A rotating platform and system for semiconductor laser equipment

Abstract

The present invention relates to a rotating platform and system for semiconductor laser equipment, wherein a table top, a driving component, a bearing component, an encoder component and a base are arranged in sequence from top to bottom along a vertical direction, and the central axes of the table top, the driving component, the bearing component, the encoder component and the base coincide with each other; by arranging the table top, the driving component, the bearing component, the encoder component and the base in sequence from top to bottom on the same central axis, the coaxiality requirements of the driving component, the bearing component and the encoder component are ensured, and a first driving unit is arranged inside a bearing body in a nested manner, and an outer ring adapter is used to connect the encoder, the bearing body, the table top and the first driving unit into a whole, thereby realizing the precise rotation function of the rotating platform, while not occupying too much space, and meeting the requirements of semiconductor laser equipment for a small and precise rotating platform.

Description

Technical Field

[0001] The present application relates to the field of laser equipment, and in particular to a rotating platform and system for semiconductor laser equipment. Background Art

[0002] With the development of science and technology, semiconductor laser equipment is used in various fields. Semiconductor laser equipment uses semiconductor lasers, has high-speed modulated laser output, high efficiency and high stability, and is matched with precise and stable mechanical mechanisms to achieve its high-speed rotation and high-precision technical requirements. In addition, the demand for miniaturization of equipment is becoming increasingly strong. While ensuring normal operation, the lightweight design of structural parts is achieved. Therefore, the development of small precision rotating platforms is particularly important.

[0003] Existing precision rotating platforms occupy a large space and are heavy. They use motors, encoders, bearings, etc. to be installed vertically on the shaft in sequence to ensure that the rotation axes of the three are consistent, but the overall height is relatively large. In addition, the wiring method uses conductive rings to prevent the wiring harness from being entangled during rotation, which also increases the size and weight of the rotating platform. Summary of the invention

[0004] In view of the above problems, the present application provides a rotating platform and system for semiconductor laser equipment, which solves the problem that the rotating platform occupies a large space.

[0005] To achieve the above-mentioned object, in a first aspect, the present invention provides a rotating platform for a semiconductor laser device, wherein a table, a driving assembly, a bearing assembly, an encoder assembly and a base are arranged in sequence from top to bottom along a vertical direction, and the central axes of the table, the driving assembly, the bearing assembly, the encoder assembly and the base coincide with each other;

[0006] The bearing assembly includes an outer ring adapter, an inner ring adapter and a bearing body. The outer ring adapter, the bearing body and the inner ring adapter are connected in sequence from top to bottom along the axial direction of the central axis. The outer ring adapter is also connected to the table top, and the inner ring adapter is arranged on the base; the drive assembly includes a first drive unit, which is arranged inside the bearing body. The first drive unit is connected to the inner side wall of the outer ring adapter and is used to drive the bearing body to drive the table top to rotate; the encoder assembly includes an encoder, which is arranged below the bearing body. The outer ring adapter is also connected to the encoder, and the encoder is used to measure the rotation angle of the bearing body.

[0007] In some embodiments, a first protruding shaft is provided at the center of the base, and the encoder, the bearing body, and the first driving unit are all sleeved on the first protruding shaft.

[0008] In some embodiments, the drive assembly also includes a first adapter, a second adapter and a first base plate, the first adapter is connected to the output end of the first drive unit, and the first adapter is also connected to the inner wall of the outer ring adapter; the second adapter is connected to the fixed end of the first drive unit; the first base plate is connected to the second adapter, and the first base plate is also connected to the first protruding shaft for fixing the first drive unit.

[0009] In some embodiments, the first protruding shaft has a first channel in its axial direction, and the first driving unit is electrically connected to an external device via a first connecting line 25 , and the first connecting line 25 is disposed in the first channel.

[0010] In some embodiments, a first opening is provided at the center of the inner ring adapter, and the encoder passes through the first opening and is connected to the outer ring adapter; a second opening is also provided at the edge of the inner ring adapter, and the first opening and the second opening form a second channel. The encoder is electrically connected to an external device through a second connecting line, and the second connecting line is arranged in the second channel.

[0011] In some embodiments, the base includes a side wall and a third bottom plate, the side wall is vertically arranged at the edge of the third bottom plate, the rotating platform also includes a connector and a plug connector, the connector passes through the side wall and protrudes from the outer surface of the side wall, the wiring harness of the encoder is connected to the connector; the plug connector cooperates with the connector to transmit the electrical signal of the encoder.

[0012] In some embodiments, the sidewalls are made of aluminum-based silicon carbide.

[0013] In some embodiments, the encoder assembly further includes a third adapter and a second base plate, the third adapter is connected to the encoder; the second base plate is connected to the third connector, and the second base plate is also connected to the base for fixing the encoder.

[0014] In some embodiments, the outer ring adapter and / or the inner ring adapter are made by 3D printing, and the bearing body is an integrated bearing.

[0015] In a second aspect, this embodiment further provides a system for a semiconductor laser device, comprising a rotating platform and a semiconductor laser, wherein the rotating platform is the rotating platform described in the first aspect; the semiconductor laser is disposed on the rotating platform, and the rotating platform is used to adjust the laser output direction of the semiconductor laser.

[0016] Different from the prior art, the above technical solution arranges the table, drive assembly, bearing assembly, encoder assembly and base in sequence from top to bottom on the same central axis, thereby ensuring the coaxiality requirements of the drive assembly, bearing assembly and encoder assembly. At the same time, the first drive unit is arranged inside the bearing body in a nested manner, and the encoder, bearing body, table and first drive unit are connected into a whole using an outer ring adapter, thereby realizing the precise rotation function of the rotating platform without taking up too much space, thus meeting the requirements for a small and precise rotating platform in semiconductor laser equipment.

[0017] The above-mentioned records related to the invention content are only an overview of the technical solution of the present application. In order to enable ordinary technicians in the field to more clearly understand the technical solution of the present application, and then implement it according to the text of the specification and the contents recorded in the drawings, and to make the above-mentioned purpose and other purposes, features and advantages of the present application easier to understand, the following is an explanation in combination with the specific implementation mode and drawings of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawings are only used to illustrate the principles, implementation methods, applications, characteristics and effects of the specific embodiments of the present invention and other related contents, and shall not be considered as limiting the present application.

[0019] In the drawings of the specification:

[0020] Figure 1 It is a cross-sectional schematic diagram of a rotating platform for a semiconductor laser device according to a specific implementation method;

[0021] Figure 2 Another cross-sectional schematic diagram of a rotating platform for a semiconductor laser device according to a specific embodiment;

[0022] Figure 3 It is a schematic diagram of the connection between the first connecting line 25 and the second connecting line of the rotating platform for the semiconductor laser device described in the specific implementation manner.

[0023] The figure marks include: 1. table; 2. drive assembly; 21. first adapter; 22. second adapter; 23. first base plate; 24. first drive unit; 25. first connecting line 25; 3. bearing assembly; 31. outer ring adapter; 32. bearing body; 33. inner ring adapter; 4. encoder assembly; 41. encoder; 42. third adapter; 43. second base plate; 44. second connecting line; 5. base; 51. side wall; 52. third base plate; 53. first raised shaft; 6. connector; 7. plug connector. DETAILED DESCRIPTION

[0024] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the following description, the same modules are represented by the same reference numerals. In the case of the same reference numerals, their names and functions are also the same. Therefore, the detailed description thereof will not be repeated.

[0025] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and do not constitute a limitation of the present invention.

[0026] See also Figure 1 In the first aspect, the present embodiment provides a rotating platform for a semiconductor laser device, wherein a table 1, a driving assembly 2, a bearing assembly 3, an encoder assembly 4 and a base 5 are arranged in sequence from top to bottom along the vertical direction, and the central axes of the table 1, the driving assembly 2, the bearing assembly 3, the encoder assembly 4 and the base 5 coincide with each other; the bearing assembly 3 comprises an outer ring adapter 31, an inner ring adapter 33 and a bearing body 32, the outer ring adapter 31, the bearing body 32 and the inner ring adapter 33 are connected in sequence from top to bottom along the axial direction of the central axis, the outer ring adapter 31 is also connected to the table 1, and the inner ring adapter 33 is arranged on the base 5; the driving assembly 2 comprises a first driving unit 24, which is arranged inside the bearing body 32, and the first driving unit 24 is connected to the inner side wall 51 of the outer ring adapter 31, and is used to drive the bearing body 32 to drive the table 1 to rotate; the encoder assembly 4 comprises an encoder 41, which is arranged below the bearing body 32, and the outer ring adapter 31 is also connected to the encoder 41, and the encoder 41 is used to measure the rotation angle of the bearing body 32.

[0027] The bearing body 32 is annular, and the center of the bearing body 32 has a cavity, and the first drive unit 24 is placed in the cavity, which makes reasonable use of the internal space of the bearing body 32 and reduces the space occupied by the rotating platform in the semiconductor laser device. In this embodiment, the outer ring adapter 31 is irregular in shape, and the specific shape is a bowl-shaped structure shown in the figure. For the convenience of explanation, the outer ring adapter 31 is divided into three parts: the upper end face, the lower end face and the inner side wall 51, wherein the upper end face and the lower end face are both flat annular plates, and the inner side wall 51 is a cylindrical structure. The upper end face and the lower end face are connected by the inner side wall 51 to form a whole. Among them, the edge of the table top 1 is locked with the upper end surface by means of threads; the upper end surface is also locked with the bearing body 32; the size of the inner wall 51 is slightly smaller than the internal cavity size of the bearing body 32, and the inner wall 51 is embedded in the internal cavity of the bearing body 32, and the first drive unit 24 is placed in the inner wall 51 and locked with the inner wall 51; the lower end surface is locked with the encoder 41 by bolts.

[0028] The first driving unit 24 drives the outer ring adapter 31 to rotate, thereby driving the bearing body 32, the table 1 and the encoder 41 to rotate. The encoder 41 calculates the rotation angle of the table 1 and converts it into an electrical signal to transmit to an external device for subsequent operation.

[0029] The inner ring adapter 33 is connected to the lower surface of the bearing body 32. The inner ring adapter 33 is a flat annular structure. The inner ring adapter 33 and the base 5 are locked by bolts to fix the bearing body 32 and the outer ring adapter 31 on the base 5. The encoder 41 is a fully assembled encoder 41, which is easy to install and adjust. The first drive unit 24 can be a rotary motor.

[0030] By arranging the table 1, drive assembly 2, bearing assembly 3, encoder assembly 4 and base 5 in sequence on the same central axis from top to bottom, the coaxiality requirements of the drive assembly 2, bearing assembly 3 and encoder assembly 4 are ensured. At the same time, the first drive unit 24 is arranged inside the bearing body 32 in a nested manner, and the encoder 41, the bearing body 32, the table 1 and the first drive unit 24 are connected into a whole by using the outer ring adapter 31, thereby realizing the precise rotation function of the rotating platform without occupying too much space, thereby meeting the requirements of semiconductor laser equipment for a small and precise rotating platform.

[0031] In some embodiments, a first protruding shaft 53 is provided at the center of the base 5, and the encoder 41, the bearing body 32, and the first drive unit 24 are all sleeved on the first protruding shaft 53. The first protruding shaft 53 is provided on the base 5, specifically on the central axis, and the addition of the first protruding shaft 53 can facilitate the coaxial installation of the encoder assembly 4, the bearing assembly 3, and the drive assembly 2, including the encoder 41, the bearing body 32, the first drive unit 24, and their corresponding accessories.

[0032] Please refer to Figure 2 In some embodiments, the drive assembly 2 also includes a first adapter 21, a second adapter 22 and a first base plate 23. The first adapter 21 is connected to the output end of the first drive unit 24, and the first adapter 21 is also connected to the inner wall 51 of the outer ring adapter 31; the second adapter 22 is connected to the fixed end of the first drive unit 24; the first base plate 23 is connected to the second adapter 22, and the first base plate 23 is also connected to the first protruding shaft 53 for fixing the first drive unit 24.

[0033] The first adapter 21 is as Figure 2As shown, the outer edge of the first adapter 21 is connected to the top of the inner wall 51 of the outer ring adapter 31 by bolts, and the first adapter 21 is also connected to the output end of the first drive unit 24 to transmit the rotation of the first drive unit 24. The second adapter 22 is a flat annular structure, and the second adapter 22 is connected to the fixed end of the first drive unit 24. If the first drive unit 24 is a motor, the second adapter 22 and the motor housing are locked by bolts. The first bottom plate 23 is a semi-enclosed cylindrical structure, specifically as shown in FIG. Figure 2 As shown, the upper portion of the first base plate 23 is connected to the second adapter 22 to form an inner cavity, and the first drive unit 24 is placed in the inner cavity. The first drive unit 24 is then fixed to the base 5 by locking the lower surface of the first base plate 23 with the upper end surface of the first protruding shaft 53.

[0034] By setting the first adapter 21, the second adapter 22 and the first bottom plate 23, the first drive unit 24 is set on the base 5, and the structural advantage of the first raised shaft 53 is utilized to realize that the first drive unit 24 is placed in the internal cavity of the bearing body 32, leaving the space under the bearing body 32 for installing the encoder assembly 4, thereby maximizing the space utilization inside the rotating platform and realizing the requirement of a small and precise rotating platform.

[0035] Please refer to Figure 3 In some embodiments, the first protruding shaft 53 has a first channel in the axial direction, and the first driving unit 24 is electrically connected to the external device through the first connecting line 25, and the first connecting line 25 is arranged in the first channel. The first channel is arranged inside the first protruding shaft 53, and a routing space for the first connecting line 25 is reserved without affecting the connection relationship between the first protruding shaft 53 and other components. The first connecting line 25 is a power line and a signal line of the first driving unit 24. The first connecting line 25 is led out through the first channel and connected to the external device, which eliminates the problem of driving the first connecting line 25 to rotate when the first driving unit 24 rotates, and is convenient for extending the service life of the first connecting line 25, thereby extending the service life of the first driving unit 24.

[0036] See also Figure 2 and Figure 3 In some embodiments, a first opening is provided at the center of the inner ring adapter 33, and the encoder 41 passes through the first opening and is connected to the outer ring adapter 31; a second opening is also provided at the edge of the inner ring adapter 33, and the first opening and the second opening form a second channel. The encoder 41 is electrically connected to an external device through a second connecting line 44, and the second connecting line 44 is arranged in the second channel.

[0037] The center of the inner ring adapter 33 has a first opening, and the encoder 41 passes through and protrudes from the first opening, and is connected to the outer ring adapter 31. A second opening is also provided at the edge of the inner ring adapter 33, and the first opening and the second opening form a second channel. Since the inner ring adapter 33 is connected to the base 5, the inner ring adapter 33 and the base 5 are relatively fixed, and the formed second channel is also fixed and will not rotate with the outer ring adapter 31. The second connecting line 44 is the power line and signal line of the second drive unit, which are led out through the second channel and connected to the external device, eliminating the problem of the second connecting line 44 rotating when the encoder 41 rotates, which is convenient for extending the service life of the second connecting line 44, and then extending the service life of the encoder 41.

[0038] See also Figure 2 In some embodiments, the base 5 includes a side wall 51 and a third bottom plate 52, the side wall 51 is vertically arranged at the edge of the third bottom plate 52, the rotating platform also includes a connector 6 and a plug connector 7, the connector 6 penetrates the side wall 51 and protrudes from the outer surface of the side wall 51, the wiring harness of the encoder 41 is connected to the connector 6; the plug connector 7 cooperates with the connector 6 to transmit the electrical signal of the encoder 41. The side wall 51 is cylindrical and vertically arranged at the edge of the third bottom plate 52. In some embodiments, the first protruding shaft 53 is arranged on the third bottom plate 52, and the side wall 51 is coaxially arranged with the first protruding shaft 53. The connector 6 is an electronic socket, one end of the connector 6 placed inside the side wall 51 is welded to the second connecting wire 44, and one end of the connector 6 placed outside the side wall 51 forms an electronic interface for cooperating with the plug connector 7, so as to realize the electrical connection between the encoder 41 and the external device through the second connecting wire 44, and the other end of the plug connector 7 has a lead, which is connected to the external device, and the external device can be a logic processor or a PLC controller. By adding the connector 6 and the plug connector 7, the routing of the second connection line 44 is more standardized, thereby avoiding problems such as entanglement during the connection between the second connection line 44 and the external device.

[0039] In some embodiments, the side wall 51 is made of aluminum-based silicon carbide. In this embodiment, the side wall 51 is also connected to the inner ring adapter 33 and the fixed end of the encoder 41. During the rotation of the bearing body 32, the stability of the side wall 51 is required to be high. Therefore, it is made of aluminum-based silicon carbide material. The specific stiffness (stiffness divided by density) of aluminum-based silicon carbide is the highest among all electronic materials, with good shock resistance and high stiffness, so it can meet the requirements of this embodiment.

[0040] In some embodiments, the encoder assembly 4 further includes a third adapter 42 and a second base plate 43, the third adapter 42 is connected to the encoder 41; the second base plate 43 is connected to the third adapter 42, and the second base plate 43 is also connected to the base 5 for fixing the encoder 41. The encoder 41 is fixed to the base 5 through the second base plate 43 and the third adapter 42, which facilitates the encoder 41 to measure the rotation angle during the rotation process, reduces the vibration of the encoder 41 during the rotation of the rotating platform, and further improves the measurement accuracy of the encoder 41.

[0041] In some embodiments, the outer ring adapter 31 and / or the inner ring adapter 33 are made by 3D printing, and the bearing body 32 is an integrated bearing. Optionally, the third adapter 42 and the first adapter 21 are both made by 3D printing, which reduces the difficulty of mechanical processing and reduces the degree of deformation of the components, thereby ensuring the accuracy of the corresponding components. The bearing body 32 is an integrated bearing, and the bearings are divided into split bearings and integrated bearings. The integrated bearing can withstand the combined load of axial load, radial load and overturning load, has a large load-bearing capacity, high stiffness, low friction torque, and ensures high accuracy.

[0042] In the second aspect, the present embodiment further provides a system for semiconductor laser equipment, including a rotating platform and a semiconductor laser, wherein the rotating platform is the rotating platform described in the first aspect; the semiconductor laser is arranged on the rotating platform, and the rotating platform is used to adjust the laser output direction of the semiconductor laser. The semiconductor laser has a high-speed modulated laser output, and has high efficiency and high stability, and needs to be matched with a precise and stable mechanical mechanism to achieve its high-speed rotation and high-precision technical requirements. Therefore, the semiconductor laser is arranged on the rotating platform. The rotating platform in the present embodiment realizes a lightweight design of the mechanical structure while ensuring normal operation, saves the space occupied by the rotating platform in the semiconductor laser system, and avoids the problem of wire bundle entanglement, thereby facilitating subsequent research.

[0043] The above technical solution arranges the table 1, drive assembly 2, bearing assembly 3, encoder assembly 4 and base 5 in sequence on the same central axis from top to bottom, thereby ensuring the coaxiality requirements of the drive assembly 2, bearing assembly 3 and encoder assembly 4. At the same time, the first drive unit 24 is arranged inside the bearing body 32 in a nested manner, and the encoder 41, bearing body 32, table 1 and first drive unit 24 are connected into a whole by using the outer ring adapter 31, thereby realizing the precise rotation function of the rotating platform without occupying too much space, thereby meeting the requirements of semiconductor laser equipment for a small and precise rotating platform. Specific embodiment:

[0045] like Figure 1As shown, the small precision turntable for semiconductor laser equipment includes a table top 1, a motor assembly, a bearing assembly 3, an encoder assembly 4, a side wall 51, and a third bottom plate 52.

[0046] like Figure 2 As shown, the table top 1 is connected to the outer ring adapter 31 by screws and is used to carry the device;

[0047] like Figure 2 As shown, the bearing assembly 3 includes an outer ring adapter 31, an inner ring adapter 33, and a bearing. An integrated bearing is used, which can withstand the combined load of axial load, radial load and overturning load, has a large bearing capacity, high rigidity, low friction torque, and ensures high precision. The outer ring adapter 31 is connected to the bearing and the table 1, and is connected to the first adapter 21. The inner ring adapter 33 is connected to the bearing and the side wall 51. The side wall 51 is a key component and needs to have good support rigidity and stability. The aluminum-based silicon carbide material is used to ensure rigidity and reduce the weight of the overall turntable.

[0048] like Figure 2 As shown, the motor assembly includes a first adapter 21, a second adapter 22, a motor stator seat (a fixed end of the first drive unit 24), and a motor output end (an output end of the first drive unit 24), which provide driving force for the rotation of the rotating platform.

[0049] like Figure 2 As shown, the encoder assembly 4 includes a self-assembled encoder 41 (i.e., encoder 41), an encoder 41 seat (i.e., a third adapter 42), and an encoder 41 connector (i.e., a second bottom plate 43), which is used to measure the rotation angle of the table 1, and the self-assembled encoder 41 is used for easy installation and adjustment. The encoder 41 seat (i.e., the third adapter 42) is installed in conjunction with the self-assembled encoder 41, the encoder 41 seat (i.e., the third adapter 42) is connected to the side wall 51 through the encoder 41 connector (i.e., the second bottom plate 43), and the upper end of the encoder 41 is connected to the outer ring adapter 31 to achieve stopper positioning. By improving the machining accuracy of the mounting end faces of the outer ring adapter 31 and the encoder 41, and by polishing the mounting faces of the encoder 41 and the encoder 41 seat (i.e., the third adapter 42), the encoder 41 seat (i.e., the third adapter 42) and the encoder 41 connector (i.e., the second base plate 43) and the side wall 51, it is ensured that the rotating axis of the assembled encoder 41 and the bearing (i.e., the bearing body 32) are coaxial, thereby improving the angle measurement accuracy.

[0050] At the same time, since the outer ring adapter 31, the inner ring adapter 33, the first adapter 21, and the encoder 41 seat (i.e., the third adapter 42) have complex shapes and require high precision, mechanical processing is likely to cause deformation of the parts. Therefore, additive manufacturing (i.e., 3D printing) is used to obtain parts with higher precision.

[0051] like Figure 2 As shown, the third bottom plate 52 is connected to the side wall 51, and a protruding hollow shaft (ie, a first protruding shaft 53) is provided at the center of the third bottom plate 52 for positioning, installing and routing the motor.

[0052] like Figure 2 As shown, the connector 6 is fixed to the side of the side wall 51, and the plug connector 7 is installed on the side wall 51 of the connector 6, which is used to route the encoder 41. The plug connector 7 and the connector 6 can be an aviation head and an aviation plug, which are collectively referred to as aviation plugs. Aviation plugs are a type of connector that originated from the military industry and are referred to as aviation plugs. Aviation plugs are electromechanical components that connect electrical circuits, so their own electrical parameters are the first issue to consider when selecting aviation plugs. Correct selection and use of aviation plugs is an important aspect of ensuring circuit reliability.

[0053] like Figure 3 As shown, the assembled encoder 41 is routed from the second channel and passes through the connector 7; the motor is routed from the first channel; this routing process does not require the use of a conductive ring, which effectively prevents the wiring harness from being entangled when the table 1 rotates.

[0054] In this embodiment, the motor, encoder 41, and bearing adopt a nested structure to make the structure compact and reduce the overall height; the side wall 51 is a key component and needs to have good support stiffness and stability. It adopts aluminum-based silicon carbide material to ensure stiffness and reduce the weight of the overall table 1; and it adopts a torque motor for direct drive without a transmission mechanism. The above method can achieve a small and lightweight table 1.

[0055] At the same time, the wiring is routed from the first channel and the second channel to ensure smooth wiring and avoid winding during rotation. The integrated bearing is used to withstand the combined load of axial load, radial load and overturning load, ensuring greater load-bearing capacity, higher rigidity, lower friction torque and higher precision.

[0056] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0057] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

[0058] The above specific implementations of the present invention do not constitute a limitation on the protection scope of the present invention. Any other corresponding changes and modifications made based on the technical concept of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A rotating platform for semiconductor laser equipment, characterized in that: A table, a driving assembly, a bearing assembly, an encoder assembly and a base are arranged in sequence from top to bottom along the vertical direction, and the central axes of the table, the driving assembly, the bearing assembly, the encoder assembly and the base coincide with each other; The bearing assembly comprises an outer ring adapter, an inner ring adapter and a bearing body, wherein the outer ring adapter, the bearing body and the inner ring adapter are sequentially connected from top to bottom along the axial direction of the central axis, the outer ring adapter is also connected to the table, and the inner ring adapter is arranged on the base; The driving assembly includes a first driving unit, which is arranged inside the bearing body, and the first driving unit is connected to the inner side wall of the outer ring adapter, and is used to drive the bearing body to drive the table to rotate; The encoder assembly includes an encoder, which is arranged below the bearing body. The outer ring adapter is also connected to the encoder, and the encoder is used to measure the rotation angle of the bearing body.

2. The rotating platform for semiconductor laser equipment according to claim 1, characterized in that: A first protruding shaft is provided at the center of the base, and the encoder, the bearing body and the first driving unit are all sleeved on the first protruding shaft.

3. The rotating platform for semiconductor laser equipment according to claim 2, characterized in that: The drive assembly also includes: A first adapter, connected to the output end of the first drive unit, and the first adapter is also connected to the inner side wall of the outer ring adapter; A second adapter connected to a fixed end of the first driving unit; A first bottom plate, wherein the first bottom plate is connected to the second adapter, and the first bottom plate is also connected to the first protruding shaft, and is used to fix the first driving unit.

4. The rotating platform for semiconductor laser equipment according to claim 2 or 3, characterized in that: The first protruding shaft has a first channel in its axial direction, the first drive unit is electrically connected to an external device via a first connecting line (25), and the first connecting line (25) is arranged in the first channel.

5. The rotating platform for semiconductor laser equipment according to claim 1, characterized in that: A first opening is provided at the center of the inner ring adapter, and the encoder passes through the first opening and is connected to the outer ring adapter; A second opening is also provided at the edge of the inner ring adapter, and the first opening and the second opening form a second channel. The encoder is electrically connected to an external device via a second connecting line, and the second connecting line is arranged in the second channel.

6. The rotating platform for semiconductor laser equipment according to claim 5, characterized in that: The base includes a side wall and a third bottom plate, wherein the side wall is vertically arranged at the edge of the third bottom plate, and the rotating platform further includes: A connector, the connector passes through the side wall and protrudes out of the outer surface of the side wall, and the wiring harness of the encoder is connected to the connector; A plug connector is matched with the connector to transmit the electrical signal of the encoder.

7. The rotating platform for semiconductor laser equipment according to claim 6, characterized in that: The side wall is made of aluminum-based silicon carbide.

8. The rotating platform for semiconductor laser equipment according to claim 1, characterized in that: The encoder assembly further comprises: A third adapter, connected to the encoder; The second bottom plate is connected to the third adapter, and the second bottom plate is also connected to the base, and is used to fix the encoder.

9. The rotating platform for semiconductor laser equipment according to claim 1, characterized in that: The outer ring adapter and / or the inner ring adapter are made by 3D printing, and the bearing body is an integrated bearing.

10. A system for a semiconductor laser device, characterized in that: include: A rotating platform, which is the rotating platform according to any one of claims 1 to 9; The semiconductor laser is arranged on the rotating platform, and the rotating platform is used to adjust the laser output direction of the semiconductor laser.

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