Product cutting method and device

Abstract

The present invention provides a product cutting method and device, wherein the method comprises: pre-cutting a film base for fixing a product module to be cut, and making the pre-cut position correspond to the actual cutting position of the product module to be cut; pasting and fixing the product module to be cut on the film base; cutting the product module to be cut on the film base by an external cutting device, and obtaining the cut product monomer. The above invention can avoid residual glue on the side wall of the product, reduce the lateral stress of the product during the cutting process, avoid displacement, and thus improve the cutting quality of the product.

Description

Technical Field

[0001] The present invention relates to the technical field of product processing, and more specifically, to a product cutting method and device. Background Art

[0002] At present, in the production and processing of small-sized products, the entire plate or the entire strip of products is usually processed at the same time. After all the processes are completed, each independent product is obtained by cutting with a blade. In the cutting process, in order to ensure the stability of the product, the usual practice is to fix the entire strip of product on a film or a vacuum base in advance before cutting.

[0003] However, in the above-mentioned film fixing method, the blade will contact residual glue during the cutting process, and the residual glue will adhere to the blade during the rotation of the blade. When the blade cuts and rubs the side wall of the product, the residual glue will adhere to the side wall of the product, resulting in residual glue on the side wall of the product. In addition, because the product will be fixed by a film or vacuum adsorption base before cutting, and then cut by the blade, the fixation is to offset or control the outward extrusion force applied to the product by the blade during cutting. However, for some products, due to design reasons, the fixing effect of the product is poor, so the product will be displaced during cutting, causing cutting abnormalities.

[0004] For example, for smaller products, due to their smaller area, when the adhesion force per unit area of ​​the film is the same, the smaller the area, the smaller the adsorption force, and the product is prone to displacement during the cutting process. For solder ball array packaging products, since only a part of the sphere is confined to the film, the adsorption area is also limited, and cutting displacement is prone to occur. In addition, for thicker products, the blade cutting force requirements are higher. Due to insufficient cutting force, the blade will exert a greater extrusion force on the product during cutting, and in severe cases, the product will be broken, affecting the molding quality of the product.

[0005] Therefore, there is an urgent need for a product cutting method that can achieve reliable, stable and high-quality cutting operations for multiple types of products. Summary of the invention

[0006] In view of the above problems, the purpose of the present invention is to provide a product cutting method and device to solve the problems that when cutting existing products, the colloid of the film base is easily adhered to the blade, resulting in residual glue on the side wall of the product, and the product is small in size, large in thickness, and has a small contact area with the film base, resulting in poor fixing effect of the product during the cutting process, affecting the product cutting quality, etc.

[0007] The product cutting method provided by the present invention comprises: pre-cutting a film base for fixing a product module to be cut, and making the pre-cut position correspond to the actual cutting position of the product module to be cut; pasting and fixing the product module to be cut on the film base; cutting the product module to be cut on the film base by an external cutting device, and obtaining the cut product monomer.

[0008] In addition, an optional technical solution is that the adhesive film base includes a substrate layer and an adhesive layer arranged on the substrate layer; and the cutting depth of the pre-cutting process is not less than the thickness of the adhesive layer.

[0009] In addition, an optional technical solution is that the process of cutting the product module to be cut on the film base by an external cutting device includes: performing at least one cutting process on the product module to be cut.

[0010] In addition, an optional technical solution is that when the size of the product module to be cut is less than 3*3mm 2 When cutting, the product module to be cut is cut at least twice, and the product monomer is obtained.

[0011] In addition, an optional technical solution is that when the thickness of the product module to be cut is greater than 3 mm, the product module to be cut is cut at least twice to obtain a single product.

[0012] In addition, an optional technical solution is that when the product module to be cut is a solder ball array package product, the product module to be cut is cut at least twice to obtain a product monomer.

[0013] In addition, an optional technical solution is to cut out a positioning contour line corresponding to the outer contour of the product module to be cut while pre-cutting the bottom layer of the film; the product module to be cut and the film base are positioned by the positioning contour line.

[0014] In addition, an optional technical solution is to set at least one fool-proof structure on the film base; wherein the fool-proof structure includes color imprints, notches or protrusions; and the product module to be cut and the film base are positioned by the fool-proof structure.

[0015] In addition, an optional technical solution is that at least two positioning columns are provided on the film base, and positioning holes corresponding to the positions of the positioning columns are provided on the product module to be cut; or, at least two positioning holes are provided on the film base, and positioning columns corresponding to the positions of the positioning holes are provided on the product module to be cut; the product module to be cut and the film base are positioned by the cooperation of the positioning columns and the positioning holes.

[0016] On the other hand, the present invention also provides a product cutting device, comprising: a pre-cutting unit, used to pre-cut the film base used to fix the product module to be cut, and make the pre-cutting position correspond to the actual cutting position of the product module to be cut; a positioning unit, used to stick and fix the product module to be cut on the film base; a cutting unit, used to cut the product module to be cut on the film base through an external cutting device, and obtain the cut product monomer.

[0017] By using the above-mentioned product cutting method and device, before pasting and fixing the product, the film base used to fix the product module to be cut is pre-cut, and then the product module to be cut is pasted and fixed on the film base. The pre-cut position corresponds to the actual cutting position of the product module to be cut. At this time, when the product module to be cut on the film base is cut by an external cutting device, the residual glue rolled out from the side wall can be reduced, the residual glue on the side wall of the product can be prevented, and the product yield can be improved.

[0018] In order to achieve the above and related purposes, one or more aspects of the present invention include the features that will be described in detail later. The following description and the accompanying drawings describe some exemplary aspects of the present invention in detail. However, these aspects indicate only some of the various ways in which the principles of the present invention can be used. In addition, the present invention is intended to include all these aspects and their equivalents. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] By referring to the following description in conjunction with the accompanying drawings, and with a more comprehensive understanding of the present invention, other objects and results of the present invention will become more apparent and easy to understand. In the accompanying drawings:

[0020] Figure 1 is a flow chart of a product cutting method according to an embodiment of the present invention;

[0021] Figure 2 Schematic diagram of the structure of a product cutting method according to an embodiment of the present invention.

[0022] Markings in the accompanying drawings: film base 1, pre-cut position 11, cutting product module 2, actual cutting position 21.

[0023] The same reference numerals throughout the drawings indicate similar or corresponding features or functions. DETAILED DESCRIPTION

[0024] In the following description, for the purpose of illustration, in order to provide a comprehensive understanding of one or more embodiments, many specific details are set forth. However, it is apparent that these embodiments may also be implemented without these specific details. In other examples, for ease of describing one or more embodiments, known structures and devices are shown in the form of block diagrams.

[0025] In the description of the present invention, it is to be understood that the orientations or positional relationships indicated by the following terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc. are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the content or structure of the present invention.

[0026] In order to solve the problems that, when cutting products, the colloid of the film base is easily adhered to the blade, resulting in residual glue on the side wall of the product, and the product is small in size, large in thickness, and has a small contact area with the film base, resulting in poor fixing effect of the product during the cutting process, so that the product will be displaced during cutting, or the product will be broken, causing cutting abnormalities and affecting the cutting quality of the product. The present invention provides a product cutting method. Before the product is pasted and fixed, the film base used to fix the product module to be cut is pre-cut, and then the product module to be cut is pasted and fixed on the film base, and then the product is half-cut or fully cut, so as to reduce the residual glue rolled out at the side wall, improve the product yield, release part of the stress inside the product, reduce the cutting displacement of the product, and improve the cutting quality of the product.

[0027] In order to describe the product cutting method and device of the present invention in detail, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0028] Figure 1 A flow chart of a product cutting method according to an embodiment of the present invention is shown.

[0029] like Figure 1 As shown, the product cutting method of the embodiment of the present invention mainly includes the following steps:

[0030] S100: Pre-cutting the adhesive film base for fixing the product module to be cut, and making the pre-cutting position correspond to the actual cutting position of the product module to be cut.

[0031] Among them, multiple fixing positions for the product modules to be cut can be set on the film base, and before fixing the product modules to be cut, each fixing position is first pre-cut, and the pre-cut position corresponds to the actual cutting position of the product module to be cut. Through the processing of this step, when the product module to be cut is actually cut, the adhesive layer on the film base below it has been cut and thinned in advance, which can prevent the blade from bringing out the residual adhesive and attaching it to the side wall of the product, thereby improving the yield of the product.

[0032] In the product cutting method of the present invention, the film base further includes a substrate layer and an adhesive layer arranged on the substrate layer. Therefore, when pre-cutting the film base, it is necessary to ensure that the cutting depth of the pre-cutting treatment is not less than the thickness of the adhesive layer, so as to effectively prevent residual glue from appearing on the side wall of the product.

[0033] S200: The product module to be cut is pasted and fixed on the film base;

[0034] When the product module to be cut is pasted and fixed on the film base, the position of the product module to be cut and the pre-cut film base needs to be accurately positioned to ensure that the actual cutting position of the product module to be cut corresponds to the pre-cut position.

[0035] Specifically, when positioning the product module to be cut and the film base, the bottom layer of the film can be pre-cut while a positioning contour line corresponding to the outer contour of the product module to be cut can be cut by a blade. Then, when pasting the product module to be cut, the two can be positioned by the positioning contour line, and the positioning contour line can be formed by slight cutting on the surface.

[0036] In addition, the positioning of the product module to be cut can be achieved by providing at least one fool-proof structure on the film base; wherein the fool-proof structure may include color imprints, notches, protrusions or rings, etc.; the product module to be cut and the film base are positioned by the fool-proof structure.

[0037] In addition, positioning between the two can be achieved by providing other types of positioning structures on the film base and the product module to be cut; for example, at least two positioning columns can be provided on the film base, and positioning holes corresponding to the positions of the positioning columns can be provided on the product module to be cut; or, at least two positioning holes can be provided on the film base, and positioning columns corresponding to the positions of the positioning holes can be provided on the product module to be cut; the product module to be cut and the film base are positioned by the cooperation of the positioning columns and the positioning holes.

[0038] S300: Cut the product module to be cut on the film base through an external cutting device, and obtain the cut product monomer.

[0039] In this step, the process of cutting the product module to be cut on the film base by an external cutting device includes at least one cutting process, that is, the product module to be cut is cut at least once. Too few cutting times may cause the product module to be cut to be subjected to excessive extrusion pressure and breakage, while too many cutting times will affect the cutting efficiency and increase the cutting cost.

[0040] In a specific embodiment of the present invention, when the size of the product module to be cut is less than 3*3mm 2When , it indicates that the size of the product module to be cut is small, and its contact area with the film base is also small, which may easily cause the product to shift during the cutting process. In this case, the product module to be cut can be cut at least twice. For example, the product module to be cut can be half-cut first, and then fully cut again on the basis of the half-cut to finally obtain the product monomer.

[0041] In another specific embodiment of the present invention, when the thickness of the product module to be cut is greater than 3 mm, it indicates that the thickness of the product module to be cut is relatively large. If it is only cut once, a large cutting force needs to be applied, which may easily cause the product to break. In this case, the product module to be cut may also be cut at least twice to finally obtain a single product.

[0042] In another specific embodiment of the present invention, when the product module to be cut is a solder ball array packaged product, due to the presence of the solder ball array, when it is adhered to the adhesive film base, only a part of the solder ball is trapped in the adhesive layer, so the adsorption area is small, and it is also easy to cause the product to shift during the cutting process. In this case, the product module to be cut can also be cut at least twice to finally obtain the product unit.

[0043] It should be noted that the specific number of cuts of the product module to be cut can be flexibly adjusted according to the size, thickness and cutting requirements of the product.

[0044] As a specific example, FIG. 2 shows a schematic diagram of a product cutting method according to an embodiment of the present invention. Figure 2 As shown, the product cutting method of this embodiment includes:

[0045] Step 1: two fixing positions of the product modules to be cut are arranged on the film base 1, and the fixing positions are pre-cut respectively to form a plurality of regularly distributed pre-cut positions 11 on the film base 1;

[0046] Step 2: Paste and fix the product module 2 to be cut on two fixing positions respectively, and ensure that the actual cutting position 21 of the product module 2 to be cut corresponds to the pre-cutting position 11;

[0047] Step 3: Perform at least one cutting process on each of the two to-be-cut product models 2 to form a plurality of product monomers.

[0048] Corresponding to the above-mentioned product cutting method, the present invention also provides a product cutting device, which can implement the steps in the above-mentioned product cutting method.

[0049] Specifically, the product cutting device of the embodiment of the present invention may include: a pre-cutting unit, used to pre-cut the film base used to fix the product module to be cut, and make the pre-cutting position correspond to the actual cutting position of the product module to be cut; a positioning unit, used to stick and fix the product module to be cut on the film base; a cutting unit, used to cut the product module to be cut on the film base through an external cutting device, and obtain the cut product monomer.

[0050] Among them, the embodiment of the product cutting device can refer to the description in the above-mentioned product cutting method embodiment, and will not be repeated here one by one.

[0051] By using the above-mentioned product cutting method and device, before the product is pasted and fixed, the adhesive film base used to fix the product module to be cut is pre-cut, and it is ensured that the pre-cut position corresponds to the actual cutting position of the product, which can reduce the residual glue rolled out at the side wall and improve the product yield; then, the product module to be cut is pasted and fixed on the adhesive film base, and the product is cut at least once, and part of the stress inside the product can be gradually released through multiple cuts, so that the product's cutting force requirements for the blade become lower, thereby ensuring that the blade's cutting force is sufficient to cut through the product and avoid crushing. In addition, the thinner the product, the smaller the force it is subjected to during cutting, and the smaller the extrusion force on the product, which is conducive to reducing the cutting displacement of the product and improving the cutting quality of the product.

[0052] The product cutting method and device according to the present invention are described above by way of example with reference to the accompanying drawings. However, those skilled in the art should understand that various improvements can be made to the product cutting method and device proposed by the present invention without departing from the content of the present invention. Therefore, the protection scope of the present invention should be determined by the content of the attached claims.

Claims

1. A product cutting method, characterized in that: include: Pre-cutting the adhesive film base for fixing the product module to be cut, and making the pre-cutting position correspond to the actual cutting position of the product module to be cut; Adhere and fix the product module to be cut on the film base; Cutting the product module to be cut on the film base by an external cutting device, and obtaining the cut product monomer; The adhesive film base comprises a substrate layer and an adhesive layer arranged on the substrate layer; The cutting depth of the pre-cutting process is not less than the thickness of the adhesive layer; The process of cutting the product module to be cut on the film base by the external cutting device includes: Performing at least one cutting process on the product module to be cut; While pre-cutting the adhesive film base, cutting out a positioning contour line corresponding to the outer contour of the product module to be cut; The to-be-cut product module and the adhesive film base are positioned by the positioning contour line.

2. The product cutting method according to claim 1, characterized in that: When the size of the product module to be cut is less than 3*3mm 2 When the product module to be cut is cut at least twice, the product monomer is obtained.

3. The product cutting method according to claim 1, characterized in that: When the thickness of the product module to be cut is greater than 3 mm, the product module to be cut is cut at least twice to obtain the product monomer.

4. The product cutting method according to claim 1, characterized in that: When the product module to be cut is a solder ball array package product, the product module to be cut is cut at least twice to obtain the product monomer.

5. The product cutting method according to claim 1, characterized in that: At least one fool-proof structure is provided on the film base; wherein the fool-proof structure includes a color imprint, a notch or a protrusion; The product module to be cut and the film base are positioned by the foolproof structure; The foolproof structure replaces the positioning contour line setting to achieve positioning between the product module to be cut and the film base.

6. The product cutting method according to claim 1, characterized in that: At least two positioning posts are arranged on the film base, and positioning holes corresponding to the positions of the positioning posts are arranged on the product module to be cut; or, At least two positioning holes are arranged on the adhesive film base, and positioning posts corresponding to the positions of the positioning holes are arranged on the product module to be cut; The product module to be cut and the film base are positioned by the cooperation between the positioning column and the positioning hole; The positioning column and the positioning hole replace the positioning contour line to achieve positioning between the to-be-cut product module and the film base.

7. A product cutting device, characterized in that: include: A pre-cutting unit, used for pre-cutting the adhesive film base for fixing the product module to be cut, and making the pre-cutting position correspond to the actual cutting position of the product module to be cut; A positioning unit, used for sticking and fixing the product module to be cut on the film base; A cutting unit, used for cutting the product module to be cut on the film base through an external cutting device, and obtaining the cut product monomer; The adhesive film base comprises a substrate layer and an adhesive layer arranged on the substrate layer; The cutting depth of the pre-cutting process is not less than the thickness of the adhesive layer; The process of cutting the product module to be cut on the film base by the external cutting device includes: Performing at least one cutting process on the product module to be cut; While pre-cutting the adhesive film base, cutting out a positioning contour line corresponding to the outer contour of the product module to be cut; The to-be-cut product module and the adhesive film base are positioned by the positioning contour line.

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