Loading mechanism and wafer bonding apparatus

Abstract

The application provides a loading mechanism and a wafer bonding device. The loading mechanism comprises a first loading unit, a second loading unit and a lifting unit. The first loading unit comprises a plurality of first pins, the end portions of the plurality of first pins jointly define a loading plane and a loading area. The second loading unit comprises a plurality of second pins, the end portions of the plurality of second pins jointly define a loading plane and a loading area. The two loading planes are parallel to each other, and the two loading areas are opposite to each other. The lifting unit can drive the first loading unit and the second loading unit to jointly move along a target direction, and can also drive the second loading unit to individually move along the target direction, and the target direction is perpendicular to the loading plane. According to the technical scheme of the application, two loading planes that do not interfere with each other are constructed in the same area, the compactness of the structure is greatly improved, and the space utilization is improved. There is a large open space between the plurality of pins, and a large enough operation space can be provided for external loading and unloading equipment.

Description

Technical Field

[0001] This invention relates to the field of wafer bonding technology, and particularly to a loading mechanism and wafer bonding equipment. Background Technology

[0002] As the demands for chip functionality continue to increase, improving performance by shrinking transistor size becomes increasingly difficult. Therefore, integrated circuit technology is gradually evolving from 2D planar integration to 3D integration. In 3D integration technology, wafer bonding is one of the most crucial steps. Wafer bonding processes include hybrid bonding, SOI bonding, and thermo-press bonding.

[0003] In wafer bonding, especially for thermocompression bonding, wafer alignment and bonding are completed in different process units, which involves loading, unloading, and transferring wafers and wafer carriers. Currently, most wafer and wafer carrier loading mechanisms do not consider the convenience of loading and unloading or the compactness of the overall structure, making it inconvenient to operate and not compact enough for equipment layout when using industrial robots for loading. Summary of the Invention

[0004] To address the issues of insufficient compactness and lack of operational convenience in the design of existing wafer loading mechanisms, this invention proposes a loading mechanism and wafer bonding equipment.

[0005] In a first aspect, the present invention provides a loading mechanism comprising:

[0006] The first loading unit includes a plurality of first ejector pins, the ends of which together define a first loading plane and form a first loading area within the first loading plane;

[0007] A second loading unit includes a plurality of second ejector pins, the ends of which collectively define a second loading plane and form a second loading area within the second loading plane. The second loading plane is parallel to a first loading plane, and the second loading area is directly opposite to the first loading area.

[0008] The lifting unit can drive the first loading unit and the second loading unit to move together along the target direction. The lifting unit can also drive the second loading unit to move independently along the target direction, which is perpendicular to the loading plane.

[0009] In one embodiment, the number of first pins and second pins is the same, the plurality of first pins together surround and define a target area, and the plurality of second pins are all located near the boundary of the target area and close to the corresponding first pin.

[0010] In one embodiment, the first loading unit further includes a first mounting plate for mounting the plurality of first ejector pins, and the second loading unit further includes a second mounting plate for mounting the plurality of second ejector pins. Both the first mounting plate and the second mounting plate are connected to the lifting end of the lifting unit.

[0011] In one embodiment, the first mounting plate has a mounting hole for mounting the first ejector pin and / or the second mounting plate has a mounting hole for mounting the second ejector pin, wherein the mounting hole is interference-fitted with one end of the ejector pin.

[0012] In one embodiment, each of the plurality of second ejector pins is provided with a suction cup at its end, and the second ejector pin has an internal branch air channel that connects to the suction area of ​​the suction cup, and the branch air channel connects to the main air channel in the second mounting plate where the second ejector pin is located.

[0013] In one embodiment, the mounting hole on the second mounting plate for mounting the second ejector pin has a chamfered structure, and an annular space is formed between the chamfered structure and the outer surface of the second ejector pin. The annular space has a sealing layer formed by filling with sealing material, and the sealing layer is used to seal the connection between the branch airway and the main airway.

[0014] In one embodiment, the lifting unit includes:

[0015] A first lifting assembly includes a lifting seat and a linear motion module. The lifting seat carries the first loading unit, and the linear motion module has a linear guide groove. One side of the lifting seat slides into the linear guide groove, and the linear motion module is mounted on a base.

[0016] The second lifting assembly includes a lifting drive device, which is disposed on the lifting seat and located on the side away from the linear motion module. The lifting drive end of the lifting drive device is connected to the second loading unit.

[0017] In one embodiment, the first mounting plate where the first ejector pin of the first loading unit is located is mounted on the top of the lifting seat; the lifting drive end of the lifting drive device is provided with a mounting seat, the second mounting plate where the second ejector pin of the second loading unit is located is located above the first mounting plate, and the bottom of the second mounting plate has a connector, the connector passing through the area where the first mounting plate is located and connecting to the mounting seat.

[0018] In one embodiment, the connector includes two connecting portions disposed opposite each other, one end of the connecting portion being connected to the second mounting plate and the other end being connected to the mounting base, the space between the two connecting portions forming a guide groove, and the first mounting plate partially fitting into the guide groove.

[0019] In one implementation, it further includes:

[0020] The sensing unit includes a plurality of sensors spaced apart along the lifting direction of the lifting unit and a trigger element disposed on the first loading unit and / or the second loading unit, wherein the sensors can be triggered by the trigger element.

[0021] Secondly, the wafer bonding apparatus proposed in this invention includes the aforementioned loading mechanism, thereby possessing all the technical effects it possesses.

[0022] The above-mentioned technical features can be combined in various suitable ways or replaced by equivalent technical features, as long as the purpose of the present invention can be achieved.

[0023] The loading mechanism and wafer bonding equipment provided by the present invention have at least the following advantages compared with the prior art:

[0024] This invention discloses a loading mechanism and wafer bonding equipment that utilizes a pin structure to construct two loading planes and corresponding loading areas within the same region, with the two not interfering with each other. This significantly reduces the volume of the loading structure, enhances its compactness, and improves space utilization. Furthermore, due to the small size of the pins themselves, there is a large open space between multiple pins, providing sufficient operating space for external loading and unloading equipment, facilitating the loading and unloading operations of the loaded objects. In addition, the two movement modes of the first and second loading units can fully match the movement requirements of various parts during the loading process. Attached Figure Description

[0025] The invention will now be described in more detail with reference to embodiments and the accompanying drawings.

[0026] Figure 1 A schematic diagram of the overall structure of the loading mechanism of the present invention is shown;

[0027] Figure 2 A schematic diagram of the loading unit portion of the loading mechanism of the present invention is shown;

[0028] Figure 3 Showing Figure 2 Top view of the structure shown;

[0029] Figure 4A schematic diagram showing the internal air passage structure of the second loading unit of the loading mechanism of the present invention is shown;

[0030] Figure 5 A structural schematic diagram of the lifting unit portion of the loading mechanism of the present invention is shown.

[0031] In the accompanying drawings, the same parts use the same reference numerals. The drawings are not to scale.

[0032] Figure label:

[0033] 1-First loading unit, 11-First ejector pin, 111-Pin body, 12-First mounting plate, 2-Second loading unit, 21-Second ejector pin, 211-Suction cup, 212-Branch airway, 213-Interference fit part, 22-Second mounting plate, 221-Connecting part, 222-Main airway, 3-Lifting unit, 31-First lifting assembly, 311-Lifting seat, 312-Linear motion module, 32-Second lifting assembly, 321-Lifting drive device, 322-Mounting seat, 4-Sensing unit, 41-Sensor, 42-Trigger, 5-Air pipe connector, 6-Base. Detailed Implementation

[0034] The invention will now be further described with reference to the accompanying drawings.

[0035] An embodiment of the present invention provides a loading mechanism, comprising:

[0036] The first loading unit 1 includes a plurality of first ejector pins 11, the ends of which together define a first loading plane and form a first loading area within the first loading plane;

[0037] The second loading unit 2 includes a plurality of second ejector pins 21, the ends of which together define a second loading plane and form a second loading area within the second loading plane. The second loading plane is parallel to a first loading plane, and the second loading area is directly opposite to the first loading area.

[0038] The lifting unit 3 can drive the first loading unit 1 and the second loading unit 2 to move together along the target direction. The lifting unit 3 can also drive the second loading unit 2 to move independently along the target direction, which is perpendicular to the loading plane.

[0039] Specifically, as shown in the attached diagram. Figure 1 and Figure 2As shown in the figure, in this embodiment, both the first loading unit 1 and the second loading unit 2 are configured as pin structures, that is, multiple first pins 11 constitute the loading part of the first loading unit 1, and multiple second pins 21 constitute the loading part of the second loading unit 2. The ends of the multiple first pins 11 and the ends of the multiple second pins 21 respectively define a loading plane, that is, the first loading plane and the second loading plane are parallel to each other, and the two loading planes are at different heights. The area on the first loading plane corresponding to the multiple first pins 11 is the first loading area. Since wafers and wafer carriers are generally roughly circular, the first loading area can be regarded as the area corresponding to the circle drawn through the vertices of the multiple first pins 11; similarly, the area on the second loading plane corresponding to the multiple second pins 21 is the second loading area. The first loading area and the second loading area can each carry an object. As shown in the figure. Figure 3 As shown, since the projections of the areas enclosed by the multiple first ejector pins 11 and the multiple second ejector pins 21 on the horizontal plane are roughly within the same area, and the positions of the individual first ejector pin 11 and the individual second ejector pin 21 on the horizontal plane are staggered, and the heights of their tops are also staggered vertically, the first loading area and the second loading area are directly opposite each other, which fully meets the loading requirements of the wafer bonding process.

[0040] In the wafer bonding process, the first loading unit 1 and the second loading unit 2 respectively carry the wafer carrier and the wafer. The tips of the ejector pins of the loading units make point contact with the bottom of the corresponding objects. The loading plane of the loading unit where the wafer is located is higher than the loading plane of the loading unit where the wafer carrier is located, and the wafer and the wafer carrier are vertically aligned. To accommodate the second ejector pin 21 of the loading mechanism, the wafer carrier can have holes for the corresponding second ejector pin 21 to pass through, or the shape and structure of the wafer carrier can be designed to avoid the corresponding second ejector pin 21. The lifting unit 3 can drive the second loading unit 2 to move independently, that is, to realize the relative movement between the first loading unit 1 and the second loading unit 2, realizing the relative movement between the wafer carrier and the wafer during loading; the lifting unit 3 can also drive the first loading unit 1 and the second loading unit 2 to move together, realizing the driving of the carrier with the wafer loaded; through the above two-stage movement, the movement requirements of each part during the loading process can be fully matched.

[0041] This embodiment utilizes a pin structure to construct two loading planes and corresponding loading areas within the same region, without interference between them. While matching the vertical layout of the wafer and wafer carrier in the wafer bonding process, it significantly reduces the volume of the loading structure, enhances compactness, and improves space utilization. Furthermore, the loading mechanism constructed using the pin structure features small pins and a large open space between multiple pins (located below and around the wafer and wafer carrier on the loading unit), providing sufficient operating space for external loading and unloading equipment (robotic arms) to facilitate loading and unloading operations of the wafer and wafer carrier. In addition, the two movement modes of the first loading unit 1 and the second loading unit 2 can fully match the movement requirements of various parts during the loading process.

[0042] Furthermore, the first loading unit 1 also includes a first mounting plate 12 for mounting a plurality of first ejector pins 11, and the second loading unit 2 also includes a second mounting plate 22 for mounting a plurality of second ejector pins 21. Both the first mounting plate 12 and the second mounting plate 22 are connected to the lifting end of the lifting unit 3. (See attached figures) Figure 1 and Figure 2 As shown, one end of a plurality of first ejector pins 11 is mounted on a first mounting plate 12, and the other end forms a loading plane; one end of a plurality of second ejector pins 21 is mounted on a second mounting plate 22, and the other end forms a loading plane. The first mounting plate 12 and the second mounting plate 22 have a structure that overlaps at least partially vertically, resulting in a compact structure.

[0043] Furthermore, to further enhance the structural compactness and reduce the structural volume, the first mounting plate 12 and the second mounting plate 22 adopt a structure adapted to the ejector pin layout. For example, as shown in the attached figure. Figure 1 As shown in the attached figure, the first mounting plate 12 and the second mounting plate 22 adopt a Y-shaped structure or a T-shaped structure that is compatible with the layout of the three ejector pins. Figure 3 As shown, instead of a complete flat structure, unnecessary parts were removed, further reducing the volume.

[0044] In one embodiment, the number of first pins 11 and second pins 21 is the same, and multiple first pins 11 together surround and define a target area, while multiple second pins 21 are located near the boundary of the target area and close to the corresponding first pin 11.

[0045] Specifically, as shown in the attached diagram. Figure 1 and Figure 3As shown, the multiple second ejector pins 21 located near the boundary of the target area means that the second ejector pins 21 can be located inside, outside, or on the boundary line of the target area. Multiple second ejector pins 21 can exist in any one or more of these three situations, which facilitates structural design and assembly. Simultaneously, in conjunction with the scheme of using the second ejector pins 21 to support the wafer, the first ejector pin 11 can protect the second ejector pins 21, preventing potential collisions between external devices and the second ejector pins 21, and ensuring that the wafer is not damaged by impacts from the second ejector pins 21.

[0046] Furthermore, as shown in the attached figure Figure 1 As shown, the first ejector pin 11 and the second ejector pin 21 are arranged close to each other to form an ejector pin structure. This maximizes the area of ​​the open area between the ejector pins, providing as much operating space as possible for external loading and unloading equipment, while also improving the compactness of the equipment.

[0047] In one embodiment, the first mounting plate 12 has a mounting hole for mounting the first ejector pin 11 and / or the second mounting plate 22 has a mounting hole for mounting the second ejector pin 21, the mounting hole being interference-fitted with one end of the ejector pin.

[0048] Specifically, in this embodiment, as shown in the attached figure... Figure 4 As shown, the mounting hole and the interference fit portion 213 at one end of the second ejector pin 21 are interference-fitted. The second mounting plate 22 and the second ejector pin 21 are inserted through the mounting hole and interference-fitted, resulting in a simple and reliable assembly structure. Of course, the first mounting plate 12 and the first ejector pin 11 can also be assembled in the same way. The mounting hole adopts an insertion and interference fit assembly method, which facilitates the initial processing of the internal air passages of the second ejector pin 21 and the second mounting plate 22, as well as the sealing after assembly. The first mounting plate 12 and the first ejector pin 11 can be assembled in other ways, such as being integrally formed or using a threaded connection.

[0049] In one embodiment, each of the ends of a plurality of second ejector pins 21 is provided with a suction cup 211, and the interior of the second ejector pin 21 is constructed with a branch airway 212 that connects to the adsorption area of ​​the suction cup 211. The branch airway 212 connects to the main airway 222 in the second mounting plate 22 where the second ejector pin 21 is located.

[0050] Specifically, since the second ejector pin 21 is used to place wafers or wafer pairs, a suction cup 211 is used to fix the wafers or wafer pairs. Therefore, each second ejector pin 21 and the corresponding second mounting plate 22 are constructed with air channels. The air channels consist of branch air channels 212 and main air channels 222, as shown in the attached figure. Figure 4 As shown in the attached diagram; the airway has an inlet, and an airway connector 5 is installed at the inlet. Figure 4As shown, the bottom of the second ejector pin 21 has an interference fit portion 213, which is interference fit with the mounting hole on the second mounting plate 22 to realize the assembly of the second ejector pin 21 and the second mounting plate 22.

[0051] In addition, the end portion of the first ejector pin 11 near its supporting plane is the pin body portion 111. The diameter of the pin body portion 111 is smaller than the diameter of the main body of the first ejector pin 11. The pin body portion 111 can be inserted into the pin hole at the bottom of the wafer carrier, so that the wafer carrier can be positioned and relatively fixed.

[0052] In one embodiment, the mounting hole on the second mounting plate 22 for mounting the second ejector pin 21 has a chamfered structure, and an annular space is formed between the chamfered structure and the outer surface of the second ejector pin 21. The annular space has a sealing layer formed by filling sealing material, and the sealing layer is used to seal the connection between the branch airway 212 and the main airway 222.

[0053] Specifically, as shown in the attached diagram. Figure 4 As shown, the chamfered structure of the mounting hole is formed at the edge of its opening. Furthermore, a chamfered structure is also constructed at the bottom of the interference fit portion 213 of the second ejector pin 21. A sealing layer is formed based on this chamfered structure. Combined with the interference fit between the second ejector pin 21 and the mounting hole, it has higher sealing performance compared to the O-ring used in the prior art.

[0054] In one embodiment, the lifting unit 3 includes:

[0055] The first lifting assembly 31 includes a lifting seat 311 and a linear motion module 312. The lifting seat 311 carries the first loading unit 1, and the linear motion module 312 has a linear guide groove. One side of the lifting seat 311 is slidably engaged with the linear guide groove, and the linear motion module 312 is mounted on the base 6.

[0056] The second lifting assembly 32 includes a lifting drive device 321, which is mounted on the lifting seat 311 and located on the side away from the linear motion module 312. The lifting drive end of the lifting drive device 321 is connected to the second loading unit 2.

[0057] Specifically, as shown in the attached diagram. Figure 1 and Figure 5 As shown, the first lifting component 31 and the second lifting component 32 in the lifting unit 3 are used to adjust the height of the first loading unit 1 and the second loading unit 2, so as to fully meet the height requirements during loading and unloading operations, as well as the loading and separation of two loads such as wafers and wafer carriers on the first loading unit 1 and the second loading unit 2.

[0058] Furthermore, as shown in the attached figure Figure 5As shown, the first lifting assembly 31 serves as the basic structure for the movement of the entire lifting unit 3. It adopts a linear motion mechanism and includes a lifting seat 311 and a linear motion module 312. The linear motion module 312 can be specifically a linear motor module with a long stroke to meet the stroke requirements for overall lifting and unloading. The linear motion module 312 has a linear guide groove, and one side of the lifting seat 311 partially fits into the linear guide groove. The second lifting assembly 32 uses a lifting drive device 321 and is mounted on the lifting seat 311 of the first lifting assembly 31. It can be lifted to a general height range under the drive of the first lifting assembly 31, and then further lifted using the lifting drive device 321 to match the corresponding loading and unloading height. Alternatively, it can drive the second loading unit 2 independently to achieve the corresponding loading operation.

[0059] In one embodiment, the first mounting plate 12 where the first ejector pin 11 of the first loading unit 1 is located is mounted on the top of the lifting seat 311; the lifting drive end of the lifting drive device 321 is provided with a mounting seat 322, the second mounting plate 22 where the second ejector pin 21 of the second loading unit 2 is located is located above the first mounting plate 12, and the bottom of the second mounting plate 22 has a connector, which passes through the area where the first mounting plate 12 is located and connects to the mounting seat 322.

[0060] Specifically, a connector extends from the bottom of the second mounting plate 22 of the second loading unit 2. The connector connects to the mounting base 322, making the connection between the lifting drive device 321 and the second mounting plate 22 more stable. Furthermore, since the second mounting plate 22 is located above the first mounting plate 12, the connector can be offset from the first mounting plate 12, that is, it can pass through the area where the first mounting plate 12 is located to connect to the mounting base 322, avoiding interference or obstruction with the first mounting plate 12.

[0061] In one embodiment, the connector includes two connecting portions 221 disposed opposite to each other. One end of the connecting portion 221 is connected to the second mounting plate 22 and the other end is connected to the mounting base 322. The space between the two connecting portions 221 forms a guide groove, and the first mounting plate 12 partially fits in the guide groove.

[0062] Specifically, as shown in the attached diagram. Figure 1 and Figure 2As shown, the connector includes connecting portions 221 on both sides and an elongated guide groove located between the connecting portions 221 on both sides. A portion of the first mounting plate 12 extends into the guide groove, which can position the assembly between the first mounting plate 12 and the second mounting plate 22 and between the first loading unit 1 and the second loading unit 2. It can also guide the second mounting plate 22 (second loading unit 2) when it is lifted and lowered separately. Since the second lifting assembly 32, which uses a lifting cylinder (one of the options for the lifting drive device 321), does not have an additional guiding structure, it is prone to deviation during long-term operation. Therefore, this design can meet the high precision requirements of the motion mechanism in the wafer bonding equipment.

[0063] In one embodiment, the loading mechanism further includes a sensing unit 4, which includes a plurality of sensors 41 spaced apart along the lifting direction of the lifting unit 3 and a trigger 42 disposed on the first loading unit 1 and / or the second loading unit 2, wherein the sensors 41 can be triggered by the trigger 42.

[0064] Specifically, as shown in the attached diagram. Figure 1 As shown, the sensing unit 4 is mainly used to determine the height of the corresponding loading unit. It is set on the fixed base 6. Multiple sensors 41 of the sensing unit 4 are calibrated for multiple heights. When the trigger 42 on the first loading unit 1 and / or the second loading unit 2 is raised or lowered to the corresponding height, it will trigger the corresponding sensor 41, thereby determining the lifting position and ensuring the accuracy of the lifting height. The sensor 41 can be a photoelectric sensor. In the wafer bonding process, the wafer carrier docking position and the wafer unloading position relative to the wafer carrier need to be realized through the cooperation of the sensing unit 4 and the lifting unit 3.

[0065] Embodiments of the present invention also propose a wafer bonding apparatus, including the loading mechanism described above, thereby possessing all the technical effects thereof.

[0066] In the description of this invention, it should be understood that the terms "upper", "lower", "bottom", "top", "front", "rear", "inner", "outer", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0067] While the invention has been described herein with reference to specific embodiments, it should be understood that these embodiments are merely examples of the principles and applications of the invention. Therefore, it should be understood that many modifications can be made to the exemplary embodiments, and other arrangements can be designed without departing from the spirit and scope of the invention as defined by the appended claims. It should be understood that different dependent claims and features described herein can be combined in ways different from those described in the original claims. It is also understood that features described in conjunction with individual embodiments can be used in other described embodiments.

Claims

1. A loading mechanism, characterized in that, include: The first loading unit includes a plurality of first ejector pins, the ends of which together define a first loading plane and form a first loading area within the first loading plane; The second loading unit includes a plurality of second ejector pins, the ends of which collectively define a second loading plane and form a second loading area within the second loading plane. The second loading plane is parallel to a first loading plane, and the second loading area is directly opposite to the first loading area. The second loading unit further includes a second mounting plate for mounting the plurality of second ejector pins. A lifting unit is provided, which can drive the first loading unit and the second loading unit to move together along the target direction. The lifting unit can also drive the second loading unit to move independently along the target direction, wherein the target direction is perpendicular to the loading plane. The first loading unit and the second loading unit respectively carry a wafer carrier and a wafer, with the wafer and the wafer carrier facing each other vertically. Each of the plurality of second ejector pins is provided with a suction cup at its end. The second ejector pin has an internal structure with a branch air channel that connects to the suction area of ​​the suction cup. The branch air channel connects to the main air channel in the second mounting plate where the second ejector pin is located. The mounting hole on the second mounting plate for mounting the second ejector pin has a chamfered structure. An annular space is formed between the chamfered structure and the outer surface of the second ejector pin. The annular space has a sealing layer formed by filling sealing material. The sealing layer is used to seal the connection between the branch airway and the main airway.

2. The loading mechanism according to claim 1, characterized in that, The number of first pins and second pins is the same. The plurality of first pins together surround and define a target area. The plurality of second pins are all located near the boundary of the target area and close to the corresponding first pin.

3. The loading mechanism according to claim 1, characterized in that, The first loading unit further includes a first mounting plate for mounting the plurality of first ejector pins, and both the first mounting plate and the second mounting plate are connected to the lifting end of the lifting unit.

4. The loading mechanism according to claim 3, characterized in that, The first mounting plate has a mounting hole for mounting the first ejector pin and / or the second mounting plate has a mounting hole for mounting the second ejector pin, wherein the mounting hole is interference-fitted with one end of the ejector pin.

5. The loading mechanism according to any one of claims 1 to 4, characterized in that, The lifting unit includes: A first lifting assembly includes a lifting seat and a linear motion module. The lifting seat carries the first loading unit, and the linear motion module has a linear guide groove. One side of the lifting seat slides into the linear guide groove, and the linear motion module is mounted on a base. The second lifting assembly includes a lifting drive device, which is disposed on the lifting seat and located on the side away from the linear motion module. The lifting drive end of the lifting drive device is connected to the second loading unit.

6. The loading mechanism according to claim 5, characterized in that, The first mounting plate containing the first ejector pin of the first loading unit is mounted on the top of the lifting seat; the lifting drive end of the lifting drive device is provided with a mounting seat, the second mounting plate containing the second ejector pin of the second loading unit is located above the first mounting plate, and the bottom of the second mounting plate has a connector, which passes through the area where the first mounting plate is located and connects to the mounting seat.

7. The loading mechanism according to claim 6, characterized in that, The connector includes two connecting parts arranged opposite each other. One end of each connecting part is connected to the second mounting plate and the other end is connected to the mounting base. The space between the two connecting parts forms a guide groove, and the first mounting plate partially fits into the guide groove.

8. The loading mechanism according to claim 1, characterized in that, Also includes: The sensing unit includes a plurality of sensors spaced apart along the lifting direction of the lifting unit and a trigger element disposed on the first loading unit and / or the second loading unit, wherein the sensors can be triggered by the trigger element.

9. A wafer bonding apparatus, characterized in that, Includes the loading mechanism as described in any one of claims 1 to 8.

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