Laser processing method, device, computer device and computer medium

Abstract

This application provides a laser processing method, apparatus, computer equipment, and computer medium. The laser processing method includes: dividing the workpiece to be processed into n camera imaging areas, with the center MC of each camera imaging area... n Let n be the image point for each camera's image area, where n ≥ 1; divide each camera's image area into m galvanometer processing areas, with MZ being the center of each galvanometer processing area. m For each corresponding galvanometer processing area, a processing point is defined, where m ≥ 1. The camera sequentially acquires the coordinate information of the cutting line feature points within each camera's image area in the camera coordinate system, and converts this coordinate information into coordinate information in the galvanometer coordinate system. Based on the coordinate information of the cutting line feature points in the galvanometer coordinate system, the galvanometer sequentially processes each galvanometer processing area. The laser processing method provided in this application can effectively save image capture time, thereby improving processing efficiency.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of laser processing, and more particularly relates to a laser processing method and device, a computer device and a computer medium. BACKGROUND

[0002] At present, large-format circuit board cutting is mainly carried out by milling machine cutting and laser cutting. Compared with milling machine cutting, laser cutting improves processing efficiency and section quality, and can be used for cutting of soft boards that cannot be cut by a milling machine, and thus is applied more and more widely.

[0003] In common large-format circuit board laser processing, a camera with a small field of view is generally used to take pictures of single products on a circuit board in sequence, and a galvanometer is used to concentrate multiple products in a same galvanometer marking range for processing, which is low in processing efficiency. SUMMARY

[0004] The application aims to provide a laser processing method, which can improve processing efficiency.

[0005] To achieve the above object, the application adopts the technical scheme of providing a laser processing method, comprising:

[0006] dividing a workpiece to be processed into n camera photographing areas, the center MC of each camera photographing area being n a photographing point corresponding to each camera photographing area, wherein n≥1;

[0007] dividing each camera photographing area into m galvanometer processing areas, the center MZ of each galvanometer processing area being m a processing point corresponding to each galvanometer processing area, wherein m≥1;

[0008] using a camera to sequentially acquire coordinate information of a cutting line feature point in each camera photographing area in a camera coordinate system, and converting the coordinate information of the cutting line feature point in the camera coordinate system into coordinate information in a galvanometer coordinate system;

[0009] According to the coordinate information of the cutting line feature point in the galvanometer coordinate system, a galvanometer sequentially processes each galvanometer processing area.

[0010] Further, the area of the camera photographing area is greater than or equal to the area of the galvanometer processing area, and the area of the workpiece to be processed is greater than or equal to the area of the camera photographing area.

[0011] Further, the step of "using a camera to sequentially acquire coordinate information of a cutting line feature point in each camera photographing area in a camera coordinate system" specifically comprises:

[0012] A1, moving a processing platform, so that the processing platform is moved to a current photographing point MCn Use the camera to obtain the MC of the current shooting point. n The coordinate information of the cutting line feature points in the camera coordinate system within the corresponding camera capture area;

[0013] A2. Continue moving the processing platform until it reaches the next photo point MC. n+1 Using a camera to acquire the image at the shooting point MC n+1 The coordinate information of the cutting line feature points in the camera coordinate system within the corresponding camera capture area;

[0014] A3. Repeat step A2 until the coordinate information of the cutting line feature points in the camera coordinate system of all camera capture areas is obtained.

[0015] Furthermore, the step "based on the coordinate information of the cutting line feature points in the galvanometer coordinate system, the galvanometer sequentially processes each galvanometer processing area" specifically includes:

[0016] B1. Move the machining platform, causing it to move to the current machining point MZ. m Based on the coordinate information of the cutting line feature points in the galvanometer coordinate system, the galvanometer is aligned with the machining point MZ. m The corresponding galvanometer processing area is processed;

[0017] B2. Continue moving the machining platform sequentially until it reaches the next machining point MZ. m+1 Based on the coordinate information of the cutting line feature points in the galvanometer coordinate system, the galvanometer is aligned with the machining point MZ. m+1 The corresponding galvanometer processing area is processed;

[0018] B3. Repeat step B2 until all galvanometer processing areas are completed.

[0019] Furthermore, before the step "using the camera to sequentially acquire the coordinate information of the cutting line feature points in the camera coordinate system within each camera's image area", the following step is also included:

[0020] The moving machining platform allows it to move sequentially to each machining point MZ. m Multiple marker points are marked in the galvanometer machining area corresponding to each machining point MZm using a laser. The coordinate matrix of the multiple marker points in the galvanometer coordinate system Z0 of each machining area is:

[0021] The mobile processing platform allows it to be moved sequentially to each photographing point (MC). n The coordinate matrix MC of all marker points within the camera's capture area in the camera coordinate system C0 is obtained using the camera. nm ;

[0022] Create MC nm and The transformation matrix ΔZC between them nm Complete the camera calibration.

[0023] Furthermore, the step "moving the machining platform, so that the machining platform moves sequentially to each machining point MZ" m Using lasers at each processing point MZ m Multiple marker points are marked in the corresponding galvanometer machining area. The coordinate matrix of the multiple marker points in the galvanometer coordinate system Z0 of each galvanometer machining area is as follows: Specifically, it includes:

[0024] C1. Move the machining platform, causing it to move to the current machining point MZ. m Using laser at the current processing point MZ m Multiple marker points are marked in the corresponding galvanometer processing area, and the coordinate matrix of the multiple marker points in the galvanometer coordinate system Z0 is:

[0025] C2. Continue moving the machining platform until it reaches the next machining point MZ. m+1 Using laser at the current processing point MZ m+1 Multiple marker points are marked in the corresponding galvanometer processing area, and the coordinate matrix of these marker points in the galvanometer coordinate system Z0 is also...

[0026] C3. Repeat step C2 until the laser marks multiple points in all galvanometer processing areas.

[0027] Furthermore, the step "moving the processing platform, so that the processing platform is moved sequentially to each photographing point MC" n The coordinate matrix MC of all marker points within the camera's capture area in the camera coordinate system C0 is obtained using the camera. nm Specifically, it includes:

[0028] D1. Move the processing platform to the current photo point MC. n The camera acquires the current shooting point MC. n The coordinate matrix MC of all marker points in the corresponding camera's image area in the camera coordinate system C0 nm ;

[0029] D2. Continue moving the processing platform until it reaches the next photo point MC. n+1 The camera acquires the next photo point (MC). n+1 The coordinate matrix MC of all marker points in the corresponding camera's image area in the camera coordinate system C0 (n+1)m ;

[0030] D3, repeat step D2 until a coordinate matrix of all marker points in the camera photographing area corresponding to the photographing point is obtained in the camera coordinate system CO.

[0031] The application further provides a laser processing device, comprising:

[0032] a first division module, configured to divide the workpiece to be processed into n camera photographing areas, a center MC of each camera photographing area n a photographing point corresponding to each camera photographing area, wherein n≥1;

[0033] a second division module, configured to divide each camera photographing area into m galvanometer processing areas, a center MZ of each galvanometer processing area m a processing point corresponding to each galvanometer processing area, wherein m≥1;

[0034] a camera, configured to sequentially obtain coordinate information of the cutting line feature points in each camera photographing area in a camera coordinate system, and convert the coordinate information of the cutting line feature points in the camera coordinate system into coordinate information in a galvanometer coordinate system; and

[0035] a galvanometer, configured to sequentially process each galvanometer processing area according to the coordinate information of the cutting line feature points in the galvanometer coordinate system.

[0036] The application further provides a computer device, comprising:

[0037] a processor configured to execute computer executable instructions;

[0038] a memory storing one or more computer executable instructions, which, when executed by the processor, implement each step of the laser processing method.

[0039] The application further provides a computer readable storage medium, which stores a computer program, and the computer program is executed by a processor to implement each step of the laser processing method.

[0040] The laser processing method provided by the application has the beneficial effects that: by dividing the workpiece to be processed into n camera photographing areas and dividing each camera photographing area into m galvanometer processing areas, the camera can obtain the coordinate information of the cutting line feature points of the m galvanometer processing areas in one photographing, which can effectively save the photographing time and improve the processing efficiency; compared with sequentially photographing the camera to obtain the coordinate information of the cutting line feature points of one galvanometer processing area, the application can reduce the error caused by multiple photographing and improve the laser processing precision; and the laser processing precision can be further improved by directly obtaining the coordinate information of the cutting line feature points by the camera. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1 A schematic flowchart of the laser processing method provided in the embodiments of this application;

[0043] Figure 2 This is a schematic diagram illustrating the division of the workpiece to be processed into a camera imaging area in the camera coordinate system according to an embodiment of this application;

[0044] Figure 3 This is a schematic diagram illustrating the division of the workpiece to be processed into a galvanometer processing area in the galvanometer coordinate system in an embodiment of this application.

[0045] The following are the labeling elements in the figure:

[0046] 100. Workpiece to be processed; 110. Camera taking pictures area; 120. Galvanometer processing area. Detailed Implementation

[0047] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0048] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0049] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0050] In addition, the terms "first", "second", etc. are used only for descriptive purposes and should not be construed as implying or suggesting relative importance or an ordered ranking such that the features so designated are necessarily intended to be important in the description of the technical features. Therefore, the features defined as "first", "second", etc. can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly and specifically limited.

[0051] Please refer to Figure 1 The laser processing method provided by the present application will be described. The laser processing method of the present application can be used for laser processing of a large-format workpiece, for example, laser processing of a large-format circuit board.

[0052] The laser processing method of the present application includes steps S10, S20, S50, and S70.

[0053] S10, divide the workpiece to be processed into n camera shooting areas, the center MC of each camera shooting area n is a shooting point corresponding to each camera shooting area, where n≥1.

[0054] In step S10, n can be a positive integer such as 1, 2, 3, 4, etc. As shown in Figure 2 In one embodiment of the present application, n is 4, i.e., the workpiece to be processed 100 can be divided into 4 camera shooting areas 110.

[0055] S20, divide each camera shooting area into m galvanometer processing areas, the center MZ of each galvanometer processing area m is a processing point corresponding to each galvanometer processing area, where m≥1 。

[0056] In step S20, m can be a positive integer such as 1, 2, 3, 4, etc. As shown in Figure 3 In one embodiment of the present application, m is 4, i.e., each camera shooting area 110 can be divided into 4 galvanometer processing areas 120. Then the workpiece to be processed 100 can be divided into 16 galvanometer processing areas 120.

[0057] S50, use the camera to sequentially obtain the coordinate information of the cutting line feature points in each camera shooting area in the camera coordinate system, and convert the coordinate information of the cutting line feature points in the camera coordinate system into coordinate information in the galvanometer coordinate system.

[0058] In step S50, the coordinate information of the cutting line feature points is obtained by using the camera, which can effectively improve the laser processing precision. The "cutting line feature points" can be feature points located on the cutting line or feature points located near the cutting line.

[0059] S70, according to the coordinate information of the cutting line feature points in the galvanometer coordinate system, the galvanometer sequentially processes each galvanometer processing region.

[0060] The laser processing method provided in the application can effectively save the photographing time and improve the processing efficiency. Compared with the method of sequentially photographing each galvanometer processing region to obtain the coordinate information of the cutting line feature points, the application can reduce the error caused by multiple photographing and improve the laser processing precision. Furthermore, the direct acquisition of the coordinate information of the cutting line feature points by the camera can further improve the laser processing precision.

[0061] Specifically, the area of the camera photographing region is greater than or equal to the area of the galvanometer processing region, and the area of the workpiece to be processed is greater than or equal to the area of the camera photographing region. Thus, one camera photographing region can be divided into m galvanometer processing regions, and one workpiece to be processed can be divided into n camera photographing regions. Figures 2 to 3 As shown in the figure, assuming that the length of the workpiece to be processed is S, the width is H, the area of the workpiece to be processed is S*H, the length of each camera photographing region is SC, the width is HC, the area of each camera photographing region is SC*HC, the length of the galvanometer processing region is SZ, the width is HZ, and the area of each camera photographing region is SZ*HZ.

[0062] Further, the area of the galvanometer processing region is less than or equal to the marking range of the galvanometer, so as to further improve the processing precision.

[0063] The step S50 of "obtaining the coordinate information of the cutting line feature points in the camera coordinate system in each camera photographing region by using the camera" can specifically include steps S510, S520 and S530.

[0064] S510, moving the processing platform so that the processing platform moves to the current photographing point MC n , and using the camera to obtain the coordinate information of the cutting line feature points in the camera coordinate system in the camera photographing region corresponding to the current photographing point MC n .

[0065] In step S510, if the current photographing point is MC1, the camera obtains the coordinate information of the cutting line feature points in the camera coordinate system in the camera photographing region corresponding to the current photographing point MC1. If the current photographing point is MC2, the camera obtains the coordinate information of the cutting line feature points in the camera coordinate system in the camera photographing region corresponding to the current photographing point MC2.

[0066] S520, continue to move the processing platform so that the processing platform moves to the next photographing point MC n+1, the camera obtains the coordinate information of the cutting line feature points in the camera coordinate system in the corresponding camera photographing area. n+1 corresponding to the photographing point MC

[0067] In step S520, if the current photographing point is MC1, the next photographing point is MC2; if the current photographing point is MC2, the next photographing point is MC3.

[0068] In step S520, if the current photographing point is MC1, the next photographing point is MC2; if the current photographing point is MC2, the next photographing point is MC3.

[0069] In step S520, if the current photographing point is MC1, the next photographing point is MC2; if the current photographing point is MC2, the next photographing point is MC3.

[0070] In step S520, if the current photographing point is MC1, the next photographing point is MC2; if the current photographing point is MC2, the next photographing point is MC3.

[0071] In step S520, if the current photographing point is MC1, the next photographing point is MC2; if the current photographing point is MC2, the next photographing point is MC3. m In step S520, if the current photographing point is MC1, the next photographing point is MC2; if the current photographing point is MC2, the next photographing point is MC3. m In step S520, if the current photographing point is MC1, the next photographing point is MC2; if the current photographing point is MC2, the next photographing point is MC3.

[0072] In step S520, if the current photographing point is MC1, the next photographing point is MC2; if the current photographing point is MC2, the next photographing point is MC3.

[0073] In step S520, if the current photographing point is MC1, the next photographing point is MC2; if the current photographing point is MC2, the next photographing point is MC3. m+1 In step S520, if the current photographing point is MC1, the next photographing point is MC2; if the current photographing point is MC2, the next photographing point is MC3. m+1 In step S520, if the current photographing point is MC1, the next photographing point is MC2; if the current photographing point is MC2, the next photographing point is MC3.

[0074] In step S520, if the current photographing point is MC1, the next photographing point is MC2; if the current photographing point is MC2, the next photographing point is MC3.

[0075] In step S520, if the current photographing point is MC1, the next photographing point is MC2; if the current photographing point is MC2, the next photographing point is MC3.

[0076] In step S520, if the current photographing point is MC1, the next photographing point is MC2; if the current photographing point is MC2, the next photographing point is MC3.

[0077] Step S50, "using the camera to sequentially acquire the coordinate information of the cutting line feature points in the camera coordinate system within each camera's image area", may also include steps S30, S40, and S80.

[0078] S30, Moving the machining platform, allowing the machining platform to move sequentially to each machining point MZ. m Using lasers at each processing point MZ m Multiple marker points are marked in the corresponding galvanometer machining area. The coordinate matrix of the multiple marker points in the galvanometer coordinate system Z0 of each galvanometer machining area is as follows:

[0079] S40, a mobile processing platform, allows the processing platform to move sequentially to each photographing point MC. n The coordinate matrix MC of all marker points within the camera's capture area in the camera coordinate system C0 is obtained using the camera. nm .

[0080] S80, Establish MCnm and The transformation matrix ΔZC between them nm Complete the camera calibration.

[0081] Through steps S30, S40, and S80, the transformation from the camera coordinate system to the galvanometer coordinate system is completed, and the camera is calibrated. Subsequently, when laser processing the next workpiece, the coordinate values ​​of the cutting lines in each photographed area of ​​the workpiece can be directly converted from the coordinate values ​​in the camera coordinate system C0 to the coordinate values ​​in the galvanometer coordinate system Z0 according to the transformation matrix, thereby improving the laser processing accuracy.

[0082] Step S30 may specifically include steps S310, S320, and S330.

[0083] S310, Moving the machining platform, allowing the machining platform to move to the current machining point MZ. m Using laser at the current processing point MZ m Multiple marker points are marked in the corresponding galvanometer machining area. The coordinate matrix of these marker points in the galvanometer coordinate system Z0 is as follows:

[0084] In step S310, the marker point can be any shape, such as a cross marker point, a circular marker point, a triangular marker point, etc.

[0085] Nine marker points can be marked in a galvanometer processing area. These nine marker points are arranged in a rectangular array, and the coordinate matrix of the nine marker points is as follows: for:

[0086]

[0087] S320, continue to move the machining platform so that the machining platform moves to the next machining point MZ m+1 mark a plurality of mark points in the current machining point MZ using the laser m+1 The coordinates matrix of the plurality of mark points in the galvanometer coordinate system Z0 is

[0088] S330, repeat step S320 until the laser marks a plurality of mark points in all galvanometer machining areas.

[0089] Step S40, move the machining platform so that the machining platform moves to each photographing point MC in turn n The coordinates matrix of all mark points in the camera coordinate system C0 in the corresponding camera photographing area is MC nm Specifically, it can include steps S410, S430 and S440.

[0090] S410, move the machining platform so that the machining platform moves to the current photographing point MC n The camera obtains the coordinates matrix MC of all mark points in the corresponding camera photographing area in the camera coordinate system C0 n nm .

[0091] In step S410, if the workpiece to be machined can be divided into four camera photographing areas, the photographing points of the four camera photographing areas can be represented by MC1, MC2, MC3 and MC4 respectively. If one camera photographing area can be divided into four galvanometer machining areas, the machining points of the four galvanometer machining areas can be represented by MZ1, MZ2, MZ3 and MZ4 respectively. If there are nine mark points in one galvanometer machining area, there are 36 mark points in one camera photographing area.

[0092] When the machining platform moves to the current photographing point MC1, since MC1 includes four galvanometer machining areas, the coordinates matrix of the mark points in the four galvanometer machining areas in MC1 in the camera coordinate system C0 is obtained by the camera:

[0093]

[0094] ​wherein, m = 1, 2, 3, 4, …, when m = 1, it represents the coordinate matrix of 9 mark points of the first galvanometer machining area in the camera coordinate system C0 in the first camera photographing area; when m = 2, it represents the coordinate matrix of 9 mark points of the second galvanometer machining area in the camera coordinate system C0 in the first camera photographing area; when m = 3, it represents the coordinate matrix of 9 mark points of the third galvanometer machining area in the camera coordinate system C0 in the first camera photographing area; when m = 4, it represents the coordinate matrix of 9 mark points of the fourth galvanometer machining area in the camera coordinate system C0 in the first camera photographing area.

[0095] S440, continue to move the machining platform, so that the machining platform moves to the next photographing point MC n+1 , the camera obtains the next photographing point MC n+1 The coordinate matrix MC of all mark points in the corresponding camera photographing area in the camera coordinate system C0. (n+1)m .

[0096] Wherein, step S440 can obtain the coordinate matrix of all mark points in all camera photographing areas in the camera coordinate system C0 by moving the machining platform to other photographing points in sequence.

[0097] For example, the current photographing point is MC1, and the next photographing point is MC2. The coordinate matrix of the mark points in the four galvanometer machining areas in MC2 in the camera coordinate system C0 is obtained by the camera:

[0098]

[0099] S440, repeat step S430 until the coordinate matrix of all mark points in the corresponding camera photographing area in the camera coordinate system C0 is obtained.

[0100] The application also provides a laser machining device, comprising:

[0101] The first division module is used for dividing the workpiece to be machined into n camera photographing areas, and the center MC of each camera photographing area is n a photographing point corresponding to each camera photographing area, wherein n≥1;

[0102] The second division module is used for dividing each camera photographing area into m galvanometer machining areas, and the center MZ of each galvanometer machining area is m a machining point corresponding to each galvanometer machining area, wherein m≥1;

[0103] The camera is used for sequentially obtaining the coordinate information of the cutting line feature points in each camera photographing area in the camera coordinate system, and converting the coordinate information of the cutting line feature points in the camera coordinate system into the coordinate information in the galvanometer coordinate system; and,

[0104] The galvanometer is used for processing each galvanometer processing area in turn according to the coordinate information of the cutting line feature points in the galvanometer coordinate system.

[0105] The application further provides a computer device, comprising:

[0106] a processor configured to execute computer executable instructions;

[0107] a memory storing one or more computer executable instructions, which, when executed by the processor, implement each step of the laser processing method in any of the above embodiments.

[0108] The memory, as a kind of computer readable storage medium, can be used to store software programs, computer executable programs and modules, such as program instructions corresponding to the laser processing method in the embodiments of the application.The processor realizes the laser processing method by running the software programs, instructions and modules stored in the memory.

[0109] The memory can mainly include a program storage area and a data storage area, wherein the program storage area can store an operating system and at least one application required by a function;The data storage area can store data created according to the use of the terminal, etc.In addition, the memory can include a high-speed random access memory, and can also include a non-volatile memory, such as at least one magnetic disk storage device, a flash memory device, or other non-volatile solid-state storage device.The examples of the above network include but are not limited to the Internet, an intranet, a local area network, a mobile communication network and a combination thereof.

[0110] The application further provides a computer readable storage medium having a computer program stored thereon, which is executed by a processor to implement each step of the laser processing method in any of the above embodiments.

[0111] Through the above description of the embodiments, those skilled in the art can clearly understand that the application can be realized by software and necessary general hardware, of course, it can also be realized by hardware, but in many cases, the former is a better embodiment.Based on such understanding, the technical solutions of the application can be embodied in the form of a software product, which can be stored in a computer readable storage medium, such as a floppy disk, a read-only memory (ROM), a random access memory (RAM), a FLASH, a hard disk or an optical disk, etc., including a plurality of instructions to make a computer device (which can be a personal computer, a server, or a network device, etc.) execute the methods of various embodiments of the application.

[0112] The above description is only the preferred embodiment of the present application, and is not intended to limit the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A method of laser processing, characterized by: The method comprises the following steps: The workpiece to be processed is divided into n camera shooting areas, the center MC of each camera shooting area n The shooting point corresponding to each camera shooting area, wherein n≥1, the area of the workpiece to be processed≥the area of the camera shooting area; Each camera shooting area is divided into m mirror processing areas, and the center MZ of each mirror processing area m Processing points corresponding to each mirror processing area, where m≥1, and the area of the camera shooting area≥the area of the mirror processing area; The camera is used to sequentially acquire coordinate information of the cutting line feature points in each camera shooting area in the camera coordinate system, and convert the coordinate information of the cutting line feature points in the camera coordinate system into coordinate information in the galvanometer coordinate system. According to the coordinate information of the cutting line feature points in the galvanometer coordinate system, the galvanometer sequentially processes each galvanometer processing area.

2. The laser processing method according to claim 1, wherein: The step of "using the camera to sequentially acquire coordinate information of the cutting line feature points in each camera shooting area in the camera coordinate system" specifically comprises: A1, a mobile machining platform, so that the machining platform moves to the current photographing point MC n , using a camera to obtain coordinate information of the cutting line feature point in the camera coordinate system in the corresponding camera photographing area of the current photographing point MC n . A2, continue to move the machining platform, so that the machining platform moves to the next photographing point MC n+1 , acquire, by using the camera, coordinate information of the cutting line feature point in the camera coordinate system in a corresponding camera photographing area of the photographing point MC n+1 . A3, repeating step A2 until the coordinate information of the cutting line feature points in each camera shooting area in the camera coordinate system is acquired.

3. The laser processing method according to claim 1, wherein: The step of "according to the coordinate information of the cutting line feature points in the galvanometer coordinate system, the galvanometer sequentially processes each galvanometer processing area" specifically comprises: B1, the mobile machining platform, so that the machining platform moves to the current machining point MZ m According to the coordinate information of the cutting line feature point in the galvanometer coordinate system, the galvanometer processes the machining area corresponding to the machining point MZ m ​ B2, continue to move the machining platform in sequence, so that the machining platform moves to the next machining point MZ m+1 According to the coordinate information of the cutting line feature point in the galvanometer coordinate system, the galvanometer processes the machining area corresponding to the machining point MZ m+1 ​ B3, repeating step B2 until the processing of all galvanometer processing areas is completed.

4. The laser processing method according to claim 1, wherein: Before the step of "using the camera to sequentially acquire coordinate information of the cutting line feature points in each camera shooting area in the camera coordinate system", the method further comprises the following steps: The machining platform is moved so that the machining platform moves to each machining point MZ in turn m The laser is used to mark each machining point MZ m A plurality of mark points are marked in each corresponding galvanometer machining area, and the coordinate matrix of the plurality of mark points in each galvanometer machining area in the galvanometer coordinate system Z0 is The machining platform is moved so that the machining platform moves to each photographing point MC in turn n The camera is used to obtain the coordinate matrix of all mark points in each camera photographing area in the camera coordinate system C0 max ; Establishing MC mm With The conversion matrix ΔZC mm between the camera calibration is completed.

5. The laser processing method according to claim 4, wherein: Step "moving the machining platform so that the machining platform moves to each machining point MZ in turn n marking each machining point MZ with a laser n A plurality of marking points are marked in each corresponding galvanometer machining region, and the coordinate matrix of the plurality of marking points in each galvanometer machining region in the galvanometer coordinate system Z0 is Specifically includes: C1, the mobile processing platform, so that the processing platform moves to the current processing point MZ n marking points in the corresponding galvanometer processing area, the coordinate matrix of the plurality of marking points in the galvanometer coordinate system Z0 is n marking points in the corresponding galvanometer processing area, the coordinate matrix of the plurality of marking points in the galvanometer coordinate system Z0 is C2. Continue moving the machining platform until it reaches the next machining point MZ. m+1 Using laser at the current processing point MZ m+1 Multiple marker points are marked in the corresponding galvanometer processing area, and the coordinate matrix of these marker points in the galvanometer coordinate system Z0 is also... C3, repeating step C2 until the laser marks multiple marking points in all galvanometer processing areas.

6. The laser processing method according to claim 4, wherein: Step "move the machining platform so that the machining platform moves to each photographing point MC n , and acquire the coordinate matrix of all the mark points in the photographing region of each camera in the camera coordinate system C n MC mm " specifically includes: D1, the mobile machining platform, so that the machining platform moves to the current photographing point MC n , the camera acquires the current photographing point MC u The coordinate matrix MC of all the mark points in the corresponding camera photographing area in the camera coordinate system Z0 mm ; D2, continue to move the machining platform so that the machining platform moves to the next photographing point MC n+1 , the camera acquires the next photographing point MC n+1 The coordinate matrix MC of all the mark points in the corresponding camera photographing area in the camera coordinate system Z0 (n-1)m ; D3, repeating step D2 until all marking points corresponding to the camera shooting area of each shooting point in the camera coordinate system Z0 are acquired.

7. A laser processing apparatus characterized by comprising: The method comprises the following steps: a first dividing module, configured to divide a workpiece to be processed into n camera photographing areas, a center MC of each camera photographing area n a photographing point corresponding to each camera photographing area, wherein n≥1, and an area of the workpiece to be processed is greater than an area of the camera photographing area; a second dividing module, configured to divide each camera photographing area into m galvanometer processing areas, each galvanometer processing area having a center MZ m a processing point corresponding to each galvanometer processing area, wherein m≥1, and an area of the camera photographing area≥an area of the galvanometer processing area; A camera is used to sequentially acquire coordinate information of the cutting line feature points in each camera shooting area in the camera coordinate system, and convert the coordinate information of the cutting line feature points in the camera coordinate system into coordinate information in the galvanometer coordinate system; and A galvanometer is used to sequentially process each galvanometer processing area according to the coordinate information of the cutting line feature points in the galvanometer coordinate system.

8. A computer device, comprising: The processor is configured to execute computer executable instructions; The memory stores one or more computer executable instructions, which are executed by the processor to realize each step of the laser processing method according to any one of claims 1 to 6. A computer program is stored thereon, and the computer program is executed by a processor to realize each step of the laser processing method according to any one of claims 1 to 6.

9. A computer-readable storage medium, characterized in that: ​

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