Image acquisition device

Abstract

The present application discloses a multi-faceted image acquisition device. Based on the present application, the image acquisition device has a mobile carrying mechanism and at least two microscopic imaging components deployed in different orientations, wherein, by controlling the motion adjustment mechanism to adjust the position of the mobile carrying mechanism to match the size specifications of the hexahedral package, at least two packaging planes of the hexahedral package placed on the mobile carrying mechanism can be automatically positioned to the target depth of field distance of the microscopic imaging component in the corresponding orientation, so that the local surface features in the at least two packaging planes of the hexahedral package are imaged at the target depth of field distance of the microscopic imaging component in the corresponding orientation. Furthermore, automatic image acquisition can be achieved to ensure image clarity for the local surface features of any packaging plane of the hexahedral package.

Description

Technical Field

[0001] The present application relates to industrial detection technology and image acquisition technology, and in particular to an image acquisition device. Background Art

[0002] When soft products such as cigarettes leave the factory, they usually come with a hexahedral hard package such as a packaging box. In addition to protecting soft products and facilitating stacking and arrangement, the hexahedral hard package can also have local surface features such as trademarks that identify the product and local surface features such as watermarks that have anti-counterfeiting effects arranged on any packaging plane.

[0003] For soft products sold on the market, it is possible to identify whether they are original products of a designated manufacturer by identifying the local surface features of the packaging plane of the hard package. The identification of the local surface features of the packaging plane can be achieved by image processing, that is, first using an imaging device to collect a feature image of the local surface features of the packaging plane, and then using an electronic device with image processing function to perform feature recognition on the collected feature image.

[0004] However, unlike the online image acquisition used for outer contour detection of hard packages in the manufacturer's assembly line, image acquisition of local surface features belongs to offline microscopic visual imaging with a smaller object distance. Therefore, the image acquisition device used for outer contour detection of hard packages in the manufacturer's assembly line is not suitable for image acquisition of local surface features.

[0005] Therefore, in the prior art, the image acquisition of the local surface features of the packaging plane cannot be carried out with the aid of the image acquisition device used for the outer contour detection of the hard package in the manufacturer's assembly line, but can only be carried out manually, so that the efficiency of the image acquisition of the local surface features is low and the clarity of the acquired image cannot be guaranteed to meet the expected level, which in turn leads to low recognition efficiency and accuracy of the local surface features of the packaging plane. Summary of the invention

[0006] In view of this, the present application provides an image acquisition device that can realize automatic image acquisition of local surface features of any packaging plane of a hexahedral package, so as to help improve the recognition efficiency and accuracy of the local surface features of the packaging plane.

[0007] The image acquisition device provided in the embodiments of the present application may include:

[0008] Global visual agency;

[0009] A mobile carrying mechanism for supporting the hexahedral package;

[0010] A motion adjustment mechanism, used for adjusting the position of the mobile bearing mechanism;

[0011] A microscopic vision mechanism, comprising at least two microscopic imaging components respectively disposed at different positions, wherein the microscopic imaging components are used to collect local surface features in a packaging plane of the hexahedral package;

[0012] The data processing module is used for: when the hexahedral package is placed on the mobile carrying mechanism in a selected posture:

[0013] Based on the image data obtained by photographing the packaging plane of the top surface of the hexahedral package by the global vision mechanism, an entire surface image of the packaging plane of the top surface of the hexahedral package is acquired;

[0014] Based on the entire surface image, determining a horizontal span size of the hexahedral package in a first horizontal direction and a second horizontal direction, wherein the second horizontal direction intersects the first horizontal direction;

[0015] Determining the size specification of the hexahedral package based on the horizontal span size of the hexahedral package in the first horizontal direction and the second horizontal direction;

[0016] Controlling the motion adjustment mechanism to adjust the position of the mobile bearing mechanism to match the size specifications of the hexahedral package; and

[0017] The microscopic vision mechanism is controlled to perform shooting in response to the position adjustment, so that: local surface features in at least two packaging planes of the hexahedral package are imaged at the target depth of field distance of the microscopic imaging component in the corresponding orientation.

[0018] In some examples, optionally, at least two of the microscopic imaging components include a first microscopic imaging component, and the field of view depth direction of the first microscopic imaging component is along the first horizontal direction toward the moving area of ​​the mobile supporting mechanism; the side edge of the mobile supporting mechanism close to the first microscopic imaging component in the first horizontal direction is configured as a first reference edge; the position adjustment includes: based on the position information of a pre-calibrated first reference position, controlling the motion adjustment mechanism to adjust the position of the mobile supporting mechanism; wherein, when the mobile supporting mechanism is adjusted to the first reference position, the first reference edge is located at the first target depth of field distance of the first microscopic imaging component; and, the hexahedral package placed on the mobile supporting mechanism is positioned so that the package plane facing the first microscopic imaging component is abutted against the first reference edge of the mobile supporting mechanism.

[0019] In some examples, optionally, the movable supporting mechanism has a first positioning protrusion at the first reference edge; wherein, when the packaging plane of the hexahedral package toward the first microscopic imaging component abuts against the first positioning protrusion, the packaging plane of the hexahedral package toward the first microscopic imaging component is positioned to abut against the first reference edge.

[0020] In some examples, optionally, the other side edge of the mobile carrying mechanism in the first horizontal direction opposite to the first reference edge is used to implement a placement operation of placing the hexahedral package on the mobile carrying mechanism; wherein, in response to the thrust along the first horizontal direction generated by the placement operation, the packaging plane of the hexahedral package toward the first microscopic imaging component abuts against the first positioning protrusion.

[0021] In some examples, optionally, at least two of the microscopic imaging components also include a second microscopic imaging component, and the field of view depth direction of the second microscopic imaging component is along the second horizontal direction toward the moving area of ​​the mobile supporting mechanism; the side edge of the mobile supporting mechanism close to the second microscopic imaging component in the second horizontal direction is configured as a second reference edge; the position adjustment also includes: based on the position information of a pre-calibrated second reference position, controlling the motion adjustment mechanism to adjust the position of the mobile supporting mechanism; wherein, when the mobile supporting mechanism is in the second reference position, the second reference edge is located at the second target depth of field distance of the second microscopic imaging component; and, the hexahedral package placed on the mobile supporting mechanism is positioned so that: the package plane facing the second microscopic imaging component is against the second reference edge of the mobile supporting mechanism.

[0022] In some examples, optionally, at least two of the microscopic imaging components also include a third microscopic imaging component, wherein the depth of field direction of the third microscopic imaging component is along the second horizontal direction toward the moving area of ​​the mobile supporting mechanism, and the depth of field direction of the third microscopic imaging component is relative to the depth of field direction of the second microscopic imaging component; the position adjustment also includes: based on the position information of the second reference position and the horizontal span size of the hexahedron package in the second horizontal direction, controlling the motion adjustment mechanism to adjust the position of the mobile supporting mechanism; wherein, when the mobile supporting mechanism is adjusted to a horizontally offset position relative to the second reference position in the second horizontal direction, the distance difference between the second reference edge in the second horizontal direction and the third target depth of field distance of the third microscopic imaging component is equal to the horizontal span size of the hexahedron package in the second horizontal direction.

[0023] In some examples, optionally, the movable supporting mechanism has an avoidance recess on a side opposite to the second reference edge in the second horizontal direction.

[0024] In some examples, optionally, the movable supporting mechanism has a second positioning protrusion at the second reference edge; wherein, when the packaging plane of the hexahedral package facing the second microscopic imaging component abuts against the second positioning protrusion, the packaging plane of the hexahedral package facing the second microscopic imaging component is positioned in the second horizontal direction to be against the second reference edge.

[0025] In some examples, optionally, the image acquisition device further includes: a flexible correction mechanism; the data processing module is further used to: in response to the completion of the placement of the hexahedral package on the mobile supporting mechanism, control the motion adjustment mechanism to adjust the position of the mobile supporting mechanism based on the position information of the flexible correction mechanism, so that the mobile supporting mechanism is abutted against the flexible correction mechanism in the second horizontal direction, so that the packaging plane of the hexahedral package facing away from the second positioning protrusion in the second horizontal direction contacts the flexible correction mechanism; in response to the pressure deformation of the flexible correction mechanism caused by the hexahedral package abutting against the second positioning protrusion, control the motion adjustment mechanism to stop the mobile supporting mechanism from continuing to abut against the flexible correction mechanism.

[0026] In some examples, optionally, the flexible correction mechanism includes: a mounting strip, which extends along the first horizontal direction; a touch pressure strip, which is parallel to the mounting strip and is spaced apart from the mounting strip in the second horizontal direction; a floating support assembly, which is connected between the mounting strip and the touch pressure strip; wherein, when the movable supporting mechanism is abutted against the flexible correction mechanism in the second horizontal direction, the packaging plane of the hexahedral package facing away from the second positioning protrusion in the second horizontal direction contacts the touch pressure strip; and, when the hexahedral package is abutted against the second positioning protrusion, the touch pressure strip is pushed close to the mounting strip, so that the deformation sensing assembly generates an output signal for characterizing the pressure deformation to the data processing module in response to a decrease in the distance between the touch pressure strip and the mounting strip.

[0027] In some examples, optionally, the floating support assembly includes: a floating guide shaft, the floating guide shaft is passed through the mounting strip and connected to the touch-pressure strip; a baffle, the baffle is fixedly mounted on a side of the mounting strip facing away from the touch-pressure strip, and the baffle forms an elastic support for the floating guide shaft through an elastic element.

[0028] In some examples, optionally, the flexible correction mechanism further includes a deformation sensing component, and the deformation sensing component is configured to: generate an output signal to the data processing module for characterizing pressure deformation of the flexible correction mechanism in response to a decrease in the distance between the contact strip and the mounting strip in the second horizontal direction.

[0029] In some examples, optionally, the data processing module is further used to: select the first reference position and / or the second reference position from a preset reference position set based on a size specification of the hexahedral package.

[0030] In some examples, optionally, at least two of the microscopic imaging components include a fourth microscopic imaging component, and the field of view depth direction of the fourth microscopic imaging component is deployed downward along the vertical direction; the image acquisition device further includes: a laser ranging mechanism, used to generate a laser ranging signal in the same direction as the field of view depth direction of the fourth microscopic imaging component; the data processing module is further used to: determine the height distance in the vertical direction between the packaging plane at the top of the hexahedral package and the fourth microscopic imaging component based on the ranging result obtained by the laser ranging mechanism using the laser ranging signal; with the goal of causing the height distance to be equal to the fourth target depth of field distance of the fourth microscopic imaging component, control the motion adjustment mechanism to adjust the position of the mobile supporting mechanism.

[0031] In some examples, optionally, the motion adjustment mechanism includes a vertical motion component, which includes: a base, the base having translational freedom in a first horizontal direction and a second horizontal direction intersecting the first horizontal direction; a top plate, the top plate being used to support the mobile supporting mechanism; a screw motor, the screw motor being located above the base and forming a longitudinal support for the top plate; wherein, under the control of the data processing module, the screw motor causes the top plate to rise and fall along the vertical direction to adjust the position of the mobile supporting mechanism in the vertical direction.

[0032] In some examples, optionally, the vertical motion assembly further includes: a lower side enclosure, which is installed above the base and surrounds the screw motor; an upper side enclosure, which is installed below the top plate and surrounds the screw motor; wherein the upper end of the lower side enclosure and the lower end of the upper side enclosure are fitted inside and outside, and the lower end of the upper side enclosure slides and cooperates with the upper end of the lower side enclosure in response to the lifting and lowering of the top plate along the vertical direction.

[0033] In some examples, optionally, the data processing module is further used to: present the entire surface image on a display device that is communicatively connected to the image acquisition device; determine a selected position of the mobile supporting mechanism in the first horizontal direction and the second horizontal direction in response to a human-computer interaction instruction received during the presentation of the entire surface image, wherein the human-computer interaction instruction is used to characterize a target area selected for capturing local surface features in a packaging plane of the top surface of the hexahedral package, and the selected position characterizes the regional position of the target area; and control the motion adjustment mechanism to adjust the position of the mobile supporting mechanism so that the position of the mobile supporting mechanism in the first horizontal direction and the second horizontal direction matches the selected position.

[0034] In some examples, optionally, the image acquisition device further includes: a support frame; a support rod, the support rod is fixedly mounted on the top of the support frame along the vertical direction; a suspension mounting block, the suspension mounting block is fixedly mounted on the top of the support rod; a positioning rod, the positioning rod is connected between the suspension mounting block and the support frame; a bottom light-transmitting plate, the bottom light-transmitting plate is fixedly mounted on the bottom end of the support rod; wherein the global vision mechanism is mounted between the suspension mounting block and the bottom light-transmitting plate with a field of view facing downward.

[0035] In some examples, optionally, the image acquisition device further includes: a spectral acquisition component, the acquisition field of view of the spectral acquisition component is deployed downward along the vertical direction; the data processing module is further used to: obtain spectral information obtained by the spectral acquisition component from collecting the packaging plane of the top surface of the hexahedral package.

[0036] Based on the above embodiments, the image acquisition device can be suitable for offline acquisition of local surface features, and has a mobile supporting mechanism for hexahedral package, and at least two microscopic imaging components deployed in different orientations, wherein the position of the mobile supporting mechanism can be adjusted by a motion adjustment mechanism. Therefore, by controlling the motion adjustment mechanism to adjust the position of the mobile supporting mechanism to match the size specifications of the hexahedral package, at least two packaging planes of the hexahedral package placed on the mobile supporting mechanism can be automatically positioned to the target depth of field distance of the microscopic imaging component in the corresponding orientation, so that the local surface features in the at least two packaging planes of the hexahedral package can be imaged at the target depth of field distance of the microscopic imaging component in the corresponding orientation. Furthermore, automatic image acquisition can be achieved to ensure image clarity for the local surface features of any packaging plane of the hexahedral package, so as to help improve the recognition efficiency and accuracy of the local surface features of the packaging plane. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The following drawings are only used to illustrate and explain the present application, and do not limit the scope of the present application:

[0038] Figure 1 This is a schematic diagram of the assembly structure of an image acquisition device in one embodiment of the present application;

[0039] Figure 2 For Figure 1 A schematic diagram of the exploded structure of the image acquisition device in the illustrated embodiment;

[0040] Figure 3 For Figure 1 A schematic diagram of a preferred structure of a motion adjustment mechanism of the image acquisition device in the illustrated embodiment;

[0041] Figure 4 For Figure 3 A schematic diagram of the assembly structure of the vertical motion component in the motion adjustment mechanism shown;

[0042] Figure 5 For Figure 3 The schematic diagram of the exploded structure of the vertical motion component in the motion adjustment mechanism shown;

[0043] Figure 6 For Figure 1 A schematic diagram of a preferred structure of a microscopic imaging component of the image acquisition device in the illustrated embodiment;

[0044] Figure 7 For Figure 1 A schematic diagram of a single imaging process of the image acquisition device in the illustrated embodiment;

[0045] Figure 8a and Figure 8b For Figure 1 A schematic diagram of a six-sided imaging process of the image acquisition device in the illustrated embodiment;

[0046] Fig. 9 For Figure 1 A schematic diagram of a preferred structure of a mobile supporting mechanism of the image acquisition device in the illustrated embodiment;

[0047] Fig.10a and Fig.10b For Fig. 9 The schematic diagram of the use state of the mobile carrying mechanism shown;

[0048] Fig.11 For adapting to Fig. 9 A schematic diagram of a preferred structure of a flexible correction mechanism of a mobile bearing mechanism shown;

[0049] Fig.12a and Figure 12b For Fig.11The correction principle of the flexible correction mechanism of the flexible correction mechanism shown;

[0050] Fig.13 For Fig. 9 A schematic diagram of the interference avoidance principle of the mobile supporting mechanism shown;

[0051] Fig.14 For Figure 1 A schematic diagram of the adjustment principle of the image acquisition device based on the laser distance measurement mechanism in the illustrated embodiment;

[0052] Fig.15 For Figure 1 A schematic diagram of a preferred structure of a global vision mechanism of the image acquisition device in the illustrated embodiment.

[0053] Reference numerals:

[0054] 10 Mobile bearing mechanism

[0055] 110 first positioning protrusion

[0056] 120 second positioning protrusion

[0057] 130 Avoidance notch

[0058] 20Sports adjustment mechanism

[0059] 210 first horizontal motion assembly

[0060] 211 first screw

[0061] 212 First Motor

[0062] 213 First Rail

[0063] 215 coupling

[0064] 220 Second horizontal motion assembly

[0065] 221 second screw

[0066] 222 Second Motor

[0067] 223 Second rail

[0068] 225 movable pallet

[0069] 230 vertical motion components

[0070] 231 Base

[0071] 2310 lower side panel

[0072] 232 screw motor

[0073] 2321 motor screw

[0074] 2322Balance Components

[0075] 233 Mounting Plate

[0076] 2330 support shaft

[0077] 235 Top Plate

[0078] 2350 Upper side panel

[0079] 236 lifting guide shaft

[0080] 2361 first linear bearing 2362 synchronous connecting rod

[0081] 237 Photoelectric Detection Components

[0082] 2371 Vertical Bracket

[0083] 2372 Position sensing element 238 Movement sensing piece

[0084] 239 wiring trough

[0085] 260 Cable Protector

[0086] 261 First Drag Chain

[0087] 262 Second drag chain 30 microscopic visual mechanism

[0088] 300 Microscopic Imaging Components

[0089] 300a Micro Industrial Camera

[0090] 300b Telecentric Lens

[0091] 300c reflector set

[0092] 300d light source bracket

[0093] 300e shadowless light source

[0094] 310 First Microscopic Imaging Component

[0095] 320 Second Microscopic Imaging Component

[0096] 330 Third Microscopic Imaging Component

[0097] 340 Fourth Microscopic Imaging Component

[0098] 350 Spectrum Collection Components

[0099] 40 data processing module 51 flexible correction mechanism

[0100] 510 mounting block

[0101] 511 Installation Strip

[0102] 512 Touch Strip Board

[0103] 513 floating support assembly

[0104] 5131 Second linear bearing

[0105] 5132 floating guide shaft

[0106] 5133 Blocking piece

[0107] 515 deformation sensing component

[0108] 5151 offset sensing element

[0109] 5152 offset sensor

[0110] 52 Laser ranging mechanism

[0111] 60 Global Vision Agency

[0112] 610 Global Industrial Camera

[0113] 620 global lens

[0114] 630 dust cover

[0115] 80 device base

[0116] 810 first support mechanism

[0117] 820 Second support mechanism

[0118] 830 Third support mechanism

[0119] 840 first suspension mechanism

[0120] 850 Second Suspension Mechanism

[0121] 851 support frame

[0122] 852 support rod

[0123] 8521 first fixing ring

[0124] 8522 second fixing ring

[0125] 8523 third fixing ring

[0126] 853 positioning rod

[0127] 855 suspension mounting block

[0128] 856 bottom light-transmitting plate

[0129] 857 Plane Light Source DETAILED DESCRIPTION

[0130] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings and examples.

[0131] Figure 1 It is a schematic diagram of the assembly structure of an image acquisition device in one embodiment of the present application. Figure 2 For Figure 1 The schematic diagram of the exploded structure of the image acquisition device in the embodiment shown. Figure 1 and Figure 2 In an embodiment of the present application, the image acquisition device may include a mobile supporting mechanism 10, a motion adjustment mechanism 20, a microscopic vision mechanism 30 and a data processing module 40.

[0132] The mobile carrying mechanism 10 is used to hold the hexahedral package. For example, the mobile carrying mechanism 10 may include a component such as a tray, a fixture, etc. having a flat carrying top surface, and the flat carrying top surface of the mobile carrying mechanism 10 is parallel to a horizontal plane defined by a first horizontal direction X and a second horizontal direction Y that intersect (e.g., are perpendicular to each other), so that the bottom packaging plane of the hexahedral package facing downward can contact the flat carrying top surface of the mobile carrying mechanism 10, so that one pair of opposite side peripheral packaging planes of the four side peripheral packaging planes of the hexahedral package object is perpendicular to the first horizontal direction X, and another pair of opposite side peripheral packaging planes is perpendicular to the second horizontal direction Y, and the top packaging plane of the hexahedral package object is perpendicular to the vertical direction Z.

[0133] In the embodiment of the present application, the hexahedral package may be any object having six planes. For example, the "package" in the hexahedral package may refer to the outer packaging of the object, or may also refer to the integrated outer layer of the object. Regardless of whether the hexahedral package refers to an object with an outer packaging or an object with an integrated outer layer, the size of the hexahedral package that can be placed on the mobile carrying mechanism 10 may not be limited to a single size, that is, the mobile carrying mechanism 10 is allowed to carry hexahedral packages of different sizes within a predetermined size range.

[0134] For example, in the case where the soft product inside the hexahedral package is a cigarette, the mobile carrying mechanism 10 may be allowed to carry two hexahedral packages of cigarette carton specifications or cigarette pack specifications, and the aforementioned predetermined size specification range may include: a cigarette carton size specification range of 180-290 mm in length, 85-130 mm in width, and 10-65 mm in height (or thickness), and a cigarette pack size specification range of 50-120 mm in length, 55 mm-90 mm in width, and 10-65 mm in height (or thickness). In addition, in the case where the soft product inside the hexahedral package is a cigarette, the specified position of the hexahedral package in the mobile carrying mechanism 10 may refer to the length direction along the first horizontal direction X, the width direction along the second horizontal direction Y, and the height (or thickness) direction along the vertical direction Z.

[0135] The motion adjustment mechanism 20 is used to adjust the position of the mobile carrying mechanism 10. For example, the mobile carrying mechanism 10 may be supported on the top of the motion adjustment mechanism 20, that is, the motion adjustment mechanism 20 may support the mobile carrying mechanism 10 below the mobile carrying mechanism 10, and the motion adjustment mechanism 20 may have a degree of freedom of motion in a first horizontal direction X and a second horizontal direction Y that are perpendicular to each other, and in a vertical direction Z that is perpendicular to both the first horizontal direction X and the second horizontal direction Y, so as to support the three-axis adjustment of the position of the mobile carrying mechanism 10 in the first horizontal direction X, the second horizontal direction Y, and the vertical direction Z.

[0136] Figure 3 For Figure 1 The preferred structural diagram of the motion adjustment mechanism of the image acquisition device in the embodiment shown is shown in FIG. Figure 3 If the motion adjustment mechanism 20 is configured to have a three-axis adjustment function, the motion adjustment mechanism may include a first horizontal motion component 210, a second horizontal motion component 220 and a vertical motion component 230, wherein the first horizontal motion component 210 and the second horizontal motion component 220 are stacked along the vertical direction Z, the first horizontal motion component 210 and the second horizontal motion component 220 are movably connected, and one of the first horizontal motion component 210 and the second horizontal motion component 220 located below the stack can be installed on the device base 80, and the other located above the stack is movably connected to the vertical motion component 230.

[0137] By movably connecting the first horizontal motion assembly 210, the second horizontal motion assembly 220 and the vertical motion assembly 230, the first horizontal motion assembly 210 and the second horizontal motion assembly 220 can drive the vertical motion assembly 230 to translate in the first horizontal direction X and the second horizontal direction Y.

[0138] Please refer to Figure 3 While watching Figure 1 and Figure 2 In the embodiment of the present application, the first horizontal motion assembly 210 is installed on the device base 80, the second horizontal motion assembly 220 is stacked above the second horizontal motion assembly 220, and the vertical motion assembly 230 is supported above the second horizontal motion assembly 220 as an example, wherein:

[0139] The first horizontal motion assembly 210 may include a first lead screw (e.g., a ball screw) 211 extending along a first horizontal direction X, a first motor 212 for driving the first lead screw 211 to rotate, and a first guide rail (e.g., a linear guide rail) 213 arranged parallel to the first lead screw 211, wherein the first lead screw 211, the first motor 212, and the first guide rail 213 are all mounted on the top surface of the device base 80, and the first motor 212 and the first lead screw 211 may be connected in transmission via a coupling 215;

[0140] The second horizontal motion assembly 220 may include a second lead screw (e.g., a ball screw) 221 extending along a second horizontal direction, a second motor 222 for driving the second lead screw 221 to rotate, and a second guide rail (e.g., a linear guide rail) 223 arranged in parallel with the second lead screw 222, wherein the second lead screw 221 and the second guide rail may be mounted on a movable support plate 225 so that the verticality tolerance between the first lead screw 211 and the second lead screw 221 is ≤0.1°, the movable support plate 225 is in transmission cooperation with the first lead screw 211 of the first horizontal motion assembly 210, the second motor 222 is mounted on the top surface of the device base 80, and the second motor 222 may be transmission-connected to the second lead screw 222 via a belt transmission assembly including a synchronous belt and a synchronous pulley;

[0141] The base 231 of the vertical motion assembly 230 is in transmission cooperation with the second lead screw 221 of the second horizontal motion assembly 220 .

[0142] Thus, the first lead screw 211, in response to the rotation of the first motor 212 controlled by the power output of the data processing module 40, can drive the movable support plate 225 of the second horizontal motion assembly 220 to translate along the first horizontal direction X, so as to drive the vertical motion assembly 230 to translate in the first horizontal direction X through the base 231 of the vertical motion assembly 230, that is, drive the vertical motion assembly 230 to translate in the first horizontal direction X; the second lead screw 221, in response to the rotation of the second motor 222 controlled by the power output of the data processing module 40, can drive the base 231 of the vertical motion assembly 230 to translate along the second horizontal direction Y, that is, drive the vertical motion assembly 230 to translate in the second horizontal direction Y. Thus, the base 231 of the vertical motion assembly 230 has the degree of freedom of translation in the first horizontal direction and in the second horizontal direction intersecting with the first horizontal direction.

[0143] Moreover, the motion adjustment mechanism 20 may also include a sensor component for detecting the horizontal position of the movable support plate 225 of the second horizontal motion component 220 and the base 231 of the vertical motion component 230. The sensor component is used to report the real-time horizontal position of the movable support plate 225 of the second horizontal motion component 220 in the first horizontal direction X and the real-time horizontal position of the base 231 of the vertical motion component 230 in the second horizontal direction Y to the data processing module 40.

[0144] In addition, the motion adjustment mechanism 20 may also include a cable protection cover 260 for protecting the electrical cables of the first motor 212 and the second motor 222, and may also include a cable protection drag chain (Cable carrier), that is, a first drag chain 261 deployed along the first horizontal direction X, and a second drag chain 262 deployed along the second horizontal direction Y.

[0145] Continue to see Figure 3 , and review at the same time Figure 1 and Figure 2 In the embodiment of the present application, the mobile carrying mechanism 10 can be fixedly mounted on the top of the vertical motion assembly 230, so that the vertical motion assembly 230 can drive the mobile carrying mechanism 10 to rise and fall in the vertical direction Z. Thus, the mobile carrying mechanism 10 follows the translation of the vertical motion assembly 230 in the first horizontal direction X and the second horizontal direction Y, and is driven by the vertical motion assembly 230 to rise and fall in the vertical direction Z, so that the position of the mobile carrying mechanism 10 can be adjusted in three axes in the first horizontal direction X, the second horizontal direction Y, and the vertical direction Z.

[0146] Figure 4 For Figure 3 Schematic diagram of the assembly structure of the vertical motion component in the motion adjustment mechanism shown. Figure 5 For Figure 3 The schematic diagram of the exploded structure of the vertical motion component in the motion adjustment mechanism shown in FIG. Figure 4 and Figure 5In the embodiment of the present application, the vertical motion assembly 230 may include, in addition to the base 231, a lead screw motor 232 located above the base 231, wherein the motor rotor of the lead screw motor 232 is directly connected to the lead screw nut, so that the motor rotor drives the lead screw nut to rotate and induces the linear motion of the motor lead screw 2321 in the vertical direction Z. For example, the lead screw motor 232 may be fixedly mounted on a mounting plate 233 located above the base 231, and the mounting plate 233 may be fixedly supported above the base 231 through a support shaft 2330, and the motor lead screw 2321 of the lead screw motor 232 extends upward along the vertical direction Z to the top of the mounting plate 233, and the top end of the motor lead screw 2321 forms a longitudinal support for the top plate 235 used to support the mobile bearing mechanism 10, for example, the top end of the motor lead screw 2321 may form a double-point support for the top plate 235 through a balancing member 2322.

[0147] Thus, when the lead screw motor 232 drives the motor lead screw 2321 to rotate under the control of the data processing module 40 , the top plate 235 can be caused to rise and fall along the vertical direction Z, thereby adjusting the position of the mobile supporting mechanism 10 in the vertical direction Z.

[0148] from Figure 4 and Figure 5 It can be seen that a lower side enclosure (e.g., a lower bent sheet metal) 2310 surrounding the screw motor 232 (e.g., the motor screw 2321) is also installed above the base 231, and an upper side enclosure (e.g., an upper bent sheet metal) 2350 surrounding the screw motor 232 (e.g., the motor screw 2321) is also installed below the top plate 235, and the upper end of the lower side enclosure 2310 and the lower end of the upper side enclosure 2350 are fitted inside and outside to form protection for the internal structure of the vertical motion component 230, and the lower end of the upper side enclosure 2350 can slide and cooperate with the upper end of the lower side enclosure 2310 in response to the lifting and lowering of the top plate 235 along the vertical direction Z, so as to avoid the fitting between the upper end of the lower side enclosure 2310 and the lower end of the upper side enclosure 2350 hindering the lifting and lowering of the top plate 235 along the vertical direction Z.

[0149] from Figure 4 and Figure 5It can also be seen that the vertical motion component 230 can also include a lifting guide shaft 236 that passes through the mounting plate 233. For example, the lifting guide shaft 236 can be symmetrically arranged on opposite sides of the motor screw 2321, and the mounting plate 233 of the vertical motion component 230 can be equipped with a pair of first linear bearings 2361 for the pair of lifting guide shafts 236 to pass through. The lower ends of the pair of lifting guide shafts 236 can be fixedly connected by a synchronous connecting rod 2362, and the upper end of each lifting guide shaft 236 can be connected to the top plate 235. Thus, through the sliding cooperation of a pair of lifting guide shafts 236 and a pair of first linear bearings 2361 along the vertical direction Z, the lifting direction of the top plate 235 can be accurately constrained in the vertical direction Z.

[0150] from Figure 4 and Figure 5 It can also be seen that the vertical motion component 230 is also arranged with a photoelectric detection component 237 between the mounting plate 233 and the base 231. The photoelectric detection component 237 may include a longitudinal bracket 2371 installed on the base 231, and at least two (preferably three) position sensing elements (such as photoelectric switches) 2372 arranged on the longitudinal bracket 2371 along the vertical direction Z. Correspondingly, the synchronous connecting rod 2362 connecting the lower ends of a pair of lifting guide shafts 236 may also be equipped with a moving sensing sheet 238. In response to the lower end of the upper side wall 2350 sliding along the vertical direction Z with the upper end of the lower side wall 2310, the moving sensing sheet 238 may pass through the sensing position of each position sensing element 2372 of the photoelectric detection component 237 to prompt the position sensing element 2372 of the photoelectric detection component 237 to generate a sensing signal to the data processing component 40, and the sensing signal is used to characterize the real-time vertical position of the mobile supporting mechanism 10 supported by the top plate 235 in the vertical direction Z.

[0151] In addition, in order to prevent the cables of the screw motor 232 and the photoelectric detection component 237 from hanging from under the base 231 and interfering with the second horizontal motion component 220, a wiring groove 239 can also be installed at the edge of the base 231. The wiring groove 239 is used to guide the screw motor 232 and the photoelectric detection component 237 to avoid the second horizontal motion component 220.

[0152] It is understandable that if Figures 3 to 5 The preferred structure of the motion adjustment mechanism 20 shown is only for facilitating understanding that the motion adjustment mechanism 20 has the function of “adjusting the position of the mobile supporting mechanism 10 ”, and the preferred structure should not be considered restrictively as the only structure of the motion adjustment mechanism 20 .

[0153] The microscopic vision mechanism 30 may include at least two microscopic imaging components 300 respectively deployed in different orientations. For example, the deployment orientation of the at least two microscopic imaging components 300 may refer to a selected orientation in any direction of the first horizontal direction X, the second horizontal direction Y, and the vertical direction Z. In the embodiment of the present application, the at least two microscopic imaging components 300 include a first microscopic imaging component 310, a second microscopic imaging component 320, a third microscopic imaging component 330, and a fourth microscopic imaging component 340, a total of four microscopic imaging components 300 in different orientations as an example, wherein:

[0154] The field depth direction of the first microscopic imaging assembly 310 is along the first horizontal direction X toward the moving area of ​​the mobile carrying mechanism 10. For example, the first microscopic imaging assembly 310 can be supported horizontally above the device base 80 by the first supporting mechanism 810.

[0155] The depth of field direction of the second microscopic imaging assembly 320 is along the second horizontal direction Y toward the moving area of ​​the mobile carrying mechanism 10. For example, the second microscopic imaging assembly 320 can be supported horizontally above the device base 80 by the second supporting mechanism 820.

[0156] The field depth direction of the third microscopic imaging assembly 330 is along the second horizontal direction Y toward the moving area of ​​the mobile carrying mechanism 10, and the field depth direction of the third microscopic imaging assembly 330 is opposite to the field depth direction of the second microscopic imaging assembly 320. For example, the third microscopic imaging assembly 330 can be supported horizontally above the device base 80 by the third supporting mechanism 830;

[0157] The field depth direction of the fourth microscopic imaging assembly 340 is deployed downward along the vertical direction Y. For example, the fourth microscopic imaging assembly 340 can be suspended above the device base 80 by the first suspension mechanism 840 .

[0158] However, it can be understood that the microscopic imaging component 300 included in the microscopic vision mechanism 30 of the image acquisition device in the embodiment of the present application should not be restrictively understood as necessarily including all of the above-mentioned first microscopic imaging component 310, the second microscopic imaging component 320, the third microscopic imaging component 330 and the fourth microscopic imaging component 340, but should be understood as only including a combination of any two or three of the above-mentioned first microscopic imaging component 310, the second microscopic imaging component 320, the third microscopic imaging component 330 and the fourth microscopic imaging component 340.

[0159] Regardless of the number and orientation of the microscopic imaging components 300 included in the microscopic vision mechanism 30, each microscopic imaging component 300 is mainly used to collect local surface features in the package plane of the hexahedral package. That is, for each microscopic imaging component 300, its "microscopic vision" means that its depth of field distance representing the imaging object distance is configured to make the imaging clarity of the local surface features equal to or higher than the preset clarity threshold, and the depth of field distance of the "microscopic vision" can be less than the depth of field distance required for visual imaging that focuses more on the overall feature collection.

[0160] Figure 6 For Figure 1 The preferred structural diagram of the microscopic imaging component of the image acquisition device in the embodiment shown is shown in FIG. Figure 6 In the embodiments of the present application, any microscopic imaging assembly 300 may include a microscopic industrial camera 300a, a telecentric lens 300b installed on the imaging side of the microscopic industrial camera 301, and a reflector group 300c installed on the lens end face of the telecentric lens 300b.

[0161] Among them, the telecentric lens 300b can weaken or even eliminate the lens distortion of the microscopic industrial camera 300a, and the reflector group 300c can make the imaging light path of the microscopic imaging component 300 bent through the reflective prism it contains. The target depth of field distance of the microscopic imaging component 300 can refer to the path length from the imaging surface of the microscopic industrial camera 300a through the bent imaging light path, and the target depth of field distance of the microscopic imaging component 300 can be 6mm-10mm (preferably 8mm) longer than the path length from the imaging surface of the microscopic industrial camera 300a to the reflector group 300c. This part of the length can be the distance between the package plane and the microscopic imaging component 300 when imaging.

[0162] If the first microscopic imaging component 310 is used as Figure 6 In the structure shown in the figure, the field depth direction of the first microscopic imaging component 310 is along the first horizontal direction X toward the moving area of ​​the mobile carrying mechanism 10, which may refer to the light incident surface of the reflector group 300c along the first horizontal direction X toward the moving area of ​​the mobile carrying mechanism 10, and the light exit surface of the reflector group 300c extends along the second horizontal direction Y, so that the space size occupied by the telecentric lens 300b and the microscopic industrial camera 300a in the first horizontal direction X is only the radial size, thereby saving the space occupied by the first microscopic imaging component 310 in the first horizontal direction X;

[0163] If the second microscopic imaging component 320 is used as Figure 6In the structure shown in the figure, the field depth direction of the second microscopic imaging component 320 is along the second horizontal direction Y toward the moving area of ​​the mobile carrying mechanism 10, which may refer to the light incident surface of the reflector group 300c along the second horizontal direction Y toward the moving area of ​​the mobile carrying mechanism 10, and the light exit surface of the reflector group 300c extends along the first horizontal direction X, so that the space occupied by the telecentric lens 300b and the microscopic industrial camera 300a in the second horizontal direction Y is only the radial dimension, thereby saving the space occupied by the second microscopic imaging component 320 in the second horizontal direction Y;

[0164] If the third microscopic imaging component 330 is used as Figure 6 The structure shown is the same as the second microscopic imaging component 320, and will not be described again here;

[0165] If the fourth microscopic imaging component 340 is used as Figure 6 In the structure shown, the field of view depth direction of the fourth microscopic imaging component 340 is downward along the vertical direction Z, which may mean that the light incident surface of its reflector group 300c is downward along the vertical direction Z, and the light emitting surface of its reflector group 300c extends along the first horizontal direction X or the second horizontal direction Y, so that the space occupied by the telecentric lens 300b and the microscopic industrial camera 300a in the vertical direction Z is only the radial dimension, thereby saving the space occupied by the fourth microscopic imaging component 340 in the vertical direction Z.

[0166] That is, by adopting Figure 6 The preferred structure of the microscopic imaging component shown can help reduce the device volume of the image acquisition device when the target depth of field distance is the same. Therefore, when the hexahedral package is a miniaturized package such as a cigarette carton or a cigarette pack, it can support the image acquisition device in the embodiment of the present application to be configured with a device volume that is convenient for placement on a small tabletop such as an office desk.

[0167] In addition, from Figure 6 It can also be seen that the microscopic imaging assembly 300 can also include a shadowless light source 300e installed on the light incident surface of the reflector group 300c through a light source bracket 300d to provide supplementary light for imaging of local microscopic features of the packaging plane.

[0168] It is understandable that if there is no need to save the volume of the image acquisition device, the microscopic imaging component 300 may not be selected as Figure 6 The preferred structure shown, that is, Figure 6 The preferred structure shown should not be understood as a necessary limitation on the image acquisition device in the embodiments of the present application.

[0169] The data processing module 40 is used to control the system operation of the motion adjustment mechanism 20 and the microscopic vision mechanism 30 in response to the placement of the hexahedral package on the mobile carrying mechanism 10 in a selected posture. For example, the image acquisition device in the embodiment of the present application may include a box shell, and the mobile carrying mechanism 10, the motion adjustment mechanism 20 and the microscopic vision mechanism 30 are all built in the box shell, and the box shell has an openable and closable door, so that whenever the box door sensor (such as a photoelectric sensor) installed in the box shell detects that the box door is closed, it can trigger the in-situ sensor (such as a pressure sensor or a photoelectric sensor) further deployed in the box shell to detect whether there is a load on the top surface of the mobile carrying mechanism 10. If so, a detection signal representing the in-situ state of the hexahedral package is generated to the data processing module 40, so that the data processing module 40 can recognize that the hexahedral package is placed on the mobile carrying mechanism 10 in a selected posture.

[0170] In the embodiment of the present application, the data processing module 40 may include a control component and an algorithm component. The control component may be used to implement the instruction interaction and state detection between the data processing module 40 and the motion adjustment mechanism 20 and the microscopic vision mechanism 30. The algorithm component may drive the control component based on the state detection result of the control component and the preset algorithm, and may even perform image processing. For example, the control component of the data processing module 40 may include a processing device with data processing capabilities such as an MCU (Microcontroller Unit), or a logic device such as an FPGA (Field Programmable Gate Array) that implements logic control based on a logic array. The algorithm component of the data processing module 40 may include a data processor such as a CPU (Central Processing Unit), an ISP (Image Signal Processor), or a GPU (Graphic Processing Unit).

[0171] Specifically, the data processing module 40 can be used to control the motion adjustment mechanism 20 to adjust the position of the mobile carrying mechanism 10 to match the size of the hexahedral package when the hexahedral package is placed on the mobile carrying mechanism 10 in a selected posture, and control the microscopic vision mechanism 30 to perform shooting in response to the position adjustment of the mobile carrying mechanism 10 by the motion adjustment mechanism 20, so that:

[0172] The local surface features in any package plane of the hexahedral package are imaged at the target depth of field distance of the microscopic imaging component 300 at the corresponding orientation.

[0173] That is, the local surface features in at least two package planes of the hexahedron package can be imaged at the target depth of field distance of the microscopic imaging component 300 in the corresponding orientation. For example, if at least two package planes of the hexahedron package are simultaneously located at the target depth of field distance of the microscopic imaging component 300 in the corresponding orientation, then the local surface features in at least two package planes of the hexahedron package can be imaged simultaneously at the target depth of field distance of the microscopic imaging component 300 in the corresponding orientation; if at least two package planes of the hexahedron package are not simultaneously located at the target depth of field distance of the microscopic imaging component 300 in the corresponding orientation, then the local surface features in at least two package planes of the hexahedron package can be imaged at the target depth of field distance of the microscopic imaging component 300 in the corresponding orientation in time division.

[0174] Figure 7 For Figure 1 Schematic diagram of a single imaging process of the image acquisition device in the embodiment shown. Figure 7 In the case of at least two microscopic imaging components 300 including a first microscopic imaging component 310, a second microscopic imaging component 320, a third microscopic imaging component 330 and a fourth microscopic imaging component 340, each time the hexahedral package is placed on the mobile supporting mechanism 10, the local surface features of the four package planes can be imaged, that is, the local surface features of the three side peripheral package planes are imaged at the target depth of field distance D1 of the first microscopic imaging component 310, the target depth of field distance D2 of the second microscopic imaging component 320 and the target depth of field distance D3 of the third microscopic imaging component 330, and the top package plane can be imaged at the target depth of field distance D4 of the fourth microscopic imaging component 340.

[0175] Figure 8a and Figure 8b For Figure 1 Schematic diagram of the six-sided imaging process of the image acquisition device in the embodiment shown. Figure 8a and Figure 8b In the case of at least two microscopic imaging components 300 including a first microscopic imaging component 310, a second microscopic imaging component 320, a third microscopic imaging component 330 and a fourth microscopic imaging component 340, if it is necessary to image the local surface features of all six package planes of the hexahedral package, it is possible to:

[0176] First, the hexahedral package is placed on the mobile carrying mechanism 10 in a first selected posture, so that S1, S3, and S4 of the six package planes S1-S6 are three side peripheral package planes facing the first microscopic imaging component 310, the second microscopic imaging component 320, and the third microscopic imaging component 330 respectively, and S5 of the six package planes S1-S6 is the top package plane facing upwards and facing the fourth microscopic imaging component 340, so that local microscopic features of the four package planes S1, S3, S4, and S5 can be imaged;

[0177] Then, the hexahedral package is flipped over to a second selected posture and placed on the mobile carrying mechanism 10, so that the package plane S2 facing away from the first microscopic imaging component 310 in the first selected posture is swapped with the package plane S1 facing the first microscopic imaging component 310, and the package plane S6 facing downward in the first selected posture is swapped with the package plane S5 facing upward, thereby using the first microscopic imaging component 310 and the fourth microscopic imaging component 340 to image the local microscopic features of the remaining two package planes S2 and S4.

[0178] Since the surface flatness of the packaging plane has a great influence on the imaging of local surface features, manual operation is preferably used for the placement operation of the hexahedral package and the reversal operation when switching the selected posture, rather than mechanical operation such as a robotic arm that generates a rigid support force on the hexahedral package, so as to avoid mechanical operation destroying the flatness of the packaging plane.

[0179] in addition, Figure 8a and Figure 8b The hexahedral packages shown in the figures are respectively represented by a first hexahedral package (e.g. a cigarette carton) 91 and a second hexahedral package (e.g. a pack of cigarettes) 92 of different sizes, thereby reflecting that the position adjustment of the mobile supporting mechanism 10 by the motion adjustment mechanism 20 under the control of the data processing module 40 is adapted to the size of the hexahedral package, thereby ensuring that no matter what the size of the hexahedral package is, the local surface features in the packaging plane of the hexahedral package facing the microscopic imaging component 300 in any orientation can be imaged at the target depth of field distance of the microscopic imaging component 300 in that orientation.

[0180] Based on the above embodiment, the image acquisition device has a mobile carrying mechanism 10 for hexahedral package and at least two microscopic imaging components 300 deployed in different positions, wherein the position of the mobile carrying mechanism 10 can be adjusted by the motion adjustment mechanism 20. Therefore, by controlling the motion adjustment mechanism 20 to adjust the position of the mobile carrying mechanism 10 to match the size specification of the hexahedral package, at least two package planes of the hexahedral package placed on the mobile carrying mechanism 10 can be automatically positioned to the target depth of field distance of the microscopic imaging component 300 in the corresponding position, so that the local surface features in the at least two package planes of the hexahedral package can be imaged at the target depth of field distance of the microscopic imaging component 300 in the corresponding position. Furthermore, automatic image acquisition can be achieved to ensure image clarity for the local surface features of any package plane of the hexahedral package, so as to help improve the recognition efficiency and accuracy of the local surface features of the package plane.

[0181] In the embodiments of the present application, for each of the first microscopic imaging component 310, the second microscopic imaging component 320, the third microscopic imaging component 330 and the fourth microscopic imaging component 340, the position adjustment mechanism implemented on the mobile supporting mechanism 10 to make the corresponding packaging plane of the hexahedral package at its target depth of field distance can be different from that of other microscopic imaging components 300, which will be described in detail below.

[0182] When the at least two microscopic imaging components 300 of the microscopic vision system 30 include a first microscopic imaging component 310, a side edge of the mobile supporting mechanism 10 close to the first microscopic imaging component 310 in the first horizontal direction X can be configured as a first reference edge, and accordingly, the hexahedral package placed on the mobile supporting mechanism 10 can be positioned such that the package plane facing the first microscopic imaging component 310 is abutted against the first reference edge of the mobile supporting mechanism 10.

[0183] Fig. 9 For Figure 1 The preferred structural diagram of the mobile supporting mechanism of the image acquisition device in the embodiment shown is shown in FIG. Fig. 9In order to achieve the positioning and abutment of the packaging plane of the hexahedral package facing the first microscopic imaging component 310 with the first reference edge of the mobile carrying mechanism 10, in an embodiment of the present application, the mobile carrying mechanism 10 may have one or more first positioning protrusions 110 at the first reference edge close to the first microscopic imaging component 310 in the first horizontal direction X, and the first positioning protrusions 110 protrude above the flat carrying top surface of the mobile carrying mechanism 10, wherein, when the packaging plane of the hexahedral package facing the first microscopic imaging component 310 abuts against the first positioning protrusion 110, the packaging plane of the hexahedral package facing the first microscopic imaging component 310 is positioned as: abutting the first reference edge of the mobile carrying mechanism 10 close to the first microscopic imaging component 310 in the first horizontal direction X.

[0184] In the embodiment of the present application, no other microscopic imaging components 300 are deployed on the opposite side of the first microscopic imaging component 310 in the first horizontal direction X. This is to facilitate the placement and removal of the hexahedral package on the mobile carrying mechanism 10 during the toilet renovation. Accordingly, if the image acquisition device in the embodiment of the present application further includes the box shell mentioned above, the box door of the box shell can be set on the opposite side of the first microscopic imaging component 310 in the first horizontal direction X.

[0185] That is, the other side edge of the mobile carrying mechanism 10 opposite to the first reference edge in the first horizontal direction X is used to implement the placement operation of placing the hexahedral package on the mobile carrying mechanism 10 and the removal operation of removing the hexahedral package from the mobile carrying mechanism 10. In this case, the operation direction of the placement operation of placing the hexahedral package on the mobile carrying mechanism 10 will be along the first horizontal direction X toward the first reference edge of the mobile carrying mechanism 10, so that, in response to the thrust force generated along the first horizontal direction by the placement operation, the hexahedral package is moved toward the package plane (for example, as shown in FIG. 1 ) of the first microscopic imaging assembly 310. Figure 8a and Figure 8b The packaging plane S1 or S2 shown can abut against the first positioning protrusion 110 at the first reference edge, so that the packaging plane of the hexahedral package facing the first microscopic imaging component 310 is positioned against the first reference edge of the movable supporting mechanism 10.

[0186] Furthermore, in order to adapt to hexahedral packages of different sizes, the number and distribution range of the first positioning protrusions 110 can be determined according to the size range of the hexahedral package.

[0187] Fig.10a and Fig.10b For Fig. 9 The diagram of the mobile support mechanism in use is shown in the figure. Fig.10a and Fig.10bThe first hexahedral package (e.g., a cigarette carton) 91 and the second hexahedral package (e.g., a pack of cigarettes) 92 of different sizes, whose packaging planes facing the first microscopic imaging component 310 can abut against at least one of the multiple first positioning protrusions 110 spaced apart along the first reference edge.

[0188] When the hexahedral package placed on the mobile supporting mechanism 10 faces the package plane of the first microscopic imaging component 310 (for example, Figure 8a and Figure 8b When the package plane S1 or S2 shown in the figure needs to collect local surface features, the data processing module 40 can be further used to: control the motion adjustment mechanism 20 to adjust the position of the mobile carrier mechanism 10 based on the position information of the pre-calibrated first reference position, wherein when the mobile carrier mechanism 10 is adjusted to the first reference position, the first reference edge is located at the first target depth of field distance of the first microscopic imaging component 310. At this time, as long as the package plane of the hexahedral package placed on the mobile carrier mechanism 10 faces the first microscopic imaging component 310 and is close to the first reference edge of the mobile carrier mechanism 10, then:

[0189] By adjusting and positioning the first reference edge of the mobile carrier mechanism 10 at the first reference position and positioning the package plane against the first reference edge of the mobile carrier mechanism 10, the package plane (eg, Figure 8a and Figure 8b Local surface features in the package plane S1 or S2 shown can be imaged at a first target depth of field distance of the first microscopic imaging component 310.

[0190] In an embodiment of the present application, the first reference position may be associated with the size specification of the hexahedral package, that is, the data processing module 40 may be further configured to: select the first reference position from a preset reference position set based on the size specification of the hexahedral package. The method for determining the size specification of the hexahedral package will be described later.

[0191] In the case where the at least two microscopic imaging components 300 of the microscopic vision system 30 include a second microscopic imaging component 320, a side edge of the mobile carrying mechanism 10 close to the second microscopic imaging component 320 in the second horizontal direction Y can be configured as a second reference edge, and accordingly, the hexahedral package placed on the mobile carrying mechanism 10 can be positioned as: facing the package plane of the second microscopic imaging component 320 (for example Figure 8a and Figure 8b The packaging plane S3 in FIG. 1 abuts against a second reference edge of the mobile supporting device 10 .

[0192] Please look back Fig. 9In order to achieve the packaging plane of the hexahedral package facing the second microscopic imaging component 320 to be in contact with the second reference edge of the mobile carrying mechanism 10, in an embodiment of the present application, the mobile carrying mechanism 10 may have one or more second positioning protrusions 120 at the second reference edge of the second microscopic imaging component 320 close to the second microscopic imaging component 320 in the second horizontal direction Y, and the second positioning protrusions 120 protrude above the flat carrying top surface of the mobile carrying mechanism 10, wherein, when the packaging plane of the hexahedral package facing the second microscopic imaging component 320 is in contact with the second positioning protrusion 120, the packaging plane of the hexahedral package facing the second microscopic imaging component 320 is positioned as: in contact with the second reference edge of the mobile carrying mechanism 10 close to the second microscopic imaging component 320 in the second horizontal direction Y.

[0193] Furthermore, in order to adapt to hexahedral packages of different sizes, the number and distribution range of the second positioning protrusions 120 can be determined according to the size range of the hexahedral package. Fig.10a and Fig.10b The first hexahedral package (e.g., a cigarette carton) 91 and the second hexahedral package (e.g., a pack of cigarettes) 92 of different sizes, whose packaging planes facing the second microscopic imaging component 320 can abut against at least one of the multiple second positioning protrusions 120 spaced apart along the second reference edge.

[0194] Since the direction in which the packaging plane of the hexahedral package facing the second microscopic imaging component 320 and the second positioning protrusion 120 are in contact with each other is the second horizontal direction Y, rather than the first horizontal direction X where the placement operation occurs, for the hexahedral package placed on the mobile carrying mechanism 10 through the placement operation along the first horizontal direction X, there may be a gap between the packaging plane facing the second microscopic imaging component 320 and the second positioning protrusion 120 due to the operational deviation of the placement operation. For this reason, in an embodiment of the present application, the position correction of the hexahedral package in the second horizontal direction Y can be performed before imaging the local surface features.

[0195] Fig.11 For adapting to Fig. 9 A schematic diagram of the preferred structure of the flexible correction mechanism of the mobile supporting mechanism is shown. Fig.12a and Figure 12b For Fig.11 The correction principle of the flexible correction mechanism shown in Figure 2 is shown in Figure 2. Fig.11 as well as Fig.12a and Figure 12bIn an embodiment of the present application, the image acquisition device may further include a flexible correction mechanism 51, which may be spaced apart from the second microscopic imaging component 320 in the second horizontal direction Y, and the flexible correction mechanism 51 is located on the opposite side of the second reference edge of the movable supporting mechanism 10 and the second positioning protrusion 120 in the second horizontal direction. For example, the flexible correction mechanism 51 may be installed on the top of a third supporting mechanism 830 for supporting the third microscopic imaging component 320.

[0196] Accordingly, the data processing module 40 can be further used for:

[0197] In response to the completion of the placement of the hexahedron package on the mobile carrying mechanism 10, based on the position information of the flexible correction mechanism 51, the motion adjustment mechanism 20 is controlled to adjust the position of the mobile carrying mechanism 10, so that the mobile carrying mechanism 10 abuts against the flexible correction mechanism 51 in the second horizontal direction Y, so that the package plane of the hexahedron package facing away from the second reference edge (i.e., the second positioning protrusion 120) in the second horizontal direction Y contacts the flexible correction mechanism 51, and when the hexahedron package abuts against the second positioning protrusion 120 due to being squeezed by the flexible correction mechanism 51, the hexahedron package will generate reverse pressure to the flexible correction mechanism 51 due to being limited by the abutment against the second positioning protrusion 120, so as to cause the flexible correction mechanism 51 to undergo pressure deformation;

[0198] In response to the pressure deformation of the flexible correction mechanism 51 caused by the hexahedral package abutting against the second positioning protrusion 120 , the motion adjustment mechanism 20 is controlled to stop moving the supporting mechanism 10 to continue to abut against the flexible correction mechanism 51 .

[0199] In an embodiment of the present application, the flexible correction mechanism 51 may include:

[0200] A mounting strip 511, the mounting strip 511 extending along the first horizontal direction X, and the mounting strip 511 can be fixedly mounted on the top of the third supporting mechanism 830 for supporting the third microscopic imaging assembly 320 through a mounting block 510;

[0201] a touch-pressure strip 512, wherein the touch-pressure strip 512 is parallel to the mounting strip 511, and the touch-pressure strip 512 is spaced apart from the mounting strip 511 in the second horizontal direction Y;

[0202] A floating support assembly 513, which is connected between the mounting strip 511 and the contact strip 512. For example, the floating support assembly 513 may include:

[0203] The floating guide shaft 5132 may be inserted into the mounting strip 511 and connected to the contact and pressure strip 512. For example, the mounting strip 511 may be provided with a second linear bearing 5131, and the floating guide shaft 5132 may be inserted into the second linear bearing 5131. Fig.11 In the example, the floating guide shaft 5132 and the second linear bearing 5131 are arranged as a pair. It can be understood that the number of the floating guide shaft 5132 and the second linear bearing 5131 is not limited to this; and,

[0204] The blocking piece 5133 can be fixedly mounted on the side of the installation strip 511 facing away from the contact and pressure strip 512, and the blocking piece 5133 can form an elastic support for the floating guide shaft 5132 through an elastic element such as a spring.

[0205] Based on the above structure, when the mobile supporting mechanism 10 is close to the flexible correction mechanism 51 in the second horizontal direction, the packaging plane of the hexahedral package facing away from the second positioning protrusion 120 in the second horizontal direction Y (for example Figure 8a and Figure 8b 512; and when the hexahedral package is pressed against the second positioning protrusion 120 due to the limited extrusion of the touch-pressure strip 512, the package plane in contact with the touch-pressure strip 512 will cause the touch-pressure strip 512 to be reversely pushed close to the mounting strip 511, so that the deformation sensing component 515 generates an output signal for indicating the pressure deformation of the flexible correction mechanism 51 to the data processing module 40 in response to the reduction of the distance between the touch-pressure strip 512 and the mounting strip 511 in the second horizontal direction Y. For example, the deformation sensing component 515 may include an offset sensing element 5151 (such as a photoelectric switch) installed on the mounting strip 511, and an offset sensing sheet 5152 installed on the touch-pressure strip 512, and the offset sensing element 5151 is used to sense the position offset of the offset sensing sheet 5152 in the second horizontal direction Y as the touch-pressure strip 512 moves.

[0206] Please look back Fig. 9 Combined with Figure 12b In an embodiment of the present application, the mobile carrying mechanism 10 may also have an avoidance recess 130 on the side opposite to the second reference edge in the second horizontal direction Y. The avoidance recess 130 can avoid interference and collision between the mobile carrying mechanism 10 and the flexible correction mechanism 51 when the hexahedral package carried by the mobile carrying mechanism 10 is a second hexahedral package (such as a cigarette pack) 92 of small size.

[0207] When the hexahedral package placed on the mobile supporting mechanism 10 faces the package plane (eg Figure 8a and Figure 8bWhen the package plane S3 shown in the figure needs to collect local surface features, the data processing module 40 can be further used to: based on the position information of the pre-calibrated second reference position, control the motion adjustment mechanism 20 to adjust the position of the mobile carrier mechanism 10, wherein, when the mobile carrier mechanism 10 is in the second reference position, the second reference edge is located at the second target depth of field distance of the second microscopic imaging component 320. At this time, as long as the package plane of the hexahedral package placed on the mobile carrier mechanism 10 faces the second microscopic imaging component 320 and is close to the second reference edge of the mobile carrier mechanism 10, then:

[0208] By adjusting and positioning the second reference edge of the mobile carrier mechanism 10 with the second reference position as a guide, and positioning the package plane against the second reference edge of the mobile carrier mechanism 10, the package plane (for example, Figure 8a and Figure 8b The local surface features in the package plane S3 shown can be imaged at a second target depth of field distance of the second microscopic imaging component 320.

[0209] In an embodiment of the present application, the second reference position may be associated with the size specification of the hexahedral package, that is, the data processing module 40 may be further configured to select the second reference position from a preset reference position set based on the size specification of the hexahedral package. The method for determining the size specification of the hexahedral package will be described later.

[0210] In the case where the at least two microscopic imaging components 300 of the microscopic vision system 30 include a third microscopic imaging component 330, the hexahedral package placed on the mobile carrier mechanism 10 can still be positioned as: facing the package plane of the second microscopic imaging component 320 (for example Figure 8a and Figure 8b The package plane S3 in the hexahedron package is abutted against the second reference edge of the mobile carrying mechanism 10. At this time, the position of the package plane of the hexahedron package facing the third microscopic imaging assembly 330 in the second horizontal direction Y can be determined by the edge position of the second reference edge of the mobile carrying mechanism 10 and the horizontal span size of the hexahedron package in the second horizontal direction Y.

[0211] Accordingly, when the hexahedral package placed on the mobile supporting mechanism 10 faces the package plane (eg Figure 8a and Figure 8b When the packaging plane S4 shown in the figure needs to collect local surface features, the data processing module 40 can be further used to:

[0212] Based on the position information of the second reference position mentioned above and the horizontal span size of the hexahedral package in the second horizontal direction Y, the motion adjustment mechanism 20 is controlled to adjust the position of the mobile supporting mechanism 10 .

[0213] When the mobile carrier mechanism 10 is adjusted to a horizontal offset position relative to the second reference position in the second horizontal direction Y, the distance difference between the second reference edge of the mobile carrier mechanism 10 and the third target depth of field distance of the third microscopic imaging component 330 in the second horizontal direction Y is equal to the horizontal span size of the hexahedron package in the second horizontal direction Y. At this time, as long as the hexahedron package placed on the mobile carrier mechanism 10 faces the package plane of the second microscopic imaging component 320 (for example Figure 8a and Figure 8b If the packaging plane S3 shown in FIG. 1 is in contact with the second reference edge of the mobile support mechanism 10, then:

[0214] By adjusting and positioning the second reference edge of the mobile carrier mechanism 10 with the second reference position as a guide, using the horizontal span size of the hexahedron package in the second horizontal direction Y as an adjustment and positioning compensation, and positioning the package plane against the second reference edge of the mobile carrier mechanism 10, the package plane on the opposite side of the hexahedron package facing the third microscopic imaging component 320 (for example Figure 8a and Figure 8b The local surface features in the package plane S4) shown can be imaged at a third target depth of field distance of the third microscopic imaging component 330.

[0215] Fig.13 For Fig. 9 Schematic diagram of the interference avoidance principle of the mobile support mechanism shown. Fig.13 , when the hexahedral package faces the package plane of the third microscopic imaging component 320 (eg Figure 8a and Figure 8b When the local surface features in the packaging plane S4) shown in the figure are imaged at the third target depth of field distance of the third microscopic imaging component 330, if the hexahedral package carried by the mobile carrying mechanism 10 is a second hexahedral package (such as a cigarette pack) 92 of small size, the avoidance recess 130 of the mobile carrying mechanism 10 can prevent the mobile carrying mechanism 10 from interfering with or colliding with the third microscopic imaging component 320 and the third support mechanism 830.

[0216] In the case where the fourth microscopic imaging component (340) is included in at least two microscopic imaging components 300 of the microscopic vision system 30, the image acquisition device in the embodiment of the present application may further include a laser ranging mechanism 52, and the laser ranging mechanism 52 may be used to generate a laser ranging signal in the same direction as the field depth direction of the fourth microscopic imaging component 340. For example, the laser ranging mechanism 52 may be installed in the first suspension mechanism 840 for suspending the fourth microscopic imaging component 340.

[0217] Accordingly, when the hexahedral package placed on the mobile supporting mechanism 10 faces the package plane (eg Figure 8a and Figure 8b When the packaging plane S5 or S6 shown in the figure needs to collect local surface features, the data processing module 40 can be further used to:

[0218] Based on the distance measurement result obtained by the laser distance measurement mechanism 52 using the laser distance measurement signal, determine the height distance in the vertical direction Z between the package plane at the top of the hexahedral package and the fourth microscopic imaging assembly 340;

[0219] To make the height spacing equal to the fourth target depth of field distance of the fourth microscopic imaging assembly 340, the motion adjustment mechanism 20 is controlled to adjust the position of the mobile carrier mechanism 10 so that the hexahedral package is upwardly directed toward the side package plane of the fourth microscopic imaging assembly 340 (for example Figure 8a and Figure 8b Local surface features in the package plane S5 or S6 shown are imaged at a fourth target depth of field distance of the fourth microscopic imaging component 340.

[0220] Fig.14 For Figure 1 The image acquisition device in the embodiment shown is a schematic diagram of the adjustment principle based on the laser distance measurement mechanism. Fig.14 As shown, for different situations where the hexahedral packages carried by the mobile carrying mechanism 10 are respectively a first hexahedral package (e.g., a cigarette strip) 91 of large size and a second hexahedral package (e.g., a pack of cigarettes) 92 of small size, there is a difference Δh in the height dimension of the hexahedral package in the vertical direction Y. According to the ranging result obtained by the laser ranging mechanism 52 using the laser ranging signal, such height dimension difference Δh can be compensated, so that the packaging plane of the hexahedral package facing upward is at the fourth target depth of field distance of the fourth microscopic imaging component 340. Moreover, the laser ranging signal can be unaffected by the surface plastic film and color of the packaging plane, and can accurately obtain the ranging result representing the height spacing, so as to help ensure that the packaging plane of the hexahedral package facing upward toward the fourth microscopic imaging component 340 (e.g., Figure 8a and Figure 8b The positioning accuracy of the packaging plane S5 or S6 shown.

[0221] If the soft product inside the hexahedral package is a cigarette, then, no matter the hexahedral package is a first hexahedral package (e.g., a cigarette carton) 91 of large size or a second hexahedral package (e.g., a pack of cigarettes) 92 of small size, it can be placed in a specified position on the mobile supporting mechanism 10 with the package plane having the "largest area and the most diverse local surface features" facing upward toward the fourth microscopic imaging component 340.

[0222] In this case, the imaging field of the fourth microscopic imaging component 340 can only cover a very small local area in the packaging plane of the hexahedral package facing upward to the fourth microscopic imaging component 340. Therefore, when imaging the packaging plane of the hexahedral package facing upward to the fourth microscopic imaging component 340, in addition to determining the height position of the mobile supporting mechanism 10 in the vertical direction Z, it is also necessary to determine the horizontal position of the mobile supporting mechanism 10 in the first horizontal direction X and the second horizontal direction Y based on the layout position of the local surface features to be collected in the packaging plane of the hexahedral package facing upward to the fourth microscopic imaging component 340, so that the local surface features to be collected in the packaging plane of the hexahedral package facing upward to the fourth microscopic imaging component 340 can be located in the imaging field of the fourth microscopic imaging component 340.

[0223] However, the layout positions of the local surface features in the package plane with "diverse local surface features" are more likely and difficult to pre-calibrate like the first reference position and the second reference position mentioned above. Therefore, in the embodiment of the present application, a horizontal position customization mechanism based on human-computer interaction is provided for the imaging of the local surface features of the package plane with "largest area and diverse local surface features". Figure 1 and Figure 2 In an embodiment of the present application, the image acquisition device may further include a global vision mechanism 60, which is mainly used to capture the overall features of the hexahedral package, and the depth of field distance of the global vision mechanism 60 may be greater than the depth of field distance of the microscopic imaging component 300.

[0224] In an embodiment of the present application, the global vision mechanism 60 is used to image the packaging plane of the top surface of the hexahedral package facing upward, that is, to image the entire packaging plane of the top surface. For example, the global vision mechanism 60 can be suspended above the device base 80 by a second suspension mechanism 850, and the second suspension mechanism 850 can be fixedly mounted on the second support mechanism 820.

[0225] Fig.15 For Figure 1 The preferred structural diagram of the global vision mechanism of the image acquisition device in the embodiment shown. Fig.15 , in the embodiments of the present application:

[0226] The second suspension mechanism 850 may include:

[0227] A support frame 851, which can be installed on the top of the second support mechanism 820, but it can be understood that the support frame 851 can also be installed on the top of the first support mechanism 810 or the third support mechanism 830, or even directly installed on the device base 80 as long as the height of the support frame 851 is sufficient;

[0228] A support rod 852, which can be fixedly mounted on the top of the support frame 851 along the vertical direction Z. For example, the support rod 852 can be fixedly mounted on the top of the support frame 851 using a first fixing ring 8521;

[0229] A suspension mounting block 855, which can be fixedly mounted on the top of the support rod 852. For example, the suspension mounting block 855 can be fixedly mounted on the top of the support rod 852 using a second fixing ring 8522;

[0230] A positioning rod 853, which can be connected between the suspension mounting block 855 and the support frame 851, so as to constrain the relative position between the suspension mounting block 855 and the support frame 851;

[0231] The bottom light-transmitting plate 856 can be fixedly mounted on the bottom end of the support rod 852. For example, the bottom light-transmitting plate 856 can be positioned and mounted on the bottom end of the support rod 852 using a third fixing ring 8523. Optionally, a planar light source 857 can also be installed below the bottom light-transmitting plate 856.

[0232] Thus, the global vision mechanism 60 can be fixedly mounted between the suspension mounting block 855 and the bottom light-transmitting plate 856 with the field of view facing downward. For example, the global vision mechanism 60 can include a global industrial camera 610 mounted on the suspension mounting block 855 with the field of view facing downward, a global lens 620 arranged on the imaging surface of the global industrial camera 610, and a dust cover 630 arranged between the light incident side of the global lens 620 and the bottom light-transmitting plate 856.

[0233] Accordingly, when the hexahedral package placed on the mobile supporting mechanism 10 faces the package plane (eg Figure 8a and Figure 8b When the packaging plane S5 or S6 shown in the figure needs to collect local surface features, the data processing module 40 can be further used to: obtain the entire surface image of the packaging plane of the top surface of the hexahedral package based on the image data obtained by photographing the packaging plane of the top surface of the hexahedral package by the global vision mechanism 60.

[0234] The global vision mechanism 60 uses the global industrial camera 610 to image the packaging plane of the top surface of the hexahedral package, so:

[0235] If the field of view of the global industrial camera 610 is sufficient to cover the complete surface of the packaging plane, then the image data obtained by the global vision mechanism 60 from photographing the packaging plane of the top surface of the hexahedral package may be all pixel information of the complete surface of the packaging plane, and the data processing module 40 may directly reconstruct the entire surface image of the packaging plane of the top surface of the hexahedral package using the pixel information;

[0236] If the field of view of the global industrial camera 610 is not sufficient to cover the complete surface of the packaging plane, then, through the coordinated control of the motion adjustment mechanism 20 and the global industrial camera 610 by the data processing module 40, the global vision mechanism 60 can obtain image data of the packaging plane of the top surface of the hexahedral package, including local pixels of different planar areas of the packaging plane. Accordingly, the data processing module 40 can first use the pixel information to reconstruct local images of different areas of the packaging plane of the top surface of the hexahedral package, and then use the local images to stitch together to obtain the entire surface image of the packaging plane of the top surface of the hexahedral package.

[0237] Furthermore, when the hexahedral package placed on the mobile supporting mechanism 10 is facing upward toward the package plane of the fourth microscopic imaging component 340 (eg Figure 8a and Figure 8b When the packaging plane S5 or S6 shown in the figure needs to collect local surface features, the data processing module 40 can also be further used to:

[0238] The entire surface image of the top surface of the hexahedral package facing upward is presented on a display device (for example, the display device may also be a part of the image acquisition device in the embodiment of the present application) that is communicatively connected to the image acquisition device in the present embodiment, wherein the entire surface image may be presented on the display device after image processing such as cropping and rotation;

[0239] In response to a human-computer interaction instruction received during the presentation of the entire surface image, determining a selected position of the mobile carrying mechanism 10 in the first horizontal direction X and the second horizontal direction Y, wherein the human-computer interaction instruction is used to characterize a target area (or an area of ​​interest) selected for collecting local surface features in a packaging plane of the top surface of the hexahedral package, and the selected position is used to characterize an area position of the target area (or area of ​​interest);

[0240] The motion adjustment mechanism 20 is controlled to adjust the position of the mobile supporting mechanism 10 so that the mobile supporting mechanism 10 reaches the selected position in the first horizontal direction X and the second horizontal direction Y, so that the target area (or area of ​​interest) selected to collect local surface features in the packaging plane of the top surface of the hexahedral package is located within the field of view of the fourth microscopic imaging component 340, thereby, the local surface features in the target area (or area of ​​interest) that are custom-selected through human-computer interaction can be imaged at the fourth target depth of field distance of the fourth microscopic imaging component 340.

[0241] In addition, as mentioned above, the first reference position and / or the second reference position may be associated with the size specification of the hexahedral package, that is, the data processing module 40 may select the first reference position and / or the second reference position from a preset reference position set based on the size specification of the hexahedral package. The size specification of the hexahedral package may also be determined based on the entire surface image of the package plane of the top surface of the hexahedral package. For example, the data processing module 40 may be further used to:

[0242] Determine the horizontal span size of the hexahedral package in the first horizontal direction X and the second horizontal direction Y based on the entire package plane image of the top surface of the hexahedral package facing upward;

[0243] Based on the horizontal span dimensions of the hexahedron package in the first horizontal direction X and the second horizontal direction Y, the dimension specifications of the hexahedron package are determined.

[0244] Also, please look back Figure 1 and Figure 2 In the embodiment of the present application, the image acquisition device may further include a spectrum acquisition component 350, the acquisition field of the spectrum acquisition component 350 is deployed downward along the vertical direction Z, and is used to obtain the spectrum information of the packaging plane of the top surface of the hexahedral package facing upward. Correspondingly, the data processing module 40 is further used to obtain the spectrum information collected by the spectrum acquisition component 350 on the packaging plane of the top surface of the hexahedral package.

[0245] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. An image acquisition device, It is characterized in that include: Global Vision Mechanism (60); A movable carrying mechanism (10) for supporting the hexahedral package; A motion adjustment mechanism (20) for adjusting the position of the movable supporting mechanism (10); A microscopic vision mechanism (30) comprising at least two microscopic imaging components (300) respectively disposed at different positions, wherein the microscopic imaging components (300) are used to collect local surface features in a packaging plane of the hexahedral package; A data processing module (40) is used for, when the hexahedral package is placed on the mobile carrying mechanism (10) in a selected posture: Based on the image data obtained by photographing the packaging plane of the top surface of the hexahedral package by the global vision mechanism (60), an entire surface image of the packaging plane of the top surface of the hexahedral package is acquired; Based on the entire surface image, determining a horizontal span size of the hexahedral package in a first horizontal direction and a second horizontal direction, wherein the second horizontal direction intersects the first horizontal direction; Determining the size specification of the hexahedral package based on the horizontal span size of the hexahedral package in the first horizontal direction and the second horizontal direction; Controlling the motion adjustment mechanism (20) to adjust the position of the mobile supporting mechanism (10) to match the size specifications of the hexahedral package; and The microscopic vision mechanism (30) is controlled to perform shooting in response to the position adjustment being in place, so that: local surface features in at least two packaging planes of the hexahedral package are imaged at target depth of field distances of the microscopic imaging component (300) at corresponding positions.

2. The image acquisition device according to claim 1, It is characterized in that At least two of the microscopic imaging components (300) include a first microscopic imaging component (310), wherein the field of view depth direction of the first microscopic imaging component (310) is along the first horizontal direction toward the moving area of ​​the moving supporting mechanism (10); A side edge of the movable supporting mechanism (10) close to the first microscopic imaging component (310) in the first horizontal direction is configured as a first reference edge; The position adjustment comprises: based on the position information of a pre-calibrated first reference position, controlling the motion adjustment mechanism (20) to adjust the position of the mobile supporting mechanism (10); Wherein, when the mobile supporting mechanism (10) is adjusted to the first reference position, the first reference edge is located at a first target depth of field distance of the first microscopic imaging component (310); Furthermore, the hexahedral package placed on the mobile supporting mechanism (10) is positioned such that the package plane facing the first microscopic imaging component (310) is in contact with the first reference edge of the mobile supporting mechanism (10).

3. The image acquisition device according to claim 2, It is characterized in that The movable supporting mechanism (10) has a first positioning protrusion (110) at the first reference edge; When the packaging plane of the hexahedral package facing the first microscopic imaging component (310) abuts against the first positioning protrusion (110), the packaging plane of the hexahedral package facing the first microscopic imaging component (310) is positioned to abut against the first reference edge.

4. The image acquisition device according to claim 3, It is characterized in that The other side edge of the mobile carrying mechanism (10) in the first horizontal direction opposite to the first reference edge is used to implement a placement operation of placing the hexahedral package on the mobile carrying mechanism (10); In response to the thrust force generated by the placement operation along the first horizontal direction, the package plane of the hexahedral package facing the first microscopic imaging component (310) abuts against the first positioning protrusion (110).

5. The image acquisition device according to claim 2, It is characterized in that At least two of the microscopic imaging assemblies (300) further include a second microscopic imaging assembly (320), wherein the field of view depth direction of the second microscopic imaging assembly (320) is along the second horizontal direction toward the moving area of ​​the moving supporting mechanism (10); A side edge of the movable supporting mechanism (10) close to the second microscopic imaging component (320) in the second horizontal direction is configured as a second reference edge; The position adjustment further comprises: based on the position information of the pre-calibrated second reference position, controlling the motion adjustment mechanism (20) to adjust the position of the mobile supporting mechanism (10); Wherein, when the mobile supporting mechanism (10) is at the second reference position, the second reference edge is located at a second target depth of field distance of the second microscopic imaging component (320); Furthermore, the hexahedral package placed on the mobile supporting mechanism (10) is positioned such that the package plane facing the second microscopic imaging component (320) is in contact with the second reference edge of the mobile supporting mechanism (10).

6. The image acquisition device according to claim 5, It is characterized in that At least two of the microscopic imaging assemblies (300) further include a third microscopic imaging assembly (330), wherein the field of view depth direction of the third microscopic imaging assembly (330) is along the second horizontal direction toward the moving area of ​​the moving support mechanism (10), and the field of view depth direction of the third microscopic imaging assembly (330) and the field of view depth direction of the second microscopic imaging assembly (320) are opposite to each other; The position adjustment further comprises: based on the position information of the second reference position and the horizontal span size of the hexahedral package in the second horizontal direction, controlling the motion adjustment mechanism (20) to adjust the position of the mobile supporting mechanism (10); Wherein, when the movable supporting mechanism (10) is adjusted to a horizontally offset position relative to the second reference position in the second horizontal direction, the distance difference between the second reference edge in the second horizontal direction and the third target depth of field distance of the third microscopic imaging component (330) is equal to the horizontal span size of the hexahedron package in the second horizontal direction.

7. The image acquisition device according to claim 6, It is characterized in that The movable supporting mechanism (10) has an avoidance recess (130) on the side opposite to the second reference edge in the second horizontal direction.

8. The image acquisition device according to claim 5, It is characterized in that The movable supporting mechanism (10) has a second positioning protrusion (120) at the second reference edge; When the packaging plane of the hexahedral package facing the second microscopic imaging component (320) abuts against the second positioning protrusion (120), the packaging plane of the hexahedral package facing the second microscopic imaging component (320) is positioned in the second horizontal direction to abut against the second reference edge.

9. The image acquisition device according to claim 8, It is characterized in that The image acquisition device further comprises: a flexible correction mechanism (51); The data processing module (40) is further used for: In response to the completion of the placement of the hexahedral package on the mobile carrying mechanism (10), the motion adjustment mechanism (20) is controlled to adjust the position of the mobile carrying mechanism (10) based on the position information of the flexible correction mechanism (51), so that the mobile carrying mechanism (10) is abutted against the flexible correction mechanism (51) in the second horizontal direction, so that the package plane of the hexahedral package facing away from the second positioning protrusion (120) in the second horizontal direction contacts the flexible correction mechanism (51); In response to pressure deformation of the flexible correction mechanism (51) caused by the hexahedral package abutting against the second positioning protrusion (120), the motion adjustment mechanism (20) is controlled to stop the movable supporting mechanism (10) from continuing to abut against the flexible correction mechanism (51).

10. The image acquisition device according to claim 9, It is characterized in that The flexible correction mechanism (51) comprises: A mounting strip (511), wherein the mounting strip (511) extends along the first horizontal direction; a touch-pressure strip (512), wherein the touch-pressure strip (512) is parallel to the mounting strip (511), and the touch-pressure strip (512) is spaced apart from the mounting strip (511) in the second horizontal direction; A floating support component (513), wherein the floating support component (513) is connected between the mounting strip plate (511) and the contact pressure strip plate (512); When the movable supporting mechanism (10) is in contact with the flexible correcting mechanism (51) in the second horizontal direction, the packaging plane of the hexahedral package facing away from the second positioning protrusion (120) in the second horizontal direction contacts the contact pressure strip (512); Furthermore, when the hexahedral package abuts against the second positioning protrusion (120), the contact and pressure strip plate (512) is pushed close to the installation strip plate (511).

11. The image acquisition device according to claim 10, It is characterized in that The floating support assembly (513) comprises: A floating guide shaft (5132), the floating guide shaft (5132) is passed through the mounting strip plate (511) and connected to the contact pressure strip plate (512); The baffle (5133) is fixedly mounted on a side of the mounting strip (511) facing away from the contact and pressure strip (512), and the baffle (5133) forms an elastic support for the floating guide shaft (5132) through an elastic element.

12. The image acquisition device according to claim 10, It is characterized in that The flexible correction mechanism (51) further comprises a deformation sensing component (515), wherein the deformation sensing component (515) is configured to generate an output signal for characterizing pressure deformation of the flexible correction mechanism (51) to the data processing module (40) in response to a decrease in the distance between the contact pressure strip (512) and the mounting strip (511) in the second horizontal direction.

13. The image acquisition device according to claim 5, It is characterized in that The data processing module (40) is further used for: Based on the size specification of the hexahedral package, the first reference position and / or the second reference position is selected from a preset reference position set.

14. The image acquisition device according to claim 1, It is characterized in that At least two of the microscopic imaging assemblies (300) include a fourth microscopic imaging assembly (340), and the field of view and depth of field direction of the fourth microscopic imaging assembly (340) are arranged downward along the vertical direction; The image acquisition device further comprises: a laser distance measurement mechanism (52) for generating a laser distance measurement signal in the same direction as the field depth direction of the fourth microscopic imaging component (340); The data processing module (40) is further used for: Based on the distance measurement result obtained by the laser distance measurement mechanism (52) using the laser distance measurement signal, determining the height distance in the vertical direction between the packaging plane at the top of the hexahedral package and the fourth microscopic imaging component (340); With the goal of causing the height spacing to be equal to a fourth target depth of field distance of the fourth microscopic imaging assembly (340), the motion adjustment mechanism (20) is controlled to adjust the position of the movable supporting mechanism (10).

15. The image acquisition device according to claim 14, It is characterized in that The motion adjustment mechanism (20) comprises a vertical motion component (230), and the vertical motion component (230) comprises: A base (231), wherein the base (231) has a translational degree of freedom in a first horizontal direction and a second horizontal direction intersecting the first horizontal direction; A top plate (235), the top plate (235) being used to support the movable supporting mechanism (10); A lead screw motor (232), the lead screw motor (232) being located above the base (231) and forming a longitudinal support for the top plate (235); Wherein, under the control of the data processing module (40), the lead screw motor (232) causes the top plate (235) to rise and fall in the vertical direction to adjust the position of the movable supporting mechanism (10) in the vertical direction.

16. The image acquisition device according to claim 15, It is characterized in that The vertical motion assembly (230) further comprises: A lower side enclosure (2310), the lower side enclosure (2310) being installed above the base (231) and surrounding the lead screw motor (232); An upper side enclosure (2350), the upper side enclosure (2350) being installed below the top plate (235) and surrounding the lead screw motor (232); The upper end of the lower side surround (2310) and the lower end of the upper side surround (2350) are fitted inside and outside, and the lower end of the upper side surround (2350) slides with the upper end of the lower side surround (2310) in response to the lifting and lowering of the top plate (235) along the vertical direction.

17. The image acquisition device according to claim 14, It is characterized in that The data processing module (40) is further used for: Presenting the entire surface image on a display device that is communicatively connected to the image acquisition device; In response to a human-computer interaction instruction received during the presentation of the entire surface image, determining a selected position of the mobile supporting mechanism (10) in the first horizontal direction and the second horizontal direction, wherein the human-computer interaction instruction is used to represent a target area selected for collecting local surface features in a packaging plane of the top surface of the hexahedral package, and the selected position represents a regional position of the target area; The motion adjustment mechanism (20) is controlled to adjust the position of the mobile supporting mechanism (10) so that the position of the mobile supporting mechanism (10) in the first horizontal direction and the second horizontal direction matches the selected position.

18. The image acquisition device according to claim 17, It is characterized in that The image acquisition device further comprises: Support frame (851); A support rod (852), wherein the support rod (852) is fixedly mounted on the top of the support frame (851) along the vertical direction; A suspension mounting block (855), wherein the suspension mounting block (855) is fixedly mounted on the top end of the support rod (852); A positioning rod (853), wherein the positioning rod (853) is connected between the suspension mounting block (855) and the support frame (851); A bottom light-transmitting plate (856), wherein the bottom light-transmitting plate (856) is fixedly mounted on the bottom end of the support rod (852); The global vision mechanism (60) is installed between the suspension mounting block (855) and the bottom light-transmitting plate (856) with the field of view facing downward.

19. The image acquisition device according to claim 14, It is characterized in that The image acquisition device further comprises: a spectrum acquisition component (350), wherein the acquisition field of view of the spectrum acquisition component (350) is arranged downward along the vertical direction; The data processing module (40) is further used for: Spectral information collected by the spectrum collection component (350) on the packaging plane of the top surface of the hexahedral package is obtained.

Images