Method and apparatus for determining a production rhythm

Abstract

Embodiments of the present application provide a method and device for determining a production tempo, which are applied to a production device including at least one production subunit. The method includes: determining target semiconductor components to be processed by each production subunit in a same batch of semiconductor components to be processed; determining an original processing time of each production subunit according to a first interval time between a first end time when the first target semiconductor component is processed by each production subunit and a second end time when the last target semiconductor component is processed by each production subunit, and the number of target semiconductor components to be processed by each production subunit; and determining the production tempo of each production subunit according to the original processing time of each production subunit and the first interval time of each production subunit. The production tempo of each production subunit determined by the embodiments of the present application has high accuracy.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of semiconductor technology, and in particular, to a method and device for determining a production takt time. BACKGROUND

[0002] Production takt time, also known as production rhythm time, is an important indicator for measuring production efficiency.

[0003] In existing semiconductor processes, the processing of semiconductor components is performed using a flow line operation. When processing semiconductor components, a plurality of semiconductor components are simultaneously loaded into a standard sealed box, and the semiconductor components in each box are referred to as a batch or a group. Ideally, assuming that the production equipment is fully loaded and stably operated, when the same production recipe is used, the interval between the end times of two consecutive batches of semiconductor components can be referred to as the production takt time.

[0004] However, in actual situations, after the production of a batch of semiconductor components is completed, there will inevitably be a downtime, which is generally difficult to accurately measure, thereby resulting in low accuracy of the determined production takt time. SUMMARY

[0005] Embodiments of the present application provide a method and device for determining a production takt time, which can solve the technical problem of low accuracy of the determined production takt time in the prior art.

[0006] In a first aspect, the present application provides a method for determining a production takt time, applied to a production device, wherein the production device comprises at least one production subunit, and the method comprises the following steps:

[0007] determining target semiconductor components required to be processed by each production subunit in a same batch of semiconductor components to be processed;

[0008] determining an original processing time of each production subunit according to a first interval between a first end time when each production subunit processes a first target semiconductor component and a second end time when each production subunit processes a last target semiconductor component, and a number of target semiconductor components required to be processed by each production subunit;

[0009] determining a production takt time of each production subunit according to the original processing time of each production subunit and the first interval of each production subunit.

[0010] In an embodiment, the first interval between the first end time when the first target semiconductor component is processed by each of the production sub-units and the second end time when the last target semiconductor component is processed by each of the production sub-units, and the number of target semiconductor components to be processed by each of the production sub-units, are used to determine the original processing time of each of the production sub-units, including:

[0011] The original processing time RPT of the i-th production sub-unit is calculated in the following manner: i

[0012]

[0013] wherein t1 represents the first end time when the first target semiconductor component is processed by the i-th production sub-unit, t2 represents the second end time when the last target semiconductor component is processed by the i-th production sub-unit, and m represents the number of target semiconductor components to be processed by the i-th production sub-unit.

[0014] In an embodiment, the production takt time of each of the production sub-units is determined based on the original processing time of each of the production sub-units and the first interval of each of the production sub-units, including:

[0015] The production takt time Takt Time(i) of the i-th production sub-unit is calculated in the following manner:

[0016] Takt Time(i) = (t2-t1) + RPT i

[0017] wherein t1 represents the first end time when the first target semiconductor component is processed by the i-th production sub-unit, t2 represents the second end time when the last target semiconductor component is processed by the i-th production sub-unit, and RPT i represents the original processing time of the i-th production sub-unit.

[0018] In an embodiment, after the production takt time of each of the production sub-units is determined, the method further includes:

[0019] The production takt time of each of the parallel sub-unit groups in the production device is determined based on the production takt time of each of the production sub-units, wherein each of the parallel sub-unit groups includes at least one of the production sub-units.

[0020] In an embodiment, the production takt time of each of the parallel sub-unit groups in the production device is determined based on the production takt time of each of the production sub-units, including:

[0021] ​The arithmetic mean of the production tact of each production subunit in each parallel subunit group is calculated, and the arithmetic mean of the production tact of each production subunit in each parallel subunit group is determined as the production tact of the parallel subunit group.

[0022] In an implementable embodiment, after the production tacts of each parallel subunit group in the production device are determined, the method further comprises:

[0023] The production tact corresponding to the parallel subunit group with the largest production tact among the parallel subunit groups is determined as the production tact corresponding to the production device.

[0024] In an implementable embodiment, different production process recipes are used among different parallel subunit groups in the production device, and the same production process recipe is used among each production subunit in the same parallel subunit group.

[0025] In a second aspect, an embodiment of the present application provides a production tact determination device, applied to a production device, the production device comprising at least one production subunit, and the device comprising:

[0026] A determination module is configured to determine target semiconductor components required to be processed by each production subunit in the same batch of semiconductor components to be processed.

[0027] A first processing module is configured to determine an original processing time length corresponding to each production subunit according to a first interval time length between a first end time when each production subunit processes a first target semiconductor component and a second end time when each production subunit processes a last target semiconductor component, and the number of target semiconductor components required to be processed by each production subunit.

[0028] A second processing module is configured to determine a production tact of each production subunit according to the original processing time length corresponding to each production subunit and the first interval time length corresponding to each production subunit.

[0029] In an implementable embodiment, the first processing module is specifically configured to:

[0030] The original processing time length RPT corresponding to the i th production subunit is calculated in the following manner: i :

[0031]

[0032] Wherein, t1 represents a first end time when the i th production subunit processes a first target semiconductor component, t2 represents a second end time when the i th production subunit processes a last target semiconductor component, and m represents a number of target semiconductor components processed by the i th production subunit.

[0033] In an implementable embodiment, the second processing module is specifically configured to:

[0034] The production Takt Time of the i th production subunit is calculated in the following manner (i) :

[0035] Takt Time (i) = (t2-t1) + RPT i

[0036] Wherein, t1 represents a first end time when the i th production subunit processes a first target semiconductor component, t2 represents a second end time when the i th production subunit processes a last target semiconductor component, and RPT i represents an original processing time corresponding to the i th production subunit.

[0037] In an implementable embodiment, a third processing module is further included, configured to:

[0038] After determining the production Takt Time of each production subunit, the production Takt Time of each parallel subunit group in the production device is determined according to the production Takt Time of each production subunit, wherein the parallel subunit group at least includes one production subunit.

[0039] In an implementable embodiment, the third processing module is specifically configured to:

[0040] An arithmetic mean value of the production Takt Time of each production subunit in each parallel subunit group is calculated, and the arithmetic mean value of the production Takt Time of each production subunit in each parallel subunit group is determined as the production Takt Time of the parallel subunit group, respectively.

[0041] In an implementable embodiment, the third processing module is further configured to:

[0042] After determining the production Takt Time of each parallel subunit group in the production device, the production Takt Time corresponding to a parallel subunit group with the largest production Takt Time in the parallel subunit group is determined as the production Takt Time corresponding to the production device.

[0043] In one possible implementation, different production process recipes are used between different parallel subunit groups in the production device, and the same production process recipe is used between each production subunit in the same parallel subunit group.

[0044] In a third aspect, an electronic device is provided, including at least one processor and a memory;

[0045] The memory stores computer-executable instructions;

[0046] The at least one processor executes the computer-executable instructions stored in the memory, so that the at least one processor executes the method for determining a production tact provided in the first aspect.

[0047] In a fourth aspect, a computer-readable storage medium is provided, and the computer-readable storage medium stores computer-executable instructions, when the processor executes the computer-executable instructions, the method for determining a production tact provided in the first aspect is implemented.

[0048] In a fifth aspect, a computer program product is provided, and the computer program product includes a computer program, when the computer program is executed by the processor, the method for determining a production tact provided in the first aspect is implemented.

[0049] The method and device for determining a production tact provided in the embodiments of the present application can determine the original processing time required by the production subunit to process one target semiconductor component, based on the first interval time between the first end time when the production subunit finishes processing the first target semiconductor component and the second end time when the production subunit finishes processing the last target semiconductor component, and the number of target semiconductor components required to be processed by the production subunit, and then determine the interval time between the end times of two batches of semiconductor components, based on the original processing time and the first interval time. Since the interval time includes the stop time for starting the production of the next batch of semiconductor components after the production of the previous batch of semiconductor components is finished, the production tact of the production subunit determined based on the interval time has high accuracy. BRIEF DESCRIPTION OF DRAWINGS

[0050] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the drawings needed in the description of the embodiments of the present application or the prior art will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the present application, and those skilled in the art can obtain other drawings according to these drawings without creative labor.

[0051] Figure 1 The figure shows the distribution of the ideal production tact on the time axis in the embodiments of the present application.

[0052] Figure 2 Fig. 3 is a schematic diagram of distribution of production rhythm on time axis in actual situation in an embodiment of the present application;

[0053] Figure 3 Fig. 4 is a schematic diagram of position relationship between production subunits in an embodiment of the present application;

[0054] Figure 4 Fig. 5 is a schematic diagram of flow of a method for determining production rhythm provided in an embodiment of the present application;

[0055] Figure 5 Fig. 6 is a schematic diagram of distribution of semiconductor component processing processes of different batches on time axis in an embodiment of the present application;

[0056] Figure 6 Fig. 7 is a schematic diagram of program modules of a device for determining production rhythm provided in an embodiment of the present application;

[0057] Figure 7 Fig. 8 is a schematic diagram of hardware structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0058] In order to make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of the present application. In addition, although the disclosure is introduced according to one or more exemplary examples, it should be understood that each aspect of the disclosure can also constitute a complete embodiment independently.

[0059] It should be noted that the brief description of the terms in the present application is only for the convenience of understanding the subsequently described embodiments, and is not intended to limit the embodiments of the present application. Unless otherwise specified, these terms should be understood according to their ordinary and general meanings.

[0060] The terms "first", "second", and the like in the specification and claims of the present application and the above-described drawings are used to distinguish similar or similar objects or entities, and do not necessarily mean to limit the specific order or sequence, unless otherwise specified. It should be understood that the terms used in this way can be interchanged under appropriate circumstances, for example, those orders other than given in the embodiment illustration or description of the present application can be implemented.

[0061] Moreover, the terms "comprising" and "having" and any variations thereof are intended to cover a non-exclusive inclusion, such that a product or apparatus that comprises a list of components does not necessarily comprise only those components in the list and can include additional components not expressly listed or inherent to such product or apparatus.

[0062] As used herein, the term "module" refers to any known or later developed hardware, software, firmware, artificial intelligence, fuzzy logic, or combination of hardware and / or software codes that can perform the function associated with the component.

[0063] In the prior art semiconductor manufacturing process, the processing of semiconductor components is performed in a pipeline operation. When processing semiconductor components, a number of semiconductor components are usually loaded into a standard sealed box at the same time. The semiconductor components in each sealed box are collectively referred to as a batch or lot.

[0064] For example, in a 12-inch semiconductor manufacturing plant, wafers are loaded into standard sealed boxes. Each sealed box can generally hold 25 wafers, which are referred to as the same batch or lot.

[0065] In some embodiments, ideally, assuming that the production equipment has sufficient raw materials at the inlet, the production equipment is fully loaded and operates stably, the interval between the end times of two consecutive batches of semiconductor components produced using the same production recipe is referred to as the production takt time.

[0066] For a better understanding of the embodiments of the present application, reference is made to Figure 1 , Figure 1 The figure shows the distribution of the ideal production takt time on the time axis in the embodiments of the present application.

[0067] In Figure 1 , Lot(i) represents the i-th batch of wafers, Lot(i-1) represents the (i-1)-th batch of wafers, Lot(i+1) represents the (i+1)-th batch of wafers, and the interval between the end times of two consecutive batches of semiconductor components is referred to as the production takt time.

[0068] However, in actual situations, after the production of a batch of semiconductor components is completed, there will inevitably be a downtime. This downtime is usually difficult to accurately measure. When recording the production takt time, the accuracy of the determined production takt time is not high due to the mixing of the downtime.

[0069] For a better understanding of the embodiments of the present application, reference is made to Figure 2 , Figure 2Fig. 1 is a schematic diagram of distribution of production tempo on time axis in actual situation in an embodiment of the present application.

[0070] In Figure 2 In the prior art, there is a pause time between the end of production of the last semiconductor component in a batch and the start of production of the first semiconductor component in the next batch.

[0071] It can be understood that a production device usually includes multiple production subunits that can independently complete a process substep, such as a reaction chamber of an etching machine.

[0072] Because the production processes corresponding to different production subunits can be different, the processing time of different production subunits for processing a semiconductor component can also be different. The production subunit with the longest processing time is usually referred to as a bottleneck production subunit.

[0073] The bottleneck production subunit determines the production tempo of the production device.

[0074] In some other embodiments, the position of the bottleneck production subunit can be determined first, and then the interval time between the end of production of two adjacent semiconductor components in the bottleneck production subunit is recorded, and the production tempo of the production device is calculated according to the recorded interval time.

[0075] However, the above method needs to accurately know the production device in advance to determine the position of the bottleneck production subunit of the production device. Because different production process recipes are faced, the bottleneck production subunit of the production device will change. If the position of the bottleneck production subunit cannot be accurately found in advance, the production tempo calculated will have a large error.

[0076] In an embodiment of the present application, in the “piece-by-piece production mode” (not the entire lot) in which one or more pieces are processed in each production subunit for the same batch and the same production control number, the processing mode of the production subunit usually includes parallel relationship and serial relationship.

[0077] Among them, for multiple production subunits with the same function and the same processing task, different semiconductor components in a batch can be completed by one of the production subunits, and do not need to pass through other production subunits with the same function. These production subunits are defined as parallel relationship.

[0078] For the same batch, the same production control number, different production process formula, for a plurality of different functions, undertake different processing task production sub unit, a batch of the same semiconductor components need to go through each production sub unit can complete production, these production sub unit between defined as serial relationship.

[0079] In addition, for the same function production sub unit, can adopt the parallel naming mode of "same name + serial number". For different function production sub unit, can adopt the serial naming mode of different name. Thus can help processing device according to the name of production sub unit can identify the parallel relationship or serial relationship between production sub unit.

[0080] In order to better understand the embodiments of the present application, refer to Figure 3 , Figure 3 The position relationship between each production sub unit in the embodiments of the present application is shown in the schematic diagram.

[0081] In Figure 3 , the production equipment includes three sub unit groups, named as ChA group, ChB group, ChC group, wherein, ChA group, ChB group, ChC group are in serial relationship.

[0082] ChA group includes three production sub units, named as ChA01, ChA02, ChA03. Among them, ChA01, ChA02, ChA03 are in parallel relationship; ChB group includes two production sub units, named as ChB01, ChB02. Among them, ChB01, ChB02 are in parallel relationship; ChC group includes one production sub unit, named as ChC01.

[0083] Among them, any one piece of semiconductor components in the same batch of semiconductor components enters ChA group from the entrance, and after processing in any one of ChA01, ChA02, ChA03, it can enter ChB group; after entering ChB group, after processing in any one of ChB01, ChB02, it can enter ChC group; after entering ChC group and processing in the later production sub unit ChC01, it can be output from the outlet.

[0084] Refer to Figure 4 , Figure 4 The flowchart of a production tact determination method provided in the embodiments of the present application is shown in the schematic diagram, in a feasible implementation manner, the method comprises:

[0085] S401, determine the target semiconductor components needed to be processed in each production sub unit of the same batch of semiconductor components.

[0086] In one possible implementation, the target semiconductor components required to be processed by each production subunit in the same batch of semiconductor components to be processed can be determined by using the production control serial number preset by the production equipment.

[0087] For example, assuming that a batch of semiconductor components includes 25 wafers, each wafer is numbered from 1 to 25, the production control serial number can be preset as follows: when the batch of semiconductor components enters the parallel subunit group ChA group for processing, the wafer numbered 1 enters the production subunit ChA01, the wafer numbered 2 enters the production subunit ChA02, the wafer numbered 3 enters the production subunit ChA03, the wafer numbered 4 enters the production subunit ChA01, the wafer numbered 5 enters the production subunit ChA02, and so on.

[0088] S402, determining the original processing time corresponding to each production subunit according to the first interval time between the first end time when each production subunit finishes processing the first target semiconductor component and the second end time when each production subunit finishes processing the last target semiconductor component, and the number of target semiconductor components required to be processed by each production subunit.

[0089] For example, taking the production subunit ChA01 as an example, assuming that the production subunit ChA01 needs to process m wafers, during the processing of the production subunit ChA01, the first end time when the production subunit ChA01 finishes processing the first wafer and the second end time when the production subunit ChA01 finishes processing the mth wafer are recorded, then the first interval time between the first end time and the second end time is calculated, and according to the calculated first interval time and the number of wafers required to be processed by the production subunit ChA01, the original processing time (Raw process time, RPT for short) corresponding to the production subunit ChA01 is determined.

[0090] The RPT corresponding to the production subunit ChA01 can be understood as the average interval time between the end times of two consecutive wafers completed by the production equipment under full load and stable operation and using the same production process recipe.

[0091] For example, assuming that the first interval time between the first end time and the second end time is T, then the RPT corresponding to the production subunit ChA01 is

[0092] S403, determining the production cycle of each production subunit according to the original processing time corresponding to each production subunit and the first interval time corresponding to each production subunit.

[0093] For example, in the production of the sub-unit ChA01, after determining the RPT corresponding to the sub-unit ChA01, the first interval time T corresponding to the sub-unit ChA01 is combined with the RPT, so as to determine the production tact of the sub-unit ChA01.

[0094] For better understanding of the embodiments of the present application, reference is made to Figure 5 , Figure 5 FIG. 1 is a schematic diagram of the distribution of the processing of different batches of semiconductor components in the time axis in the embodiments of the present application.

[0095] In Figure 5 , it is assumed that each batch of semiconductor components includes 25 wafers, wherein wafers (n-1) 25 , wafers (n-1) 24 , …, represent the (n-1)th batch of semiconductor components, wafers (n)1, wafers (n)2, wafers (n)3, …, wafers (n) 25 represent the nth batch of semiconductor components.

[0096] It is assumed that a certain sub-unit needs to process all the 25 wafers of the same batch, and the first end time when the wafer (n)1 is processed is t1, and the second end time when the wafer (n) 25 is processed is t2, then the first interval time T corresponding to the sub-unit is T=t2-t1, and the RPT corresponding to the sub-unit is

[0097] It can be understood that the RPT corresponding to the sub-unit calculated by the above method includes the average idle time between the end time of the processing of the previous wafer and the start time of the processing of the next wafer, which can be equivalent to the idle time between the end time of the processing of the last wafer of the (n-1)th batch of semiconductor components and the start time of the processing of the first wafer of the nth batch of semiconductor components. Therefore, the RPT corresponding to the sub-unit calculated by the above method can be used to represent the interval time between the end time of the processing of the last wafer of the (n-1)th batch of semiconductor components and the end time of the processing of the last wafer of the nth batch of semiconductor components.

[0098] In the embodiments of the present application, the sum of the first interval time T between the first end time t1 when the first wafer (n)1 of the nth batch of semiconductor components is processed and the second end time t2 when the last wafer (n) 25 is processed, and the first RPT of the sub-unit, can be used as the production tact of the sub-unit.

[0099] The method for determining the production rhythm provided by the embodiments of the present application can determine the original processing time required by the production subunit to process one target semiconductor component by using the first interval time between the first end time when the production subunit finishes processing the first target semiconductor component and the second end time when the production subunit finishes processing the last target semiconductor component, and the number of target semiconductor components required to be processed by the production subunit. Then, the interval time between the production end times of two batches of semiconductor components can be determined based on the original processing time and the first interval time. Since the interval time contains the stop time for starting the production of the next batch of semiconductor components after the production of the last batch of semiconductor components is finished, the production rhythm of the production subunit determined based on the interval time has high accuracy.

[0100] Based on the content described in the above embodiments, in some embodiments, for the ith production subunit, the original processing time RPT corresponding thereto can be calculated in the following manner i :

[0101]

[0102] wherein t1 represents the first end time when the ith production subunit finishes processing the first target semiconductor component, t2 represents the second end time when the ith production subunit finishes processing the last target semiconductor component, and m represents the number of target semiconductor components required to be processed by the ith production subunit.

[0103] Meanwhile, the production rhythm Takt Time(i) of the ith production subunit can be calculated in the following manner:

[0104] Takt Time(i) = (t2-t1) + RPT i

[0105] wherein t1 represents the first end time when the ith production subunit finishes processing the first target semiconductor component, t2 represents the second end time when the ith production subunit finishes processing the last target semiconductor component, and RPT i represents the original processing time corresponding to the ith production subunit.

[0106] Based on the content described in the above embodiments, in some embodiments, after the production rhythm of each production subunit is determined, the production rhythm of each parallel subunit group can be determined based on the production rhythm of each production subunit.

[0107] Optionally, in a feasible implementation of the present application, the arithmetic mean of the production tact time of each production subunit in each parallel subunit group can be calculated, and the arithmetic mean of the production tact time of each production subunit in each parallel subunit group is determined as the production tact time of each parallel subunit group.

[0108] For example, assuming that the parallel subunit group ChA includes three production subunits, i.e., the production subunit ChA01, the production subunit ChA02 and the production subunit ChA03, and the production tact times of the three production subunits are T 01 , T 02 and T 03 respectively, then the production tact time Takt Time(ChA) of the parallel subunit group ChA is:

[0109]

[0110] Based on the above-described content in the embodiments, in some embodiments, after the production tact time of each parallel subunit group is determined, the production tact time of the production device can be determined based on the production tact time of each parallel subunit group.

[0111] In this case, the parallel subunit group with the largest production tact time can be determined first, and then the production tact time of the parallel subunit group with the largest production tact time is determined as the production tact time of the production device.

[0112] The method for determining the production tact time provided in the embodiments of the present application can not only accurately determine the production tact time of the production subunit, but also effectively determine the production tact time of each parallel subunit group and the production tact time of the production device.

[0113] Based on the above-described content in the embodiments, the present application further provides a device for determining the production tact time, which is applied to the above-described production device. Referring to Figure 6 , Figure 6 FIG. 1 is a schematic diagram of a program module of a device for determining the production tact time provided in the embodiments of the present application. The device for determining the production tact time includes:

[0114] The determining module 601 is configured to determine the target semiconductor components to be processed by each production subunit in the same batch of semiconductor components to be processed.

[0115] The first processing module 602 is configured to determine the original processing time corresponding to each production subunit based on the first interval time between the first end time when each production subunit processes the first target semiconductor component and the second end time when each production subunit processes the last target semiconductor component, and the number of target semiconductor components to be processed by each production subunit.

[0116] The second processing module is configured to determine the production tact of each production subunit according to the original processing time length corresponding to each production subunit and the first interval time length corresponding to each production subunit.

[0117] The determination device for production tact provided in the embodiments of the present application determines the original processing time length of a production subunit for processing one target semiconductor component by using the first interval time length between the first end time when the production subunit finishes processing the first target semiconductor component and the second end time when the production subunit finishes processing the last target semiconductor component and the number of target semiconductor components processed by the production subunit, and then determines the interval time length between the production end times of two batches of semiconductor components based on the original processing time length and the first interval time length. Since the interval time length contains the stop time for starting the production of the next batch of semiconductor components after the production of the last batch of semiconductor components is finished, the production tact of the production subunit determined based on the interval time length has high accuracy.

[0118] In a possible implementation, the first processing module 602 is specifically configured to:

[0119] The original processing time length RPT corresponding to the ith production subunit is calculated in the following manner i :

[0120]

[0121] wherein t1 represents the first end time when the ith production subunit finishes processing the first target semiconductor component, t2 represents the second end time when the ith production subunit finishes processing the last target semiconductor component, and m represents the number of target semiconductor components processed by the ith production subunit.

[0122] In a possible implementation, the second processing module 603 is specifically configured to:

[0123] The production tact Takt Time of the ith production subunit is calculated in the following manner (i) :

[0124] Takt Time (i) = (t2-t1) + RPT i

[0125] wherein t1 represents the first end time when the ith production subunit finishes processing the first target semiconductor component, t2 represents the second end time when the ith production subunit finishes processing the last target semiconductor component, and RPT i represents the original processing time length corresponding to the ith production subunit.

[0126] In an implementation, the apparatus further comprises a third processing module configured to:

[0127] After determining the production tempo of each production subunit, determine the production tempo of each parallel subunit group in the production device according to the production tempo of each production subunit; wherein the parallel subunit group comprises at least one production subunit.

[0128] In an implementation, the third processing module is specifically configured to:

[0129] Calculate the arithmetic mean of the production tempo of each production subunit in each parallel subunit group, and determine the arithmetic mean of the production tempo of each production subunit in each parallel subunit group as the production tempo of each parallel subunit group, respectively.

[0130] In an implementation, the third processing module is further configured to:

[0131] After determining the production tempo of each parallel subunit group in the production device, determine the production tempo of the production device according to the production tempo of the parallel subunit group with the largest production tempo in each parallel subunit group.

[0132] It should be noted that the content specifically performed by the determining module 601, the first processing module 602 and the second processing module 603 in the embodiments of the present application can be referred to the related content in the embodiments shown in Figures 1 to 5 , and will not be described here in detail.

[0133] Based on the content described in the above embodiments, the embodiments of the present application further provide an electronic device, which comprises at least one processor and a memory; wherein the memory stores computer execution instructions; the at least one processor executes the computer execution instructions stored in the memory to realize each step in the production tempo determination method as described in the above embodiments, and the specific implementation can be referred to the description in the above embodiments, and will not be described here in detail.

[0134] In order to better understand the embodiments of the present application, refer to Figure 7 , Figure 7 The hardware structure schematic diagram of an electronic device provided by the embodiments of the present application.

[0135] As Figure 7 shown, the electronic device 70 of the embodiments comprises a processor 701 and a memory 702; wherein:

[0136] The memory 702 is configured to store computer execution instructions;

[0137] The processor 701 is configured to execute the computer-executable instructions stored in the memory to implement the steps in the method for determining the production rhythm described in the above embodiments. Details can be referred to the description in the above embodiments, which will not be repeated here.

[0138] Optionally, the memory 702 can be independent or integrated with the processor 701.

[0139] When the memory 702 is independent, the device further includes a bus 703 for connecting the memory 702 and the processor 701.

[0140] Based on the above description, the present embodiment further provides a computer-readable storage medium, which stores computer-executable instructions. When the processor executes the computer-executable instructions, the steps in the method for determining the production rhythm described in the above embodiments are implemented. Details can be referred to the description in the above embodiments, which will not be repeated here.

[0141] Based on the above description, the present embodiment further provides a computer program product, which includes a computer program. When the processor executes the computer program, the steps in the method for determining the production rhythm described in the above embodiments are implemented. Details can be referred to the description in the above embodiments, which will not be repeated here.

[0142] In several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other manners. For example, the above-described device embodiments are merely illustrative. For example, the division of the modules is merely a logical function division. There can be another division manner for actual implementation. For example, a plurality of modules or features can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the displayed or discussed coupling or direct coupling or communication connection between modules can be indirect coupling or communication connection through some interface, device or module, and can be electrical, mechanical or in other forms.

[0143] The modules illustrated as separate components can or can not be physically separate, and the components illustrated as modules can or can not be physical units, i.e., can be located in one place, or can be distributed on a plurality of network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the present embodiment.

[0144] In addition, each functional module in the various embodiments of the present application can be integrated in one processing unit, or each module can be physically present separately, or two or more modules can be integrated in one unit. The above-mentioned modules can be realized in the form of hardware or in the form of hardware plus software functional modules.

[0145] The integrated modules realized in the form of software functional modules can be stored in a computer readable storage medium. The software functional modules stored in a storage medium include a plurality of instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) or a processor to execute some steps of the method disclosed in the various embodiments of the present application.

[0146] It should be understood that the processor can be a central processing unit (CPU), and can also be other general-purpose processors, digital signal processors (DSP), application specific integrated circuits (ASIC), etc. The general-purpose processor can be a microprocessor or any conventional processor, etc. The steps of the method disclosed in the application can be directly embodied as hardware processor execution, or executed by a combination of hardware and software modules in the processor.

[0147] The memory can include a high-speed RAM memory, and can also include a non-volatile storage NVM, such as at least one disk memory, and can also be a U disk, a mobile hard disk, a read-only memory, a magnetic disk or an optical disk, etc.

[0148] The bus can be an industry standard architecture (ISA) bus, a peripheral component (PCI) bus, or an extended industry standard architecture (EISA) bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc. For the convenience of representation, the bus in the drawings of the present application does not limit to only one bus or one type of bus.

[0149] The aforementioned storage medium can be realized by any type of volatile or nonvolatile storage devices or a combination thereof, such as a static random access memory (SRAM), an electrically erasable programmable read-only memory (EEPROM), an erasable programmable read-only memory (EPROM), a programmable read-only memory (PROM), a read-only memory (ROM), a magnetic storage, a flash memory, a magnetic disk or an optical disk. The storage medium can be any available medium that can be accessed by a general or special purpose computer.

[0150] An exemplary storage medium is coupled to the processor so that the processor can read information from, and write information to, the storage medium. Of course, the storage medium can be a part of the processor. The processor and the storage medium can be located in an application specific integrated circuit (ASIC). The processor and the storage medium can be located in a remote terminal or a server.

[0151] It is understood by those skilled in the art that all or part of the steps of the above-mentioned method embodiments can be completed by program instruction related hardware. The aforementioned program can be stored in a computer readable storage medium. When the program is executed, the steps of the above-mentioned method embodiments are executed; and the aforementioned storage medium includes ROM, RAM, magnetic disk or optical disk and various storage media that can store program codes.

[0152] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the above embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A method for determining production cycle time, characterized in that, Applied to production equipment, said production equipment including at least one production sub-unit, the method includes: Determine the target semiconductor components to be processed for each of the production sub-units in the same batch of semiconductor components to be processed; Based on the first interval between the first end time when each production subunit finishes processing the first target semiconductor component and the second end time when it finishes processing the last target semiconductor component, and the number of target semiconductor components that each production subunit needs to process, the original processing time corresponding to each production subunit is determined. The original processing time RPTi corresponding to the i-th production subunit is calculated as follows: Where t1 represents the first end time when the i-th production sub-unit finishes processing the first target semiconductor component, t2 represents the second end time when the i-th production sub-unit finishes processing the last target semiconductor component, and m represents the number of target semiconductor components that the i-th production sub-unit needs to process. The production cycle time of each production subunit is determined based on the original processing time corresponding to each production subunit and the first interval time corresponding to each production subunit.

2. The method according to claim 1, characterized in that, The step of determining the production cycle time of each production sub-unit based on the original processing time corresponding to each production sub-unit and the first interval time corresponding to each production sub-unit includes: The production takt time (i) of the i-th production subunit is calculated as follows: Takt Time (i)=(t2- t1)+RPTi Where t1 represents the first end time when the i-th production sub-unit finishes processing the first target semiconductor component, t2 represents the second end time when the i-th production sub-unit finishes processing the last target semiconductor component, and RPTi represents the original processing time corresponding to the i-th production sub-unit.

3. The method according to claim 1, characterized in that, After determining the production cycle time of each of the production sub-units, the method further includes: The production cycle time of each parallel subunit group in the production equipment is determined according to the production cycle time of each of the production subunits; wherein, the parallel subunit group includes at least one of the production subunits.

4. The method according to claim 3, characterized in that, The step of determining the production cycle time of each parallel subunit group in the production equipment based on the production cycle time of each of the production subunits includes: Calculate the arithmetic mean of the production cycle time of each production subunit in each parallel subunit group, and determine the arithmetic mean of the production cycle time of each production subunit in each parallel subunit group as the production cycle time of each parallel subunit group.

5. The method according to claim 3, characterized in that, After determining the production cycle time of each parallel sub-unit group in the production equipment, the method further includes: The production cycle time corresponding to the parallel subunit group with the largest production cycle time among the various parallel subunit groups is determined as the production cycle time corresponding to the production equipment.

6. The method according to any one of claims 3 to 5, characterized in that, Different production process formulas are used between different parallel sub-unit groups in the production equipment, while the same production process formula is used between each production sub-unit in the same parallel sub-unit group.

7. A device for determining production cycle time, characterized in that, Applied to production equipment, the production equipment including at least one production sub-unit, the device includes: The determining module is used to determine the target semiconductor components to be processed in each of the production sub-units in the same batch of semiconductor components to be processed; The first processing module is used to determine the original processing time of each production sub-unit based on the first interval between the first end time when each production sub-unit finishes processing the first target semiconductor component and the second end time when it finishes processing the last target semiconductor component, and the number of target semiconductor components that each production sub-unit needs to process. The original processing time RPTi corresponding to the i-th production subunit is calculated as follows: Where t1 represents the first end time when the i-th production sub-unit finishes processing the first target semiconductor component, t2 represents the second end time when the i-th production sub-unit finishes processing the last target semiconductor component, and m represents the number of target semiconductor components that the i-th production sub-unit needs to process. The second processing module is used to determine the production cycle time of each production sub-unit based on the original processing time corresponding to each production sub-unit and the first interval time corresponding to each production sub-unit.

8. The apparatus according to claim 7, characterized in that, The second processing module is specifically used for: The production takt time (i) of the i-th production subunit is calculated as follows: Takt Time (i)=(t2- t1)+RPTi Where t1 represents the first end time when the i-th production sub-unit finishes processing the first target semiconductor component, t2 represents the second end time when the i-th production sub-unit finishes processing the last target semiconductor component, and RPTi represents the original processing time corresponding to the i-th production sub-unit.

9. The apparatus according to claim 7, characterized in that, It also includes a third processing module, used for: After determining the production cycle time of each production sub-unit, the production cycle time of each parallel sub-unit group in the production equipment is determined based on the production cycle time of each production sub-unit; wherein, the parallel sub-unit group includes at least one production sub-unit.

10. The apparatus according to claim 9, characterized in that, The third processing module is specifically used for: Calculate the arithmetic mean of the production cycle time of each production subunit in each parallel subunit group, and determine the arithmetic mean of the production cycle time of each production subunit in each parallel subunit group as the production cycle time of each parallel subunit group.

11. The apparatus according to claim 9, characterized in that, The third processing module is also used for: After determining the production cycle time of each parallel sub-unit group in the production equipment, the production cycle time corresponding to the parallel sub-unit group with the largest production cycle time is determined as the production cycle time corresponding to the production equipment.

12. The apparatus according to any one of claims 7 to 11, characterized in that, Different production process formulas are used between different parallel sub-unit groups in the production equipment, while the same production process formula is used between each production sub-unit in the same parallel sub-unit group.

13. An electronic device, characterized in that, include: At least one processor and memory; The memory stores computer-executed instructions; The at least one processor executes computer execution instructions stored in the memory, causing the at least one processor to perform the method for determining the production cycle as described in any one of claims 1 to 6.

14. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions, which, when executed by a processor, implement the method for determining production cycle time as described in any one of claims 1 to 6.

15. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by the processor, it implements the method for determining the production cycle time as described in any one of claims 1 to 6.

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