Light emitting component and light module

Abstract

The application discloses a light emitting assembly and a light module. The light emitting assembly comprises a heat dissipation base, an adapter, a light emitting assembly, a combiner, a refrigeration chip, a converging lens, a shell and a heat conductive glue. The heat dissipation base comprises a heat dissipation body and first and second heat dissipation plate bodies which are extended to form a T-shaped or L-shaped structure, the two sides of the second heat dissipation plate body are connected to the surfaces of the heat dissipation body and the first heat dissipation plate body; the converging lens and part of the adapter are arranged in the through hole of the heat dissipation body; the light emitting assembly and the combiner are arranged on the second heat dissipation plate body, the combiner combines the light beams emitted by the multiple light emitting chips of the light emitting assembly into one light beam, and then the light beam enters the adapter through the converging lens; the refrigeration chip is arranged on the surface of the first heat dissipation plate body opposite to the second heat dissipation plate body; the heat dissipation base, the light emitting chip, the combiner and the refrigeration chip are arranged in the shell, the adapter passes through the first through hole and comes out of the shell, and the refrigeration chip corresponds to the second through hole of the shell; the heat conductive glue is filled between the second through hole and the refrigeration chip and the shell.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of communication technology, and in particular to an optical transmitting assembly and an optical module. BACKGROUND

[0002] In modern communication systems, the growth of network traffic demand is very rapid. Therefore, fiber broadband has gradually become the mainstream, making optical modules quite important. The existing optical module usually adopts wavelength division multiplexing (WDM) technology to combine the multiple light beams emitted by multiple light emitting chips placed on the same plane in the optical transmitting assembly into one light beam, so as to accommodate more optical signals through a single optical fiber cable, improve the optical signal transmission amount of the optical fiber cable, and thus improve the transmission capacity of information.

[0003] However, the design of placing multiple light emitting chips on the same plane may cause the heat generated by the multiple light emitting chips to be unable to be effectively dissipated through the bearing base, thereby shortening the service life of the light emitting chips.

[0004] Therefore, how to provide a solution to the above technical problems is a problem that needs to be solved by those skilled in the art at present. SUMMARY

[0005] The embodiments of the present application provide an optical transmitting assembly and an optical module, which can solve the problem that the design of placing multiple light emitting chips on the same plane in the existing optical transmitting assembly may cause the heat generated by the multiple light emitting chips to be unable to be effectively dissipated through the bearing base, thereby shortening the service life of the light emitting chips.

[0006] In order to solve the above technical problems, the present application is implemented as follows:

[0007] The application provides a light emitting assembly, which comprises a heat dissipation base, a converging lens, an adapter, a light emitting assembly, a beam combiner, a refrigeration chip, a heat conducting shell and heat conducting glue. The heat dissipation base comprises a heat dissipation body and first and second heat dissipation plate bodies which are arranged along a first direction and extend from the heat dissipation body, the first and second heat dissipation plate bodies form a T-shaped structure or an L-shaped structure, two adjacent side edges of the second heat dissipation plate body are connected to a surface of the heat dissipation body and a surface of the first heat dissipation plate body respectively, and the heat dissipation body is provided with a through hole along the first direction. The converging lens is arranged in the through hole; one end of the adapter is inserted into the through hole; the light emitting assembly is arranged on the second heat dissipation plate body and comprises a plurality of light emitting chips; the beam combiner is arranged on the second heat dissipation plate body and located between the plurality of light emitting chips and the converging lens, and is used for combining light beams emitted by the plurality of light emitting chips into one light beam and making the one light beam converge to the adapter through the converging lens; and the refrigeration chip is arranged on a surface of the first heat dissipation plate body opposite to the second heat dissipation plate body. One end of the heat conducting shell is provided with a first through hole along the first direction and a second through hole along a second direction, the first direction and the second direction are perpendicular to each other; the heat dissipation base, the plurality of light emitting chips, the beam combiner and the refrigeration chip are arranged in the heat conducting shell, the adapter passes out of the heat conducting shell from the first through hole, and the refrigeration chip is arranged corresponding to the second through hole; and the heat conducting glue is filled between the second through hole and the refrigeration chip and the heat conducting shell, so that the refrigeration chip and the heat conducting shell are in heat conduction connection.

[0008] The application provides a light module, which comprises a light receiving assembly and the light emitting assembly.

[0009] In the embodiment of the light emitting assembly, the first and second heat dissipation plate bodies form a T-shaped structure or an L-shaped structure, the light emitting chips are placed on the second heat dissipation plate body, and the refrigeration chip is arranged on a surface of the first heat dissipation plate body opposite to the second heat dissipation plate body, so that the heat energy generated by the plurality of light emitting chips placed on the same plane can be effectively dissipated through the refrigeration chip on the heat dissipation base and the heat conducting shell. BRIEF DESCRIPTION OF DRAWINGS

[0010] The accompanying drawings, which are included to provide a further understanding of the application and constitute a part of this application, illustrate certain illustrative embodiments of the application and are used to explain the application, but do not limit the application. In the drawings:

[0011] Figure 1 It is a perspective view of an embodiment of the light emitting assembly according to the application;

[0012] Figure 2 It is a first perspective view of the light emitting assembly; Figure 1

[0013] Figure 3 It is a second perspective view of the light emitting assembly; and Figure 1 ​a first perspective exploded view of the light emitting assembly of

[0014] Figure 4 a combined side view of the heat sink, the light emitting assembly and the combiner of Figure 1

[0015] Figure 5 a first perspective exploded view of the light emitting assembly of Figure 2

[0016] Figure 6 a first perspective exploded view of the light emitting assembly of

[0017] Figure 7 a first perspective exploded view of the light emitting assembly of Figure 6

[0018] Figure 8 a first perspective exploded view of the light emitting assembly of Figure 6

[0019] Figure 9 a first perspective exploded view of the light emitting assembly of

[0020] Figure 10 a first perspective exploded view of the light emitting assembly of Figure 9

[0021] Figure 11 a first perspective exploded view of the light emitting assembly of

[0022] Figure 12 a first perspective exploded view of the light emitting assembly of Figure 11

[0023] a first perspective exploded view of the light emitting assembly of Figure 13 Figure 11 a first perspective exploded view of the light emitting assembly of

[0024] Figure 14 Figure 11 a first perspective exploded view of the light emitting assembly of

[0025] Figure 15 a first perspective exploded view of the light emitting assembly of DETAILED DESCRIPTION

[0026] Embodiments of the present application will be described below with reference to the accompanying drawings. In these drawings, like reference numerals indicate like or similar components or method flows.

[0027] ​​​​​​​It must be understood that the terms "comprise", "comprising", "include", "including", and the like used herein are configured to be understood in an inclusive manner, such that they allow for addition of more features, steps, processes, and / or components to the described technology.

[0028] It must be understood that when a component is described as "connected" or "coupled" to another component, it can be directly linked or coupled to the other component, and there can be intervening components. Conversely, when a component is described as "directly connected" or "directly coupled" to another component, there are no intervening components.

[0029] Please refer to Figures 1 to 4 , Figure 1 for a perspective view of an embodiment of the light emitting assembly according to the present application, Figure 2 for Figure 1 a first perspective view of the light emitting assembly, Figure 3 for Figure 1 a second perspective view of the light emitting assembly, Figure 4 for Figure 1 a combined side view of the heat dissipation base, the light emitting assembly, and the combiner. As shown in Figures 1 to 4 , the light emitting assembly 1 comprises a heat dissipation base 11, a converging lens 12, an adapter 13, a light emitting assembly 14, a combiner 15, a refrigeration chip 16, a heat conducting shell 17, and a heat conducting glue 18. The heat dissipation base 11 comprises a heat dissipation body 111, a first heat dissipation plate body 112, and a second heat dissipation plate body 113, wherein the first heat dissipation plate body 112 and the second heat dissipation plate body 113 form a T-shaped structure or an L-shaped structure, the adjacent two side edges of the second heat dissipation plate body 113 are connected to a surface S1 of the heat dissipation body 111 and a surface S2 of the first heat dissipation plate body 112 respectively, and the heat dissipation body 111 is provided with a through hole 1111 in the first direction F. In this embodiment, the first heat dissipation plate body 112 and the second heat dissipation plate body 113 form an L-shaped structure; the heat dissipation body 111, the first heat dissipation plate body 112, and the second heat dissipation plate body 113 can be integrally formed; the material of the heat dissipation base 11 can be a metal material or an alloy material, so that it has good heat conduction characteristics, specifically, the material of the heat dissipation base 11 can be one or a combination of gold, aluminum, copper, platinum, titanium, and chromium; but this embodiment is not used to limit the present application.

[0030] In the embodiment, the converging lens 12 is arranged in the through hole 1111; one end of the adapter 13 is inserted into the through hole 1111, and the adapter 13 can be but is not limited to a single-mode adapter; the light-emitting assembly 14 is arranged on the second heat dissipation plate body 113 and includes a plurality of light-emitting chips 141, the number of the light-emitting chips 141 can be but is not limited to four, the wavelengths of the light beams emitted by each of the light-emitting chips 141 are all different, the light-emitting chips 141 can be but are not limited to laser chips, and the light-emitting chips 141 are used for emitting light beams towards the heat dissipation body 111; the beam combiner 15 is arranged on the second heat dissipation plate body 113 and located between the four light-emitting chips 141 and the converging lens 12, and is used for combining the light beams emitted by the four light-emitting chips 141 into one light beam (i.e., combining four light beams of different wavelengths into one light beam) and making the one light beam pass through the converging lens 12 to converge to the adapter 13.

[0031] In the embodiment, the refrigeration chip 16 is arranged on the surface S3 of the first heat dissipation plate body 112 opposite to the second heat dissipation plate body 113; one end of the heat-conducting shell 17 is provided with a first through hole 171 along the first direction F and a second through hole 172 along the second direction W, the number of the second through hole 172 can be but is not limited to two, and the first direction F and the second direction W are perpendicular to each other; the heat dissipation base 11, the plurality of light-emitting chips 141, the beam combiner 15 and the refrigeration chip 16 are arranged in the heat-conducting shell 17, the adapter 13 passes out of the heat-conducting shell 17 from the first through hole 171 (i.e., the through hole 1111 corresponds to the first through hole 171), and the refrigeration chip 16 is arranged corresponding to the second through hole 172; the heat-conducting adhesive 18 is filled between the second through hole 172 and the refrigeration chip 16 and the heat-conducting shell 17, so as to make the refrigeration chip 16 and the heat-conducting shell 17 in thermal conductive connection.

[0032] It should be noted that the heat dissipation base 11 and the heat-conducting shell 17 in the embodiment are only substantially connected through the refrigeration chip 16 and the heat-conducting adhesive 18, but the embodiment is not used to limit the present application. In addition, in order to strengthen the heat conduction between the heat dissipation base 11 and the heat-conducting shell 17, the heat-conducting shell 17 can also be provided with a third through hole 173 along the second direction W, and the heat dissipation body 111 is arranged corresponding to the third through hole 173; the heat-conducting adhesive 18 can also be filled between the third through hole 173 and the heat dissipation body 111 and the heat-conducting shell 17, so as to make the heat dissipation body 111 and the heat-conducting shell 17 in thermal conductive connection.

[0033] Therefore, the light emitting assembly 1 of the present embodiment realizes the emission of four light emitting beams, and the heat generated by the four light emitting chips 141 can be dissipated through the second heat dissipation plate 113, the first heat dissipation plate 112, the refrigeration chip 16 and the heat conductive shell 17, thereby solving the heat dissipation problem of the prior art. In addition, the heat conductive shell 17 is arranged, which not only helps to dissipate the heat of the four light emitting chips 141, but also protects the heat dissipation base 11, the four light emitting chips 141, the combiner 15 and the refrigeration chip 16, prevents water vapor and / or dust from entering the inside of the heat conductive shell 17, and affects the functions of the light emitting chips 141, the combiner 15 and the refrigeration chip 16.

[0034] In an embodiment, the adapter 13 can include a sleeve 131, the converging lens 12 is fixed in the sleeve 131, the sleeve 131 is inserted into the through hole 1111 (i.e. one end of the adapter 13 is inserted into the through hole 1111, and the other end of the adapter 13 protrudes from the outer surface of the heat dissipation body 111), and the adapter 13 can be but not limited to a single-mode adapter. In addition, the adapter 13 can also include an optical fiber ferrule and other necessary devices, which are not described one by one here.

[0035] In an embodiment, the light emitting assembly 14 can further include a circuit board 142 electrically connected to the plurality of light emitting chips 141 and extending in the first direction F; the other end of the heat conductive shell 17 is provided with an opening along the first direction F, and the circuit board 142 extends out of the heat conductive shell 17 from the opening to receive an electric signal from the outside for driving the plurality of light emitting chips 141 to emit light beams, and transmit the electric signal to the plurality of light emitting chips 141.

[0036] In an embodiment, the heat conductive shell 17 can include a cover body 175 and a cover body 176, the cover body 176 covers the opening 1751 of the cover body 175 to form a containing space, the heat dissipation base 11, the plurality of light emitting chips 141, the combiner 15 and the refrigeration chip 16 are arranged in the containing space, the cover body 176 is provided with the opening through which the circuit board 142 extends out of the heat conductive shell 17, and the cover body 175 is provided with the first through hole 171 and the second through hole 172. The cover body 176 can include a first cover shell 1761 and a second cover shell 1762, the notch 17611 on the first cover shell 1761 and the protrusion 17621 on the second cover shell 1762 cooperate to form the opening along the first direction F for clamping the circuit board 142 (i.e. the opening through which the circuit board 142 extends out of the heat conductive shell 17).

[0037] In an embodiment, the light emitting component 14 can further include a plurality of collimating lenses 143 disposed on the second heat sink body 113, the plurality of light emitting chips 141 and the plurality of collimating lenses 143 correspond to each other one-to-one (i.e., the number of the light emitting chips 141 is equal to the number of the collimating lenses 143), and each light beam emitted by each light emitting chip 141 enters the combiner 15 through the corresponding collimating lens 143. In this embodiment, the collimating lens 143 and the corresponding light emitting chip 141 can be assembled by using an active alignment or passive alignment optical path alignment technology.

[0038] In an embodiment, the second heat sink body 113 can be provided with a first bearing seat 1131 and a second bearing seat 1132, the first bearing seat 1131 bears the plurality of light emitting chips 141, and the second bearing seat 1132 bears the circuit board 142; the height of the first bearing seat 1131 is greater than the height of the second bearing seat 1132, and the plurality of light emitting chips 141 and the surface S4 of the circuit board 142 electrically connected to the plurality of light emitting chips 141 are located at the same height (as shown in Figure 4 In this embodiment, the first bearing seat 1131 and the second bearing seat 1132 can form a stepped structure; the circuit board 142 is attached to the second bearing seat 1132 by using an adhesive 9 (e.g., a thermally conductive adhesive), so that the plurality of light emitting chips 141 and the surface S4 of the circuit board 142 electrically connected to the plurality of light emitting chips 141 are located at the same height; the plurality of light emitting chips 141 and the surface S4 of the circuit board 142 electrically connected to the plurality of light emitting chips 141 located at the same height is beneficial to wire bonding and shortens the wire bonding length; the circuit board 142 can be, but is not limited to, a printed circuit board (PCB), a flexible printed circuit (FPC), or a rigid-flex printed circuit board.

[0039] In an embodiment, the combiner 15 can be a thin film filter (TFF) or an arrayed waveguide grating (AWG).

[0040] In an embodiment, when the combiner 15 is a thin film filter, the light entrance surface of the combiner 15 is provided with a plurality of thin film filters 151 corresponding to the plurality of light emitting chips 141, the light exit surface of the combiner 15 is provided with a reflective film 152 and an exit port 153, and the light beams emitted by the plurality of light emitting chips 141 enter the combiner 15 through the plurality of thin film filters 151, are reflected by the reflective film 152, and are combined into one light beam which is emitted from the exit port 153.

[0041] Specifically, please refer to Figure 5 , which is Figure 2A bottom-view schematic diagram of the optical path of the light-emitting component. (See diagram below.) Figure 5 As shown, the thin-film filter 151 is a bandpass filter, used to allow light beams of a specific wavelength emitted by the corresponding light-emitting chip 141 to pass through, while reflecting light beams of other wavelengths; some of the multiple light-emitting chips 141 (i.e., Figure 5 The light beam emitted by the topmost light-emitting chip 141 in the diagram, passing through the corresponding thin-film filter 151 and entering the combiner 15, can pass straight through the light outlet 153 and illuminate the converging lens 12. The other light-emitting chips 141 (i.e., Figure 5 In the diagram, the light beams emitted by the second to fourth light-emitting chips (141) at the top enter the combiner 15, and after being reflected by the reflective film 152 and the non-corresponding thin-film filter 151, they are combined with... Figure 5 The light beam emitted by the topmost light-emitting chip 141 in the diagram and passing through the corresponding thin-film filter 151 into the combiner 15 is combined into a single light beam emitted from the light outlet 153. The light outlet 153 may be provided with an anti-reflection film 1531 to increase the transmittance of the single light beam emitted from the light outlet 153.

[0042] Please see Figures 6 to 8 , Figure 6 This is a perspective view of another embodiment of the light emitting component according to this application. Figure 7 for Figure 6 A first-person view of the explosion of the light-emitting component. Figure 8 for Figure 6 A second-view explosion diagram of a light-emitting component. (See diagram for example.) Figures 6 to 8 As shown, Figure 6 Light emitting component 2 and Figure 2 The difference between the light emitting components 1 is that... Figure 6 The first heat sink 112 and the second heat sink 113 form a T-shaped structure. The number of each of the following components—light-emitting assembly 14, converging lens 12, adapter 13, wave combiner 15, through hole 1111, first through hole 171, and the opening along the first direction F of the heat-conducting housing 17 (i.e., the opening extending from the heat-conducting housing 17 by the circuit board 142)—are two and correspondingly arranged. The two light-emitting assemblies 14, two converging lenses 12, two adapters 13, two through holes 1111, and two wave combiners 15 are symmetrically arranged relative to the second heat sink 113. Specifically, Figure 6The light emitting assembly 2 includes two sets of multi-optical path configurations (each set includes a light-emitting component 14, a converging lens 12, an adapter 13, a combiner 15, a through hole 1111 in the heat sink 111, a first through hole 171 in the heat-conducting housing 17, and a circuit board 142 extending from an opening in the heat-conducting housing 17), and the two sets of multi-optical path configurations are symmetrically arranged with the second heat sink 113 as the plane of symmetry. That is, through the T-shaped structure design formed by the first heat sink 112 and the second heat sink 113, the light emitting assembly 2 can include two symmetrically arranged multi-optical path configurations, relative to... Figure 2 The addition of a multi-optical-path configuration to the light-emitting component 1 also increases the output transmission capacity of the light-emitting component 2. Furthermore, the heat generated by the two light-emitting components 14 can be dissipated through the second heat sink 113, the first heat sink 112, the cooling chip 16, and the heat-conducting housing 17, thus solving the heat dissipation problem existing in the prior art.

[0043] In one embodiment, the light emitting component 2 may further include a third heat dissipation plate 114 extending from the heat dissipation body 111 along a first direction F and arranged parallel to the first heat dissipation plate 112, and another cooling chip 16. The first heat dissipation plate 112, the second heat dissipation plate 113, and the third heat dissipation plate 114 form an H-shaped structure. The other cooling chip 16 is disposed on the surface S5 of the third heat dissipation plate 114 that is connected to the second heat dissipation plate 113. The heat-conducting housing 17 is also provided with a fourth through hole 177, and the other cooling chip 16 is disposed corresponding to the fourth through hole 177. Thermally conductive adhesive 18 is also filled between the fourth through hole 177 and the other cooling chip 16 and the heat-conducting housing 17 to make the other cooling chip 16 and the heat-conducting housing 17 thermally connected (e.g., Figure 9 and Figure 10 As shown, Figure 9 This is a first-view exploded view of an embodiment of the light emitting component according to this application. Figure 10 for Figure 9 (A second-view exploded view of the light emitting component). Additionally, the heat-conducting housing 17 may also be provided with two third through holes 173, and the heat dissipation body 111 is provided corresponding to the two third through holes 173; thermally conductive adhesive 18 may also be filled between the two third through holes 173 and between the heat dissipation body 111 and the heat-conducting housing 17, so that the heat dissipation body 111 and the heat-conducting housing 17 are thermally connected. Through the first heat dissipation plate 112, the second heat dissipation plate 113, and the third heat dissipation plate 114 forming an H-shaped structure, a cooling chip 16 is disposed on the surface S3 of the first heat dissipation plate 112 and thermally connected to the heat-conducting housing 17, and another cooling chip 16 is disposed on the surface S5 of the third heat dissipation plate 114 and thermally connected to the heat-conducting housing 17. Therefore, the light emitting component 2 has two heat dissipation paths (i.e., heat dissipation through two cooling chips 16), which can disperse heat conduction and improve heat dissipation efficiency.

[0044] Referring to Figure 11 and Figure 12 , Figure 11 is a first perspective exploded schematic view of a light emitting assembly according to the present application, Figure 12 is Figure 11 a second perspective exploded schematic view of the light emitting assembly. As Figure 11 and Figure 12 shown, Figure 11 the difference between the light emitting assembly 3 of Figure 6 and the light emitting assembly 2 of Figure 6 the light emitting assembly 2 comprises two combiners 15, Figure 11 the light emitting assembly 3 comprises only one combiner 25, which is also symmetrically arranged relative to the second heat sink body 113 (i.e. two combiners 15 are integrated into one combiner 25); the second heat sink body 113 is provided with a notch 1133, and the combiner 25 is arranged in the notch 1133 and fixed to the second heat sink body 113; the combiner 25 is also used for combining the light beams emitted by the plurality of light emitting chips 141 of each light emitting assembly 14 into one light beam, and making the one light beam pass through the corresponding converging lens 12 to converge to the corresponding adapter 13.

[0045] Referring to Figures 11 to 14 , Figure 13 is Figure 11 a lower view of the light path of the light emitting assembly, Figure 14 is Figure 11 a side view of the light path of the light emitting assembly. As Figures 11 to 14 shown, when the combiner 25 is a thin film filter, the light entrance surface of the combiner 25 is symmetrically provided with a plurality of thin film filters 251 corresponding to the plurality of light emitting chips 141 of each light emitting assembly 14 relative to the second heat sink body 113, and the light exit surface of the combiner 25 is symmetrically provided with a reflecting film 252 and an exit opening 253 corresponding to each light emitting assembly 14 relative to the second heat sink body 113; the light beams emitted by the plurality of light emitting chips 141 of each light emitting assembly 14 pass through the corresponding plurality of thin film filters 251 into the combiner 25, and are reflected by the corresponding reflecting film 252 to combine the one light beam emitted from the corresponding exit opening 253.

[0046] Specifically, the thin film filter 251 is a band-pass filter, which is used for allowing the light beams with a specific wavelength emitted by the corresponding light emitting chip 141 to pass through, and reflecting light beams with other wavelengths; since the two sets of multi-light paths are symmetrically arranged, the description of each set of multi-light paths is made with Figure 13 , Figure 13 is Figure 14 a schematic view of the light path configuration of the light emitting assembly 14 above the drawing surface, Figure 13In the middle, some of the multiple light-emitting chips 141 (i.e., Figure 13 The light beam emitted by the topmost light-emitting chip 141 in the diagram, passing through the corresponding thin-film filter 251 and entering the combiner 25, can pass straight through the corresponding light outlet 253 and illuminate the corresponding converging lens 12. The other light-emitting chips 141 (i.e., Figure 13 In the diagram, the light beams emitted by the second to fourth light-emitting chips (141) at the top enter the combiner 25, and after reflection by the corresponding reflective film 252 and the non-corresponding thin-film filter 251, they are combined with... Figure 13 In the diagram, the light beam emitted by the topmost light-emitting chip 141, passing through the corresponding thin-film filter 251 and entering the combiner 25, is combined into a single light beam emitted from the corresponding exit port 253. The exit port 253 may be equipped with an anti-reflection film 2531 to increase the transmittance of the single light beam emitted from it. It should be noted that because the combiner 25 is symmetrically arranged relative to the second heat sink 113, and the light beam emitted by each light-emitting chip 141 first passes through the corresponding collimating lens 143 before entering the combiner 25, different light-emitting chips...

[0047] The multiple beams emitted by component 14 will not interfere with each other (i.e.) Figure 14 In the diagram, the light-emitting component 145 at the top will only be incident on the corresponding converging lens 12 through the upper half of its corresponding multiplexer 25. Figure 14 The picture

[0048] The lower center light-emitting component 14 will only be incident on the corresponding converging lens 12 through the lower half of its corresponding combiner 25.

[0049] Please see Figure 15 This is a schematic diagram of an embodiment of the optical module according to this application.

[0050] Figure 15 As shown, the optical module 4 may include an optical receiving component 41 and an optical emitting component 1. It should be noted that the optical module 4 may also include other necessary components such as a heat-conducting shell (not shown) and an electrical interface circuit. The cooling chip 16 can be thermally connected to the heat-conducting shell 17 to help dissipate heat from the multiple light-emitting chips 141 of the optical emitting component 1. These will not be described in detail here.

[0051] In summary, in this application, the light emitting component is connected to the second heat sink via a first heat sink.

[0052] The second heat dissipation plate body forms a T-shaped structure or an L-shaped structure with the light emitting chip and its optical path related devices, and the refrigeration chip is disposed on the surface of the first heat dissipation plate body opposite to the surface connected with the second heat dissipation plate body, so that the heat generated by the multiple light emitting chips disposed on the same plane can be effectively dissipated through the refrigeration chip on the heat dissipation base via the heat conductive shell. In addition, through the design of the T-shaped structure formed by the first heat dissipation plate body and the second heat dissipation plate body, the light emitting assembly can include two groups of symmetrically disposed multiple optical path configurations, increasing the output of the light emitting assembly

[0053] In addition, through the H-shaped structure formed by the first heat dissipation plate body, the second heat dissipation plate body and the third heat dissipation plate body, the refrigeration chip disposed on the surface of the first heat dissipation plate body and thermally connected with the heat conductive shell, and the other refrigeration chip disposed on the surface of the third heat dissipation plate body and thermally connected with the heat conductive shell, the light emitting assembly has two heat dissipation paths (i.e. heat dissipation through two refrigeration chips), which can disperse heat conduction and improve heat dissipation efficiency.

[0054] Although the present application is explained by using the above embodiments, it should be noted that these descriptions

[0055] are not configured to limit the present application. On the contrary, the present application covers all the modifications and similar arrangements obvious to those skilled in the art. Therefore, the scope of the claims should be interpreted in the broadest way to include all the modifications and similar arrangements obvious to those skilled in the art.

Claims

1. A light emitting component, characterized in that, include: A heat dissipation base includes a heat dissipation body and a first heat dissipation plate and a second heat dissipation plate extending from the heat dissipation body along a first direction. The first heat dissipation plate and the second heat dissipation plate form a T-shaped structure or an L-shaped structure. The adjacent two sides of the second heat dissipation plate are respectively connected to the surface of the heat dissipation body and the surface of the first heat dissipation plate. The heat dissipation body is provided with a through hole along the first direction. A converging lens is disposed within the through hole; An adapter, one end of which is inserted into the through hole; A light-emitting component is disposed on the second heat sink and includes multiple light-emitting chips; A beam combiner is disposed on the second heat sink, located between the plurality of light-emitting chips and the converging lens, and is used to combine the light beams emitted by the plurality of light-emitting chips into a single beam, and to converge the single beam to the adapter through the converging lens; A cooling chip is disposed on the surface of the first heat sink body that is connected to the second heat sink body; A heat-conducting housing has a first through hole along the first direction and a second through hole along the second direction at one end, the first direction and the second direction being perpendicular to each other; the heat dissipation base, the plurality of light-emitting chips, the wave combiner and the cooling chip are disposed inside the heat-conducting housing, the adapter passes through the heat-conducting housing from the first through hole, and the cooling chip is disposed corresponding to the second through hole; as well as Thermally conductive adhesive is filled between the second through hole and the cooling chip and the thermally conductive housing to make the cooling chip and the thermally conductive housing thermally connected.

2. The light emitting component as described in claim 1, characterized in that, The adapter includes a sleeve, the converging lens is fixed inside the sleeve, and the sleeve is inserted into the through hole.

3. The light emitting component as described in claim 1, characterized in that, The light-emitting component also includes a circuit board, which is electrically connected to the plurality of light-emitting chips and extends in the first direction; the other end of the heat-conducting housing has an opening in the first direction, and the circuit board extends out of the heat-conducting housing from the opening.

4. The light emitting component as described in claim 3, characterized in that, The heat-conducting housing includes a cover and a cap. The cap covers the opening of the cover to form an accommodating space. The heat dissipation base, the plurality of light-emitting chips, the wave combiner and the cooling chip are disposed in the accommodating space. The cap has the opening along the first direction. The cover has the first through hole and the second through hole.

5. The light emitting component as described in claim 3, characterized in that, The second heat sink is provided with a first support and a second support. The first support supports the plurality of light-emitting chips, and the second support supports the circuit board. The height of the first support is greater than the height of the second support, and the surfaces of the plurality of light-emitting chips and the circuit board that are electrically connected to the plurality of light-emitting chips are at the same height.

6. The light emitting component as described in claim 3, characterized in that, The first heat sink and the second heat sink form the T-shaped structure. The number of openings along the first direction of the light-emitting component, the converging lens, the adapter, the wave combiner, the through hole, the first through hole, and the heat-conducting shell are all two and correspondingly arranged. The two light-emitting components, the two converging lenses, the two adapters, the two through holes, and the two wave combiners are symmetrically arranged with respect to the second heat sink.

7. The light emitting component as described in claim 6, characterized in that, It also includes a third heat sink extending from the heat sink body along the first direction and arranged parallel to the first heat sink body, and another cooling chip. The first heat sink body, the second heat sink body, and the third heat sink body form an H-shaped structure. The other cooling chip is disposed on the surface of the third heat sink body that is connected to the second heat sink body. The thermally conductive housing is also provided with a fourth through hole along the second direction, and the other cooling chip is disposed corresponding to the fourth through hole. The thermally conductive adhesive is also filled between the fourth through hole and the other cooling chip and the thermally conductive housing 5, so that the other cooling chip is thermally connected to the thermally conductive housing.

8. The light emitting component as described in claim 3, characterized in that, The first heat sink and the second heat sink form the T-shaped structure. The number of openings along the first direction of the light-emitting component, the converging lens, the adapter, the through hole, the first through hole, and the heat-conducting housing are all two and correspondingly arranged. The two light-emitting components, the two converging lenses, the two adapters, the two through holes, and the wave combiner are symmetrically arranged with respect to the second heat sink. The second heat sink has a notch, and the wave combiner is disposed in the notch and fixed to the second heat sink. The wave combiner is also used to combine the light beams emitted by the plurality of light-emitting chips of each light-emitting component into a single light beam, and to converge the single light beam to the corresponding adapter through the corresponding converging lens.

9. The light emitting component as described in claim 8, characterized in that, When the beam combiner is a thin-film filter, the light-incident surface of the beam combiner is symmetrically arranged with respect to the second heat sink with multiple thin-film filters corresponding to the multiple light-emitting chips of each light-emitting component, and the light-emitting surface of the beam combiner is symmetrically arranged with respect to the second heat sink with a reflective film and a light-emitting port corresponding to each light-emitting component. The light beam emitted by the multiple light-emitting chips of each light-emitting component enters the beam combiner after passing through the corresponding multiple thin-film filters, and is reflected by the corresponding reflective film to be combined into a single light beam emitted from the corresponding light-emitting port.

10. The light emitting component as claimed in claim 1, characterized in that, When the beam combiner is a thin-film filter, the light-incident surface of the beam combiner is provided with multiple thin-film filters corresponding to the multiple light-emitting chips, and the light-emitting surface of the beam combiner is provided with a reflective film and a light-emitting port. After the light beams emitted by the multiple light-emitting chips enter the beam combiner through the multiple thin-film filters, they are reflected by the reflective film and combined into a single light beam emitted from the light-emitting port.

11. The light emitting component as described in claim 9 or 10, characterized in that, The light outlet is equipped with an anti-reflection film.

12. The light emitting component as claimed in claim 1, characterized in that, The combiner is a thin-film filter or an arrayed waveguide grating.

13. The light emitting component as claimed in claim 1, characterized in that, The light-emitting component also includes a plurality of collimating lenses disposed on the second heat sink. The plurality of light-emitting chips correspond one-to-one with the plurality of collimating lenses, and the light beam emitted by each light-emitting chip enters the beam combiner through the corresponding collimating lens.

14. An optical module, characterized in that, include: An optical receiving component and an optical emitting component as described in any one of claims 1 to 13.

15. The optical module as described in claim 14, characterized in that, It also includes a thermally conductive housing, through which the cooling chip is thermally connected to the thermally conductive housing.

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