Single-axis gyroscope and miniaturized integrated three-axis gyroscope based on single-axis gyroscope

Abstract

The application belongs to the technical field of information collection and data processing microsystem integration, and particularly relates to a single-axis gyroscope and a miniaturized integrated three-axis gyroscope based on the single-axis gyroscope. The single-axis gyroscope comprises a gyroscope meter head, an ASIC circuit and a substrate. The upper and lower surfaces of the substrate are both provided with pads, the gyroscope meter head and the ASIC circuit are bonded to the upper surface of the substrate and connected with the pads on the upper surface of the substrate, and a passive device is welded on the pads on the lower surface of the substrate. The substrate is internally provided with an interconnection circuit, the interconnection circuit is connected with the pads on the upper and lower surfaces of the substrate, and the interconnection circuit is used for signal transmission between the gyroscope meter head, the ASIC circuit and the passive device. The side surface of the substrate is provided with a plurality of electrodes, the plurality of electrodes are connected with the basic interconnection circuit, and the plurality of electrodes are used for single-axis gyroscope signal leading-out and power supply.

Description

Technical Field

[0001] This invention belongs to the field of microsystem integration technology for information acquisition and data processing, and specifically relates to a single-axis gyroscope and a miniaturized integrated three-axis gyroscope based on the single-axis gyroscope. Background Technology

[0002] Gyroscopes are sensitive to angular rates, enabling them to measure the rotation of a carrier and output angular rate signals. Typically, the rotation of a moving carrier in space can be decomposed into three orthogonal axes, requiring a triaxial gyroscope to measure the angular rate motion of each individual axis.

[0003] With the continuous development of gyroscope sensors, from laser gyroscopes to fiber optic gyroscopes, and then to MEMS-based microelectromechanical systems (MEMS) gyroscopes, the size of gyroscopes has been continuously reduced, and their application scenarios have become increasingly diverse. Many application scenarios have placed more stringent requirements on the size of triaxial gyroscopes. To achieve miniaturized triaxial gyroscopes, there are generally two methods. One is to assemble a triaxial gyroscope by mounting a single-axis gyroscope on an orthogonal platform. This method is characterized by being based on a single-axis gyroscope, resulting in a simple assembly process, but the single-axis gyroscope shell and peripheral circuitry are relatively large. Furthermore, the interconnection of signals between gyroscopes requires consideration of cables or connectors, which also occupies a significant amount of space. The other method is to use a single-chip triaxial gyroscope sensing structure, such as patent CN 113218381 A "A Triaxial Gyroscope," which implements the sensing structure of an orthogonal triaxial gyroscope on a single chip. Combined with the triaxial gyroscope's control circuitry, this allows for the realization of a miniaturized triaxial gyroscope. This method is characterized by the smallest gyroscope size, but the single-chip three-axis gyroscope head chip structure is complex, and the gyroscope performance is lower than that of a single-axis gyroscope, making it impossible to achieve a high-performance three-axis gyroscope. Summary of the Invention

[0004] To address the various shortcomings of existing miniaturized triaxial gyroscopes, this patent designs a miniaturized integrated triaxial gyroscope device based on a single-axis gyroscope.

[0005] This solution proposes a three-axis gyroscope based on multi-chip integration. It uses a single-axis gyroscope chip and a single-axis control circuit ASIC. Three single-axis gyroscope chips and three single-axis control circuit ASICs are mounted on three different orthogonal circuit boards. Through high-precision assembly process, a miniaturized integrated three-axis gyroscope is formed.

[0006] On one hand, the present invention provides a single-axis gyroscope, comprising: a gyroscope head, an ASIC circuit, and a substrate;

[0007] The substrate has pads on both its upper and lower surfaces. The gyroscope head and ASIC circuit are bonded to the upper surface of the substrate and connected to the pads on the upper surface of the substrate. Passive devices are soldered onto the pads on the lower surface of the substrate. The substrate has built-in interconnect circuits, which are connected to the pads on the upper and lower surfaces of the substrate. The interconnect circuits are used for signal transmission between the gyroscope head, ASIC circuit and passive devices.

[0008] The substrate has multiple electrodes on its side, which are connected to a basic interconnect circuit. The electrodes are used for single-axis gyroscope signal output and power supply.

[0009] Furthermore, the gyroscope head and ASIC circuit are connected to the substrate surface pads via gold wire bonding or flip-chip bonding.

[0010] Furthermore, the electrode is a semi-circular through-hole disposed on the side of the substrate and penetrating the upper and lower surfaces of the substrate, and the semi-circular through-hole is provided with pads for leading out signals from the interconnect circuit.

[0011] Furthermore, the semi-circular through-hole is plated with gold as a solder pad for gold wire bonding.

[0012] On the other hand, the present invention provides a miniaturized integrated triaxial gyroscope based on a single-axis gyroscope, the triaxial gyroscope comprising: a housing, a main board, and an X-axis side single-axis gyroscope, a Y-axis single-axis gyroscope, and a Z-axis main axis gyroscope disposed in the housing and orthogonally mounted to each other;

[0013] The X-axis single-axis gyroscope and the Y-axis single-axis gyroscope are single-axis gyroscopes as described in any one of claims 1-4; the Z-axis main axis gyroscope includes: a single-axis gyroscope as described in any one of claims 1-4 and a processing chip and working circuit;

[0014] The motherboard has solder pads on its upper and lower surfaces respectively;

[0015] The electrodes on the X-axis single-axis gyroscope, Y-axis single-axis gyroscope and Z-axis main axis gyroscope are connected to the pads on the motherboard by gold wire bonding, and the processing chip is soldered to the lower surface of the motherboard.

[0016] The motherboard has a built-in working circuit for signal transmission between the X-axis single-axis gyroscope, the Y-axis single-axis gyroscope, the Z-axis main spindle gyroscope and the processing chip;

[0017] The motherboard also has wires soldered to its pads for leading out the three-axis gyroscope signals and supplying power.

[0018] Furthermore, the base plate and main board of the Z-axis spindle gyroscope are combined into a single circuit board.

[0019] Furthermore, the substrates of the X-axis single-axis gyroscope, Y-axis single-axis gyroscope, and Z-axis main axis gyroscope are provided with a no-wiring area, which is then bonded to the housing by applying adhesive to the no-wiring area.

[0020] Furthermore, the Z-axis main axis gyroscope is horizontally arranged parallel to the motherboard, while the X-axis side single-axis gyroscope and the Y-axis single-axis gyroscope are vertically arranged perpendicular to the motherboard.

[0021] Beneficial effects

[0022] This invention proposes a miniaturized integrated triaxial gyroscope based on a single-axis gyroscope. By mounting the single-axis gyroscope head and ASIC circuitry on a substrate and interconnecting the electrical signals via wire bonding, the size of the single-axis gyroscope is reduced. The installation of the single-axis gyroscope module on an orthogonal mechanical structure enables sensitive positioning of the triaxial gyroscope. Furthermore, to achieve interconnection between the vertically mounted circuit modules, wire bonding is performed using metallized holes on the side of the substrate, thereby enabling signal interconnection between the triaxial gyroscope modules without the need for connectors or wire bonding, greatly simplifying assembly complexity and reducing the size of the triaxial gyroscope device. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of a single-axis gyroscope.

[0024] Figure 2 Schematic diagram of a miniaturized integrated three-axis gyroscope;

[0025] Figure 3 Schematic diagram of a miniaturized integrated triaxial gyroscope with the shell removed;

[0026] In the figure, 1-single-axis gyroscope head, 11-single-axis gyroscope head surface pad, 2-gyroscope ASIC circuit, 21-gyroscope ASIC surface pad, 3-single-axis gyroscope module substrate, 31-substrate surface pad, 4-three-axis gyroscope housing, 5-x-axis gyroscope module, 6-y-axis gyroscope module, 7-z-axis gyroscope module, 41-gyroscope housing sidewall, 42-gyroscope housing sidewall, 43-gyroscope housing bottom surface, 31-substrate surface pad, 51-X-axis gyroscope module side metal semi-circular hole array electrode, 61-Y-axis gyroscope module side metal semi-circular hole array electrode, 71-Z-axis gyroscope module surface metal array electrode, 8-gold wire, 9-gold wire. Detailed Implementation

[0027] The specific embodiments of the present invention will now be described in detail with reference to the accompanying drawings. In the following description, specific details are set forth for purposes of explanation rather than limitation, in order to help to fully understand the present invention.

[0028] It should be noted that, in order to avoid obscuring the invention with unnecessary details, only structures closely related to the solution according to the invention are shown in the accompanying drawings, while other details that are not closely related to the invention are omitted.

[0029] An embodiment of a single-axis gyroscope and a miniaturized integrated triaxial gyroscope based on the single-axis gyroscope is disclosed. In the single-axis gyroscope, the single-axis gyroscope head 1 and the gyroscope ASIC circuit 2 are mounted on the same side of the single-axis gyroscope module substrate 3 by adhesive bonding. Figure 1 As shown, the other side of the single-axis gyroscope module substrate 3 also has substrate surface pads 31. Gyroscope ASIC surface pads 21 are designed on the surface of the gyroscope ASIC circuit 2 for outputting electrical signals. The single-axis gyroscope head 1 has similar metal pads. The gyroscope ASIC surface pads 21 and the substrate surface pads 31 are interconnected using gold wire bonding technology. The single-axis gyroscope head 1 is interconnected with the gyroscope ASIC circuit 2 and the single-axis gyroscope module substrate 3 in a similar manner, enabling signal transmission between the gyroscope head, ASIC circuit, and passive devices. On the other side of the single-axis gyroscope module substrate 3, resistors, capacitors, inductors, and other devices are electrically connected to the substrate 3 using a lead-tin soldering process.

[0030] Based on the orthogonal mounting of the single-axis gyroscope module in the three-axis gyroscope housing 4, such as Figure 2 As shown, x-axis gyroscope module 5, y-axis gyroscope module 6, and z-axis gyroscope module 7 are implemented respectively. The specific installation process involves applying epoxy adhesive to the no-wiring areas of x-axis gyroscope module 5, y-axis gyroscope module 6, and z-axis gyroscope module 7, and then bonding and fixing them to designated positions on the three-axis gyroscope housing 4. The signals from the three-axis gyroscopes are delivered via wires.

[0031] The interconnection between the x-axis gyroscope module 5 and the z-axis gyroscope module 7, such as Figure 3 As shown, the x-axis gyroscope module 5 has a side-mounted metal semi-circular hole array electrode 51, which is fabricated using a printed circuit board metal through-hole process and plated with gold in the metallization layer for gold wire bonding. The z-axis gyroscope module 7 has a surface-mounted metal array electrode 71 for gold wire bonding. The side-mounted metal semi-circular hole array electrode 51 and the surface-mounted metal array electrode 71 of the z-axis gyroscope module are electrically connected via gold wires 8.

[0032] The interconnection between the y-axis gyroscope module 6 and the z-axis gyroscope module 7, such as Figure 3 As shown, the y-axis gyroscope module 6 has a side-mounted metal semi-circular hole array electrode 61, which is fabricated using a printed circuit board metal through-hole process and plated with gold in the metallization layer for gold wire bonding. The z-axis gyroscope module 7 has a surface-mounted metal array electrode 72 for gold wire bonding. The side-mounted metal semi-circular hole array electrode 61 and the surface-mounted metal array electrode 72 of the z-axis gyroscope module are electrically connected via gold wires 9.

Claims

1. A single-axis gyroscope, characterized by: The single-axis gyroscope comprises a gyroscope head, an ASIC circuit and a substrate; The upper and lower surfaces of the substrate are provided with pads, the gyroscope head and the ASIC circuit are bonded to the upper surface of the substrate and connected to the pads on the upper surface of the substrate, and the pads on the lower surface of the substrate are welded with passive devices; The substrate is provided with a plurality of electrodes on the side surface, the plurality of electrodes are connected with the interconnection circuit of the substrate, and the plurality of electrodes are used for signal leading-out and power supply of the single-axis gyroscope.

2. The single-axis gyroscope of claim 1, wherein: The gyroscope head and the ASIC circuit are connected with the pads on the surface of the substrate through gold wire bonding or flip-chip bonding.

3. The single-axis gyroscope of claim 1, wherein: The electrodes are semicircular through holes provided on the side surface of the substrate and penetrating the upper and lower surfaces of the substrate, and the semicircular through holes are provided with pads for leading out the signals of the interconnection circuit.

4. The single-axis gyroscope of claim 3, wherein: The semicircular through holes are plated with gold as pads for gold wire bonding.

5. A miniaturized integrated tri-axial gyroscope based on a single-axis gyroscope, characterized in that: The three-axis gyroscope comprises a shell, a main board and X-direction side single-axis gyroscopes, Y-direction single-axis gyroscopes and Z-direction main-axis gyroscopes which are installed in the shell and perpendicular to each other; The X-direction single-axis gyroscopes and the Y-direction single-axis gyroscopes are the single-axis gyroscopes according to any one of claims 1-4, and the Z-direction main-axis gyroscopes comprise the single-axis gyroscopes according to any one of claims 1-4, a processing chip and working circuits; The upper and lower surfaces of the main board are respectively provided with pads; The electrodes on the X-direction single-axis gyroscopes, the Y-direction single-axis gyroscopes and the Z-direction main-axis gyroscopes are connected with the pads on the main board through gold wire bonding, and the processing chip is welded on the lower surface of the main board; The main board is provided with working circuits therein for signal transmission between the X-direction single-axis gyroscopes, the Y-direction single-axis gyroscopes, the Z-direction main-axis gyroscopes and the processing chip; The pads on the main board are further welded with wires for leading out signals and power supply of the three-axis gyroscope.

6. The miniaturized integrated tri-axis gyroscope according to claim 5, characterized in that: The substrate of the Z-direction main-axis gyroscope is combined with the main board into the same circuit board.

7. The miniaturized integrated tri-axis gyroscope according to claim 6, characterized in that: The substrates of the X-direction side single-axis gyroscopes, the Y-direction single-axis gyroscopes and the Z-direction main-axis gyroscopes are provided with prohibited wiring areas, and the prohibited wiring areas are bonded to the shell through gluing.

8. The miniaturized integrated tri-axis gyroscope according to claim 7, characterized in that: The Z-direction main-axis gyroscopes are horizontally arranged parallel to the main board, and the X-direction side single-axis gyroscopes and the Y-direction single-axis gyroscopes are vertically arranged perpendicular to the main board.

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