Bonded assembly with microdisplay device, display panel, and method of fabrication

Abstract

The application relates to the technical field of micro display devices, in particular to a bonding assembly with a micro display device, a display panel and a manufacturing method, the display panel comprises a first substrate, a plurality of bonding electrode pairs, a plurality of micro display devices and a second substrate, the bonding electrode pair comprises a first bonding electrode and a second bonding electrode, and the first bonding electrode and the second bonding electrode are arranged at intervals on one side of the first substrate; the micro display device comprises a micro display main body, a first electrode and a second electrode, and the first electrode and the second electrode are located on the side of the micro display main body close to the first substrate; wherein the micro display device is arranged in correspondence with the bonding electrode pair, the first electrode is in contact communication with the first bonding electrode, and the second electrode is in contact communication with the second bonding electrode; and the second substrate is used for carrying and fixing the plurality of micro display main bodies. The manufacturing process of the display panel reduces the bonding times, reduces the mutual influence between the micro display devices, improves the bonding yield of the micro display devices, and can improve the yield of the display panel.

Description

Technical Field

[0001] This application relates to the field of microdisplay device technology, and in particular to bonding components having microdisplay devices, display panels, and manufacturing methods. Background Technology

[0002] Micro LED display panels offer advantages such as pure solid-state display, long lifespan, high brightness, and compatibility with flexible substrates, making them a future trend in the display field. Currently, the conventional manufacturing process for Micro LED display panels requires mass transfer of the R, G, and B primary color Micro LEDs, which are then individually transferred and bonded to the driving circuitry. During this transfer process, bonding defects can easily occur, resulting in dark spots and uneven display on the panel. Summary of the Invention

[0003] In view of this, the main technical problem to be solved by this application is to provide a display panel that can improve the yield of the display panel.

[0004] To solve the above-mentioned technical problems, one technical solution adopted in this application is: providing a display panel, including a first substrate, a plurality of bonding electrode pairs, a plurality of microdisplay devices, and a second substrate. The bonding electrode pairs include a first bonding electrode and a second bonding electrode, which are spaced apart on one side of the first substrate. The microdisplay devices include a microdisplay body, a first electrode, and a second electrode, which are located on the side of the microdisplay body closer to the first substrate. The microdisplay devices are correspondingly arranged with the bonding electrode pairs, the first electrode is in contact with the first bonding electrode, and the second electrode is in contact with the second bonding electrode. The second substrate is used to support and fix the plurality of microdisplay bodies.

[0005] The second substrate includes a substrate body, which is disposed on the side of the microdisplay subject away from the first substrate, and the microdisplay subject is attached to one side of the substrate body at intervals.

[0006] The second substrate further includes an insulating layer, which is attached to the side of the substrate body near the first substrate. The insulating layer includes several openings for embedding the micro-display body to fix the micro-display device.

[0007] The second substrate includes an insulating layer, which includes a first insulating layer and a second insulating layer. The first insulating layer has several openings for embedding the micro-display body. The second insulating layer is located on the side of the first insulating layer away from the second substrate and includes several second openings. The first electrode and the second electrode pass through the second openings respectively, and the second insulating layer is used to fix the first electrode and the second electrode.

[0008] The insulating layer includes a color-blocking material to prevent mutual interference between several micro-display devices.

[0009] The first electrode includes a first electrode post and a first extended electrode. One end of the first electrode post is connected to the microdisplay body, and the other end is connected to the first extended electrode. The first extended electrode extends at least along a first direction, which is the direction in which the first electrode is away from the second electrode; and / or,

[0010] The second electrode includes a second pole piece and a second extended electrode. One end of the second pole piece is connected to the microdisplay body, and the other end is connected to the second extended electrode. The second extended electrode extends at least along a second direction, which is the direction in which the second electrode is away from the first electrode.

[0011] The display panel also includes a protective layer, which is disposed on the side of the first electrode and the second electrode away from the second substrate. The protective layer is provided with a plurality of through-hole groups, each of which includes two through holes spaced apart. The through holes face the first electrode and the second electrode, and the through-hole groups are correspondingly disposed with the bonding electrode pairs. The bonding electrode pairs pass through the through-hole groups and contact the first electrode and the second electrode.

[0012] The through-hole faces the first extended electrode and the second extended electrode, and the bonding electrode pair passes through the through-hole group to contact the first extended electrode and the second extended electrode; the distance between the first bonding electrode and the second bonding electrode is greater than the distance between the first pole piece and the second pole piece.

[0013] This application also includes a second technical solution, a bonding assembly with microdisplay devices, including a second substrate and a plurality of microdisplay devices, wherein the microdisplay devices include a microdisplay body, a first electrode and a second electrode; wherein the microdisplay body is attached to one side of the second substrate, and the first electrode and the second electrode are located on the side of the microdisplay body away from the second substrate.

[0014] This application also includes a third technical solution, a method for manufacturing a display panel, comprising: transferring a microdisplay device to one side of a second substrate, wherein the microdisplay device includes a microdisplay body, a first electrode and a second electrode, such that the microdisplay body is fixed to one side of the second substrate, and the first electrode and the second electrode are located on the side of the microdisplay body away from the second substrate.

[0015] The first electrode of the microdisplay device on the second substrate is electrically connected to the first bonding electrode of the bonding electrode pair, and the second electrode is electrically connected to the second bonding electrode of the bonding electrode pair, wherein the first bonding electrode and the second bonding electrode are disposed alternately on the first substrate.

[0016] The beneficial effects of this application are as follows: Unlike the prior art, the display panel provided by this application, by setting a second substrate, enables the second substrate to support and fix the micro-display body. During the manufacturing process of the display panel, the second substrate can support all the micro-display bodies as a whole, and can support micro-display devices of various primary colors. The first electrode and the second electrode of the micro-display devices of various primary colors can be connected to the bonding electrode pair through a single bonding process. This reduces the number of bonding processes during the manufacturing process of the display panel, reduces the mutual influence between micro-display devices, improves the bonding yield of micro-display devices, and improves the yield of the display panel. Attached Figure Description

[0017] Figure 1 This is a cross-sectional structural schematic diagram of the first embodiment of the display panel of this application;

[0018] Figure 2 This is a cross-sectional structural schematic diagram of the second embodiment of the display panel of this application;

[0019] Figure 3 This is a cross-sectional structural schematic diagram of the third embodiment of the display panel of this application;

[0020] Figure 4 This is a cross-sectional structural schematic diagram of the fourth embodiment of the display panel of this application;

[0021] Figure 5 This is a cross-sectional structural schematic diagram of the fifth embodiment of the display panel of this application;

[0022] Figure 6 This is a cross-sectional structural schematic diagram of the sixth embodiment of the display panel of this application;

[0023] Figure 7 This is a schematic diagram of the planar structure of an embodiment of the display panel of this application;

[0024] Figure 8 yes Figure 7 A schematic diagram of the cross-sectional structure;

[0025] Figure 9 This is a cross-sectional structural schematic diagram of the first embodiment of the bonding assembly having a microdisplay device according to this application;

[0026] Figure 10 This is a cross-sectional structural schematic diagram of a second embodiment of the bonding assembly having a microdisplay device according to this application;

[0027] Figures 11a-11i This application displays a schematic cross-sectional view of the manufacturing process of an embodiment of the display panel;

[0028] Figure 12 This is a flowchart illustrating the first embodiment of the display panel manufacturing method of this application;

[0029] Figure 13 This is a flowchart illustrating the second embodiment of the display panel manufacturing method of this application;

[0030] Figure 14 This is a flowchart illustrating the third embodiment of the display panel manufacturing method of this application. Detailed Implementation

[0031] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings.

[0032] In the conventional manufacturing process of display panels, the red, green, and blue micro-display devices need to be transferred three times. The red micro-display device is then bonded to the bonding electrode pair, the green micro-display device to the bonding electrode pair, and the blue micro-display device to the bonding electrode pair, respectively. This bonding process requires heating, which can easily cause oxidation or morphological changes to the bonding electrode pairs. This can lead to poor contact during the second and / or third transfer and bonding of the micro-display devices, resulting in partial non-contact between the first and / or second electrodes of the micro-display device and the bonding electrode pair. Alternatively, during bonding, deformation of the bonding electrode pairs or inaccurate alignment of the micro-display device can cause the micro-display body to tilt, affecting the alignment and bonding of the micro-display devices during the second and third transfers. This results in low yield rates, dark spots in some areas, micro-display device detachment, and uneven display.

[0033] This application provides a display panel; please refer to [link / reference]. Figure 1 The system includes a first substrate 10, a plurality of bonding electrode pairs 20, a plurality of microdisplay devices 30, and a second substrate 40. Each bonding electrode pair 20 includes a first bonding electrode 21 and a second bonding electrode 22, which are spaced apart on one side of the first substrate 10. Each microdisplay device 30 includes a microdisplay body 31, a first electrode 32, and a second electrode 33, which are located on the side of the microdisplay body 31 closer to the first substrate 10. The microdisplay devices 30 are correspondingly arranged with the bonding electrode pairs 20. The first electrode 32 is in contact with the first bonding electrode 21, and the second electrode 33 is in contact with the second bonding electrode 22. The second substrate 40 is used to support and fix the plurality of microdisplay bodies 31.

[0034] In this embodiment, the display panel is provided with a second substrate 40, which can support and fix the micro-display body 31. During the manufacturing process of the display panel, the second substrate 40 can support all the micro-display bodies 31 as a whole, and can support micro-display devices 30 with different primary colors. The first electrode 32 and the second electrode 33 of the micro-display devices 30 with different primary colors can be connected to the bonding electrode pair 20 through a single bonding. This reduces the number of bonding steps during the manufacturing process of the display panel, reduces the mutual influence between the micro-display devices 30, improves the bonding yield of the micro-display devices 30, and improves the yield of the display panel.

[0035] In this embodiment, the first substrate 10 includes a substrate body 11 and a driving circuit layer 12. In this embodiment, the substrate body 11 may be made of glass. In this embodiment, the first substrate 10, by providing the driving circuit layer 12 and connecting it to the first electrode 32 and the second electrode 33 of the microdisplay device 30 via bonding electrode pairs 20, enables the driving circuit of the driving circuit layer 12 to drive the microdisplay device 30 to emit light. In this embodiment, the bonding electrode pairs 20 are disposed on the driving circuit layer 12 and are connected to the driving circuit. In other embodiments, the first substrate 10 may also include only the driving circuit layer 12.

[0036] In one embodiment of this application, the following continues... Figure 1 As shown, the second substrate 40 includes a substrate body 41, which is disposed on the side of the microdisplay subject 31 facing away from the first substrate 10. The microdisplay subjects 31 are spaced apart and attached to one side of the substrate body 41. In this embodiment, the second substrate 40 includes a substrate body 41. By spacedly attaching the microdisplay subjects 31 to the substrate body 41, the substrate body 41 can be used to support the microdisplay subjects 31. During the manufacturing process of the display panel, the second substrate 40 can achieve contact communication between the microdisplay subjects 31 of various primary colors and the bonding electrode pairs 20 through a single bonding. In this embodiment, the substrate body 41 is a heat sink with good heat dissipation performance, allowing convection to form between the second substrate 40 and the first substrate 10. The heat generated by the microdisplay device 30 can be dissipated through the first substrate 10 and the second substrate 40, improving the heat dissipation effect of the display panel.

[0037] In one embodiment of this application, as Figure 2As shown, the substrate body 41 can be provided with multiple grooves (not shown), and the grooves correspond to the positions and sizes of the micro-display body 31, so that the micro-display body 31 is fitted and locked in the grooves, so as to fix the micro-display body 31 to the substrate body 41. In another embodiment of this application, an adhesive layer (not shown) can be provided between the micro-display body 31 and the substrate body 41, and the micro-display device 30 is fixed to one side of the substrate body 41 by the adhesive layer; in this embodiment of the application, the adhesive layer can be a high-temperature resistant adhesive layer. The embodiments of this application do not limit the fixing method of the substrate body 41 and the micro-display body 31. In this embodiment of the application, the material of the substrate body 41 can be transparent glass.

[0038] Another embodiment of this application, such as Figure 3 As shown, the second substrate 40 includes a substrate body 41 and an insulating layer 42. The insulating layer 42 is attached to the substrate body 41 near the first substrate 10. The insulating layer 42 includes several openings (not shown) for embedding the micro-display body 31 to fix the micro-display device 30. In this embodiment, by providing the insulating layer 42 with several openings, the micro-display body 31 of the micro-display device 30 can be embedded in the openings, so that the openings can achieve the purpose of fixing and limiting the micro-display device 30, facilitating the arrangement and alignment of the micro-display device 30, and facilitating the fixation of the micro-display device 30. In this embodiment, the insulating layer 42 can also prevent short circuits between the micro-display devices 30. The insulating layer 42 in this embodiment is a high-temperature resistant insulating layer, such as a high-molecular organic material.

[0039] In one embodiment of this application, the insulating layer 42 includes a color-blocking material to prevent mutual interference between the plurality of microdisplay devices 30, prevent color cross-contamination between microdisplay devices 30 with different primary colors, and increase contrast. In one embodiment of this application, the insulating layer 42 may be a black matrix; in other embodiments, the insulating layer 42 may be other insulating materials with added color-blocking material.

[0040] In another embodiment of this application, such as Figure 4As shown, the second substrate 40 includes an insulating layer 42 with several openings for embedding the microdisplay body 31 to fix the microdisplay device 30. In this embodiment, the second substrate 40 only includes the insulating layer 42. In this embodiment, during the manufacturing process of the display panel, after the second substrate 40 drives the microdisplay device 30 to bond with the bonding electrode pair 20, the display panel is formed by removing the substrate body 41, so that the second substrate 40 only includes the insulating layer 42; alternatively, during the manufacturing process of the display panel, the second substrate 40 only includes the insulating layer 42. The insulating layer 42 is made of a material with a certain degree of hardness and can be used to support and fix the microdisplay device 30. Furthermore, the insulating layer 42 in this embodiment can also be provided with a color-blocking material to prevent mutual interference between the multiple microdisplay devices 30.

[0041] In one embodiment of this application, the following continues... Figure 4 As shown, the insulating layer 42 includes a first insulating layer 421 and a second insulating layer 422; the first insulating layer 421 is provided with a plurality of first openings 423 (see...). Figure 11a The first opening 423 is used to embed the microdisplay body 31; the second insulating layer 422 is located on the side of the first insulating layer 421 away from the second substrate 40, and the second insulating layer 422 includes a plurality of second openings (not shown in the figure). The first electrode 32 and the second electrode 33 respectively pass through the second openings, and the second insulating layer 422 is used to fix the first electrode 32 and the second electrode 33. In this embodiment of the application, by setting the first insulating layer 421, it can be used to fix the microdisplay body 31, prevent short circuits between the microdisplay bodies 31, and by setting the first opening 423, it can assist in the alignment of the microdisplay body 31 with the bonding electrode pair 20, improving the alignment effect. By providing a second insulating layer 422, the first electrode 32 and the second electrode 33 can be fixed, achieving a better fixing effect and preventing the first electrode 32 and / or the second electrode 33 from tilting during bonding of the microdisplay device 30. Simultaneously, it achieves the effect of encapsulating the microdisplay device 30. Furthermore, the second insulating layer 422 can avoid or reduce metallic reflections from the first electrode 32 and the second electrode 33 within the display panel, improving the display effect. In this embodiment, the first electrode 32 and the second electrode 33 are exposed on the side of the second insulating layer 422 facing away from the first insulating layer 421, without affecting the contact and communication between the first electrode 32 and the second electrode 33 and the bonding electrode pair 20.

[0042] In the embodiments of this application, such as Figure 4 , Figure 5 and Figure 6As shown, the first electrode 32 includes a first electrode post 321 and a first extended electrode 322. One end of the first electrode post 321 is connected to the microdisplay body 31, and the other end is connected to the first extended electrode 322. The first extended electrode 322 extends at least along a first direction D1, which is the direction in which the first electrode 32 is away from the second electrode 33. The second electrode 33 includes a second electrode post 331 and a second extended electrode 332. One end of the second electrode post 331 is connected to the microdisplay body 31, and the other end is connected to the second extended electrode 332. The second extended electrode 332 extends at least along a second direction D2, which is the direction in which the second electrode 33 is away from the first electrode 32.

[0043] In this embodiment, the first direction D1 is the direction in which the first electrode 32 is away from the second electrode 33, and the first direction D1 is parallel to the second substrate 40; the second direction D2 is the direction in which the second electrode 33 is away from the first electrode 32, and the second direction D2 is parallel to the second substrate 40.

[0044] In this embodiment, the first extended electrode 322 is horizontally disposed and extends along the first direction D1; in other embodiments, the first extended electrode 322 may also have a certain component in the horizontal direction, and the angle between the first extended electrode 322 and the horizontal plane is an acute angle. The second extended electrode 332 is horizontally disposed and extends along the second direction D2; in other embodiments, the second extended electrode 332 may also have a certain component in the horizontal direction, and the angle between the second extended electrode 332 and the horizontal plane is an acute angle.

[0045] In this embodiment, the first electrode 32 is provided with a first extended electrode 322, which allows the first extended electrode 322 to extend toward the first direction D1. The distance between the first extended electrode 322 and the second electrode 33 is greater than the distance between the first pole piece 321 and the second pole piece 331. Consequently, the distance between the first bonding electrode 21 and the second bonding electrode 22 is also greater than the distance between the first pole piece 321 and the second pole piece 331. This means that the distance between the first bonding electrode 21 and the second bonding electrode 22 is not constrained by the distance between the first pole piece 321 and the second pole piece 331. In this embodiment, the increased distance between the first bonding electrode 21 and the second bonding electrode 22 reduces the risk of short circuits when the first electrode 32, the second electrode 33, and the bonding electrode pair 20 are bonded. At the same time, the increased distance between the first bonding electrode 21 and the second bonding electrode 22 increases the volume of the heat dissipation channel when the microdisplay body 31 dissipates heat through the first substrate 10, thereby improving the heat dissipation effect of the display panel. Furthermore, the shape of the first extended electrode 322 is not limited by the columnar shape of the first electrode post 321; the shape of the first extended electrode 322 can be planar, and the area of ​​the first extended electrode 322 can be increased, making it easier to align the first bonding electrode 21 with the first extended electrode 322. On the other hand, in this embodiment, by providing the first extended electrode 322, the area of ​​the first electrode 32 is increased, the resistance of the first electrode 32 is reduced, and the first extended electrode 322 can carry the VSS signal or VDD signal of the driving circuit, thereby reducing the voltage drop of the VSS signal or VDD signal.

[0046] In this embodiment, the second electrode 33 is provided with a second extended electrode 332, which allows the second extended electrode 332 to extend toward the second direction D2; the distance between the second extended electrode 332 and the first electrode 32 is greater than the distance between the first electrode post 321 and the second electrode post 331. In this embodiment, the effect of providing the second extended electrode 332 to the second electrode 33 is similar to that of providing the first extended electrode 322 to the first electrode 32, and will not be elaborated further here.

[0047] In this embodiment, the first electrode 32 is provided with a first extended electrode 322, and the second electrode 33 is also provided with a second extended electrode 332, so that the distance between the first bonding electrode 21 and the second bonding electrode 22 can be greater, and the above-mentioned effect is more obvious. In other embodiments, the first electrode 32 may be provided with a first pole post 321 and a first extended electrode 322, and the second electrode 33 may only be provided with a second pole post 331, and the end face of the second pole post 331 away from the microdisplay body 31 is on the same horizontal plane as the surface where the first extended electrode 322 is located. Alternatively, the second electrode 33 may be provided with a second pole post 331 and a second extended electrode 332, and the first electrode 32 may only be provided with a first pole post 321, and the end face of the first pole post 321 away from the microdisplay body 31 is on the same horizontal plane as the surface where the second extended electrode 332 is located.

[0048] In one embodiment of this application, the following continues... Figure 4 and Figure 5 As shown, the display panel includes a protective layer 50, which is disposed on the side of the first electrode 32 and the second electrode 33 facing away from the second substrate 40. The protective layer 50 has multiple through-hole groups (not shown in the figure), and each through-hole group includes two spaced through holes 51 (see figure). Figure 11g The through-hole 51 is directly opposite the first electrode 32 and the second electrode 33, and the through-hole group is correspondingly arranged with the bonding electrode pair 20. The bonding electrode pair 20 passes through the through-hole group and contacts the first electrode 32 and the second electrode. In this embodiment, by providing a protective layer 50, the first electrode 32 and the second electrode 33 can be protected from scratches, thereby improving the stability of the first electrode 32 and the second electrode 33. In this embodiment, by providing a protective layer 50 and providing through-holes 51 on the protective layer 50, the bonding electrode pair 20 only needs to pass through the through-hole group to achieve alignment with the first electrode 32 and the second electrode 33. This makes the alignment of the bonding electrode pair 20 with the first electrode 32 and the second electrode 33 easier and reduces the likelihood of tilting of the microdisplay body 31 caused by misalignment of the first electrode 32, the second electrode 33 and the bonding electrode pair 20. In this embodiment, by providing a protective layer 50, the bonding electrode pair 20 passes through the through-hole group of the protective layer 50. This enhances the bonding force between the bonding electrode pair 20 and the first electrode 32 and second electrode 33 during the bonding process, resulting in adhesion or adsorption between the protective layer 50 and the bonding electrode pair 20. This improves the bonding stability between the microdisplay device 30 and the bonding electrode pair 20, thereby enhancing the stability of the display panel. Furthermore, by providing the protective layer 50, direct connection between adjacent first electrodes 32 and second electrodes 33 can be prevented, avoiding or reducing the risk of short circuits.

[0049] In this embodiment, the protective layer 50 can be made of organic materials or inorganic materials such as silicon nitride.

[0050] The embodiments of this application continue as follows: Figure 4 and Figure 5 As shown, the through-hole 51 faces the first extended electrode 322 and the second extended electrode 332. The bonding electrode pair 20 passes through the through-hole group and contacts the first extended electrode 322 and the second extended electrode 332. The distance between the first bonding electrode 21 and the second bonding electrode 22 is greater than the distance between the first electrode post 321 and the second electrode post 331. In this embodiment, the through-hole 51 faces the first extended electrode 322 and the second extended electrode 332, resulting in a larger distance between the first bonding electrode 21 and the second bonding electrode 22. In other embodiments, some through-holes 51 may correspond to the first electrode post 321, or / and some through-holes 51 may correspond to the second electrode post 331, so that the first bonding electrode 21 is in contact with the first electrode post 321, or / and the second bonding electrode 22 is in contact with the second electrode post 331.

[0051] In this embodiment, the cross-section of the through-hole 51 is trapezoidal, and the cross-sections of the first bonding electrode 21 and the second bonding electrode 22 are also trapezoidal. In this embodiment, the cross-section of the through-hole 51 in the direction perpendicular to the second substrate 40 is trapezoidal, and the cross-sections of the first bonding electrode 21 and the second bonding electrode 22 in the direction perpendicular to the first substrate 10 are also trapezoidal. This results in a larger interaction force between the bonding electrode pair 20 and the through-hole group when the first bonding electrode 21 and the second bonding electrode 22 are inserted into the through-hole 51. This can improve the adhesion or adsorption force between the bonding electrode pair 20 and the protective layer 50, making the bonding of the display panel more secure and improving the stability of the display panel.

[0052] In one embodiment of this application, as Figure 7 and Figure 8As shown, the display panel includes a display area 81 and a non-display area 82, with the non-display area 82 surrounding the display area 81. In this embodiment, a portion of the protective layer 50 is disposed in the non-display area 82 and located between the substrate body 41 and the first substrate 10. The protective layer 50 located in the non-display area 82 can serve as a sealing layer 70 for the display panel, directly encapsulating the first substrate 10 and the second substrate 40 of the display panel, thereby protecting the micro-display device 30 and providing it with water and oxygen barrier effects. In this embodiment, the partial protective layer 50 serves as a sealing layer 70, eliminating the need for additional encapsulation processes during the manufacturing of the display panel, thus reducing the encapsulation effect. In this embodiment, the protective layer 50 serving as a sealing layer 70 provides a better encapsulation effect. In other embodiments, the sealing layer 70 can also be the protective layer 50, with a portion of the extended electrode, bonding electrode pair 20, and insulating layer 42 disposed on the protective layer 50 together constituting the sealing layer 70, which can also achieve a good sealing effect, reducing the number of encapsulation layers and encapsulation steps required for the display panel.

[0053] This application also includes a second technical solution, such as Figure 9 As shown, a bonding assembly with microdisplay devices 30 includes a second substrate 40 and a plurality of microdisplay devices 30. Each microdisplay device 30 includes a microdisplay body 31, a first electrode 32, and a second electrode 33. The microdisplay body 31 is attached to one side of the second substrate 40, and the first electrode 32 and the second electrode 33 are located on the side of the microdisplay body 31 facing away from the second substrate 40. In this embodiment, the bonding assembly of the microdisplay devices 30 attaches the microdisplay body 31 to the second substrate 40, thereby reducing the number of bonding operations during the transfer and bonding process of the microdisplay devices 30. The second substrate 40 can simultaneously hold three primary color microdisplay devices 30, allowing the bonding assembly to perform only one bonding operation during the transfer and bonding process of the microdisplay devices 30, thus reducing the number of bonding operations.

[0054] In one embodiment of this application, the bonding assembly of the microdisplay device 30 includes a second substrate 40 comprising a substrate body 41, with microdisplay bodies 31 spaced and attached to one side of the substrate body 41. In another embodiment, the substrate body 41 may have multiple grooves, the grooves corresponding in position and size to the microdisplay bodies 31, allowing the microdisplay bodies 31 to be fitted and secured within the grooves, thus securing the microdisplay bodies 31 to the substrate body 41. In another embodiment, an adhesive layer may be provided between the microdisplay bodies 31 and the substrate body 41, fixing the microdisplay device 30 to one side of the substrate body 41 through the adhesive layer; in this embodiment, the adhesive layer may be a high-temperature resistant adhesive layer. This application does not limit the method of fixing the substrate body 41 and the microdisplay bodies 31. In this embodiment, the substrate body 41 may be made of transparent glass.

[0055] Another embodiment of this application, such as Figure 10 As shown, the second substrate 40 includes a substrate body 41 and an insulating layer 42. The insulating layer 42 is attached to one side of the substrate body 41 and includes several openings for embedding the micro-display body 31 to fix the micro-display device 30.

[0056] In one embodiment of this application, the insulating layer 42 includes a color-blocking material to prevent mutual interference between the plurality of microdisplay devices 30, prevent color cross-contamination between microdisplay devices 30 with different primary colors, and increase contrast. In one embodiment of this application, the insulating layer 42 may be a black matrix; in other embodiments, the insulating layer 42 may be other insulating materials with added color-blocking material.

[0057] In another embodiment of this application, the second substrate 40 includes an insulating layer 42, which has a plurality of openings for embedding the microdisplay body 31 to fix the microdisplay device 30. In this embodiment, the insulating layer 42 of the second substrate 40 is fabricated and assembled in the same way as the above-described technical solutions, and its function is the same, so it will not be described again here.

[0058] In one embodiment of this application, the insulating layer 42 includes a first insulating layer 421 and a second insulating layer 422; the first insulating layer 421 is provided with a plurality of first openings 423, the first openings 423 being used to embed the micro-display body 31; the second insulating layer 422 is located on the side of the first insulating layer 421 away from the second substrate 40, the second insulating layer 422 includes a plurality of second openings, the first electrode 32 and the second electrode 33 respectively pass through the second openings, and the second insulating layer 422 is used to fix the first electrode 32 and the second electrode 33.

[0059] In this embodiment, the first electrode 32 includes a first electrode post 321 and a first extended electrode 322. One end of the first electrode post 321 is connected to the microdisplay body 31, and the other end is connected to the first extended electrode 322. The first extended electrode 322 extends at least along a first direction D1, which is the direction in which the first electrode 32 is away from the second electrode 33. The second electrode 33 includes a second electrode post 331 and a second extended electrode 332. One end of the second electrode post 331 is connected to the microdisplay body 31, and the other end is connected to the second extended electrode 332. The second extended electrode 332 extends at least along a second direction D2, which is the direction in which the second electrode 33 is away from the first electrode 32.

[0060] In this embodiment, the first direction D1 is the direction in which the first electrode 32 is away from the second electrode 33, and the first direction D1 is parallel to the second substrate 40; the second direction D2 is the direction in which the second electrode 33 is away from the first electrode 32, and the second direction D2 is parallel to the second substrate 40, and the directions of the first direction D1 and the second direction D2 are opposite.

[0061] In this embodiment, the first extended electrode 322 is horizontally disposed and extends along the first direction D1; in other embodiments, the first extended electrode 322 may also have a certain component in the horizontal direction, and the angle between the first extended electrode 322 and the horizontal plane is an acute angle. The second extended electrode 332 is horizontally disposed and extends along the second direction D2; in other embodiments, the second extended electrode 332 may also have a certain component in the horizontal direction, and the angle between the second extended electrode 332 and the horizontal plane is an acute angle.

[0062] In one embodiment of this application, the bonding assembly further includes a protective layer 50. The protective layer 50 is disposed on the side of the first electrode 32 and the second electrode 33 facing away from the second substrate 40. The protective layer 50 has at least two through holes 51, which are directly opposite the first electrode 32 and the second electrode 33. In this embodiment, by providing the protective layer 50, the bonding assembly plays the same role as the above-described technical solution when applied to a display panel, and will not be described further here.

[0063] This application also includes a third technical solution, such as Figure 12 As shown, a method for manufacturing a display panel includes:

[0064] S110: As Figure 11b , Figure 11c and Figure 11d As shown, the microdisplay device 30 is transferred to one side of the second substrate 40. The microdisplay device 30 includes a microdisplay body 31, a first electrode 32, and a second electrode 33, such that the microdisplay body 31 is fixed to one side of the second substrate 40, and the first electrode 32 and the second electrode 33 are located on the side of the microdisplay body 31 opposite to the second substrate 40.

[0065] In this embodiment of the application, by transferring the microdisplay device 30 to one side of the second substrate 40, for example, in this embodiment of the application, the microdisplay device 30 includes RGB three-primary-color microdisplay devices 30, and the red microdisplay device 34, green microdisplay device 35 and blue microdisplay device 36 can be transferred to one side of the second substrate 40 respectively through three transfers.

[0066] S120: As Figure 11h and Figure 11i As shown, the first electrode 32 of the microdisplay device 30 on the second substrate 40 is electrically connected to the first bonding electrode 21 of the bonding electrode pair 20, and the second electrode 33 is electrically connected to the second bonding electrode 22 of the bonding electrode pair 20, wherein the first bonding electrode 21 and the second bonding electrode 22 are disposed on the first substrate 10 at intervals.

[0067] In this embodiment, bonding electrode pairs 20 are spaced apart on the first substrate 10. By moving the second substrate 40, and consequently moving the microdisplay device 30, the first electrode 32 and the second electrode 33 of the microdisplay device 30 are aligned with the first bonding electrode 21 and the second bonding electrode 22 on the first substrate 10. Through a single bonding operation, the microdisplay device 30 can be bonded to the bonding electrode pairs 20. This reduces the number of bonding operations, thereby improving the yield rate of the display panel during manufacturing.

[0068] Specifically, in one embodiment of this application, the method for manufacturing the display panel is as follows: Figure 13 As shown, it includes:

[0069] S210: As Figure 11a As shown, a first insulating layer 421 is formed on the substrate body 41, and the first insulating layer 421 is patterned to form a plurality of first openings 423.

[0070] In this embodiment, the first insulating layer 421 includes a color resist material. In this embodiment, the material of the first insulating layer 421 is black matrix. In other embodiments, the material of the first insulating layer 421 may also be other materials, and the first insulating layer 421 may not have a color resist material.

[0071] In this embodiment, the substrate body 41 is made of a heat dissipation material, such as glass.

[0072] S220: As Figure 11b , 11c As shown in Figure 11d, a plurality of microdisplay devices 30 are transferred into the first opening 423, and the microdisplay body 31 is embedded in the first opening 423.

[0073] Specifically, in this embodiment, the microdisplay device 30 includes red, green, and blue primary color microdisplay devices 30. First, a plurality of red microdisplay devices 34 are transferred to a portion of the first opening 423; then, green microdisplay devices 35 are transferred to another portion of the first opening 423; subsequently, blue microdisplay devices 36 are transferred to the remaining portion of the first opening 423. This achieves the transfer of the microdisplay device 30 to the first opening 423. In this embodiment, the transfer order of the red, green, and blue microdisplay devices 34, 35, and 36 is not specifically limited. In this embodiment, by transferring the red, green, and blue primary color microdisplay devices 30 to the first opening 423, the transfer of the red, green, and blue primary color microdisplay devices 30 to the second substrate 40 results in high flatness of the light-emitting surface, good light emission consistency, and a better working state of the microdisplay device 30.

[0074] In the embodiments of this application, such as Figure 11e As shown, the microdisplay device 30 includes a microdisplay body 31 and a first electrode 32 and a second electrode 33 disposed on one side of the microdisplay body 31. The first electrode 32 includes a first terminal 321, and the second electrode 33 includes a second terminal 331. The first terminal 321 and the second terminal 331 are exposed outside the first insulating layer 421.

[0075] In this embodiment, the height of the first opening 423 is equal to the thickness of the micro-display body 31, and the shape and size of the first opening 423 correspond to the micro-display body 31, so that the micro-display body 31 can be precisely positioned within the first opening 423. This allows the micro-display body 31 to directly contact the substrate body 41, enabling the micro-display body 31 to dissipate heat through the substrate body 41, thereby improving the heat dissipation effect of the display panel.

[0076] S230: As Figure 11e As shown, a second insulating layer 422 is formed on the side of the first insulating layer 421 that is opposite to the second substrate 40, such that the second insulating layer 422 is located on the first insulating layer 421.

[0077] In this embodiment, the second insulating layer 422 may also include a color resist material. In this embodiment, the material of the second insulating layer 422 is also black matrix. In other embodiments, the material of the second insulating layer 422 may also be other materials, and the second insulating layer 422 may not be provided with a color resist material.

[0078] In this embodiment, the second insulating layer 422 forms a second opening, through which the first pole post 321 and the second pole post 331 pass, and the ends of the first pole post 321 and the second pole post 331 that are away from the second substrate 40 are exposed outside the second insulating layer 422.

[0079] S240: As Figure 11f As shown, a first extended electrode 322 and a second extended electrode 332 are formed on the surface of the second insulating layer 422 away from the second substrate 40, such that the first extended electrode 322 is in contact with and connected to the first pole post 321, and the second extended electrode 332 is in contact with and connected to the second pole post 331. The first extended electrode 322 is disposed at least along the first direction D1, and the second extended electrode 332 is disposed at least along the second direction D2. The first direction D1 is opposite to the second direction D2.

[0080] In this embodiment, the materials of the first extended electrode 322 and the second extended electrode 332 are the same as those of the first electrode post 321 and the second electrode post 331, for example, both are metal.

[0081] In this embodiment, the first direction D1 is the direction in which the first electrode 32 is away from the second electrode 33, and the first direction D1 is parallel to the second substrate 40; the second direction D2 is the direction in which the second electrode 33 is away from the first electrode 32, and the second direction D2 is parallel to the second substrate 40.

[0082] In this embodiment, the first extended electrode 322 is horizontally disposed and extends along the first direction D1; in other embodiments, the first extended electrode 322 may also have a certain component in the horizontal direction, and the angle between the first extended electrode 322 and the horizontal plane is an acute angle. The second extended electrode 332 is horizontally disposed and extends along the second direction D2; in other embodiments, the second extended electrode 332 may also have a certain component in the horizontal direction, and the angle between the second extended electrode 332 and the horizontal plane is an acute angle.

[0083] In this embodiment, the plurality of first extended electrodes 322 and the plurality of second extended electrodes 332 are not in direct contact with each other. In this embodiment, the first extended electrodes 322 and the second extended electrodes 332 are shielded by a mask and fabricated by depositing metal.

[0084] S250: such as Figure 11g As shown, a protective layer 50 is formed on the side of the second insulating layer 422 facing away from the second substrate 40, and a plurality of through-hole groups are formed on the protective layer 50. Each through-hole group includes two through holes spaced apart, such that one through-hole 51 of the through-hole group is directly connected to the first electrode 32 and the other through-hole 51 is directly connected to the second electrode 33.

[0085] In this embodiment, the through-hole group is spaced apart on the protective layer 50, such that the through-holes 51 in this embodiment are spaced apart on the protective layer 50. In this embodiment, one through-hole 51 of the through-hole group faces the first extended electrode 322, and the other through-hole 51 faces the second extended electrode 332, such that the distance between the two through-holes 51 in the through-hole group is greater than the distance between the first electrode post 321 and the second electrode post 331.

[0086] S260: As Figure 11h and Figure 11i As shown, the through-hole group of the second substrate 40 is aligned with the bonding electrode pair 30, so that the first electrode 32 is electrically connected to the first bonding electrode 21 and the second electrode 33 is electrically connected to the second bonding electrode 22. The bonding electrode pair 20 is disposed on the first substrate 10, and the bonding electrode pair 20 includes the first bonding electrode 21 and the second bonding electrode 22 disposed at intervals.

[0087] In this embodiment, bonding electrode pairs 20 are spaced apart on the first substrate 10, and the bonding electrode pairs 20 correspond to the microdisplay device 30. In this embodiment, the first substrate 10 includes a substrate body 11 and a driving circuit layer 12. In this embodiment, the substrate body 11 can be made of glass. In this embodiment, the first substrate 10, by providing the driving circuit layer 12 and connecting with the first electrode 32 and the second circuit of the microdisplay device 30 through the bonding electrode pairs 20, enables the driving circuit of the driving circuit layer 12 to drive the microdisplay device 30 to emit light. The display panel structure fabricated in this embodiment is as follows: Figure 5 As shown.

[0088] In this embodiment, steps S210-S250 are used to fabricate the bonding components of the microdisplay device 30. Alternatively, steps S230, S220 and S230, S240, or S260 may be omitted. In other embodiments, such as... Figure 14 As shown, S270 can also be included after S260: removing the substrate body 41. In another embodiment, the substrate body 11 of the further first substrate 10 can also be removed.

[0089] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A display panel, characterized in that, include: First substrate, A plurality of bonding electrode pairs, wherein the bonding electrode pairs include a first bonding electrode and a second bonding electrode, the first bonding electrode and the second bonding electrode being disposed at a distance from one side of the first substrate; A plurality of microdisplay devices, each microdisplay device comprising a microdisplay body, a first electrode, and a second electrode, wherein the first electrode and the second electrode are located on the side of the microdisplay body closer to the first substrate; wherein the microdisplay device and the bonding electrode are correspondingly disposed, the first electrode is in contact with the first bonding electrode, and the second electrode is in contact with the second bonding electrode. The second substrate is used to support and fix a plurality of the micro-display subjects; The second substrate includes an insulating layer, which includes a first insulating layer and a second insulating layer. The first insulating layer has a plurality of first openings for embedding the microdisplay body. The second insulating layer is located on the side of the first insulating layer facing the first substrate and includes a plurality of second openings. The first electrode and the second electrode pass through the second openings respectively, and the second insulating layer is used to fix the first electrode and the second electrode. The display panel further includes a protective layer disposed on the side of the first electrode and the second electrode away from the second substrate. The protective layer is provided with a plurality of through-hole groups, each through-hole group including two through holes spaced apart. The through holes are directly opposite the first electrode and the second electrode, and the through-hole groups are correspondingly disposed with the bonding electrode pairs. The bonding electrode pairs pass through the through-hole groups and contact the first electrode and the second electrode.

2. The display panel according to claim 1, characterized in that, The second substrate further includes: A substrate body is disposed on the side of the first insulating layer away from the second insulating layer.

3. The display panel according to claim 1, characterized in that, The insulating layer includes a color-blocking material to prevent mutual interference between the plurality of microdisplay devices.

4. The display panel according to claim 1, characterized in that, The first electrode includes a first electrode post and a first extended electrode. One end of the first electrode post is connected to the microdisplay body, and the other end is connected to the first extended electrode. The extended electrode extends at least along a first direction, which is the direction in which the first electrode is away from the second electrode; and / or, The second electrode includes a second post and a second extended electrode. One end of the second post is connected to the microdisplay body, and the other end is connected to the second extended electrode. The extended electrode extends at least along a second direction, which is the direction in which the second electrode is away from the first electrode.

5. The display panel according to claim 4, characterized in that, The through-hole faces the first extended electrode and the second extended electrode, and the bonding electrode pair passes through the through-hole group and contacts the first extended electrode and the second extended electrode; The distance between the first bonding electrode and the second bonding electrode is greater than the distance between the first electrode post and the second electrode post.

6. A bonding assembly with a microdisplay device, characterized in that, include: Second substrate, Several microdisplay devices, each microdisplay device comprising a microdisplay body, a first electrode, and a second electrode; The microdisplay body is attached to one side of the second substrate, and the first electrode and the second electrode are located on the side of the microdisplay body away from the second substrate. The second substrate includes an insulating layer, which includes a first insulating layer and a second insulating layer; the first insulating layer is provided with a plurality of first openings, which are used to embed the microdisplay body; The second insulating layer is located on the side of the first insulating layer away from the second substrate. The second insulating layer includes a plurality of second openings, through which the first electrode and the second electrode pass. The second insulating layer is used to fix the first electrode and the second electrode. The bonding assembly further includes a protective layer disposed on the side of the first electrode and the second electrode away from the second substrate. The protective layer is provided with a plurality of via groups, each via group including two vias spaced apart, the vias being directly opposite the first electrode and the second electrode.

7. A method for manufacturing a display panel, characterized in that, include: The microdisplay device is transferred to one side of the second substrate, wherein the microdisplay device includes a microdisplay body, a first electrode and a second electrode, such that the microdisplay body is fixed to one side of the second substrate, and the first electrode and the second electrode are located on the side of the microdisplay body opposite to the second substrate. The first electrode of the microdisplay device on the second substrate is electrically connected to the first bonding electrode of the bonding electrode pair, and the second electrode is electrically connected to the second bonding electrode of the bonding electrode pair, wherein the first bonding electrode and the second bonding electrode are disposed on the first substrate at a distance. ； The second substrate includes an insulating layer, which includes a first insulating layer and a second insulating layer. The first insulating layer has a plurality of first openings for embedding the microdisplay body. The second insulating layer is located on the side of the first insulating layer facing the first substrate and includes a plurality of second openings. The first electrode and the second electrode pass through the second openings respectively, and the second insulating layer is used to fix the first electrode and the second electrode. The method further includes: forming a protective layer on the side of the second insulating layer opposite to the first insulating layer, and forming a plurality of through-hole groups on the protective layer, wherein the through-hole group includes two through holes spaced apart, such that one of the through holes in the through-hole group is directly connected to the first electrode and the other through hole is directly connected to the second electrode.

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