A temperature pressure sensor

Abstract

A temperature pressure sensor comprises a shell, a top cover, a pressure sensitive assembly, a printed circuit board, a ceramic circuit board, a pressure core body electrically connected with a solder pad through a conductor, and a core body protection cover comprising a cover plate and a first skirt wall vertically protruding from the edge of the cover plate to the back side; the cover plate is provided with a glue injection hole and a glue filling hole, the back side of the glue filling hole is provided with a second skirt wall protruding from the edge to the back side; the back side end surface of the second skirt wall is located on the front side of the first skirt wall; the back side end surface of the second skirt wall is sealed and fixed on the front side end surface of the ceramic circuit board, and the back side end surface of the first skirt wall is sealed and fixed on the front side end surface of the printed circuit board; the pressure core body is located in the glue filling hole, the glue filling hole is filled with a first protection glue; the second skirt wall, the first skirt wall and the printed circuit board form a glue filling cavity, the conductor is located in the glue filling cavity, and the glue filling cavity is filled with a second protection glue, which can protect the pressure core body and the gold wire.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of sensors, in particular to a temperature pressure sensor. BACKGROUND

[0002] The temperature pressure sensor is a sensor for measuring the pressure and temperature of the environment or medium at the same time, which is currently realized by MEMS (Micro Electro Mechanical System), that is, the pressure is measured by the piezoresistive effect of semiconductor silicon, and the temperature of the medium is measured by the piezoresistance. Among them, the middle part of the silicon core is set as a diaphragm shape, the pressure applied to the silicon diaphragm on both sides causes the resistance value of the doped resistor on the silicon diaphragm to change, and the current or voltage signal output by the measurement circuit composed of several resistors can be further processed by the conditioning circuit and then output to the outside to measure the result. When a vacuum cavity is provided on one side of the silicon chip, the measured pressure is the pressure applied on the other side relative to the pressure of the vacuum, that is, the absolute pressure; when the atmospheric pressure is introduced on one side of the diaphragm, the measured pressure is the pressure relative to the atmosphere, that is, the gauge pressure; when the other pressures are introduced on both sides of the diaphragm, the measured pressure is the difference between the two sides, that is, the differential pressure. Among them, the pressure core can be set on the ceramic substrate or the metal substrate with a special thermal expansion coefficient to avoid stress damage caused by thermal changes, and the conditioning circuit is set on the printed circuit board fixed with the substrate.

[0003] Under harsh working conditions such as high temperature and vibration, the pressure core of the pressure sensor is more likely to be damaged by temperature stress and fail when the temperature changes. For example, to meet the national six emission standards, diesel engines usually need to be provided with an EGR (Exhaust Gas Recirculation) circuit, at this time, the exhaust gas temperature is 30-40℃ higher than the usual exhaust gas temperature of 130℃; at this time, the printed circuit board is reduced in service life.

[0004] One of the applicant's ideas is to install the pressure core on the ceramic substrate or the metal substrate with a special thermal expansion coefficient to reduce the risk of damage by temperature stress, but due to cost and technical considerations, the ceramic substrate or the metal substrate is preferably bonded to the printed circuit board by glue, and after the glue is cured, the pressure core is bonded to the solder pad on the printed circuit board by gold wire bonding. However, due to the bonding, the two are not fixed firmly enough, and there is a risk of displacement, gold wire breakage and de-soldering caused by accidental touch during production assembly or use. On the other hand, high temperature can also cause a decrease in the sealing performance of the sensor, making the measured medium (such as high-temperature exhaust gas) more likely to invade the cavity where the electronic components are located, thereby reducing the service life of the sensor.

[0005] In addition, the known temperature pressure sensor generally uses a thermistor to measure the temperature of the medium to be measured. The temperature pressure sensor is characterized in that the medium channel needs to be communicated to the pressure chip to measure the pressure of the fluid to be measured, and a thermistor circuit does not need to be arranged inside the medium channel to measure the temperature. In order to prevent the thermistor from obstructing the medium channel and to fix the connection terminals of the thermistor circuit, an intermediate seat plate is used to fix the end of the thermistor, and the connection terminals are connected to the flexible circuit board through the probe downwardly penetrating the intermediate seat, and the pin for outputting the signal is connected to the flexible circuit board, for example, CN115127722A. This structure also needs to be fixed by an auxiliary structure. Therefore, the structure is relatively complex, and the cost is relatively high.

[0006] The statements in this section merely provide background information related to the present application and can not constitute the prior art. SUMMARY

[0007] In view of the deficiencies of the prior art, the present application provides a temperature pressure sensor to reduce the risk of gold wire breakage and welding failure during production, assembly and use.

[0008] To achieve the above object, the present application provides the following technical solution: a temperature pressure sensor, comprising:

[0009] a housing;

[0010] a top cover surrounding a working cavity together with the housing;

[0011] a pressure sensitive assembly arranged in the working cavity and separating the working cavity into a sealed cavity and a sensing cavity, comprising: a printed circuit board; a ceramic circuit board bonded to the front side of the printed circuit board, the printed circuit board being electrically connected to the pads arranged on the ceramic circuit board through conductive bodies, the back surface of the printed circuit board being provided with a conditioning element; a pressure core body fixed to the front surface of the ceramic circuit board and electrically connected to the pads through the conductive bodies; and a core body protection cover comprising a cover plate and a first skirt wall vertically protruding from the edge of the cover plate towards the back surface side; wherein the cover plate is provided with a glue injection hole and a glue filling hole, the back side periphery of the glue filling hole protruding towards the back side to form a second skirt wall; the back side end surface of the second skirt wall is located on the front side of the first skirt wall; the back side end surface of the second skirt wall is sealingly fixed to the front side end surface of the ceramic circuit board, and the back side end surface of the first skirt wall is sealingly fixed to the front side end surface of the printed circuit board; the pressure core body is located in the glue filling hole, and the glue filling hole is filled with a first protective glue; a glue filling cavity is formed between the second skirt wall, the first skirt wall and the printed circuit board, the conductive bodies are located in the glue filling cavity, and the glue filling cavity is filled with a second protective glue;

[0012] a pressure connector pipe sealingly communicated to the sensing cavity at one end;

[0013] a temperature sensitive element fixed to the lower part of the inner cavity of the pressure connector pipe and electrically connected with the printed circuit board;

[0014] a terminal knob connected with the shell;

[0015] a plurality of third fisheye pins with one end electrically connected with the printed circuit board and the other end extending into the terminal knob through the shell.

[0016] Preferably, the front side of the filling hole is located on the front side of the injection hole.

[0017] Preferably, the edge of the front side of the filling hole is protruded to form a positioning flange on the front side, and the inner side of the positioning flange forms a positioning groove.

[0018] Preferably, a side of the positioning flange near the injection hole is provided with a clearance opening.

[0019] Preferably, the front side of the injection hole is provided with a first positioning part protruding to the front side.

[0020] Preferably, the back side of the first skirt wall is provided with a second positioning part protruding to the back side.

[0021] Preferably, the side wall of the second skirt wall away from the injection hole is integrally connected with the corresponding side wall of the first skirt wall.

[0022] Preferably, the injection hole is sealed with a sealing cover.

[0023] Preferably, the temperature and pressure sensor further comprises a plurality of second fisheye pins embedded in the shell, the first end of the second fisheye pins is inserted into the metal hole provided in the printed circuit board and electrically connected with the printed circuit board through the metal hole; the plurality of lead terminals of the temperature sensitive element extend upward and are connected with the second end of the second fisheye pins.

[0024] Preferably, a containing cavity is provided between the pressure sensitive assembly and the shell, the lead terminals and the second end of the second fisheye pins are arranged in the containing cavity, and the containing cavity is filled with sealing adhesive.

[0025] The temperature pressure sensor of the present application can protect the pressure chip and gold wire well, especially can avoid the failure risk of the gold wire during product assembly or use. In addition, the temperature sensitive component and the pin are connected to the printed circuit board through the second fish eye pin and the third fish eye pin embedded in the shell respectively, which has a simpler structure and greatly reduces the cost. In addition, the double sealing is formed by the adhesive sealing between the second positioning surface of the core protection cover and the ceramic circuit board and between the first positioning surface and the printed circuit board, which greatly reduces the risk of the measured medium invading the area of other electronic elements of the printed circuit board from the surface of the circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 It is a perspective view of the temperature pressure sensor of a preferred embodiment of the present application;

[0027] Figure 2 It is a top view of the temperature pressure sensor of a preferred embodiment of the present application;

[0028] Figure 3 It is a sectional view of the temperature pressure sensor of a preferred embodiment of the present application along A-A shown in Figure 2

[0029] Figure 4 It is a perspective view of part of the structure of the temperature pressure sensor of a preferred embodiment of the present application;

[0030] Figure 5 It is a sectional view of part of the structure of the temperature pressure sensor of a preferred embodiment of the present application along B-B shown in Figure 2

[0031] Figure 6 It is a perspective view of the pressure sensitive component of a preferred embodiment of the present application;

[0032] Figure 7 It is a top view of the pressure sensitive component of a preferred embodiment of the present application;

[0033] Figure 8 It is a sectional view of the pressure sensitive component of a preferred embodiment of the present application along C-C shown in Figure 7

[0034] Figure 9 It is a bottom view of the core protection cover of a preferred embodiment of the present application;

[0035] Figure 10 It is a sectional view of the core protection cover of a preferred embodiment of the present application along D-D shown in Figure 8

[0036] Figure 11 It is a perspective view of the core protection cover of a preferred embodiment of the present application; ​​​​

[0037] Figure 12 Another perspective view of the core protection cover of a preferred embodiment of the present application;

[0038] In the figure: 1, pressure sensitive assembly; 10, core protection cover; 100, cover plate; 101, first skirt wall; 102, second skirt wall; 103, positioning flange; 104, first positioning part; 105, second positioning part; 10a, glue injection hole; 01a, glue filling cavity; 10b, glue filling hole; 10c, positioning groove; 10d, top end face; 10e, first positioning face; 10f, second positioning face; 10g, give way opening; 11, pressure core; 12, printed circuit board; 13, ceramic circuit board; 14, conditioning element; 15, conductor; 16, sealing cover; 17, first protective glue; 18, second protective glue; 2, shell; 21, cover body sealing groove; 3, pressure connector pipe; 30, pressure channel; 31, first window; 33, adhesive sealing glue; 34, second window; 35, lower pipe wall; 36, sealing ring groove; 37, protruding positioning part; 4, end knob; 41, guide part; 5, sealing ring; 6, temperature sensitive assembly; 64, groove; 60, terminal via hole; 61, temperature sensitive element; 62, lead terminal; 65, support plane; 71, first fisheye pin; 72, second fisheye pin; 73, third fisheye pin; 8, top cover; 81, plate body; 82, sealing flange; 9, mounting part; 91, bushing; 120, metal hole; 66, second end; 67, accommodating cavity. DETAILED DESCRIPTION

[0039] The technical solutions of the present application will be described clearly and completely below in conjunction with the drawings. The following examples are exemplary and are used only to explain the present application, and cannot be interpreted as a limitation on the present application. In the following description, the same reference signs are used to represent the same or equivalent elements, and repeated descriptions are omitted.

[0040] In the description of the present application, it should be understood that the terms "upper", "lower", "inner", "outer", "left", "right", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly used when the product is used, or the orientation or positional relationship commonly understood by those skilled in the art, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0041] In addition, the terms "mounted," "connected," and "connected" should be interpreted broadly. For example, they can refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0042] It should be further understood that the term “and / or” used in this specification and the corresponding claims refers to any and all possible combinations of one or more of the listed items.

[0043] like Figures 1 to 5 As shown. The temperature and pressure sensor of the present application includes a housing (unmarked), a pressure sensitive component 1, a pressure connector tube 3, a temperature sensitive component 6 and a terminal button 4. The housing can be composed of a shell 2 and a top cover 8, and the top cover 8 and the shell 2 together form a working chamber. The top cover 8 can include a plate body 81 and a sealing flange 82 formed by the edge of the plate body 81 protruding downward. In order to facilitate the combined seal between the top cover 8 and the shell 2, the upper end of the shell 2 can be provided with a cover body sealing groove 21, and the sealing flange 82 extends into the cover body sealing groove 21, and the cover body sealing groove 21 is filled with a sealing adhesive.

[0044] The pressure sensitive component 1 is disposed in the working chamber and divides the working chamber into a sealed chamber and a sensing chamber. The pressure sensitive component 1 includes at least a printed circuit board 12 and a pressure core 11 disposed on the front side of the printed circuit board 12 and electrically connected to the printed circuit board 12 .

[0045] The upper end of the pressure connector tube 3 is sealedly connected to the sensing cavity, allowing the measured medium to act on a pressure-sensing surface of the pressure core 11 through the lumen (pressure channel 30) of the pressure connector tube 3. A sealing ring groove 36 may be provided on the outer wall of the pressure connector tube 3, and a sealing ring 5 is disposed within the sealing ring groove 36 to provide a seal when docking with the container of the measured medium.

[0046] The temperature sensitive assembly 6 comprises a temperature sensitive element 61 and a plurality of second fish-eye pins 72 embedded in the housing 2. The temperature sensitive element 61 is fixed at the lower portion of the inner cavity of the pressure connector tube 3. A plurality of lead terminals 62 of the temperature sensitive element 61 extend upwardly and are connected to the second ends 66 of the second fish-eye pins 72. One end of a plurality of third fish-eye pins 73 is electrically connected to the printed circuit board 12, and the other end extends into the inner portion of the end knob 4. The inner portion of the end knob 4 can be provided with a horizontally extending guide portion 41 to facilitate the electrical connection with external devices. The first ends of the second fish-eye pins 72 and the third fish-eye pins 73 are respectively inserted into the metal holes 120 provided in the printed circuit board 12 to fix the printed circuit board 12 in the working cavity. The second fish-eye pins 72 and the third fish-eye pins 73 are electrically connected to the printed circuit board 12 through the metal holes 120, so that the temperature sensitive element 61 is electrically connected to the printed circuit board 12, and the printed circuit board 12 outputs the measured pressure electrical signal to the outside through the third fish-eye pins 73.

[0047] In order to expose the temperature sensitive element 61 to the side of the medium to be measured to more accurately measure the temperature of the medium to be measured, a plurality of first windows 31 and at least one second window 34 are formed on the lower side wall of the pressure connector tube 3. The upper end edge of the second window 34 extends relatively towards the first window 31 to form a lower tube wall 35. The terminal via 60 is filled with adhesive sealant 33, and part of the adhesive sealant 33 fixes and adheres the part of the lead terminal 62 close to the temperature sensitive element 61 to the lower tube wall 35 of the pressure connector tube 3, thereby further fixing the temperature sensitive element 61 and preventing the impact of the flow rate of the medium to be measured.

[0048] Please refer to Figures 6 to 12 .

[0049] The pressure sensitive assembly 1 comprises a printed circuit board 12, a pressure core 11, a ceramic circuit board 13 and a core protection cover 10. The ceramic circuit board 13 is adhered to the front side of the printed circuit board 12. The printed circuit board 12 is electrically connected to the pads provided on the ceramic circuit board 13 through a conductive body 15. The back surface of the printed circuit board 12 is provided with a conditioning element 14. The pressure core 11 is fixed to the front surface of the ceramic circuit board 13, and is electrically connected to the pads through the conductive body 15 (such as gold wire).

[0050] The core protection cover 10 comprises a cover plate 100 and a first skirt wall 101 vertically protruding from the edge of the cover plate 100 towards the back side. The cover plate 100 is provided with a glue injection hole 10a and a glue filling hole 10b. The back side of the glue filling hole 10b is provided with a second skirt wall 102 protruding towards the back side. The back side end surface 10f of the second skirt wall 102 is located on the front side of the back side end surface 10e of the first skirt wall 101. The back side end surface 10f of the second skirt wall 102 is sealed and fixed on the front side end surface of the ceramic circuit board 13. The back side end surface 10e of the first skirt wall 101 is sealed and fixed on the front side end surface of the printed circuit board 12. The pressure core 11 is located in the glue filling hole 10b. The glue filling hole 10b is filled with the first protective glue 17. The glue filling cavity 01a is formed between the second skirt wall 102, the first skirt wall 101 and the printed circuit board 12. The conductive body 15 is located in the glue filling cavity 01a. The glue filling cavity 01a is filled with the second protective glue 18.

[0051] The first protective glue 17 filled in the glue filling hole 10b can protect the pressure core from damage under the condition of corrosive medium (such as circulating gas in the engine intake manifold). The second protective glue 18 filled in the glue filling cavity 01a can avoid the risk of soldering point falling off or gold wire breaking of the conductive body 15 during assembly or use. In addition, the double sealing between the core protection cover 10 and the ceramic circuit board 13 and the printed circuit board 12 can greatly reduce the risk of corrosion of other electronic elements (such as the conditioning element 14) by the pressure medium to be measured. Moreover, the use of the ceramic circuit board as the mounting base of the pressure core in the present application can reduce the adverse effects of high-temperature exhaust gas on the printed circuit board.

[0052] The shell 2 is fixedly connected with a plate-shaped mounting portion 9. The mounting portion 9 is provided with a mounting hole, and the mounting hole is provided with a bushing 91. Thus, the temperature and pressure sensor can be fixed to an external device by a fastener. In the embodiments of the present application, the end knob 4 and the pressure connector pipe 3 are preferably integrally connected with the shell 2, and of course, they can also be fixedly connected separately.

[0053] In the embodiment, the measurement result of the pressure core 11 is absolute pressure. That is, a vacuum cavity is arranged on the other side of the measurement diaphragm of the pressure core as a pressure reference. In other embodiments, the pressure sensing surface on the other side of the pressure core can be in communication with the atmosphere, for example, through the through holes provided on the printed circuit board 12 and the ceramic circuit board 13 and the waterproof and breathable membrane / through hole provided on the top cover 8.

[0054] In some other embodiments, preferably, a receiving cavity 67 is arranged between the pressure sensitive assembly 1 and the shell 2. The lead-out terminal 62 and the second end 66 of the second fish-eye pin 72 are arranged in the receiving cavity 67. The end of the lead-out terminal 62 away from the temperature sensitive element 61 is welded to the second end 66 of the second fish-eye pin 72 after passing through the terminal through-hole 60 arranged in the shell 2 upwardly one by one. The second end 66 of the second fish-eye pin 72 can be arranged horizontally. The second end 66 of the second fish-eye pin 72 is supported on the support plane 65 formed correspondingly on the inner wall of the shell 2.

[0055] In some other embodiments, preferably, the edge of the front side end surface of the glue filling hole 10b is protruded toward the front side to form a positioning flange 103. The inner side of the positioning flange 103 is correspondingly formed with a positioning groove 10c. The proximal part of the upper end of the pressure connector pipe 3 is protruded upwardly to form a protruding positioning part 37. The edge of the upper end of the pressure connector pipe 3 is correspondingly formed with a recess 64. The protruding positioning part 37 is inserted into the positioning groove 10c upwardly. The positioning flange 103 is inserted into the recess 64 downwardly. The recess 64 is filled with sealing adhesive. In this way, when the pressure sensitive assembly 1 is fixed to the protruding positioning part 37 by the sealing adhesive, it can have a larger bonding area to improve the bonding strength, and the sealing path is relatively lengthened to improve the sealing effect.

[0056] In some other embodiments, preferably, the front side end surface of the glue filling hole 10b is located on the front side of the front side end surface of the glue injection hole 10a, as shown in Figure 10 In this way, after the sealing cover 16 is installed at the glue injection hole 10a, the sealing cover 16 does not protrude from the front end of the positioning flange 103.

[0057] Preferably, the receiving cavity 67 can be communicated with the recess 64. The upper end of the lead-out terminal 62 is passed out of the pipe wall of the pressure connector pipe 3 upwardly and then passes through the recess 64 and the receiving cavity 67 in sequence. In this way, when the sealing adhesive is injected into the recess 64, the sealing adhesive injected into the recess 64 can also fill the receiving cavity 67, so as to seal the lead-out terminal 62 and the terminal through-hole 60, thereby preventing the measured medium from invading the sealing cavity of the sensor through the terminal through-hole 60.

[0058] In some other embodiments, preferably, a clearance opening 10g for giving way to the lead-out terminal 62 is arranged on one side of the proximal end of the front side of the positioning flange 103.

[0059] In some other embodiments, preferably, the glue injection hole 10a is sealed with a sealing cover 16. In this way, the sealing property of the glue filling cavity 01a can be improved, and the glue in the receiving cavity 67 can be prevented from pressing the second protective glue 18 from the glue injection hole 10a after solidification during assembly, so as to cause the gold wire bonding point to fall off.

[0060] In some other embodiments, preferably, a first positioning part 104 is arranged on the front side end surface of the glue injection hole 10a and extends towards the front side, and a second positioning part 105 is arranged on the back side end surface of the first skirt wall 101 and extends towards the back side, so as to realize the positioning between the core protection cover 10 and the printed circuit board 12 and between the core protection cover 10 and the sealing cover 16 in the horizontal position.

[0061] In some other embodiments, preferably, the side wall of the second skirt wall 102 away from the glue injection hole 10a is integrally connected with the corresponding side wall of the first skirt wall 101.

[0062] In the above-mentioned embodiments of the present application, the temperature sensitive component 6 and the related structure can also not be arranged, and in this case, the temperature sensitive component 6 is a pressure sensor.

[0063] The scope of the disclosure is not limited by the detailed description, but is defined by the claims and their equivalents, and all variations within the scope of the claims and their equivalents are interpreted as included in the disclosure.

Claims

1. A temperature pressure sensor, characterized by, The utility model relates to a pressure sensor, comprising: a shell (2); a top cover (8) which together with the shell (2) encloses a working cavity; a pressure sensitive component (1) arranged in the working cavity and separating the working cavity into a sealed cavity and a sensing cavity, comprising: a printed circuit board (12); a ceramic circuit board (13) bonded to the front side of the printed circuit board (12), the printed circuit board (12) being electrically connected to the pads arranged on the ceramic circuit board (13) through conductive bodies (15), the back of the printed circuit board (12) being provided with a conditioning element (14); a pressure core (11) fixed to the front of the ceramic circuit board (13), which is electrically connected to the pads through the conductive bodies (15); and a core protection cover, comprising a cover plate (100) and a first skirt wall (101) vertically protruding from the edge of the cover plate (100) towards the back side; wherein the cover plate (100) is provided with a glue injection hole (10a) and a glue filling hole (10b), the back side of the glue filling hole (10b) protruding towards the back side to form a second skirt wall (102); the back side end face of the second skirt wall (102) is located on the front side of the back side end face of the first skirt wall (101); the back side end face of the second skirt wall (102) is sealingly fixed to the front side end face of the ceramic circuit board (13), and the back side end face of the first skirt wall (101) is sealingly fixed to the front side end face of the printed circuit board (12); the pressure core (11) is located in the glue filling hole (10b), and the glue filling hole (10b) is filled with a first protective glue (17); a glue filling cavity (01a) is formed between the second skirt wall (102), the first skirt wall (101) and the printed circuit board (12), the conductive bodies (15) are located in the glue filling cavity (01a), and the glue filling cavity (01a) is filled with a second protective glue (18); a pressure connector pipe (3) sealingly connected to one end of the sensing cavity; a temperature sensitive element (61) fixed to the lower part of the inner cavity of the pressure connector pipe (3) and electrically connected to the printed circuit board (12); an end button (4) connected to the shell (2); and a plurality of third fisheye pins (73) electrically connected to one end of the printed circuit board (12), the other end of which extends to the inside of the end button (4) after passing through the shell (2).

2. The temperature pressure sensor of claim 1, wherein, The front side end face of the glue filling hole (10b) is located on the front side of the front side end face of the glue injection hole (10a).

3. The temperature pressure sensor of claim 1, wherein, The edge of the front side end face of the glue filling hole (10b) protrudes towards the front side to form a positioning flange (103), and the inner side of the positioning flange (103) corresponds to a positioning groove (10c).

4. The temperature pressure sensor of claim 3, wherein, A side of the front side end of the positioning flange (103) close to the glue injection hole (10a) is provided with a clearance opening (10g).

5. The temperature pressure sensor of claim 1, wherein, The front side end face of the glue injection hole (10a) is provided with a first positioning part (104) extending towards the front side.

6. The temperature pressure sensor of claim 1, wherein, The back side end face of the first skirt wall (101) is provided with a second positioning part (105) extending towards the back side.

7. The temperature pressure sensor according to any one of claims 1 to 6, characterized in that, The side wall of the second skirt wall (102) away from the glue injection hole (10a) is integrally connected with the corresponding side wall of the first skirt wall (101).

8. The temperature pressure sensor of claim 7, wherein, The glue injection hole (10a) is externally sealed by a sealing cover (16).

9. The temperature pressure sensor of claim 7, wherein, The second fish-eye pins (72) are embedded and fixed in the shell (2), the first ends of the second fish-eye pins (72) are upwardly inserted into metal holes (120) arranged in the printed circuit board (12) and are electrically connected to the printed circuit board (12) through the metal holes (120), and the multiple lead terminals (62) of the temperature sensitive element (61) are upwardly extended and connected to the second ends of the second fish-eye pins (72).

10. The temperature pressure sensor of claim 9, wherein, The pressure sensitive assembly (1) and the shell (2) are provided with a containing cavity, the lead terminals (62) and the second ends of the second fish-eye pins (72) are arranged in the containing cavity, and the containing cavity is filled with sealing adhesive.

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