulation cotton (8) is partially wrapped around the outer wall of the heat insulation pipe (12).

4. The simplified semiconductor refrigeration portable air conditioner according to claim 1, characterized in that: The heat exchange tube (17) includes heat exchange plates (1701), and several heat exchange plates (1701) are arranged at equal intervals. At the same time, the heat exchange plates (1701) and the turbine fan (20) do not contact each other.

5. The simplified semiconductor refrigeration portable air conditioner according to claim 1, characterized in that: The turbine fan (20) is connected to the output shaft of the drive motor (21) at one end, which is a closed structure, and the other end of the turbine fan (20) is an open structure. At the same time, the end of the turbine fan (20) away from the drive motor (21) is rotatably connected to the inner wall of the air intake window (23).

6. The simplified semiconductor refrigeration portable air conditioner according to claim 5, characterized in that: The rear shell (25) is equipped with heat dissipation pipes (22), and three heat dissipation pipes (22) are arranged at equal intervals. At the same time, one end of each of the three heat dissipation pipes (22) passes through the rear shell (25) and the inner shell (7) and is connected to the semiconductor cooling plate (9). The bottom of the rear shell (25) is equipped with cooling fans (26), and three cooling fans (26) are arranged at equal intervals. At the same time, the three cooling fans (26) are distributed corresponding to the three heat dissipation pipes (22).

7. The simplified semiconductor refrigeration portable air conditioner according to claim 6, characterized in that: The top of the rear shell (25) is connected to the bottom of the air outlet pipe (27), and the air outlet pipe (27) is installed on the top rear side of the bottom shell (1); the air outlet pipe (27) has an air outlet (28) on its rear side, and a limiting plate (29) is installed on the rear outer wall of the air outlet pipe (27), while the limiting plate (29) has a "U" shaped groove structure on its rear side.

8. The simplified semiconductor refrigeration portable air conditioner according to claim 7, characterized in that: The limiting plate (29) is provided with a pressure plate (30) inside, and the front side of the pressure plate (30) is connected to the air outlet pipe (27) with a reset spring (31); the reset spring (31) is provided in two sets symmetrically about the transverse axis of the air outlet (28), and each set of air outlets (28) is provided in two sets symmetrically about the transverse axis of the air outlet (28); a safety switch (32) is installed on the rear side of the air outlet pipe (27), and the end of the movable mechanism of the safety switch (32) is connected to the inner section of the pressure plate (30). At the same time, the pressure plate (30) and the movable mechanism of the reset spring (31) and the safety switch (32) form a telescopic structure.

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