Semiconductor package force adjustment type bonding device

Abstract

The application provides a semiconductor packaging force adjusting type attaching device, the device comprises a heating mechanism, an attaching head, a pressure sensor, a servo motor, a voice coil motor and a linear motor structure, and the device further comprises a first stage base, a second stage base, a third stage base and a fourth stage base. The servo motor, the linear motor structure and the voice coil motor are used for driving the attaching head respectively or cooperatively, the upper limit of the attaching force is high, the size interval of the adjustable force is larger, the device is suitable for different semiconductor chips, and various different operation requirements can be met. Meanwhile, the pressure sensor is arranged, and the linear motor structure is matched with the pressure sensor. When the driver detects the pressure change value on the pressure sensor, closed loop calculation is performed, the effect that control and detection are synchronously performed is achieved, the closed loop force control of the large force is achieved while switching, the attaching precision is improved, and the attaching precision is improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and in particular to a semiconductor packaging force-adjustable bonding device. Background Technology

[0002] Currently, semiconductor packaging refers to the process of processing tested wafers into individual chips according to product models and functional requirements. In the semiconductor packaging industry, chip mounters are generally used for semiconductor packaging. Existing technologies, such as the Besi Datacon 2200 chip mounter and the Infotech Sinter Bonder chip mounter, require bonding some chips in a high-temperature and high-pressure environment to meet process requirements. The bonding head used is generally driven downwards by a linear motor, forming an open-loop structure. Due to structural limitations, it cannot provide sufficient force. Although the applied force can be controlled to some extent by adjusting the current, the adjustment range is limited, and the dynamic rigidity of the linear motor is extremely low, which cannot provide buffering and damping, making it prone to vibration and unable to provide accurate control. Therefore, a new type of high-precision bonding device is needed that can provide sufficient force, provide more accurate control of the applied force, and have a larger force adjustment range. Summary of the Invention

[0003] The purpose of this invention is to provide a high-precision semiconductor packaging force-adjustable bonding device that provides sufficient force, has a large range of switching between large and small forces, and can achieve closed-loop force control of large force while switching.

[0004] To achieve the above objectives, the technical solution of the present invention is as follows:

[0005] A semiconductor packaging force-adjustable bonding device includes a heating mechanism, a bonding head, and a pressure sensor. The device includes a servo motor, a voice coil motor, and a linear motor structure. The device also includes a first-stage base, a second-stage base, a third-stage base, and a fourth-stage base.

[0006] A servo motor with its output shaft pointing downwards is mounted on the first-stage base. The output shaft of the servo motor is connected to the second-stage base, which is slidably connected to the first-stage base. A linear motor structure is mounted on the second-stage base, and its output shaft is connected to the fourth-stage base. A third-stage base is mounted on the second-stage base, which is slidably connected to the fourth-stage base. A voice coil motor is also mounted on the third-stage base, and its output shaft is connected to the fourth-stage base. A bonding head is located at the lower end of the fourth-stage base, and the bonding head encloses a heating mechanism. A pressure sensor is mounted on the output shaft of the linear motor structure.

[0007] Using the above structure, three sets of semiconductor package bonding force structures are formed by servo motors, voice coil motors, and linear motors. The servo motor on the first-stage base provides the maximum bonding force. The first-stage base serves as the mounting position for the pick-and-place machine. The servo motor drives the second-stage base downwards relative to the first-stage base via a sliding connection. This downward movement, caused by the servo motor on the first-stage base, causes the entire structure on the second-stage base to move downwards, thus driving the bonding head for bonding operations. The linear motor on the second-stage base and the voice coil motor on the third-stage base work together on the fourth-stage base, causing the entire structure on the fourth-stage base to move downwards, further driving the bonding head for bonding operations. The simultaneous use of these three force structures provides sufficient bonding force. Furthermore, the voice coil motor and linear motor... The force applied by the motor structure is proportional to the applied current. By controlling the current, the force can be switched between high and low. The three force-applying structures can be used independently, providing three force ranges: high, medium, and low. The upper limit of the bonding force is high, and the adjustable force range is wide, making it suitable for different semiconductor chips and meeting various operational needs. A pressure sensor is also included, working in conjunction with the servo motor or linear motor structure. The driver detects the pressure change value uploaded by the pressure sensor and performs closed-loop calculations, achieving simultaneous control and detection. This allows for closed-loop force control at high force levels while switching between different applications. This invention, through the cooperation of multiple force-applying structures, offers a wide adjustment range, a high upper limit of the applied force, and relatively accurate control of the applied force. Therefore, it has a wide range of applications, suitable for various semiconductor bonding requirements, with controllable force and high bonding accuracy.

[0008] Preferably, the second-level base, the third-level base, and the fourth-level base are all L-shaped plates.

[0009] Preferably, the voice coil motor has two sets, which are respectively set at both ends of the third-stage base and connected together to the fourth-stage base.

[0010] It is evident that by incorporating two sets of voice coil motors, it is beneficial to provide stronger force and ensure a rapid and smooth switching between high and low force.

[0011] Preferably, a DDR motor is also provided between the fourth-stage base and the bonding head. The DDR motor is fixedly connected to the fourth-stage base, and its output axis is connected downward to the bonding head.

[0012] Therefore, by placing the DDR motor between the fourth-stage base and the bonding head, and directly driving the bonding head to rotate, the bonding head can be adjusted without affecting the bonding process. This allows the bonding head to be adjusted according to actual requirements, thereby improving bonding accuracy.

[0013] Preferably, the first-level base and the second-level base are slidably connected by a first-level guide mechanism, and the third-level base and the fourth-level base are slidably connected by a second-level guide mechanism.

[0014] Preferably, both the first-stage guide mechanism and the second-stage guide mechanism are sliding structures composed of guide rails and sliders.

[0015] Therefore, by using a first-stage guide mechanism and a second-stage guide mechanism consisting of a guide rail and a slider, the stroke of vertical movement or downward contact is limited, providing positioning and stability for the servo motor, linear motor and voice coil motor during operation, and preventing small deviations caused by minor vibrations during operation, thereby improving the accuracy of contact.

[0016] Preferably, the linear motor structure includes a linear motor mover and a linear motor stator. The linear motor mover is located at the upper end of the fourth-stage base, and the linear motor stator is located at the lower end of the second-stage base. The linear motor mover and the linear motor stator are connected to form a motor.

[0017] Therefore, it can be seen that by constructing a linear motor structure with a linear motor mover and a linear motor stator, and by leveraging the high precision, repeatability, and speed of the linear motor, and combining it with a pressure sensor to form a closed-loop force control, the production efficiency can be improved while ensuring precision during semiconductor bonding operations. Attached Figure Description

[0018] Figure 1 This is an oblique diopter view of the present invention.

[0019] Figure 2 This is the front view of the present invention.

[0020] Figure 3 This is the right view of the present invention. Detailed Implementation

[0021] The present invention will now be described in detail with reference to the accompanying drawings.

[0022] like Figure 1-3As shown, a semiconductor packaging force-adjustable bonding device includes a heating mechanism 10, a bonding head 14, and a pressure sensor 11. The device includes a servo motor 2, a voice coil motor 9, and a linear motor structure. It also includes a first-stage base 1, a second-stage base 4, a third-stage base 6, and a fourth-stage base 7. The first-stage base 1 has a servo motor 2 with its output shaft pointing downwards. The output shaft of the servo motor 2 is connected to the second-stage base 4, and the first-stage base 1 and the second-stage base 4 are slidably connected. The second-stage base 4 has a linear motor structure, and the output shaft of the linear motor structure is connected to the fourth-stage base 7. The second-stage base 4 has a third-stage base 6, which is slidably connected to the fourth-stage base 7. The third-stage base 6 also has a voice coil motor 9, and the output shaft of the voice coil motor 9 is connected to the fourth-stage base 7. The lower end of the fourth-stage base 7 has a bonding head 14, which encloses the heating mechanism 10. The output shaft of the linear motor structure has a pressure sensor 11.

[0023] Preferably, the second-level base 4, the third-level base 6, and the fourth-level base 7 are all L-shaped plates.

[0024] Preferably, the voice coil motor 9 has two sets respectively set at both ends of the third-stage base 6 and connected together to the fourth-stage base 7.

[0025] Preferably, a DDR motor 5 is also provided between the fourth-level base 7 and the bonding head 14. The DDR motor 5 is fixedly connected to the fourth-level base 7, and its output axis is connected downward to the bonding head 14.

[0026] Preferably, the first-stage base 1 and the second-stage base 4 are slidably connected by a first-stage guide mechanism 3;

[0027] The third-level base 6 and the fourth-level base 7 are slidably connected by a second-level guide mechanism 8.

[0028] Preferably, both the first-stage guide mechanism 3 and the second-stage guide mechanism 8 are sliding structures composed of guide rails and sliders.

[0029] Preferably, the linear motor structure includes a linear motor mover 12 and a linear motor stator 13;

[0030] The linear motor mover 12 is located on the upper end of the fourth-stage base 7, and the linear motor stator 13 is located on the lower end of the second-stage base 4. The linear motor mover 12 and the linear motor stator 13 are connected together to form a motor.

[0031] In this embodiment, the device is installed in a pick-and-place machine and connected to the machine's control system. The first-stage base 1 serves as the mounting position for the pick-and-place machine. When the pick-and-place machine performs semiconductor bonding operations, it drives this device to bond the semiconductors. This device has three sets of force-giving structures, which can be used individually or in combination. It provides a high upper limit for bonding force and a wider adjustable force range, making it suitable for different semiconductor chips and meeting various operational needs. In this embodiment, the linear motor structure is formed by the linear motor mover 12 and the linear motor stator 13, serving as the linear motor... The linear motor mover 12 on the output shaft of the structure, together with the pressure sensor 11 mounted on the linear motor mover 12, utilizes the high accuracy, repeatability, and speed of the linear motor to form a closed-loop force control with the pressure sensor. During semiconductor bonding operations, this improves production efficiency while ensuring accuracy. When the driver or controller of the chip mounter detects the pressure change value uploaded by the pressure sensor 11, it performs closed-loop calculations to achieve the effect of simultaneous control and detection. This enables strong closed-loop force control while switching, avoiding situations such as chip damage due to excessive force, thus forming a high-precision force-controlled bonding head.

[0032] The servo motor 2 on the first-level base 1 provides the maximum bonding force. The first-level base 1 serves as the mounting position for the pick-and-place machine. The servo motor 2 drives the second-level base 4 downwards, which is connected downwards relative to the first-level base 1 via a sliding connection. That is, the servo motor 2 on the first-level base 1 drives the second-level base 4 downwards, causing the entire structure on the second-level base 4 to move downwards, thereby driving the bonding head 14 to perform bonding operations. The linear motor structure on the second-level base 4 and the voice coil motor 9 on the third-level base work together on the fourth-level base 7, causing the entire structure on the fourth-level base 7 to move downwards, thereby driving the bonding head 14 to perform bonding operations, providing a force of 30 kg or more. The three sets of powerful structures work together to provide sufficient force for bonding. At the same time, by utilizing the characteristic that the force of the voice coil motor 9 and the linear motor structure is proportional to the applied current, the current can be controlled to switch between high and low force.

[0033] Compared to a single set of bonding structures, a pick-and-place machine using this bonding device can selectively use a single bonding structure. It offers a higher upper limit for the bonding force and a wider adjustable force range, making it suitable for different semiconductor chips and meeting various operational needs. The resulting products have higher precision.

[0034] The device is equipped with a DDR motor 5 that can drive the bonding head 14. During use, in conjunction with the vision sensor inside the pick and place machine, the bonding head 14 can be adjusted according to actual requirements, further improving bonding accuracy.

[0035] The heating mechanism 10 heats the bonding head 14. For chips that require bonding in a high-temperature and high-pressure environment, it is convenient to directly heat the bonding head 14 without the need for additional heating equipment or to replace it with a special thermal bonding equipment.

[0036] The above is a detailed description of the present invention in conjunction with specific embodiments, and it should not be construed that the specific embodiments of the present invention are limited to these descriptions. For those skilled in the art, any equivalent substitutions or obvious modifications made without departing from the concept of the present invention, and which have the same performance or use, should be considered to fall within the patent protection scope defined by the submitted claims.

Claims

1. A semiconductor packaging force-adjustable bonding device, the device comprising a heating mechanism (10), a bonding head (14), and a pressure sensor (11), characterized in that: The device includes a servo motor (2), a voice coil motor (9), and a linear motor structure; The device also includes a first-stage base (1), a second-stage base (4), a third-stage base (6), and a fourth-stage base (7). A servo motor (2) with its output shaft pointing downwards is provided on the first-stage base (1), and the output shaft of the servo motor (2) is connected to the second-stage base (4); The first-stage base (1) and the second-stage base (4) are slidably connected; A linear motor structure is provided on the second-stage base (4), and the output shaft of the linear motor structure is connected to the fourth-stage base (7). A third-level base (6) is provided on the second-level base (4); The third-level base (6) and the fourth-level base (7) are slidably connected; The third-level base (6) is also provided with a voice coil motor (9), and the output shaft of the voice coil motor (9) is connected to the fourth-level base (7). The lower end of the fourth-level base (7) is provided with a bonding head (14), and the bonding head is wrapped with a heating mechanism (10). The output shaft of the linear motor structure is equipped with a pressure sensor (11).

2. The semiconductor packaging force-adjustable bonding device according to claim 1, characterized in that: The second-level base (4), the third-level base (6) and the fourth-level base (7) are all L-shaped plates.

3. The semiconductor packaging force-adjustable bonding device according to claim 1, characterized in that: The voice coil motor (9) has two sets respectively set at both ends of the third-stage base (6) and connected to the fourth-stage base (7).

4. The semiconductor packaging force-adjustable bonding device according to claim 1, characterized in that: A DDR motor (5) is also provided between the fourth-level base (7) and the bonding head (14). The DDR motor (5) is fixedly connected to the fourth-level base (7), and its output axis is connected downward to the bonding head (14).

5. The semiconductor packaging force-adjustable bonding device according to claim 1, characterized in that: The first-stage base (1) and the second-stage base (4) are slidably connected by a first-stage guide mechanism (3); The third-level base (6) and the fourth-level base (7) are slidably connected by a second-level guide mechanism (8).

6. The semiconductor packaging force-adjustable bonding device according to claim 5, characterized in that: Both the first-stage guide mechanism (3) and the second-stage guide mechanism (8) are sliding structures composed of guide rails and sliders.

7. A semiconductor packaging force-adjustable bonding device according to claim 1, characterized in that: The linear motor structure includes a linear motor mover (12) and a linear motor stator (13); The linear motor mover (12) is located on the upper end of the fourth-stage base (7), and the linear motor stator (13) is located on the lower end of the second-stage base (4). The linear motor mover (12) and the linear motor stator (13) are connected together to form a motor.

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