Packaging parameter inspection method for integrated component model analysis and extraction algorithm

Abstract

The application relates to a package parameter inspection method of integrated component model analysis and extraction algorithm, and belongs to the field of electronic design. The method comprises the following steps: in the service process of extracting component package parameters, company-level components are analyzed according to data objects, the components are distinguished into quick components and classic components according to different data importance levels and access forms; component identification algorithms and component extraction algorithms are defined based on the industry experience and hardware design method of electronic circuit technology; the component identification algorithm is used to extract the identification field of the quick component, and the identification field reflects the normalized package parameters from different suppliers and different product families of the suppliers; the component extraction algorithm is used to map the identification field to the package parameter model library; wherein, the component identification algorithm is adopted for the quick component; and the look-up table comparison method is adopted for the classic component.

Description

TECHNICAL FIELD

[0001] The application relates to a package parameter inspection method of integrated component model analysis and extraction algorithm and belongs to the field of electronic design. BACKGROUND

[0002] Since the 1960s, the CAD technology of electronic design has developed rapidly, and a large number of tooling principles and methods serving the printed circuit board design business have emerged. The package parameter of a component is key data connecting the design and manufacturing of a printed circuit board. If the package parameter is wrong, the component cannot be reliably soldered on the corresponding point of the printed board, resulting in the scrapping of the entire batch of printed boards. Even if the soldering is successful, abnormalities may occur in the printed board assembly link and the power-on debugging link, leading to system-level safety problems, quality risks and difficult-to-assess cost losses. Therefore, the traditional CAD technology considers establishing a management database for the package of a component. In this way, the database is referenced when the printed board is designed, facilitating pre-plate comparison and ensuring that the mapping relationship between the component model and the package information is correct, thereby avoiding risks.

[0003] However, the traditional method of checking the package of a component has the following defects:

[0004] Firstly, a database with a certain capacity needs to be established, and as the development team continuously develops new projects or the types of circuit boards become more diversified, the number of packages basically increases linearly with the number of component selection, so the cost of establishing and maintaining the database is also high.

[0005] Secondly, the inspection period of the general "table lookup method" increases with the number of component selection, because each model information needs to be compared as a key value, and the time cost of processor resources, storage resources and network resources is limited by the capacity of the database.

[0006] Thirdly, the security in the data access process needs to be designed, especially the data storage aspect, and it is necessary to regularly refresh the aging data. SUMMARY

[0007] The application aims to:

[0008] In order to explore a more efficient and reliable inspection method, the concept of a vector diagram in computer image science is considered. A vector diagram is an object-oriented graph, which is a graph described by straight lines and curves. These basic elements constituting the graph are obtained through mathematical formula calculation. Since the vector diagram packages algorithms rather than dot matrix data, it can be enlarged or reduced without loss compared with a bitmap (composed of each pixel information), the file size is smaller, and the editing is flexible. The traditional inspection method is a method based on table lookup in a database, which is similar to the concept of a bitmap based on pixel data. The application attempts to design an inspection method like a vector Figure OneThe sample packaging algorithm realizes comparison without table lookup, so as to improve the inspection efficiency, miniaturize the data resource, and make the process data safer.

[0009] Technical scheme:

[0010] An integrated component model analysis and extraction algorithm packaging parameter inspection method, comprising:

[0011] In the business process of extracting component packaging parameters, the company-level components are analyzed according to the data object, and the components are divided into fast components and classic components according to the different data importance levels and access forms;

[0012] Based on the industry experience and hardware design method of electronic circuit technology, the component recognition algorithm and the component extraction algorithm are defined; the component recognition algorithm is used to extract the identification field of the fast component, and the identification field reflects the common information of different suppliers and different supplier product families; the component extraction algorithm is used to map the identification field to the packaging parameter model library of the fast component;

[0013] Among them, for the fast component, the component recognition algorithm is used; for the classic component, the table lookup comparison method is used.

[0014] In addition, the inspection error codes of the fast component and the classic component are split.

[0015] The fast component is a kind of component that is easy to identify the model, easy to extract the packaging from the model, and non-critical data access;

[0016] The component of many kinds is a kind of component that accounts for more than 60% of the component list in a certain electronic circuit design field;

[0017] The component easy to identify the model is a kind of component whose identification field provided by the supplier does not exceed 15 characters in the electronic circuit design field;

[0018] The component easy to extract the packaging from the model is a kind of component whose model identification field and packaging parameter description are one-to-one mapped in the supplier's specification;

[0019] The component of non-critical data access is a kind of component that does not cause significant errors in the business process of extracting component packaging parameters, resulting in board return;

[0020] The classic component is a kind of component that is not easy to identify the model, not easy to extract the packaging from the model, and critical data access.

[0021] For digital circuits, the fast component is a resistor-capacitor component; for radio frequency analog circuits, the fast component is an amplifier.

[0022] Based on the industry experience of electronic circuit technology, hardware design method, define component identification algorithm, component extraction algorithm, including:

[0023] First, get the supplier list of fast components, analyze the specification of each product family of each supplier;

[0024] For any product family of any of the above suppliers, get the model description of the fast component;

[0025] Extract the common part of the fast component model description as the optional item of the identification field;

[0026] Put the optional item of the identification field into the identification algorithm pool;

[0027] For all other product families of suppliers, verify whether the identification field in the identification algorithm pool can be matched, iterate or split, and finally match the identification field to the full set of fast components;

[0028] According to the identification field in the identification algorithm pool, analyze the packaging information field, construct the extraction algorithm of the identification field to extract the packaging information, and associate it with the packaging model in the packaging parameter library;

[0029] Put the association relationship into the extraction algorithm pool.

[0030] Extract the common part of the fast component model description as the optional item of the identification field, including:

[0031] Extract the location and string description of the packaging size in the fast component model description;

[0032] Extract the location and string description of the metric standard in the fast component model description;

[0033] Perform string matching on other fields except packaging size and metric standard to extract common character fields;

[0034] The identification field is composed of the above character field, the number wildcard for packaging size placeholder, and the metric standard.

[0035] Split the error codes of fast components and classic components, including:

[0036] Fast component check reports fast component error code, indicating user operation exception of component identification algorithm pool and extraction algorithm pool;

[0037] Classic component check reports classic component error code, indicating user operation exception of data table.

[0038] The method further comprises:

[0039] Input the model description of the components to be checked;

[0040] According to the model description, it is determined that the component to be checked belongs to a fast component or a classic component;

[0041] If the component to be checked is a fast component, the corresponding packaging parameter model is obtained through the identification algorithm pool and the extraction algorithm pool;

[0042] If the component to be checked is a classic component, the corresponding packaging parameter model is obtained through a table lookup method.

[0043] The corresponding packaging parameter model is obtained through the identification algorithm pool and the extraction algorithm pool, comprising:

[0044] The model description of the component to be checked is matched with each identification field in the identification algorithm pool in turn until the appropriate identification field to be checked is matched;

[0045] According to the extraction algorithm pool, the packaging parameter model corresponding to the identification field to be checked is queried.

[0046] Beneficial effects:

[0047] The present application relates to a component packaging parameter inspection method, which combines component identification algorithm and extraction packaging information algorithm in the inspection process. The table lookup comparison and algorithm comparison are integrated, which greatly reduces the database access period, improves the inspection efficiency and data security, and optimizes the large-scale electronic circuit design inspection operation time. BRIEF DESCRIPTION OF DRAWINGS

[0048] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly introduced as follows.

[0049] Figure 1 It is a specification sheet diagram of RMK type chip film fixed resistor with reliability index of Zhuzhou Hongda;

[0050] Figure 2 It is a specification sheet diagram of RMK type chip film fixed resistor with reliability index of 718 factory;

[0051] Figure 3 It is a specification sheet diagram of RM type chip film fixed resistor of 718 factory;

[0052] Figure 4 It is a flow chart for introducing the main processing flow chart of the inspection, and assisting in explaining the working mode of table lookup comparison + algorithm comparison. DETAILED DESCRIPTION

[0053] The characteristics of the standard resistance and capacitance component meet the above fast component definition.

[0054] This is because, standard resistance-capacitance components are the most commonly used components of the circuit board, if each through the database query method for packaging and other components inherent properties of comparison, will waste a lot of access cycle, and data query process may be wrong cause data invalid.

[0055] In the preparation phase of the standard resistance-capacitance components packaging parameter inspection business, first get the company standard resistance-capacitance components supplier list, analysis of the specification, get a (class) supplier a (class) resistance-capacitance components model identification field, determine the identification field in the current model list of uniqueness, get the identification field. For example, Figure 1 For the RMK type chip film fixed resistor specification of Zhuzhou Hongda with reliability index, Figure 2 For the RMK resistor specification of 718 factory, "RMKxxxxy" (xxxx for 4 digits, y for letter) can be extracted as the identification field, and the current model list has uniqueness, which can be used as the identification field of the general resistor of the supplier option, added to the identification algorithm pool. Next, all the standard resistance-capacitance components model descriptions of the company are iterated or split, and finally the identification field is matched to the full set. For example, Figure 3 For the RM type resistor specification of 718 factory, "RMxxxxy" (xxxx for 4 digits, y for letter) can be extracted as the identification field, which is added to the identification algorithm pool for use.

[0056] Secondly, for the effective identification algorithm of a (class) supplier a (class) resistance-capacitance components model description, decompose the packaging information in it, construct the extraction algorithm for extracting the packaging information from the model, and associate it with the packaging parameters in the library packaging, gradually enrich the extraction algorithm pool. For example, Figure 1 、 Figure 2 The "RMKxxxxy" identification field of the component, and Figure 3 The "RMxxxxy" identification field, "xxxx" in the specification is consistent, which represents the packaging metric size of the resistor, "1608" should be associated with the "R0603

[1608] " packaging model in the library packaging, so a set of extraction algorithms is constructed.

[0057] Finally, the standard resistance-capacitance components are packaged with their identification algorithm pool and extraction algorithm pool.

[0058] In the implementation phase of the inspection, the process is as follows Figure 4The shown: first, the initial judgment of the legality of component model, that is, the object is valid, such as to exclude the illegal component model name "10Kohm"; second, using standard resistance and capacitance identification algorithm pool to filter out the standard resistance and capacitance (fast component), other components (classic components); third, the standard resistance and capacitance adopts extraction algorithm pool to obtain the associated packaging parameters, and other components query "model name"-"library packaging" mapping table, or access material management database to obtain packaging parameters; then, the result packaging parameters are compared with the packaging parameters in the drawing, if incorrect, report error code respectively.

[0059] In addition, the error code of the standard resistance and capacitance is separated from the inspection result. The error code of the standard resistance and capacitance algorithm comparison error is 7 to 9, respectively pointing to "discrete component model name error", "discrete component packaging name error", "discrete component not using library packaging" three types of errors, which is different from the error code 0 to 6 of the classic component table comparison error. Such design provides the possibility for users to batch process resistance and capacitance errors.

Claims

1. A method of package parameter checking integrating a model analysis and extraction algorithm, characterized in that, The method comprises the following steps: In the process of extracting component packaging parameters, the company-level components are analyzed in the form of data objects, and the components are divided into fast components and classic components according to different data importance levels and access forms; Based on the industry experience and hardware design method of electronic circuit technology, the component identification algorithm and the component extraction algorithm are defined, the component identification algorithm is used to extract the identification field of the fast component, and the identification field reflects the common information of different suppliers and different product families of the suppliers; the component extraction algorithm is used to map the identification field to the packaging parameter model library of the fast component; Wherein, for the fast component, the component identification algorithm is used; for the classic component, the table lookup comparison method is used; In addition, the error codes of the fast component and the classic component are split; Based on the industry experience and hardware design method of electronic circuit technology, the component identification algorithm and the component extraction algorithm are defined, including: First, the supplier list of the fast component is obtained, and the specification book of each product family of each supplier is analyzed; For any product family of any supplier, the model description of the fast component is obtained; The common part in the model description of the fast component is extracted as the optional item of the identification field; The optional item of the identification field is put into the identification algorithm pool; For all other product families of the suppliers, it is verified whether the identification field in the identification algorithm pool can be matched, and iteration or splitting is performed, so that the identification field finally matches the full set of fast components; According to the identification field in the identification algorithm pool, the packaging information field is analyzed, the extraction algorithm for extracting the packaging information from the identification field is constructed, and the extraction algorithm is associated with the packaging model in the packaging parameter library; The association relationship is put into the extraction algorithm pool; The method further comprises: inputting the model description of the component to be checked; According to the model description, it is judged whether the component to be checked belongs to the fast component or the classic component; If the component to be checked is the fast component, the corresponding packaging parameter model is obtained through the identification algorithm pool and the extraction algorithm pool; If the component to be checked is the classic component, the corresponding packaging parameter model is obtained through the table lookup method; The corresponding packaging parameter model is obtained through the identification algorithm pool and the extraction algorithm pool, including: The model description of the component to be checked is matched with each identification field in the identification algorithm pool in turn until the appropriate identification field of the component to be checked is matched; According to the extraction algorithm pool, the packaging parameter model corresponding to the identification field of the component to be checked is queried.

2. The method of claim 1, wherein, The fast component is a component with multiple types, easy to identify model, easy to extract packaging from model, and non-critical data access; The component with multiple types is a component whose list accounts for more than 60% of the components in a certain electronic circuit design field; The component with easy-to-identify model is a component whose identification field provided by the supplier does not exceed 15 characters in the electronic circuit design field; The component easy to extract packaging from model is a component whose model identification field and packaging parameter description are one-to-one mapped in the specification book of the supplier; The non-critical data access component is a component that does not cause significant errors in the business process of extracting component packaging parameters, resulting in scrap of the circuit board. The classic element is an element with few types, which is not easy to identify the model, not easy to extract the package from the model, and access to key data.

3. The method of claim 1, wherein, For digital circuits, the fast element is mainly a resistor-capacitor element; for radio frequency analog circuits, the fast element is mainly an amplifier and a resistor-capacitor element.

4. The method of claim 1, wherein, Extract the common part of the fast element model description as an optional field of the identification field, including: Extract the location and string description of the package size in the fast element model description; Extract the location and string description of the metric standard in the fast element model description; String matching is performed on other fields in addition to package size and metric standard, and common character fields are extracted. The identification field is composed of the above character field, the number wildcard identification for the package size, and the metric standard.

5. The method of claim 1, wherein, The inspection error codes of the fast element and the classic element are split, including: The fast element inspection reports the fast element error code, indicating that the user's operation of the element identification algorithm pool and the extraction algorithm pool is abnormal; The classic element inspection reports the classic element error code, indicating that the user's operation of the data table is abnormal.

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