Submerged cooling system and cooling device

Abstract

This article relates to an immersion cooling system and device. The cooling device includes a housing, a heat dissipation module, and a cooling module. The cooling module includes a cooling plate and a heat dissipation fin assembly. The cooling plate covers an opening in the housing and has cooling channels. The cooling channels are located on the cooling plate and include an inlet and an outlet, which are respectively located on opposite sides of the cooling plate. One side of the heat dissipation fin assembly contacts the surface of the cooling plate, and the other side of the heat dissipation fin assembly is located inside the housing. With this structure, the amount of heat transfer fluid used inside the housing is lower than that of conventional immersion cooling devices.

Description

Technical Field

[0001] This invention relates to a cooling system, and more particularly to an immersion cooling system and cooling device. Background Technology

[0002] With the rapid development of server performance, servers generate a lot of heat during operation. To avoid the accumulation of heat and poor server performance, the motherboard inside the server is usually immersed in heat sink. The heat sink absorbs the heat generated by the heat-generating components on the motherboard and circulates to the outside of the server enclosure to exchange heat with water or air. This heat exchange method requires a large amount of heat sink and is prone to leakage when entering and leaving the enclosure. Summary of the Invention

[0003] According to some embodiments, an immersion cooling system includes a housing, a heat transfer fluid, a heat dissipation module, and a cooling module. The housing includes an opening for communicating between the interior and exterior of the housing. The heat transfer fluid is located inside the housing. The heat dissipation module is located inside the housing. The cooling module includes a cooling plate and a heat dissipation fin assembly. The cooling plate covers the opening and has a cooling channel disposed on the cooling plate. The cooling channel includes an inlet and an outlet, which are located on opposite sides of the cooling plate. One side of the heat dissipation fin assembly contacts the cooling plate, and the other side of the heat dissipation fin assembly is located inside the housing.

[0004] In some embodiments, the immersion cooling system further includes a fluid delivery device with its outlet facing the heat dissipation module, and fluid generated at the outlet of the fluid delivery device flowing to the heat dissipation module.

[0005] In some embodiments, the immersion cooling system further includes a flow guide member located within the housing. The flow guide member has a flow guide plate that forms two partitioned regions within the housing. A fluid delivery device is positioned on the flow guide plate, which separates the heat dissipation module and the heat dissipation fin assembly. The heat dissipation module and the heat dissipation fin assembly are located in each partitioned region, and the heat transfer fluid in each partitioned region is delivered in opposite directions.

[0006] In some embodiments, the baffle has a bend that is located at or adjacent to the outlet of the fluid delivery device.

[0007] In some embodiments, the turning part is an upright plate that is parallel to the surface of the fluid conveying device, or the turning part is an inclined plate that has an angle less than 90 degrees with the surface of the fluid conveying device.

[0008] In some embodiments, the immersion cooling device further includes a plurality of fluid delivery devices, each fluid delivery device being arranged in two groups opposite to each other and on both sides of the housing, the outlet of each fluid delivery device facing the heat dissipation module and the heat dissipation fin group respectively, and the fluid flow generated at the outlet of each fluid delivery device being delivered to the heat dissipation module and the heat dissipation fin group respectively.

[0009] In some embodiments, the immersion cooling device further includes a plurality of heat dissipation modules, with the outlet of each fluid delivery device facing each heat dissipation module and guiding the heat transfer fluid to each heat dissipation module.

[0010] In some embodiments, the flow guiding member has a plurality of flow guiding plates, each flow guiding plate being located adjacent to the outlet of each fluid conveying device. Each flow guiding plate is used to guide the heat transfer fluid conveyed by each fluid conveying device to the heat dissipation module and the heat dissipation fin assembly. Each flow guiding plate is an inclined plate, and each inclined plate has an angle with the surface of each fluid conveying device, and each angle is less than 90 degrees.

[0011] In some embodiments, the immersion cooling device further includes a circuit board and a plurality of electronic components, each electronic component being disposed on the circuit board, the circuit board being located inside the housing, and each heat dissipation module being connected to each electronic component.

[0012] In some embodiments, the immersion cooling device further includes a circuit board and a central processing unit, with the central processing unit disposed on the circuit board, the circuit board located inside the housing, and a heat dissipation module integrated with the central processing unit.

[0013] In some embodiments, the immersion cooling device further includes a plurality of expansion components disposed on a circuit board and located on the side of the central processing unit.

[0014] In some embodiments, the heat dissipation module has a base and a plurality of heat sinks, each heat sink being disposed on the base. The base has a plurality of baffles, each baffle being located on both sides of the plurality of heat sinks. The thickness of each baffle is greater than the thickness of each heat sink. The base and each heat sink can be an integral one-piece component, or the base and each heat sink can be two separate components.

[0015] In some embodiments, the base has multiple locking members, and each heat sink is arranged in a cross shape on the base. Each locking member is locked around the multiple heat sinks and secured to the circuit board.

[0016] In some embodiments, the thickness of each heat sink ranges from 0.8 mm to 1.2 mm, and the distance between each heat sink ranges from 2.8 mm to 3.6 mm.

[0017] In some embodiments, the long side of each heat sink and the long side of the heat dissipation fin group are parallel to the direction of the heat transfer fluid, and the heat transfer fluid passes in the forward direction between each heat sink and the heat dissipation fin group.

[0018] In some embodiments, the cooling channel includes a flow channel arranged in a continuous S-shape within the cooling plate, with the inlet located on one side of the cooling plate and connected to the flow channel, and the outlet located on the other side of the cooling plate and connected to the flow channel.

[0019] According to some embodiments, a cooling device includes a housing with an opening for communicating between the interior and exterior of the housing. A heat dissipation module is located inside the housing. The cooling module includes a cooling plate and a heat dissipation fin assembly. The cooling plate covers the opening and has a cooling channel disposed on the cooling plate. The cooling channel includes an inlet and an outlet, which are located on opposite sides of the cooling plate. One side of the heat dissipation fin assembly contacts the cooling plate, and the other side of the heat dissipation fin assembly is located inside the housing.

[0020] According to some embodiments, a cooling device includes a housing suitable for containing a heat transfer fluid. The housing includes an opening for communicating between the interior and exterior of the housing, with the heat transfer fluid located inside the housing. A heat dissipation module is located inside the housing. The cooling module includes a cooling plate and a heat dissipation fin assembly. The cooling plate covers the opening and has a cooling channel disposed on the cooling plate. The cooling channel includes an inlet and an outlet, which are located on opposite sides of the cooling plate. One side of the heat dissipation fin assembly contacts the cooling plate, and the other side of the heat dissipation fin assembly is located inside the housing.

[0021] In summary, according to some embodiments, the cooling module covers the opening of the box, and the heat transfer fluid exchanges heat inside the box through the cooling plate and heat dissipation fins of the cooling module. The heat transfer fluid does not need to exchange heat with air or water outside the box. The amount of heat transfer fluid used inside the box can be relatively reduced compared to the amount of heat transfer fluid that needs to be transported to the outside of the box in the traditional method. Attached Figure Description

[0022] Figure 1 The diagram illustrates the appearance of an immersion cooling system according to some embodiments. The housing and cooling modules are represented by dashed lines. The airflow guiding components are not shown. The heat transfer fluid inside the housing is represented by an imaginary line formed by two-point chains. Electronic components are located below each heat dissipation module.

[0023] Figure 2 The diagram illustrates the appearance of an immersion cooling system according to some embodiments. The housing is represented by dashed lines. The flow guide components cover the fluid delivery device. The cooling module and heat transfer fluid are not shown.

[0024] Figure 3A The illustration shows a schematic diagram of the heat dissipation module based on some embodiments;

[0025] Figure 3B The diagram illustrates a front view of a heat dissipation module based on some embodiments.

[0026] Figure 4A The illustration shows a schematic diagram of the appearance of the cooling module according to some embodiments;

[0027] Figure 4B A front view schematic diagram of a cooling module is shown according to some embodiments;

[0028] Figure 5 The diagram illustrates a top view of an immersion cooling system according to some embodiments, with solid lines representing the state of the circuit board, heat dissipation module and fluid delivery device, and dashed lines representing the state of the housing and cooling module.

[0029] Figure 6 Illustration as follows Figure 5 The side view sectional diagram marked 6-6 uses an imaginary line formed by two points to represent the local heat transfer fluid inside the box, and arrows to show the fluid flow direction generated by the operation of each fluid conveying device and the water inlet and outlet direction of the cooling plate.

[0030] Figure 7 The illustrations are based on some embodiments, to Figure 1 From a three-dimensional sectional view of the immersion cooling system, arrows indicate the flow direction of the heat transfer fluid and the cooling channels in the cooling plate.

[0031] Figure 8A The illustrations are based on some embodiments, to Figure 6 From this perspective, a side cross-sectional view of the immersion cooling system shows that the turning part of the guide vane is an inclined plate.

[0032] Figure 8B The illustrations are based on some embodiments, to Figure 6 From this perspective, a side cross-sectional view of the immersion cooling system shows that the deflector is a flat plate.

[0033] Figure 8C The illustrations are based on some embodiments, to Figure 6 From this perspective, a side view cross-sectional diagram of an immersion cooling system shows that multiple guide vanes are inclined flat plates.

[0034] Figure 8D The illustrations are based on some embodiments, to Figure 6 From this perspective, a side cross-sectional view of the immersion cooling system shows the state without the use of deflectors;

[0035] Figure 9 The illustrations are based on some embodiments, to Figure 6 From this perspective, a side cross-sectional view of an immersion cooling system shows the flow direction of the heat transfer fluid with the baffles installed; and

[0036] Figure 10 The illustrations are based on some embodiments, to Figure 6 This is a side view cross-sectional diagram of an immersion cooling system, showing the flow direction of the heat transfer fluid without the baffle installed.

[0037] Explanation of symbols in the attached drawings:

[0038] 100: Cooling device;

[0039] 1: Box;

[0040] 10: Storage space;

[0041] 11: Opening;

[0042] 2: Heat dissipation module;

[0043] 21: Base;

[0044] 211: baffle;

[0045] 22: Heat sink;

[0046] 22a: Long side;

[0047] 23: Locking connector;

[0048] 3: Cooling module;

[0049] 31: Cooling plate;

[0050] 32: Heat dissipation fin assembly;

[0051] 32a: Long side;

[0052] 33: Cooling channel;

[0053] 331: Flow channel;

[0054] 332: Water inlet pipe;

[0055] 333: Water outlet pipe;

[0056] 4: Fluid conveying device;

[0057] 41: Exports;

[0058] 42: Imported;

[0059] 5: Flow guiding components;

[0060] 51: Deflector plate;

[0061] 511: Turning point;

[0062] 511a: Vertical flat plate;

[0063] 511b: Inclined flat plate;

[0064] 52: Divide the area;

[0065] 6: Circuit board;

[0066] 61: Electronic components;

[0067] 62: Expansion components;

[0068] 63: Electronic components;

[0069] 9: Heat transfer fluid;

[0070] θ1: included angle;

[0071] θ2: included angle;

[0072] θ3: included angle;

[0073] D1: Thickness;

[0074] D2: Thickness;

[0075] W: Distance;

[0076] P1: Flow direction on the right;

[0077] P2: Flowing direction on the left. Detailed Implementation

[0078] Please see Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the immersion cooling system. The housing 1 and cooling modules 3 are represented by dashed lines. The airflow guide 5 is not shown. An imaginary line connecting two points forms a circle to represent the heat transfer fluid 9 inside the housing 1. Electronic components 61 (such as...) are located below each heat dissipation module 2. Figure 6 As shown), Figure 2This is a schematic diagram of the appearance of an immersion cooling system. The housing 1 is represented by dashed lines. A flow guide 5 is drawn, covering the fluid delivery device 4. The cooling module 3 and heat transfer fluid 9 are not shown. In some embodiments, the immersion cooling system includes a cooling device 100, which includes a housing 1, a heat sink 2, and a cooling module 3. The housing 1 includes an opening 11 for connecting the interior of the housing 1 (hereinafter referred to as the receiving space 10) to the outside of the housing 1. The heat sink 2 is located in the receiving space 10. The cooling module 3 includes a cooling plate 31 (covering plate) and a heat sink fin assembly 32. The cooling plate 31 covers the opening 11 and has a cooling channel 33 (a water channel). The cooling channel 33 is located on the cooling plate 31 and includes an inlet and an outlet, located on opposite sides of the cooling plate 31. One side of the heat sink fin assembly 32 contacts the cooling plate 31, and the other side of the heat sink fin assembly 32 is located in the receiving space 10 (e.g., the receiving space 10). Figure 6 (As shown).

[0079] In some embodiments, the cooling device 100 is adapted to contain a heat transfer fluid 9, which is a non-conductor and is located in the accommodating space 10 of the housing 1 of the cooling device 100.

[0080] After the heat transfer fluid 9 is filled into the housing 1, the cooling module 3 is used to cover and seal the opening 11 of the housing 1, making the housing 1 and the cooling module 3 a closed housing. The heat dissipation module 2 and the heat dissipation fin assembly 32 of the cooling module 3 inside the housing 1 are immersed in the heat transfer fluid 9, so that the heat transfer fluid 9 exchanges heat within the housing 1 through the cooling plate 31 and the heat dissipation fin assembly 32. The heat transfer fluid 9 does not need to exchange heat with air or water outside the housing 1. The amount of heat transfer fluid 9 used inside the housing 1 is relatively reduced compared to the amount of heat transfer fluid 9 that needs to be transported to the outside of the housing 1 in the traditional method. This reduces leakage loss and evaporation caused by the pipelines transporting heat transfer fluid 9 to the outside of the housing 1, and reduces equipment operating costs.

[0081] See Figure 3A and Figure 3B , Figure 3A This is a schematic diagram of the appearance of heat dissipation module 2. Figure 3B This is a front view schematic diagram of the heat dissipation module 2. In some embodiments, the heat dissipation module 2 has a base 21 and a plurality of heat sinks 22, each heat sink 22 being disposed on the base 21. The base 21 has a plurality of baffles 211, each baffle 211 being coaxial with the plurality of heat sinks 22 (e.g., ...). Figure 3AThe heat sink 2 extends into a rectangular sheet along the Z-axis. Each baffle 211 is located on both sides of the multiple heat sinks 22, and the thickness D1 of each baffle 211 is greater than the thickness D2 of each heat sink 22. When the heat sink module 2 is heated, the multiple heat sinks 22 will bend when heated, and the multiple heat sinks 22 will abut against the baffle 211. By the baffle 211 being located on both sides of the multiple heat sinks 22, each heat sink 22 can be limited between the baffles 211 when bending, ensuring that the multiple heat sinks 22 are in a normal upright state.

[0082] See Figure 3A and Figure 3B In some embodiments, the base 21 and each heat sink 22 may be an integral one-piece component, or the base 21 and each heat sink 22 may be separate two-piece components. In some embodiments, the base 21 has a plurality of locking members 23, and each heat sink 22 is arranged in a cross shape on the base 21. Each locking member 23 is locked into the periphery of the plurality of heat sinks 22 and secured to the circuit board 6.

[0083] See Figure 3A and Figure 3B In some embodiments, the long side 22a of each heat sink 22 and the long side 32a of each fin of the heat sink fin group 32 (e.g.) Figure 4A The direction shown is parallel to the guiding direction of the heat transfer fluid 9 (as shown). Figure 6 (As shown by the arrows), the heat transfer fluid 9 flows in the forward direction between each heat sink 22 and between each fin of the heat dissipation fin assembly 32. The shape of each heat sink 22 and each fin of the heat dissipation fin assembly 32 is rectangular, but it can also be trapezoidal or square.

[0084] See Figure 3A and Figure 3B In some embodiments, the thickness D2 of each heat sink 22 ranges from 0.8 mm to 1.2 mm, and the distance W between each heat sink 22 ranges from 2.8 mm to 3.6 mm. Traditional air cooling methods primarily use stacked fins for heat sinks. The thickness of a traditional heat sink 22 is 0.3 mm, and the pitch between each traditional heat sink 22 is less than 1.65 mm. The material is aluminum. Due to the high viscosity of the heat transfer fluid 9, if the distance between each heat sink 22 is too small, the heat transfer fluid 9 cannot easily pass between the heat sinks 22. Figure 3B The heat sinks 22 are arranged horizontally in sequence with intervals, the distance W between each heat sink 22 is set to 3.2 mm, and the thickness D2 of each heat sink 22 is set to 1 mm, which facilitates the passage of the heat transfer fluid 9. In some embodiments, the material of each heat sink 22 is copper, so that heat energy can be quickly and uniformly conducted to the heat transfer fluid 9.

[0085] See Figure 4A and Figure 4B , Figure 4A This is a schematic diagram of the appearance of cooling module 3. Figure 4B This is a front view of the cooling module 3. In some embodiments, the cooling module 3 is made of copper or aluminum, and the cooling channel 33 is a water channel. The cooling channel 33 includes a flow channel 331, which is arranged in a continuous S-shape within the cooling plate 31. The flow channel 331 can be a slot that penetrates the cooling plate 31, or a water pipe can be installed in the slot. The inlet is a water inlet pipe 332, which is located on one side of the cooling plate 31 and connected to the flow channel 331. The outlet is a water outlet pipe 333, which is located on the other side of the cooling plate 31 and connected to the flow channel 331. However, the water inlet pipe 332 and the water outlet pipe 333 can be arranged at any position on the cooling plate 31 as needed. When the cooling module 3 is in heat exchange operation, the water is cooled by… Figure 6 It can be seen that the heat transfer fluid 9 inside the housing 1 is absorbed by the heat dissipation fin assembly 32 below the cooling plate 31, and undergoes heat exchange with the water in the cooling channel 33 of the cooling plate 31 (e.g., Figure 7 (As shown). In some embodiments, ordinary water can be used to inject into the cooling plate 31. The water enters from the inlet pipe 332 and flows around the S-shaped flow channel 331 to the outlet pipe 333. The temperature of the water entering through the inlet pipe 332 is about 35 degrees Celsius. The water carries away the heat energy on the heat dissipation fin assembly 32 along the S-shaped flow channel 331 towards the outlet pipe 333.

[0086] See Figure 4A and Figure 4B In some embodiments, the cooling plate 31 and the heat dissipation fin assembly 32 may be a single integrated component, or they may be separate two components. One end of the heat dissipation fin assembly 32 contacts the cooling plate 31, and the other end of the heat dissipation fin assembly 32 is installed in the accommodating space 10 of the housing 1 (e.g., Figure 6 (as shown); at least a portion of the other end of the heat dissipation fin assembly 32 is immersed in the heat transfer fluid 9. If the amount of liquid in the heat transfer fluid 9 is large, the heat dissipation fin assembly 32 is completely immersed in the heat transfer fluid 9, or if the amount of liquid in the heat transfer fluid 9 is small, at least a portion of the heat dissipation fin assembly 32 is immersed in the heat transfer fluid 9.

[0087] Please see Figure 2 In some embodiments, the immersion cooling device 100 includes multiple fluid delivery devices 4 (or may be a single fluid delivery device 4), with each fluid delivery device 4 facing each other to form two groups, each group being used by multiple fluid delivery devices 4 (or each group may be used by one fluid delivery device 4). The multiple fluid delivery devices 4 of the two groups are arranged on both sides inside the housing 1, and the outlet 41 of each fluid delivery device 4 faces the heat dissipation module 2 and the heat dissipation fin assembly 32 respectively. Figure 6As shown), the fluid flow direction generated at the outlet 41 of each fluid delivery device 4 is to be delivered to the heat dissipation module 2 and the heat dissipation fin group 32 respectively. Each fluid delivery device 4 forces the mixing of heat transfer fluid 9 to improve heat transfer efficiency.

[0088] Please see Figure 2 In some embodiments, the immersion cooling device 100 further includes at least one fluid delivery device 4, with its outlet 41 facing the heat dissipation module 2. Fluid generated at the outlet 41 of the fluid delivery device 4 is delivered to the heat dissipation module 2. In some embodiments, the fluid delivery device 4 is a fan for liquid transport, with one side of the fan being the fluid outlet 41 and the other side being the fluid inlet 42. When the fan is operating, the blades in the fan rotate and drive the heat transfer fluid 9 from the inlet 42 to the outlet 41, with the fluid generated at the outlet 41 of the fluid delivery device 4 being delivered to the heat dissipation module 2.

[0089] Please see Figure 2 , Figure 3A and Figure 3B , Figure 3A This is a schematic diagram of the appearance of heat dissipation module 2. Figure 3B This is a front view schematic diagram of the heat dissipation module 2. In some embodiments, the immersion cooling device 100 includes a plurality of heat dissipation modules 2 (such as...). Figure 1 On the left side, there are two heat dissipation modules 2 arranged horizontally along the X-axis (not limited to this, one heat dissipation module 2 can also be used), such as... Figure 1 The outlets 41 of each fluid delivery device 4 on the left face each heat dissipation module 2, and the heat transfer fluid 9 generated at the outlets 41 of each fluid delivery device 4 is guided to each heat dissipation module 2.

[0090] In some embodiments, the number of fluid delivery devices 4 corresponds to the number of heat dissipation modules 2, but this is not a limitation. In some embodiments, the number of fluid delivery devices 4 may be greater than or less than the number of heat dissipation modules 2. In some embodiments, two fluid delivery devices 4 can be used as a group, such as... Figure 1 The three fluid delivery devices 4 on the left side of the diagram are omitted, while the middle fluid delivery device 4 is omitted. Figure 1 The diagram shows the usage of the three fluid delivery devices 4 on the right. In some embodiments, two fluid delivery devices 4 are respectively positioned facing the two heat dissipation modules 2. However, this is not a limitation. In some embodiments, the two fluid delivery devices 4 can be positioned facing the sides of the two heat dissipation modules 2, and the heat energy of the heat dissipation modules 2 can be carried away by the fluid flow on the sides of the heat dissipation modules 2.

[0091] In some embodiments, three fluid delivery devices 4 may be used, such as Figure 1 The three fluid delivery devices 4 shown on the left are used (omitted). Figure 1The three fluid delivery devices 4 shown on the right are illustrated. Figure 1 In the diagram, the outlet 41 of the leftmost first fluid delivery device 4 and the outlet 41 of the rightmost second fluid delivery device 4 on the left face each heat dissipation module 2. Figure 1 The outlet 41 of the third fluid delivery device 4 in the middle on the left side faces the space between each heat dissipation module 2. The fluid generated at the outlet 41 of the third fluid delivery device 4 is delivered to the space between each heat dissipation module 2.

[0092] See Figure 1 and Figure 2 In some embodiments, the immersion cooling device 100 further includes a circuit board 6 and multiple electronic components 61 (or at least one electronic component 61), the circuit board 6 being located inside a housing 1, the housing 1 being a rectangular enclosed tank that can be filled with a non-conductive heat transfer fluid 9 (such as... Figure 1 The right side schematically represents the heat transfer fluid 9 inside the housing 1, indicated by an imaginary line formed by two points. The circuit board 6 and electronic components 61 are immersed in the heat transfer fluid 9. In some embodiments, each electronic component 61 is disposed as follows: Figure 6 The circuit board 6 shown is arranged on the left side and at intervals along the X-axis direction. However, not limited to this, electronic components 61 can be placed as follows: Figure 1 Other locations on the circuit board 6 shown. For example... Figure 1 The electronic components 61 shown on the left operate at high wattage, and multiple heat dissipation modules 2 are respectively combined with... Figure 1 Above each electronic component 61 shown on the left (e.g.) Figure 6 (As shown), it is used to absorb the heat emitted by each electronic component 61. In some embodiments, the electronic component 61 is a central processing unit (CPU chip) with a high heat output.

[0093] In some embodiments, the immersion cooling device 100 further includes an electronic component 63 (or multiple electronic components 63), the electronic component 63 being disposed on such as Figure 1 The position on the right side of the circuit board 6 shown is as follows: Figure 6 The fluid flowing through the heat dissipation module 2 is delivered to the electronic component 63, so that the heat generated by the electronic component 63 is carried away by the fluid. In some embodiments, the electronic component 63 is a chipset (Platform Controller Hub, abbreviated as PCH) or a switch.

[0094] In some embodiments, the circuit board 6 can be a finished product of an existing system. The circuit board 6 has electronic components 61 and a heat dissipation module 2. The circuit board 6 of the existing system is installed in the accommodating space 10 of the housing 1. Then, the fluid delivery device 4 and the flow guiding component 5 are installed, and the heat transfer fluid 9 is filled into the accommodating space 10 of the housing 1. The cooling module 3 is then placed on the housing 1, and the opening 11 of the housing 1 is closed to complete the assembly of all components. This method is easy to use and allows for rapid integration. In some embodiments, the housing 1 has a cable outlet (e.g., in...). Figure 1 A round hole is provided on the box 1 next to the number 9, through which the transmission line connected to the circuit board 6 can pass. The transmission line is used to transmit power to the circuit board 6 for operation and / or to transmit signals to connect the circuit board 6 to external devices. In addition, a gasket or waterproof glue can be installed between the transmission line and the outlet hole to seal it, so that the inside of the box 1 is airtight.

[0095] See Figure 1 and Figure 5 , Figure 5 This is a top view of the immersion cooling device 100. Solid lines represent the circuit board 6, heat dissipation module 2, and fluid delivery device 4, while dashed lines represent the housing 1 and cooling module 3. In some embodiments, the immersion cooling device 100 further includes multiple expansion components 62, each disposed on the circuit board 6 and located beside the electronic component 61, with expansion components 62 between each heat dissipation module 2. In this embodiment, the expansion component 62 is a dual-in-line memory module (DIMM), but it is not limited thereto; for example, the expansion component 62 could also be a display adapter or graphics card. The outlet 41 of the fluid delivery device 4 can face the expansion component 62, such as... Figure 1 The fluid generated at the outlet 41 of the fluid delivery device 4 in the middle left position shown in the figure is delivered to the expansion component 62 between each heat dissipation module 2, so that the heat generated by the expansion component 62 is carried away by the fluid.

[0096] See Figure 2 and Figure 6 , Figure 6 Illustration as follows Figure 5 The side cross-sectional view at position 6-6 shows the localized heat transfer fluid 9 within the housing 1, enclosed by an imaginary line formed by two points. Arrows indicate the fluid flow direction generated by each fluid delivery device 4 and the water inlet / outlet direction of the cooling plate 31. In some embodiments, the number of the two groups of multiple fluid delivery devices 4 located on both sides of the housing 1 is six, such as... Figure 2 The three fluid delivery devices 4 in the first group shown on the left are located inside the housing 1 on one side and at the bottom of the flow guiding member 5, as shown. Figure 2The three fluid delivery devices 4 in the second group shown on the right are located on the other side inside the housing 1 and on top of the flow guide member 5.

[0097] See Figure 2 and Figure 6 In some embodiments, such as Figure 2 The fluid delivery devices 4 in the first group shown on the left are as follows: Figure 2 The fluid delivery devices 4 in the second group shown on the right are coaxial (e.g., Figure 2 The fluid conveying devices 4 are arranged in a parallel double-row pattern (X-axis in the diagram), with each single row containing 3 fluid conveying devices 4, and the 3 fluid conveying devices 4 in the same group are spaced apart by a predetermined distance. Figure 5 As can be clearly seen in the top view shown, the six fluid conveying devices 4 in the double-row configuration are coaxially arranged. Figure 5 (The outlets 41 of the fluid conveying devices 4 on the left and right sides are correspondingly arranged to each other.) However, this is not a limitation; the six fluid conveying devices 4 in a double-row configuration can also be arranged non-coaxially. For example, a group of fluid conveying devices 4... Figure 5 The middle section is arranged along the X-axis, and another set of fluid conveying devices 4 is located in... Figure 5 The middle is not the X-axis (and) Figure 5 The X-axis in the diagram is arranged at an angle.

[0098] See Figure 6 As shown, in some embodiments, Figure 6 The fluid delivery device 4 on the left and the fluid delivery device 4 on the right are not arranged on the same horizontal plane, but are staggered. The left fluid delivery device 4 is located on the circuit board 6, below the guide plate 51, while the right fluid delivery device 4 is located above the guide plate 51 and adjacent to the cooling plate 31. The staggered arrangement of the left and right fluid delivery devices 4 can be partially overlapping (e.g., ...). Figure 6 The top of the fluid delivery device 4 on the left and the bottom of the fluid delivery device 4 on the right are overlapping images when projected onto a plane in the Z-axis direction, or they may be non-overlapping (e.g. Figure 8B The top of the fluid delivery device 4 on the left and the bottom of the fluid delivery device 4 on the right are non-overlapping images when projected onto a plane in the Z-axis direction.

[0099] See Figure 2 and Figure 6 In some embodiments, the immersion cooling device 100 further includes a flow guiding member 5, which is located inside the housing 1 and is used to guide the heat transfer fluid 9 to the heat dissipation module 2.

[0100] See Figure 2 and Figure 6In some embodiments, the flow guiding member 5 has a flow guiding plate 51 and two partition regions 52. The fluid conveying device 4 is positioned on the flow guiding plate 51, which separates the heat dissipation module 2 from the heat dissipation fin assembly 32. The heat dissipation module 2 and the heat dissipation fin assembly 32 are respectively located in each partition region 52, and the heat transfer fluid 9 in each partition region 52 is conveyed in opposite directions (e.g., ...). Figure 6 The right-side flow direction P1 and the left-side flow direction P2 are shown in the diagram. Figure 7 The heat transfer fluid 9 in the upper partition area 52 is transported to the left, and the heat transfer fluid 9 in the lower partition area 52 is transported to the right. In some embodiments, the heat exchange operation principle is as follows: the box 1 is divided into upper and lower layers by the upper and lower flow guide plate 51. The lower layer fluid transport device 4 transports the heat transfer fluid 9 from left to right, passes through the electronic component 61 and transfers the heat energy of the electronic component 61 to the upper layer. The upper layer fluid transport device 4 then transports the heat transfer fluid 9 from right to left, allowing the heat energy to be absorbed by the heat dissipation fin assembly 32 below the cooling plate 31 and to be transported away by heat exchange with the water in the cooling plate 31.

[0101] See Figure 2 and Figure 7 , Figure 7 For Figure 1 The diagram shows a three-dimensional cross-sectional view of the immersion cooling device 100, with arrows indicating the flow direction of the heat transfer fluid 9 and the cooling channel 33 in the cooling plate 31. In some embodiments, the guide plate 51 covers the sides of each fluid delivery device 4. With the guide plate 51 covering the fluid delivery device 4, the fluid delivery device 4 has its outlet 41 and inlet 42 exposed. The guide plate 51 is assembled in the housing 1 and can be divided into upper and lower partition areas 52. The guide plate 51 causes the heat transfer fluid 9 in the housing 1 to flow vertically, so that the heat transfer fluid 9 can be better circulated in the housing 1 and backflow is reduced.

[0102] See Figure 2 In some embodiments, the guide plate 51 can be a horizontally arranged flat plate, as shown in Figure 4. The long side of the horizontal plate is the same horizontal axis as the Z-axis, and the horizontal plate is arranged horizontally in the housing 1.

[0103] In some embodiments, the guide vane 51 may be a single, inclined flat plate, for example... Figure 6 The horizontal plate is rotated by an angle about the X-axis, so that the guide plate 51 is in the form of an inclined plate, for example in... Figure 6 The horizontal guide plate 51 is in the form of an inclined plate with the right side higher than the left side or vice versa. In some embodiments, each fluid conveying device 4 is inclined on the inclined plate, and each fluid conveying device 4 can generate an inclined fluid flow direction, increasing the applicability of the inclined fluid flow direction.

[0104] See Figure 6 In some embodiments, the guide plate 51 has a bend 511, which is located at or adjacent to the outlet 41 of the fluid conveying device 4, such as... Figure 6 The guide plate 51 shown is roughly stepped in side view. A small horizontal plane on the upper left and a large horizontal plane on the lower right of the guide plate 51 are located at different horizontal planes by a turning part 511. When the fluid generated by the fluid delivery device 4 flows to the turning part 511, the heat transfer fluid 9 will turn and change direction at the turning part 511 before flowing to the heat dissipation module 2, such as... Figure 9 As shown, the multiple arrow patterns at the turning point 511 appear dense and accumulated, indicating that the speed of the heat transfer fluid 9 slows down at the turning point 511.

[0105] See Figure 6 In some embodiments, the turning portion 511 is a vertical plate 511a, the direction of which is the same as the Y-axis direction, and the vertical plate 511a is parallel to the surface of the outlet 41 of the fluid conveying device 4. When the fluid conveying device 4 generates heat transfer fluid 9 to flow to the vertical plate 511a, the vertical plate 511a is perpendicular to the flow direction of the heat transfer fluid 9 and blocks the flow. The heat transfer fluid 9 will turn and change its flow direction at the vertical plate 511a before flowing to the heat dissipation module 2.

[0106] See Figure 8A , Figure 8A For Figure 6 The side cross-sectional view of the immersion cooling device 100 shows the bend 511 of the guide plate 51 as an inclined plate. In some embodiments, the bend 511 is an inclined plate 511b, and the inclined plate 511b has an angle θ1 with the surface of the fluid conveying device 4, the angle θ1 being less than 90 degrees. Figure 8A The included angle θ1 of the inclined plate 511b on the left side can be set to the required angle as needed, for example, when the position of the fluid conveying device 4 changes. Figure 8A The distance between the fluid delivery device 4 on the left and the heat dissipation module 2 becomes longer, and the included angle θ1 can become smaller, less than 60 degrees, which facilitates fluid guidance and delivery; for example, the volume of the fluid delivery device 4 changes (e.g., Figure 8A and Figure 8C The fluid conveying device 4 is large in size. Figure 8B and Figure 8D The fluid conveying device 4 is small in size, such as Figure 8A The larger volume of the fluid delivery device 4 on the left is changed to, for example Figure 8B The smaller volume of the fluid delivery device 4 on the left. Figure 8AMost of the fluid generated by the fluid delivery device 4 on the left can be directed to the heat dissipation module 2. A small portion of the fluid generated by the fluid delivery device 4 must be redirected and delivered to the heat dissipation module 2 via the inclined plate 511b. The included angle θ1 of the inclined plate 511b can be increased to close to 90 degrees to facilitate fluid guidance and delivery.

[0107] See Figure 8C , Figure 8C For Figure 6 The side cross-sectional view of the immersion cooling device 100 shows that the multiple guide plates 51 are inclined flat plates 511b. In some embodiments, the flow guiding member 5 has multiple guide plates 51, each guide plate 51 being a small inclined flat plate 511b. Each inclined flat plate 511b is located adjacent to the outlet 41 of each fluid conveying device 4. Each inclined flat plate 511b is used to guide the heat transfer fluid 9 conveyed by each fluid conveying device 4 to the heat dissipation module 2 and the heat dissipation fin assembly 32, respectively. Each inclined flat plate 511b has an angle θ2 or θ3 with the surface of each fluid conveying device 4, and the angles θ2 and θ3 are less than 90 degrees. Figure 8C The angle θ2 shown on the left is less than Figure 8C The angle θ3 shown on the right. Figure 8C The included angle θ2 of the inclined plate 511b on the left side can be set to the required angle as needed, for example, when the position of the fluid conveying device 4 changes. Figure 8C The distance between the fluid delivery device 4 on the left and the heat dissipation module 2 is relatively long, allowing the included angle θ2 to be smaller, less than 60 degrees, which facilitates fluid guidance and delivery; for example Figure 8C The included angle θ3 of the inclined plate 511b on the right side can be set to the required angle as needed, for example, when the position of the fluid conveying device 4 changes. Figure 8C The distance between the fluid delivery device 4 on the right and the heat dissipation module 2 is relatively short, and the included angle θ3 can be increased to nearly 90 degrees, which facilitates fluid guidance and delivery.

[0108] In some embodiments, such as Figure 8C The included angle θ2 of the guide vane 51 on the left side is as follows: Figure 8C The included angle θ3 of the guide vane 51 on the right side can be the same or different; for example Figure 8C The included angle θ2 of the guide plate 51 on the left side can be set to the required angle as needed. For example, when the position or volume of the fluid conveying device 4 or the position or volume of the heat dissipation module 2 changes, the included angle θ2 of the guide plate 51 can be further changed so that the fluid flow generated at the outlet 41 of the fluid conveying device 4 can be guided along the guide plate 51 to the heat dissipation module 2; Figure 8CThe included angle θ3 of the guide plate 51 on the right side can be set to the required angle as needed. For example, when the position or volume of the fluid delivery device 4 or the position or volume of the heat dissipation module 2 changes, the guide plate 51 can further change the included angle θ3 so that the fluid flow generated at the outlet 41 of the fluid delivery device 4 can be guided along the guide plate 51 to the heat dissipation fin assembly 32.

[0109] In some embodiments, the flow guiding member 5 has at least one flow guiding plate 51 (e.g., a flow guiding plate 51). Figure 8C The guide plate 51 on the right side is omitted, while the guide plate 51 on the left side is retained. The guide plate 51 is a small inclined plate 511b, which is set at the outlet 41 of a fluid conveying device 4. The inclined plate 511b is used to guide the heat transfer fluid 9 conveyed by the fluid conveying device 4 to the heat dissipation module 2. There is an angle θ2 between the inclined plate 511b and the surface of the fluid conveying device 4, which is less than 90 degrees.

[0110] In some embodiments, when the guide plate 51 of the flow guiding member 5 is installed inside the housing 1, such as Figure 9 The fluid conveying devices 4 on the left and right sides of the middle section cause the heat transfer fluid 9 inside the housing 1 to flow in stratified directions, causing the heat transfer fluid 9 to be split above and below the guide plate 51 and circulate in a counterclockwise direction, such as... Figure 9 The heat transfer fluid 9, delivered by the fluid delivery device 4 on the left, flows downwards through the guide plate 51. After passing through the heat dissipation module 2, the heat transfer fluid 9 is drawn in by the fluid delivery device 4 on the right, helping to carry the heat energy of the high-wattage electronic components 61 and 63 to the upper heat dissipation fin assembly 32. Then, the heat is dissipated by the water in the cooling channel 33 of the upper cooling plate 31. The flow velocity of the heat transfer fluid 9 is faster closer to the fluid delivery device 4 and slower further away from the fluid delivery device 4. Figure 9 The fluid conveying device 4 on the left conveys the heat transfer fluid 9 from left to right, such as... Figure 9 The fluid delivery device 4 on the right side delivers the heat transfer fluid 9 from right to left. The heat transfer fluid 9 is diverted via the guide plate 51, allowing it to effectively enter the heat dissipation module 2 and carry away its heat. The heat transfer fluid 9 then effectively enters the heat dissipation fin assembly 32, where the cooling plate 31 carries away its heat. In some embodiments, the temperature of the electronic component 61 (CPU) is approximately 54 degrees Celsius (Tc), the ambient temperature near the electronic component 61 is approximately 40.5 degrees Celsius (Ta), the temperature of the partition area 52 above and below the guide plate 51 is approximately 40.5 to 40.6 degrees Celsius, the wattage of the electronic component 61 is 350 watts (W), and the thermal resistance (R) of the heat dissipation module 2 is 0.039 (C / W), calculated using the formula: R = Tc - Ta / W (C / W).

[0111] See Figure 8D , Figure 8D For Figure 6 This is a side cross-sectional view of the immersion cooling device 100, showing the state without the use of the guide plate 51. In some embodiments, the guide plate 51, which is the component for guiding the flow, may not be installed inside the housing 1. When the guide plate 51 is omitted, the fluid delivery device 4 can be fixed in a predetermined position inside the housing 1 by a bracket or other fixing structure. When each fluid delivery device 4 is in operation, such as Figure 10 The fluid delivery devices 4 on the left and right sides of the housing 1 cause disturbances in the flow direction of the heat transfer fluid 9, resulting in circulation or backflow. This helps the high-wattage electronic components 61 carry their heat to the upper heat dissipation fin assembly 32. Then, the heat is dissipated by the water in the cooling channels 33 of the upper cooling plate 31. The flow speed of the heat transfer fluid 9 is faster closer to the fluid delivery device 4 and slower further away from the fluid delivery device 4. Figure 10 The fluid conveying device 4 on the left conveys the heat transfer fluid 9 from left to right, such as... Figure 10 The fluid delivery device 4 on the right side delivers the heat transfer fluid 9 from right to left, causing the heat transfer fluid 9 to collide and flow back near the middle of the housing 1. In some embodiments, the temperature of the electronic component 61 (CPU) is approximately 60 degrees Celsius (Tc), the ambient temperature near the electronic component 61 is approximately 41.1 degrees Celsius (Ta), the temperature of various parts inside the housing 1 is approximately 41.1 to 41.2 degrees Celsius, the wattage of the electronic component 61 is 350 watts (W), and the thermal resistance (R) of the heat dissipation module 2 is 0.054 (C / W), calculated using the formula: R = Tc - Ta / W (C / W).

[0112] In some embodiments, the circuit board 6 has multiple electronic components 61, electronic parts 63 and other heat-generating components. The total heat source in the housing 1 has 1000 watts (W) of heat energy. Without the addition of the heat guide plate 51, the temperature inside the housing 1 can be effectively reduced. With the addition of the heat guide plate 51, the temperature inside the housing 1 can be reduced even more effectively. The temperature of the electronic component 61 (CPU) decreases by about 31%, and the thermal resistance decreases by about 28%.

[0113] In some embodiments, the thermal resistance of the heat dissipation module 2 using conventional air cooling is 0.137 (C / W), the thermal resistance of the heat dissipation module 2 without the guide plate 51 is 0.054 (C / W), and the thermal resistance of the heat dissipation module 2 with the guide plate 51 is 0.039 (C / W). The thermal resistance of the heat dissipation module 2 without the guide plate 51 is 60.6%, while the thermal resistance of the heat dissipation module 2 with the guide plate 51 is increased to 71.5%.

[0114] In some embodiments, the height of a standard server is measured in U (1U equals 1.75 inches, which is 44.45 mm). A 1U server chassis has a capacity of approximately 15.7L. The immersion cooling unit 100 reduces the amount of heat transfer fluid 9 used within its enclosure 1. Since the heat transfer fluid 9 does not need to exchange heat with air or water outside the enclosure 1, the amount of heat transfer fluid 9 used within the enclosure 1 is relatively less compared to the amount required to transport heat transfer fluid 9 to the outside of the enclosure 1 in conventional methods. Therefore, there is no external heat exchange circulation, thus reducing the amount of heat transfer fluid 9 required by conventional methods that would pass through the coolant distribution unit (CDU) and manifold outside the enclosure 1. The usage is approximately 30 liters (L). The price of heat transfer fluid 9 is typically around 180 USD / L. The immersion cooling unit 100 can save approximately 5400 USD (180 x 30), representing a cost saving of approximately 65.7%.

[0115] In summary, according to some embodiments, the cooling module covers the opening of the box, and the heat transfer fluid exchanges heat inside the box through the cooling plate and heat dissipation fins of the cooling module. The heat transfer fluid does not need to exchange heat with air or water outside the box. The amount of heat transfer fluid used inside the box can be relatively reduced compared to the amount of heat transfer fluid that needs to be transported to the outside of the box in the traditional method.

Claims

1. An immersion cooling system, characterized in that, include: A housing, including an opening for communicating between the interior and exterior of the housing; A heat transfer fluid is located inside the chamber; A heat dissipation module, which is located inside the enclosure; and A cooling module includes a cooling plate and a heat dissipation fin assembly. The cooling plate covers the opening and has a cooling channel. The cooling channel is disposed on the cooling plate and includes an inlet and an outlet. The inlet and the outlet are respectively located on both sides of the cooling plate. One side of the heat dissipation fin assembly contacts the cooling plate and the other side of the heat dissipation fin assembly is located inside the housing. It also includes a flow guiding member located inside the housing. The flow guiding member has a flow guiding plate that forms two partitioned areas inside the housing. The heat dissipation module and the heat dissipation fin assembly are located in each partitioned area, and the heat transfer fluid in each partitioned area is transported in opposite directions.

2. The immersion cooling system according to claim 1, characterized in that, It also includes a fluid delivery device, one outlet of which faces the heat dissipation module, and the fluid generated at the outlet of the fluid delivery device flows to the heat dissipation module.

3. The immersion cooling system according to claim 2, characterized in that, The fluid delivery device is positioned on the guide plate, which separates the heat dissipation module from the heat dissipation fin assembly.

4. The immersion cooling system according to claim 3, characterized in that, The guide vane has a bend that is located at or adjacent to the outlet of the fluid conveying device.

5. The immersion cooling system according to claim 4, characterized in that, The turning point is a vertical plate that is parallel to the surface of the fluid conveying device, or the turning point is an inclined plate that has an angle less than 90 degrees with the surface of the fluid conveying device.

6. The immersion cooling system according to claim 3, characterized in that, It also includes multiple fluid delivery devices, each fluid delivery device forming two groups opposite each other and arranged on both sides of the housing. The outlet of each fluid delivery device faces the heat dissipation module and the heat dissipation fin group respectively, and the fluid generated at the outlet of each fluid delivery device is delivered to the heat dissipation module and the heat dissipation fin group respectively.

7. The immersion cooling system according to claim 6, characterized in that, It also includes multiple heat dissipation modules, with the outlet of each fluid delivery device facing each heat dissipation module and guiding the heat transfer fluid to each heat dissipation module.

8. The immersion cooling system according to claim 6, characterized in that, The flow guiding component has multiple flow guiding plates, each of which is located adjacent to the outlet of each fluid conveying device. Each flow guiding plate is used to guide the heat transfer fluid conveyed by each fluid conveying device to the heat dissipation module and the heat dissipation fin assembly. Each flow guiding plate is an inclined plate, and each inclined plate has an angle with the surface of each fluid conveying device, and each angle is less than 90 degrees.

9. The immersion cooling system according to claim 8, characterized in that, It also includes a circuit board and multiple electronic components, each of which is mounted on the circuit board, which is located inside the housing, and each of which is connected to the electronic component.

10. The immersion cooling system according to claim 2, characterized in that, It also includes a circuit board and a central processing unit, the central processing unit being mounted on the circuit board, the circuit board being located inside the housing, and the heat dissipation module being integrated with the central processing unit.

11. The immersion cooling system according to claim 10, characterized in that, It also includes multiple expansion components, each of which is disposed on the circuit board and located on the side of the central processing unit.

12. The immersion cooling system according to claim 10, characterized in that, The heat dissipation module has a base and multiple heat sinks, each heat sink being disposed on the base. The base has multiple baffles, each baffle being located on both sides of the heat sinks. The thickness of each baffle is greater than the thickness of each heat sink. The base and each heat sink can be an integral one-piece component, or the base and each heat sink can be two separate components.

13. The immersion cooling system according to claim 12, characterized in that, The base has multiple locking components, and each heat sink is arranged in a cross shape on the base. Each locking component is locked around the heat sink and secured to the circuit board.

14. The immersion cooling system according to claim 12, characterized in that, The thickness of each heat sink ranges from 0.8mm to 1.2mm, and the distance between each heat sink ranges from 2.8mm to 3.6mm.

15. The immersion cooling system according to claim 12, characterized in that, The direction of one long side of each heat sink and one long side of the heat dissipation fin assembly is parallel to the direction of the heat transfer fluid, and the heat transfer fluid passes in the forward direction between each heat sink and the heat dissipation fin assembly.

16. The immersion cooling system according to claim 2, characterized in that, The cooling channel includes a flow channel arranged in a continuous S-shape within the cooling plate. The inlet is located on one side of the cooling plate and connected to the flow channel, and the outlet is located on the other side of the cooling plate and connected to the flow channel.

17. A cooling device, characterized in that, include: A housing, including an opening for communicating between the interior and exterior of the housing; A heat dissipation module, which is located inside the enclosure; and A cooling module includes a cooling plate and a heat dissipation fin assembly. The cooling plate covers the opening and has a cooling channel. The cooling channel is disposed on the cooling plate and includes an inlet and an outlet. The inlet and the outlet are respectively located on both sides of the cooling plate. One side of the heat dissipation fin assembly contacts the cooling plate and the other side of the heat dissipation fin assembly is located inside the housing. It also includes a flow guiding member located inside the housing. The flow guiding member has a flow guiding plate that forms two partitioned areas inside the housing. The heat dissipation module and the heat dissipation fin assembly are located in each partitioned area, and the heat transfer fluid in each partitioned area is transported in opposite directions.

18. The cooling device according to claim 17, characterized in that, It further includes a fluid delivery device, one outlet of which faces the heat dissipation module, and the fluid generated at the outlet of the fluid delivery device flows to the heat dissipation module. The fluid delivery device is positioned on the guide plate, which separates the heat dissipation module from the heat dissipation fin assembly.

19. A cooling device, characterized in that, Suitable for containing a heat transfer fluid, the cooling device includes: A housing, including an opening for communicating the interior of the housing to the exterior of the housing, wherein the heat transfer fluid is located inside the housing; A heat dissipation module, which is located inside the enclosure; and A cooling module includes a cooling plate and a heat dissipation fin assembly. The cooling plate covers the opening and has a cooling channel. The cooling channel is disposed on the cooling plate and includes an inlet and an outlet. The inlet and the outlet are respectively located on both sides of the cooling plate. One side of the heat dissipation fin assembly contacts the cooling plate and the other side of the heat dissipation fin assembly is located inside the housing. It also includes a flow guiding member located inside the housing. The flow guiding member has a flow guiding plate that forms two partitioned areas inside the housing. The heat dissipation module and the heat dissipation fin assembly are located in each partitioned area, and the heat transfer fluid in each partitioned area is transported in opposite directions.

20. The cooling device according to claim 19, characterized in that, It further includes a fluid delivery device, one outlet of which faces the heat dissipation module, and the fluid generated at the outlet of the fluid delivery device flows to the heat dissipation module. The fluid delivery device is positioned on the guide plate, which separates the heat dissipation module from the heat dissipation fin assembly.

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