A new type of optical lamp beads and lamp board manufacturing process

Abstract

The present invention provides a manufacturing process for a novel optical lamp bead, comprising the following steps: step S1, opening multiple groups of isolation grooves on a metal sheet to form a sheet having multiple groups of electrode groups, each electrode group having at least two electrodes, and each two electrodes being separated by an isolation groove; step S2, electroplating the surface of the sheet to improve the performance of the electrode group; step S3, bonding a chip to each group of electrodes with a die-bonding adhesive to conduct the electrodes of the sheet; step S4, using a transparent plastic material to wrap a single electrode group by injection molding to form an encapsulation colloid, and forming an optical surface on the outer surface of the encapsulation colloid by designing the injection mold; step S5, disassembling multiple groups of single lamp beads on the sheet by cutting. The advantages of the novel optical lamp bead are: a wider light output range; the shape and energy distribution of the light output can be adjusted completely according to the actual needs of the customer; saving raw materials and manufacturing costs; and solving the problem of poor consistency of light efficiency across the entire sheet.

Description

Technical Field

[0001] The present invention relates to the technical field of LED lamp bead packaging, and in particular to a manufacturing process of a novel optical lamp bead and a lamp board. Background Art

[0002] Currently, when manufacturing common LED lamp beads, a plastic raw material is first used to form an LED bracket on a hardware material. The LED bracket is provided with a cup-shaped mouth inside. After the die is solidified in the cup-shaped mouth, another plastic raw material is used to glue the chip, thus forming the LED lamp bead. However, the LED lamp beads produced by the current manufacturing process have the following disadvantages: 1. The light-emitting angle of the chip is limited by the cup-shaped mouth of the LED bracket, resulting in a small light-emitting range; 2. The current design of the LED bracket cup-shaped mouth has reached its limit, making it difficult to increase the brightness of the lamp bead; 3. The manufacturing process is complicated and wastes a lot of manpower and material resources; 4. Two or more plastic raw materials are required, resulting in serious consumables. In view of the above disadvantages of the existing manufacturing process, it is necessary to develop a new optical lamp bead manufacturing process to solve the above problems. Summary of the Invention

[0003] The purpose of the present invention is to provide a novel optical lamp bead and a manufacturing process of a lamp board to solve the problems mentioned in the background technology.

[0004] In order to achieve the above object, the present invention provides the following technical solutions:

[0005] A new type of optical lamp bead manufacturing process includes the following steps:

[0006] Step S1: multiple sets of isolation grooves are formed on a metal sheet to produce a sheet having multiple electrode groups, each electrode group having at least two electrodes, and each two electrodes are separated by an isolation groove;

[0007] Step S2: electroplating the surface of the sheet to improve the performance of the electrode assembly;

[0008] Step S3: bonding the chip to each set of electrodes with a die-bonding adhesive to conduct the electrodes of the sheet;

[0009] Step S4: using a transparent plastic material to wrap a single electrode group by injection molding to form an encapsulating colloid, and forming an optical surface layer on the outer surface of the encapsulating colloid by designing the injection mold;

[0010] Step S5: disassemble multiple groups of single lamp beads from the sheet by cutting.

[0011] Further description of the present invention: In step S1, a metal sheet is made into a blank by punching, etching or cutting.

[0012] Further description of the present invention: In step S1, glue-catching holes are provided on the electrode.

[0013] Further description of the present invention: In step S2, the electroplating is gold plating or silver plating.

[0014] Further description of the present invention: In step S3, the chip is directly connected to the electrode using a flip chip; or a face-up chip is used and connected to the electrode through a wire.

[0015] Further description of the present invention: In step S3, the chip adopts a monochromatic light chip or a CSP packaged chip.

[0016] Further description of the present invention: In step S4, phosphor is added to the transparent plastic material to match the color of the chip to achieve different optical effects.

[0017] Further description of the present invention: In step S4, a plastic connection point is provided between the two sets of encapsulating colloids;

[0018] In step S5, the plastic connection between the encapsulating colloid is cut open by punching or cutting, and then the connection between the electrode and the sheet is cut off to disassemble multiple groups of single lamp beads.

[0019] Further description of the present invention: In step S5, after a single lamp bead is powered on, the chip forms a rectangular light spot or a circular light spot through the optical surface on the packaging colloid.

[0020] A novel light board manufacturing process, including a novel optical light bead manufacturing process, is characterized in that it further includes the following steps:

[0021] Step S6: Spectroscopically screen the single lamp beads to obtain a whole batch of single lamp beads with consistent lighting effects;

[0022] Step S7: affix the entire batch of single lamp beads to the FPC light strip or substrate to form a light board.

[0023] The beneficial effects of the present invention are:

[0024] 1. The chip emits light through the outer surface of the entire packaging colloid, and the light output range is wider;

[0025] 2. Through mold design, different optical surfaces can be formed on the outer surface of the encapsulated colloid according to actual needs, making the light output shape and light output energy distribution controllable;

[0026] 3. After die bonding, the chip is directly wrapped with a single plastic material to simplify the process;

[0027] 4. Only a single type of plastic material is needed for wrapping during the production process, which can save plastic raw materials and reduce costs;

[0028] 5. Disassembling into single lamp beads makes it easier to sort them, so as to make a lamp board with consistent lighting effects, and it is also easy to repair the single lamp beads on the lamp board. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the manufacturing process of the present invention;

[0030] Figure 2 This is a schematic diagram of the structure of an optical lamp bead in the prior art;

[0031] Figure 3 Schematic diagram of the partial structure of the material sheet in step S1 of the present invention;

[0032] Figure 4 Schematic diagram of the partial structure of the material sheet and the chip in step S3 of the present invention (chip flip-chip);

[0033] Figure 5 Schematic diagram of the partial structure of the blank and chip in step S3 of the present invention (chip upright);

[0034] Figure 6 Schematic diagram of the partial structure of the sheet and chip in step S3 of the present invention (multiple groups of electrodes and chips are provided);

[0035] Figure 7 This is a schematic diagram of the local structure of the tablet, chip and packaging colloid in step S4 of the present invention. Figure 1 ;

[0036] Figure 8 This is a schematic diagram of the local structure of the tablet, chip and packaging colloid in step S4 of the present invention. Figure 2 ;

[0037] Figure 9 yes Figure 8 Structural views of a single lamp bead (front view, right view, rear view and bottom view);

[0038] Figure 10 This is the structural three-view diagram of a single lamp bead in the present invention (the light output shape is a rectangular spot);

[0039] Figure 11 This is the structural three-view diagram of a single lamp bead in the present invention (the light output shape is a circular spot situation 1);

[0040] Figure 12 This is the structural three-view diagram of a single lamp bead in the present invention (the light output shape is a circular spot situation 2);

[0041] Figure 13 This is the structural three-view diagram of a single lamp bead in the present invention (the light output shape is a circular spot situation three);

[0042] Description of reference numerals:

[0043] 1. Sheet; 2. Isolation groove; 3. Chip; 4. Wire; 5. Packaging colloid; 6. Bracket colloid; 7. Electrode; 8. Glue grabbing hole; 9. Optical surface; 10. Single lamp bead. DETAILED DESCRIPTION

[0044] The present invention will be further described below with reference to the accompanying drawings:

[0045] like Figure 1 As shown, the present invention relates to a novel process for manufacturing optical lamp beads, comprising the following steps:

[0046] Step S1: multiple groups of isolation grooves 2 are formed on a metal sheet to produce a sheet 1 having multiple electrode groups, each electrode group having at least two electrodes 7, and each two electrodes 7 are separated by an isolation groove 2;

[0047] Step S2: electroplating the surface of the sheet 1 to improve the performance of the electrode assembly;

[0048] Step S3: bonding the chip 3 to each set of electrodes 7 with a die-bonding adhesive, and conducting the electrodes 7 of the sheet 1;

[0049] Step S4: using a transparent plastic material to wrap a single electrode group by injection molding to form an encapsulating colloid 5, and forming an optical surface 9 on the outer surface of the encapsulating colloid 5 by designing the injection mold;

[0050] Step S5: disassemble multiple groups of single lamp beads 10 from the sheet 1 by cutting.

[0051] After the single lamp bead 10 is manufactured, the single lamp bead 10 can be further manufactured into a lamp board, which includes the following steps:

[0052] Step S6: Spectroscopically screening the single lamp beads 10 to obtain a whole batch of single lamp beads 10 with consistent light effects;

[0053] Step S7: affix the entire batch of single lamp beads 10 to an FPC light strip or substrate to form a light board.

[0054] like Figure 2 As shown in the figure: When making optical lamp beads in the prior art, a plastic material is used to form a bracket colloid 6 on a sheet 1, that is, an LED bracket is made. After the crystal is fixed (wires are welded) on the LED bracket, another plastic material is used to form an encapsulation colloid 5 in the bracket colloid 6, thereby making a lamp bead. Its defects are: 1. The light-emitting angle is limited by the cup mouth; 2. The bracket cup mouth design has reached its limit and the brightness is difficult to improve; 3. The process is complicated and a lot of manpower and material resources are wasted; 4. Two or more plastic raw materials are required.

[0055] In the prior art, when manufacturing a light board, multiple chips 3 are fixed on a substrate with electrodes 7, and then a packaging colloid 5 is injected to form the light board. The drawbacks of this technology are: 1. Because the chips 3 are fixed on the substrate in advance, the injection molding flow channel design is complex and long when molding the packaging colloid 5, resulting in a lot of plastic waste; 2. The light pattern of the lamp beads on the same light board is inconsistent, and the light efficiency uniformity of the entire light board is poor;

[0056] The new type of lamp beads designed and produced by this invention have a wider light output range; the shape and energy distribution of the light output can be adjusted completely according to the actual needs of the customer; it saves raw materials and manufacturing costs; and when made into light panels, it can solve the problem of poor consistency in lighting efficiency across the entire panel.

[0057] like Figure 3 As shown, in step S1, multiple groups of isolation grooves 2 are opened on the metal sheet to form a sheet 1 with multiple groups of electrode groups, each group of electrode groups has at least two electrodes 7, and each two electrodes 7 are separated by an isolation groove 2; according to different usage requirements, more than two electrodes 7 can be set for each electrode group, and multiple chips 3 are solidified at the same time, and each chip 3 is connected to two groups of electrodes 7 respectively, so as to form different light effects; the electrodes 7 are arranged tightly on the sheet 1, which can reduce the amount of runner plastic used in the subsequent injection molding process and save costs.

[0058] The metal sheet can be made into the material sheet 1 by punching, etching, cutting or the like.

[0059] The electrode 7 is provided with a glue-catching hole 8, so that the connection between the electrode 7 and the encapsulating colloid 5 is more stable and firm.

[0060] Step S2: Electroplating is performed on the surface of the material sheet 1 to improve the performance of the electrode group. The electroplating can be performed by gold plating or silver plating. Gold plating improves the reliability of the electrode group; silver plating is cheap and saves costs.

[0061] like Figures 4 to 5 As shown, step S3, the chip 3 is bonded to each set of electrodes 7 with a die-bonding adhesive, and the electrodes 7 of the material sheet 1 are connected; the chip 3 can be as follows Figure 4 Use flip chip 3 to connect directly to electrode 7; or Figure 5 As shown, a front-mounted chip 3 is used, which is connected to an electrode 7 via a wire 4 .

[0062] like Figure 6 As shown, the number of electrodes 7 and the number of chips 3 can be multiple, such as four groups of electrodes 7 and three groups of chips 3, and each group of chips 3 is connected to two groups of electrodes 7.

[0063] The chip 3 can be a monochromatic light chip 3 or a CSP packaged chip 3, which can be selected according to different usage requirements.

[0064] like Figures 7 to 12As shown, in step S4, a transparent plastic material is used to wrap a single electrode group by injection molding to form an encapsulation colloid 5, and an optical surface 9 is formed on the outer surface of the encapsulation colloid 5 by designing the injection mold; phosphor can be added to the transparent plastic material to match the color of the chip 3 to achieve different optical effects.

[0065] Step S5: disassemble multiple groups of single lamp beads 10 from the sheet 1 by cutting.

[0066] like Figure 7 As shown, when the encapsulating colloid 5 is injection molded, a plastic connection portion can be provided between two groups of encapsulating colloids 5. The plastic connection portion between the encapsulating colloids 5 is first cut open by punching or cutting, and then the connection portion between the electrode 7 and the sheet 1 is cut off to disassemble multiple groups of single lamp beads 10.

[0067] like Figures 8 to 9 As shown, when the encapsulation colloid 5 is injection molded, each group of encapsulation colloids 5 can correspond to a separate glue inlet. When disassembling into a single lamp bead 10, the connection between the electrode 7 and the sheet 1 can be directly cut off. This solution can make the LED bracket arrangement more compact and save more metal and plastic materials.

[0068] like Figures 10 to 13 As shown, after a single lamp bead 10 is powered on, the chip 3 forms a rectangular light spot or a circular light spot through the optical surface 9 on the packaging colloid 5. By designing the mold, optical surfaces 9 of different shapes can be produced to control the shape and energy distribution of the light spot.

[0069] like Figure 10 The single lamp bead 10 forms a rectangular light spot;

[0070] like Figure 11 , using a reflective optical surface 9, so that a single lamp bead 10 forms a circular light spot, and the circular light spot expands as the distance increases;

[0071] like Figure 12 , using a refractive optical surface 9, so that a single lamp bead 10 forms a circular light spot, and the circular light spot expands as the distance increases;

[0072] like Figure 13 The single lamp bead 10 in the image forms a circular light spot, which shrinks as the distance increases.

[0073] Step S6: Spectroscopically screening the single lamp beads 10 to obtain a whole batch of single lamp beads 10 with consistent light effects;

[0074] Step S7: affix the entire batch of single lamp beads 10 to an FPC light strip or substrate to form a light board.

[0075] By disassembling the lamp beads into individual pieces, batches of lamp beads with consistent optical effects can be sorted out, which optimizes the consistency of subsequent molding. In addition, the lamp board is easy to repair during subsequent use. If a single lamp bead 10 is abnormal in the future, a specific light effect product can be selected for replacement separately.

[0076] The above does not limit the technical scope of the present invention. Any modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A new type of optical lamp bead manufacturing process, characterized in that, The following steps are involved: Step S1: multiple sets of isolation grooves are formed on a metal sheet to produce a sheet having multiple electrode groups, each electrode group having at least two electrodes, and each two electrodes are separated by an isolation groove; Step S2: electroplating the surface of the sheet to improve the performance of the electrode assembly; Step S3: bonding the chip to each set of electrodes with a die-bonding adhesive to conduct the electrodes of the sheet; Step S4: using a transparent plastic material to wrap a single electrode group by injection molding to form an encapsulating colloid, and forming an optical surface layer on the outer surface of the encapsulating colloid by designing the injection mold; Step S5: disassembling multiple groups of single lamp beads from the sheet by cutting; In step S1, a glue-grabbing hole is provided on the electrode; In step S4, there is a plastic connection between the two groups of packaging colloids; in step S5, the plastic connection between the packaging colloids is first cut open by punching or cutting, and then the connection between the electrode and the sheet is cut off to disassemble multiple groups of single lamp beads.

2. The manufacturing process of a novel optical lamp bead according to claim 1, characterized in that: In step S1 , a metal sheet is made into a blank by punching, etching or cutting.

3. The manufacturing process of a novel optical lamp bead according to claim 1, characterized in that: In step S2 , gold plating or silver plating is used for electroplating.

4. The manufacturing process of a novel optical lamp bead according to claim 1, characterized in that: In step S3, the chip is directly connected to the electrode using a flip chip; or is connected to the electrode through a wire using a face-up chip.

5. The manufacturing process of a novel optical lamp bead according to claim 1, characterized in that: In step S3, the chip adopts a monochromatic light chip or a CSP packaged chip.

6. The manufacturing process of a novel optical lamp bead according to claim 1, characterized in that: In step S4, phosphor is added to the transparent plastic material to match the color of the chip to achieve different optical effects.

7. The manufacturing process of a novel optical lamp bead according to claim 1, characterized in that: In step S5, after the single lamp bead is powered on, the chip forms a rectangular light spot or a circular light spot through the optical surface on the packaging colloid.

8. A novel light board manufacturing process, comprising the novel optical light bead manufacturing process according to any one of claims 1 to 7, characterized in that: The following steps are also included: Step S6: Spectroscopically screen the single lamp beads to obtain a whole batch of single lamp beads with consistent lighting effects; Step S7: affix the entire batch of single lamp beads to the FPC light strip or substrate to form a light board.

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