Electroplating tank and electroplating production line with side wall drainage function

Abstract

The present invention provides an electroplating tank and an electroplating production line with a sidewall drainage function for plating solution. The electroplating tank comprises: a bottom plate, and a first sidewall and a second sidewall disposed oppositely on the bottom plate; a first drainage area is disposed on the first sidewall, the first drainage area comprising a first side plate with a first overflow hole; a second drainage area is disposed on the second sidewall, the second drainage area comprising a second side plate with a second overflow hole; the second sidewall is further provided with a plurality of liquid outlet holes communicating with the second drainage area, the plurality of liquid outlet holes being lower in height than the first overflow hole and the second overflow hole; a third drainage area is disposed on the bottom plate, the third drainage area being in communication with the first drainage area and the second drainage area, respectively, for draining plating solution from the first drainage area to the second drainage area. The present invention facilitates both maintenance and replacement of plating solution by disposing the liquid outlet holes on the sidewalls.

Description

Technical Field

[0001] The present invention relates to the technical field of water electroplating, and in particular to an electroplating tank and an electroplating production line with a side wall drainage plating solution function. Background Art

[0002] With the development of technology, the demand for surface coating of flexible film substrates is increasing. In industrial production, water electroplating equipment is usually used to electroplate flexible film substrates. That is, water plating solution is configured according to the needs of various bodies and coatings, so that the flexible film substrate can be completed in a shorter time through the water plating solution.

[0003] Prior art electroplating equipment typically includes multiple plating tanks for supplying plating solution. Plating tanks are devices used to electroplate materials, utilizing the principles of electroplating to deposit metal on the surface of the material being plated, thereby achieving the purpose of electroplating. However, prior art requires the provision of both an outlet and an inlet to ensure the concentration of the plating solution during electroplating. Currently, the plating solution outlet of a plating tank is located at the bottom of the tank. For example, patent number CN114164478A, entitled "Horizontal Electroplating Equipment," has all its outlets located at the bottom of the tank, making it inconvenient to maintain. Summary of the Invention

[0004] In view of this, the purpose of the embodiments of the present invention is to provide an electroplating tank and an electroplating production line with the function of draining the plating liquid from the side walls, so as to solve the technical problem in the prior art that the liquid outlet of the electroplating tank is set at the bottom of the electroplating tank, which is inconvenient for maintenance.

[0005] To achieve the above-mentioned object, an embodiment of the present invention provides an electroplating tank with a sidewall drainage function for plating solution, the electroplating tank comprising:

[0006] A bottom plate, and a first side wall and a second side wall oppositely disposed on the bottom plate;

[0007] A first drainage area is provided on the first side wall, and the first drainage area includes a first side plate with a first overflow hole;

[0008] A second drainage area is provided on the second side wall, and the second drainage area includes a second side plate with a second overflow hole;

[0009] The second side wall is further provided with a plurality of liquid outlet holes, which are in communication with the second drainage area, and the height of the plurality of liquid outlet holes is lower than the height of the first overflow hole and the second overflow hole;

[0010] A third drainage area is provided on the bottom plate. The third drainage area is connected to the first drainage area and the second drainage area respectively, and is used to drain the plating solution in the first drainage area to the second drainage area.

[0011] In some possible implementations, the electroplating tank further includes: a third side wall and a fourth side wall,

[0012] The third drainage area is located on the third side wall and is arranged on the bottom plate in a U-shape together with the first drainage area and the second drainage area.

[0013] In some possible implementations, the liquid outlet is close to the fourth side wall.

[0014] In some possible implementations, the third drainage area is arranged on the bottom plate in an I-shape with the first drainage area and the second drainage area.

[0015] In some possible implementations, the liquid outlet is located on the second side wall at any one end or both ends away from the third drainage area.

[0016] In some possible implementations, the first overflow hole and the second overflow hole are both horizontally arranged strip-shaped holes, and are symmetrically arranged on the first side plate and the second side plate, respectively.

[0017] In some possible implementations, a plurality of liquid inlet holes are further provided on the second side wall, and the plurality of liquid inlet holes are respectively provided at both ends of the second side wall.

[0018] In some possible embodiments, one or more liquid inlet pipes are further provided on the bottom plate, and the liquid inlet pipes are respectively provided on both sides of the coating area, the liquid inlet pipes are communicated with the second drainage area, and a plurality of holes are provided on the sides of the liquid inlet pipes.

[0019] In some possible implementations, each of the liquid outlets is respectively provided with a liquid outlet valve, and each of the liquid inlet is respectively provided with a liquid inlet valve.

[0020] In the second aspect, an embodiment of the present invention provides an electroplating production line, which includes a number of electroplating tanks, several of which are connected in sequence, and each of which is provided with an anode mechanism, wherein the liquid inlet pipe at the liquid inlet end of the electroplating tank located at the head end of the electroplating production line is adjacent to the third drainage area.

[0021] The beneficial technical effects of the above technical solution are:

[0022] An embodiment of the present invention provides an electroplating tank and an electroplating production line with a sidewall drainage function for plating solution. The electroplating tank comprises: a bottom plate, and a first side wall and a second side wall disposed oppositely on the bottom plate; a first drainage area is disposed on the first side wall, the first drainage area comprising a first side plate with a first overflow hole; a second drainage area is disposed on the second side wall, the second drainage area comprising a second side plate with a second overflow hole; the second side wall is further provided with a plurality of liquid outlet holes communicating with the second drainage area, the plurality of liquid outlet holes being lower in height than the first overflow hole and the second overflow hole; a third drainage area is disposed on the bottom plate, the third drainage area being in communication with the first drainage area and the second drainage area, respectively, for draining the plating solution from the first drainage area to the second drainage area. The present invention facilitates maintenance and replacement of the plating solution by providing the liquid outlet holes on the side walls. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 Schematic diagram of the overall structure of a first electroplating tank according to an embodiment of the present invention;

[0025] Figure 2 Schematic diagram of the overall structure of a second electroplating tank according to an embodiment of the present invention;

[0026] Figure 3 This is a schematic structural diagram of a first side panel and a second side panel according to an embodiment of the present invention;

[0027] Figure 4 This is a structural schematic diagram of a first electroplating tank equipped with a liquid outlet valve according to an embodiment of the present invention;

[0028] Figure 5 This is a structural schematic diagram of a second electroplating tank equipped with a liquid outlet valve according to an embodiment of the present invention.

[0029] Description of Figure Numbers:

[0030] 1. Bottom plate; 11. Third drainage area; 12. Liquid inlet pipe; 13. Anode mechanism;

[0031] 2. First side wall; 21. First drainage area; 211. First side plate; 212. First overflow hole;

[0032] 3. Second side wall; 31. Second drainage area; 311. Second side plate; 312. Second overflow hole; 32. Liquid outlet hole; 321. Liquid outlet valve; 33. Liquid inlet hole; 331. Liquid inlet valve;

[0033] 4. The third side wall;

[0034] 5. The fourth side wall. DETAILED DESCRIPTION

[0035] The features and exemplary embodiments of various aspects of the present invention are described in detail below. In the detailed description that follows, many specific details are set forth in order to provide a comprehensive understanding of the present invention. However, it will be apparent to those skilled in the art that the present invention can be implemented without some of these specific details. The following description of the embodiments is intended only to provide a better understanding of the present invention by illustrating examples of the present invention. In the accompanying drawings and the following description, at least some of the well-known structures and techniques are not shown in order to avoid unnecessary ambiguity in the present invention; and, for clarity, the sizes of some structures may be exaggerated. In addition, the features, structures, or characteristics described below may be combined in any suitable manner in one or more embodiments.

[0036] Figure 1 Schematic diagram of the overall structure of the first electroplating tank according to an embodiment of the present invention, Figure 2 Schematic diagram of the overall structure of the second electroplating tank according to an embodiment of the present invention, Figure 3 Schematic diagram of the structure of the first side plate and the second side plate of the embodiment of the present invention. Figures 1 to 3 As shown, the electroplating tank includes: a bottom plate 1, and a first side wall 2 and a second side wall 3 relatively arranged on the bottom plate 1; a first drainage area 21 is provided on the first side wall 2, and the first drainage area 21 includes a first side plate 211 with a first overflow hole 212; a second drainage area 31 is provided on the second side wall 3, and the second drainage area 31 includes a second side plate 311 with a second overflow hole 312; a plurality of liquid outlet holes 32 are also provided on the second side wall 3, which are communicated with the second drainage area 31, and the heights of the plurality of liquid outlet holes 32 are lower than the heights of the first overflow hole 212 and the second overflow hole 312; a third drainage area 11 is provided on the bottom plate 1, and the third drainage area 11 is respectively communicated with the first drainage area 21 and the second drainage area 31, and is used to drain the plating solution in the first drainage area 21 to the second drainage area 31.

[0037] Specifically, the plating solution can enter the first drainage area 21 through the first overflow hole 212 on the first side plate 211, or enter the second drainage area 31 through the second overflow hole 312 on the second side plate 311. The plating solution in the first drainage area 21 is drained to the second drainage area 31 through the third drainage area 11, and then discharged through the plurality of liquid outlet holes 32 on the second side wall 3. In this embodiment of the present invention, overflow plating solution from the first drainage area 21 is drained to the second drainage area 31 through the third drainage area 11, thereby reducing the need for liquid outlet holes 32 and maintenance work. Furthermore, liquid discharge from the side facilitates maintenance and replacement of the plating solution.

[0038] like Figure 1 As shown, in some embodiments, the electroplating tank further includes: a third side wall 4 and a fourth side wall 5. It should be noted that when an electroplating device includes an electroplating tank, the electroplating tank has a third side wall 4 and a fourth side wall 5. When the electroplating device has multiple electroplating tanks, the multiple electroplating tanks are connected head to tail. At this time, the electroplating tank located at the head end of the electroplating equipment has a third side wall 4, the electroplating tank at the end has a fourth side wall 5, and the electroplating tank connected in the middle has a first side wall 2 and a second side wall 3.

[0039] In this embodiment, the electroplating equipment has a single electroplating tank. The third drainage area 11 is located on the third side wall 4 and is arranged on the bottom plate 1 in a U-shaped configuration with the first drainage area 21 and the second drainage area 31. The liquid outlet 32 ​​is located near the fourth side wall 5.

[0040] like Figure 2 As shown, in some embodiments, when the electroplating equipment has multiple electroplating tanks, the electroplating tank between the first and last electroplating tanks has only the first sidewall 2 and the second sidewall 3, and the third drainage area 11 is arranged in an I-shape with the first drainage area 21 and the second drainage area 31 on the bottom plate 1. In this case, the liquid outlet 32 ​​is located at either end or both ends of the second sidewall 3 away from the third drainage area 11.

[0041] like Figure 3 As shown, in some embodiments, the first overflow hole 212 and the second overflow hole 312 are both horizontally arranged strip-shaped holes, symmetrically arranged on the first side plate 211 and the second side plate 311. During electroplating, the membrane is flush with the first overflow hole 212 and the second overflow hole 312, facilitating the discharge of the plating solution beneath the membrane. By symmetrically arranging the first overflow hole 212 and the second overflow hole 312 on the first side plate 211 and the second side plate 311, embodiments of the present invention can maintain balanced discharge of the plating solution at the left and right ends of the electroplating tank.

[0042] like Figure 1 and Figure 2As shown, in some embodiments, the second side wall 3 is further provided with a plurality of liquid inlet holes 33, and the plurality of liquid inlet holes 33 are respectively provided at both ends of the second side wall 3. By providing the plurality of liquid inlet holes 33 at both ends of the second side wall 3, the embodiment of the present invention can maintain a balanced inflow of plating solution at the front and rear ends of the electroplating tank.

[0043] like Figure 4 and Figure 5 As shown, in some embodiments, one or more liquid inlet pipes 12 are further provided on the bottom plate 1. The liquid inlet pipes 12 are respectively provided on both sides of the coating area. The liquid inlet pipes 12 are communicated with the second drainage area 31, and a plurality of holes are provided on the side of the liquid inlet pipe 12. It should be noted that when the electroplating equipment has one electroplating tank, the liquid inlet pipe 12 is provided at the liquid inlet end and the liquid outlet end of the electroplating tank. The liquid inlet pipe 12 located at the liquid inlet end is adjacent to the third drainage area 11, which makes the structure of the electroplating tank compact and reduces the floor space of the electroplating tank. Of course, when the electroplating equipment has multiple electroplating tanks, the liquid inlet pipe 12 at the liquid inlet end of the electroplating tank at the head end is also adjacent to the third drainage area 11.

[0044] The embodiment of the present invention sets liquid inlet pipes 12 on both sides of the coating area in the electroplating tank, and slowly introduces liquid from a number of holes set on the side of the liquid inlet pipes 12. This not only ensures that the density of the plating solution in each part of the electroplating tank is the same, but also avoids the instability of the film in the plating solution caused by large-scale liquid inflow, thereby affecting the coating quality.

[0045] like Figure 4 and Figure 5 As shown, each liquid outlet 32 ​​is respectively installed with a liquid outlet valve 321, and each liquid inlet 33 is respectively provided with a liquid inlet valve 331. The embodiment of the present invention can control the inflow and outflow of plating solution of the electroplating equipment at any time through the liquid outlet valve 321 and the liquid inlet valve 331.

[0046] On the other hand, the present invention also provides an electroplating production line, which includes the above-mentioned several electroplating tanks, which are connected in sequence, and each electroplating tank is provided with an anode mechanism 13, wherein the liquid inlet pipe 12 at the liquid inlet end of the electroplating tank at the head end of the electroplating production line is adjacent to the third drainage area 11. The electroplating production line provided by the embodiment of the present invention can not only discharge liquid from the side, reducing the setting of the liquid outlet hole 32 to reduce maintenance work, but also facilitate maintenance and replacement of the plating solution. In addition, the electroplating production line of the present application has a compact structure, a reasonable design, and a small footprint.

[0047] The beneficial effects of the present invention are as follows:

[0048] In the embodiment of the present invention, the overflow plating solution of the first drainage area 21 is drained to the second drainage area 31 through the third drainage area 11, thereby reducing the number of liquid outlet holes 32 and reducing maintenance work. In addition, the liquid is discharged from the side, which is convenient for maintenance and replacement of the plating solution.

[0049] In the embodiment of the present invention, the first overflow hole 212 and the second overflow hole 312 are symmetrically arranged on the first side plate 211 and the second side plate 311, so that the plating solution outflow balance at the left and right ends of the electroplating tank can be maintained;

[0050] In the embodiment of the present invention, a plurality of liquid inlet holes 33 are provided at both ends of the second side wall 3, so that the plating liquid inflow balance at the front and rear ends of the electroplating tank can be maintained;

[0051] In the embodiment of the present invention, liquid inlet pipes 12 are provided on both sides of the coating area in the electroplating tank, and liquid is slowly introduced through a plurality of holes provided on the sides of the liquid inlet pipes 12. This not only ensures that the density of the plating solution in each part of the electroplating tank is the same, but also prevents large amounts of liquid from being introduced, which may cause the film to be unstable in the plating solution and affect the coating quality.

[0052] The embodiment of the present invention can control the inflow and outflow of plating solution of the electroplating equipment at any time through the liquid outlet valve 321 and the liquid inlet valve 331 .

[0053] In describing the embodiments of the present invention, it should be noted that the terms "upper, lower, inner, and outer" and other references to orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limitations on the present invention. Furthermore, the terms "first, second, or third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0054] In the embodiments of the present invention, unless otherwise specified or limited, the terms "mounted, connected, and connected" should be understood broadly. For example, they can refer to fixed connections, detachable connections, or integrated connections. They can also refer to mechanical connections, electrical connections, direct connections, indirect connections through an intermediate medium, or internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0055] While the present invention has been described with reference to preferred embodiments, various modifications may be made and equivalent components may be substituted without departing from the scope of the present invention. In particular, the various technical features described in the various embodiments may be combined in any manner, provided no structural conflicts exist. The present invention is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions within the scope of the claims.

Claims

1. An electroplating tank with sidewall drainage function, characterized in that: The electroplating tank comprises: A bottom plate (1), and a first side wall (2) and a second side wall (3) arranged opposite to the bottom plate (1); A first drainage area (21) is provided on the first side wall (2), and the first drainage area (21) comprises a first side plate (211) with a first overflow hole (212); A second drainage area (31) is provided on the second side wall (3), and the second drainage area (31) includes a second side plate (311) with a second overflow hole (312); The second side wall (3) is further provided with a plurality of liquid outlet holes (32) which are in communication with the second drainage area (31); the height of the plurality of liquid outlet holes (32) is lower than the height of the first overflow hole (212) and the second overflow hole (312); A third drainage area (11) is provided on the bottom plate (1), and the third drainage area (11) is respectively connected to the first drainage area (21) and the second drainage area (31), and is used for draining the plating solution in the first drainage area (21) to the second drainage area (31); The electroplating tank further comprises: a third side wall (4) and a fourth side wall (5); The third drainage area (11) is located on the third side wall (4), and is arranged on the bottom plate (1) in a U-shaped manner together with the first drainage area (21) and the second drainage area (31); the liquid outlet (32) is close to the fourth side wall (5); One or more liquid inlet pipes (12) are also provided on the bottom plate (1), and the liquid inlet pipes (12) are respectively provided on both sides of the coating area. The liquid inlet pipes (12) are communicated with the second drainage area (31), and a plurality of holes are provided on the side of the liquid inlet pipe (12).

2. The electroplating tank with sidewall drainage function according to claim 1, characterized in that: The third drainage area (11), the first drainage area (21) and the second drainage area (31) are arranged on the bottom plate (1) in an I-shape.

3. The electroplating tank with sidewall drainage function according to claim 2, characterized in that: The liquid outlet hole (32) is located on the second side wall (3) at any one end or both ends away from the third drainage area (11).

4. The electroplating tank with sidewall drainage function according to claim 1, characterized in that: The first overflow hole (212) and the second overflow hole (312) are both horizontally arranged strip-shaped holes, and are symmetrically arranged on the first side plate (211) and the second side plate (311), respectively.

5. The electroplating tank with sidewall drainage function according to claim 1, characterized in that: A plurality of liquid inlet holes (33) are also provided on the second side wall (3), and the plurality of liquid inlet holes (33) are respectively provided at both ends of the second side wall (3).

6. The electroplating tank with sidewall drainage function according to claim 5, characterized in that: Each of the liquid outlet holes (32) is respectively provided with a liquid outlet valve (321), and each of the liquid inlet holes (33) is respectively provided with a liquid inlet valve (331).

7. An electroplating production line, characterized in that: The electroplating production line comprises a plurality of electroplating tanks according to any one of claims 1 to 6, wherein the plurality of electroplating tanks are connected in sequence, and an anode mechanism (13) is provided in each of the electroplating tanks, wherein the liquid inlet pipe (12) at the liquid inlet end of the electroplating tank at the head end of the electroplating production line is adjacent to the third drainage area (11).

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