Radiator with flow guide structure for new energy automobile

Abstract

The utility model discloses a new energy automobile radiator with a flow guide structure, which comprises a heat conducting plate, a fan and an air duct, a base plate is mounted on the heat conducting plate through a buckling mechanism, a plurality of arc-shaped fins are arranged on the surface of the base plate, the section of each arc-shaped fin is U-shaped, the fan is mounted at the center of the base plate, and the air duct is connected with the arc-shaped fins; when the substrate is placed on the heat-conducting plate, the clamping groove is aligned with the limiting block, the limiting block presses the heat-conducting plate and prevents the heat-conducting plate from sliding, the pressing block is rotated to press the other side of the heat-conducting plate, the non-slip mat can limit rotation of the pressing block, the pressing block is matched with the limiting block to achieve rapid assembly of the substrate and the heat-conducting plate, and the heat-conducting plate cannot be loosened due to vibration. And the fan can extract surrounding air at 360 degrees, air channels are formed between the arc-shaped fins to guide the air to flow to the fan, the fan can quickly and uniformly cool all the arc-shaped fins, and the heat dissipation effect is good.

Description

Technical Field

[0001] This utility model relates to the field of PCB heat dissipation technology, specifically a heat sink for new energy vehicles with a flow guiding structure. Background Technology

[0002] PCB boards in new energy vehicles carry various electronic components, such as controllers and sensors, to realize the vehicle's electric drive, energy management, data transmission and other functions. The components on the PCB generate heat during operation and need to be cooled to ensure normal operation.

[0003] Among the relevant technologies, a solution for a heat sink (announcement number CN118201195A) for a PCB board of a new energy vehicle was found. This solution uses a fan to absorb the heat generated on the surface of the PCB board of the new energy vehicle. The heat is then dissipated through the surface of the heat sink and heat dissipation fins, allowing the fan, heat sink, and heat dissipation fins to dissipate the heat on the surface of the PCB board of the new energy vehicle, thus making the heat dissipation more rapid.

[0004] However, the above solution involves installing the housing by moving the extrusion plate. When affected by factors such as vibration, the housing may become loose, resulting in gaps between the housing and the PCB. This reduces heat transfer efficiency. The limited contact area between the heat sink fins and the heatsink limits the speed at which the heatsink moves towards the heatsink fins. Furthermore, the straight heatsink fins cannot interfere with the airflow direction of the fan, so the heat dissipation efficiency still needs to be optimized. Utility Model Content

[0005] The purpose of this invention is to provide a radiator for new energy vehicles with a flow guiding structure to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a radiator for new energy vehicles with a flow guiding structure, including a heat-conducting plate, on which a base plate is mounted by a fastening mechanism, and the surface of the base plate is provided with a plurality of arc-shaped fins, which are arranged in a ring. The cross-section of the arc-shaped fins is U-shaped, and the shell increases the contact area between the arc-shaped fins and the heat-conducting plate, thereby improving the heat dissipation efficiency.

[0007] The fan is installed at the center of the substrate. The fan draws in air from the gap between adjacent arc-shaped fins and discharges it upwards. The arc-shaped fins allow the air to flow in an arc shape, which is conducive to the air gathering towards the fan. The fan can draw in air 360 degrees and has a good heat dissipation effect on the arc-shaped fins.

[0008] An air guide duct is connected to the arc-shaped fins. The air guide duct is fitted outside the fan to guide hot air away from the arc-shaped fins, so as to avoid the hot air affecting the heat dissipation effect of the arc-shaped fins.

[0009] Furthermore, an elastic clamp is installed at the corner of the heat-conducting plate to achieve elastic installation of the heat-conducting plate. The elastic clamp includes an internal hex bolt with a spring sleeved on it. The internal hex bolt passes through the heat-conducting plate, and when connecting the heat-conducting plate to the circuit board, an elastic connection can be used to avoid the circuit board bending and deforming due to excessive tightening of the internal hex bolt.

[0010] Furthermore, the lower surface of the heat-conducting plate is provided with a groove, and a heat-conducting pad is provided inside the groove. The heat-conducting pad is relatively soft and can stably fill the gap between the heat-conducting plate and the circuit board, so as to quickly conduct heat to the components on the circuit board.

[0011] Furthermore, the fastening mechanism includes a baffle and a housing, and the baffle and housing are connected to the edge of the heat-conducting plate. A pressure block is rotatably installed in the housing. The baffle is connected to a limit block. An anti-slip pad is fixedly connected to the lower surface of the pressure block. The substrate is placed under the limit block, and the pressure block is rotated to press the substrate, so as to realize the quick installation of the substrate without any loosening problem.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] (1) When the substrate is placed on the heat-conducting plate, align the slot with the limiting block. The limiting block presses down on the heat-conducting plate and prevents the heat-conducting plate from sliding. Rotate the pressing block to press down on the other side of the heat-conducting plate. The anti-slip pad can limit the rotation of the pressing block. The pressing block and the limiting block together enable the rapid assembly of the substrate and the heat-conducting plate. The heat-conducting plate will not loosen due to vibration, ensuring that there will be no gaps between the substrate and the heat-conducting plate, and the heat conduction is more stable.

[0014] (2) The curved fins are bent into a U-shape, which increases the contact area between the curved fins and the heat-conducting plate, resulting in faster heat conduction and higher heat dissipation efficiency of the curved fins on the heat-conducting plate, thereby improving the heat dissipation efficiency of components on the circuit board.

[0015] (3) Several arc-shaped fins are arranged in a ring. When the fan draws air, the air flows through the gaps between the arc-shaped fins. The fan can draw out the surrounding air in 360 degrees. The air passages formed between the arc-shaped fins guide the air flow to the fan, which is conducive to the fan quickly and evenly cooling all the arc-shaped fins, resulting in good heat dissipation.

[0016] (4) Tighten the hex bolts to connect with the circuit board. The hex bolts push the heat-conducting plate to fit with the circuit board, achieving an elastic connection between the heat-conducting plate and the circuit board. When the hex bolts are tightened, the circuit board can be prevented from bending and deforming, thus providing a protective effect. Attached Figure Description

[0017] Figure 1 This is a top view of the present invention;

[0018] Figure 2 This is a schematic diagram of the connection between the internal hexagonal bolt and the spring in this utility model;

[0019] Figure 3 This is a schematic diagram of the structure of the limiting block pressing down on the substrate according to this utility model;

[0020] Figure 4 This is a schematic diagram showing the connection between the fan and the base plate of this utility model;

[0021] Figure 5 This is a cross-sectional view of the arc-shaped fin of this utility model.

[0022] In the diagram: 1. Heat-conducting plate; 2. Socket head bolt; 3. Housing; 4. Pressure block; 5. Base plate; 6. Arc-shaped fins; 7. Limiting block; 8. Baffle; 9. Air duct; 10. Fan; 11. Slot; 12. Spring; 13. Heat-conducting pad; 14. Groove; 15. Anti-slip pad; 16. Bracket. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Example:

[0025] Please see Figure 1-5 This utility model provides a technical solution: a radiator for new energy vehicles with a flow guiding structure, including a heat-conducting plate 1, on which a base plate 5 is mounted by a fastening mechanism. The surface of the base plate 5 is provided with a plurality of arc-shaped fins 6, which are arranged in a ring. The cross-section of the arc-shaped fins 6 is U-shaped. The arc-shaped fins 6 are bent into a U-shape to connect the ground of the arc-shaped fins 6 to the base plate 5, thereby increasing the contact area with the base plate 5. This facilitates the faster conduction of heat from the base plate 5 to the arc-shaped fins 6, thus improving the heat conduction efficiency. The heat-conducting plate 1 can be made of copper, and the base plate 5 and the arc-shaped fins 6 can be made of aluminum.

[0026] Fan 10 is installed at the center of substrate 5. Fan 10 draws air from the gap between adjacent arc-shaped fins 6 and discharges it upward. Fan 10 draws air in so that air converges from the edge of the arc-shaped fins 6 to the center. The hot air discharged by fan 10 can stay away from substrate 5 and heat-conducting plate 1 and will not affect the heat dissipation of heat-conducting plate 1.

[0027] The air guide 9 is connected to the arc-shaped fins 6. The air guide 9 is sleeved outside the fan 10. The air guide 9 prevents hot air from spreading in all directions and ensures that hot air does not come into contact with the substrate 5 and the heat-conducting plate 1.

[0028] In this embodiment, an elastic clamp is installed at the corner of the heat-conducting plate 1. The elastic clamp enables the heat-conducting plate 1 to be installed elastically, avoiding the rigid installation method of using screws. This can prevent the circuit board from deforming due to screw tightening and prevent the circuit board from being damaged.

[0029] In this embodiment, as Figure 1 and Figure 2 As shown, the elastic clamping device includes an internal hex bolt 2, and a spring 12 is sleeved on the internal hex bolt 2. The internal hex bolt 2 passes through the heat-conducting plate 1. When the internal hex bolt 2 is screwed to the circuit board, the internal hex bolt 2 compresses the spring 12. The spring 12 pushes the heat-conducting plate 1 to fit against the circuit board, which can ensure a tight contact and prevent the circuit board from bending due to the internal hex bolt 2 being tightened.

[0030] In this embodiment, as Figure 4 As shown, a bracket 16 is installed on the fan 10. The bracket 16 is fixedly connected to the base plate 5. The bracket 16 is connected to the base plate 5 with screws to ensure that the fan 10 is stably fixed.

[0031] In this embodiment, as Figure 2 As shown, the lower surface of the heat-conducting plate 1 is provided with a groove 14, and a heat-conducting pad 13 is provided inside the groove 14. The groove 14 can restrict the sliding of the heat-conducting pad 13. The heat-conducting pad 13 is elastic and can fill the gap between the heat-conducting plate 1 and the circuit board. Heat is transferred through the heat-conducting pad 13, which can dissipate the heat of the components on the circuit board more quickly.

[0032] In this embodiment, as Figure 1 and Figure 3 As shown, the fastening mechanism includes a baffle 8 and a housing 3, and the baffle 8 and the housing 3 are connected to the edge of the heat-conducting plate 1. A pressure block 4 is rotatably installed in the housing 3. The baffle 8 is connected to a limiting block 7. The limiting block 7 and the pressure block 4 press the substrate 5 to ensure that the substrate 5 is in contact with the heat-conducting plate 1, and also to prevent the heat-conducting plate 1 from loosening. The installation method is relatively simple and can improve the production efficiency of the radiator.

[0033] In this embodiment, as Figure 3 As shown, an anti-slip pad 15 is fixedly connected to the lower surface of the pressure block 4. The anti-slip pad 15 can be made of rubber, which has a good anti-slip effect and ensures that the pressure block 4 will not rotate freely. A recessed groove can also be set on the base plate 5 to lock the anti-slip pad 15, which can also restrict the free rotation of the pressure block 4.

[0034] In this embodiment, as Figure 3 As shown, the substrate 5 has a slot 11 on its surface, and the limiting block 7 is placed inside the slot 11, which can effectively prevent the substrate 5 from sliding and improve the installation stability of the substrate 5.

[0035] Specifically, during use, apply silicone grease to the bonding surface of the heat-conducting plate 1 or the substrate 5, align the slot 11 of the substrate 5 with the limiting block 7 of the baffle 8 to achieve the positioning and installation of the substrate 5, and then rotate the pressure block 4 so that the pressure block 4 presses the substrate 5 through the anti-slip pad 15 to complete the connection between the substrate 5 and the heat-conducting plate 1.

[0036] Align the hex bolt 2 with the screw hole on the circuit board and tighten the hex bolt 2 diagonally. The hex bolt 2 compresses the spring 12, and the spring 12 increases the thrust on the heat conduction plate 1, ensuring that the heat conduction pad 13 on the lower surface of the heat conduction plate 1 is in close contact with the components on the circuit board.

[0037] When components on the circuit board generate heat, the heat is conducted through the thermal pad 13 to the thermal plate 1, substrate 5, and arc-shaped fins 6. The fan 10 rotates to draw in air, which flows along the gaps between the arc-shaped fins 6, carrying away the heat. The annular arrangement of the arc-shaped fins 6 does not obstruct airflow, allowing the fan 10 to draw in surrounding air in a circular pattern. The air, after exchanging heat with the arc-shaped fins 6, is then sent by the fan 10 to the air duct 9. Figure 4 As shown by the middle arrow, the air duct 9 guides the hot air away from the heat-conducting plate 1, the substrate 5, and the arc-shaped fins 6, so as to avoid the hot air interfering with the heat dissipation effect.

[0038] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A radiator for new energy vehicles with a flow guiding structure, characterized in that, include: A heat-conducting plate (1) is provided with a base plate (5) installed on the heat-conducting plate (1) by a fastening mechanism. The base plate (5) has a plurality of arc-shaped fins (6) arranged in a ring. The cross section of the arc-shaped fins (6) is U-shaped. A fan (10) is mounted at the center of a substrate (5). The fan (10) draws in air from the gap between adjacent arcuate fins (6) and discharges it upward. The air guide tube (9) is connected to the arc-shaped fins (6) and is fitted outside the fan (10).

2. The radiator with flow guide structure for new energy vehicles according to claim 1, characterized in that: A spring clamp is installed at the corner of the heat-conducting plate (1), and the spring clamp enables the heat-conducting plate (1) to be installed elastically.

3. The radiator with flow guide structure for new energy vehicles according to claim 2, characterized in that: The elastic clamping device includes an internal hex bolt (2), and a spring (12) is sleeved on the internal hex bolt (2), and the internal hex bolt (2) passes through the heat-conducting plate (1).

4. A radiator for new energy vehicles with a flow-guiding structure according to claim 1, characterized in that: A bracket (16) is mounted on the fan (10), and the bracket (16) is fixedly connected to the base plate (5).

5. A radiator for new energy vehicles with a flow-guiding structure according to claim 1, characterized in that: The lower surface of the heat-conducting plate (1) is provided with a groove (14), and a heat-conducting pad (13) is provided inside the groove (14).

6. A radiator for new energy vehicles with a flow-guiding structure according to claim 1, characterized in that: The fastening mechanism includes a baffle (8) and a housing (3), and the baffle (8) and the housing (3) are connected to the edge of the heat-conducting plate (1). A pressure block (4) is rotatably installed in the housing (3), and the baffle (8) is connected to a limit block (7).

7. A radiator for new energy vehicles with a flow-guiding structure according to claim 6, characterized in that: An anti-slip pad (15) is fixedly connected to the lower surface of the pressure block (4).

8. A radiator for new energy vehicles with a flow-guiding structure according to claim 6, characterized in that: The substrate (5) has a slot (11) on its surface, and the limiting block (7) is placed inside the slot (11).

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