Anti-shake assembly, manufacturing method thereof and camera module

Abstract

The application provides an anti-shake assembly, which comprises a circuit board, a photosensitive chip and a magnetic part. The circuit board comprises a first hard plate, a second hard plate, a plurality of connecting pieces and a plurality of coils. The first hard plate is provided with a containing space, the second hard plate is movably contained in the containing space, the connecting pieces are flexibly connected between the first hard plate and the second hard plate, the photosensitive chip and the coils are arranged on the second hard plate, and the magnetic part comprises a base and a plurality of magnets. The base comprises a main plate and a side plate, the side plate is arranged around the periphery of the main plate to form a containing space, the magnets are arranged on the side of the main plate facing the containing space, and the magnets are oppositely arranged with the coils. In addition, the application also provides a manufacturing method of the anti-shake assembly and a camera module.

Description

TECHNICAL FIELD

[0001] The present application relates to an anti-shake assembly and a manufacturing method thereof, and a camera module. BACKGROUND

[0002] Generally, a voice coil motor needs to be arranged in the camera module to realize the anti-shake function of the camera module by timely adjusting the posture of the optical lens, while the image sensor in the camera module is fixed.

[0003] However, with the development of the differentiation of the shooting function, electronic products such as mobile phones need to be arranged with more and more optical lenses, and thus a voice coil motor with more power is needed to adjust the postures of multiple optical lenses, and the voice coil motor with large power often needs more coil windings and larger magnets, which is not conducive to the miniaturization requirement of the camera module. SUMMARY

[0004] To solve the above problems in the prior art, the present application provides an anti-shake assembly.

[0005] In addition, it is also necessary to provide a manufacturing method of the anti-shake assembly.

[0006] In addition, it is also necessary to provide a camera module with the above circuit board.

[0007] An anti-shake assembly, comprising a circuit board, a photosensitive chip and a magnetic piece, the circuit board comprising a first hard board, a second hard board, a plurality of connecting pieces and a plurality of coils, the first hard board being provided with a containing space, the second hard board being movably contained in the containing space, the connecting pieces being flexibly connected between the first hard board and the second hard board, the photosensitive chip and the coils being arranged on the second hard board, the magnetic piece comprising a base and a plurality of magnets, the base comprising a main plate and a side plate, the side plate being arranged around the periphery of the main plate to form a receiving space, the magnets being arranged on the side of the main plate facing the receiving space, and the magnets being oppositely arranged with the coils.

[0008] Further, the anti-shake assembly further comprises a gyroscope and a control chip, the gyroscope being arranged on the second hard board, the control chip being arranged on the first hard board or the second hard board, the gyroscope being electrically connected with the control chip, the control chip being electrically connected with the coils, the gyroscope being used for sensing the posture information of the photosensitive chip, and the control chip being used for controlling the energization state of the coils according to the posture information.

[0009] Further, the containing space penetrates through the second hard board, and the anti-shake assembly further comprises a reinforcing plate and a plurality of balls, the reinforcing plate being arranged away from the side of the second hard board facing away from the photosensitive chip, and the balls being rollably arranged between the reinforcing plate and the second hard board.

[0010] Further, the reinforcing plate is recessed to form a plurality of first accommodating grooves, and part of the balls are rollably arranged in the first accommodating grooves.

[0011] Further, the accommodating space does not penetrate the second hard plate, and the anti-shake assembly further comprises a plurality of balls, which are rollably arranged between the bottom of the accommodating space and the second hard plate.

[0012] Further, the bottom of the second accommodating space is recessed to form a plurality of second accommodating grooves, part of the balls are rollably accommodated in the second accommodating grooves, and the side of the second hard plate facing the balls is recessed to form a first limiting groove, and the other part of the balls are movably accommodated in the first limiting groove.

[0013] Further, the side of the second hard plate facing the balls is recessed to form a plurality of third accommodating grooves, part of the balls are rollably accommodated in the third accommodating grooves, and the bottom of the second accommodating space is recessed to form a second limiting groove, and the other part of the balls are movably accommodated in the second limiting groove.

[0014] Further, the second hard plate is recessed to form the first limiting groove, the bottom of the second accommodating space is recessed to form the second limiting groove, at least part of the first limiting groove and the second limiting groove are arranged opposite to each other, part of the balls are accommodated in the first limiting groove, and the other part of the balls are accommodated in the second limiting groove.

[0015] Further, the connecting member comprises a soft plate or a wire.

[0016] Further, the photosensitive chip is arranged at the center region of the second hard plate, and a plurality of the coils are arranged around the photosensitive chip.

[0017] A camera module comprises a lens assembly, a filter and an anti-shake assembly as described above, the main plate is provided with a light passing hole, the filter is arranged on the light passing hole, the lens assembly is arranged on one side of the main plate, the lens assembly is arranged corresponding to the light passing hole, and the photosensitive chip is arranged corresponding to the light passing hole.

[0018] A manufacturing method of an anti-shake assembly, comprising the steps of: providing a circuit board, the circuit board comprising a first hard plate, a second hard plate, a plurality of connecting members and a plurality of coils, the first hard plate being provided with a receiving space, the second hard plate being received in the receiving space, the connecting members being flexibly connected between the first hard plate and the second hard plate, and the coils being arranged on the second hard plate; arranging a photosensitive chip on the second hard plate, and arranging a magnetic member on the circuit board, the magnetic member comprising a base and a plurality of magnets, the base comprising a main plate and a side plate, the side plate being arranged around the periphery of the main plate to form a receiving space, and the magnets being arranged on a side of the main plate facing the receiving space, and the magnets being oppositely arranged with the coils.

[0019] Further, the manufacturing method of the circuit board comprises: providing an inner soft plate, the inner soft plate comprising a core plate and a cover film arranged on opposite sides of the core plate, the core plate comprising a dielectric layer and an inner circuit layer arranged on opposite sides of the dielectric layer, and the cover film comprising an adhesive layer and a cover layer, the adhesive layer being arranged between the inner circuit layer and the cover layer; wherein, along the thickness direction of the inner soft plate, the inner soft plate is divided into a first region, a second region and a connecting region, the first region being arranged at the periphery of the second region, and the connecting region connecting the first region and the second region; arranging an outer hard plate on the inner soft plate, the outer hard plate comprising a base material layer, an outer circuit layer, a plurality of coils and a solder mask layer, the base material layer being arranged between the outer circuit layer and the cover layer, the coils being arranged on a side of the outer circuit layer away from the base material layer, and the solder mask layer covering the outer circuit layer; removing the outer hard plate corresponding to the connecting region, exposing part of the inner soft plate in the connecting region, forming the first hard plate by the inner soft plate corresponding to the first region and the outer hard plate corresponding to the first region, forming the second hard plate by the inner soft plate corresponding to the second region and the outer hard plate corresponding to the second region, and cutting the inner soft plate exposed in the connecting region to form a plurality of connecting soft plates, thereby obtaining the circuit board.

[0020] Further, the manufacturing method further comprises the steps of: arranging a release film on the cover film corresponding to the connecting region, and peeling off the release film to remove the outer hard plate corresponding to the connecting region.

[0021] The anti-shake assembly provided by the present application can flexibly connect the second hard plate to the first hard plate through a plurality of connecting soft plates, the coils can generate Lorentz force in a magnetic field to drive the second hard plate to move, thereby adjusting the posture of the photosensitive chip to realize the anti-shake function, so that a large-size voice coil motor is not needed to adjust the posture of the lens assembly, and the size of the camera module can be reduced. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 A schematic diagram of a copper clad substrate provided for the first embodiment of the present application.

[0023] Figure 2 A schematic diagram of an inner soft plate provided for the first embodiment of the present application.

[0024] Figure 3 A schematic diagram of an inner soft plate provided for the first embodiment of the present application. Figure 2 A schematic diagram of the inner soft plate provided for the first embodiment of the present application.

[0025] Figure 4 A schematic diagram of a second intermediate body provided for the first embodiment of the present application.

[0026] Figure 5 A schematic diagram of a second intermediate body provided for the first embodiment of the present application. Figure 4 A schematic diagram of the second intermediate body provided for the first embodiment of the present application.

[0027] Figure 6 A schematic diagram of the second intermediate body provided for the first embodiment of the present application. Figure 5 A schematic diagram of the second intermediate body provided for the first embodiment of the present application.

[0028] Figure 7 A schematic diagram of the second intermediate body provided for the first embodiment of the present application. Figure 6 A schematic diagram of the second intermediate body provided for the first embodiment of the present application.

[0029] Figure 8 A schematic diagram of the second intermediate body provided for the first embodiment of the present application. Figure 7 A schematic diagram of the second intermediate body provided for the first embodiment of the present application.

[0030] Figure 9 A schematic diagram of the second intermediate body provided for the first embodiment of the present application. Figure 8 A top view of the second intermediate body provided for the first embodiment of the present application.

[0031] Figure 10 A schematic diagram of a circuit board provided for the first embodiment of the present application.

[0032] Figure 11 A schematic diagram of a circuit board provided for the first embodiment of the present application. Figure 10 A cross-sectional view of the circuit board provided for the first embodiment of the present application.

[0033] Figure 12 A schematic diagram of an anti-shake assembly provided for the first embodiment of the present application.

[0034] Figure 13 A schematic diagram of a camera module provided for the first embodiment of the present application.

[0035] Figure 14 A schematic diagram of an anti-shake assembly provided for the second embodiment of the present application.

[0036] Figure 15 A schematic diagram of a camera module provided for the second embodiment of the present application.

[0037] Figure 16A schematic view of the anti-shake assembly provided by the third embodiment of the present application.

[0038] Figure 17 A schematic view of the anti-shake assembly provided by the fourth embodiment of the present application.

[0039] Figure 18 A schematic view of the inner side substrate provided by the second embodiment of the present application.

[0040] Figure 19 A schematic view of the inner side substrate provided by the second embodiment of the present application. Figure 18 A schematic view of the inner side substrate provided by the second embodiment of the present application.

[0041] Figure 20 A schematic view of the third hard plate provided by the second embodiment of the present application.

[0042] Figure 21 A schematic view of the third hard plate provided by the second embodiment of the present application. Figure 20 A schematic view of the third hard plate provided by the second embodiment of the present application.

[0043] Figure 22 A schematic view of the third hard plate provided by the second embodiment of the present application. Figure 21 A schematic view of the third hard plate provided by the second embodiment of the present application.

[0044] Figure 23 A schematic view of the third hard plate provided by the second embodiment of the present application. Figure 22 A schematic view of the third hard plate provided by the second embodiment of the present application.

[0045] A schematic view of the third hard plate provided by the second embodiment of the present application. Figure 24 Figure 23 A schematic view of the third hard plate provided by the second embodiment of the present application.

[0046] Main element symbol explanation

[0047] Anti-shake assembly 10, 50 Second inner side circuit layer 242

[0048] Circuit board 1 Adhesive layer 25

[0049] First hard plate 11 First adhesive layer 251

[0050] First accommodating space 111 Second adhesive layer 252

[0051] Second hard plate 12 Cover layer 26

[0052] Soft plate 13 First cover layer 261

[0053] First end 131 Second cover layer 262

[0054] Second end 132 Release film 27

[0055] Coil 14 Copper clad substrate 33

[0056] Third hard plate 15 First substrate layer 611

[0057] Inner side substrate 151 Second outer side substrate 153

[0058] First outer side substrate 152 Second substrate layer 612

[0059] Dielectric layer 154 First conductive body 331

[0060] First inner conductive circuit layer 155 Solder resist layer 63

[0061] Second inner conductive circuit layer 156 First solder resist layer 631

[0062] Fourth adhesive layer 157 Second solder resist layer 632

[0063] Third adhesive layer 158 Third copper foil layer 351

[0064] Photosensitive chip 2 Fourth copper foil layer 352

[0065] Magnetic member 3 First opening 36

[0066] Base 31 Second opening 361

[0067] Magnet 32 Third opening 362

[0068] Main plate 311 First electroplated layer 371

[0069] Side plate 312 Second electroplated layer 372

[0070] Light passing hole 313 Second conductive body 381

[0071] Camera module 500, 600 Third conductive body 382

[0072] Lens assembly 501 Second intermediate body 40

[0073] Filter 502 First copper foil layer 34

[0074] Second accommodating space 16 Second copper foil layer 35

[0075] Second accommodating groove 161 Outer side hard plate 60

[0076] First limiting groove 162 First outer side hard plate 601

[0077] Third accommodating groove 163 Second outer side hard plate 602

[0078] Second limiting groove 164 Substrate layer 61

[0079] inner groove 17 outer side circuit layer 64

[0080] reinforcing plate 6 first outer side circuit layer 641

[0081] first accommodating groove 62 central area A

[0082] ball 7 edge area B

[0083] inner soft plate 20 accommodation space C

[0084] core plate 201 first area F

[0085] cover film 22 second area S

[0086] dielectric layer 23 connecting area L

[0087] inner circuit layer 24 second outer side circuit layer 642

[0088] first inner circuit layer 241 thickness D1, D2

[0089] thickness d1, d2 metal wire M

[0090] The following detailed description will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0091] The technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all.

[0092] It should be noted that when an element is referred to as being "fixed" to another element, it can be directly on the other element or there can be an intervening element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or there can be an intervening element. When an element is referred to as being "disposed" on another element, it can be directly disposed on the other element or there can be an intervening element.

[0093] Please refer to Figure 12The first embodiment of the present application provides an anti-shake assembly 10, comprising a circuit board 1, a photosensitive chip 2 and a magnetic piece 3. The circuit board 1 comprises a first hard board 11, a second hard board 12, a plurality of soft boards 13 and a plurality of coils 14. The first hard board 11 is provided with a first accommodating space 111, the second hard board 12 is arranged in the first accommodating space 111, the soft board 13 is flexibly connected between the first hard board 11 and the second hard board 12, and the photosensitive chip 2 and the coil 14 are arranged on the second hard board 12. The magnetic piece 3 comprises a base 31 and a plurality of magnets 32, the base 31 comprises a main plate 311 and a side plate 312, the side plate 312 is arranged around the periphery of the main plate 311 to form a containing space C, and the magnets 32 are arranged on one side of the main plate 311 facing the containing space C. The second hard board 12 is contained in the containing space C, and the magnets 32 correspond to the coils 14 one by one.

[0094] In specific work, when the photosensitive chip 2 is in a normal posture (wherein the normal posture means that the photosensitive chip 2 directly faces a lens assembly 501), the second hard board 12 will energize all the coils 14, and each energized coil 14 will be subjected to a Lorentz force (not shown in the figure) in the magnetic field of the magnet 32. After a plurality of Lorentz forces jointly act on the coil 14, they are mutually cancelled, and the second hard board 12 is in a balanced and stationary state under the pulling of a plurality of soft boards 13. When the photosensitive chip 2 is in an inclined posture (wherein the inclined posture means that the photosensitive chip 2 is staggered with the lens assembly 501), the second hard board 12 will energize part of the coils 14, and part of the energized coils 14 will be subjected to unbalanced Lorentz forces in the magnetic field of the magnet 32. The unbalanced Lorentz forces can drive the second hard board 12 to move in the plane of the first hard board 11, so as to compensate for the inclined posture of the photosensitive chip 2, so that the photosensitive chip 2 is again in a normal posture.

[0095] The anti-shake assembly 10 provided by the present application can flexibly connect the second hard board 12 to the first hard board 11 through a plurality of soft boards 13, and the coil 14 can generate a Lorentz force in the magnetic field to drive the second hard board 12 to move in the plane of the first hard board 11, so as to adjust the posture of the photosensitive chip 2 and realize the anti-shake function, thereby eliminating the need for a large-size voice coil motor to adjust the posture of the lens assembly, and facilitating the reduction of the size of the camera module.

[0096] In the embodiment, the anti-shake assembly 10 further comprises a gyroscope (not shown in the figure) and a control chip (not shown in the figure), the gyroscope is arranged on the second hard plate 12, the control chip is arranged on the first hard plate 11 or the second hard plate 12, the gyroscope is electrically connected to the control chip, the control chip is electrically connected to the coil 14, the gyroscope is used for sensing the attitude information (for example, normal attitude or inclined attitude) of the photosensitive chip 2, and the control chip controls the energization state of the coil 14 according to the attitude information. The coil 14 in the energization state is subjected to the Lorentz force in the magnetic field, and the Lorentz force can adjust the position of the second hard plate 12, and then adjust the attitude of the photosensitive chip 2.

[0097] Please refer to Figure 11 In the embodiment, the second hard plate 12 is divided into a central region A and an edge region B surrounding the central region A, the photosensitive chip 2 is arranged on the central region A, and a plurality of coils 14 are symmetrically arranged on the edge region B.

[0098] Please refer to Figure 10 In the embodiment, the soft plate 13 is approximately in the shape of "S", the soft plate 13 has a restoring force resisting deformation, the soft plate 13 is symmetrically arranged on the periphery of the second hard plate 12, the soft plate 13 comprises a first end 131 and a second end 132 opposite to the first end 131, the first end 131 is electrically connected to the first hard plate 11, and the second end 132 is electrically connected to the second hard plate 12.

[0099] Please refer to Figure 12 In the embodiment, the anti-shake assembly 10 further comprises a reinforcing plate 6 and a plurality of balls 7, the reinforcing plate 6 is arranged away from one side of the second hard plate 12 facing away from the photosensitive chip 2, and the balls 7 are rollably arranged between the reinforcing plate 6 and the second hard plate 12, so that the second hard plate 12 can move in the plane of the reinforcing plate 6. The balls 7 are used for supporting part of the weight of the second hard plate 12, and meanwhile, reducing the friction between the second hard plate 12 and the reinforcing plate 6. Further, the reinforcing plate 6 is provided with a plurality of first accommodating grooves 62, and part of the balls 7 are rollably arranged in the first accommodating grooves 62.

[0100] Please refer to Figures 1 to 11 The first embodiment of the application further provides a manufacturing method of the anti-shake assembly 10, comprising the following steps:

[0101] S1: Please refer to Figures 9 to 10The application provides a circuit board 1, which comprises a first hard plate 11, a second hard plate 12, a plurality of soft plates 13 and a plurality of coils 14, the first hard plate 11 is provided with a first accommodating space 111, the second hard plate 12 is arranged in the first accommodating space 111, the soft plate 13 is flexibly connected between the first hard plate 11 and the second hard plate 12, and the coil 14 is arranged on the second hard plate 12.

[0102] Please refer to Figures 2 to 10 In the embodiment, the manufacturing method of the circuit board 1 comprises the following steps.

[0103] S10: Please refer to Figure 2 An inner soft plate 20 is provided, which comprises a core plate 201 and a cover film 22 arranged on opposite sides of the core plate 201, the core plate 201 comprises a dielectric layer 23 and inner circuit layers 24 arranged on opposite sides of the dielectric layer 23, the cover film 22 comprises an adhesive layer 25 and a cover layer 26, and the adhesive layer 25 is arranged between the inner circuit layer 24 and the cover layer 26. The material of the dielectric layer 23 and the cover layer 26 comprises polyimide or epoxy resin. Wherein, along the thickness direction D of the inner soft plate 20, the inner soft plate 20 is divided into a first area F, a second area S and a connecting area L, the first area F is arranged at the periphery of the second area S, and the connecting area L connects the first area F and the second area S.

[0104] In the embodiment, please refer to Figures 1 to 2 In step S10, the manufacturing method of the inner soft plate 20 comprises the following steps.

[0105] S101: Please refer to Figure 1 A copper-clad substrate 33 is provided, which comprises the dielectric layer 23, a first copper foil layer 34 and a second copper foil layer 35, and the first copper foil layer 34 and the second copper foil layer 35 are arranged on opposite sides of the dielectric layer 23.

[0106] S101: Please refer to Figure 2 A first opening 36 is arranged on the copper-clad substrate 33, the first opening 36 penetrates the second copper foil layer 35 and the dielectric layer 23, and the first copper foil layer 34 is exposed at the bottom of the first opening 36.

[0107] S102: Please refer to Figure 2 A first conductive body 331 is formed by electroplating in the first opening 36, and the first conductive body 331 electrically connects the first copper foil layer 34 and the second copper foil layer 35.

[0108] S103: Etching the first copper foil layer 34 to form a first inner side circuit layer 241, and etching the second copper foil layer 35 to form a second inner side circuit layer 242.

[0109] S104: A first adhesive layer 251 is arranged on the first inner side circuit layer 241, and a second adhesive layer 252 is arranged on the second inner side circuit layer 242.

[0110] S105: A first cover layer 261 is arranged on the first adhesive layer 251, and a second cover layer 262 is arranged on the second adhesive layer 252, to obtain the inner side soft board 20.

[0111] S11: Please refer to Figure 3 , a release film 27 is arranged on the cover film 22 corresponding to the connection area L.

[0112] S12: Please refer to Figure 4 and Figure 5 , an outer side hard board 60 is arranged on the inner side soft board 20, the outer side hard board 60 includes a substrate layer 61, an outer side circuit layer 64, a plurality of the coils 14, and an anti-welding layer 63, the substrate layer 61 is arranged between the outer side circuit layer 64 and the cover layer 26, the coils 14 (see Figure 5 ) are arranged on the side of the outer side circuit layer 64 away from the substrate layer 61, and the anti-welding layer 63 covers the outer side circuit layer 64.

[0113] In this embodiment, in step S12, the step of “arranging an outer side hard board 60 on the inner side soft board 20” includes:

[0114] S120: Please refer to Figure 4 , a first outer side hard board 601 is laminated on the first cover layer 261, and a second outer side hard board 602 is laminated on the second cover layer 262, to obtain a second intermediate body 40. The first outer side hard board 601 includes a first substrate layer 611 and a third copper foil layer 351 arranged on the first substrate layer 611, and the second outer side hard board 602 includes a second substrate layer 612 and a fourth copper foil layer 352 arranged on the second substrate layer 612. The thickness D1 of the third copper foil layer 351 or the thickness D2 of the fourth copper foil layer 352 is greater than the thickness d1 of the first copper foil layer 34 or the thickness d2 of the second copper foil layer 35 (see Figure 1 ).

[0115] S121: Please refer to Figure 5, a second opening 361 and a third opening 362 are formed in the second intermediate body 40, the second opening 361 penetrates the third copper foil layer 351, the first substrate layer 611, the first cover layer 261 and the first adhesive layer 251 in sequence, and the first inner side circuit layer 241 is exposed at the bottom of the second opening 361. The third opening 362 penetrates the fourth copper foil layer 352, the second substrate layer 612, the second cover layer 262 and the second adhesive layer 252 in sequence, and the second inner side circuit layer 242 is exposed at the bottom of the third opening 362.

[0116] S122: Please refer to Figure 5 , a first electroplated layer 371 is formed on the third copper foil layer 351 by electroplating, and a second electroplated layer 372 is formed on the fourth copper foil layer 352 by electroplating. Part of the first electroplated layer 371 fills the second opening 361 to form a second conductive body 381, and the second conductive body 381 is electrically connected to the third copper foil layer 351 and the first inner side circuit layer 241. Part of the second electroplated layer 372 fills the third opening 362 to form a third conductive body 382, and the third conductive body 382 is electrically connected to the fourth copper foil layer 352 and the second inner side circuit layer 242.

[0117] S123: Please refer to Figure 5 , the first electroplated layer 371 and the third copper foil layer 351 are etched to form a first outer side circuit layer 641, and the second electroplated layer 372 and the fourth copper foil layer 352 are etched to form a second outer side circuit layer 642.

[0118] S124: Please refer to Figure 6 , a plurality of coils 14 are arranged on the first outer side circuit layer 641.

[0119] S125: Please refer to Figure 6 , a first anti-welding layer 631 is arranged on the first outer side circuit layer 641, and a second anti-welding layer 632 is arranged on the second outer side circuit layer 642, thereby completing the arrangement of the outer hard plate 60 on the inner soft plate 20.

[0120] S13: Please refer to Figure 7 , the part of the outer hard plate 60 corresponding to the connection area L is removed, and part of the inner soft plate 20 is exposed at the connection area L. The part of the inner soft plate 20 corresponding to the first area F and the part of the outer hard plate 60 form the first hard plate 11, and the part of the inner soft plate 20 corresponding to the second area S and the part of the outer hard plate 60 form the second hard plate 12.

[0121] In this embodiment, please refer to Figure 7 and Figure 8In step S13, the step of "removing the outer hard plate 60 corresponding to the connection area L" includes the steps of:

[0122] S130: Please refer to Figure 7 laser cutting the first anti-weld layer 631, the first outer circuit layer 641 and the first substrate layer 611 corresponding to the connection area L, and laser cutting the second anti-weld layer 632, the second outer circuit layer 642 and the second substrate layer 612 corresponding to the connection area L.

[0123] S131: Please refer to Figure 8 and Figure 9 peeling off the release film 27 to remove the first anti-weld layer 631, the first outer circuit layer 641 and the first substrate layer 611 corresponding to the connection area L, and removing the second anti-weld layer 632, the second outer circuit layer 642 and the second substrate layer 612 corresponding to the connection area L.

[0124] S13: Please refer to Figure 10 laser cutting the inner soft plate 20 exposed in the connection area L to form a plurality of soft plates 13, thereby obtaining the circuit board 1.

[0125] S2: Please refer to Figure 11 disposing a photosensitive chip 2 on the second hard plate 12, and the photosensitive chip 2 is electrically connected to the second hard plate 12 through metal wires M.

[0126] S3: Please refer to Figure 12 containing the second hard plate 12 in the magnetic member 3, the coil 14 corresponding to the magnet 32, thereby obtaining the anti-shake assembly 10.

[0127] Please refer to Figure 13 The first embodiment of the present application further provides a camera module 500, which comprises a lens assembly 501, a filter 502 and the anti-shake assembly 10 arranged in sequence, a light transmission hole 313 is disposed through the main plate 311, and the filter 502 is arranged on the light transmission hole 313. The lens assembly 501 is arranged on the main plate 311, the lens assembly 501 is arranged opposite to the light transmission hole 313, and the photosensitive chip 2 is arranged opposite to the light transmission hole 313.

[0128] Please refer to Figure 14In the second embodiment of the present application, a third hard plate 15 is provided instead of the first hard plate 11 in the anti-shake assembly 10. The third hard plate 15 is provided with a second accommodating space 16 which does not penetrate the third hard plate 15. The second hard plate 12 is movably accommodated in the second accommodating space 16. The second hard plate 12 and the third hard plate 15 are flexibly connected by the connecting wire 8.

[0129] In the second embodiment of the present application, a third hard plate 15 is provided instead of the first hard plate 11 in the anti-shake assembly 10. The third hard plate 15 is provided with a second accommodating space 16 which does not penetrate the third hard plate 15. The second hard plate 12 is movably accommodated in the second accommodating space 16. The second hard plate 12 and the third hard plate 15 are flexibly connected by the connecting wire 8. Figure 14 In the second embodiment of the present application, a third hard plate 15 is provided instead of the first hard plate 11 in the anti-shake assembly 10. The third hard plate 15 is provided with a second accommodating space 16 which does not penetrate the third hard plate 15. The second hard plate 12 is movably accommodated in the second accommodating space 16. The second hard plate 12 and the third hard plate 15 are flexibly connected by the connecting wire 8.

[0130] In the second embodiment of the present application, a third hard plate 15 is provided instead of the first hard plate 11 in the anti-shake assembly 10. The third hard plate 15 is provided with a second accommodating space 16 which does not penetrate the third hard plate 15. The second hard plate 12 is movably accommodated in the second accommodating space 16. The second hard plate 12 and the third hard plate 15 are flexibly connected by the connecting wire 8. Figure 14 In the second embodiment of the present application, a third hard plate 15 is provided instead of the first hard plate 11 in the anti-shake assembly 10. The third hard plate 15 is provided with a second accommodating space 16 which does not penetrate the third hard plate 15. The second hard plate 12 is movably accommodated in the second accommodating space 16. The second hard plate 12 and the third hard plate 15 are flexibly connected by the connecting wire 8.

[0131] In the second embodiment of the present application, a third hard plate 15 is provided instead of the first hard plate 11 in the anti-shake assembly 10. The third hard plate 15 is provided with a second accommodating space 16 which does not penetrate the third hard plate 15. The second hard plate 12 is movably accommodated in the second accommodating space 16. The second hard plate 12 and the third hard plate 15 are flexibly connected by the connecting wire 8. Figure 15 In the second embodiment of the present application, a third hard plate 15 is provided instead of the first hard plate 11 in the anti-shake assembly 10. The third hard plate 15 is provided with a second accommodating space 16 which does not penetrate the third hard plate 15. The second hard plate 12 is movably accommodated in the second accommodating space 16. The second hard plate 12 and the third hard plate 15 are flexibly connected by the connecting wire 8.

[0132] In the third embodiment of the present application, a third hard plate 15 is provided instead of the first hard plate 11 in the anti-shake assembly 10. The third hard plate 15 is provided with a second accommodating space 16 which does not penetrate the third hard plate 15. The second hard plate 12 is movably accommodated in the second accommodating space 16. The second hard plate 12 and the third hard plate 15 are flexibly connected by the connecting wire 8. Figure 16 In the third embodiment of the present application, a third hard plate 15 is provided instead of the first hard plate 11 in the anti-shake assembly 10. The third hard plate 15 is provided with a second accommodating space 16 which does not penetrate the third hard plate 15. The second hard plate 12 is movably accommodated in the second accommodating space 16. The second hard plate 12 and the third hard plate 15 are flexibly connected by the connecting wire 8.

[0133] In the fourth embodiment of the present application, please refer to Figure 17 The difference between the first embodiment is that the second hard plate 12 is recessed to form the first limiting groove 162, the bottom of the second accommodating space 16 is recessed to form the second limiting groove 164, at least part of the first limiting groove 162 is arranged opposite to the second limiting groove 164, part of the ball 7 is accommodated in the first limiting groove 162, and another part of the ball is accommodated in the second limiting groove 164.

[0134] Please refer to Figures 18 to 24 The second embodiment of the present application also provides a manufacturing method of the anti-shake assembly 50, comprising the steps of:

[0135] S4: please refer to Figure 20 A third hard plate 15 is provided, the third hard plate 15 comprises an inner base plate 151, a first outer base plate 152 and a second outer base plate 153, the first outer base plate 152 and the second outer base plate 153 are arranged on opposite sides of the inner base plate 151, the inner base plate 151 comprises a dielectric layer 154, a first inner conductor layer 155 and a second inner conductor layer 156, the first inner conductor layer 155 and the second inner conductor layer 156 are arranged on opposite sides of the dielectric layer 154. The third hard plate 15 is provided with the second accommodating space 16, the second accommodating space 16 penetrates through the first outer base plate 152 and the first inner conductor layer 155, and the dielectric layer 154 is exposed at the bottom of the second accommodating space 16.

[0136] In the present embodiment, please refer to Figures 18 to 20 In step S4, the manufacturing method of the third hard plate 15 comprises:

[0137] S40: please refer to Figure 18 The inner base plate 151 is provided, the inner base plate 151 is provided with an inner recess 17, the inner recess 17 penetrates through the first inner conductor layer 155, and the dielectric layer 154 is exposed at the bottom of the inner recess 17.

[0138] S41: please refer to Figure 19 A third adhesive layer 158 is arranged on the first inner conductor layer 155, then the first outer base plate 152 is pressed on the third adhesive layer 158, and a fourth adhesive layer 157 is arranged on the second inner conductor layer 156, then the second outer base plate 153 is pressed on the fourth adhesive layer 157.

[0139] S42: please refer to Figure 20 The inner recess 17 is removed by laser cutting to form the second accommodating space 16, and the third hard plate 15 is obtained.

[0140] S5: Please refer to Figure 21 and Figure 22 , the second accommodating groove 161 is formed on the exposed part of the dielectric layer 154 at the bottom of the second accommodating space 16 by mechanical drilling, and the ball 7 is arranged in the second accommodating groove 161.

[0141] S6: Please refer to Figure 23 and Figure 24 , the second hard plate 12 is arranged on the ball 7, and the third hard plate 15 and the second hard plate 12 are electrically connected through the connecting wire 8.

[0142] S7: Please refer to Figure 14 , the second hard plate 12 and the third hard plate 15 are accommodated in the magnetic piece 3, the coil 14 corresponds to the magnet 32, and the anti-shake assembly 50 is obtained.

[0143] The above description is only one optimized specific embodiment of the present application, but in the actual application process, it cannot be limited to this embodiment. Other modifications and changes made by those skilled in the art according to the technical concept of the present application should belong to the protection scope of the present application.

Claims

1. An anti-shake assembly, characterized in that, The anti-shake assembly comprises a circuit board, a photosensitive chip and a magnetic member, the circuit board comprises a first hard plate, a second hard plate, a plurality of connecting members and a plurality of coils, the first hard plate is provided with a containing space, the second hard plate is movably contained in the containing space, the connecting member is flexibly connected between the first hard plate and the second hard plate, the photosensitive chip and the coil are arranged on the surface of the second hard plate, and the magnetic member comprises a base and a plurality of magnets. The circuit board further comprises a third hard plate, the containing space further comprises a second containing space, the third hard plate is provided with the second containing space, the second containing space does not penetrate through the third hard plate, and the anti-shake assembly further comprises a plurality of balls.

2. The anti-shake assembly of claim 1, wherein, The anti-shake assembly further comprises a gyroscope and a control chip, the gyroscope is arranged on the second hard plate, the control chip is arranged on the first hard plate or the second hard plate, the gyroscope is electrically connected with the control chip, the control chip is electrically connected with the coil, the gyroscope is used for sensing attitude information of the photosensitive chip, and the control chip is used for controlling the second hard plate to be powered to all the coils or part of the coils according to the attitude information.

3. The anti-shake assembly of claim 1, wherein, The bottom of the second containing space is recessed to form a plurality of second containing grooves, part of the balls are movably contained in the second containing grooves, and one side of the second hard plate facing the balls is recessed to form a first limiting groove, and another part of the balls are movably contained in the first limiting groove.

4. The anti-shake assembly of claim 3, wherein, The second hard plate is recessed to form a plurality of third containing grooves, part of the balls are movably contained in the third containing grooves, and the bottom of the second containing space is recessed to form a second limiting groove, and another part of the balls are movably contained in the second limiting groove.

5. The anti-shake assembly of claim 4, wherein, The second hard plate is recessed to form the first limiting groove, the bottom of the second containing groove is recessed to form the second limiting groove, at least part of the first limiting groove and the second limiting groove are oppositely arranged, part of the balls are contained in the first limiting groove, and another part of the balls are contained in the second limiting groove.

6. The anti-shake assembly of claim 1, wherein, The connecting member comprises a soft plate or a wire.

7. The anti-shake assembly of claim 1, wherein, The photosensitive chip is arranged in the central region of the second hard plate, and a plurality of the coils are arranged around the photosensitive chip.

8. A camera module, characterized by, The anti-shake assembly comprises a lens assembly, a filter and the anti-shake assembly according to any one of claims 1 to 7, the main plate is provided with a light passing hole, the filter is arranged on the light passing hole, the lens assembly is arranged on one side of the main plate, the lens assembly is arranged corresponding to the light passing hole, and the photosensitive chip is arranged corresponding to the light passing hole.

9. A method of manufacturing an anti-shake assembly, characterized by: The anti-shake assembly comprises the following steps: Provided is a circuit board, comprising a first hard plate, a second hard plate, a plurality of connecting pieces, and a plurality of coils, the first hard plate is provided with a receiving space, the second hard plate is received in the receiving space, the connecting pieces are flexibly connected between the first hard plate and the second hard plate, and the coils are arranged on the second hard plate; a photosensitive chip is arranged on the second hard plate; and a magnetic piece is arranged on the circuit board, the magnetic piece comprises a base and a plurality of magnets, the base comprises a main plate and a side plate, the side plate is arranged around the periphery of the main plate to form a receiving space, the magnets are arranged on one side of the main plate facing the receiving space, and the magnets are arranged opposite the coils; wherein the manufacturing method of the circuit board comprises: providing an inner soft plate, the inner soft plate comprises a core plate and a cover film arranged on opposite sides of the core plate, the core plate comprises a dielectric layer and an inner circuit layer arranged on opposite sides of the dielectric layer, the cover film comprises an adhesive layer and a cover layer, and the adhesive layer is arranged between the inner circuit layer and the cover layer; wherein, along the thickness direction of the inner soft plate, the inner soft plate is divided into a first region, a second region, and a connecting region, the first region is arranged at the periphery of the second region, and the connecting region connects the first region and the second region; an outer hard plate is arranged on the inner soft plate, the outer hard plate comprises a base material layer, an outer circuit layer, a plurality of coils, and a solder mask layer, the base material layer is arranged between the outer circuit layer and the cover layer, the coils are arranged on one side of the outer circuit layer away from the base material layer, and the solder mask layer covers the outer circuit layer; the outer hard plate corresponding to the connecting region is removed, part of the inner soft plate is exposed in the connecting region, the inner soft plate corresponding to the first region and part of the outer hard plate form the first hard plate, and the inner soft plate corresponding to the second region and part of the outer hard plate form the second hard plate; and the part of the inner soft plate exposed in the connecting region is cut to form a plurality of connecting soft plates, and the circuit board is obtained.

10. The production method according to claim 9, wherein Further comprising: a release film is arranged on the cover film corresponding to the connecting region; and the release film is peeled off to remove the outer hard plate corresponding to the connecting region.

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