Composite shell, display module, manufacturing method and application thereof

Abstract

The present application relates to a kind of composite shell, display module and its manufacturing method and application, wherein composite shell, applied to display module, including heat dissipation aluminum plate and plastic shell, multiple honeycomb-shaped protruding parts are distributed on the end face along the thickness direction of the heat dissipation aluminum plate, multiple the protruding parts are mutually spaced distribution on the upper surface of heat dissipation aluminum plate, the plastic shell is covered in the four around heat dissipation aluminum plate, and it extends to the surface of heat dissipation aluminum plate along the length direction of heat dissipation aluminum plate, the plastic shell located in the lower surface of heat dissipation aluminum plate is arranged between any two adjacent protruding parts, and it is formed with the bottom surface of protruding part between and forms a heat dissipation cavity, so that the protruding part of heat dissipation aluminum plate is exposed to air in whole when composite shell is installed and used, in the upper surface of heat dissipation aluminum plate is still filled with a layer of heat-conducting silica gel layer, for improving the heat conductivity of heat dissipation aluminum plate and the sealing of plastic shell junction.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a composite shell, a display module, a manufacturing method and application thereof. BACKGROUND

[0002] With the development of human-computer interface and the popularity of smart phones, tablets and other electronic products, displays are everywhere in people's lives. The display module is one of the main components of the display product, mainly composed of LED (Light Emitting Diode), PCB (Printed Circuit Board), IC (Integrated Circuit Chip) and other related electronic components and plastic kits.

[0003] The existing all-plastic shell not only has the technical problems of poor heat dissipation performance and uneven heat dissipation, but also causes the electronic components inside the shell to be locally overheated during use, so that the screen of the display will produce a bluish phenomenon, and in severe cases, the smart device will be easily disturbed, contact failure and poor performance during use. At the same time, the existing all-plastic shell also has the technical problems of low strength and insufficient stability of the shell. SUMMARY

[0004] Therefore, the purpose of the present application is to avoid the shortcomings of the prior art and provide a composite shell, a display module, a manufacturing method and application thereof to solve the problems of uneven heating, poor heat dissipation effect, poor contact and poor performance of the existing display module.

[0005] One of the purposes of the embodiments of the present application is:

[0006] The embodiment provides a composite shell applied to a display module, which comprises a heat dissipation aluminum plate and a plastic shell, a plurality of convex parts in a honeycomb shape are arranged on the end surface of the heat dissipation aluminum plate in the thickness direction, the plurality of convex parts are arranged on the upper surface of the heat dissipation aluminum plate and are spaced from each other, the plastic shell covers the periphery of the heat dissipation aluminum plate and extends to the surface of the heat dissipation aluminum plate in the length direction of the heat dissipation aluminum plate, the plastic shell on the upper surface of the heat dissipation aluminum plate is arranged between any two adjacent convex parts and forms a honeycomb-shaped supporting part with a size matching the convex part on the periphery of the convex part, the height of the supporting part is greater than the height of the convex part, the plastic shell on the lower surface of the heat dissipation aluminum plate is arranged between any two adjacent convex parts and forms a heat dissipation cavity with the bottom surface of the convex part, so that the convex part of the heat dissipation aluminum plate is exposed to air when the composite shell is installed and used, a heat-conducting silica gel layer is further filled on the upper surface of the heat dissipation aluminum plate, and the bottom of the heat-conducting silica gel layer further covers the connection between the heat dissipation aluminum plate and the plastic shell, so that the sealing performance of the connection between the heat dissipation aluminum plate and the plastic shell is improved.

[0007] Further, a round hole is arranged on the heat dissipation aluminum plate, the plastic shell comprises upper plastic and lower plastic, the upper plastic is arranged on the upper surface of the heat dissipation aluminum plate, and the lower plastic is arranged on the lower surface of the upper plastic in a opposite manner, and the upper plastic is integrally formed between the round hole of the heat dissipation aluminum plate and the lower plastic.

[0008] Further, a positioning hole is further arranged on the heat dissipation aluminum plate for facilitating injection molding of the heat dissipation aluminum plate and the plastic shell.

[0009] Further, a PCB mounting hole for connecting a PCB is further arranged on the plastic shell on the upper surface of the heat dissipation aluminum plate, and a clamping groove for connecting external electronic components is further arranged on the plastic shell on the upper surface of the heat dissipation aluminum plate.

[0010] The second purpose of the embodiment of the application is to:

[0011] The embodiment provides a display module, which comprises a PCB, an IC control chip, an LED lamp and the composite shell, the PCB is arranged on the composite shell, the LED lamp is arranged on the upper surface of the PCB, and the IC control chip is arranged on the lower surface of the PCB and is arranged opposite to the convex part of the heat dissipation aluminum plate.

[0012] The height of the heat-conducting silica gel is higher than the convex plane W of the aluminum plate, the thickness of the IC control chip is X, the height of the convex part is Y, and the height of the supporting part is Z, and the thickness X of the IC control chip and the height Z of the supporting part satisfy the following relationship: 0mm

[0013] Further, a waterproof layer is further included, which covers the upper surface of the PCB.

[0014] The third purpose of the embodiment of the present application is:

[0015] A manufacturing method of a display module is provided, comprising the following steps:

[0016] (1) Preparation of the heat dissipation aluminum plate: place the prepared aluminum plate in a precision hardware mold, and use an intelligent stamping device to form a honeycomb-shaped protrusion on the surface of the aluminum plate, so as to obtain a heat dissipation aluminum plate; ensure that the distance between the protrusion of the aluminum plate and the IC control chip is within 0.1 mm during installation;

[0017] (2) Injection molding of the plastic shell: first, place the heat dissipation aluminum plate prepared in step (1) in the mold of an injection molding machine, then add plastic particle raw materials to the injection molding machine, and finally turn on the injection molding machine to form a plastic shell on the upper and lower end surfaces of the outer periphery and the protruding portion of the heat dissipation aluminum plate, thereby obtaining a composite shell; wherein the positioning hole on the heat dissipation aluminum plate can be clamped on the positioning column inside the mold of the injection molding machine to accurately position the aluminum plate and ensure the accuracy of the integral injection molding;

[0018] (3) Filling of the heat-conducting silica gel: after the composite shell prepared in step (2) is kept in a horizontal balanced state, the thickness of the heat-conducting silica gel is controlled by the height of the honeycomb-shaped protrusion structure, and the height of the heat-conducting silica gel is 0.5-1.0 mm higher than the protruding plane of the aluminum plate;

[0019] (4) Assembly of the PCB: weld the LED lamp and the IC control chip on the front and back surfaces of the PCB to obtain a PCB containing the LED lamp and the IC control chip;

[0020] (5) Assembly of the display module: use a jig to shield the LED lamp on the front surface of the PCB lamp, and brush three-proof paint on the back surface of the PCB lamp plate; before the heat-conducting silica gel starts to solidify, the PCB prepared in step (4) is fixed and connected to the composite shell through the mounting hole in the PCB by a bolt, wherein the screwing force of the screw machine is less than 0.1 N;

[0021] (6) Filling of the waterproof glue: keep the display module assembled in step (5) in a horizontal balanced state, and inject waterproof glue to a standard height on the front surface of the PCB; wherein the waterproof glue is waterproof AB glue; the AB glue comprises epoxy resin and a coagulant; the coagulant comprises at least one of ethylenediamine, diethylenetriamine, triethylenetriamine, phenyldimethylamine, and m-phenylenediamine;

[0022] (7) Mask installation: after the waterproof glue in step (6) is solidified for 5-7 hours, an outer mask is installed to obtain a complete display module;

[0023] (8) Product inspection: the display module obtained in step (7) is subjected to data inspection, if the product composite standard, then packed into warehouse, if the product does not meet the standard, then re-repair.

[0024] Further, the preparation of the aluminum plate in step (1) comprises the following sub-steps:

[0025] (11) Raw material selection: according to the following mass percentage: 1.0-1.5% Mg, 3.5-4.0% Si, 0.3-0.5% Cu, 0.4-1.0% Fe, 0.05-0.20% Mn, 0.20-0.30% Li, 0.2-0.3% Zn, 0.08-0.12% Cr, 0.04-0.05 Ce, 0.01-0.02 Ti, the balance is Al and inevitable impurities;

[0026] (12) Pretreatment: the raw materials are preheated at 100-200 DEG C for 10-15 min;

[0027] (13) Smelting: after the raw materials pretreated in step (12) are placed in a smelting furnace to obtain a melt mixture, 0.5-1.0% of a deslagging agent and a refining agent are added, the refining is carried out for 10-20 min, the dross is removed, and then the aluminum alloy ingot is obtained after standing for 20-30 min;

[0028] (14) Hot rolling composite: the aluminum alloy ingot prepared in step (13) is heated to 520 DEG C and kept for 1.5-2 hours, the temperature is reduced to 400-420 DEG C during the time interval, and then the aluminum plate is rolled out of the furnace.

[0029] Further, the heat-conducting silica gel in step (3) comprises a high molecular silicone oil and a heat-conducting filler; the heat-conducting filler comprises at least any one of alumina, magnesium oxide, boron nitride, aluminum nitride, beryllium oxide and quartz.

[0030] The fourth purpose of the embodiment of the application is:

[0031] An electronic device is provided, and the electronic device comprises the display module or is prepared by the manufacturing method of the display module.

[0032] Compared with the prior art, the embodiment of the application has the following beneficial effects:

[0033] (1) In the embodiment of the present application, the composite shell is composed of a heat dissipation aluminum plate and a plastic shell, wherein the plastic shell is wrapped around the outer periphery of the heat dissipation aluminum plate and between adjacent protruding portions, so that the heat dissipation aluminum plate and the plastic shell are arranged alternately, and the support portion on the upper part of the plastic shell and the heat dissipation cavity on the lower part of the plastic shell are used in cooperation, so that when the composite shell is used, the protruding portion on the heat dissipation aluminum plate can conduct heat relative to the heat generating electronic components inside the display module, and the heat generated by the electronic components is conducted into the heat dissipation cavity through the heat conduction performance of the aluminum material, avoiding the technical problems of poor heat dissipation performance and uneven heat dissipation of the existing all-plastic shell when used, improving the overall heat dissipation performance of the display module; at the same time, a heat conduction silica gel layer is also arranged on the upper surface of the heat dissipation aluminum plate, which can further enhance the heat conduction effect of the heat dissipation aluminum plate and improve the heat conduction efficiency of the composite shell. A plurality of honeycomb-shaped protrusions are arranged on the heat dissipation aluminum plate, which can effectively enhance the strength of the aluminum plate during use, increase the contact area of the aluminum plate, improve the heat dissipation effect of the heat dissipation aluminum plate, and solve the technical problems of low strength and poor stability of the existing all-plastic shell.

[0034] (2) In the embodiment of the present application, a round hole is formed in the heat dissipation aluminum plate, and the plastic shell includes an upper layer of plastic and a lower layer of plastic, and the round hole of the plate connects the upper layer of plastic and the lower layer of plastic, so that the shell is not pulled off when demolding, and the yield of integral injection molding is reduced.

[0035] (3) In the embodiment of the present application, a display module is also provided, which is composed of a PCB board, an LED lamp, an IC control chip and a composite shell, the IC control chip is arranged on the lower surface of the PCB board and is arranged opposite to the protruding portion of the heat dissipation aluminum plate; wherein the height of the heat conduction silica gel is higher than the protruding plane W of the aluminum plate, the thickness of the IC control chip is X, the height of the protruding portion is Y, and the height of the support portion is Z, the thickness X of the IC control chip and the height Z of the support portion satisfy the following relationship: 0mm<Z-(W+X+Y)<0.1mm, so that the IC control chip and the heat dissipation aluminum plate are in the best heat conduction distance under the size limitation.

[0036] (4) In the embodiment of the present application, a waterproof layer is also included, which is covered on the upper surface of the PCB board, effectively improving the waterproof performance of the display module.

[0037] (5) The application also provides a preparation method of the display module. Through the cooperation of each step in the preparation method, the heat conduction coefficient of the composite shell is 209 W / m*k, which is more than twice that of the conventional pressure-cast aluminum shell (96.2 W / m*k) and more than four times that of the conventional all-plastic shell (48.5 W / m*k). Therefore, the heat conduction effect is obvious, and the heat dissipation effect is excellent. BRIEF DESCRIPTION OF DRAWINGS

[0038] The application will be further described with reference to the accompanying drawings, but the embodiments in the drawings do not constitute any limitation on the application. For ordinary skilled persons in the art, other drawings can be obtained without creative labor on the basis of the following drawings.

[0039] Figure 1 It is a partial cross-sectional structure diagram of the composite shell in the embodiment of the application.

[0040] Figure 2 It is a partial structure front view of the composite shell in the embodiment of the application.

[0041] Figure 3 It is a partial cross-sectional structure diagram of the display module in the embodiment of the application.

[0042] Figure 4 Position Figure 3 An enlarged view of the A part.

[0043] Figure 5 It is a step diagram of the manufacturing method of the display module in the embodiment of the application.

[0044] The drawings include: a heat dissipation aluminum plate 1, a plastic shell 2, a protruding part 3, a supporting part 4, a heat dissipation cavity 5, a heat conduction silica gel layer 6, a circular hole 7, an upper layer of plastic 8, a lower layer of plastic 9, a positioning hole 10, a PCB plate 11, a PCB mounting hole 111, a clamping groove 112, an IC control chip 12, an LED lamp 13, and a waterproof layer 14. DETAILED DESCRIPTION

[0045] The technical solutions in the embodiments of the application will be described clearly and completely below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, rather than all the embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the application.

[0046] The specific embodiments of the application will be described in detail below with reference to the drawings.

[0047] Embodiment 1:

[0048] As Figures 1-2 shown, the present embodiment provides a composite shell applied to a display module, comprising a heat dissipation aluminum plate 1 and a plastic shell 2, a plurality of protruding parts 3 arranged in a honeycomb shape are distributed on the end surface of the thickness direction of the heat dissipation aluminum plate 1, a plurality of the protruding parts 3 are distributed on the upper surface of the heat dissipation aluminum plate 1 at intervals, the plastic shell 2 covers the periphery of the heat dissipation aluminum plate 1 and extends to the surface of the heat dissipation aluminum plate 1 along the length direction of the heat dissipation aluminum plate 1, the plastic shell 2 on the upper surface of the heat dissipation aluminum plate 1 is arranged between any two adjacent protruding parts 3, and a honeycomb-shaped supporting part 4 with a size matching the protruding part 3 is formed on the periphery of the protruding part 3, the height of the supporting part 4 is greater than that of the protruding part 3, the plastic shell 2 on the lower surface of the heat dissipation aluminum plate 1 is arranged between any two adjacent protruding parts 3, and a heat dissipation cavity 5 is formed between the plastic shell 2 and the bottom surface of the protruding part 3, so that when the composite shell is installed and used, the protruding part 3 of the heat dissipation aluminum plate 1 is exposed to the air as a whole, a heat-conducting silica gel layer 6 is filled on the upper surface of the heat dissipation aluminum plate 1, and the bottom of the heat-conducting silica gel layer 6 covers the connection between the heat dissipation aluminum plate 1 and the plastic shell 2, so as to improve the sealing performance of the connection between the heat dissipation aluminum plate 1 and the plastic shell 2.

[0049] In the embodiment of the present application, the composite shell is composed of a heat dissipation aluminum plate 1 and a plastic shell 2, wherein the plastic shell 2 covers the periphery of the heat dissipation aluminum plate 1 and the space between adjacent protruding parts 3, so that the heat dissipation aluminum plate 1 and the plastic shell 2 are arranged at intervals and are matched with the supporting part 4 on the upper part of the plastic shell 2 and the heat dissipation cavity 5 on the lower part of the plastic shell 2, so that when the composite shell is used, the protruding part 3 on the heat dissipation aluminum plate 1 can conduct heat relative to the heat-generating electronic components inside the display module, and the heat generated by the electronic components is conducted into the heat dissipation cavity 5 through the heat-conducting performance of aluminum, thereby avoiding the technical problems of poor heat dissipation performance and uneven heat dissipation of the existing all-plastic shell when used, improving the overall heat dissipation performance of the display module; meanwhile, a heat-conducting silica gel layer 6 is arranged on the upper surface of the heat dissipation aluminum plate 1, which can further enhance the heat dissipation effect of the heat dissipation aluminum plate 1 and improve the heat dissipation efficiency of the composite shell. A plurality of honeycomb-shaped protrusions are arranged on the heat dissipation aluminum plate 1, which can effectively enhance the strength of the aluminum plate during use, increase the contact area of the aluminum plate, improve the heat dissipation effect of the heat dissipation aluminum plate 1, and solve the technical problems of low strength and insufficient stability of the existing all-plastic shell.

[0050] In a preferred embodiment, a circular hole 7 is formed on the heat dissipation aluminum plate 1, and the plastic shell 2 includes an upper plastic layer 8 and a lower plastic layer 9. The upper plastic layer 8 is disposed on the upper surface of the heat dissipation aluminum plate 1, and the lower plastic layer 9 is disposed opposite to the lower surface of the upper plastic layer 8. The upper plastic layer 8 is integrally formed between the circular hole 7 of the heat dissipation aluminum plate 1 and the lower plastic layer 9.

[0051] In this embodiment of the invention, a circular hole 7 is provided on the heat dissipation aluminum plate 1, and the plastic shell 2 includes an upper plastic layer 8 and a lower plastic layer 9. The circular hole 7 of the plate connects the upper plastic layer 8 and the lower plastic layer 9, so as to prevent the shell from being pulled apart when demolding and reduce the defect rate of one-piece injection molding.

[0052] In a preferred embodiment, the heat dissipation aluminum plate 1 is further provided with positioning holes 10 for facilitating the injection molding of the heat dissipation aluminum plate 1 and the plastic shell 2.

[0053] In this embodiment of the invention, the positioning hole 10 facilitates the positioning and injection molding of the plastic shell 2.

[0054] In a preferred embodiment, the plastic housing 2 located on the upper surface of the heat dissipation aluminum plate 1 is also provided with PCB mounting holes 111 for connecting the PCB board 11, and the plastic housing 2 located on the upper surface of the heat dissipation aluminum plate 1 is also provided with slots 112 for connecting external electronic components.

[0055] Example 2:

[0056] like Figures 1-2 As shown, this embodiment provides a display module, including a PCB board 11, an IC control chip 12, an LED lamp 13 and the aforementioned composite housing. The PCB board 11 is disposed on the upper part of the composite housing, the LED lamp 13 is disposed on the upper surface of the PCB board 11, and the IC control chip 12 is disposed on the lower surface of the PCB board 11 and is disposed opposite to the protrusion 3 of the heat dissipation aluminum plate 1.

[0057] Let the thickness of the IC control chip 12 be X, the height of the protrusion 3 be Y, and the height of the support 4 be Z. The thickness X of the IC control chip 12 and the height Z of the support 4 satisfy the following relationship: 0mm < Z - (X + Y) < 0.1mm.

[0058] The display module in the embodiment of the present application is also provided, which is composed of a PCB board 11, an LED lamp 13, an IC control chip 12 and a composite shell, the IC control chip 12 is arranged on the lower surface of the PCB board 11 and is arranged opposite to the protruding part 3 of the heat-dissipating aluminum plate 1; wherein the height of the heat-conducting silica gel is higher than the protruding plane W of the aluminum plate, the thickness of the IC control chip 12 is X, the height of the protruding part 3 is Y, the height of the supporting part 4 is Z, the thickness X of the IC control chip 12 and the height Z of the supporting part 4 satisfy the following relationship: 0mm < Z-(W+X+Y) < 0.1mm, so that the IC control chip 12 and the heat-dissipating aluminum plate 1 are in the optimal heat-conducting distance under the size limitation.

[0059] In the preferred embodiment, a waterproof layer 14 is further included, which covers the upper surface of the PCB board 11.

[0060] In the embodiment of the present application, a waterproof layer 14 is further included, which covers the upper surface of the PCB board 11, effectively improving the waterproof performance of the display module.

[0061] Embodiment 3:

[0062] The embodiment provides an electronic device, which comprises the display module or the display module prepared by the manufacturing method of the display module.

[0063] Embodiment 4:

[0064] The embodiment provides a manufacturing method of a display module, which is characterized by comprising the following steps:

[0065] (1) raw material selection: according to the following mass percentage: 1.0% of Mg, 3.5% of Si, 0.3-0.5% of Cu, 0.4% of Fe, 0.05% of Mn, 0.20% of Li, 0.2% of Zn, 0.08% of Cr, 0.04% of Ce, 0.01% of Ti, and the balance of Al and inevitable impurities;

[0066] (2) pretreatment: the raw material is preheated at 100℃ for 10min;

[0067] (3) smelting: the raw material after pretreatment in step (12) is placed in a smelting furnace to obtain a melt mixture, then 0.5% of a deslagging agent and a refining agent by the mass of the melt are added, the dross is removed after refining for 10min, and then the aluminum alloy ingot is obtained after standing for 20min;

[0068] (4) hot rolling: the aluminum alloy ingot prepared in step (13) is heated at 520℃ for 1.5h, the temperature is reduced to 400℃ for heat preservation in the time interval, and then the aluminum plate is obtained after being discharged and rolled.

[0069] (5) Preparation of the heat dissipation aluminum plate 1: the prepared aluminum plate is placed in a precision hardware mold, and the surface of the aluminum plate is made into a honeycomb-shaped protrusion arranged at intervals by an intelligent stamping device to obtain the heat dissipation aluminum plate 1; the distance between the protrusion of the aluminum plate and the IC control chip 12 during installation is ensured to be within 0.1 mm;

[0070] (6) Injection molding of the plastic shell 2: the heat dissipation aluminum plate 1 prepared in step (1) is first placed in the mold of an injection molding machine, then plastic particle raw materials are added to the injection molding machine, and finally the injection molding machine is started to inject a ring of plastic shell 2 on the upper and lower end faces of the heat dissipation aluminum plate 1 and the protrusion part 3 to obtain a composite shell; the positioning hole 10 on the heat dissipation aluminum plate 1 can be clamped on the positioning column inside the mold of the injection molding machine to accurately position the aluminum plate and ensure the accuracy of the integral injection molding;

[0071] (7) Filling of the heat-conducting silicone: the composite shell prepared in step (2) is kept in a horizontal balanced state, the thickness of the heat-conducting silicone is controlled by the height of the honeycomb-shaped protrusion structure, and the injection height of the heat-conducting silicone is 1.0 mm higher than the protrusion plane of the aluminum plate; the heat-conducting silicone includes high-molecular silicone oil and heat-conducting filler; the heat-conducting filler includes at least one of aluminum oxide, magnesium oxide, boron nitride, aluminum nitride, beryllium oxide, and quartz.

[0072] (8) Assembly of the PCB plate 11: the LED lamp 13 and the IC control chip 12 are welded on the front and back surfaces of the PCB to obtain the PCB plate 11 containing the LED lamp 13 and the IC control chip 12;

[0073] (9) Assembly of the display module: the LED lamp 13 on the front surface of the PCB lamp is shielded by a jig, the back surface of the PCB lamp plate is painted with a three-proofing paint, and before the heat-conducting silicone starts to solidify, the PCB plate 11 prepared in step (4) is fixed and connected to the composite shell through the mounting hole in the PCB by a bolt, wherein the screwing force of the bolt is less than 0.1 N;

[0074] (10) Filling of waterproof glue: the display module assembled in step (5) is kept in a horizontal balanced state, and waterproof glue is injected to a standard height on the front surface of the PCB plate 11; the waterproof glue is waterproof AB glue; the AB glue includes epoxy resin and a coagulant; the coagulant includes at least one of ethylenediamine, diethylenetriamine, triethylenetriamine, xylylenediamine, and m-phenylenediamine;

[0075] (11) Installation of the face mask: after the waterproof glue in step (6) is solidified for 5-7 hours, the outer face mask is installed to obtain a complete display module;

[0076] (12) Final inspection: the display module obtained in step (7) is subjected to data inspection, if the product composite standard, then packed into storage, if the product does not meet the standard, then re-repair.

[0077] The preparation method of the display module is also provided in the embodiments of the present application. Through the cooperation of each step in the preparation method, the heat conduction coefficient of the composite shell obtained is 209 W / m*k, which is more than twice that of the conventional die-cast aluminum shell (96.2 W / m*k) and more than four times that of the conventional all-plastic shell (48.5 W / m*k). Therefore, the heat conduction effect is obvious, and the heat dissipation effect is excellent.

[0078] Embodiment 5: Embodiment 5 differs from Embodiment 4 in that the preparation process of the aluminum plate is different, as shown below:

[0079] (1) Raw material selection: according to the following mass percentage: 1.5% Mg, 4.0% Si, 0.5% Cu, 1.0% Fe, 0.20% Mn, 0.30% Li, 0.3% Zn, 0.12% Cr, 0.05 Ce, 0.02 Ti, the balance is Al and unavoidable impurities;

[0080] (2) Pretreatment: preheat the raw materials at 200°C for 15 min;

[0081] (3) Melting: after the raw materials pretreated in step (2) are placed in a melting furnace to obtain a melt mixture, 1.0% of the mass of the melt of a deslagging agent and a refining agent is added, and after refining for 20 min, the dross is removed, and then it is left to stand for 30 min to obtain an aluminum alloy ingot;

[0082] (4) Hot rolling: the aluminum alloy ingot prepared in step (3) is kept at 520°C for 2 hours, and during this time interval, the temperature is reduced to 420°C for keeping, and then it is taken out of the furnace and rolled into an aluminum plate.

[0083] Embodiment 6: Embodiment 6 differs from Embodiment 4 in that the preparation process of the aluminum plate is different, as shown below:

[0084] (1) Raw material selection: according to the following mass percentage: 1.2% Mg, 3.7% Si, 0.4% Cu, 0.7% Fe, 0.12% Mn, 0.25% Li, 0.25% Zn, 0.09% Cr, 0.04 Ce, 0.01 Ti, the balance is Al and unavoidable impurities;

[0085] (2) Pretreatment: preheat the raw materials at 150°C for 12 min;

[0086] (3) Melting: after the pretreated raw materials in step (2) are placed in a melting furnace to obtain a melt mixture, 0.7% of a deslagging agent and a refining agent by mass of the melt are added, and the melt is refined for 15 min, after which the dross is removed, and then the melt is left to stand for 25 min to obtain an aluminum alloy ingot;

[0087] (4) Hot rolling: the aluminum alloy ingot prepared in step (3) is kept at 520℃ for 1.6 hours, and the temperature is lowered to 410℃ for keeping during the time interval, and then the aluminum alloy ingot is taken out of the furnace and rolled into an aluminum plate.

[0088] Comparative Example 1: Comparative Example 1 differs from Example 4 in that the preparation process of the aluminum plate is different.

[0089] (1) Raw material selection: the raw materials are prepared according to the following mass percentage: 1.0% Mg, 3.5% Si, 0.3-0.5% Cu, 0.4% Fe, 0.05% Mn, 0.20% Li, 0.2% Zn, 0.08% Cr, 0.04 Ce, 0.01 Ti, and the balance of Al and unavoidable impurities;

[0090] (2) Pretreatment: the raw materials are preheated at 100℃ for 10 min;

[0091] (3) Melting: after the pretreated raw materials in step (2) are placed in a melting furnace to obtain a melt mixture, 0.7% of a deslagging agent and a refining agent by mass of the melt are added, and the melt is refined for 15 min, after which the dross is removed, and then the melt is left to stand for 25 min to obtain an aluminum alloy ingot;

[0092] (4) Hot rolling: the aluminum alloy ingot prepared in step (3) is kept at 520℃ for 1.6 hours, and the temperature is lowered to 410℃ for keeping during the time interval, and then the aluminum alloy ingot is taken out of the furnace and rolled into an aluminum plate.

[0093] Comparative Example 2: Comparative Example 1 differs from Example 4 in that:

[0094] (1) Raw material selection: the raw materials are prepared according to the following mass percentage: 0.3-0.5% Cu, 0.4% Fe, 0.05% Mn, 0.20% Li, 0.2% Zn, 0.08% Cr, 0.04 Ce, 0.01 Ti, and the balance of Al and unavoidable impurities;

[0095] (2) Pretreatment: the raw materials are preheated at 100℃ for 10 min;

[0096] (3) Melting: after the pretreated raw materials in step (2) are placed in a melting furnace to obtain a melt mixture, 0.7% of a deslagging agent and a refining agent by mass of the melt are added, and the melt is refined for 15 min, after which the dross is removed, and then the melt is left to stand for 25 min to obtain an aluminum alloy ingot;

[0097] (4) Hot rolling: the aluminum alloy ingot prepared in step (3) is kept at 520°C for 1.5 hours, and the temperature is reduced to 400°C during the time interval, and then the aluminum plate is rolled out of the furnace.

[0098] Experimental Example

[0099] The test results of the mechanical properties and thermal conductivity of the aluminum alloy plates prepared in Examples 4-6 and Comparative Example 1 are shown in Table 1:

[0100] Example 4 Example 5 Example 6 Comparative Example 2 Tensile strength (Mpa) 266 265 263 230 Elongation (%) 23 22 22.5 25 Thermal conductivity (W / (m K)) 96.2 95.8 94.7 25

[0101] The test results of the mechanical properties and thermal conductivity of the aluminum alloy plates prepared in Examples 4-6 and Comparative Example 2 are shown in Table 2:

[0102]

[0103]

[0104] As can be seen from the test results of the examples and the comparative examples in Table 1, the tensile strength of the aluminum plate rolled at 520°C for 1.5 hours is greater than 260 MPa, and the elongation is greater than 22%. However, when the holding time is increased to 4 hours, the elongation of the rolled plate is high, but the strength is lower than the above-mentioned value, and the thermal conductivity coefficient is greatly reduced to 20.5 W / (m·K).

[0105] As can be seen from the test results of the examples and the comparative examples in Table 2, the tensile strength (MPa), elongation (%) and thermal conductivity coefficient (W / (m·K)) of the aluminum plate are greatly reduced after deleting 1.0% Mg and 3.5% Si in the formula.

[0106] In summary, the tensile strength (MPa), elongation (%) and thermal conductivity coefficient (W / (m·K)) of the aluminum plate prepared by the preparation process are the best.

[0107] In the above description of the present specification, unless otherwise explicitly specified or limited, the terms "fixed", "mounted", "connected" or "connected" and the like should be understood in a broad sense. For example, as to the term "connected", it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the internal connection of two elements or the interaction relationship between two elements. Therefore, unless otherwise explicitly specified in the present specification, those skilled in the art can understand the specific meaning of the above-mentioned terms in the present application according to the specific circumstances.

[0108] According to the above description of the present specification, those skilled in the art can also understand that the terms used such as "upper", "lower", "front", "back", "left", "right", "length", "width", "thickness", "depth", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", "center", "longitudinal", "transverse", "clockwise" or "counterclockwise" and other terms indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings of the present specification, and are only for the purpose of facilitating the description of the technical solutions of the present application and simplifying the description, and are not explicitly or implicitly indicating that the devices or elements involved must have the described specific orientation, be constructed in a specific orientation, or be operated, Therefore, the above orientation or positional relationship terms cannot be understood or interpreted as a limitation on the technical solutions of the present application.

[0109] The preferred embodiments of the present application are described above. It should be understood that the present application is not limited to the specific embodiments described above, and that the devices and structures not fully described should be understood to be implemented in the ordinary way in the art; any person skilled in the art can make many possible changes, modifications or modifications to the technical solutions of the present application using the disclosed methods and technical content without departing from the scope of the technical solutions of the present application, which does not affect the essential content of the present application. Therefore, any simple modification, equivalent change and modification of the above embodiments made in accordance with the technical essence of the present application without departing from the content of the technical solutions of the present application, all still belong to the scope of protection of the technical solutions of the present application.

Claims

1. A composite housing applied to a display module, characterized in that: The composite shell comprises a heat dissipation aluminum plate and a plastic shell. A plurality of honeycomb-shaped protrusions are arranged on the end surface of the heat dissipation aluminum plate in the thickness direction of the heat dissipation aluminum plate. The plurality of protrusions are arranged on the upper surface of the heat dissipation aluminum plate at intervals. The plastic shell covers the periphery of the heat dissipation aluminum plate and extends to the surface of the heat dissipation aluminum plate in the length direction of the heat dissipation aluminum plate. The plastic shell on the upper surface of the heat dissipation aluminum plate is arranged between any two adjacent protrusions and forms a honeycomb-shaped support portion with a size matching the protrusions around the protrusions. The height of the support portion is greater than the height of the protrusions. The plastic shell on the lower surface of the heat dissipation aluminum plate is arranged between any two adjacent protrusions and forms a heat dissipation cavity with the bottom surface of the protrusions. When the composite shell is installed and used, the protrusions of the heat dissipation aluminum plate are exposed to the air. A heat-conducting silica gel layer is filled on the upper surface of the heat dissipation aluminum plate. The bottom of the heat-conducting silica gel layer covers the connection between the heat dissipation aluminum plate and the plastic shell to improve the sealing performance of the connection.

2. The composite case according to claim 1, wherein: A round hole is formed in the heat dissipation aluminum plate. The plastic shell comprises an upper layer of plastic and a lower layer of plastic. The upper layer of plastic is arranged on the upper surface of the heat dissipation aluminum plate. The lower layer of plastic is arranged on the lower surface of the upper layer of plastic. The upper layer of plastic is integrally formed between the round hole of the heat dissipation aluminum plate and the lower layer of plastic.

3. The composite case according to claim 2, wherein: Positioning holes are formed in the heat dissipation aluminum plate for facilitating injection molding of the heat dissipation aluminum plate and the plastic shell.

4. The composite case according to any one of claims 1 to 3, wherein: PCB mounting holes are arranged on the plastic shell on the upper surface of the heat dissipation aluminum plate for connecting a PCB. Clamping grooves are arranged on the plastic shell on the upper surface of the heat dissipation aluminum plate for connecting external electronic components.

5. A display module, comprising a PCB, an IC control chip, an LED lamp, and the composite shell according to any one of claims 1-4. The PCB is arranged on the composite shell. The LED lamp is arranged on the upper surface of the PCB. The IC control chip is arranged on the lower surface of the PCB and opposite to the protrusions of the heat dissipation aluminum plate. wherein The height of the heat-conducting silica gel is higher than the protrusion plane W of the aluminum plate. The thickness of the IC control chip is X. The height of the protrusions is Y. The height of the support portion is Z. The thickness X of the IC control chip and the height Z of the support portion satisfy the following relationship: 0mm < Z-(W+X+Y) < 0.1mm.

6. The display module of claim 5, wherein: A waterproof layer is arranged on the upper surface of the PCB.

7. A method of manufacturing a display module as claimed in any one of claims 5-6, characterized in that: The method comprises the following steps: (1) Preparation of the heat dissipation aluminum plate: place the prepared aluminum plate in a precision hardware mold and use an intelligent stamping device to form honeycomb-shaped protrusions on the surface of the aluminum plate at intervals to obtain the heat dissipation aluminum plate. Ensure that the distance between the protrusions of the aluminum plate and the IC control chip is within 0.1mm during installation. (2) injection molding of the plastic shell: the heat dissipation aluminum plate prepared in step (1) is placed in the mold of an injection molding machine, plastic particle raw materials are then added to the injection molding machine, and finally the injection molding machine is started to form a plastic shell around the periphery of the heat dissipation aluminum plate and the convex portion by injection molding on the upper and lower end surfaces of the periphery and the convex portion, thereby obtaining a composite shell; the positioning hole on the heat dissipation aluminum plate can be clamped on the positioning column inside the mold of the injection molding machine to accurately position the aluminum plate and ensure the accuracy of the integral injection molding; (3) filling of the heat-conducting silica gel: the composite shell prepared in step (2) is kept in a horizontal balanced state, the height of the honeycomb-shaped convex structure is used to control the thickness of the heat-conducting silica gel, and the height of the heat-conducting silica gel is 0.5-1.0 mm higher than the convex plane of the aluminum plate; (4) assembly of the PCB: the LED lamp and the IC control chip are welded on the front and back surfaces of the PCB to obtain a PCB containing the LED lamp and the IC control chip; (5) assembly of the display module: the LED lamp on the front surface of the PCB lamp is shielded by a jig, three-proof paint is applied on the back surface of the PCB lamp, and the PCB prepared in step (4) is fixed and connected to the composite shell through the mounting hole in the PCB by a bolt before the heat-conducting silica gel starts to solidify, wherein the screwing force of the bolt is less than 0.1 N; (6) filling of the waterproof glue: the display module assembled in step (5) is kept in a horizontal balanced state, and waterproof glue is injected to a standard height on the front surface of the PCB; the waterproof glue is waterproof AB glue; the AB glue comprises epoxy resin and a coagulant; the coagulant comprises at least one of ethylenediamine, diethylenetriamine, triethylenetriamine, phenylenediamine, and m-phenylenediamine; (7) installation of the face mask: after the waterproof glue in step (6) is coagulated for 5-7 hours, an outer face mask is installed to obtain a complete display module; (8) finished product inspection: the display module obtained in step (7) is subjected to data inspection, and if the product meets the standard, it is packed and stored, otherwise, it is reconditioned.

8. The method of claim 7, wherein the display module is manufactured by: The preparation of the aluminum plate in step (1) comprises the following sub-steps: ​ (11) raw material selection: the raw materials are prepared according to the following mass percentages: 1.0-1.5% Mg, 3.5-4.0% Si, 0.3-0.5% Cu, 0.4-1.0% Fe, 0.05-0.20% Mn, 0.20-0.30% Li, 0.2-0.3% Zn, 0.08-0.12% Cr, 0.04-0.05 Ce, 0.01-0.02 Ti, and the balance being Al and unavoidable impurities; (12) pretreatment: the raw materials are preheated at 100-200°C for 10-15 min; (13) melting: the raw materials pretreated in step (12) are placed in a melting furnace to obtain a melt mixture, 0.5-1.0% of a deslagging agent and a refining agent based on the mass of the melt are added, the refining is performed for 10-20 min, the dross is removed, and then the aluminum alloy ingot is obtained by standing for 20-30 min. (14) Hot rolling: the aluminum alloy ingot prepared in step (13) is kept at 520 DEG C for 1.5-2 hours, the temperature is reduced to 400-420 DEG C during the time interval, and then the ingot is discharged and rolled into an aluminum plate.

9. The method of claim 7, wherein: the display module is a liquid crystal display module. The heat-conducting silica gel in the step (3) comprises a high polymer silicone oil and a heat-conducting filler; the heat-conducting filler comprises at least one of alumina, magnesia, boron nitride, aluminum nitride, beryllia, and quartz.

10. An electronic device, comprising: The electronic device comprises the display module of any one of claims 3-6 or the display module prepared by the manufacturing method of any one of claims 7-9.

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