A device package structure and a light emitting assembly

Abstract

The application provides a device packaging structure and a light-emitting assembly. The device packaging structure comprises a packaging bottom plate and a packaging cover plate. The packaging cover plate is arranged above the packaging bottom plate and forms a containing space with the packaging bottom plate, so as to place a light-emitting device in the containing space. An area corresponding to the light-emitting device on a first surface of the packaging cover plate is provided with a light inlet. A second surface opposite to the first surface of the packaging cover plate is provided with a light outlet. The packaging cover plate is made of a light-conducting material, so that the light beam emitted by the light-emitting device enters the packaging cover plate through the light inlet and is emitted from the light outlet through the conduction of the packaging cover plate. The area of the light outlet is smaller than the area of the light inlet, so as to reduce the cost and realize the effect of a small light-emitting surface.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more specifically, to a device packaging structure and a light-emitting component. Background Technology

[0002] Conventional LED devices typically employ open-surface packaging, maximizing light extraction efficiency without restricting the emitting surface. However, in certain specialized applications, such as micro-displays, linear array images, and exposure, the emitting surface needs to be comparable to or smaller than that of the LED chip. In these cases, conventional packaging methods cannot meet the requirement of such a small emitting surface, and using an LED chip with a small emitting surface would increase costs. Summary of the Invention

[0003] In view of this, the purpose of this application is to provide a device packaging structure and light-emitting component, so as to reduce costs while achieving the effect of small light-emitting surface.

[0004] In a first aspect, this application provides a device packaging structure, which includes a packaging base plate and a packaging cover plate. The packaging cover plate is disposed above the packaging base plate and forms a receiving space between the packaging base plate and the packaging base plate for placing a light-emitting device within the receiving space. A light inlet is formed on a first surface of the packaging cover plate in an area corresponding to the light-emitting device, and a light outlet is formed on a second surface of the packaging cover plate opposite to the first surface. The packaging cover plate is made of a light-conducting material so that the light beam emitted by the light-emitting device enters the packaging cover plate through the light inlet and is emitted from the light outlet through the conduction of the packaging cover plate. The area of ​​the light outlet is smaller than the area of ​​the light inlet.

[0005] Preferably, the light outlet and the light inlet do not coincide in the direction perpendicular to the first surface.

[0006] Preferably, the device packaging structure further includes an anti-reflection film, which covers the light inlet and the light outlet.

[0007] Preferably, the encapsulation cover includes a light guide layer for diffusing the light beam entering from the light inlet; and a reflective layer covering the outer surface of the light guide layer, wherein a first area not covered by the reflective layer serves as the light inlet, a second area not covered by the reflective layer serves as the light outlet, and the reflective layer is used to reflect the light beam diffused from the light guide layer back to the light guide layer.

[0008] Preferably, a mounting groove is formed on the packaging substrate for mounting the light-emitting device.

[0009] Preferably, the device packaging structure further includes a support portion, with a first end fixed to the packaging base plate and a second end fixed to the first surface of the packaging cover plate to form a receiving space.

[0010] Preferably, the device packaging structure further includes: a first electrode sheet, the first end of which is disposed on the packaging base plate and located within the receiving space, and the second end of which extends out of the packaging base plate or support portion for electrical connection to the light-emitting device; a second electrode sheet, the first end of which is disposed on the packaging base plate and located within the receiving space, and the second end of which extends out of the packaging base plate or support portion for electrical connection to the light-emitting device; a first gold wire, the first end of which is connected to the first end of the first electrode sheet, and the second end of which is used to connect to the positive electrode of the light-emitting device; and a second gold wire, the first end of which is connected to the second end of the second electrode sheet, and the second end of which is used to connect to the negative electrode of the light-emitting device.

[0011] Preferably, the device packaging structure further includes a filling layer for filling the containment space, and the filling layer is made of a light-conducting material.

[0012] Secondly, this application provides a light-emitting component, which includes the device packaging structure as described above; and a light-emitting device.

[0013] Preferably, there are multiple light-emitting components, and the multiple light-emitting components are arranged side by side.

[0014] The device packaging structure and light-emitting component provided in this application include a packaging base plate and a packaging cover plate. The packaging cover plate is disposed above the packaging base plate, forming a receiving space between them for placing a light-emitting device within the receiving space. A light inlet is formed on a first surface of the packaging cover plate in an area corresponding to the light-emitting device, and a light outlet is formed on a second surface of the packaging cover plate opposite to the first surface. The packaging cover plate is made of a light-guiding material, allowing the light beam emitted by the light-emitting device to enter the packaging cover plate through the light inlet and be conducted through the packaging cover plate to exit through the light outlet. The area of ​​the light outlet is smaller than the area of ​​the light inlet. This allows the light beam emitted by the light-emitting device to be guided out through a smaller light outlet, meeting the requirements for small light-emitting surfaces while reducing costs.

[0015] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1This is a schematic diagram of a device packaging structure provided in an embodiment of this application;

[0018] Figure 2 A bottom view of an encapsulation cover provided in an embodiment of this application;

[0019] Figure 3 This is a top view of a packaging cover provided in an embodiment of this application.

[0020] Figure label:

[0021] Encapsulation base plate 10, light-emitting device 20, encapsulation cover plate 30, support part 40, filler layer 50;

[0022] Light inlet 301, light outlet 302. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. Based on the embodiments of this application, every other embodiment obtained by those skilled in the art without inventive effort falls within the scope of protection of this application.

[0024] First, the applicable application scenarios of this application are introduced. This application can be applied to LED packaging in scenarios such as micro-displays, linear array images, and exposure.

[0025] Research has shown that conventional LED devices use open-surface packaging, maximizing light extraction efficiency without limiting the emitting surface. However, in certain special applications, such as micro-displays, linear image arrays, and exposure, the emitting surface needs to be comparable to or smaller than the emitting surface of the LED chip. In these cases, conventional packaging methods cannot meet the requirement of such a small emitting surface, and using LED chips with smaller emitting surfaces would increase costs.

[0026] Based on this, embodiments of this application provide a device packaging structure and a light-emitting component.

[0027] Please see Figures 1 to 3 , Figure 1 This is a schematic diagram of a device packaging structure provided in an embodiment of this application. Figure 2 This is a bottom view of a packaging cover provided in an embodiment of this application. Figure 3This is a top view of a packaging cover provided in an embodiment of this application. Figures 1 to 3 As shown in the illustration, the device packaging structure and light-emitting component provided in this application embodiment include a packaging base plate 10 and a packaging cover plate 30. The packaging cover plate 30 is disposed above the packaging base plate 10, forming a receiving space between it and the packaging base plate 10 for placing a light-emitting device 20 within the receiving space. A light inlet 301 is formed on the first surface of the packaging cover plate 30 in the area corresponding to the light-emitting device 20, and a light outlet 302 is formed on the second surface of the packaging cover plate 30 opposite to the first surface. The packaging cover plate 30 is made of a light-conducting material so that the light beam emitted by the light-emitting device 20 enters the packaging cover plate 30 through the light inlet 301 and exits through the light outlet 302 via conduction by the packaging cover plate 30. The area of ​​the light outlet 302 is smaller than the area of ​​the light inlet 301.

[0028] The encapsulation substrate 10 here can be an alumina ceramic substrate or an aluminum nitride ceramic substrate. The encapsulation substrate 10 can support one or more light-emitting devices 20. The light-emitting devices 20 are generally mounted on the encapsulation substrate by adhesive bonding.

[0029] Specifically, the encapsulation cover 30 includes a light guide layer and a reflective layer. The light guide layer is used to diffuse the light beam entering through the light inlet 301. The reflective layer covers the outer surface of the light guide layer, wherein a first area not covered by the reflective layer serves as the light inlet 301, and a second area not covered by the reflective layer serves as the light outlet 302. The reflective layer is used to reflect the light beam diffused from the light guide layer back to the light guide layer.

[0030] The light guide layer here can be made of materials such as quartz, glass, transparent plastic, resin, and silicone. The reflective layer can be made of reflective materials such as dielectric film, aluminum, and silver. The light-emitting device 20 here can be an LED chip, and the LED chip can emit ultraviolet light, visible light, infrared light, or a mixture of light.

[0031] Taking an LED chip as an example, the light beam emitted by the LED chip enters the light guide layer through the light inlet 301. The light guide layer diffuses the light beam, which is then reflected back to the light guide layer after reaching the reflective layer, and finally exits through the light outlet 302. In this way, even if the light-emitting area of ​​the LED chip is large, it can still meet the needs of small light-emitting surfaces, while also reducing costs compared to using LED chips with smaller areas.

[0032] In one embodiment of this application, the light outlet 302 and the light inlet 301 do not coincide in the direction perpendicular to the first surface.

[0033] The encapsulation cover 30 can protrude from the encapsulation base plate 10, while the light emission port 302 is positioned in an area that facilitates arrangement. This allows for a tighter arrangement between the light-emitting surfaces, ensuring optimal light emission. For example, multiple light-emitting components can be arranged side-by-side to form a strip-shaped LED array for exposure.

[0034] In one embodiment of this application, the device packaging structure further includes an antireflection film covering the light inlet 301 and the light outlet 302.

[0035] The antireflection coating here is used to improve the efficiency of light entering the light inlet 301 or exiting the light outlet 302 at high speed. The antireflection coating here can also be other surface scattering structures.

[0036] In one embodiment of this application, the device packaging structure further includes a support portion 40, with a first end of the support portion 40 fixed to the packaging base plate 10 and a second end of the support portion 40 fixed to the first surface of the packaging cover plate 30 to form a receiving space.

[0037] The support part 40 here is used to connect the encapsulation cover plate 30 and the encapsulation base plate 10. The support part 40 has a hollow structure.

[0038] In one embodiment of this application, a mounting groove is formed on the encapsulation base plate 10 for mounting the light-emitting device 20. That is, the support portion 40 and the encapsulation base plate 10 are integrally formed.

[0039] In one embodiment of this application, the device packaging structure further includes a first electrode sheet, a second electrode sheet, a first gold wire, and a second gold wire. The first end of the first electrode sheet is disposed on the packaging base plate 10 and located within the receiving space, while the second end of the first electrode sheet extends out of the packaging base plate 10 or the support portion 40 for electrical connection to the light-emitting device 20. The first end of the second electrode sheet is disposed on the packaging base plate 10 and located within the receiving space, while the second end of the second electrode sheet extends out of the packaging base plate 10 or the support portion 40 for electrical connection to the light-emitting device 20. The first end of the first gold wire is connected to the first end of the first electrode sheet, and the second end of the first gold wire is used to connect to the positive electrode of the light-emitting device 20. The first end of the second gold wire is connected to the second end of the second electrode sheet, and the second end of the second gold wire is used to connect to the negative electrode of the light-emitting device 20.

[0040] The gold wires here are used for the connection between the light-emitting device 20 and the electrode sheet. The electrode sheet is a solderable electrode structure used for soldering the light-emitting component. The electrode sheet is made of a conductive metallic material. The gold wires here can also be other types of wires. The electrode sheet and the LED chip can also be connected using flip-chip or eutectic bonding methods.

[0041] In one embodiment of this application, the device packaging structure further includes a filling layer 50 for filling the accommodating space, and the filling layer 50 is made of a light-conducting material.

[0042] The filler layer 50 here is generally made of a transparent material such as silicone. The filler layer 50 is used to diffuse the light beam and protect the LED chip. Before filling, the filler layer 50 is a fluid material; after cooling, it solidifies to form the filler layer 50, filling the remaining space within the containment area. It also serves to connect the encapsulation cover plate 30 and the encapsulation base plate 10. If necessary, phosphor can also be added to the filler layer 50.

[0043] Based on the same inventive concept, this application also provides a light-emitting component device corresponding to the device packaging structure. Since the principle of the light-emitting component in this application is similar to the device packaging structure described above in this application, the implementation of the light-emitting component can refer to the implementation of the device packaging structure, and the repeated parts will not be described again.

[0044] The light-emitting components here include the device packaging structure and the light-emitting device 20.

[0045] The light-emitting device 20 here can be an LED chip. Multiple light-emitting components can be arranged into a light strip for applications such as exposure.

[0046] Finally, it should be noted that the above-described embodiments are merely specific implementations of this application, used to illustrate the technical solutions of this application, and not to limit them. The scope of protection of this application is not limited thereto. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still modify or easily conceive of changes to the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features, within the scope of the technology disclosed in this application. Such modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A device packaging structure, characterized in that, The device packaging structure includes: Packaging base plate; An encapsulation cover is disposed above an encapsulation base plate and forms a receiving space between the encapsulation base plate for placing a light-emitting device within the receiving space. A light inlet is formed on a first surface of the encapsulation cover in an area corresponding to the light-emitting device, and a light outlet is formed on a second surface of the encapsulation cover opposite to the first surface. The encapsulation cover is made of a light-conducting material so that the light beam emitted by the light-emitting device enters the encapsulation cover through the light inlet and exits through the light outlet via the conduction of the encapsulation cover. The area of ​​the light outlet is smaller than the area of ​​the light inlet. The light outlet and the light inlet do not coincide in the direction perpendicular to the first surface; The encapsulation cover includes: A light guide layer for diffusing the light beam entering from the light inlet; A reflective layer covers the outer surface of the light guide layer, wherein a first area not covered by the reflective layer serves as the light inlet, and a second area not covered by the reflective layer serves as the light outlet. The reflective layer is used to reflect the light beam diffused from the light guide layer back to the light guide layer.

2. The device packaging structure according to claim 1, characterized in that, The device packaging structure also includes: An antireflection film is provided, which covers the light inlet and the light outlet.

3. The device packaging structure according to claim 1, characterized in that, A mounting groove is formed on the packaging substrate, and the mounting groove is used to mount the light-emitting device.

4. The device packaging structure according to claim 1, characterized in that, The device packaging structure also includes: The support portion has a first end fixed to the packaging base plate and a second end fixed to the first surface of the packaging cover plate to form the receiving space.

5. The device packaging structure according to claim 4, characterized in that, The device packaging structure also includes: A first electrode sheet, with its first end disposed on the packaging base plate and located within the receiving space, and its second end extending out of the packaging base plate or the support portion for electrical connection of the light-emitting device; The second electrode sheet has a first end disposed on the packaging base plate and located within the receiving space, and a second end extending out of the packaging base plate or the support portion for electrical connection of the light-emitting device. The first gold wire has a first end connected to the first end of the first electrode sheet, and the second end of the first gold wire is used to connect to the positive electrode of the light-emitting device. The second gold wire has a first end connected to the second end of the second electrode sheet, and the second end of the second gold wire is used to connect to the negative electrode of the light-emitting device.

6. The device packaging structure according to claim 1, characterized in that, The device packaging structure also includes: A filling layer for filling the accommodating space, the filling layer being made of a light-conducting material.

7. A light-emitting component, characterized in that, The light-emitting component includes: The device packaging structure as described in any one of claims 1 to 6; Light-emitting devices.

8. The light-emitting component according to claim 7, characterized in that, The number of light-emitting components is multiple, and the multiple light-emitting components are arranged side by side.

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