Miniaturized band-rejection filter based on hybrid integration
By using a hybrid integrated miniaturized bandstop filter, a cross-shaped structure is formed by LC parallel resonant circuits. Combined with semiconductor passive integration and printed circuit technology, the miniaturization and high suppression problems of traditional bandstop filters are solved, achieving high selectivity and broadband characteristics.
Patent Information
- Application Number
- CN202211372429.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-11-02
- Publication Date
- 2026-08-25
- Estimated Expiration
- 2042-11-02
AI Technical Summary
Traditional band-stop filters in wireless communication systems suffer from challenges in miniaturization, large size, and significant performance errors, and traditional designs cannot meet high suppression requirements.
A miniaturized bandstop filter based on hybrid integration is adopted, which forms a cross-shaped structure through four sets of LC parallel resonant circuits or LC parallel resonators. Combined with semiconductor passive integration technology and printed circuit technology, it achieves high selectivity and broadband characteristics of the signal path.
The filter achieves miniaturization, reduces errors, and possesses high selectivity and broadband characteristics, meeting the high integration requirements of modern wireless communication systems.
Smart Images

Figure CN115765664B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of band-stop filters, and in particular to a miniaturized band-stop filter based on hybrid integration. Background Technology
[0002] In wireless communication systems, bandpass filters are usually sufficient to select useful signals and suppress unwanted signals. However, with the improvement of living standards, there is a need for higher quality and more stable communication. Therefore, in the case of strong interference signals, bandstop filters are needed to further suppress unwanted signals.
[0003] As communication systems become increasingly complex and integrated, traditional band-stop filters designed with discrete components can no longer meet the requirements of miniaturization. Moreover, band-stop filters are usually synthesized using Chebyshev functions or Butterworth functions. To achieve a high-suppression band-stop filter, the order of the filter needs to be increased, which obviously increases the size of the band-stop filter.
[0004] In view of this, it is necessary to develop a miniaturized bandstop filter based on hybrid integration to solve the above problems. Summary of the Invention
[0005] An embodiment of the present invention provides a miniaturized bandstop filter based on hybrid integration.
[0006] To address the aforementioned technical problems, embodiments of the present invention disclose the following technical solutions:
[0007] A miniaturized bandstop filter based on hybrid integration is provided, comprising:
[0008] A signal path, arranged between the first port and the second port, having a central connection point formed on the signal path; and
[0009] At least four sets of LC parallel resonant circuits, wherein the first LC parallel resonant circuit and the second LC parallel resonant circuit in the at least four sets of LC parallel resonant circuits are connected to each other through the central connection point, and the third LC parallel resonant circuit and the fourth LC parallel resonant circuit in the at least four sets of LC parallel resonant circuits are connected to each other through the central connection point.
[0010] The first LC parallel resonant circuit and the second LC parallel resonant circuit are respectively arranged on both sides of the central connection point in the first direction to form at least a part of the signal path. The third LC parallel resonant circuit and the fourth LC parallel resonant circuit are respectively arranged on both sides of the central connection point in the second direction intersecting the first direction, so that the at least four sets of LC parallel resonant circuits are connected to form a cross-shaped structure.
[0011] In addition to one or more of the features disclosed above, or as an alternative, the first LC parallel resonant circuit is connected to the first port, and the second LC parallel resonant circuit is connected to the second port.
[0012] In addition to one or more of the features disclosed above, or as an alternative, the cross-shaped structure formed by the at least four sets of LC parallel resonant circuits is a symmetrical structure symmetrical about the central connection point.
[0013] In addition to one or more of the features disclosed above, or alternatively, each set of the LC parallel resonant circuits includes an inductor and a capacitor connected in parallel with each other.
[0014] In addition to one or more of the features disclosed above, or as an alternative, the first LC parallel resonant circuit includes a first inductor and a first capacitor connected in parallel with each other; the second LC parallel resonant circuit includes a second inductor and a second capacitor connected in parallel with each other.
[0015] In addition to one or more of the features disclosed above, or alternatively, the inductance of the first inductor is equal to the inductance of the second inductor; and the capacitance of the first capacitor is equal to the capacitance of the second capacitor.
[0016] In addition to one or more of the features disclosed above, or alternatively, a third inductor is connected in series before the first capacitor is connected in parallel with the first inductor; and a fourth inductor is connected in series before the second capacitor is connected in parallel with the second inductor.
[0017] In addition to one or more of the features disclosed above, or alternatively, the inductance of the third inductor is equal to that of the fourth inductor.
[0018] In addition to one or more of the features disclosed above, or as an alternative, both the third LC parallel resonant circuit and the fourth LC parallel resonant circuit are grounded.
[0019] In addition to one or more of the features disclosed above, or as an alternative, the third LC parallel resonant circuit includes a fifth inductor and a third capacitor connected in parallel with each other; the fourth LC parallel resonant circuit includes a sixth inductor and a fourth capacitor connected in parallel with each other.
[0020] In addition to one or more of the features disclosed above, or alternatively, the inductance of the fifth inductor is not equal to that of the sixth inductor; and the capacitance of the third capacitor is not equal to that of the fourth capacitor.
[0021] In addition to one or more of the features disclosed above, or as an alternative, the third LC parallel resonant circuit is grounded through the fifth capacitor, and the fourth LC parallel resonant circuit is grounded through the sixth capacitor.
[0022] In addition to one or more of the features disclosed above, or alternatively, the capacitance of the fifth capacitor is not equal to the capacitance of the sixth capacitor.
[0023] On the other hand, a miniaturized band-stop filter based on hybrid integration is further disclosed, which, in addition to one or more of the features disclosed above, or alternatively, includes:
[0024] A substrate, wherein a first terminal and a second terminal are electrically connected on the substrate, and a central connection point is formed between the first terminal and the second terminal; and
[0025] At least four LC parallel resonators are disposed on the substrate, wherein the first LC parallel resonator and the second LC parallel resonator of the at least four LC parallel resonators are connected to each other through the central connection point, and the third LC parallel resonator and the fourth LC parallel resonator of the at least four sets of LC parallel resonators are connected to each other through the central connection point.
[0026] The first LC parallel resonator and the second LC parallel resonator are respectively arranged on both sides of the central connection point in the first direction, and the third LC parallel resonator and the fourth LC parallel resonator are respectively arranged on both sides of the central connection point in the second direction intersecting the first direction, so that the at least four sets of LC parallel resonators are connected to form a cross-shaped structure.
[0027] In addition to one or more of the features disclosed above, or as an alternative, the first LC parallel resonator is connected to the first terminal, and the second LC parallel resonator is connected to the second terminal.
[0028] In addition to one or more of the features disclosed above, or as an alternative, the cross-shaped structure formed by the at least four sets of LC parallel resonators is a symmetrical structure symmetrical about the central connection point.
[0029] In addition to one or more of the features disclosed above, or alternatively, each set of said LC parallel resonators includes an inductor and a capacitor connected in parallel with each other.
[0030] In addition to one or more of the features disclosed above, or as an alternative, the substrate includes a passive integrated substrate made based on a semiconductor passive integrated process and a printed circuit substrate made based on a printed circuit process; the capacitors in the first LC parallel resonator and the second LC parallel resonator are planar capacitors arranged on the passive integrated substrate; the inductors in the first LC parallel resonator and the second LC parallel resonator are spiral inductors arranged on the printed circuit substrate.
[0031] In addition to one or more of the features disclosed above, or as an alternative, the first LC parallel resonator includes a first inductor and a first capacitor connected in parallel with each other; the second LC parallel resonator includes a second inductor and a second capacitor connected in parallel with each other.
[0032] In addition to one or more of the features disclosed above, or alternatively, the inductance of the first inductor is equal to the inductance of the second inductor; and the capacitance of the first capacitor is equal to the capacitance of the second capacitor.
[0033] In addition to one or more of the features disclosed above, or alternatively, a third inductor is connected in series before the first capacitor and the first inductor are connected in parallel; and a fourth inductor is connected in series before the second capacitor and the second inductor are connected in parallel.
[0034] In addition to one or more of the features disclosed above, or alternatively, the inductance of the third inductor is equal to the inductance of the fourth inductor.
[0035] In addition to one or more of the features disclosed above, or as an alternative, both the third LC parallel resonator and the fourth LC parallel resonator are grounded.
[0036] In addition to one or more of the features disclosed above, or alternatively, the third LC parallel resonator includes a fifth inductor and a third capacitor connected in parallel with each other; the fourth LC parallel resonator includes a sixth inductor and a fourth capacitor connected in parallel with each other.
[0037] In addition to one or more of the features disclosed above, or alternatively, the inductance of the fifth inductor is not equal to the inductance of the sixth inductor; the capacitance of the third capacitor is not equal to the capacitance of the fourth capacitor.
[0038] In addition to one or more of the features disclosed above, or as an alternative, the fifth inductor and the sixth inductor are both planar spiral inductors, and the third capacitor and the fourth capacitor are the parasitic capacitances of the fifth inductor and the sixth inductor, respectively.
[0039] In addition to one or more of the features disclosed above, or as an alternative, the third LC parallel resonator is grounded through the fifth capacitor, and the fourth LC parallel resonator is grounded through the sixth capacitor.
[0040] In addition to one or more of the features disclosed above, or alternatively, the capacitance of the fifth capacitor is not equal to the capacitance of the sixth capacitor.
[0041] One of the above technical solutions has the following advantages or beneficial effects: it can reduce errors while reducing the difficulty of miniaturization design.
[0042] Another technical solution in the above-mentioned technical solution has the following advantages or beneficial effects: since the stopband topology is composed of four resonators connected in a cross shape, the stopband it realizes has wide bandwidth characteristics, and the stopband filter has high selectivity and wide upper passband characteristics. Attached Figure Description
[0043] The technical solution and other beneficial effects of the present invention will become apparent from the following detailed description of specific embodiments of the invention, in conjunction with the accompanying drawings.
[0044] Figure 1 The circuit topology diagram of the filter provided in the embodiment of the present invention is shown.
[0045] Figure 2 The circuit topology diagram of the filter provided in the embodiment of the present invention shows the capacitance and inductance of each capacitor, that is, the same symbol is used to represent components with the same capacitance / inductance.
[0046] Figure 3 The physical structure diagram of the filter provided in the embodiment of the present invention.
[0047] Figure 4 The simulation results of the S-parameters of the filter provided in the embodiments of the present invention.
[0048] Figure 5 This shows how the inductance L and quality factor Q of a spiral inductor change with the number of turns n. Detailed Implementation
[0049] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. In the description of the present invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of the present invention, "a plurality of" means two or more, unless otherwise explicitly specified.
[0050] Band-stop filters play a crucial role in modern wireless communication systems, primarily suppressing unwanted signals. As device complexity and integration increase, miniaturization becomes essential for future device development. To address the problems of large package size, high miniaturization design difficulty, and large performance errors inherent in traditional band-stop filters, this invention provides a miniaturized band-stop filter based on hybrid integration. This miniaturized band-stop filter allows signals outside a specific frequency band to pass through while blocking (attenuating) signals within that band. The miniaturized band-stop filter provided by this invention features small size, high selectivity, high accuracy, and low passband energy loss.
[0051] The embodiments of the present invention will now be described in detail and clearly with reference to the accompanying drawings.
[0052] Please see Figure 1 As shown, Figure 1 The diagram shown is a circuit topology diagram of a miniaturized band-stop filter 10 based on hybrid integration provided in an embodiment of the present invention. Figure 1 The miniaturized bandstop filter 10 shown includes:
[0053] A signal path S is arranged between a first port P1 and a second port P2, and a central connection point CP is formed on the signal path S; and
[0054] Four sets of LC parallel resonant circuits, wherein the first LC parallel resonant circuit 100 and the second LC parallel resonant circuit 200 are connected to each other through the central connection point CP, and the third LC parallel resonant circuit 300 and the fourth LC parallel resonant circuit 400 are connected to each other through the central connection point CP.
[0055] Wherein, the first LC parallel resonant circuit 100 and the second LC parallel resonant circuit 200 are in the first direction (e.g. Figure 1 The third LC parallel resonant circuit 300 and the fourth LC parallel resonant circuit 400 are respectively arranged on both sides of the central connection point CP in the horizontal direction shown in the figure, to form part of the signal path S. Figure 1 The at least four sets of LC parallel resonant circuits are arranged on both sides of the central connection point CP in the vertical direction (perpendicular to the horizontal direction) to form a cross-shaped structure. Those skilled in the art will understand that the arrangement of the first and second directions is not limited to the aforementioned horizontal and vertical directions, and the angle between the first and second directions can be arranged at any angle between 0° and 180° according to design requirements. Figure 1 The circuit topology diagram shown is a third-order bandstop filter with a quasi-elliptic function response. This stopband topology consists of four resonators connected in a cross shape. The stopband it achieves has wide bandwidth characteristics, and the stopband filter has high selectivity and a wide upper passband.
[0056] In some embodiments, each group of LC parallel resonant circuits includes an inductor and a capacitor connected in parallel. For example, the first LC parallel resonant circuit 100 includes a first inductor 101 and a first capacitor 102 connected in parallel; the second LC parallel resonant circuit 200 includes a second inductor 201 and a second capacitor 202 connected in parallel. In one embodiment, the first LC parallel resonant circuit 100 is directly connected to the first port P1, and the second LC parallel resonant circuit 200 is directly connected to the second port P2. The first LC parallel resonant circuit 100 and the second LC parallel resonant circuit 200 are used to control the position of the transmission zero point. Specifically, refer to... Figure 4 As shown, Figure 4 The S-parameter simulation results of the filter 10 provided in this embodiment show that the first inductor 101 and the first capacitor 102, as well as the second inductor 201 and the second capacitor 202, play a role in controlling the transmission zero T in the topology. z2 .
[0057] In one embodiment, both the third LC parallel resonant circuit 300 and the fourth LC parallel resonant circuit 400 are grounded. The third LC parallel resonant circuit 300 includes a fifth inductor 301 and a third capacitor 302 connected in parallel; the fourth LC parallel resonant circuit 400 includes a sixth inductor 401 and a fourth capacitor 402 connected in parallel. In some embodiments, the third LC parallel resonant circuit 300 is grounded through a fifth capacitor 303, and the fourth LC parallel resonant circuit 400 is grounded through a sixth capacitor 403. The third LC parallel resonant circuit 300 and the fourth LC parallel resonant circuit 400 are used to control the positions of the transmission zero and transmission poles. Specifically, refer to... Figure 4 As shown, Figure 4 The simulation results of the S-parameters of the filter 10 provided in this embodiment are shown, wherein the fifth inductor 301 and the fifth capacitor 303 are used to control the transmission zero point T. z3 and transmission pole T p2 The position of the sixth inductor 401 and the sixth capacitor 403 is used to control the transmission zero point T. z1 and transmission pole T p1 The location.
[0058] In one embodiment, a third inductor 103 is connected in series before the first capacitor 102 is connected in parallel with the first inductor 101; a fourth inductor 203 is connected in series before the second capacitor 202 is connected in parallel with the second inductor 201. The third inductor 103 and the fourth inductor 203 can be further magnetically coupled to the third capacitor 302 and the fourth capacitor 402, thereby enabling the third inductor 103 and the fourth inductor 203 to control the transfer pole T. p3 and transmission pole T p4 The location.
[0059] In some embodiments, a grounded metal frame may be provided around the miniaturized band-stop filter 10, and the third LC parallel resonant circuit 300 and the fourth LC parallel resonant circuit 400 are both grounded through the grounded metal frame to facilitate the grounding operation of the component lines.
[0060] In some embodiments of the present invention, the cross-shaped structure formed by the four sets of LC parallel resonant circuits is a symmetrical structure symmetrical about the central connection point CP. Figure 1In the illustrated embodiment, the first LC parallel resonant circuit 100 and the second LC parallel resonant circuit 200 are centrally symmetrical structures with the central connection point CP of the cross-shaped structure as the center of symmetry. The third LC parallel resonant circuit 300 and the fourth LC parallel resonant circuit 400 are also centrally symmetrical structures with the central connection point CP of the cross-shaped structure as the center of symmetry. Throughout the above and the entire specification, the term "centrally symmetrical" should be understood as meaning that the positions of corresponding elements or other structures in the corresponding LC parallel resonant circuits are approximately symmetrical, but it does not require that the fine structures of each element are also strictly symmetrical. For example, it is not required that the spiral directions of corresponding inductor coils are also centrally symmetrical. Furthermore, the parameter values of the elements in the symmetrical structure can be equal or unequal. Figure 2 In the illustrated embodiment, the inductance values of the first inductor 101 and the second inductor 201 are equal. L 1 The capacitance values of the first capacitor 102 and the second capacitor 202 are equal. C 1 The inductance values of the third inductor 103 and the fourth inductor 203 are equal. L 11 The inductance values of the fifth inductor 301 and the sixth inductor 401 are not equal; the fifth inductor 301 is... L 2 The sixth inductor 401 is L 3 The capacitance values of the third capacitor 302 and the fourth capacitor 402 are not equal; the capacitance value of the third capacitor 302 is... C p1 The fourth capacitor 402 is C p2 The capacitance values of the fifth capacitor 303 and the sixth capacitor 403 are not equal; the capacitance value of the fifth capacitor 303 is... C 2 The sixth capacitor 403 is C 3 .based on Figure 1 The circuit topology diagram allows for the adjustment of the positions of the transmission zero and transmission poles in advance by adjusting the inductance and capacitance values of the fifth inductor 301, the fifth capacitor 303, the sixth inductor 401, and the sixth capacitor 403, thereby adjusting the operating bandwidth.
[0061] Although Figure 1 and Figure 2 The symmetrical structure shown above is illustrated, but the invention is not limited thereto. Figure 1 and Figure 2 The circuit topology diagram shown, i.e., the cross-shaped structure formed by four sets of LC parallel resonant circuits, may not be a symmetrical structure.
[0062] In addition, Figure 1 and Figure 2 In the illustrated embodiment, although only four sets of LC parallel resonant circuits are shown, the present invention is not limited to this. More sets of LC parallel resonant circuits can be used to form a cross-shaped structure. In this implementation, each line of the cross-shaped structure can also have at least one set of LC parallel resonant circuits.
[0063] As another embodiment of the present invention, Figure 3 The physical structure diagram of the miniaturized bandstop filter 20 based on hybrid integration is shown. Specifically, Figure 3 The miniaturized bandstop filter 20 shown is Figure 1 and Figure 2 The diagram shows the physical structure of the miniaturized band-stop filter 10. Specifically, as shown... Figure 1 The miniaturized bandstop filter 20 shown includes:
[0064] A substrate, wherein a first terminal H1 and a second terminal H2 are electrically connected on the substrate, and a central connection point OP is formed between the first terminal H1 and the second terminal H2; and
[0065] Four LC parallel resonators are disposed on the substrate. The first LC parallel resonator 500 and the second LC parallel resonator 600 are connected to each other through the central connection point OP. The third LC parallel resonator 700 and the fourth LC parallel resonator 800 are connected to each other through the central connection point OP.
[0066] Wherein, the first LC parallel resonator 500 and the second LC parallel resonator 600 are in a first direction (e.g. Figure 3 The third LC parallel resonator 700 and the fourth LC parallel resonator 800 are respectively arranged on both sides of the central connection point OP in the horizontal direction shown in the figure. The second direction intersects the first direction (e.g., in the horizontal direction shown in the figure). Figure 3 The at least four sets of LC parallel resonators are arranged on both sides of the central connection point OP in the vertical direction (as shown in the diagram, perpendicular to the horizontal direction) to form a cross-shaped structure. Those skilled in the art will understand that the arrangement of the first and second directions is not limited to the aforementioned horizontal and vertical directions, and the angle between the first and second directions can be any angle between 0° and 180° according to design requirements. Figure 3 The physical structure diagram of the filter shown is a third-order bandstop filter with a quasi-elliptic function response. The stopband is composed of four resonators connected in a cross shape. The stopband implemented has wide bandwidth characteristics, and the stopband filter has high selectivity and a wide upper passband.
[0067] In some embodiments, each group of LC parallel resonators includes an inductor and a capacitor connected in parallel. For example, the first LC parallel resonator 500 includes a first inductor 501 and a first capacitor 502 connected in parallel; the second LC parallel resonator 600 includes a second inductor 601 and a second capacitor 602 connected in parallel. In one embodiment, the first LC parallel resonator 500 is directly connected to the first terminal H1, and the second LC parallel resonator 600 is directly connected to the second terminal H2. The first LC parallel resonator 500 and the second LC parallel resonator 600 are used to control the position of the transmission zero point. Specifically, refer to... Figure 4 As shown, Figure 4 The simulation results of the S-parameters of the filter 20 provided in this embodiment show that the first inductor 501 and the first capacitor 502, as well as the second inductor 601 and the second capacitor 602, play a role in controlling the transmission zero T in the topology. z2 .
[0068] In one embodiment, both the third LC parallel resonator 700 and the fourth LC parallel resonator 800 are grounded. The third LC parallel resonator 700 includes a fifth inductor 701 and a third capacitor 702 connected in parallel; the fourth LC parallel resonator 800 includes a sixth inductor 801 and a fourth capacitor 802 connected in parallel. In some embodiments, the third LC parallel resonator 700 is grounded through a fifth capacitor 703, and the fourth LC parallel resonator 800 is grounded through a sixth capacitor 803. The third LC parallel resonator 700 and the fourth LC parallel resonator 800 are used to control the positions of the transmission zero and transmission poles. Specifically, refer to... Figure 4 As shown, Figure 4 The simulation results of the S-parameters of the filter 20 provided in this embodiment are shown, wherein the fifth inductor 701 and the fifth capacitor 703 are used to control the transmission zero point T. z3 and transmission pole T p2 The position of the sixth inductor 801 and the sixth capacitor 803 is used to control the transmission zero point T. z1 and transmission pole T p1 The location.
[0069] As a further improvement, the substrate includes a passive integrated substrate fabricated based on semiconductor passive integrated circuit technology and a printed circuit board fabricated based on printed circuit technology; the capacitors in the first LC parallel resonator 500 and the second LC parallel resonator 600 are planar capacitors arranged on the passive integrated substrate; the inductors in the first LC parallel resonator 500 and the second LC parallel resonator 600 are spiral inductors arranged on the printed circuit board. In some embodiments, the first capacitor 502 is a planar capacitor arranged on the first passive integrated substrate 5021, the second capacitor 602 is a planar capacitor arranged on the second passive integrated substrate 6021, the fifth capacitor 703 is a planar capacitor arranged on the fifth passive integrated substrate 7031, and the sixth capacitor 803 is a planar capacitor arranged on the sixth passive integrated substrate 8031; the first inductor 501, the second inductor 601, the fifth inductor 701, and the sixth inductor 801 are all spiral inductors arranged on the printed circuit board. Passive integrated circuit (SI) substrates, fabricated using semiconductor passive integration technology, are surface-mounted onto a printed circuit board (PCB). Electrical connections to inductors are achieved via gold wire bonding. Metallized vias are present on the PCB directly beneath each SI substrate to ensure that the capacitor and inductor grounds are at the same potential. Each parallel-plate capacitor has three adjustment points on each side; connecting / disconnecting these points allows adjustment of the capacitor's capacitance. Compared to surface-mount capacitors, capacitors fabricated using semiconductor passive integration technology can be manufactured with arbitrary capacitance values, thus offering high flexibility, tunability, and small size.
[0070] In some embodiments, the fifth inductor 701 and the sixth inductor 801 are both planar spiral inductors, and the third capacitor 702 and the fourth capacitor 802 are the parasitic capacitances of the fifth inductor 701 and the sixth inductor 801, respectively. This reduces the area of the hybrid integration of the third capacitor 702 and the fourth capacitor 802, allowing the filter to be designed to be smaller.
[0071] Figure 5 The graph also shows the variation of the inductance L and quality factor Q of the spiral inductor with the number of turns n. It can be seen from the graph that the number of turns has a significant impact on all inductor parameters. As the number of turns n increases, the inductance increases, but the self-resonant frequency also decreases significantly. This is because the increased inductor area leads to a larger parasitic capacitance. The Q value increases with increasing n before reaching its maximum value; after reaching its maximum, the Q value drops sharply. Other parameters such as the inductor's inner diameter d, line spacing s, and line width w also affect the inductor performance. By analyzing these parameters, a circular inductor model with a high Q value within the desired frequency band can be established. Therefore, the resonant frequency can be controlled by adjusting the values of the capacitance and inductance in the resonant circuit, thereby controlling the operating frequency.
[0072] In one embodiment, a third inductor 503 is connected in series before the first capacitor 502 and the first inductor 501 are connected in parallel; a fourth inductor 603 is connected in series before the second capacitor 602 and the second inductor 601 are connected in parallel. The third inductor 503 and the fourth inductor 603 can be further magnetically coupled to the third capacitor 702 and the fourth capacitor 802, thereby enabling the third inductor 503 and the fourth inductor 603 to control the transmission pole T with the third capacitor 702 and the fourth capacitor 802. p3 and transmission pole T p4 The location.
[0073] In some embodiments of the present invention, the cross-shaped structure formed by four sets of LC parallel resonators is a symmetrical structure symmetrical about the central connection point OP. Figure 3 In the illustrated embodiment, the first LC parallel resonator 500 and the second LC parallel resonator 600 are centrally symmetrical structures with the central connection point OP of the cross-shaped structure as the center of symmetry. Similarly, the third LC parallel resonator 700 and the fourth LC parallel resonator 800 are also centrally symmetrical structures with the central connection point OP of the cross-shaped structure as the center of symmetry. Throughout the specification, the term "centrally symmetrical" should be understood as meaning that the positions of corresponding components or other structures in the LC parallel resonant circuit are approximately symmetrical, without requiring that the fine structures of each component be strictly symmetrical. For example, it is not required that the spiral directions of corresponding inductor coils are also centrally symmetrical. Furthermore, the parameter values of the components in the symmetrical structure may or may not be equal.
[0074] In addition, Figure 3 In the illustrated embodiment, although only four sets of LC parallel resonators are shown, the invention is not limited to this. More sets of LC parallel resonators can be used to form a cross-shaped structure. In this implementation, each line of the cross-shaped structure can also have at least one set of LC parallel resonators.
[0075] Figure 4 The S-parameter simulation structure of the miniaturized band-stop filter 20 shown in this embodiment of the invention is illustrated. Simulation results show that the stopband center frequency is 1 GHz, the relative bandwidth is 62.4%, the insertion loss is 20 dB, and the upper passband range can be extended from 20 dB to 4.5 dB. f 0. It can be seen from this that the miniaturized band-stop filter 10 provided by the present invention has broadband characteristics, and the stopband filter has high selectivity and wide upper passband characteristics.
[0076] The foregoing has provided a detailed description of a miniaturized band-stop filter based on hybrid integration provided by the embodiments of the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the above embodiments are only for the purpose of helping to understand the technical solutions and core ideas of the present invention. Those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. A miniaturized band-stop filter (10) based on hybrid integration, characterized in that, include: A signal path (S) is arranged between a first port (P1) and a second port (P2), and a central connection point (CP) is formed on the signal path (S); and At least four sets of LC parallel resonant circuits, wherein the first LC parallel resonant circuit (100) and the second LC parallel resonant circuit (200) in the at least four sets of LC parallel resonant circuits are connected to each other through the central connection point (CP), and the third LC parallel resonant circuit (300) and the fourth LC parallel resonant circuit (400) in the at least four sets of LC parallel resonant circuits are connected to each other through the central connection point (CP); The first LC parallel resonant circuit (100) and the second LC parallel resonant circuit (200) are respectively arranged on both sides of the central connection point (CP) in the first direction to form at least a part of the signal path (S). The third LC parallel resonant circuit (300) and the fourth LC parallel resonant circuit (400) are respectively arranged on both sides of the central connection point (CP) in the second direction intersecting the first direction, so that the at least four sets of LC parallel resonant circuits are connected to form a cross-shaped structure. The first LC parallel resonant circuit (100) includes a first inductor (101) and a first capacitor (102) connected in parallel; the second LC parallel resonant circuit (200) includes a second inductor (201) and a second capacitor (202) connected in parallel; a third inductor (103) is connected in series before the first capacitor (102) is connected in parallel with the first inductor (101); a fourth inductor (203) is connected in series before the second capacitor (202) is connected in parallel with the second inductor (201); the inductance of the third inductor (103) and the inductance of the fourth inductor (203) are equal to each other.
2. The miniaturized band-stop filter (10) as described in claim 1, characterized in that, The first LC parallel resonant circuit (100) is connected to the first port (P1), and the second LC parallel resonant circuit (200) is connected to the second port (P2).
3. The miniaturized band-stop filter (10) as described in claim 1, characterized in that, The cross-shaped structure formed by the at least four sets of LC parallel resonant circuits is a symmetrical structure about the central connection point (CP).
4. The miniaturized band-stop filter (10) as described in claim 1, characterized in that, Each set of LC parallel resonant circuits includes an inductor and a capacitor connected in parallel with each other.
5. The miniaturized band-stop filter (10) as described in claim 1, characterized in that, The inductance of the first inductor (101) is equal to the inductance of the second inductor (201); the capacitance of the first capacitor (102) is equal to the capacitance of the second capacitor (202).
6. The miniaturized band-stop filter (10) according to any one of claims 1-4, characterized in that, Both the third LC parallel resonant circuit (300) and the fourth LC parallel resonant circuit (400) are grounded.
7. The miniaturized band-stop filter (10) as described in claim 6, characterized in that, The third LC parallel resonant circuit (300) includes a fifth inductor (301) and a third capacitor (302) connected in parallel with each other; the fourth LC parallel resonant circuit (400) includes a sixth inductor (401) and a fourth capacitor (402) connected in parallel with each other.
8. The miniaturized band-stop filter (10) as described in claim 7, characterized in that, The inductance of the fifth inductor (301) is not equal to the inductance of the sixth inductor (401); the capacitance of the third capacitor (302) is not equal to the capacitance of the fourth capacitor (402).
9. The miniaturized band-stop filter (10) as described in claim 6, characterized in that, The third LC parallel resonant circuit (300) is grounded through the fifth capacitor (303), and the fourth LC parallel resonant circuit (400) is grounded through the sixth capacitor (403).
10. The miniaturized band-stop filter (10) as described in claim 9, characterized in that, The capacitance of the fifth capacitor (303) is not equal to the capacitance of the sixth capacitor (403).
11. A miniaturized band-stop filter (20) based on hybrid integration, characterized in that, include: A substrate, on which a first terminal (H1) and a second terminal (H2) are electrically connected, and a central connection point (OP) is formed between the first terminal (H1) and the second terminal (H2); and At least four LC parallel resonators are disposed on the substrate, wherein the first LC parallel resonator (500) and the second LC parallel resonator (600) of the at least four LC parallel resonators are connected to each other through the central connection point (OP), and the third LC parallel resonator (700) and the fourth LC parallel resonator (800) of the at least four sets of LC parallel resonators are connected to each other through the central connection point (OP). The first LC parallel resonator (500) and the second LC parallel resonator (600) are respectively arranged on both sides of the central connection point (OP) in the first direction, and the third LC parallel resonator (700) and the fourth LC parallel resonator (800) are respectively arranged on both sides of the central connection point (OP) in the second direction intersecting the first direction, so that the at least four sets of LC parallel resonators are connected to form a cross-shaped structure. The first LC parallel resonator (500) includes a first inductor (501) and a first capacitor (502) connected in parallel; the second LC parallel resonator (600) includes a second inductor (601) and a second capacitor (602) connected in parallel. Before the first capacitor (502) and the first inductor (501) are connected in parallel, a third inductor (503) is connected in series; before the second capacitor (602) and the second inductor (601) are connected in parallel, a fourth inductor (603) is connected in series. The inductance of the third inductor (503) is equal to the inductance of the fourth inductor (603).
12. The miniaturized band-stop filter (20) as described in claim 11, characterized in that, The first LC parallel resonator (500) is connected to the first terminal (H1), and the second LC parallel resonator (600) is connected to the second terminal (H2).
13. The miniaturized band-stop filter (20) as described in claim 11, characterized in that, The cross-shaped structure formed by the at least four sets of LC parallel resonators is a symmetrical structure about the central connection point (OP).
14. The miniaturized band-stop filter (20) as described in claim 11, characterized in that, Each set of LC parallel resonators includes inductors and capacitors connected in parallel with each other.
15. The miniaturized band-stop filter (20) according to any one of claims 11-14, characterized in that, The substrate includes a passive integrated substrate made based on semiconductor passive integrated technology and a printed circuit substrate made based on printed circuit technology; the capacitors in the first LC parallel resonator (500) and the second LC parallel resonator (600) are planar capacitors arranged on the passive integrated substrate; the inductors in the first LC parallel resonator (500) and the second LC parallel resonator (600) are spiral inductors arranged on the printed circuit substrate.
16. The miniaturized band-stop filter (20) as described in claim 15, characterized in that, The inductance of the first inductor (501) is equal to the inductance of the second inductor (601); the capacitance of the first capacitor (502) is equal to the capacitance of the second capacitor (602).
17. The miniaturized band-stop filter (20) according to any one of claims 11-14, characterized in that, Both the third LC parallel resonator (700) and the fourth LC parallel resonator (800) are grounded.
18. The miniaturized band-stop filter (20) as described in claim 17, characterized in that, The third LC parallel resonator (700) includes a fifth inductor (701) and a third capacitor (702) connected in parallel with each other; the fourth LC parallel resonator (800) includes a sixth inductor (801) and a fourth capacitor (802) connected in parallel with each other.
19. The miniaturized band-stop filter (20) as described in claim 18, characterized in that, The inductance of the fifth inductor (701) is not equal to the inductance of the sixth inductor (801); the capacitance of the third capacitor (702) is not equal to the capacitance of the fourth capacitor (802).
20. The miniaturized band-stop filter (20) as described in claim 18, characterized in that, The fifth inductor (701) and the sixth inductor (801) are both planar spiral inductors, and the third capacitor (702) and the fourth capacitor (802) are the parasitic capacitances of the fifth inductor (701) and the sixth inductor (801), respectively.
21. The miniaturized band-stop filter (20) as described in claim 18, characterized in that, The third LC parallel resonator (700) is grounded through the fifth capacitor (703), and the fourth LC parallel resonator (800) is grounded through the sixth capacitor (803).
22. The miniaturized band-stop filter (20) as described in claim 21, characterized in that, The capacitance of the fifth capacitor (703) is not equal to the capacitance of the sixth capacitor (803).
Citation Information
Patent Citations
Broadband high-selectivity IPD filter chip suitable for microwave frequency band
CN114039571A