A fluidic heat dissipating device

Abstract

The jet flow heat dissipation device provided by the application comprises a cover body, a jet flow plate and a heat dissipation cold plate, the cover body is provided with a liquid cavity, a working medium inlet and a working medium outlet, the jet flow plate is connected with the cover body and covers the liquid cavity, a plurality of jet flow holes are uniformly arranged on the jet flow plate and communicate with the liquid cavity, the heat dissipation cold plate is connected with the cover body, the side of the heat dissipation cold plate facing the cover body is provided with a boiling cavity, a plurality of micro fins are arranged in the boiling cavity at intervals, the heights of the plurality of micro fins are in sinusoidal wave distribution, the micro fins corresponding to the sinusoidal wave peaks are aligned with the jet flow holes, the plurality of jet flow holes and the plurality of micro fins are matched in cooperation, so that the cooling liquid is uniformly distributed in the boiling cavity, and the temperature distribution of the region of the heat dissipation cold plate in contact with the heat source is uniform; in addition, the micro fins in sinusoidal wave distribution of the application are matched with the waveform characteristics of the jet flow field distribution, so that the flow resistance of jet flow impact is greatly reduced.

Description

Technical Field

[0001] This invention relates to the field of evaporation-boiling heat transfer technology in confined spaces, and particularly to a jet heat dissipation device. Background Technology

[0002] With the rapid development and integration of high-power microelectronics technology, the localized heat generation of microelectronic devices, such as high-power IGBTs and high-power lasers, has increased dramatically. Achieving ultra-high localized heat flux density heat dissipation within a confined space is particularly important, and rapid heat dissipation and reduced heat accumulation have become prerequisites for reliable equipment operation. Jet impingement, as a forward-looking method for thermal management of electronic devices, demonstrates significant advantages in heat dissipation.

[0003] However, in the existing technology, when heat dissipation is achieved through jet impact, the jet resistance is large and uniform heat dissipation on the surface of microelectronic devices cannot be achieved. Summary of the Invention

[0004] Therefore, the main objective of this invention is to provide a jet cooling device that can reduce jet resistance and achieve uniform heat dissipation.

[0005] To achieve the above objectives, the present invention provides a jet heat dissipation device comprising:

[0006] The cover has a liquid cavity, a working fluid inlet and a working fluid outlet, and the working fluid inlet is connected to the liquid cavity;

[0007] A jetting plate, connected to the cover, covers the liquid cavity; the jetting plate has multiple jetting holes spaced apart, and the jetting holes communicate with the liquid cavity; and

[0008] A heat dissipation plate is connected to one end of the cover body that is connected to the jet plate. A boiling chamber is formed on the side of the heat dissipation plate facing the cover body. The boiling chamber is connected to the jet hole and also to the working fluid outlet. Multiple microfins are spaced apart on the bottom wall of the boiling chamber. The height of the multiple microfins is distributed in a sinusoidal waveform. The sinusoidal waveform includes multiple peaks. The multiple peaks correspond one-to-one with the multiple jet holes. Each peak is coaxially arranged with the corresponding jet hole. Each peak of the sinusoidal waveform corresponds to one or two microfins. The side of the heat dissipation plate away from the boiling chamber is used to be mounted on the heat source.

[0009] The coolant enters the liquid chamber through the working fluid inlet, and then impacts the microfins in the boiling chamber through the jet holes on the jet plate. The heat dissipation plate receives the heat from the heat source, causing the coolant in the boiling chamber to undergo phase change and dissipate heat. The steam generated by the phase change is discharged through the working fluid outlet.

[0010] Preferably, the plurality of jet holes are arranged in an array, with the jet holes being equally spaced in the horizontal and vertical directions, and the plurality of microfins are arranged in an array, with the height of the plurality of microfins in the horizontal and vertical directions being distributed in a sinusoidal waveform.

[0011] Preferably, the number of jet holes is 25, and the 25 jet holes are arranged in a 5×5 array.

[0012] Preferably, a plurality of jet nozzles are uniformly arranged on the side of the jet plate facing the heat dissipation plate. The number of jet nozzles is the same as the number of jet holes, and the jet nozzles correspond one-to-one with the jet holes. Each jet nozzle has a through hole, and the jet holes and the boiling chamber are connected through the through holes.

[0013] Preferably, the jet nozzle is detachable from the heat dissipation plate, and the jet nozzle includes various specifications, with different specifications having different lengths and / or different diameters of the through holes.

[0014] Preferably, the cover body also has a vapor chamber spaced apart from the liquid chamber, and the vapor chamber is connected to the working fluid outlet and the boiling chamber respectively.

[0015] Preferably, the heat source is a chip, and the power of the chip is greater than 1000W.

[0016] Preferably, the area of ​​the heat dissipation plate corresponding to the microfins is the same as the surface area of ​​the chip.

[0017] Preferably, the jet heat dissipation device is made by machining or 3D printing technology.

[0018] Preferably, the material of the jet heat dissipation device is copper, aluminum, or ceramic.

[0019] The advantages of the technical solution of this invention are as follows: When heat dissipation of the heat source is required, the side of the heat dissipation plate away from the boiling chamber is made to contact the heat source. The coolant enters the liquid chamber through the working fluid inlet and then impacts the microfins in the boiling chamber through the jet holes on the jet plate. The heat dissipation plate receives the heat from the heat source, causing the coolant in the boiling chamber to undergo phase change and dissipate heat. The steam generated by the phase change is discharged through the working fluid outlet, thereby achieving heat dissipation of the heat source. In this invention, multiple jet holes are evenly distributed on the jet plate, and multiple spaced microfins are arranged in the boiling chamber. The multiple jet holes and multiple microfins work together to ensure that the coolant is evenly distributed in the boiling chamber, thereby making the temperature distribution in the area where the heat dissipation plate contacts the heat source uniform and preventing the existence of thermal stress. In addition, compared with traditional microfins, the sinusoidal distribution of the microfins in this application matches the waveform characteristics of the jet flow field, thereby greatly reducing the flow resistance of the jet impact. Furthermore, the arrangement of the sinusoidal distribution of the microfins can increase the heat exchange area, so the jet heat dissipation device of this application can reduce the jet resistance and achieve uniform heat dissipation. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the devices shown in these drawings without creative effort.

[0021] Figure 1 An exploded view of a jet cooling device according to one embodiment;

[0022] Figure 2 This is a cross-sectional view of a jet heat dissipation device according to an embodiment;

[0023] Figure 3 This is a 3D cross-sectional view of a jet heat dissipation device according to an embodiment;

[0024] Figure 4 This is a schematic diagram of the structure of the cover in one embodiment;

[0025] Figure 5 This is a top view of the cover body according to one embodiment;

[0026] Figure 6 This is a front cross-sectional view of the cover body according to one embodiment;

[0027] Figure 7 A top view of a jet plate according to one embodiment;

[0028] Figure 8 This is a front cross-sectional view of a jet plate according to one embodiment;

[0029] Figure 9 A top view of a heat dissipation plate according to one embodiment;

[0030] Figure 10 This is a front cross-sectional view of a heat dissipation plate according to one embodiment;

[0031] Figure 11 This is a schematic diagram of the structure of a heat dissipation plate according to one embodiment.

[0032] Among them, 100. Cover body; 110. Working medium inlet; 120. Working medium outlet; 130. Liquid chamber; 140. Gas chamber; 200. Jet plate; 210. Jet hole; 220. Jet nozzle; 221. Through hole; 300. Heat dissipation plate; 310. Boiling chamber; 320. Microfins.

[0033] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0034] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0035] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of the components in a specific posture (as shown in the attached figure). If the specific posture changes, the directional indication will also change accordingly. Furthermore, the descriptions involving "first," "second," etc., in the present invention are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the term "and / or" throughout the text includes three solutions. Taking A and / or B as an example, it includes technical solution A, technical solution B, and a technical solution that simultaneously satisfies A and B. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

[0036] like Figures 1-3As shown, a jet heat dissipation device includes a cover 100, a jet plate 200, and a heat dissipation plate 300. The cover 100 has a liquid cavity 130, a working fluid inlet 110, and a working fluid outlet 120. The working fluid inlet 110 is connected to the liquid cavity 130. The jet plate 200 is connected to the cover 100 and covers the liquid cavity 130. A plurality of jet holes 210 are spaced apart on the jet plate 200 and are connected to the liquid cavity 130. The heat dissipation plate 300 is connected to the cover 100 at one end of the jet plate 200. A boiling chamber 310 is formed on the side of the heat dissipation plate 300 facing the cover 100. The boiling chamber 310 is connected to the jet holes 210 and also to the working fluid outlet 120. The bottom wall of the boiling chamber 310 has... Multiple microfins 320 are spaced apart, and the height of the multiple microfins 320 is distributed in a sinusoidal waveform. The sinusoidal waveform includes multiple peaks, and each peak corresponds to a multiple jet hole 210. Each peak and the corresponding jet hole 210 are coaxially arranged. Each peak of the sinusoidal waveform corresponds to one or two microfins 320. The side of the heat dissipation plate 300 away from the boiling chamber 310 is used to be set on the heat source. The coolant enters the liquid chamber 130 through the working fluid inlet 110, and then jets through the jet holes 210 on the jet plate 200 to impact the microfins 320 in the boiling chamber 310. The heat dissipation plate 300 receives the heat from the heat source, causing the coolant in the boiling chamber 310 to undergo phase change and dissipate heat. The steam generated by the phase change is discharged through the working fluid outlet 120.

[0037] When heat dissipation is required, the side of the heat dissipation plate 300 away from the boiling chamber 310 is brought into contact with the heat source. The coolant enters the liquid chamber 130 through the working fluid inlet 110, and then impacts the microfins 320 on the bottom wall of the boiling chamber 310 through the jet holes 210 on the jet plate 200. The heat dissipation plate 300 receives the heat from the heat source, causing the coolant in the boiling chamber 310 to undergo phase change and dissipate heat. The steam generated by the phase change is discharged through the working fluid outlet 120, thereby achieving heat dissipation of the heat source. In this design, multiple jet holes 210 are evenly distributed on the jet plate 200, and multiple spaced microfins 320 are arranged within the boiling chamber 310. The coordinated matching of the jet holes 210 and microfins 320 ensures uniform distribution of the coolant within the boiling chamber 310, resulting in a uniform temperature distribution in the area where the heat dissipation plate 300 contacts the heat source and preventing thermal stress. Furthermore, compared to traditional microfins 320, the sinusoidal distribution of the microfins 320 in this application matches the waveform characteristics of the jet flow field, significantly reducing the flow resistance of the jet impact. The microfins 320 are located on the bottom wall of the boiling chamber 310, on the side of the heat dissipation plate 300 opposite to the heat source, allowing heat from the heat source to be transferred to the microfins 320. The sinusoidal distribution of the microfins 320 increases the heat exchange area. Therefore, this jet cooling device reduces jet resistance and achieves uniform heat dissipation.

[0038] The sinusoidal wave-shaped microfins 320 of this application create a undulating flow path for the coolant, thereby increasing the impact of the sprayed coolant on the microfins 320 and improving heat transfer performance. The heat dissipation plate 300 is connected to one end of the jet plate 200 connected to the cover 100, meaning the jet plate 200 is located between the heat dissipation plate 300 and the cover 100. In this embodiment, the jet plate 200 is located within the space formed by the heat dissipation plate 300 and the cover 100.

[0039] Specifically, the jet plate 200 of this application has multiple jet holes 210 evenly distributed on it. This avoids the situation where only the area of ​​the heat dissipation plate 300 corresponding to the jet hole 210 has a lower temperature, while the temperature of the other areas of the heat dissipation plate 300 is higher, when there is only one jet hole 210. The waveform characteristics of the actual jet flow field distribution are approximately sinusoidal. Therefore, the microfins 320 with a sinusoidal waveform distribution can match the waveform characteristics of the jet flow field distribution. The heights of the multiple microfins 320 are distributed in a sinusoidal waveform, where the sinusoidal waveform has multiple peaks. Each peak corresponds one-to-one with a jet hole 210, and the microfin 320 corresponding to the peak of the sinusoidal waveform refers to the microfin 320 with the highest height.

[0040] In this embodiment, the coolant is powered to flow by a pump body, which can be an external pump body.

[0041] The cross-sectional area of ​​the jet hole 210 is larger than that of the micro fin 320. Therefore, when the coolant jets through the jet hole 210 to impact the micro fin 320, the coolant can cover the micro fin 320 directly below the jet hole 210. In this embodiment, the number of micro fins 320 with a sinusoidal waveform distribution in one cycle is even. Thus, the peak of the sinusoidal waveform corresponds to two adjacent micro fins 320, and the coolant can jet impact the two micro fins 320 directly below the jet hole 210 through the jet hole 210.

[0042] refer to Figure 2 The microfin 320 is a rectangular column, and the side length of the microfin 320 is the same as the gap between adjacent microfins 320.

[0043] refer to Figure 1 and Figure 11Multiple jet holes 210 are arranged in an array, with equal intervals in both the horizontal and vertical directions. Multiple microfins 320 are also arranged in an array, with their heights exhibiting a sinusoidal waveform distribution in both the horizontal and vertical directions. Specifically, this arrangement allows the coolant to uniformly jet-impact the bottom wall of the boiling chamber 310, ensuring a uniform temperature distribution in the area where the heat dissipation plate 300 contacts the heat source, further preventing thermal stress. In this embodiment, the microfins 320 are also arranged in an array, exhibiting a sinusoidal waveform distribution in both the horizontal and vertical directions, so that each of the arrayed jet holes 210 corresponds to a microfin 320 with a sinusoidal waveform peak. (Refer to...) Figure 3 and Figure 9 The horizontal direction in the horizontal and vertical directions refers to Figure 3 and Figure 9 The X-axis is located in the horizontal direction, and the vertical direction refers to the direction of the horizontal and vertical axes. Figure 3 and Figure 9 In the Y-axis direction, specifically in both the horizontal and vertical directions, there are two microfins 320 directly below the jet holes 210, so that the coolant can jet and impact the four microfins 320 directly below the jet holes 210. In addition, the jet holes 210 are arranged in an array at equal intervals in both the horizontal and vertical directions.

[0044] refer to Figure 1 There are 25 jet holes 210, which are arranged in a 5×5 array. Specifically, there are 25 microfins 320 in the array that correspond to the peak of the sine wave, which correspond one-to-one with the 25 jet holes 210.

[0045] refer to Figure 1 A plurality of jet nozzles 220 are uniformly arranged on the side of the jet plate 200 facing the heat dissipation plate 300. The number of jet nozzles 220 is the same as the number of jet holes 210, and the jet nozzles 220 correspond one-to-one with the jet holes 210. The jet nozzles 220 are provided with through holes 221, and the jet holes 210 and the boiling chamber 310 are connected through the through holes 221. Specifically, the arrangement of the jet nozzles 220 enables reliable jet impact on the bottom wall of the boiling chamber 310. In this embodiment, the number of jet nozzles 220 and jet holes 210 is 25 each, and the 25 jet nozzles 220 are also arranged in a 5×5 array.

[0046] The jet nozzle 220 is detachable from the heat dissipation plate 300. The jet nozzle 220 includes various specifications, with different lengths and / or different apertures of the through-hole 221. Specifically, the jet impact speed can be controlled by changing the length of the jet nozzle 220 and the aperture of the through-hole 221. The longer the jet nozzle 220 or the smaller the aperture of the through-hole 221, the faster the jet impact speed, thereby improving the heat exchange performance of the coolant. In other embodiments, different specifications of jet nozzles 220 can be selected according to actual needs, so that the jet plate 200 has suitable jet nozzles 220.

[0047] refer to Figures 2-4 The cover 100 also has a vapor chamber 140 spaced apart from the liquid chamber 130. The vapor chamber 140 is connected to the working fluid outlet 120 and the boiling chamber 310. Specifically, the vapor chamber 140 is located between the working fluid outlet 120 and the boiling chamber 310. After the coolant in the boiling chamber 310 undergoes phase change and heat dissipation, the vapor generated by the phase change rises to the vapor chamber 140, preventing the vapor from accumulating at the bottom of the boiling chamber 310, thus delaying the boiling crisis and greatly improving the boiling heat transfer performance. In actual operation, the jet heat dissipation device is configured with the cover 100 on top and the heat dissipation plate 300 below, so the vapor chamber 140 is located above the boiling chamber 310. The vapor generated by the phase change rises to the vapor chamber 140 and is then discharged through the working fluid outlet 120.

[0048] The heat source is a chip with a power greater than 1000W. Specifically, the jet heat dissipation device of this application is mainly used for heat dissipation of high-power chips.

[0049] The area of ​​the heat dissipation plate 300 corresponding to the microfins 320 is the same as the surface area of ​​the chip, so that the surface area of ​​the chip corresponds to the microfins 320 evenly, thereby the chip surface can be uniformly dissipated, which effectively improves the uniformity of the surface temperature distribution of the chip. At the same time, the array jet impact can also meet the requirements of high power heat dissipation area. In this embodiment, the bottom area of ​​the liquid cavity 130 is similar to the area of ​​the area where the jet hole 210 is located, and the bottom area of ​​the liquid cavity 130 is the same as the area of ​​the heat dissipation plate 300 corresponding to the microfins 320.

[0050] The jet heat dissipation device is made by machining or 3D printing technology. Specifically, when the jet heat dissipation device is made by 3D printing technology, the jet heat dissipation device is printed as a whole; when the jet heat dissipation device is made by machining, the components are connected together by bolts or welded together, and the holes or cavities of the components are obtained by micro-milling.

[0051] The jet heat dissipation device is made of copper, aluminum or ceramic.

[0052] refer to Figure 1 ,Figure 1 The arrows in the diagram indicate the flow path of the coolant.

[0053] Example 1

[0054] like Figures 5-6 As shown, the cover 100 has a length and width of l1 (80 mm) and a height of h1 (20 mm). The liquid cavity 130 and the gas cavity 140 are machined / 3D printed inside it. At the same time, a certain space is left at the bottom of the liquid cavity 130 for embedding the jet plate 200. The liquid cavity 130 has a length and width of l4 (30 mm) and a height of h4 (10 mm). The gas cavity 140 has a length and width of l2 (50 mm) and a height of h2 (15 mm). The width of the gas cavity 140 is 1 / 2 × (l2 - l3). The working fluid inlet 110 and the working fluid outlet 120 are distributed on opposite sides of the upper cover 100. The diameter d1 of the working fluid inlet 110 is equal to the diameter d2 of the working fluid outlet 120 (8 mm). The lengths of the working fluid inlet 110 and the working fluid outlet 120 are [1 / 2×(l1-l4)] (25 mm) and [1 / 2×(l1-l2)] (15 mm), respectively.

[0055] like Figures 7-8 As shown, the length and width of the jet plate 200 are both l3 (10 mm), and the overall height is (h3 + h3') (7-12 mm). There are 25 jet holes 210 evenly distributed in the middle area directly opposite the liquid cavity 130. The hole diameter is d3 (1-4 mm) and the height is h3 (5 mm). Below each jet hole 210 2.1 is a jet nozzle 220. The inner diameter of the jet nozzle 220 is the same as the hole diameter of the jet hole 210. The length of the jet nozzle 220 is h3' (2-7 mm). The jet impact speed can be controlled by changing the inner diameter and length of the nozzle.

[0056] like Figures 9-10 As shown, the heat dissipation plate 300 has a length and width of l1 (80 mm) and a height of h5 (15 mm). It contains a boiling chamber 310, which has a length and width of l2 (50 mm) and a height of h6 (10 mm). The heated area of ​​the bottom plate of the boiling chamber 310 is (l4×l4)(30×30 mm). 2 The design includes an array of microfins 320, with a side length of l5 (0.2-1 mm), a spacing of l5 (0.2-1 mm) between microfins 320, a height of h7 (0.2-2 mm) for microfins 320, and the microfins 320 being distributed in a sinusoidal wave shape with the wave crests facing the jet nozzle 220.

[0057] The above are merely preferred embodiments of the present invention and do not limit the patent scope of the present invention. Any equivalent device transformations made based on the inventive concept of the present invention and the contents of the specification and drawings of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A jet heat dissipation device, characterized in that, include: The cover has a liquid cavity, a working fluid inlet and a working fluid outlet, and the working fluid inlet is connected to the liquid cavity; A jetting plate, connected to the cover, covers the liquid cavity; the jetting plate has multiple jetting holes spaced apart, and the jetting holes communicate with the liquid cavity; and A heat dissipation plate is connected to one end of the cover body that is connected to the jet plate. A boiling chamber is formed on the side of the heat dissipation plate facing the cover body. The boiling chamber is connected to the jet holes and also to the working fluid outlet. Multiple microfins are spaced apart on the bottom wall of the boiling chamber. The height of the multiple microfins is distributed in a sinusoidal waveform. The sinusoidal waveform includes multiple peaks. The multiple peaks correspond one-to-one with the multiple jet holes. Each peak is coaxially arranged with the corresponding jet hole. Each peak of the sinusoidal waveform corresponds to one or two microfins. The side of the heat dissipation plate away from the boiling chamber is used to be mounted on the heat source. The side length of the microfins is the same as the gap between adjacent microfins. The multiple jet holes are arranged in an array. The jet holes are evenly spaced in the horizontal and vertical directions. The multiple microfins are arranged in an array. The height of the multiple microfins in the horizontal and vertical directions is distributed in a sinusoidal waveform. The coolant enters the liquid chamber through the working fluid inlet, and then impacts the microfins in the boiling chamber through the jet holes on the jet plate. The heat dissipation plate receives the heat from the heat source, causing the coolant in the boiling chamber to undergo phase change and dissipate heat. The steam generated by the phase change is discharged through the working fluid outlet.

2. The jet heat dissipation device as described in claim 1, characterized in that, The number of jet holes is 25, and the 25 jet holes are arranged in a 5×5 array.

3. The jet heat dissipation device as described in claim 1, characterized in that, The jet plate has a plurality of jet nozzles evenly arranged on the side facing the heat dissipation plate. The number of jet nozzles is the same as the number of jet holes, and the jet nozzles correspond one-to-one with the jet holes. Each jet nozzle has a through hole, and the jet holes and the boiling chamber are connected through the through holes.

4. The jet heat dissipation device as described in claim 3, characterized in that, The jet nozzle is detachable from the heat dissipation plate. The jet nozzle includes various specifications, and the length of the jet nozzle and / or the diameter of the through hole are different for different specifications.

5. The jet heat dissipation device as described in claim 1, characterized in that, The cover also has a vapor chamber spaced apart from the liquid chamber, and the vapor chamber is connected to the working fluid outlet and the boiling chamber respectively.

6. The jet heat dissipation device as described in claim 1, characterized in that, The heat source is a chip, and the power of the chip is greater than 1000W.

7. The jet heat dissipation device as described in claim 6, characterized in that, The area of ​​the heat dissipation plate corresponding to the microfins is the same as the surface area of ​​the chip.

8. The jet heat dissipation device as described in claim 1, characterized in that, The jet heat dissipation device is made by machining or 3D printing technology.

9. The jet heat dissipation device as described in claim 1, characterized in that, The material of the jet heat dissipation device is copper, aluminum or ceramic.

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