Electric card refrigeration device

Abstract

The present invention discloses an electric card refrigeration device, including: a heat dissipation module, a supporting mold, a permanent magnet, an electric card material and a magnetic coil; the bottom of the heat dissipation module is attached with a permanent magnet; a cavity is provided inside the supporting mold, and the electric card material and the magnetic coil are arranged in the cavity; an opening connected to the cavity is provided at the bottom of the supporting mold, and the opening cooperates with the heat-generating electronic component, and a heat dissipation port connected to the cavity is provided at the top of the supporting mold, and the bottom of the heat dissipation module is arranged in the heat dissipation port. Compared with the traditional technology, this method realizes the transfer of heat of the electronic component by driving the electric card material in the mold up and down by the magnetic coil, and uses the electric card material and the magnetic coil to form an LC oscillation circuit to recover the driving electric field energy, and uses an external power supply to compensate for energy and maintain oscillation; by adjusting the formation period and oscillation period of the electric card effect, a refrigeration device with high heat exchange efficiency, miniaturization and light weight is obtained.

Description

Technical Field

[0001] The present invention relates to the technical field of electric card refrigeration, and more specifically, to an electric card refrigeration device. Background Art

[0002] Nowadays, the integration of chips as the core of electronic devices is getting higher and higher to meet the needs of diversified functions of electronic devices. At the same time, the failure problem of devices caused by excessive integration, especially thermal failure problem, is becoming more and more prominent.

[0003] At present, chip cooling relies on passive cooling by heat sink, active cooling by fan and active cooling by pump. Each of the above solutions has its own shortcomings, such as low passive cooling efficiency of heat sink and great influence of ambient temperature, easy adhesion of dust by fan, and potential leakage of liquid pipeline by pump. Therefore, finding new refrigeration technology with high energy conversion efficiency, small size and light weight has become an urgent problem to be solved all over the world.

[0004] As a dielectric capacitor field effect device with good insulation, electrocaloric refrigeration technology effectively solves the urgent need for heat dissipation of highly integrated electronic devices and the defects and limitations of traditional refrigeration technology. Its advantages include high energy reversibility (>90%), efficient recovery and reuse of driving electric field energy (>80%), simple field addition method, light equipment, low noise, simple system structure, and higher system theoretical power density than refrigeration. Since it does not rely on compressors and the driving electric field energy is easily recovered, electrocaloric refrigeration devices are light, noiseless, and easy to integrate, so they are expected to be applied in some new demands and new fields that are difficult to meet with traditional technologies. For example, wearable thermal management devices, (data center) chip in-situ thermal management, low-energy thermal management of electric vehicles, etc.

[0005] However, existing electric card refrigeration devices still have disadvantages such as being large in size, having overly large drive components, consuming large drive energy, and being unable to be miniaturized.

[0006] The electrocaloric effect refers to the fact that when an electric field acts on a certain type of spontaneously polarized dielectric material, it will induce a change in the polarization degree of the dielectric, causing the material to exhibit a reversible isothermal entropy change, thereby causing a temperature change. A class of materials that can produce the electrocaloric effect is called electrocaloric materials.

[0007] The prior art discloses a light and small electric card refrigeration device, which includes an electromagnetic drive part and a refrigeration core unit. The coil is connected to a DC power supply to generate a magnetic field. Relying on the advantages of high magnetic permeability, fast magnetization and rapid demagnetization of soft ferrite, a magnetic circuit is formed to generate a stable magnetic field under the soft ferrite plate. The soft ferrite thin layer generates a magnetic torque in the magnetic field and fits tightly with the soft ferrite plate. The presence or absence of the magnetic field torque can be controlled by an external power supply, thereby achieving reciprocating motion. The refrigeration core unit is composed of an electric card material unit and a soft ferrite thin layer bonded together with thermal conductive glue to form a whole with good thermal conductivity. The defect of this device is that the formation period and oscillation period of the electric caloric effect cannot be adjusted, and the heat exchange efficiency is not high.

[0008] To this end, in combination with the above requirements and the defects of the prior art, the present application proposes an electric card refrigeration device. Summary of the invention

[0009] The present invention provides an electric card refrigeration device, which can drive the electric card material in the mold to move up and down through a magnetic coil to achieve the transfer of heat from electronic components, utilize the electric card material and the magnetic coil to form an LC oscillation circuit to recover the driving electric field energy, and achieve the effect of efficient heat exchange by adjusting the formation period and oscillation period of the electric caloric effect.

[0010] The primary purpose of the present invention is to solve the above technical problems. The technical solutions of the present invention are as follows:

[0011] The first aspect of the present invention provides an electric card refrigeration device, which is arranged on a heat-generating electronic component 7 and includes: a heat dissipation module, a supporting mold, a permanent magnet, an electric card material and a magnetic coil; wherein the bottom of the heat dissipation module is attached with a permanent magnet; a cavity is provided inside the supporting mold, an opening connected to the cavity is provided at the bottom of the supporting mold, the opening cooperates with the heat-generating electronic component, a heat dissipation port connected to the cavity is provided at the top of the supporting mold, and the bottom of the heat dissipation module is provided in the heat dissipation port.

[0012] The electric card material is arranged in the support structure formed by the magnetic coil and in the cavity, the bottom end of the electric card material can fit the heat-generating electronic component, and the top end of the electric card material can fit the permanent magnet.

[0013] Among them, the magnetic coil drives the electric card material in the supporting mold to move up and down to realize the heat transfer of the heat-generating electronic components.

[0014] Furthermore, the electric card material is a multilayer ceramic capacitor MLCC electric card material, which is composed of a plurality of nickel electrodes and a plurality of barium titanate ferroelectric ceramics alternately stacked, and copper end external electrodes are arranged on two opposite sides of the MLCC electric card material.

[0015] Among them, MLCC contains multiple layers of ferromagnetic nickel electrodes, which can be spontaneously attracted by permanent magnets. Therefore, the electric card material module composed of MLCC, magnetic coil and supporting mold in the electric card refrigeration device will spontaneously adhere to the permanent magnet of the upper heat dissipation module when the magnetic coil is not energized.

[0016] Furthermore, the supporting mold includes a top structure, a bottom structure and several middle-layer structures, wherein the top structure is used to fix the heat dissipation module, the bottom structure is used to fix on the heat-generating electronic component, and the several middle-layer structures are used to fix the magnetic coil and the electric card material.

[0017] Furthermore, the top structure, bottom structure and several middle-layer structures are all rectangular, and limiting holes are arranged at the four top corners of each part of the top structure, bottom structure and several middle-layer structures. Limiting columns are arranged in the limiting holes, and the top structure, bottom structure and several middle-layer structures are connected together through the limiting columns.

[0018] The purpose of setting the limiting holes and limiting columns is to prevent the device from moving in the horizontal direction, and the limiting columns do not limit the vertical displacement of the middle-layer structures.

[0019] Among them, the heat transfer of a single thermal cycle can be increased by increasing the number of the middle-layer structures and placing a support structure formed by stacking multiple magnetic coils of electric card materials, and the cooling and heat dissipation power can be increased by increasing the temperature difference between the cold and hot ends by connecting them in series. At the same time, the cooling and heat dissipation power can also be increased by parallel connection in the horizontal direction.

[0020] Furthermore, the heat dissipation module is a heat dissipation fin, and the heat dissipation fin is made of copper material. The permanent magnet attached to the lower end of the heat dissipation fin is used to provide a constant magnetic field and form a magnetic force with the electromagnetic coil.

[0021] The second aspect of the present invention provides a circuit for adjusting the formation period and oscillation period of the electrocaloric effect. The circuit is used for an electrocaloric refrigeration device, including: a DC power supply, an equivalent MLCC capacitor, a magnetic coil and an NPN transistor. The magnetic coil includes: a first inductor coil and a second inductor coil. The specific connection relationship is: the output end of the DC power supply is respectively connected to one end of the equivalent MLCC capacitor, the first connection end of the first inductor coil, the other end of the equivalent MLCC capacitor and the second connection end of the first inductor coil are both connected to the collector of the NPN transistor, the second connection end of the second inductor coil is connected to the base of the NPN transistor, and the first connection end of the second inductor coil and the emitter of the NPN transistor are both grounded.

[0022] Furthermore, the equivalent MLCC capacitor is an equivalent capacitor of an electric card material, the first inductor coil and the second inductor coil are wound around the equivalent MLCC capacitor, and the second inductor coil is used as an inductor feedback to form an inductor three-point oscillation circuit.

[0023] Among them, the LC frequency oscillation formula is:

[0024]

[0025] Where, L represents the inductance of the magnetic coil; C represents the capacitance of the MLCC electrical card material, f r Represents the output frequency, that is, the oscillation frequency of the circuit.

[0026] A third aspect of the present invention provides a method for adjusting an electrocaloric effect formation period and an oscillation period, the method being used in a circuit for adjusting an electrocaloric effect formation period and an oscillation period, the method comprising the following steps:

[0027] S1. Apply a driving electric field, and the current charges the equivalent MLCC capacitor. The temperature of the equivalent MLCC capacitor, i.e., the electric card material, rises through the electrocaloric effect. At this time, the upper surface of the electric card material contacts the lower surface of the heat dissipation module, and the electric card material transfers the heat to the heat dissipation fins and dissipates it into the air.

[0028] S2. Remove the driving electric field, discharge the equivalent MLCC capacitor, and the electric energy enters the first inductor magnetic coil, i.e. the magnetic coil, through the wire, and is converted into magnetic field energy through the inductance effect. The magnetic field generated by the magnetic coil repels the permanent magnet, driving the module composed of the electric card material, several middle-layer structures and the magnetic coil to break away from the adsorption of the permanent magnet and move downward. At the same time, after losing the electric field, the electric card material is cooled down under the action of the electric caloric effect, and the lower surface of the electric card material contacts the upper surface of the heat-generating electronic component for heat exchange.

[0029] S3, the magnetic field energy is converted into the electric field energy of the electrocardial material through the properties of the LC oscillation circuit, the DC power supply is controlled to output current to the circuit, and the process returns to step S1.

[0030] Among them, by adjusting the period of applying the electric field and removing the electric field, the formation period and oscillation period of the electrocaloric effect can be adjusted.

[0031] Among them, in the LC oscillation circuit formed by the magnetic coil and the MLCC electric card material, the magnetic coil gradually releases the magnetic field energy, so that the magnetic field generated by the magnetic coil is weakened and reversed, so that the magnetic coil drives the electric card material and the model composed of several middle-layer structures to move upward under the magnetic attraction of the permanent magnet under the upper heat dissipation module. At the same time, the energy in the magnetic coil is gradually returned to the MLCC electric card material, and the electric card material is also applied with an electric field to form an electric caloric effect and the temperature rises, and then it contacts with the upper heat dissipation module for heat exchange, and the heat dissipation module takes away the heat of the electric card material and dissipates it into the air.

[0032] Compared with the prior art, the technical solution of the present invention has the following beneficial effects:

[0033] The present invention provides an electric card refrigeration device, which drives the MLCC electric card material in the mold to move up and down through a magnetic coil to achieve the transfer of heat from the electronic components, utilizes the MLCC and the magnetic coil to form an LC oscillation circuit to recover the driving electric field energy, and performs energy compensation through an external power supply to maintain the oscillation; by adjusting the formation period and oscillation period of the electric caloric effect, a new type of refrigeration device with high heat exchange efficiency, miniaturization and light weight is achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 The present invention is a schematic structural diagram of an electric card refrigeration device.

[0035] Figure 2 It is a schematic diagram of the structure of the electric card material in the present invention.

[0036] Figure 3 It is a schematic diagram of the overall structure of the present invention.

[0037] Figure 4 The present invention is an equivalent energy compensation LC oscillation circuit diagram in a method for adjusting the electrocaloric effect formation period and oscillation period. DETAILED DESCRIPTION

[0038] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0039] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited to the specific embodiments disclosed below.

[0040] Example 1

[0041] like Figure 1-Figure 3 As shown, the present invention provides an electric card refrigeration device, which is arranged on a heat-generating electronic component 7, and includes: a heat dissipation module 1, a supporting mold 2, a permanent magnet 3, an electric card material 4 and a magnetic coil 6; wherein, the bottom of the heat dissipation module 1 is attached with the permanent magnet 3; a cavity is provided inside the supporting mold 2, and an opening connected to the cavity is provided at the bottom of the supporting mold 2, and the opening cooperates with the heat-generating electronic component 7, and a heat dissipation port connected to the cavity is provided at the top of the supporting mold 2, and the bottom of the heat dissipation module 1 is provided in the heat dissipation port.

[0042] The electric card material 4 is arranged in the support structure formed by the magnetic coil 6 and in the cavity, the bottom end of the electric card material 4 can fit the heat-generating electronic component 7, and the top end of the electric card material 4 can fit the permanent magnet 3.

[0043] In a specific embodiment, Figure 2 As shown, the MLCC electric card material 4 contains multiple layers of ferromagnetic nickel electrodes 8, which can be spontaneously attracted by the permanent magnet 3. Therefore, the module formed by the MLCC electric card material 4, the magnetic coil 6, and the supporting mold 2 in the electric card refrigeration device will spontaneously adhere to the permanent magnet 3 of the upper heat dissipation module 1 when the magnetic coil 6 is not energized.

[0044] The magnetic coil 6 drives the electric card material 4 in the supporting mold 2 to move up and down to achieve the heat transfer of the heat-generating electronic component 7.

[0045] Further, such as Figure 2 As shown, the electric card material 4 is a multilayer ceramic capacitor MLCC electric card material, which is composed of a plurality of nickel electrodes 8 and a plurality of barium titanate ferroelectric ceramics 9 alternately stacked, and copper end external electrodes 10 are arranged on two opposite sides of the MLCC electric card material.

[0046] Among them, MLCC contains multiple layers of ferromagnetic nickel electrodes, which can be spontaneously attracted by permanent magnets. Therefore, the electric card material module composed of MLCC, magnetic coil and supporting mold in the electric card refrigeration device will spontaneously adhere to the permanent magnet of the upper heat dissipation module when the magnetic coil is not energized.

[0047] In a specific embodiment, a multilayer ceramic capacitor MLCC electric card material 4 made of an inorganic non-metallic material barium titanate ferroelectric ceramic is used, and its structure is as follows: Figure 2 shown.

[0048] Furthermore, the supporting mold 2 includes a top structure 21, a bottom structure 22 and a plurality of middle-layer structures 23, wherein the top structure 21 is used to fix the heat dissipation module 1, the bottom structure 22 is used to fix on the heat-generating electronic component 7, and the plurality of middle-layer structures 23 are used to fix the magnetic coil 6 and the electric card material 7.

[0049] Furthermore, the top structure 21, the bottom structure 22 and the plurality of middle-layer structures 23 are all rectangular, and limiting holes are provided at the four top corners of each part of the top structure 21, the bottom structure 22 and the plurality of middle-layer structures 23, and limiting columns 5 are provided in the limiting holes. The top structure 21, the bottom structure 22 and the plurality of middle-layer structures 23 are connected together through the limiting columns 5.

[0050] The purpose of providing the limiting holes and the limiting columns 5 is to prevent the device from moving in the horizontal direction, and the limiting columns 5 do not restrict the displacement of the middle-layer structures 23 in the vertical direction.

[0051] Among them, the heat transfer of a single thermodynamic cycle can be increased by increasing the number of the middle layer structures 23 and placing a support structure formed by stacking a plurality of magnetic coils 6 of electric card materials 4, and the cooling and heat dissipation power can be increased by increasing the temperature difference between the cold and hot ends by connecting them in series. At the same time, the cooling and heat dissipation power can also be increased by connecting them in parallel in the horizontal direction.

[0052] Furthermore, the heat dissipation module 1 is a heat dissipation fin, and the heat dissipation fin is made of copper material. The permanent magnet 3 attached to the lower end of the heat dissipation fin is used to provide a constant magnetic field and form a magnetic force with the electromagnetic coil 6.

[0053] In a specific embodiment, the heat sink fins are made of high-quality thermally conductive copper material, and the fins are shaped like straight teeth or pointed teeth to increase the heat dissipation area. The permanent magnet attached to the lower end of the fin is used to provide a constant magnetic field to form a magnetic force with the energized magnetic coil.

[0054] This embodiment uses a barium titanate ferroelectric ceramic with a large electrocaloric effect to prepare it into an MLCC electrocaloric material for a multilayer ceramic capacitor. The MLCC electrocaloric material in the mold is driven up and down by a magnetic coil to transfer the heat of the electronic components. The MLCC and the magnetic coil form an LC oscillation circuit to recover the driving electric field energy, and the oscillation is maintained through compensation. The electrocaloric effect formation period and the oscillation period are adjusted to achieve a new type of refrigeration device with high energy efficiency, miniaturization, and light weight through an external power supply.

[0055] In a specific embodiment, an electric field is first applied to the MLCC electrocaloric material. Under the electrocaloric effect, the electrocaloric material undergoes adiabatic entropy reduction, and the temperature instantly rises by ΔT. ΔT depends on the properties of the material. In this embodiment, ΔT is 4K.

[0056] Secondly, the MLCC electric card material contacts and transfers heat to the heat dissipation module. The MLCC electric card material drops in temperature isentropically, and the heat is transferred to the heat dissipation module. The temperature of the heat dissipation module rises, and the heat is dissipated to the air through the heat dissipation fins with a large heat dissipation area.

[0057] Next, the MLCC electric card material and the magnetic coil form an LC oscillation circuit. The MLCC electric card material, as a capacitor, transfers electrical energy to the magnetic coil as an inductor for charging. The magnetic field formed by the inductor gradually increases. At the same time, the multi-layer nickel electrodes of the MLCC electric card material are equivalent to the magnetic core in the electromagnet, further enhancing the magnetic field generated by the concentrated magnetic coil. The magnetic field formed by the magnetic coil generates a magnetic force that repels the permanent magnet in the upper heat dissipation module, pushing the electric card material module downward. At the same time, because the MLCC electric card material discharges, the electric field in the capacitor is removed, and the electric card material will increase adiabatically and the temperature will drop by ΔT under the action of the electric caloric effect.

[0058] The electric card material module further moves downward to fit the heat-generating electronic component that serves as a heat source. The electric card material itself has a relatively low temperature and absorbs heat isentropically, cooling the electronic component to remove the heat generated during its operation.

[0059] The above steps are repeated repeatedly to form a thermodynamic cycle of the electric card refrigeration device, which continuously transports the heat generated by the electronic components at the heating end at a low temperature upward to the heat dissipation end at a higher temperature and dissipates it to the air, effectively reducing the temperature of the electronic components.

[0060] Example 2

[0061] Based on the above embodiment 1, combined with Figure 4 This embodiment describes in detail the second aspect of the present invention, a circuit for adjusting the electrocaloric effect formation period and the oscillation period, and the third aspect of the present invention, a method for adjusting the electrocaloric effect formation period and the oscillation period.

[0062] like Figure 4 As shown, the second aspect of the present invention provides a circuit for adjusting the formation period and oscillation period of the electrocaloric effect, which is used in an electrocaloric refrigeration device, including: a DC power supply 403, an equivalent MLCC capacitor 405, a magnetic coil and an NPN transistor 404, wherein the magnetic coil includes: a first inductor 401 and a second inductor 402, and the specific connection relationship is: the output end of the DC power supply 403 is respectively connected to one end of the equivalent MLCC capacitor 405, the first connection end of the first inductor 401, the other end of the equivalent MLCC capacitor 405 and the second connection end of the first inductor 401 are all connected to the collector of the NPN transistor 404, the second connection end of the second inductor 402 is connected to the base of the NPN transistor 404, and the first connection end of the second inductor 402 and the emitter of the NPN transistor 404 are both grounded.

[0063] Furthermore, the equivalent MLCC capacitor 405 is an equivalent capacitor of the electric card material 4, the first inductor 401 and the second inductor 402 are wound around the equivalent MLCC capacitor 402, and the second inductor 402 is used as inductor feedback to form an inductor three-point oscillation circuit.

[0064] In a specific embodiment, the first inductor 401 and the second inductor 402 are wound around the equivalent MLCC capacitor 405 made of the same electrocard material, and the second inductor 402 is used as an inductor feedback to form an inductor three-point oscillation circuit. After running for a certain period of time, due to the existence of internal resistance, the oscillation generated by the first inductor 401 and the electrocard material equivalent MLCC capacitor 405 gradually weakens and disappears. When the oscillation decays to a certain extent, the second inductor 402 feeds back the electrical quantity to the NPN transistor 404, at which time the NPN transistor 404 is turned on, and the external DC power supply 403 replenishes energy to the LC oscillation circuit to maintain oscillation. After the loss energy is replenished, the second inductor 402 also feeds back the electrical quantity to the NPN transistor 404, at which time the NPN transistor 404 is turned off, and the first inductor 401 and the electrocard material equivalent MLCC capacitor 405 continue to oscillate. The above process will be repeated continuously to maintain the operation of the refrigeration device.

[0065] Among them, the LC frequency oscillation formula is:

[0066]

[0067] Where, L represents the inductance of the magnetic coil; C represents the capacitance of the MLCC electrical card material, f r Represents the output frequency, that is, the oscillation frequency of the circuit.

[0068] A third aspect of the present invention provides a method for adjusting an electrocaloric effect formation period and an oscillation period, the method being used in a circuit for adjusting an electrocaloric effect formation period and an oscillation period, the method comprising the following steps:

[0069] S1. Apply a driving electric field, and the current charges the equivalent MLCC capacitor 405. The temperature of the equivalent MLCC capacitor 405, i.e., the electric card material 4, rises through the electrocaloric effect. At this time, the upper surface of the electric card material 4 contacts the lower surface of the heat dissipation module 1, and the electric card material 4 transfers the heat to the heat dissipation fins 1 and dissipates it into the air.

[0070] S2. Remove the driving electric field, discharge the equivalent MLCC capacitor 405, and the electric energy enters the first inductor magnetic coil 401, i.e., the magnetic coil 6, through the wire, and is converted into magnetic field energy through the inductance effect. The magnetic field generated by the magnetic coil 6 repels the permanent magnet 3, driving the module composed of the electric card material 4, the plurality of middle-layer structures 23 and the magnetic coil 6 to break away from the adsorption of the permanent magnet 3 and move downward. At the same time, after losing the electric field, the electric card material 4 is cooled down under the action of the electric card effect, and the lower surface of the electric card material 4 contacts the upper surface of the heat-generating electronic component 7 for heat exchange.

[0071] S3, the magnetic field energy is converted into the electric field energy of the electrocaloric material 4 through the properties of the LC oscillation circuit, the DC power supply 403 is controlled to output current to the circuit, and the process returns to step S1.

[0072] Among them, by adjusting the period of applying the electric field and removing the electric field, the formation period and oscillation period of the electrocaloric effect can be adjusted.

[0073] Among them, in the LC oscillation circuit formed by the magnetic coil and the MLCC electric card material, the magnetic coil gradually releases the magnetic field energy, so that the magnetic field generated by the magnetic coil is weakened and reversed, so that the magnetic coil drives the electric card material and the model composed of several middle-layer structures to move upward under the magnetic attraction of the permanent magnet under the upper heat dissipation module. At the same time, the energy in the magnetic coil is gradually returned to the MLCC electric card material, and the electric card material is also applied with an electric field to form an electric caloric effect and the temperature rises, and then it contacts with the upper heat dissipation module for heat exchange, and the heat dissipation module takes away the heat of the electric card material and dissipates it into the air.

[0074] Example 3

[0075] Based on the above-mentioned embodiment 1 and embodiment 2, combined Figure 1-Figure 4 This embodiment describes in detail the manufacturing process and use process of an electric card refrigeration device of the present invention.

[0076] In a specific embodiment, the ceramic slurry is first cast into a film, and then the electrode slurry is made into a specific pattern on the ceramic film by screen printing, and multiple layers are stacked and cut into different sizes according to different application ranges, and heated in a furnace to remove part of the solvent, and then sintered at high temperature to achieve reliable interconnection between particles. Then the formed ceramic body is sealed and sintered, and the nickel electrodes at one end of the capacitor are connected together using the copper end external electrodes to form a multilayer ceramic capacitor (MLCC) structure. Figure 2 .

[0077] The prepared electric card material is placed in a support mold prepared by 3D printing or other methods. A magnetic coil is wound around the periphery of the mold. At the same time, there are limit holes on the four corners of the support mold. The limit posts pass through the limit holes to limit its horizontal movement. At the same time, the limit posts are connected to the heat dissipation modules and the heating electronic component modules at the upper and lower ends to provide support for the heat dissipation module at the upper end.

[0078] The heat dissipation module consists of heat dissipation fins, a support plate surface, and permanent magnets. The fins are made of high-quality thermally conductive copper material. The fins are shaped like straight teeth, pointed teeth, etc. to increase the heat dissipation area. The permanent magnet attached to the lower end of the fin is used to provide a constant magnetic field to form a magnetic force with the electromagnetic coil.

[0079] The equivalent inductance of the magnetic coil and the MLCC equivalent capacitance formed by the electric card material are connected to the circuit. A part of the copper coil in the magnetic coil is used as an inductance sensor to sense the circuit condition. After a certain period of circuit operation, the LC oscillation circuit composed of the MLCC and the magnetic coil is compensated for the energy loss caused by the existence of circuit resistance.

[0080] In the initial state, the electrocaloric material is embedded in the supporting mold and the magnetic coil, and the whole is adsorbed by the permanent magnet 3. When a driving electric field is applied, the electrocaloric material made of barium titanate ferroelectric ceramic is equivalent to a capacitor plate, and the current charges the barium titanate ferroelectric ceramic through the nickel electrode. Due to the electrocaloric effect, the temperature of the barium titanate ferroelectric ceramic rises. At this time, the upper surface of the electrocaloric material contacts the lower surface of the heat sink fin, and the electrocaloric material transfers heat to the heat sink fin and then dissipates it to the air.

[0081] When the driving electric field is removed, the electrocardioid material discharges, and the electric energy enters the magnetic coil through the wire. Thanks to the inductance effect, the driving electric field energy is converted into the magnetic field energy of the magnetic coil. The generated magnetic field repels the permanent magnet, driving the module composed of the electrocardioid material, the supporting mold and the magnetic coil to break away from the permanent magnet adsorption and move downward. At the same time, due to the loss of the electric field, the electrocardioid material's temperature drops under the action of the electrocardioid effect. The lower surface of the electrocardioid material contacts the upper surface of the heat-generating electronic component for heat exchange.

[0082] According to the properties of the LC oscillation circuit, the magnetic field energy of the magnetic coil is converted back into the electric field energy of the electrocardial material after a certain time interval. The magnetic field energy of the magnetic coil gradually disappears, and the module composed of the electrocardial material, the supporting mold and the magnetic coil will be attracted upward by the permanent magnet. Since the circuit is not ideal, the LC oscillation will not last forever, and the circuit is energy compensated at this time. The magnetic field energy and a certain amount of compensation energy are converted into electric field energy, and the barium titanate ferroelectric ceramic is charged again, and the temperature of the electrocardial material rises due to the electrocaloric effect. The upper surface of the electrocardial material contacts the lower surface of the heat sink fin again for heat exchange, and the above is a thermodynamic cycle.

[0083] Through continuous circulation, the device continuously transports the heat generated by the electronic components at the low-temperature heating end upward to the heat dissipation end at the higher temperature and dissipates it into the air, effectively reducing the temperature of the electronic components.

[0084] The icons describing the structural positional relationships in the accompanying drawings are for illustrative purposes only and should not be construed as limitations on this patent.

[0085] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. An electric card refrigeration device, characterized in that: The device is arranged on a heat-generating electronic component (7), and comprises: a heat dissipation module (1), a supporting mold (2), a permanent magnet (3), an electric card material (4), and a magnetic coil (6); wherein the heat dissipation module (1) is a heat dissipation fin, the bottom of the heat dissipation module (1) is bonded with a permanent magnet (3), the heat dissipation fin is made of a copper material, and the permanent magnet (3) attached to the lower end of the heat dissipation fin is used to provide a constant magnetic field and form a magnetic force with the energized magnetic coil (6); a cavity is provided inside the supporting mold (2), and the electric card material (4) is arranged in a supporting structure formed by the magnetic coil (6) and in the cavity; the electric card material (4) is arranged in a supporting structure formed by the magnetic coil (6) and in the cavity; The card material (4) is a multilayer ceramic capacitor MLCC electric card material, the MLCC electric card material is composed of a plurality of nickel electrodes (8) and a plurality of barium titanate ferroelectric ceramics (9) alternately stacked, and copper-terminal external electrodes (10) are arranged on two opposite sides of the MLCC electric card material; an opening connected to the cavity is arranged at the bottom of the supporting mold (2), the opening cooperates with the heat-generating electronic component (7), a heat dissipation port connected to the cavity is arranged at the top of the supporting mold (2), the bottom of the heat dissipation module (1) is arranged in the heat dissipation port, and the supporting mold (2) comprises a top structure (21), a bottom structure (2 2) and a plurality of middle-layer structures (23); the electrocaloric refrigeration device also includes a circuit for adjusting the formation period and oscillation period of the electrocaloric effect, the circuit including: a DC power supply (403), an equivalent MLCC capacitor (405), a magnetic coil and an NPN-type triode (404), the magnetic coil including: a first inductor (401) and a second inductor (402), the specific connection relationship being: the output end of the DC power supply (403) is respectively connected to one end of the equivalent MLCC capacitor (405), the first connection end of the first inductor (401), the other end of the equivalent MLCC capacitor (405) and the first inductor (402); 1) are connected to the collector of the NPN transistor (404), the second connection end of the second inductor (402) is connected to the base of the NPN transistor (404), and the first connection end of the second inductor (402) and the emitter of the NPN transistor (404) are grounded; the equivalent MLCC capacitor (405) is an equivalent capacitor of the electrocardial material (4), the first inductor (401) and the second inductor (402) are wound around the equivalent MLCC capacitor (405), and the second inductor (402) is used as an inductor feedback to form an inductor three-point oscillation circuit.

2. The electric card refrigeration device according to claim 1, characterized in that: The top structure (21) is used to fix the heat dissipation module (1), the bottom structure (22) is used to fix on the heat generating electronic component (7), and the plurality of middle-layer structures (23) are used to fix the magnetic coil (6) and the electric card material (4).

3. The electric card refrigeration device according to claim 2, characterized in that: The top structure (21), the bottom structure (22) and the plurality of middle-layer structures (23) are all rectangular.

4. The electric card refrigeration device according to claim 3, characterized in that: Limiting holes are provided at four top corners of each part of the top structure (21), the bottom structure (22) and the plurality of middle-layer structures (23), and limiting columns (5) are provided in the limiting holes. The top structure (21), the bottom structure (22) and the plurality of middle-layer structures (23) are connected together via the limiting columns (5); wherein the limiting columns (5) are used to support the top structure (21) and prevent the top structure (21) and the plurality of middle-layer structures (23) from being displaced in the horizontal direction.

5. A method for adjusting the formation period and oscillation period of the electrocaloric effect, the method being used for an electrocaloric refrigeration device according to any one of claims 1 to 4, the method comprising the following steps: S1, applying a driving electric field, the current charges the equivalent MLCC capacitor (405), and the temperature of the equivalent MLCC capacitor (405), i.e., the electrocaloric effect, rises, so that the upper surface of the electrocaloric material (4) contacts the lower surface of the heat dissipation module (1), and the electrocaloric material (4) transfers heat to the heat dissipation module (1) and dissipates it into the air; S2, the driving electric field is removed, the equivalent MLCC capacitor (405) is discharged, and the electric energy enters the first inductor coil (401), i.e., the magnetic coil (6), through the wire, and is converted into magnetic field energy through the inductance effect. The magnetic field generated by the magnetic coil (6) repels the permanent magnet (3), driving the module composed of the electric card material (4), the plurality of middle-layer structures (23) and the magnetic coil (6) to break away from the adsorption of the permanent magnet (3) and move downward. At the same time, after losing the electric field, the electric card material (4) is cooled down under the action of the electric card effect, and the lower surface of the electric card material (4) contacts the upper surface of the heat-generating electronic component (7) for heat exchange; S3, the magnetic field energy is converted into the electric field energy of the electrocaloric material (4) through the properties of the LC oscillation circuit, the DC power supply (403) is controlled to output current to the circuit, and the process returns to step S1.

Images