Combined high-speed flatbed hot stamping and die-cutting machine

Abstract

The present invention relates to the field of die-cutting technology, and in particular to a combined high-speed flat-pressing hot stamping die-cutting machine, comprising a die-cutting component and a hot stamping component, wherein base paper slides through the die-cutting component and the hot stamping component, and hot stamping paper slides through the hot stamping component, a cooling component is fixedly installed on one side of the hot stamping component, a flattening component is fixedly installed on the moving part of the hot stamping component, and the cooling component and the flattening component are connected to each other; the cooling component comprises a slot provided on the base of the hot stamping component and a water tank fixedly installed on one side of the base of the hot stamping component; by arranging the cooling component and the flattening component near the hot stamping component, the new hot stamping temperature can be reduced from being dissipated to the bottom hot stamping during the accumulation of embossed hot stamping, thereby reducing a certain amount of melting and warping caused by the bottom hot stamping; at the same time, under the action of the flattening component, it can be further ensured that the embossed hot stamping maintains a good shape after hot stamping and its temperature is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of die-cutting, in particular to a combined high-speed flat-pressing and hot stamping die-cutting machine. Background Art

[0002] Hot stamping refers to the process of hot stamping anodized aluminum foil onto the surface of the substrate under a certain temperature and pressure. Traditional die-cutting refers to a cutting process for the post-processing of printed materials. The die-cutting process can make printed materials or other paper products into die-cutting plates according to pre-designed graphics for cutting. In existing technologies, hot stamping and die-cutting are combined on a production line to improve production efficiency.

[0003] The existing Chinese patent with publication number CN106629158A discloses a hot stamping die-cutting machine, including an upper template, a lower template and a paper conveying device, characterized in that the lower template is provided with a first push gauge mechanism, the first push gauge mechanism includes a push gauge and a cable line, the lower template and the robot arm are connected in series via a main shaft, the main shaft and the push gauge are connected by a cable line for transmission, the paper conveying device includes a robot transmission mechanism and a transmission mechanism, the transmission mechanism includes an input transmission wheel, a speed-increasing bridge wheel and an output transmission wheel, the input transmission wheel is connected to the power mechanism, the power mechanism includes a rocker and a power source, the rocker is connected to the input transmission wheel, and the output transmission wheel is connected to the robot transmission mechanism, ensuring that the lower template is flipped and fitted with the upper template while the cable line pulls the push gauge to perform the paper straightening action, thereby improving the synchronization and coordination of the transmission between the two.

[0004] During the implementation of the above technical solution, it was found that for embossed hot stamping, since embossed hot stamping requires multiple color changes at the same position, the hot stamping position after hot stamping is prone to melting when hot stamping again, resulting in warping during hot stamping. In the existing technology, workers will adjust the temperature and pressure to prevent the hot stamping from warping. The temperature adjustment needs to prevent the already hot stamped part from melting, and at the same time, the hot stamping part that needs to be melted must be quickly heated so that it can stick to the part that needs hot stamping. This temperature is difficult to adjust accurately, and the temperature range is very small. The device needs to maintain a precise constant temperature. The hot stamping will still have some warping, and the difficulty and cost of the production process are relatively high. Summary of the Invention

[0005] Technical problems solved

[0006] In view of the above-mentioned shortcomings of the prior art, the present invention provides a combined high-speed flat-press hot stamping and die-cutting machine, which can effectively solve the problem of hot stamping warping in the prior art.

[0007] Technical Solution

[0008] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0009] The present invention provides a combined high-speed flat-press hot stamping die-cutting machine, comprising a die-cutting component and a hot stamping component. Base paper slides through the die-cutting component and the hot stamping component, and hot stamping paper slides through the hot stamping component. When the device is in use, the base paper passes through the die-cutting component, and the hot stamping on the hot stamping paper is stamped on the base paper for hot stamping. Then the base paper passes through the hot stamping component and is cut into the required size by die-cutting. The device includes some components such as a fixed component and a driving component to support the operation of the device. A cooling component is fixedly installed on one side of the hot stamping component. The moving part of the hot stamping component A flattening assembly is fixedly installed, and the cooling assembly and the flattening assembly are connected to each other; the cooling assembly includes a slot opened on the base of the hot stamping assembly and a water tank fixedly installed on one side of the base of the hot stamping assembly, the slot is located behind the intersection of the hot stamping paper and the base paper, the top plate of the water tank extends outward and seals above the slot, a semiconductor refrigeration plate is fixedly installed horizontally in the water tank, the cooling end of the semiconductor refrigeration plate is arranged upward and placed in the empty slot of the middle partition of the water tank, and the top and bottom of the semiconductor refrigeration plate are respectively fixedly installed with a thermal conductive plate;

[0010] A flattening assembly is fixedly installed on the moving end of the hot stamping assembly, and drainage assemblies are fixedly installed on both sides of the flattening assembly and both sides of the water tank. The drainage assembly connects the flattening assembly and the top of the water tank. Anti-sticking assemblies that slide on the bottom of the flattening assembly are fixedly installed on both sides of the flattening assembly.

[0011] When the moving end that moves up and down in the hot stamping component is working, the moving end heats the hot stamping paper and presses the hot stamping paper onto the base paper. At this time, the hot stamping paper is driven by the external driving component and cooperates with the movement frequency of the hot stamping component to make the hot stamping paper continuously perform hot stamping work in the process of stopping and starting. After the hot stamping paper is stamped on the base paper, the base paper with hot stamping will immediately move to the top of the slot. The user energizes the semiconductor refrigeration chip to produce a cooling effect on the top of the semiconductor refrigeration chip and lower the water temperature in the water tank. The contact between the top plate of the water tank and the base paper is used to quickly cool down the hot stamped base paper. This can reduce the accumulation of embossed hot stamping, and the new hot stamping temperature is dissipated to the bottom hot stamping, reducing the certain melting and warping of the bottom hot stamping, and can well control the hot stamping. type, which can increase work efficiency. At the same time, the work of the moving end of the hot stamping component will drive the flattening component to move together. At the same time, when the flattening component moves together with the moving end of the hot stamping component, the flattening component continuously pumps the cold water in the water tank into the flattening component through the drainage component in the up and down reciprocating motion, and generates water flow in the flattening component and the water tank, so that the flattening component will always maintain water with a lower temperature. In this way, when the flattening component is pressed onto the base paper, the hot stamping part can be compacted while further reducing the hot stamping temperature. This can further ensure that the embossed hot stamping can maintain a good shape after hot stamping, which can effectively improve work efficiency. At the same time, it is used synchronously with the hot stamping component, and there is no need to add additional control components and drive mechanisms, which will not increase excessive costs.

[0012] Furthermore, the flattening assembly includes a fixed plate fixedly mounted on the moving end of the hot stamping assembly, a flow box fixedly mounted on the bottom of the fixed plate through a connecting rod, a first guide rod and a second guide rod fixedly mounted on both sides of the flow box, respectively, the first guide rod and the second guide rod are respectively slidably sleeved with a first sleeve and a second sleeve fixedly mounted on both sides of the water tank, a first piston block fixedly mounted on the bottom end of the first guide rod, a second piston block fixedly mounted on the bottom end of the second guide rod, a guide hole is opened on one side of the bottom end of the second guide rod, and a one-way valve is fixedly mounted in the hole and the guide hole of the first piston block and the second piston block.

[0013] The one-way valve in the guide hole and the second sleeve can only allow water to flow downward through the guide hole and the second sleeve, and the one-way valve in the first piston block can only allow water to move upward through the first piston block. When the fixed plate moves up and down, it will drive the first guide rod and the second guide rod at the bottom of the fixed plate to move together. When the second guide rod is squeezed downward, the second piston block and the one-way valve in the second piston block are used to push the liquid in the second sleeve into the water tank. At the same time, since the water tank is full of water, the water in the water tank will also be squeezed into the first sleeve. At the same time, when the first guide rod is squeezed downward, the water in the first sleeve will flow through the first piston block into the first guide rod and into the flow box. At this time, the water in the flow box will flow to the second The water flows in the guide rod and flows into the second sleeve through the guide hole. When the fixed plate moves upward, the second piston block squeezes the water above the second piston block, and the water flows to the bottom of the second piston block through the guide hole and the second sleeve. When the second piston block moves down next time, the water below the second piston block is squeezed into the water tank. At the same time, the first piston block moves upward to generate negative pressure in the first sleeve, causing the water in the water tank to flow into the first sleeve, and so on, forming a circulation process from the first sleeve to the flow box, and from the flow box to the water tank through the second sleeve. In this way, the cooled water in the water tank can flow into the flow box while the flow box itself moves, so that the cooling effects of the water tank and the flow box can be unified, thereby ensuring the cooling effect of the flow box.

[0014] Furthermore, the bottom plate of the flow box is composed of a plurality of elastic sheets, and a spoiler assembly is fixedly mounted on the top of the elastic sheet.

[0015] Furthermore, the spoiler assembly includes a fixing rod fixedly mounted on the top of the elastic sheet, and a turbofan is rotatably mounted on the top of the fixing rod.

[0016] When the flow box presses the base paper downward, the elastic sheet is squeezed and deformed. During the downward pressing process, the elastic sheet provides a certain elasticity between the flow box and the base paper, so that a certain buffer is generated when pressing the base paper, and the contact between the flow box and the base paper is changed to an elastic collision. When the elastic sheet is deformed, the spoiler component on the top of the elastic sheet is driven to move, causing the turbofan to move upward and rotate, disturbing the water in the flow box. In conjunction with the working drainage component, the water in the flow box can better transfer the temperature to the elastic sheet, thereby increasing the cooling effect when the flow box presses the base paper, while ensuring the pressing effect, the cooling and shaping effect of the embossed hot stamping is improved.

[0017] Furthermore, a heat dissipation component is fixedly installed on the outside of the water tank, and the heat dissipation component includes a conduit interconnected with the lower parts of both sides of the water tank, a square sleeve is fixedly sleeved on the outside of the conduit, a fan is fixedly installed on the top of the square sleeve, and a plurality of heat sinks are fixedly installed around the outside of the conduit, the heat sinks are located in the square sleeve, and a preheating component is installed through the top of the square sleeve, and the hot stamping paper slides in the preheating component.

[0018] Furthermore, the heat dissipation component includes an extrusion plate fixedly connected to a fixed plate through a connecting rod, an air bag is installed at the bottom height of the extrusion plate, the air bag is fixedly installed between the water tank and the conduit and maintained in communication, and a one-way valve is provided between the air bag, the conduit and the water tank. The preheating component includes an air outlet pipe installed through the top of the square sleeve, an air outlet box is fixedly installed on the top of the air outlet pipe, and the hot stamping paper slides through the air outlet box.

[0019] In order to increase the cooling effect of the semiconductor refrigeration plate, the conduit is connected, and when the fixed plate moves up and down, the air bag is continuously pressed and pulled up, and the air bag is used to generate the power to pump water, so that the water at the bottom of the water tank flows out. This part of the water is in contact with the heating end of the semiconductor refrigeration plate. After this part of the water is cooled, it can produce a certain cooling effect on the heating end of the semiconductor refrigeration plate. The lower the temperature of the heating end of the semiconductor refrigeration plate, the better the cooling effect of the cooling end of the semiconductor refrigeration plate. The water flowing out of the conduit will be cooled by the joint action of the fan and the heat sink, which can further improve the cooling effect of the semiconductor refrigeration plate, keep the water temperature in the water tank and the flow box at a low state, and then improve the cooling effect on the base paper.

[0020] At the same time, the wind blown out by the fan takes away the heat of the water in contact with the heat sink. This part of the heat will be blown upward through the air outlet pipe and blown out through the air outlet box. The hot stamping paper passing through the air outlet box will be heated by this part of the heat, which will heat the hot stamping material that is about to be peeled off from the hot stamping paper to the base paper, so that it can be more conveniently and quickly stamped on the base paper after being heated by the hot stamping component, which can effectively improve the hot stamping effect, enable it to stay more closely in the hot stamping position, improve the hot stamping efficiency, and reduce warping after hot stamping.

[0021] Furthermore, the anti-sticking component includes a fixing frame fixedly installed on both sides of the flow box and a rack fixedly installed on the base, a reciprocating screw is rotatably installed between the two fixing frames, a gear that can engage with the rack is fixedly installed on the outer end of the reciprocating screw, a slider that engages with the reciprocating screw is slidably connected to the reciprocating screw, and a scraper plate is horizontally fixedly connected between the sliders.

[0022] Furthermore, the scraper plate is a cavity structure, a scraper is inserted in the middle of the top plate of the scraper plate, and sponge blocks are symmetrically fixed on both sides of the scraper plate, and the sponge blocks extend to the scraper plate. When the flow box moves up and down, the flow box will drive the fixed frame to move together, so that the gear installed on the fixed frame and the rack rotate through meshing, so that the rotation of the reciprocating screw can drive the slider to move, and the gear drops from the highest point to the lowest point, which can just drive the reciprocating screw to drive the slider to move from one end to the other, so that the scraper plate can be used to scrape the bottom of the elastic sheet, so that The bottom surface of the elastic sheet is kept clean, thereby avoiding adhesion between the elastic sheet and the hot stamping material and ensuring the hot stamping effect. At the same time, when the scraper plate moves at the bottom of the elastic sheet, the scraper installed in the middle of the scraper plate directly contacts the elastic sheet and bends to a certain extent under the action of friction, and squeezes one of the sponge blocks, so that the detackifying agent absorbed in the sponge block, which is usually a wax substance, is squeezed to the bottom of the elastic sheet. In this way, the next time the elastic sheet contacts the base paper, the hot stamping on the surface of the base paper will be difficult to adhere to the elastic sheet, further ensuring the hot stamping effect and enabling the device to be used stably.

[0023] Beneficial effects

[0024] Compared with the known public technologies, the technical solution provided by the present invention has the following beneficial effects:

[0025] The present invention arranges a cooling component and a flattening component near the hot stamping component, thereby reducing the new hot stamping temperature from being dissipated to the bottom hot stamping during the accumulation of embossed hot stamping, thereby reducing a certain amount of melting and warping caused by the bottom hot stamping. At the same time, under the action of the flattening component, it can further ensure that the embossed hot stamping maintains a good shape after hot stamping and reduce its temperature.

[0026] By using a flow bypass component, the present invention can enable the water in the flow box to better transfer its temperature to the elastic sheet, thereby increasing the cooling effect when the flow box presses the base paper, while ensuring the pressing effect and improving the cooling and shaping effect of the embossed hot stamping.

[0027] By using a heat dissipation component, the present invention allows the water flowing out of the conduit to be cooled by the combined action of a fan and a heat sink, which can further enhance the cooling effect of the semiconductor refrigeration plate and maintain the water temperature in the water tank and the flow box at a relatively low state. At the same time, by utilizing a preheating component, the hot stamping material that is about to be peeled off from the hot stamping paper to the base paper can be heated, so that it can be more conveniently and quickly hot stamped on the base paper after being heated by the hot stamping component, which can effectively enhance the hot stamping effect.

[0028] The present invention uses an anti-sticking component and a scraping plate to scrape the bottom of the elastic sheet so that the bottom surface of the elastic sheet is kept clean, thereby preventing the elastic sheet and the hot stamping material from adhering to each other. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0030] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0031] Figure 2 It is a schematic cross-sectional view of the present invention;

[0032] Figure 3 It is a structural schematic diagram of the cooling assembly of the present invention;

[0033] Figure 4 It is a structural schematic diagram of the heat dissipation component of the present invention;

[0034] Figure 5 It is a schematic cross-sectional structural diagram of the flow box of the present invention;

[0035] Figure 6 Schematic diagram of the cross-sectional structure of the scraper plate of the present invention;

[0036] Figure 7 For the present invention Figure 1 Enlarged view of point A in the middle.

[0037] The numbers in the figure represent: 1. Die-cutting assembly; 2. Hot stamping assembly; 3. Hot stamping paper; 4. Base paper; 5. Cooling assembly; 501. Slot; 502. Water tank; 503. Semiconductor cooling plate; 504. Thermal conductive plate; 6. Flattening assembly; 601. Fixing plate; 602. Flow box; 603. Elastic sheet; 7. Drainage assembly; 701. First guide rod; 702. First piston block; 703. First sleeve; 704. Second guide rod; 705. Guide hole; 706. Second sleeve; 707. Second piston Block; 8. spoiler assembly; 801. fixing rod; 802. turbofan; 9. heat dissipation assembly; 901. extrusion plate; 902. air bag; 903. duct; 904. square sleeve; 905. heat sink; 906. fan; 10. preheating assembly; 1001. air outlet pipe; 1002. air outlet box; 11. anti-sticking assembly; 1101. fixing bracket; 1102. rack; 1103. reciprocating screw; 1104. gear; 1105. slider; 1106. scraper plate; 1107. sponge block; 1108. scraper. DETAILED DESCRIPTION

[0038] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0039] The present invention will be further described below with reference to the embodiments.

[0040] Reference Figures 1 to 7 , Example:

[0041] The combined high-speed flat-press hot stamping die-cutting machine includes a die-cutting component 1 and a hot stamping component 2. A base paper 4 slides through the die-cutting component 1 and the hot stamping component 2, and a hot stamping paper 3 slides through the hot stamping component 2. When the device is in use, the base paper 4 passes through the die-cutting component 1, and the hot stamping on the hot stamping paper 3 is stamped on the base paper 4 for hot stamping. Then the base paper 4 passes through the hot stamping component 2 and is cut into the required size by die-cutting. The device includes some fixed components and drive components and other components that support the operation of the device. It is a relatively mature existing technology. Only technology-related components are shown in the figure, and no further details are given here. A cooling component 5 is fixedly installed on one side of the hot stamping component 2. The movement of the hot stamping component 2 A flattening assembly 6 is fixedly installed on the top of the water tank 502. The cooling assembly 5 and the flattening assembly 6 are connected to each other. The cooling assembly 5 includes a slot 501 opened on the base of the hot stamping assembly 2 and a water tank 502 fixedly installed on one side of the base of the hot stamping assembly 2. The slot 501 is located behind the intersection of the hot stamping paper 3 and the base paper 4. The top plate of the water tank 502 extends outward and seals above the slot 501. A semiconductor refrigeration plate 503 is fixedly installed horizontally in the water tank 502. The cooling end of the semiconductor refrigeration plate 503 is arranged upward and placed in the empty slot of the middle partition of the water tank 502. The top and bottom of the semiconductor refrigeration plate 503 are respectively fixedly installed with 505 and a thermal conductive plate 504;

[0042] The moving end of the hot stamping component 2 is fixedly installed with a flattening component 6, and the two sides of the flattening component 6 and the two sides of the water tank 502 are jointly fixedly installed with drainage components 7. The drainage component 7 connects the flattening component 6 and the top of the water tank 502 with each other. The two sides of the flattening component 6 are fixedly installed with anti-sticking components 11 that slide on the bottom of the flattening component 6.

[0043] When the moving end moving up and down in the hot stamping component 2 is working, the moving end heats the hot stamping paper 3 and presses the hot stamping paper 3 onto the base paper 4. At this time, the hot stamping paper 3 is driven by an external driving component (existing technology, not shown in the figure) and cooperates with the movement frequency of the hot stamping component 2 to make the hot stamping paper 3 continue to perform hot stamping work in the process of stopping and starting. After the hot stamping paper 3 is stamped on the base paper 4, the base paper 4 with hot stamping will immediately move to the top of the slot 501. The user energizes the semiconductor refrigeration chip 503, which can generate a cooling effect on the top of the semiconductor refrigeration chip 503 and reduce the water temperature in the water tank 502. The water tank 502 is used to cool the water. The contact between the top plate of 02 and the base paper 4 can quickly cool down the hot stamped base paper 4, which can reduce the new hot stamping temperature from being dissipated to the bottom hot stamping during the accumulation of embossed hot stamping, reducing the melting and warping of the bottom hot stamping, and can shape the hot stamping very well, which can increase work efficiency. At the same time, the work of the moving end of the hot stamping component 2 will drive the flattening component 6 to move together, and when the flattening component 6 moves with the moving end of the hot stamping component 2, the flattening component 6 continuously pumps the cold water in the water tank 502 into the flattening component 6 through the drainage component 7 in the up and down reciprocating motion, and And the water flow is generated in the water tank 502, so that the flattening component 6 will always maintain water with a low temperature. In this way, when the flattening component 6 is pressed onto the base paper 4, the temperature of the hot stamping can be further reduced while compacting the hot stamping part. This can further ensure that the embossed hot stamping can maintain a good shape after hot stamping, which can effectively improve work efficiency. At the same time, it can be used synchronously with the hot stamping component 2 without adding additional control components and drive mechanisms, and will not increase excessive costs.

[0044] Specifically, refer to Figure 3 、 Figure 4 and Figure 5 The flattening component 6 includes a fixed plate 601 fixedly mounted on the moving end of the hot stamping component 2, and a flow box 602 is fixedly mounted on the bottom of the fixed plate 601 through a connecting rod. A first guide rod 701 and a second guide rod 704 are fixedly mounted on both sides of the flow box 602, respectively. The first guide rod 701 and the second guide rod 704 are respectively slidably sleeved with a first sleeve 703 and a second sleeve 706 fixedly mounted on both sides of the water tank 502. A first piston block 702 is fixedly mounted on the bottom end of the first guide rod 701, and a second piston block 707 is fixedly mounted on the bottom end of the second guide rod 704. A guide hole 705 is opened on one side of the bottom end of the second guide rod 704, and a one-way valve is fixedly mounted in the holes of the first piston block 702 and the second piston block 707 and the guide hole 705.

[0045] The one-way valves in the guide hole 705 and the second sleeve 706 can only allow water to flow downward through the guide hole 705 and the second sleeve 706, and the one-way valve in the first piston block 702 can only allow water to move upward through the first piston block 702. When the fixed plate 601 moves up and down, it will drive the first guide rod 701 and the second guide rod 704 at the bottom of the fixed plate 601 to move together. When the second guide rod 704 is squeezed downward, the second piston block 707 and the one-way valve in the second piston block 707 are used to push the liquid in the second sleeve 706 into the water tank 502. At the same time, since the water tank 502 is full of water, the water in the water tank 502 will also be squeezed into the first sleeve 703. At the same time, the first guide rod 701 is squeezed downward, which will cause the water in the first sleeve 703 to flow through the first piston block 702 to the first guide rod 701 and into the flow box 602. At this time, the water in the flow box 602 will flow to the second guide rod The water flows in the water tank 502 and flows into the second sleeve 706 through the guide hole 705. When the fixed plate 601 moves upward, the second piston block 707 squeezes the water above the second piston block 707, and the water flows to the bottom of the second piston block 707 through the guide hole 705 and the second sleeve 706. When the second piston block 707 moves downward next time, the water below the second piston block 707 is squeezed into the water tank 502. At the same time, the first piston block 702 moves upward to generate a negative pressure in the first sleeve 703. Pressure causes the water in the water tank 502 to flow into the first sleeve 703, and so on, forming a circulation process in which the water flows upward from the first sleeve 703 to the flow box 602, and then flows back to the water tank 502 from the flow box 602 through the second sleeve 706. In this way, the cooled water in the water tank 502 can flow into the flow box 602 while the flow box 602 itself moves, and the cooling effects of the water tank 502 and the flow box 602 can be unified, thereby ensuring the cooling effect of the flow box 602.

[0046] Specifically, refer to Figure 5 The bottom plate of the flow box 602 is composed of a plurality of elastic sheets 603 , and a spoiler assembly 8 is fixedly installed on the top of the elastic sheet 603 .

[0047] Specifically, refer to Figure 5 The spoiler assembly 8 includes a fixing rod 801 fixedly mounted on the top of the elastic sheet 603, and a turbofan 802 is rotatably mounted on the top of the fixing rod 801.

[0048] When the flow box 602 presses the base paper 4 downward, the elastic sheet 603 is squeezed and deformed. During the downward pressing process, the elastic sheet 603 provides a certain elasticity between the flow box 602 and the base paper 4, so that a certain buffer is generated when pressing the base paper 4, and the contact between the flow box 602 and the base paper 4 is changed to an elastic collision. At the same time as the elastic sheet 603 is deformed, the spoiler component 8 on the top of the elastic sheet 603 is driven to move, so that the turbofan 802 moves upward and rotates, which disturbs the water in the flow box 602. In conjunction with the working drainage component 7, the water in the flow box 602 can better transfer the temperature to the elastic sheet 603, thereby increasing the cooling effect when the flow box 602 presses the base paper 4, while ensuring the pressing effect, the cooling and shaping effect of the embossed hot stamping is improved.

[0049] Specifically, refer to Figure 3 and Figure 4 A heat dissipation component 9 is fixedly installed on the outside of the water tank 502. The heat dissipation component 9 includes a conduit 903 that is interconnected with the lower parts of both sides of the water tank 502. A square sleeve 904 is fixedly sleeved on the outside of the conduit 903. A fan 906 is fixedly installed on the top of the square sleeve 904. A plurality of heat dissipation fins 905 are fixedly installed around the outside of the conduit 903. The heat dissipation fins 905 are located in the square sleeve 904. A preheating component 10 is installed through the top of the square sleeve 904, and the hot stamping paper 3 slides in the preheating component 10.

[0050] Specifically, refer to Figure 3 and Figure 4 The heat dissipation component 9 includes an extrusion plate 901 fixedly connected to the fixed plate 601 through a connecting rod, and an air bag 902 is installed at the bottom height of the extrusion plate 901. The air bag 902 is fixedly installed between the water tank 502 and the conduit 903 and maintains communication. A one-way valve is provided between the air bag 902, the conduit 903 and the water tank 502. The preheating component 10 includes an air outlet pipe 1001 installed through the top of the square sleeve 904, and an air outlet box 1002 is fixedly installed on the top of the air outlet pipe 1001. The hot stamping paper 3 slides through the air outlet box 1002.

[0051] In order to increase the cooling effect of the semiconductor refrigeration plate 503, by connecting the conduit 903 and continuously pressing and pulling up the air bag 902 when the fixed plate 601 moves up and down, the air bag 902 is used to generate the power of pumping water, so that the water at the bottom of the water tank 502 flows out. This part of the water is in contact with the heating end of the semiconductor refrigeration plate 503. After this part of the water is cooled, it can produce a certain cooling effect on the heating end of the semiconductor refrigeration plate 503. The lower the temperature of the heating end of the semiconductor refrigeration plate 503, the better the cooling effect of the cooling end of the semiconductor refrigeration plate 503. The water flowing out of the conduit 903 will be cooled by the joint action of the fan 906 and the heat sink 905, which can further improve the cooling effect of the semiconductor refrigeration plate 503, keep the water temperature in the water tank 502 and the flow box 602 at a low state, and then improve the cooling effect on the base paper 4.

[0052] At the same time, the wind blown by the fan 906 takes away the heat of the water in contact with the heat sink 905. This part of the heat will be blown upward through the air outlet pipe 1001 and blown out through the air outlet box 1002. The hot stamping paper 3 passing through the air outlet box 1002 will be heated by this part of the heat, which will heat the hot stamping material that is about to be peeled off from the hot stamping paper 3 to the base paper 4, so that it can be more conveniently and quickly stamped on the base paper 4 after being heated by the hot stamping component 2, which can effectively improve the hot stamping effect, enable it to stay more closely in the hot stamping position, improve the hot stamping efficiency, and reduce the warping after hot stamping.

[0053] Specifically, refer to Figure 1 and Figure 7 The anti-sticking component 11 includes a fixing frame 1101 fixedly installed on both sides of the flow box 602 and a rack 1102 fixedly installed on the base. A reciprocating screw 1103 is rotatably installed between the two fixing frames 1101. A gear 1104 that can engage with the rack 1102 is fixedly installed on the outer end of the reciprocating screw 1103. A slider 1105 that engages with the reciprocating screw 1103 is slidably connected to the reciprocating screw 1103, and a scraper plate 1106 is horizontally fixedly connected between the sliders 1105.

[0054] Specifically, refer to Figure 6 The scraper plate 1106 is a hollow structure, a scraper blade 1108 is inserted in the middle of the top plate of the scraper plate 1106, and sponge blocks 1107 are symmetrically fixed on both sides of the scraper blade 1108, and the sponge blocks 1107 extend to the scraper plate 1106.

[0055] When the mobile box 602 moves up and down, the mobile box 602 will drive the fixed frame 1101 to move together, so that the gear 1104 installed on the fixed frame 1101 and the rack 1102 rotate through meshing, so that the rotation of the reciprocating screw 1103 can drive the slider 1105 to move, and the gear 1104 drops from the highest point to the lowest point, which can just drive the reciprocating screw 1103 to drive the slider 1105 to move from one end to the other, so that the scraper 1106 can be used to scrape the bottom of the elastic sheet 603 to keep the bottom surface of the elastic sheet 603 clean, thereby preventing the elastic sheet 603 from being scalded. The gold material adheres to ensure the hot stamping effect. At the same time, when the scraper plate 1106 moves at the bottom of the elastic sheet 603, the scraper 1108 installed in the middle of the scraper plate 1106 directly contacts the elastic sheet 603 and bends to a certain extent under the action of friction. It is squeezed onto one of the sponge blocks 1107, so that the detackifying agent absorbed in the sponge block 1107, which is usually a wax substance, is squeezed to the bottom of the elastic sheet 603. In this way, the next time the elastic sheet 603 contacts the base paper 4, the hot stamping on the surface of the base paper 4 will be difficult to adhere to the elastic sheet 603, further ensuring the hot stamping effect and enabling the device to be used stably.

[0056] Working principle: When the device is used, the base paper 4 passes through the die-cutting component 1, and the hot stamping on the hot stamping paper 3 is stamped on the base paper 4 for hot stamping. Then the base paper 4 passes through the hot stamping component 2 and is cut into the required size by die-cutting. The device includes some fixed components and driving components and other components that support the operation of the device. It is a relatively mature existing technology. Only technology-related components are shown in the figure, and no further details are given here. A cooling component 5 is fixedly installed on one side of the hot stamping component 2, and a flattening component 6 is fixedly installed on the moving part of the hot stamping component 2. The cooling component 5 and the flattening component 6 are connected to each other. The cooling assembly 5 includes a slot 501 formed on the base of the hot stamping assembly 2 and a water tank 502 fixedly mounted on one side of the base of the hot stamping assembly 2. The slot 501 is located behind the junction of the hot stamping paper 3 and the base paper 4. The top plate of the water tank 502 extends outward and seals over the slot 501. A semiconductor cooling plate 503 is fixedly mounted horizontally within the water tank 502. The cooling end of the semiconductor cooling plate 503 is positioned upward and positioned within an empty slot in the middle partition of the water tank 502. A 505 and a thermal conductive plate 504 are fixedly mounted on the top and bottom of the semiconductor cooling plate 503, respectively.

[0057] The moving end of the hot stamping component 2 is fixedly installed with a flattening component 6, and the two sides of the flattening component 6 and the two sides of the water tank 502 are jointly fixedly installed with drainage components 7. The drainage component 7 connects the flattening component 6 and the top of the water tank 502 with each other. The two sides of the flattening component 6 are fixedly installed with anti-sticking components 11 that slide on the bottom of the flattening component 6.

[0058] When the moving end that moves up and down in the hot stamping component 2 is working, the moving end heats the hot stamping paper 3 and presses the hot stamping paper 3 onto the base paper 4. At this time, the hot stamping paper 3 is driven by the external driving component and cooperates with the movement frequency of the hot stamping component 2, so that the hot stamping paper 3 is continuously hot stamped in the moving and stopping process. After the hot stamping paper 3 is stamped on the base paper 4, the base paper 4 with hot stamping will immediately move to the top of the slot 501. The user powers on the semiconductor refrigeration chip 503, which can produce a cooling effect on the top of the semiconductor refrigeration chip 503 and reduce the water temperature in the water tank 502. The top plate and The contact between the base paper 4 and the base paper 4 can quickly cool down the hot stamped base paper 4, which can reduce the new hot stamping temperature from being dissipated to the bottom hot stamping during the accumulation of embossed hot stamping, reducing the melting and warping of the bottom hot stamping, and can shape the hot stamping very well, which can increase work efficiency. At the same time, the work of the moving end of the hot stamping component 2 will drive the flattening component 6 to move together, and when the flattening component 6 moves with the moving end of the hot stamping component 2, the flattening component 6 continuously pumps the cold water in the water tank 502 into the flattening component 6 through the drainage component 7 in the up and down reciprocating motion, and And the water flow is generated in the water tank 502, so that the flattening component 6 will always maintain water with a low temperature. In this way, when the flattening component 6 is pressed onto the base paper 4, the temperature of the hot stamping can be further reduced while compacting the hot stamping part. This can further ensure that the embossed hot stamping can maintain a good shape after hot stamping, which can effectively improve work efficiency. At the same time, it can be used synchronously with the hot stamping component 2 without adding additional control components and drive mechanisms, and will not increase excessive costs.

[0059] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A combined high-speed flat-press hot stamping die-cutting machine, comprising a die-cutting component (1) and a hot stamping component (2), wherein the die-cutting component (1) and the hot stamping component (2) slide through a base paper (4), and the hot stamping component (2) slides through a hot stamping paper (3). When the device is used, the base paper (4) passes through the die-cutting component (1), and the hot stamping on the hot stamping paper (3) is stamped on the base paper (4) to perform the hot stamping operation, and then the base paper (4) passes through the hot stamping component (2), characterized in that: A cooling component (5) is fixedly mounted on one side of the hot stamping component (2), a flattening component (6) is fixedly mounted on the moving portion of the hot stamping component (2), and the cooling component (5) and the flattening component (6) are in communication with each other; The cooling component (5) comprises a slot (501) provided on the base of the hot stamping component (2) and a water tank (502) fixedly mounted on one side of the base of the hot stamping component (2); the slot (501) is located behind the junction of the hot stamping paper (3) and the base paper (4); the top plate of the water tank (502) extends outward and is sealed over the slot (501); a semiconductor cooling plate (503) is fixedly mounted horizontally in the water tank (502); the cooling end of the semiconductor cooling plate (503) is arranged upward and is placed in an empty slot of a middle partition of the water tank (502); and (505) and a thermal conductive plate (504) are fixedly mounted on the top and bottom of the semiconductor cooling plate (503), respectively. A flattening component (6) is fixedly mounted on the moving end of the hot stamping component (2); drainage components (7) are fixedly mounted on both sides of the flattening component (6) and both sides of the water tank (502); the drainage components (7) connect the flattening component (6) and the top of the water tank (502) to each other; and anti-sticking components (11) are fixedly mounted on both sides of the flattening component (6) and slide on the bottom of the flattening component (6); The flattening component (6) includes a fixed plate (601) fixedly mounted on the moving end of the hot stamping component (2), a flow box (602) fixedly mounted on the bottom of the fixed plate (601) via a connecting rod, a first guide rod (701) and a second guide rod (704) fixedly mounted on both sides of the flow box (602), a first sleeve (703) and a second sleeve (706) fixedly mounted on both sides of the water tank (502) are slidably sleeved on the first guide rod (701) and the second guide rod (704), a first piston block (702) fixedly mounted on the bottom end of the first guide rod (701), a second piston block (707) fixedly mounted on the bottom end of the second guide rod (704), a guide hole (705) is opened on one side of the bottom end of the second guide rod (704), and a one-way valve is fixedly mounted in the holes of the first piston block (702) and the second piston block (707) and the guide hole (705); The bottom plate of the flow box (602) is composed of a plurality of elastic sheets (603), and a spoiler assembly (8) is fixedly mounted on the top of the elastic sheet (603).

2. The combined high-speed flat-press hot stamping and die-cutting machine according to claim 1, characterized in that: The spoiler assembly (8) comprises a fixing rod (801) fixedly mounted on the top of the elastic sheet (603), and a turbofan (802) is rotatably mounted on the top of the fixing rod (801).

3. The combined high-speed flat-press hot stamping and die-cutting machine according to claim 1, characterized in that: A heat dissipation component (9) is fixedly installed on the outside of the water tank (502), and the heat dissipation component (9) includes a conduit (903) that is interconnected with the lower parts of both sides of the water tank (502), a square sleeve (904) is fixedly sleeved on the outside of the conduit (903), a fan (906) is fixedly installed on the top of the square sleeve (904), and a plurality of heat dissipation fins (905) are fixedly installed around the outside of the conduit (903), the heat dissipation fins (905) are located in the square sleeve (904), and a preheating component (10) is installed through the top of the square sleeve (904), and the hot stamping paper (3) slides in the preheating component (10).

4. The combined high-speed flat-press hot stamping and die-cutting machine according to claim 3, characterized in that: The heat dissipation component (9) comprises an extrusion plate (901) fixedly connected to a fixing plate (601) via a connecting rod, an air bag (902) is installed at the bottom height of the extrusion plate (901), the air bag (902) is fixedly installed between the water tank (502) and the conduit (903) and maintains communication, and a one-way valve is provided between the air bag (902), the conduit (903) and the water tank (502), and the preheating component (10) comprises an air outlet pipe (1001) installed through the top of the square sleeve (904), an air outlet box (1002) is fixedly installed on the top of the air outlet pipe (1001), and the hot stamping paper (3) slides through the air outlet box (1002).

5. The combined high-speed flat-press hot stamping and die-cutting machine according to claim 2, characterized in that: The anti-sticking component (11) includes a fixing frame (1101) fixedly mounted on both sides of the flow box (602) and a rack (1102) fixedly mounted on the base, a reciprocating screw (1103) is rotatably mounted between the two fixing frames (1101), a gear (1104) capable of meshing with the rack (1102) is fixedly mounted on the outer end of the reciprocating screw (1103), a slider (1105) meshing with the reciprocating screw (1103) is slidably connected to the reciprocating screw (1103), and a scraper plate (1106) is horizontally fixedly connected between the sliders (1105).

6. The combined high-speed flat-press hot stamping and die-cutting machine according to claim 5, characterized in that: The scraping plate (1106) is a hollow structure, a scraper (1108) is inserted into the middle of the top plate of the scraping plate (1106), and sponge blocks (1107) are symmetrically fixedly installed on both sides of the scraper (1108), and the sponge blocks (1107) extend to the scraping plate (1106).

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