Powder supply device and coating system

Abstract

This invention provides a powder supply device and a plating system that minimizes powder scattering. The powder supply device provides a powder supply apparatus for supplying powder containing a metal used in plating to a plating solution. The powder supply apparatus includes: a plating solution tank configured to receive the plating solution; an input pipe for inputting powder into the plating solution tank; a gas supply line for supplying gas; and a spiral airflow generating member configured to receive gas from the gas supply line and generate a spiral airflow toward the plating solution tank inside the input pipe.

Description

[0001] This application is a divisional application of the invention patent application filed on December 24, 2018, with application number 201811585813.6 and invention title "Powder Supply Device and Coating System". Technical Field

[0002] This invention relates to a powder supply device and a coating system. Background Technology

[0003] Conventionally, wiring is formed in fine trenches, holes, or resist openings on the surface of substrates such as semiconductor wafers, or bumps (protruding electrodes) are formed on the substrate surface to electrically connect with packaged electrodes. Known methods for forming these wirings and bumps include electroplating, vapor deposition, printing, and the ballbump method. However, with the increase in the number of I / Os and the miniaturization of semiconductor chips, electroplating, which allows for miniaturization and offers more stable performance, is increasingly used.

[0004] In electroplating apparatus, an anode and a substrate are typically arranged opposite each other in a plating tank containing the plating solution, and a voltage is applied to the anode and the substrate. As a result, a plating film is formed on the surface of the substrate.

[0005] Conventionally, either dissolved anodes or insoluble anodes that do not dissolve in the plating solution are used as anodes in electroplating apparatuses. When using insoluble anodes for plating, metal ions in the plating solution are consumed as plating progresses. Therefore, it is necessary to periodically replenish the plating solution with metal ions to adjust the concentration of metal ions in the plating solution. Therefore, an apparatus is known for dissolving metal powder in a plating solution held in a plating solution tank separate from the plating tank and supplying the plating solution to the plating tank (see, for example, Patent Document 1).

[0006] Existing technical documents

[0007] Patent documents

[0008] Patent Document 1: Japanese Patent Application Publication No. 2017-141503 Summary of the Invention

[0009] Previously, when metal powder was added to the plating solution tank, there was a risk of powder scattering outside the device and contaminating the cleanroom. To prevent cleanroom contamination, conventional devices were placed in separate spaces, such as the floor below the cleanroom. However, in situations where a separate space cannot be prepared, there is a desire to place the device within the cleanroom. Furthermore, even if powder scattering is contained within the device, there is still a problem of wasted powder that cannot be added to the plating solution tank.

[0010] The present invention was made in view of the above-mentioned problems, and one of its objects is to provide a powder supply device that prevents powder from scattering as much as possible.

[0011] According to one aspect of the present invention, a powder supply device is provided for supplying powder containing a metal used in plating to a plating solution. The powder supply device includes: a plating solution tank configured to receive the plating solution; an input pipe for inputting the powder into the plating solution tank; a gas supply line for supplying gas; and a spiral airflow generating member configured to receive gas from the gas supply line and generate a spiral airflow toward the plating solution tank inside the input pipe.

[0012] According to another aspect of the present invention, a powder supply device is provided for supplying powder containing a metal used in plating to a plating solution. The powder supply device includes: a plating solution tank configured to receive the plating solution; an input pipe for inputting the powder into the plating solution tank; and a liquid curtain generating component for generating a cylindrical liquid curtain of the plating solution that covers the outlet of the input pipe.

[0013] According to another aspect of the present invention, a powder supply device is provided for supplying powder containing a metal used in plating to a plating solution. The powder supply device includes: a plating solution tank configured to receive the plating solution; and a hopper for receiving the powder. The hopper has: an inlet for feeding the powder into the hopper; and an outlet for discharging gas from the hopper. The powder supply device further includes: a first scattering prevention member configured to prevent the powder from scattering through the gap between the inlet and an inlet nozzle for feeding the powder into the inlet; and a second scattering prevention member configured to prevent the powder from scattering through the outlet.

[0014] According to another aspect of the present invention, a plating system is provided. The plating system includes: one of the aforementioned powder supply devices; a plating tank for plating a substrate; and a plating liquid supply pipe extending from the plating liquid tank of the aforementioned powder supply device to the aforementioned plating tank. Attached Figure Description

[0015] Figure 1 This is a schematic diagram showing the overall plating system of this embodiment.

[0016] Figure 2 This is a side view of a powder container that can hold copper oxide powder inside.

[0017] Figure 3 This is a side view showing a part of the powder supply device.

[0018] Figure 4 yes Figure 3The enlarged 3D view of the interior of the enclosure shown.

[0019] Figure 5A This is a three-dimensional view of the spiral airflow generating component.

[0020] Figure 5B This is a side sectional view of the spiral airflow generating component.

[0021] Figure 6 This is a side view showing the outlet opening end of the input piping in this embodiment.

[0022] Figure 7A This is a perspective view showing an example of a liquid curtain generating component.

[0023] Figure 7B yes Figure 7A The side sectional view of the liquid curtain generating component shown.

[0024] Figure 7C This is a schematic diagram showing the shape of the outlet of the liquid curtain generating component.

[0025] Figure 8A This is a perspective view showing other examples of liquid curtain generating components.

[0026] Figure 8B yes Figure 8A The side sectional view of the liquid curtain generating component shown.

[0027] Figure 9 This is an enlarged side view of the area near the hopper lid.

[0028] Figure 10 This is a 3D view of the second anti-scattering component.

[0029] Figure 11 This is a 3D view of the first anti-scattering component.

[0030] Figure 12 This is a three-dimensional view of the hopper before the first anti-scattering component comes into contact with the hopper's inlet.

[0031] Figure 13 This is a three-dimensional view of the hopper after the first anti-scattering component comes into contact with the hopper's inlet.

[0032] Explanation of reference numerals in the attached figures

[0033] 2…plating tank

[0034] 20…Powder feeding device

[0035] 29…Pipeline put into operation

[0036] 29a…Inlet opening end

[0037] 29b…exit opening end

[0038] 30…Feeder

[0039] 33… Hopper

[0040] 35… Coating solution tank

[0041] 42…exhaust port

[0042] 44…Inert gas supply pipeline

[0043] 46…Powder delivery tube

[0044] 46a… Nozzle

[0045] 50… Spiral airflow generating component

[0046] 51… Cylindrical component

[0047] 53…First end

[0048] 54…Second end

[0049] 55… slot

[0050] 56… Circumferential layer difference section

[0051] 60…Liquid curtain generating component

[0052] 62…First cylindrical section

[0053] 63…Second cylindrical section

[0054] 64…Entrance

[0055] 65…discharge outlet

[0056] 66… Week 1 Flow Path

[0057] 67…Axial flow path

[0058] 68… Week 2 flow path

[0059] 69…Discharge flow path

[0060] 70…Second scattering prevention component

[0061] 72… filter

[0062] 74…First Flying Prevention Component

[0063] 80… intermediate nozzle

[0064] 82… Nozzle section Detailed Implementation

[0065] Embodiments of the present invention will now be described with reference to the accompanying drawings. In the drawings described below, the same or equivalent structural elements are labeled with the same reference numerals and repeated descriptions are omitted. Figure 1 This is a schematic diagram showing the overall plating system of this embodiment. The plating system includes: a plating apparatus 1 installed in a clean room; and a powder supply device 20 installed in a downstairs room. In this embodiment, the powder supply device 20 may also be installed in the clean room in the same way as the plating apparatus 1.

[0066] In this embodiment, the plating apparatus 1 is an electroplating unit for electroplating metals such as copper onto substrates such as wafers, and the powder supply apparatus 20 is an apparatus for supplying powder containing at least a metal to the plating solution used in the plating apparatus 1. In this embodiment, copper oxide powder is described as an example of using copper oxide powder as a powder containing at least a metal. In addition, the average particle size of the copper oxide powder in this embodiment is, for example, 10 micrometers to 200 micrometers. In this specification, "powder" includes objects of any shape that may be dispersed, such as solid particles, shaped granules, solid objects shaped into granules, solid spheres formed into small-diameter spheres, strips or strands of solid metal shaped into strips, or mixtures of some combination thereof.

[0067] The plating apparatus 1 of this embodiment has four plating tanks 2. The plating apparatus 1 can have any number of plating tanks 2. Each plating tank 2 has an inner tank 5 and an outer tank 6. An insoluble anode 8 held by an anode holder 9 is disposed in the inner tank 5. A neutral film (not shown) is disposed around the insoluble anode 8 in the plating tank 2. The inner tank 5 is filled with plating liquid, and the plating liquid overflowing from the inner tank 5 flows into the outer tank 6. In addition, a stirrer (not shown) for stirring the plating liquid can be provided in the inner tank 5. The substrate W is held by a substrate holder 11 and is immersed in the plating liquid in the inner tank 5 together with the substrate holder 11. In addition, a semiconductor substrate, a printed wiring board, etc. can be used as the substrate W.

[0068] The insoluble anode 8 is electrically connected to the positive terminal of the plating power supply 15 via the anode holder 9, and the substrate W, held by the substrate holder 11, is electrically connected to the negative terminal of the plating power supply 15 via the substrate holder 11. When a voltage is applied between the insoluble anode 8 immersed in the plating solution and the substrate W through the plating power supply 15, an electrochemical reaction occurs in the plating solution contained in the plating tank 2, and copper is deposited on the surface of the substrate W. In this way, the surface of the substrate W is plated with copper.

[0069] The plating apparatus 1 includes a plating control unit 17 for controlling the plating process of the substrate W. This plating control unit 17 has the function of calculating the concentration of copper ions in the plating solution within the plating tank 2 based on the cumulative value of the current flowing through the substrate W. Specifically, as the substrate W is plated, copper in the plating solution is consumed. The amount of copper consumed is proportional to the cumulative value of the current flowing through the substrate W. The plating control unit 17 can estimate the concentration of copper ions in the plating solution in each plating tank 2 based on the amount of copper added to the plating solution and the cumulative value of the current (copper consumption).

[0070] The powder supply device 20 includes a sealed chamber 24, a hopper 33, a feeder 30, a motor 31, a plating solution tank 35, and an operation control unit 32. A powder container 21 containing copper oxide powder is fed into the sealed chamber 24. The hopper 33 receives the copper oxide powder supplied from the powder container 21. The feeder 30 is configured to convey powder located at the bottom of the hopper 33. The motor 31 is the drive source for the feeder 30. The plating solution tank 35 is configured to receive the plating solution and the copper oxide powder conveyed by the feeder 30. The operation control unit 32 controls the operation of the motor 31.

[0071] The plating apparatus 1 and the powder supply apparatus 20 are connected via a plating solution supply pipe 36 and a plating solution return pipe 37. More specifically, the plating solution supply pipe 36 extends from the plating solution tank 35 to the bottom of the inner tank 5 of the plating tank 2. The plating solution supply pipe 36 branches into four branch pipes 36a, which are respectively connected to the bottom of the inner tank 5 of the four plating tanks 2. A flow meter 38 and a flow regulating valve 39 are respectively provided on the four branch pipes 36a. The flow meter 38 and the flow regulating valve 39 are communicatively connected to the plating control unit 17. The plating control unit 17 is configured to control the opening of the flow regulating valve 39 based on the flow rate of the plating solution measured by the flow meter 38. Therefore, the flow rate of the plating solution supplied to each plating tank 2 via the four branch pipes 36a is controlled by the flow regulating valve 39 located on the upstream side of each plating tank 2, so that their flow rates are approximately the same. The plating solution return pipe 37 extends from the bottom of the outer tank 6 of the plating tank 2 to the plating solution tank 35. The plating solution return pipe 37 has four discharge pipes 37a that are respectively connected to the bottom of the four outer tanks 6 of the plating tank 2.

[0072] A pump 25 for transferring the plating solution and a filter 26 disposed downstream of the pump 25 are provided on the plating solution supply pipe 36. The plating solution used in the plating apparatus 1 is transported to the plating solution tank 35 of the powder supply device 20 through the plating solution return pipe 37. The plating solution with copper oxide powder added by the powder supply device 20 is transported to the plating apparatus 1 through the plating solution supply pipe 36. The pump 25 enables the plating solution to circulate continuously between the plating apparatus 1 and the powder supply device 20. Alternatively, a predetermined amount of plating solution can be intermittently supplied from the plating apparatus 1 to the powder supply device 20, and the plating solution with copper oxide powder added can be intermittently returned from the powder supply device 20 to the plating apparatus 1.

[0073] Furthermore, a pure water supply line 22 is connected to the plating solution tank 35 to replenish the plating solution with pure water (DIW: Deionized Water). This pure water supply line 22 is equipped with an on / off valve 23 for stopping the pure water supply when the plating device 1 is stopped, a flow meter 28 for measuring the flow rate of the pure water, and a flow regulating valve 27 for adjusting the flow rate of the pure water. The on / off valve 23 is normally open. The flow meter 28 and the flow regulating valve 27 are communicatively connected to the plating control unit 17. The configuration is such that if the copper ion concentration in the plating solution exceeds a set value, the plating control unit 17 controls the opening of the flow regulating valve 27 to supply pure water to the plating solution tank 35 in order to dilute the plating solution.

[0074] The plating control unit 17 is communicatively connected to the operation control unit 32 of the powder supply device 20. Configured such that when the copper ion concentration in the plating solution is lower than a set value, the plating control unit 17 sends a signal indicating a replenishment requirement to the operation control unit 32 of the powder supply device 20. The powder supply device 20 receives this signal and adds copper oxide powder to the plating solution until the amount of copper oxide powder added reaches the replenishment requirement. In this embodiment, the plating control unit 17 and the operation control unit 32 are configured as different devices, but in one embodiment, the plating control unit 17 and the operation control unit 32 may also be configured as a single control unit. In this case, the control unit may be a computer that operates according to a program. This program may be stored in a storage medium.

[0075] The plating apparatus 1 may also include a concentration measuring device 18a for measuring the concentration of copper ions in the plating solution. The concentration measuring device 18a is installed on four discharge pipes 37a of the plating solution return pipe 37. The measured value of the copper ion concentration obtained by the concentration measuring device 18a is sent to the plating control unit 17. The plating control unit 17 may compare the copper ion concentration in the plating solution calculated based on the cumulative value of the current with the aforementioned set value, or it may compare the copper ion concentration measured by the concentration measuring device 18a with the aforementioned set value. The plating control unit 17 may also correct the calculated value of the copper ion concentration based on a comparison between the copper ion concentration in the plating solution calculated based on the cumulative value of the current (i.e., the estimated value of the copper ion concentration) and the copper ion concentration measured by the concentration measuring device 18a (i.e., the measured value of the copper ion concentration).

[0076] Alternatively, a branch pipe 36b can be provided to the plating solution supply pipe 36, and a concentration meter 18b can be installed on this branch pipe 36b to monitor the concentration of copper ions in the plating solution. Furthermore, an analytical device (such as a CVS device, colorimeter, etc.) can be installed on this branch pipe 36b to quantitatively analyze and monitor not only the solubility of copper ions but also the solubility of various chemical components. This allows for the analysis of the concentration of chemical components, such as impurities, present in the plating solution supply pipe 36 before supplying plating solution to each plating tank 2. As a result, impurities can be prevented from affecting plating performance, leading to a more precise plating process. Alternatively, only one of the concentration meters 18a and 18b may be installed.

[0077] Figure 2 This is a side view showing the powder container 21 capable of holding copper oxide powder inside. (See attached image.) Figure 2 As shown, the powder container 21 includes: a container body 45 capable of containing copper oxide powder; a powder conduit 46 (equivalent to an example of an injection nozzle) connected to the container body 45; and a valve 48 installed on the powder conduit 46. The container body 45 is made of synthetic resin such as polyethylene. A handle 49 is formed on the container body 45, allowing the operator to grasp the handle 49 to move the powder container 21.

[0078] The powder conduit 46 is engaged with the container body 45. The powder conduit 46 is inclined at an angle of approximately 30 degrees relative to the vertical direction. When the valve 48 installed on the powder conduit 46 is opened, copper oxide powder can pass through the powder conduit 46; when the valve 48 is closed, copper oxide powder cannot pass through the powder conduit 46. Figure 2 The diagram shows valve 48 in the closed state. Powder conduit 46 has a nozzle 46a at its front end. A cap 47 is mounted on nozzle 46a.

[0079] Next, a detailed explanation will be given. Figure 1 The powder supply device 20 shown. Figure 3 This is a side view showing a portion of the powder supply device 20. The sealed cavity 24 of the powder supply device 20 is omitted in the figure. As shown, the hopper 33 is a powder reservoir, containing copper oxide powder supplied from the powder container 21. The hopper 33 is generally frustum-shaped, allowing the copper oxide powder to flow downwards easily. The upper opening of the hopper 33 is covered by a cover 41. The cover 41 has an inlet 19 for feeding copper oxide powder from the powder container 21. The outlet 42 communicates with the internal space of the hopper 33 and is connected to a negative pressure source (not shown). Therefore, the hopper 33 discharges gas through the outlet 42.

[0080] The feeder 30 communicates with an opening located at the bottom of the hopper 33. The feeder 30 is configured to extend from the opening at the bottom of the hopper 33 toward the feed pipe 29 (described later). Figure 4 The feeder 30 is a screw feeder with a spiral 30a, but it is not limited to this and any conveying device can be used. The motor 31 is connected to the feeder 30 to drive the feeder 30. The hopper 33 and the feeder 30 are fixed on the bracket 34, and the bracket 34 is supported on the weight measuring device 40. That is, the weight measuring device 40 is configured to measure the total weight of the hopper 33, the feeder 30, the motor 31, and the copper oxide powder present inside the hopper 33 and the feeder 30.

[0081] The outlet 30b of the feeder 30 is surrounded by a containment shroud 43. When the motor 31 drives the feeder 30, the copper oxide powder in the hopper 33 is conveyed through the feeder 30 into the containment shroud 43 and falls into the plating solution tank 35. The outlet 30b of the feeder 30 is located inside the containment shroud 43. Additionally, the powder supply device 20 has an inert gas supply line 44 (equivalent to an example of a gas supply line). The inert gas supply line 44 passes through the containment shroud 43 and connects to the spiral airflow generating component 50 (see below). Figure 4 )connect.

[0082] The weight measuring device 40 is communicatively connected to the motion control unit 32 that controls the movement of the motor 31. The measured weight value output from the weight measuring device 40 can be sent to the motion control unit 32. The motion control unit 32 receives data from the plating apparatus 1 (see reference 1). Figure 1 The signal sent indicates the replenishment requirement value, causing motor 31 to operate until the amount of copper oxide powder added reaches the replenishment requirement value. Motor 31 drives feeder 30, which adds the amount of copper oxide powder corresponding to the replenishment requirement value to plating solution tank 35.

[0083] exist Figure 3In the powder supply device 20 shown, as described above, the weight of the feeder 30 is measured by the weight measuring device 40. Therefore, the area near the outlet 30b of the feeder 30 is configured not to contact the surrounding cover 43. That is, a gap is formed between the area near the outlet 30b of the feeder 30 and the surrounding cover 43. When copper oxide powder falls from the outlet 30b of the feeder 30 into the plating solution tank 35, the copper oxide powder may scatter through this gap. The powder supply device 20 of this embodiment has a structure to suppress this scattering.

[0084] Figure 4 yes Figure 3 An enlarged perspective view of the interior of the enclosure 43 is shown. Figure 4 As shown, the enclosure 43 has an opening 43a on its side for inserting the feeder 30. Since the feeder 30 does not contact the enclosure 43, copper oxide powder may scatter from the gap between the opening 43a and the feeder 30. The powder supply device 20 has a flow path from the inside of the enclosure 43 towards... Figure 1 and Figure 3 The plating solution tank 35 shown has an input pipe 29 extending vertically. The input pipe 29 is preferably made of ultra-high molecular weight polyethylene material to prevent electrostatic charging. The input pipe 29 has an inlet opening 29a for powder input and an outlet opening 29b for powder discharge (see below). Figure 6 ). Inlet opening end 29a as Figure 4 It is configured with an upward opening as shown. Thus, the copper oxide powder conveyed by the feeder 30 falls from the outlet 30b of the feeder 30, passes through the inlet pipe 29, and is put into the plating solution tank 35.

[0085] In this embodiment, a spiral airflow generating component 50 is provided to suppress the scattering of copper oxide powder, which is configured to generate a spiral airflow inside the input pipe 29. The spiral airflow generating component 50 receives inert gas from the inert gas supply pipe 44 and generates a spiral airflow toward the plating liquid tank 35.

[0086] Figure 5A This is a three-dimensional view of the spiral airflow generating component 50. Figure 5B This is a side sectional view of the spiral airflow generating component 50. (See image.) Figure 5A As shown, the spiral airflow generating component 50 is installed at the inlet opening end 29a of the input piping 29. Figure 5A and Figure 5B As shown, the spiral airflow generating component 50 has: a generally cylindrical cylindrical component 51; and an annular component 52 mounted on or integrally formed with the cylindrical component 51. Furthermore, in Figure 5A In the diagram, the annular component 52 and the insertion pipe 29 are shown in cross-section.

[0087] like Figure 5A As shown, with the spiral airflow generating component 50 installed in the inlet pipe 29, the outer surface 51a of the cylindrical component 51 is configured to contact the inner surface of the inlet pipe 29. The cylindrical component 51 has a first end 53 (lower end in the figure) located on the side of the plating liquid tank 35, and a second end 54 (upper end in the figure) on the opposite side. In this embodiment, the cylindrical component 51 is partially inserted into the interior of the inlet pipe 29, and is arranged such that the second end 54 protrudes from the inlet pipe 29.

[0088] The cylindrical member 51 has one or more grooves 55 extending from the first end 53 toward the second end 54 on its outer surface 51a. In other words, the grooves 55 may or may not reach the second end 54, at least reaching the first end 53. In this embodiment, a plurality of grooves 55 are formed on the outer surface 51a. As shown, the grooves 55 are configured to be inclined relative to the axial direction of the cylindrical member 51. Each groove 55 is configured to be inclined at the same angle to each other. Furthermore, it is desirable that the angle, width, and depth of the grooves 55 be appropriately set according to the inner diameter or length of the insertion pipe 29, etc. When the cylindrical member 51 is partially inserted into the interior of the insertion pipe 29, multiple flow paths inclined relative to the axial direction of the cylindrical member 51 are divided by the grooves 55 of the cylindrical member 51 and the inner surface of the insertion pipe 29.

[0089] Furthermore, the cylindrical member 51 has a circumferentially extending layer 56. In this embodiment, the circumferentially extending layer 56 is formed at the second end 54 of the cylindrical member 51. Thus, a circumferential gas flow path 58 communicating with the groove 55 is defined by the cylindrical member 51 and the annular member 52 (see reference). Figure 5B The annular component 52 has a gas inlet 57 on its upper surface (the upper side of the figure) for connection to the inert gas supply line 44. The gas inlet 57 communicates with the circumferential gas flow path 58 of the cylindrical component 51.

[0090] Next, the function of the spiral airflow generating component 50 will be explained. When inert gas is supplied from the inert gas supply line 44 to the gas injection port 57, the inert gas passes through the circumferential gas flow path 58 and reaches each of the multiple slots 55. This allows the pressure of the inert gas passing through the slots 55 to be uniform. The inert gas passes through the slots 55 and is discharged from the first end 53 of the cylindrical component 51 into the input pipe 29. At this time, since the slots 55 are inclined axially relative to the cylindrical component 51, a spiral airflow (spiral airflow) is generated in the input pipe 29 by the inert gas. The spiral airflow generated in the input pipe 29 introduces air from the surrounding shroud 43 into the input pipe 29 while being discharged from the outlet opening end 29b of the input pipe 29 (see below). Figure 6The copper oxide powder present in the ambient gas within the enclosure 43 is introduced into the feed pipe 29, thereby suppressing the dispersion of copper oxide powder. Furthermore, the spiral airflow generated within the feed pipe 29 prevents copper oxide powder passing through the inside of the feed pipe 29 from contacting the inner wall surface of the feed pipe 29. This prevents copper oxide powder from adhering to the inner wall surface of the feed pipe 29.

[0091] As explained above, in this embodiment, a spiral airflow can be generated inside the feed pipe 29 by means of the spiral airflow generating member 50, thereby suppressing the scattering of powder within the enclosure 43. Furthermore, according to this embodiment, powder adhesion to the feed pipe 29 can be suppressed.

[0092] In this embodiment, the cylindrical component 51 has a groove 55 on its outer surface 51a, and a spiral airflow is generated by supplying gas to the groove 55. Therefore, the spiral airflow generating component 50 according to this embodiment can generate a spiral airflow with a very simple structure. Furthermore, in this embodiment, the inert gas supply pipe 44 is connected to the gas injection port 57, and the inert gas is directly supplied to the input pipe 29 via the spiral airflow generating component 50. When inert gas is supplied into the space inside the enclosure 43, powder of the ambient gas present inside the enclosure 43 may disperse. Therefore, in this embodiment, compared to supplying inert gas into the space inside the enclosure 43, the dispersion of powder inside the enclosure 43 can be suppressed.

[0093] For example, if the spiral airflow generating component 50 is located at the middle of the feed pipe 29 along its length, no spiral airflow will be generated inside the feed pipe 29 on the side closer to the inlet opening end 29a than the spiral airflow generating component 50. In this case, powder may adhere to the inner wall of the feed pipe 29 on the side closer to the inlet opening end 29a than the spiral airflow generating component 50. In this embodiment, the spiral airflow generating component 50 is located at the inlet opening end 29a of the feed pipe 29. This allows a spiral airflow to be generated throughout the feed pipe 29, thereby suppressing powder adhesion to the entire interior of the feed pipe 29.

[0094] In this embodiment, inert gas is supplied to the feed line 29. When the plating solution stored in the plating solution tank 35 is maintained at a high temperature (e.g., approximately 45°C), vapor will be generated from the plating solution. This vapor rises within the feed line 29 and reaches the interior of the enclosure 43, potentially intruding into the feeder 30. When the vapor adsorbs onto the copper oxide powder within the feeder 30, there is a risk of copper oxide powder agglomeration causing blockage of the feeder 30. Therefore, by supplying inert gas to the feed line 29, the intrusion of plating solution vapor into the feeder 30 can be prevented.

[0095] Next, the structure for suppressing the scattering of copper oxide powder near the end of the plating solution tank 35 on the side of the input piping 29 will be explained. Figure 6 This is a side view showing the outlet opening end 29b of the input piping 29 in this embodiment. (See attached image.) Figure 6 As shown, the feed pipe 29 has an outlet opening end 29b. When the inert gas from the inert gas supply line 44 exits from the outlet opening end 29b of the feed pipe 29, it diffuses due to the pressure difference between the inside and outside of the feed pipe 29. Therefore, the copper oxide powder fed into the feed pipe 29 may be scattered due to the diffusion of the inert gas and may adhere to the wall of the plating solution tank 35. Thus, in this embodiment, as... Figure 6 As shown, a liquid curtain generating component 60 generates a cylindrical liquid curtain of plating solution in a manner that covers the outlet of the inlet pipe 29. A plating solution supply line 61 is connected to the liquid curtain generating component 60 to supply plating solution. The plating solution supply line 61 can, for example, be connected to... Figure 1 The plating solution return pipe 37 shown can also be configured to extract the plating solution from the plating solution tank 35 via a pump or the like and supply it to the liquid curtain generating unit 60.

[0096] Next, the detailed structure of the liquid curtain generating component 60 will be explained. Figure 7A This is a perspective view showing an example of a liquid curtain generating component 60. Figure 7B yes Figure 7A The side sectional view of the liquid curtain generating component 60 shown. Figure 7C This is a schematic diagram showing the shape of the outlet of the liquid curtain generating component 60. (Example) Figure 7A and Figure 7B As shown, the liquid curtain generating component 60 is a ring-shaped component, configured to be installed on the outer circumferential surface of the input piping 29. (As shown...) Figure 7B As shown in detail, the liquid curtain generating component 60 has a first cylindrical portion 62 and a second cylindrical portion 63 located outside the first cylindrical portion 62. The second cylindrical portion 63 has an inlet 64 for supplying plating solution to the liquid curtain generating component 60. In addition, an outlet 65 for discharging the plating solution in a liquid curtain manner is formed between the first cylindrical portion 62 and the second cylindrical portion 63. Alternatively, the inlet 64 may also be formed in the first cylindrical portion 62.

[0097] A flow path for the plating solution is formed between the inlet 64 and the outlet 65. In this embodiment, the flow path consists of a first circumferential flow path 66, an axial flow path 67, a second circumferential flow path 68, and an outlet flow path 69. The first circumferential flow path 66 is formed circumferentially between the first cylindrical portion 62 and the second cylindrical portion 63 and communicates with the inlet 64. The axial flow path 67 communicates with the first circumferential flow path 66. In this embodiment, multiple axial flow paths 67 are arranged at approximately equal intervals along the circumference of the liquid curtain generating member 60. The second circumferential flow path 68 is formed circumferentially between the first cylindrical portion 62 and the second cylindrical portion 63 and communicates with each axial flow path 67. The second circumferential flow path 68 is configured to allow the plating solution to flow not only circumferentially but also radially outward. The discharge flow path 69 is radially connected to the outer side of the second circumferential flow path 68, thus fluidly connecting the second circumferential flow path 68 and the discharge port 65. Furthermore, here, axial direction refers to the direction of the central axis of the first cylindrical portion 62 and the second cylindrical portion 63.

[0098] like Figure 7C As shown, in this embodiment, the outlet 65 extends circumferentially between the first cylindrical portion 62 and the second cylindrical portion 63. In other words, the outlet 65 has a generally annular cross-section as a whole. Furthermore, Figure 7C The shape of the liquid curtain generating component 60 in a cross-section orthogonal to the axial direction is shown. The outlet 65 has: a first portion 65a having a first radial width; and a second portion 65b having a second radial width larger than the first radial width. Specifically, the first portion 65a is generally fan-shaped, and the second portion 65b is generally circular. Furthermore, here, fan-shaped refers to a shape surrounded by two radii of a circle and two arcs between the two radii. In this embodiment, the outlet 65 is composed of a plurality of first portions 65a and a plurality of second portions 65b, forming a generally annular cross-section as a whole. In other words, the outlet 65 is configured such that the generally fan-shaped first portions 65a connect the generally circular second portions 65b. Figure 7C As shown, preferably, a plurality of second portions 65b are arranged at approximately equal intervals along the circumferential direction.

[0099] illustrate Figures 7A to 7C The function of the liquid curtain generating component 60 shown. When from... Figure 6When the plating solution supply line 61 supplied the plating solution to the inlet 64 of the liquid curtain generating component 60, the plating solution passed through the first circumference flow path 66 and spread throughout the entire circumference of the liquid curtain generating component 60. The plating solution spread throughout the entire circumference then moved axially through multiple axial flow paths 67. As a result, the flow direction of the plating solution changed. Next, the plating solution that had passed through the axial flow path 67 passed through the second circumference flow path 68 and again spread throughout the entire circumference of the liquid curtain generating component 60. At this time, the pressure of the plating solution was distributed approximately uniformly throughout the entire circumference of the liquid curtain generating component 60. The plating solution that reached the second circumference flow path 68 passed through the second circumference flow path 68 and flowed outward in both the circumferential and radial directions, reaching the discharge flow path 69. The plating solution that reached the discharge flow path 69 passed through the outlet 65 and generated a generally cylindrical liquid curtain of plating solution.

[0100] The liquid curtain generating component 60 described above can generate a cylindrical liquid curtain of plating solution covering the outlet of the feed pipe 29. This prevents copper oxide powder from scattering and adhering to the wall of the plating solution tank 35 due to the diffusion of inert gas when discharged from the feed pipe 29. In this embodiment, inert gas is supplied to the feed pipe 29, but even without supplying inert gas, copper oxide powder discharged from the feed pipe 29 may still adhere to the wall of the plating solution tank 35. Specifically, for example, when copper oxide powder collides with the plating solution surface, it may scatter along with the plating solution and adhere to the wall of the plating solution tank 35. Therefore, the liquid curtain generating component 60 of this embodiment can suppress the scattering of copper oxide powder when it collides with the plating solution surface even without supplying inert gas to the feed pipe 29.

[0101] Furthermore, the liquid curtain generating component 60 has a discharge port 65 comprising a first portion 65a and a second portion 65b. When the discharge port 65 is a simple annular shape with a fixed width, it is difficult to generate a continuous liquid curtain of plating solution. Additionally, when the discharge port 65 is constructed by arranging multiple axial flow paths spaced apart circumferentially, a spray-like discharge of plating solution occurs, making it difficult to generate a liquid curtain of plating solution. Since the discharge port 65 of this embodiment comprises a first portion 65a and a second portion 65b, a continuous liquid curtain of plating solution can be generated stably. Furthermore, the discharge port 65 has multiple second portions 65b spaced approximately equally circumferentially, thereby enabling a more stable generation of a continuous liquid curtain of plating solution.

[0102] The liquid curtain generating component 60 of this embodiment has a first circumferential flow path 66 and an axial flow path 67, thus enabling the plating liquid supplied from the inlet 64 to immediately spread throughout the entire circumference of the liquid curtain generating component 60 while changing its flow direction. In addition, since the liquid curtain generating component 60 has a second circumferential flow path 68, the pressure of the plating liquid can be evenly distributed along the entire circumference.

[0103] Next, a modified example of the liquid curtain generating component 60 will be described. Figure 8A This is a perspective view showing other examples of the liquid curtain generating component 60. Figure 8B yes Figure 8A A side sectional view of the liquid curtain generating component 60 shown. Figure 8A and Figure 8B As shown, in this example, the liquid curtain generating component 60 and Figures 7A to 7C The liquid curtain generating component 60 shown is also an integral ring-shaped component, configured to be installed on the outer circumferential surface of the input pipe 29. For example... Figure 8B As shown in detail, the liquid curtain generating component 60 has a first cylindrical portion 62 and a second cylindrical portion 63 located outside the first cylindrical portion 62. The second cylindrical portion 63 has an inlet 64 for supplying plating solution to the liquid curtain generating component 60. Additionally, an outlet 65 for discharging the plating solution in a liquid curtain manner is formed between the first cylindrical portion 62 and the second cylindrical portion 63. The inlet 64 may also be formed in the first cylindrical portion 62. The first cylindrical portion 62 is longer in the axial direction than the second cylindrical portion 63. Specifically, when the liquid curtain generating component 60 is installed in the input piping 29, the first cylindrical portion 62 is further towards the plating solution tank 35 than the outlet 65. Figure 8A , Figure 8B (Extends downwards in the middle).

[0104] A flow path for the plating solution is formed between the inlet 64 and the outlet 65. In the illustrated example, this flow path consists of a first circumferential flow path 66, an axial flow path 67, and an outlet flow path 69. The first circumferential flow path 66 is formed circumferentially between the first cylindrical portion 62 and the second cylindrical portion 63 and communicates with the inlet 64. The axial flow path 67 communicates with the first circumferential flow path 66. In the illustrated example, multiple axial flow paths 67 are arranged at approximately equal intervals along the circumference of the liquid curtain generating component 60, and each axial flow path 67 communicates radially outward of the first circumferential flow path 66. The outlet flow path 69 is a flow path that fluidly connects the axial flow paths 67 and the outlet 65.

[0105] In this embodiment, the outlet 65 extends along the entire circumferential direction between the first cylindrical portion 62 and the second cylindrical portion 63. The outlet 65 has a generally annular cross-section as a whole, and the radial width (thickness of the ring) of the outlet 65 is approximately fixed. The second cylindrical portion 63 has an inclined surface 63a on its inner circumferential surface, which slopes towards the outlet 65 and decreases in distance from the first cylindrical portion 62. On the other hand, the surface of the first cylindrical portion 62 opposite to the inclined surface 63a of the second cylindrical portion 63 has a fixed outer diameter. Therefore, the discharge path 69 is configured to gradually narrow towards the outlet 65 via the inclined surface 63a of the second cylindrical portion 63.

[0106] illustrate Figure 8A and Figure 8B The function of the liquid curtain generating component 60 shown. When from... Figure 6 When the plating solution supply line 61 supplied the plating solution to the inlet 64 of the liquid curtain generating component 60, the plating solution passed through the first circumference of the flow path 66 and spread throughout the entire circumference of the liquid curtain generating component 60. The plating solution spread throughout the entire circumference then moved axially through multiple axial flow paths 67. As a result, the flow direction of the plating solution changed. Next, the plating solution that had passed through the axial flow paths 67 reached the discharge flow path 69. The plating solution that reached the discharge flow path 69 was discharged from the discharge outlet 65 while its flow rate increased as it passed through the discharge flow path 69, which gradually narrowed towards the discharge outlet 65. The plating solution discharged from the discharge outlet 65 was pressurized by the gradually narrowing discharge flow path 69, thereby generating a generally cylindrical liquid curtain of plating solution.

[0107] The liquid curtain generating component 60 described above can generate a cylindrical liquid curtain of plating solution covering the outlet of the feed pipe 29. This prevents copper oxide powder from scattering and adhering to the wall of the plating solution tank 35 due to the diffusion of inert gas when discharged from the feed pipe 29. In this embodiment, inert gas is supplied to the feed pipe 29, but even without supplying inert gas, copper oxide powder discharged from the feed pipe 29 may still adhere to the wall of the plating solution tank 35. Specifically, for example, when copper oxide powder collides with the plating solution surface, it may scatter along with the plating solution and adhere to the wall of the tank 35. Therefore, the liquid curtain generating component 60 of this embodiment can suppress the scattering of copper oxide powder when it collides with the plating solution surface even without supplying inert gas to the feed pipe 29.

[0108] Furthermore, the liquid curtain generating component 60 has an inclined surface 63a in the second cylindrical portion 63, and the discharge flow path 69 gradually narrows towards the discharge port 65. This generates pressure in the plating solution passing through the discharge flow path 69 in the direction toward the outer peripheral surface of the first cylindrical portion 62, thereby increasing the flow rate and pressure of the plating solution. Additionally, since the first cylindrical portion 62 extends further downward (towards the plating solution tank 35) than the discharge port 65, the plating solution discharged from the discharge port 65 flows along the outer peripheral surface of the first cylindrical portion 62. This allows for the stable generation of a circumferentially continuous liquid curtain of plating solution.

[0109] Next, the structure for suppressing the scattering of copper oxide powder near the cover 41 of the hopper 33 will be explained. Figure 9This is an enlarged side view near the cover 41 of the hopper 33. When copper oxide powder is fed from the powder container 21 into the inlet 19 of the hopper 33, the copper oxide powder may scatter out of the hopper 33 through the gap between the powder guide tube 46 of the powder container 21 and the inlet 19. Furthermore, after the copper oxide powder is fed into the hopper 33, the gas inside the hopper 33 is discharged from the exhaust port 42, and the copper oxide powder inside the hopper 33 may scatter out of the hopper 33 through the exhaust port 42. Therefore, in this embodiment, as... Figure 9 As shown, the powder supply device 20 has: a first scattering prevention member 74 for preventing copper oxide powder from scattering from the gap between the inlet 19 of the hopper 33 and the powder guide 46; and a second scattering prevention member 70 for preventing copper oxide powder from scattering from the exhaust port 42 of the hopper 33.

[0110] like Figure 9 As shown, the powder supply device 20 of this embodiment has an intermediate nozzle 80 that receives copper oxide powder fed from the nozzle 46a of the powder conduit 46 and feeds copper oxide powder into the inlet 19 of the hopper 33. In this embodiment, a first scattering prevention member 74 is provided in the intermediate nozzle 80. In other embodiments, the intermediate nozzle 80 may not be provided, and the copper oxide powder may be directly fed from the powder conduit 46 of the powder container 21 into the inlet 19 of the hopper 33. In this case, the first scattering prevention member 74 is provided in the powder conduit 46.

[0111] Figure 10 This is a perspective view of the second anti-scattering component 70. (See diagram below.) Figure 10 The second scattering prevention component shown includes a filter 72 that closes the exhaust port 42 and a fixing member 71 that fixes the filter 72 to the exhaust port 42. In this embodiment, any filter capable of capturing copper oxide powder, such as a filter cloth filter, can be used as the filter 72. In addition, in this embodiment, a generally cylindrical member that presses the filter 72 onto the exhaust port 42 is used as the fixing member 71.

[0112] Figure 11 This is a perspective view of the first anti-scattering component 74. (See diagram below.) Figure 11 As shown, the first scattering prevention component 74 has a cylindrical component 77 and a flange portion 75 extending radially from the cylindrical component 77. The cylindrical component 77 is configured to fit into the powder conduit 46 or the intermediate nozzle 80. The first scattering prevention component 74 can be fixed to the powder conduit 46 or the intermediate nozzle 80 by means of a fixing screw 76. The flange portion 75 has a plurality of openings. In this embodiment, four openings are provided on the flange portion 75. These plurality of openings are closed by a filter 72. In addition, an opening 78 is formed inside the cylindrical component 77, and the powder conduit 46 or the intermediate nozzle 80 is inserted into the opening 78.

[0113] Next, the process of feeding copper oxide powder from powder container 21 into hopper 33 will be described. Figure 12 This is a perspective view of the hopper 33 before the first scattering prevention component 74 comes into contact with the inlet 19 of the hopper 33. Figure 13 This is a perspective view of the hopper 33 after the first scattering prevention component 74 comes into contact with the inlet 19 of the hopper 33. (See image below.) Figure 12 As shown, the powder supply device 20 has a fixing plate 85 extending horizontally and a plurality of bolts 84 screwed into the fixing plate 85. The fixing plate 85 is for... Figure 3 The weight measuring device 40 shown is configured without applying a load.

[0114] like Figure 12 As shown, the intermediate nozzle 80 has a flange portion 81 and a nozzle portion 82 extending from the flange portion 81 (corresponding to an example of an injection nozzle). A first scattering prevention member 74 is installed in the nozzle portion 82 of the intermediate nozzle 80. The flange portion 81 has a plurality of holes 83 through which a bolt 84 can pass. Figure 12 In the state shown, multiple bolts 84 support the flange 81 from below, and the filter 72 of the first scattering prevention component 74 (see reference). Figure 11 The first scattering prevention component 74 mounted on the intermediate nozzle 80 does not contact the feed inlet 19 of the hopper 33. Therefore, when no copper oxide powder is fed into the hopper 33, it will not cause any scattering. Figure 3 The weight measuring device 40 shown applies the weight of the intermediate nozzle 80 and the first scattering prevention component 74.

[0115] like Figure 13 As shown, when copper oxide powder is fed into the hopper 33, firstly, the intermediate nozzle 80 is rotated circumferentially by a predetermined angle, and the bolt 84 passes through the hole 83 in the flange portion 81. The intermediate nozzle 80 moves toward the hopper 33, and the first scattering prevention member 74 contacts the inlet 19 of the hopper 33. Thus, the filter 72 of the first scattering prevention member 74 prevents copper oxide powder from scattering from the gap between the intermediate nozzle 80 and the inlet 19 of the hopper 33.

[0116] Furthermore, if the intermediate nozzle 80 is not provided and the first scattering prevention component 74 is provided on the powder conduit 46 of the powder container 21, the powder conduit 46 is inserted into the inlet 19 until the filter 72 of the first scattering prevention component 74 contacts the inlet 19, and the valve 48 is opened (see reference). Figure 2 Thus, the filter 72 of the first scattering prevention component 74 prevents copper oxide powder from scattering from the gap between the powder conduit 46 of the powder container 21 and the inlet 19 of the hopper 33.

[0117] Alternatively, in other embodiments, the first scattering prevention component 74 may be pre-installed on the inlet 19 of the hopper 33. In this case, copper oxide powder can be fed into the hopper 33 by inserting the nozzle portion 82 of the intermediate nozzle 80 or the nozzle 46a of the powder conduit 46 of the powder container 21 into the cylindrical component 77 of the first scattering prevention component 74 installed at the inlet 19. Furthermore, in this case, the weight of the hopper 33, including the weight of the first scattering prevention component 74, is managed in advance.

[0118] In the above embodiments, a powder supply device separately provided from the plating apparatus was described. However, the present invention is also applicable when copper oxide powder is directly supplied to the plating tank of the plating apparatus. Furthermore, the powder containing the metal supplied to the plating solution is not limited to copper oxide, but may also include various metals such as nickel.

[0119] The embodiments of the present invention have been described above. However, these embodiments are provided to facilitate understanding of the invention and do not limit its scope. The present invention can be modified and improved without departing from its spirit, and its equivalents are naturally included. Furthermore, within the scope of solving at least some of the aforementioned problems or achieving at least some of the effects, any combination or omission of the structural elements described in the claims and specification is possible.

[0120] The following describes several methods disclosed in this specification.

[0121] According to the first method, a powder supply device is provided for supplying powder containing a metal used in plating to a plating solution. The powder supply device includes: a plating solution tank configured to receive the plating solution; an input pipe for inputting the powder into the plating solution tank; a gas supply line for supplying gas; and a spiral airflow generating member configured to receive gas from the gas supply line and generate a spiral airflow toward the plating solution tank inside the input pipe.

[0122] According to the second embodiment, in the powder supply device of the first embodiment, the spiral airflow generating component has a cylindrical component with an outer surface configured to contact the inner surface of the input pipe. The cylindrical component has a first end on the side of the plating liquid tank and a second end on the side opposite to the first end. A groove extending from the first end toward the second end is provided on the outer surface, configured such that gas from the gas supply pipe passes through the groove of the cylindrical component.

[0123] According to the third method, in the powder supply device of the second method, the groove is formed in a manner that is inclined relative to the axial direction of the cylindrical member.

[0124] According to the fourth method, in the powder supply device of the second or third method, the spiral airflow generating component further has an air flow path that extends circumferentially and communicates with the groove, and an air injection port that is connected to the gas supply pipeline and communicates with the air flow path.

[0125] According to the fifth method, in any of the powder supply devices of the first to fourth methods, the feeding pipe has an inlet opening end for feeding the powder and an outlet opening end for discharging the powder, and the spiral airflow generating component is provided at the inlet opening end of the feeding pipe.

[0126] According to the sixth method, any powder supply device of the first to fifth methods includes: a hopper configured to receive the powder; and a feeder configured to supply the powder from an opening provided at the bottom of the hopper toward the feed pipe.

[0127] According to the seventh method, a powder supply device is provided for supplying powder containing a metal used in plating to a plating solution. The powder supply device includes: a plating solution tank configured to hold the plating solution; an input pipe for inputting the powder into the plating solution tank; and a liquid curtain generating component for generating a cylindrical liquid curtain of the plating solution that covers the outlet of the input pipe.

[0128] According to the eighth embodiment, in the powder supply device of the seventh embodiment, the liquid curtain generating component has a first cylindrical portion and a second cylindrical portion located outside the first cylindrical portion. A discharge port for discharging the plating liquid is formed between the first cylindrical portion and the second cylindrical portion. The discharge port extends along the entire circumferential direction between the first cylindrical portion and the second cylindrical portion. In a cross-section orthogonal to the axial direction of the liquid curtain generating component, there is a first portion having a first radial width, and a second portion having a second radial width larger than the first radial width.

[0129] According to the ninth method, in the powder supply device of the eighth method, the discharge port has a plurality of the second portions, which are arranged at approximately equal intervals along the circumferential direction.

[0130] According to the 10th embodiment, in the powder supply device of the 7th embodiment, the liquid curtain generating component has: a first cylindrical portion; a second cylindrical portion located outside the first cylindrical portion; and a discharge port formed between the first cylindrical portion and the second cylindrical portion. A discharge flow path communicating with the discharge port and discharging the plating liquid is formed between the first cylindrical portion and the second cylindrical portion. The second cylindrical portion has an inclined surface on its inner circumferential surface that is inclined toward the discharge port and the distance between it and the first cylindrical portion becomes closer. The discharge flow path is configured to gradually narrow toward the discharge port by the inclined surface of the second cylindrical portion.

[0131] According to the 11th embodiment, in the powder supply device of the 10th embodiment, the first cylindrical portion extends further toward the plating liquid tank than the outlet.

[0132] According to the 12th embodiment, in any of the powder supply devices of the 8th to 11th embodiments, the liquid curtain generating component has: an inlet for the plating liquid; and a first circumferential flow path that communicates with the inlet and extends circumferentially between the first cylindrical portion and the second cylindrical portion.

[0133] According to the 13th embodiment, in the powder supply device of the 12th embodiment, the liquid curtain generating component has multiple axial flow paths that communicate with the first circumferential flow path.

[0134] According to the 14th embodiment, in the powder supply device of the 12th embodiment, the liquid curtain generating component has a second circumferential flow path that is connected to each of the axial flow paths and extends circumferentially between the first cylindrical portion and the second cylindrical portion, and the second circumferential flow path is connected to the discharge port.

[0135] According to the 15th method, in the powder supply device of the 13th method, the above-mentioned multiple axial flow paths are connected to the above-mentioned discharge flow path.

[0136] According to the 16th method, any of the powder supply devices of the 7th to 15th methods has a gas supply pipeline for supplying gas to the aforementioned injection piping.

[0137] According to the 17th aspect, a powder supply device is provided for supplying powder containing a metal used in plating to a plating solution. The powder supply device includes: a plating solution tank configured to receive the plating solution; and a hopper for receiving the powder, the hopper having an inlet for feeding the powder into the hopper and an outlet for discharging gas from the hopper. The powder supply device further includes: a first scattering prevention member configured to prevent the powder from scattering through the gap between the inlet and an inlet nozzle for feeding the powder into the inlet; and a second scattering prevention member configured to prevent the powder from scattering through the outlet.

[0138] According to the 18th method, in the powder supply device of the 17th method, the first scattering prevention component includes a filter cloth filter, which is installed at the inlet or the inlet nozzle.

[0139] According to the 19th method, in the powder supply device of the 17th or 18th method, the second scattering prevention component includes a filter cloth filter, which is installed at the exhaust port.

[0140] According to the 20th method, in any of the powder supply devices of the 17th to 19th methods, the aforementioned injection nozzle is the nozzle of a powder container that receives powder.

[0141] According to the 21st method, in any of the powder supply devices of the 17th to 19th methods, there is an intermediate nozzle that receives the powder fed from the nozzle of the powder container that holds the powder and feeds the powder into the feed port of the hopper, wherein the feed nozzle is the intermediate nozzle.

[0142] According to the 22nd embodiment, in the powder supply device of the 21st embodiment, the first scattering prevention component is installed on the intermediate nozzle, configured such that when the powder is fed into the hopper, the first scattering prevention component contacts the inlet of the hopper.

[0143] According to the 23rd embodiment, a plating system is provided. The plating system includes: a powder supply device according to any one of the 1st to 22nd embodiments; a plating tank for plating a substrate; and a plating liquid supply pipe extending from the plating liquid tank of the powder supply device to the plating tank.

Claims

1. A powder supply device that supplies a powder containing a metal used in plating to a plating solution, the powder supply device characterized by comprising: a plating solution tank configured to store the plating solution; and a hopper configured to store the powder, the hopper having a powder inlet for feeding the powder into the hopper and a gas outlet for discharging gas in the hopper, the powder supply device further comprising: a first scattering prevention member configured to prevent the powder from scattering from a gap between the powder inlet and a feeding nozzle for feeding the powder to the powder inlet; and a second scattering prevention member configured to prevent the powder from scattering from the gas outlet, the first scattering prevention member having a cylindrical member and a flange portion extending radially from the cylindrical member, an opening being formed in an inside of the cylindrical member, the feeding nozzle being inserted into the opening, the flange portion having a plurality of openings that are closed by filters.

2. The powder supply device according to claim 1, wherein the first scattering prevention member includes a cloth filter that is installed at the powder inlet or the feeding nozzle.

3. The powder supply device according to claim 1, wherein the second scattering prevention member includes a cloth filter that is installed at the gas outlet.

4. The powder supply device according to claim 1, wherein the feeding nozzle is a nozzle of a powder container that stores the powder.

5. The powder supply device according to claim 1, comprising an intermediate nozzle that receives the powder fed from a nozzle of a powder container that stores the powder and feeds the powder to the powder inlet of the hopper, the feeding nozzle being the intermediate nozzle.

6. The powder supply device according to claim 5, wherein the first scattering prevention member is installed at the intermediate nozzle, the powder supply device being configured such that the first scattering prevention member comes into contact with the powder inlet of the hopper when the powder is fed to the hopper.

7. A plating system comprising: the powder supply device according to any one of claims 1 to 6; a plating tank configured to plate a substrate; and a plating solution supply pipe that extends from the plating solution tank of the powder supply device to the plating tank. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 7. A plating system characterized by, ​ ​ ​ ​

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