Non-uniform air grid

Abstract

A non-uniform air grid is provided. The present disclosure relates to a housing wall including at least one air grid, the air grid having at least a first layer with a first mesh structure and a second layer with a second mesh structure. The first mesh structure and the second mesh structure are arranged coextensively. The first layer and the second layer are conductively coupled. The first mesh structure includes a plurality of first through-holes. The second mesh structure includes a plurality of second through-holes. The through-holes in the plurality of first through-holes are misaligned compared to the through-holes in the plurality of second through-holes, thereby providing an overall through-hole configuration of the non-uniform air grid.

Description

Technical Field

[0001] The present disclosure generally relates to a housing wall for an electrical or electronic device. Background Art

[0002] Electrical and electronic devices generally must meet CE / EMI (Conformité Européene / Electromagnetic Interference) regulations. These devices need to resist external electromagnetic radiation and also are not allowed to emit electromagnetic radiation beyond the limits specified by international standards in a steadily increasing frequency range. These regulations and requirements are particularly relevant in view of electronic test equipment. Any influence on the measurement results or burdening the test setup with artifacts should be avoided as much as possible. Otherwise, any conclusion drawn based on the device under test inspected by the test equipment may be wrong. For example, misleading conclusions can be drawn in view of whether the device under test (complies with / does not comply with) a known CE / EMI standard.

[0003] Ensuring bidirectional shielding of electromagnetic radiation in the gigahertz (GHz) range that complies with CE / EMI standards while not impairing the heat exchange between the inside and outside of the electronic device housing is difficult. In view of the increasing packaging and power density of electronic products, the relevance of sufficient heat exchange is further enhanced. Sufficient cooling requires dissipating power losses with an air flow rate as high as possible.

[0004] One way to provide a sufficient cooling mechanism is to use air ventilation by using an air grid implemented in the housing wall of the corresponding electronic device. For example, an air grid with holes of relatively large size can be used, such as uniformly distributed honeycomb-shaped holes. However, traditional air grids are limited in their electromagnetic shielding performance. Therefore, in view of the increasing requirements for electromagnetic shielding in applications at higher frequencies (such as in the GHz range), the size of the holes is gradually reduced. Although a mesh structure with geometrically smaller holes is beneficial for electrical shielding, they show a greatly reduced air exchange capacity between the inside and outside of the housing. This can lead to heat accumulation, an increase in dirt deposition inside the device housing, and a serious risk of unwanted resonance noise.

[0005] Therefore, there is a need for a technology that provides sufficient cooling performance while allowing sufficient electromagnetic shielding of electronic devices. Summary of the Invention

[0006] The objective technical problem to be solved can be regarded as including overcoming or at least reducing the disadvantages according to the prior art. This problem is solved by the subject matter of the independent claims. Further embodiments are indicated in the dependent claims and the following description, each of which alone or in combination can represent various aspects of the present disclosure.

[0007] The following presents an overview of certain embodiments disclosed herein. It should be understood that these aspects are presented merely to provide a brief overview of these embodiments and are not intended to limit the scope of the present disclosure. The present disclosure may cover various aspects that may not be set forth below.

[0008] According to one aspect, there is provided a housing wall including at least one air grid, the air grid having at least a first layer with a first mesh structure and a second layer with a second mesh structure. The first mesh structure and the second mesh structure are arranged coextensively. The first layer and the second layer are conductively coupled. The first mesh structure includes a plurality of first through-holes. The second mesh structure includes a plurality of second through-holes. The plurality of first through-holes are misaligned compared to the through-holes in the plurality of second through-holes, thereby providing an overall through-hole configuration of the non-uniform air grid.

[0009] The electrical connection between the layers provides the possibility of electrically shielding the cross-sectional surface area of the air grid. The non-uniformity of the through-holes in different layers improves the electromagnetic shielding performance. The non-uniformity between the two mesh structures results in an inconsistent and irregular overall through-hole configuration. Due to the irregularity caused by the non-uniform through-hole configuration, the penetration of resonant electromagnetic waves and their higher harmonics is suppressed. In particular, the non-uniform through-hole configuration ensures the provision of a barrier for electromagnetic waves, especially in the GHz range. Therefore, the occurrence of standing waves is greatly reduced. At the same time, since the total cross-sectional opening area can still be large and the individual irregular through-holes still provide a sufficient diameter for effective air exchange, sufficient air ventilation for effectively dissipating the heat energy of the electronic device is achieved.

[0010] In other words, in view of the opposite sides with respect to the air grid, the air ventilation mechanism is specifically provided by the air grid, thereby ensuring air exchange between these opposite sides.

[0011] The overall through-hole configuration of the air grid can also be aperiodic or chaotic. In particular, the overall through-hole configuration of the air grid can be configured such that it does not exhibit repetition.

[0012] Optionally, the through-holes of the first mesh structure can be parallelly oriented and shifted with respect to the corresponding extension axes compared to the through-holes of the second mesh structure. In other words, the lateral extension direction of the first mesh structure is the same as the lateral extension direction of the coextensive second mesh structure. However, the extension axes of the through-holes of the two mesh structures do not coincide but are shifted relative to each other according to the top view of the mesh structures. In other words, in view of the corresponding extension axes of the through-holes, at least some of the through-holes of the first mesh structure are not coaxially aligned with any of the through-holes of the second mesh structure. Preferably, in view of the corresponding extension axes, even a single through-hole of the first mesh structure is not coaxially aligned with any of the through-holes of the second mesh structure.

[0013] In other words, a coextensive arrangement can be regarded as an arrangement of a first layer having a first mesh structure and a second layer having a second mesh structure, wherein the corresponding surface-extending structures of each layer are arranged parallel to each other. However, it is not required that these layers be flat. Instead, these layers can also include curved surfaces arranged side by side.

[0014] The through-holes of the first mesh structure differ from the through-holes of the second mesh structure in at least one of cross-sectional area, shape, and perimeter. In particular, these differences can be observed in a top view of the mesh structure. For example, the first mesh structure can have through-holes with a triangular cross-sectional shape. Then, the second mesh structure can have through-holes with a circular cross-sectional shape or a different cross-sectional shape. In addition, the through-holes can be distinguished from each other in terms of opening size.

[0015] In addition, at least one of the cross-sectional area, shape, and perimeter of the through-holes of any mesh structure can also vary between each mesh structure extending laterally throughout.

[0016] According to another aspect, the first layer and the second layer can be conductively coupled at a plurality of connection points that establish electrical connections along the surface. Thus, a perforated structure that substantially represents a Faraday cage is established, which provides good shielding performance. The connection points distributed over the entire surface area of the first layer and the second layer increase the mechanical strength. In particular, the stiffness of the shielding wall is improved. Therefore, advantages are obtained in terms of weight reduction and resource conservation.

[0017] The first mesh structure can include a pattern of through-holes having a first shape (cross-sectional shape). The second mesh structure can include a pattern of through-holes having a second shape. The first shape and the second shape can be determined according to a top view of the mesh structure. The first shape and the second shape can be the same as each other, or can be different from each other. Preferably, the first shape and the second shape are different. The different shapes of the through-holes result in irregularity in the overall through-hole configuration of the air grid. Thus, periodicity of the through-holes can be avoided.

[0018] Optionally, the second mesh structure can include a through-hole pattern that represents a non-integer multiple of the through-hole pattern of the first mesh structure. In other words, the (cross-sectional) size of the through-holes of the first mesh structure can be a non-integer multiple of the (cross-sectional) size of the through-holes of the second mesh structure. In addition, the extension axes of the through-holes of the first mesh structure can be positioned according to a non-integer distance from the distance between the extension axes of the second mesh structure. This improves the non-uniformity of the overall through-hole configuration of the air grid.

[0019] The first layer and the second layer can be coupled at least in part via welding. The layers can be welded together in a very effective manner at various connection points. Thus, the manufacturing efficiency is high.

[0020] In particular, at least one of gas-phase welding, ultrasonic welding, and conductive adhesive bonding can be used to couple the first layer and the second layer. Thus, high mechanical strength can be achieved, thereby providing a rigid housing wall including an air grid.

[0021] Optionally, the housing wall has a thickness of 5 mm or more, particularly 7 mm or more, and further particularly 10 mm or more along the extension axis of the through-holes of the mesh structure. The thickness of the housing wall results in an extension length of the through-holes. This provides a tunneling effect that strongly suppresses the propagation of electromagnetic waves. In particular, combining the extension length of the through-holes with polygons provides additional electromagnetic wave suppression.

[0022] The first mesh structure and the second mesh structure can at least partially include a conductive material. Thus, the shielding effect against electromagnetic radiation is improved.

[0023] In other words, in addition to the conductive coupling between the first layer and the second layer, the mesh structure of the separation layer can at least partially include a conductive material. Thus, the conductive material can be provided in a spatially distributed manner. Therefore, an electrical shielding effect that is spatially distributed along the mesh structure and each layer can also be provided.

[0024] The electrical shielding of the housing wall can be configured to reduce the penetration of electromagnetic waves having a frequency of 1 GHz or higher, particularly 5 GHz or higher, preferably 10 GHz or higher.

[0025] In other words, the cross-sectional openings of the through-holes of the mesh structure can be selected such that the cross-sectional openings of the through-holes of the overall through-hole configuration result in a reduction in the penetration of electromagnetic waves having a specific frequency. In particular, the distance between the opposing sidewalls of the corresponding through-holes can be selected such that the cross-sectional surface area of the corresponding through-holes is restricted and a reduction in electromagnetic waves is ensured.

[0026] The through-holes of the first mesh structure can include a quasi-polygonal basic shape. The through-holes of the second mesh structure can include a quasi-honeycomb basic shape. Thereby, the non-uniformity of the overall through-hole configuration of the air grid is improved.

[0027] Furthermore, for each mesh structure, at least some of the through-holes can include a shape that deviates from the shape typically possessed by the remaining through-holes of the same mesh structure.

[0028] The shape of the through-holes in a particular mesh structure does not need to remain constant. At least one of the first mesh structure and the second mesh structure can be irregular. For example, the first mesh structure can include through-holes that generally include a particular shape (such as a honeycomb (cross-sectional) shape). Other through-holes of the same first mesh structure can then include shapes representing a distorted honeycomb (quasi-honeycomb). Thus, for each mesh structure, each through-hole or at least some of the through-holes can generally have individual shapes and / or dimensions and / or perimeters. Thus, the irregularity of each mesh structure is improved on an individual basis, which also results in an additional non-uniformity of the overall through-hole configuration of the air grid.

[0029] As an option, at least one of the first mesh structure and the second mesh structure can include through-holes whose axes of extension can be distorted with respect to the axes of extension of the remaining through-holes of the corresponding mesh structure. This means that the side walls of at least some of the through-holes are at least partially not perpendicular to the lateral extension of the mesh structure and are inclined in this regard.

[0030] In fact, the non-uniformity of the overall through-hole configuration can be related to the misaligned axes of extension of the through-holes of different mesh structures. According to the top view of the through-holes, it can also be related to the cross-sectional areas of the through-holes that at least partially do not match (are misaligned). In addition, the non-uniformity can be related to the different shapes of the through-holes and / or the different dimensions of the through-holes with respect to their cross-sectional openings. In addition, the through-holes of each mesh structure can even be different from the other through-holes of the same mesh structure. Thus, an overall through-hole configuration of a non-uniform air grid is provided, greatly reducing the penetration of resonant electromagnetic waves and their higher harmonics.

[0031] In addition, the first layer and the second layer can include different thicknesses. For example, the first layer can have a first thickness, and the second layer can have a second thickness. Then, the second thickness can be greater than the first thickness. This results in an additional irregularity of the overall through-hole configuration of the air grid.

[0032] According to another option, the air grid can also include additional layers containing mesh structures with through-holes. Thus, additional irregularities can be introduced into the system. For example, the overall through-hole configuration of the air grid can also include three layers, each layer having through-holes that generally include (cross-sectional) shapes (circular / honeycomb / square) that distinguish the layers.

[0033] Any of the above-mentioned aspects can be combined with any other aspect(s), provided that a conceivable development is provided to the person skilled in the art accordingly. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] When combined with the drawings, the above aspects and further advantages of the claimed subject matter will be better understood. In the drawings,

[0035] Figure 1 is a schematic diagram of an electronic device including a housing wall,

[0036] Figure 2 is a schematic diagram of a part of an overall through-hole configuration of an air grid,

[0037] Figure 3 is a schematic diagram of a part of an overall through-hole configuration of an air grid according to a front view,

[0038] Figure 4 is a schematic diagram of a part of an overall through-hole configuration of an air grid according to a rear view, and

[0039] Figure 5 is a schematic diagram of a part of an overall through-hole configuration of an air grid according to a cross-sectional side view. Detailed Description of the Invention

[0040] The following detailed description is presented in conjunction with the accompanying drawings, in which like reference numerals refer to like elements and which is intended as a description of various embodiments of the disclosed subject matter and is not intended to represent the only embodiments. Each embodiment described in this disclosure is provided by way of example or illustration only and should not be construed as being more preferred or advantageous than other embodiments. The illustrative examples provided herein are not intended to be exhaustive or to limit the claimed subject matter to the precise forms disclosed. Various modifications to the described embodiments will be apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of the described embodiments. Accordingly, the described embodiments are not limited to the embodiments shown, but are to be accorded the widest scope consistent with the principles and features disclosed herein.

[0041] All features disclosed herein with respect to example embodiments and / or the drawings may be combined alone or in any sub-combination with the features of aspects of this disclosure including their preferred embodiments, provided that the resulting feature combinations are reasonable to those skilled in the art.

[0042] For the purposes of this disclosure, the phrase "at least one of A, B, and C" refers, for example, to (A), (B), (C), (A and B), (A and C), (B and C), or (A, B, and C), including all further possible combinations when more than three elements are listed. In other words, the term "at least one of A and B" generally refers to "A and / or B", i.e., A alone, B alone, or A and B.

[0043] Figure 1It is a schematic diagram of an electronic device 10 including a housing 12. The housing 12 includes a housing wall 14. The housing wall 14 includes an air grid 16 for providing air exchange between the internal space surrounded by the housing 12 and the external space. Thus, the heat energy (heat) generated by the internal components of the electronic device 10 can be effectively transmitted to the external space.

[0044] Figure 2 It is a schematic diagram of a part of the overall through-hole configuration 30 of the air grid 16. There is a first layer 18 including a first mesh structure 20. In addition, there is a second layer 22 including a second mesh structure 24. The first layer 18 and the second layer 22 are arranged coextensively.

[0045] According to this embodiment, the first mesh structure 20 includes first-type through-holes 26. The second mesh structure 24 includes second-type through-holes 28. The first-type through-holes 26 are different from the second-type through-holes 28. In addition, the first-type through-holes 26 and the second-type through-holes are not any integer of each other in terms of their specific shapes, dimensions (cross-sectional opening areas), or perimeters.

[0046] In this embodiment, the first-type through-holes 26 have a quadrilateral shape, more specifically a square shape, and the second-type through-holes 28 have a honeycomb shape.

[0047] In addition, the first mesh structure 20 and the second mesh structure 24 are arranged to achieve a non-uniform overall through-hole configuration 30 of the air grid 16. In other words, the extension axes of the different types of through-holes 26, 28 are neither coaxially aligned nor arranged at a specific constant distance. In addition, the extension axes of a specific mesh structure are not arranged at an integer distance representing the extension axis distance of the remaining mesh structure. This results in the overall through-hole configuration 30 of the air grid 16 being non-periodic and even chaotic. Therefore, compared with the case of a single type of through-hole or an air grid 16 showing a periodic overall through-hole configuration 30, the shielding of the housing wall 14 against the penetration of resonant electromagnetic waves and high-order harmonics is improved.

[0048] Figure 3 It is a schematic diagram of a part of the overall through-hole configuration 30 of the air grid 16 according to the front view. Figure 4 It is a schematic diagram of a part of the overall through-hole configuration 30 of the air grid 16 according to the rear view.

[0049] Both the first layer 18 and the second layer 22 are made of a metallic material. The two layers 18, 22 are coextensively aligned. The through-holes 26, 28 of each of the layers 18, 22 include different through-hole lengths, which can be seen best as Figure 4 shown. The length of the through-holes 28 of the second layer 22 is longer than the length of the through-holes 26 of the first layer 18. Therefore, the second layer 22 is thicker than the first layer 18.

[0050] In addition, the first layer 18 and the second layer 22 are coupled to each other at respective connection points 32. Welding is applied in this regard. In particular, vapor phase bonding can be employed. Some additional suitable coupling techniques include ultrasonic welding and the use of conductive adhesives. Since the layers 18, 22 are made of metallic materials, a plurality of connection points 32 between the first layer and the second layer 18, 22 establish an electrical connection along the surface. Thus, since the connection points 32 represent a Faraday cage, the shielding against electromagnetic radiation is further improved.

[0051] In addition, as best visible in the rear view according to Figure 4 , at least some of the through-holes 28 of the second mesh structure 24 vary in shape with respect to the remaining through-holes 28 of the same second mesh structure 24. In other words, the mesh structure 24 is irregular. Of course, generally, two or all of the mesh structures 20, 24 can be irregular. The non-uniformity of the air grid 16 is further improved by providing the through-holes 26, 28. The through-holes 26 and 28 generally have a similar shape (here, a honeycomb shape), but they are different from each other based on personal views. This can be easily provided by twisting the corresponding mesh structure 24 before the layers 18, 22 are coupled to each other.

[0052] Figure 5 is a schematic view of a part of the overall through-hole configuration 30 of the air grid 16 according to a cross-sectional side view.

[0053] The air grid 16 has a total thickness TTOT along the extension axes of the through-holes 26, 28. The total thickness can be, in particular, 5 mm or greater, preferably 7 mm or greater, and further preferably 10 mm or greater.

[0054] The first layer 18 includes a mesh structure 20 having through-holes 26, and the through-holes 26 have a length along their extension axis 34 corresponding to a first thickness T1 of the first layer 18. The second layer 22 includes a mesh structure 24 having through-holes 28, and the through-holes 28 have a length along their extension axis 36 corresponding to a second thickness T2 of the second layer 22. According to this embodiment, the first thickness T1 is different from the second thickness T2. In particular, the first thickness T1 is less than the second thickness T2. Thus, the non-uniformity of the air grid 16 is further improved.

[0055] As shown, the extension axes 34, 36 of the through-holes 26, 28 of the different layers 18, 22 are not aligned with each other, which further improves the irregularity of the overall through-hole configuration 30 of the air grid 16.

[0056] This application may refer to quantities and numbers. Unless otherwise specified, these quantities and numbers should not be regarded as restrictive, but rather exemplary of possible quantities or numbers associated with this application. Also in this regard, this application may use the term "plurality" to denote a quantity or number. In this regard, the term "plurality" means any number greater than one, for example, two, three, four, five, etc. The terms "about", "approximately", "close to", etc. indicate plus or minus 5% of the stated value.

[0057] Although the present disclosure has been illustrated and described with respect to one or more embodiments, equivalent changes and modifications will occur to others of ordinary skill in the art upon reading and understanding this specification and the drawings. Additionally, although a particular feature of the present disclosure may be disclosed with respect to only one of several embodiments, as may be desired and preferred for any given or particular application, that feature may be combined with one or more other features of the other embodiments.

Claims

1. A housing wall for a housing of an electrical device or an electronic device, the housing wall comprising: at least one air grid, the air grid having at least a first layer with a first mesh structure and a second layer with a second mesh structure, wherein the first mesh structure and the second mesh structure at least partially comprise a conductive material, wherein the first mesh structure and the second mesh structure are arranged coextensively, wherein the first layer and the second layer are conductively coupled at a plurality of connection points that establish an electrical connection along the surface, wherein the first mesh structure comprises a plurality of first through-holes, and wherein the second mesh structure comprises a plurality of second through-holes, wherein, compared to the through-holes of the second mesh structure, the through-holes of the first mesh structure are oriented parallel and displaced with respect to a corresponding extension axis, wherein the through-holes of the first mesh structure differ from the through-holes of the second mesh structure in at least one of cross-sectional area, shape, and perimeter, wherein the through-holes in the plurality of first through-holes are misaligned compared to the through-holes in the plurality of second through-holes, thereby providing a non-uniform overall through-hole configuration of the air grid, wherein the overall through-hole configuration is irregular, and wherein the housing wall provides electrical shielding for electromagnetic waves having a frequency of 1 GHz or higher, wherein the housing wall has a thickness of 5 mm or more along the extension axis of the through-holes of the mesh structure, wherein the first mesh structure comprises a pattern of through-holes having a first shape, wherein the second mesh structure comprises a pattern of through-holes having a second shape, wherein the first shape and the second shape are the same, and wherein the second mesh structure comprises a pattern of through-holes representing a non-integer multiple of the pattern of through-holes of the first mesh structure.

2. The outer shell wall according to claim 1, wherein, The first layer and the second layer are at least partially coupled by bonding or conductive adhesive connection.

3. The outer shell wall according to claim 2, wherein, The first layer and the second layer are at least partially coupled by at least one of vapor phase bonding and ultrasonic welding.

4. The outer shell wall according to claim 1, wherein The first layer has a first thickness, wherein the second layer has a second thickness, and wherein the second thickness is greater than the first thickness.

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