A multi-system access device

Abstract

The present invention provides a multi-system access device, comprising: a chassis, a partition board, a bridge, a first combiner and a second combiner; the chassis includes a plurality of output ports and a plurality of input ports, the partition board is disposed inside the chassis and divides the chassis into a first cavity and a second cavity, the first combiner is disposed in the first cavity, and the second combiner is disposed in the second cavity; the output ends of the first combiner and the second combiner are respectively electrically connected to the input end of the bridge, the output end of the bridge is electrically connected to the plurality of output ports on the chassis, the plurality of input ports are electrically connected to the input end of the first combiner, and the first combiner is coupled to the second combiner. By adopting an integrated design, the present invention integrates the chassis, the partition board, the bridge, the first combiner and the second combiner, simplifies the product structure, effectively reduces the volume and weight of the product, enhances the product reliability, and reduces the system loss.

Description

Technical Field

[0001] The present invention relates to the field of communication technologies, and particularly to a multi-system access device. Background Art

[0002] With the rapid development of mobile communication technologies and the popularization of smart terminals, people's lives have entered the 5G era from the 4G era, and the demand for data traffic for services such as mobile payment, real-time video, and webcasting has reached its peak. Currently, since 80% of data traffic occurs indoors, higher requirements are put forward for indoor network coverage. Currently, multi-system access devices are generally used for indoor communication, but currently, there are many internal components in multi-system access devices, and they are generally assembled and welded through RF cables, with many connection nodes, thus resulting in complex internal assembly problems of multi-system access devices. Summary of the Invention

[0003] A multi-system access device provided by an embodiment of the present invention solves the problem of complex internal assembly of multi-system access devices in the prior art.

[0004] The present invention provides a multi-system access device, including: a chassis, a partition, a hybrid coupler, a first combiner, and a second combiner;

[0005] The chassis includes a plurality of output ports and a plurality of input ports, the partition is disposed inside the chassis and divides the chassis into a first cavity and a second cavity, the first combiner is disposed in the first cavity, and the second combiner is disposed in the second cavity;

[0006] The output ends of the first combiner and the second combiner are respectively electrically connected to the input end of the hybrid coupler, the output end of the hybrid coupler is electrically connected to the plurality of output ports on the chassis, the plurality of input ports are electrically connected to the input end of the first combiner, and the first combiner and the second combiner are coupled.

[0007] Optionally, a first cavity wall is disposed on the partition, the first combiner and the second combiner respectively include a plurality of transmission cavities, the plurality of transmission cavities are formed by surrounding through the first cavity wall, the input ends of the plurality of transmission cavities are respectively connected to the plurality of input ports in one-to-one correspondence, and the output ends of the plurality of transmission cavities are electrically connected to the input end of the hybrid coupler;

[0008] Wherein, the area formed by surrounding each of the plurality of transmission cavities through the first cavity wall is different.

[0009] Optionally, a second cavity wall is further provided on the partition board. Each of the plurality of transmission cavities includes a plurality of resonant cavities, and the plurality of resonant cavities are formed by surrounding with the first cavity wall and the second cavity wall. Resonators are respectively arranged in the plurality of resonant cavities.

[0010] Optionally, a plurality of first through holes are provided on the partition board, and the plurality of resonators correspond to the plurality of first through holes one by one and are arranged in the first through holes.

[0011] Optionally, the input end of the bridge includes at least one port;

[0012] The resonant cavity includes at least two common cavities. The port is shared between any two of the common cavities. The at least two common cavities are respectively coupled to the port through a coupling rod or connected through a conductor. Any two of the common cavities are connected through a window or a partition rib;

[0013] The transmission frequency band range of the transmission cavity is determined based on the height of the coupling rod from the resonant cavity, the distance between the coupling rod and the cavity wall, the diameter of the coupling rod, and the depth of the resonator inserted into the through hole.

[0014] Optionally, the resonant cavity includes a first common cavity, a second common cavity, a third common cavity, and a fourth common cavity;

[0015] The port and the first common cavity are capacitively coupled through a coupling rod, the port and the second common cavity are inductively coupled through welding, and the third common cavity and the fourth common cavity are coupled across layers and share the cavity.

[0016] Optionally, it further includes a metal screw, and the metal screw is arranged between any two of the resonant cavities;

[0017] The axial direction of the metal screw is perpendicular to the energy transmission direction between any two of the resonant cavities.

[0018] Optionally, the first end of the resonator is arranged in the first cavity, the second end of the resonator is arranged in the second cavity, and the first end of the resonator is coupled to the second end of the resonator.

[0019] Optionally, a hollowed-out area is provided at the edge position of the partition board, and the common cavity is adjacent to the hollowed-out area.

[0020] Optionally, it further includes a debugging screw. A cross-layer coupling structure is provided on the chassis. The debugging screw is fixedly connected to the chassis through the cross-layer coupling structure, and the debugging screw is coupled to the common cavity.

[0021] The present invention provides a multi-system access device, comprising: a chassis, a partition, a bridge, a first combiner and a second combiner; the chassis includes a plurality of output ports and a plurality of input ports, the partition is disposed within the chassis and divides the chassis into a first cavity and a second cavity, the first combiner is disposed in the first cavity, and the second combiner is disposed in the second cavity; the output ends of the first combiner and the second combiner are respectively electrically connected to the input end of the bridge, the output end of the bridge is electrically connected to the plurality of output ports on the chassis, the plurality of input ports are electrically connected to the input end of the first combiner, and the first combiner is coupled to the second combiner. By adopting an integrated design, the present invention integrates the chassis, the partition, the bridge, the first combiner and the second combiner, simplifies the product structure, effectively reduces the volume and weight of the product, enhances the product reliability, and reduces the system loss. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings required for the description of the embodiments or the prior art will be briefly introduced below.

[0023] Figure 1 FIG. 1 is one of the schematic structural diagrams of a multi-system access device provided in an embodiment of the present invention;

[0024] Figure 2 FIG. 2 is another schematic structural diagram of a multi-system access device provided in an embodiment of the present invention;

[0025] Figure 3 FIG. 3 is yet another schematic structural diagram of a multi-system access device provided in an embodiment of the present invention;

[0026] Figure 4 FIG. 4 is a partial schematic structural diagram of a multi-system access device provided in an embodiment of the present invention;

[0027] Figure 5 FIG. 5 is one of the schematic diagrams of the modules provided in an embodiment of the present invention;

[0028] Figure 6 FIG. 6 is another schematic diagram of the modules provided in an embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0029] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art without creative efforts based on the embodiments of the present application belong to the scope of protection of the present application.

[0030] Before discussing the exemplary embodiments in more detail, it should be noted that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although the flowcharts depict the steps as sequential processes, many of the steps can be implemented in parallel, concurrently, or simultaneously. In addition, the order of the steps can be rearranged. The process can be terminated when its operations are completed, but there can also be additional steps not included in the drawings. The process can correspond to a method, function, procedure, subroutine, subprogram, etc.

[0031] In addition, terms such as "first", "second", etc. may be used herein to describe various directions, actions, steps, or elements, etc., but these directions, actions, steps, or elements are not limited by these terms. These terms are only used to distinguish the first direction, action, step, or element from another direction, action, step, or element. For example, without departing from the scope of the present application, the first speed difference can be the second speed difference, and similarly, the second speed difference can be called the first speed difference. Both the first speed difference and the second speed difference are speed differences, but they are not the same speed difference. The terms "first", "second", etc. should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0032] The present invention provides a multi-system access device, including: a chassis, a partition, a bridge, a first combiner, and a second combiner; the chassis includes a plurality of output ports and a plurality of input ports, the partition is disposed inside the chassis and divides the chassis into a first cavity and a second cavity, the first combiner is disposed in the first cavity, and the second combiner is disposed in the second cavity; the output ends of the first combiner and the second combiner are respectively electrically connected to the input ends of the bridge, the output end of the bridge is electrically connected to the plurality of output ports on the chassis, the plurality of input ports are electrically connected to the input end of the first combiner, and the first combiner is coupled to the second combiner.

[0033] In this embodiment, as Figure 1 , Figure 2 and Figure 3 shown, Figure 1 , Figure 2 and Figure 3 are one of the structural schematic diagrams, the second structural schematic diagram, and the third structural schematic diagram of the multi-system access device provided by the embodiments of the present invention. As Figure 1 , Figure 2 and Figure 3As shown in the figure, a multi-system access device provided by the present invention includes: a chassis 100, a partition 200, a bridge 300, a first combiner 400, and a second combiner 500;

[0034] The chassis 100 includes a plurality of output ports and a plurality of input ports. The partition 200 is disposed inside the chassis 100 and divides the chassis 100 into a first cavity and a second cavity. The first combiner 400 is disposed in the first cavity, and the second combiner 500 is disposed in the second cavity (the relevant part of the distribution description of the first and second combiners needs to be refreshed);

[0035] The output end of the first combiner 400 and the output end of the second combiner 500 are respectively electrically connected to the input end of the bridge 300. The output end of the bridge 300 is electrically connected to a plurality of output ports on the chassis 100. The plurality of input ports are electrically connected to the input end of the first combiner 400. The first combiner 400 is coupled to the second combiner 500.

[0036] In this embodiment, the multi-system access device is a multi-system access platform in the form of a chassis 100. It should be noted that the multi-system access platform is mainly applied in large buildings and municipal facilities that require multi-network system access, such as large exhibition halls, subways, railway stations, airports, government offices, etc. The multi-system access platform realizes the functions of multi-band and multi-signal combining, avoiding repeated investment in the construction of in-building distribution systems, and is an effective means to achieve compatible coverage of multi-network signals.

[0037] In this embodiment, the chassis 100 is an overall rectangular structure, and a plurality of input interfaces and a plurality of output interfaces are provided on its exterior. Among them, the input interfaces can be connected to signals input by external operators. It should be noted that the input interfaces can simultaneously connect input signals provided by multiple different operators, and the frequency band ranges of each input signal can also be different. Exemplarily, the multi-system access platform involved in the present invention covers all existing frequency bands and newly added 5G frequency bands of mobile / radio and television / telecom / unicom, adds the radio and television 700M frequency band, supports the co-construction and sharing access of 1800M and 2100M of telecom and unicom, and supports the co-construction and sharing access of 3500M of telecom and unicom.

[0038] In the chassis 100, there is a partition 200 that divides the internal space of the chassis 100 into two parts. The two sides of the partition 200 are the first cavity and the second cavity respectively. The first combiner 400 and the second combiner 500 are respectively arranged in the first cavity and the second cavity. It should be noted that in this embodiment, the first combiner 400 and the second combiner 500 can be an integral structure, and the installation positions are distinguished by the first combiner 400 and the second combiner 500. By integrating them into an integrated cavity structure and then using the upper and lower covers to achieve shielding and protection, the volume and weight of the multi-system access platform can be effectively reduced.

[0039] In this embodiment, the output ends of the first combiner 400 and the second combiner 500 are respectively electrically connected to the input ends of the hybrid coupler 300. The output end of the hybrid coupler 300 is electrically connected to multiple output ports on the chassis 100. Multiple input ports are electrically connected to the input end of the first combiner 400. The first combiner 400 is coupled to the second combiner 500. It should be noted that in this embodiment, each component is connected by electricity or coupling. Among them, the electrical connection can be achieved by soldering, etc., and no specific limitation is made in this embodiment.

[0040] The above multi-system access platform has the following functions: It supports 12 standard frequency bands and meets the engineering usage requirements. Its typical characteristics are: The input and output connectors are on the same side and in the same orientation, and the distance between the connectors meets the basic spacing requirements for engineering construction and installation. The product is adapted to the installation scenarios of the commonly used 19-inch standard cabinet and wall-mounted installation in engineering. It adopts a back-to-back double-sided structure design: The 12 standard operator frequency bands are distributed in two sub-cavities of the integrated metal cavity according to a specific combination. Specifically, it is divided into side A and side B. The left half of side A and side B forms the first combiner 400, and the right half forms the second combiner 500. The hybrid coupler is distributed on side A or side B of the cavity. The first combiner 400, the second combiner 500, and the hybrid coupler 300 are connected by matching transmission conductors (embedded and shielded in the cavity, on side A) to form a complete product solution. Finally, metal covers are installed on sides A and B of the metal cavity, and slots for waterproof rubber strips are reserved in the cavity. Waterproof rubber strips are embedded between the cavity and the covers to achieve waterproofing.

[0041] The present invention provides a multi-system access device, comprising: a chassis, a partition board, a bridge, a first combiner, and a second combiner; the chassis includes a plurality of output ports and a plurality of input ports, the partition board is disposed inside the chassis and divides the chassis into a first cavity and a second cavity, the first combiner is disposed in the first cavity, and the second combiner is disposed in the second cavity; the output ends of the first combiner and the second combiner are respectively electrically connected to the input ends of the bridge, the output end of the bridge is electrically connected to the plurality of output ports on the chassis, the plurality of input ports are electrically connected to the input ends of the first combiner, and the first combiner is coupled to the second combiner. By adopting an integrated design, the present invention integrates the chassis, the partition board, the bridge, the first combiner, and the second combiner, simplifies the product structure, effectively reduces the volume and weight of the product, enhances the product reliability, and reduces the system loss.

[0042] Optionally, a first cavity wall 420 is provided on the partition board 200. The first combiner 400 and the second combiner 500 respectively include a plurality of transmission cavities 410. The plurality of transmission cavities 410 are formed by surrounding through the first cavity wall 420. The input ends of the plurality of transmission cavities 410 are respectively connected to the plurality of input ports in one-to-one correspondence, and the output ends of the plurality of transmission cavities 410 are electrically connected to the input ends of the bridge 300;

[0043] Wherein, the area formed by surrounding each of the plurality of transmission cavities 410 through the first cavity wall 420 is different.

[0044] Optionally, a second cavity wall 430 is further provided on the partition board 200. Each of the plurality of transmission cavities 410 includes a plurality of resonant cavities 440. The plurality of resonant cavities 440 are formed by surrounding through the first cavity wall 420 and the second cavity wall 430, and resonators 450 are respectively disposed in the plurality of resonant cavities 440.

[0045] Refer to Figure 4 , as Figure 4 shown, Figure 4 is a schematic diagram of a structural part in an embodiment of the present invention. In this embodiment, the first combiner 400 and the second combiner 500 respectively include a plurality of transmission cavities 410. The transmission cavity 410 is a frequency band signal transmission channel. Among them, the frequency band signal transmission channel is formed by surrounding through a plurality of first cavity walls 420. And each of the plurality of transmission cavities 410 includes a plurality of resonant cavities 440. Among them, the resonant cavity 440 is formed by surrounding through the first cavity wall 420 and the second cavity wall 430, and a resonator 450 is disposed in each resonant cavity 440.

[0046] Optionally, a plurality of first through-holes are provided on the partition plate 200, and the plurality of resonators 450 correspond to the plurality of first through-holes one by one and are disposed in the first through-holes.

[0047] The first end of the resonator 450 is disposed in the first cavity, the second end of the resonator 450 is disposed in the second cavity, and the first end of the resonator 450 is coupled to the second end of the resonator 450.

[0048] In this embodiment, a plurality of first through-holes are provided at positions corresponding to the resonators 450 on the partition plate 200. The plurality of resonators 450 correspond to the plurality of first through-holes one by one and are disposed in the first through-holes. By disposing the resonators 450 in the first through-holes, the two ends of the resonators 450 can be respectively located in the first cavity and the second cavity, so that the two combiners can work respectively. It should be noted that the opposite ends of the resonator 450 are connected by coupling.

[0049] Optionally, the input end of the hybrid coupler 300 includes at least one port;

[0050] The resonant cavity 440 includes at least two common cavities. Any two of the common cavities share the port. The at least two common cavities are respectively coupled to the port by a coupling rod or connected by a conductor. Any two of the common cavities are connected by a window or a partition rib. It should be noted that the conductor is specifically a silver-plated copper wire.

[0051] The transmission frequency band range of the transmission cavity 410 is determined based on the height of the coupling rod from the resonant cavity 440, the distance between the coupling rod and the cavity wall, the diameter of the coupling rod, and the depth of the resonator 450 inserted into the through-hole.

[0052] It further includes a metal screw disposed between any two of the resonant cavities 440; the axial direction of the metal screw is perpendicular to the energy transmission direction between any two of the resonant cavities 440. A hollowed-out area is provided at the edge position of the partition plate 200, and the common cavity is adjacent to the hollowed-out area. It further includes an adjustment screw. A second through-hole is provided on the chassis 100, and the adjustment screw is fixedly connected to the chassis 100 through the second through-hole, and the adjustment screw is coupled to the common cavity.

[0053] Optionally, the resonant cavity includes a first common cavity, a second common cavity, a third common cavity, and a fourth common cavity;

[0054] The port and the first common cavity achieve capacitive coupling through a coupling rod, the port and the second common cavity achieve inductive coupling through welding, and the third common cavity and the fourth common cavity are coupled across layers and share a cavity.

[0055] In this embodiment, as Figure 5 shown Figure 5 is one of the schematic diagrams of the modules in the embodiment of the present invention. The present invention provides a realization method of an ultra-wideband coupling structure with low-frequency welding and medium-high-frequency coupling. A single common port can support the frequency band of 700 - 3700 MHz. As Figure 5 shown, in the first combiner, the port and the common cavity 1-1 achieve capacitive coupling through a coupling rod, and the port and the common cavity 1-2 achieve inductive coupling through welding. The common cavities 1-1 and 1-2 then distribute different frequency bands through the next-level common cavity.

[0056] To combine the frequency bands of the cavities on sides A and B, in combiner 1, the common cavity 2-1A and the common cavity 3-1B adopt a cross-layer design to achieve energy conduction. The two cavities cross the A and B sides of the cavity through a hollowing-out method, and are respectively indicated as "common 2-1A" and "common 3-1B" in the cavities on sides A and B.

[0057] Among them, the frequency band of 1735 - 3700 MHz is combined through the first-stage common cavity 1-1, and signal transmission is achieved through capacitive coupling between the port and the common cavity 1-1; the frequency band of 703 - 960 MHz realizes a common port through the common cavity 1-2, and signal transmission is achieved by welding the port and the common cavity 1-2 to the port coupling rod with a silver-plated copper wire. According to the above method, the signals of the frequency bands of 1735 - 3700 MHz and 703 - 960 MHz are both transmitted to the port, realizing ultra-wideband combining. The common 2-1A and the common 3-1B are cross-layer coupled.

[0058] In this embodiment, the ultra-wideband technology of the common cavity 1 in the range of 1735 - 3700 MHz is realized. Specifically, the common cavity 1-1 supports a frequency band bandwidth of 1735 - 3700 MHz, and multiplexes multiple frequency bands with a frequency band span of 1735 - 3700 MHz. The energy conduction between the port and the common cavity 1-1 is realized by coupling through inserting a metal coupling rod into the common cavity 1-1. By adjusting the distance between the common cavity 1-1 and the cavity wall, the height of the coupling rod from the bottom of the cavity, the diameter of the coupling rod, and the depth of insertion into the common cavity 1, the bandwidth adjustment is achieved. A cross-layer coupling design is adopted between the common cavity 2-1A and 3-1B. Conventionally, the coupling between cavities is on the same plane. For example, both the common cavity 1-1 and the common cavity 2-1 are on the A plane. However, the common cavity 2-1A and the cavity 3-1B are vertically spanned from the A plane across the metal layer to the B plane in terms of structure, and the corresponding energy is conducted from the A plane to the B plane. The common cavity 2-1 multiplexes the moving F&A, the unicom UL2100 uplink, and the U Dian LTE-FDD1.8G frequency band on the B plane. To adjust the electrical performance parameters of the path, a metal screw, namely a debugging screw, is usually added between the cavities for debugging. Since the energy transmission direction between the cavity 2-1A and 3-1B is perpendicular to the AB plane, at this time, the axial direction of the conventional debugging screw perpendicular to the AB plane is parallel to the energy transmission direction, and the change in the depth of the debugging screw entering the cavity has little impact on the energy, so the path debugging cannot be realized. To adjust the energy between the two cavities, two metal debugging screws that enter horizontally from the side of the cavity are designed. The axial direction of the screws is perpendicular to the energy transmission direction between the two cavities, realizing a larger range of coupling energy adjustment. This design effectively increases the debugging margin. The form of this debugging screw is not limited to the screw form and can also be other structures, which are not specifically defined in this embodiment.

[0059] In this embodiment, the ultra-wideband technology of the common cavity 1-2 in the range of 703 - 960 MHz is realized. Specifically, the common cavity 1-2 supports a frequency band bandwidth of 703 - 960 MHz, and multiplexes two frequency bands of mobile / radio and television NR700 and mobile / unicom GSM900. The cavity is welded to the port through a silver-plated copper wire to realize energy conduction.

[0060] In the second multiplexer, as Figure 6 shown, Figure 6 is the second schematic diagram of the module in the embodiment of the present invention. The implementation method is the same as that in the above Figure 5 and will not be elaborated in this embodiment.

[0061] The present invention provides a multi-system access device, comprising: a chassis, a partition, a bridge, a first combiner and a second combiner; the chassis includes a plurality of output ports and a plurality of input ports, the partition is disposed inside the chassis and divides the chassis into a first cavity and a second cavity, the first combiner is disposed in the first cavity, and the second combiner is disposed in the second cavity; the output ends of the first combiner and the second combiner are respectively electrically connected to the input ends of the bridge, the output end of the bridge is electrically connected to the plurality of output ports on the chassis, the plurality of input ports are electrically connected to the input end of the first combiner, and the first combiner is coupled to the second combiner. By adopting an integrated design, the present invention integrates the chassis, the partition, the bridge, the first combiner and the second combiner, simplifies the product structure, effectively reduces the volume and weight of the product, enhances the product reliability, and reduces the system loss.

[0062] Note that the above is only the preferred embodiment of the present invention and the applied technical principle. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein. Various obvious changes, re-adjustments and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments. Without departing from the concept of the present invention, more other equivalent embodiments can be included, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A multi-system access device, characterized in that, Comprising: a chassis, a partition board, a bridge, a first combiner, and a second combiner; the chassis includes a plurality of output ports and a plurality of input ports, the partition board is disposed inside the chassis and divides the chassis into a first cavity and a second cavity, the first combiner is disposed in the first cavity, and the second combiner is disposed in the second cavity; the output end of the first combiner and the output end of the second combiner are respectively electrically connected to the input end of the bridge, the output end of the bridge is electrically connected to the plurality of output ports on the chassis, the plurality of input ports are electrically connected to the input end of the first combiner, and the first combiner is coupled to the second combiner; the input end of the bridge includes at least one port; the first combiner and the second combiner respectively include a plurality of transmission cavities, each transmission cavity in the plurality of transmission cavities includes a plurality of resonant cavities, the resonant cavity includes at least two common cavities, the port is shared between any two of the common cavities, the at least two common cavities are respectively coupled to the port through a coupling rod or connected through a conductor, and any two of the common cavities are connected through a window opening or a partition rib; a first cavity wall is disposed on the partition board, the plurality of transmission cavities are formed by surrounding the first cavity wall, the input ends of the plurality of transmission cavities are respectively connected to the plurality of input ports in one-to-one correspondence, and the output ends of the plurality of transmission cavities are electrically connected to the input end of the bridge; a second cavity wall is further disposed on the partition board, the plurality of resonant cavities are formed by surrounding the first cavity wall and the second cavity wall, and resonators are respectively disposed in the plurality of resonant cavities; the area formed by surrounding each transmission cavity in the plurality of transmission cavities by the first cavity wall is different, and a plurality of first through holes are disposed on the partition board, and the plurality of resonators are in one-to-one correspondence with the plurality of first through holes and are disposed in the first through holes; the transmission frequency band range of the transmission cavity is determined based on the height of the coupling rod from the resonant cavity, the distance between the coupling rod and the first cavity wall and the second cavity wall, the diameter of the coupling rod, and the depth of insertion of the resonator into the plurality of first through holes.

2. The multi-system access device according to claim 1, wherein The resonant cavity includes a first common cavity, a second common cavity, a third common cavity, and a fourth common cavity; the port and the first common cavity achieve capacitive coupling through a coupling rod, the port and the second common cavity achieve inductive coupling through welding, and the third common cavity and the fourth common cavity achieve cross-layer common cavity coupling.

3. The multi-system access device according to claim 1, wherein It further includes a metal screw, and the metal screw is disposed between any two of the resonant cavities; the axial direction of the metal screw is perpendicular to the energy transmission direction between any two of the resonant cavities.

4. The multi-system access device according to claim 1, characterized in that, the first end of the resonator is disposed in the first cavity, the second end of the resonator is disposed in the second cavity, and the first end of the resonator is coupled to the second end of the resonator.

5. The multi-system access device according to claim 1, wherein a hollowed-out area is disposed at the edge position of the partition board, and the common cavity is adjacent to the hollowed-out area.

6. The multi-system access device according to claim 5, wherein It further includes a debugging screw. A cross-layer coupling structure is provided on the chassis. The debugging screw is fixedly connected to the chassis through the cross-layer coupling structure, and the debugging screw is coupled to the common cavity.

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