Capacitive microphone manufacturing method and capacitive microphone

Abstract

The application discloses a condenser microphone preparation method and a condenser microphone, and relates to the technical field of condenser microphone preparation methods. The condenser microphone preparation method comprises the following steps: taking a polymer substrate as a substrate, and sequentially forming a microphone main body and a dustproof screen on the polymer substrate by using a three-dimensional printing technology; turning over the polymer substrate, the microphone main body and the dustproof screen which are connected in an integrated mode, so that the polymer substrate is placed upwards; peeling the polymer substrate from one side of the microphone main body which is far away from the dustproof screen; and depositing an electrode on one side of the microphone main body which is far away from the dustproof screen, so as to form a complete condenser microphone. The technical scheme is aimed at reducing the preparation difficulty of the condenser microphone preparation method, thereby improving the structural stability of the condenser microphone.

Description

Technical Field

[0001] This invention relates to the field of microphone technology, and in particular to a method for manufacturing a condenser microphone and a condenser microphone. Background Technology

[0002] In recent years, electronic devices such as smartphones, smartwatches, and wearable products have become increasingly prevalent in people's daily lives. Furthermore, with technological advancements, the performance requirements for these devices are gradually increasing. MEMS microphones, as acoustic components in electronic products, play a crucial role in evaluating product quality.

[0003] MEMS microphones mainly consist of a diaphragm, a backplate, and a housing. To prevent foreign objects from entering, a dustproof mesh is attached between the backhole and the PCB board during MEMS microphone packaging. This dustproof mesh has a certain thickness, which limits the microphone's package size. Designing the entire condenser microphone as a single, molded structure facilitates packaging. However, the overall depth of the backhole in MEMS microphones is relatively large. If traditional MEMS fabrication processes are used to manufacture an integrated dustproof mesh structure within the backhole, a sacrificial layer process is typically required, making the overall MEMS fabrication process extremely complex. Summary of the Invention

[0004] The main objective of this invention is to provide a method for manufacturing a condenser microphone and a condenser microphone, aiming to reduce the manufacturing difficulty of the condenser microphone and thus improve the structural stability of the condenser microphone.

[0005] To achieve the above objectives, the present invention proposes a method for manufacturing a condenser microphone, the method comprising:

[0006] Using a polymer substrate as a base, the microphone body and dustproof mesh are sequentially formed on the polymer substrate using 3D printing technology.

[0007] Separate the polymer substrate from the side of the microphone body away from the dustproof mesh;

[0008] The microphone body and the dustproof mesh are flipped and transferred to allow the polymer substrate to peel off from the microphone body and the dustproof mesh;

[0009] Electrodes are deposited on the side of the microphone body away from the dustproof mesh to form a complete condenser microphone.

[0010] In one embodiment, the step of separating the polymer substrate from the side of the microphone body away from the dustproof mesh includes:

[0011] The microphone body and the dustproof mesh are subjected to acid washing to separate the polymer substrate from the microphone body.

[0012] In one embodiment, the step of sequentially forming the microphone body and the dustproof mesh on the polymer substrate using 3D printing technology, with the polymer substrate as the substrate, includes:

[0013] A back electrode layer and a micropillar structure are printed onto the polymer substrate.

[0014] An outlet layer shell is printed on the side of the back electrode layer facing away from the polymer substrate;

[0015] A vibrating diaphragm is formed on the side of the gas layer shell opposite to the back electrode layer;

[0016] A back cavity shell is formed on the side of the vibrating diaphragm facing away from the gas layer shell;

[0017] The dustproof net is formed on the side of the back cavity shell facing away from the vibrating diaphragm.

[0018] The present invention also proposes a condenser microphone, which is manufactured using the condenser microphone manufacturing method described above. The condenser microphone includes a microphone body and a dustproof mesh. The microphone body includes a shell structure, a back electrode layer, and a diaphragm. The shell structure has an inner cavity and a back opening communicating with the inner cavity. The back electrode layer and the diaphragm are both disposed in the inner cavity, and the back electrode layer is spaced apart from the diaphragm to form an air chamber. The dustproof mesh is disposed in the shell structure and located at the back opening, and the dustproof mesh is located on the side of the diaphragm facing away from the back electrode layer.

[0019] In one embodiment, the dustproof net is provided with multiple microchannels, which are arranged at intervals, and each microchannel is used for external airflow.

[0020] In one embodiment, the microchannel is any one of a sinusoidal surface, a spiral, or a combination of a sinusoidal surface and a spiral.

[0021] In one embodiment, the dustproof net has multiple layers of ventilation channels, which are stacked vertically and connected to each other.

[0022] In one embodiment, each layer of the ventilation channel includes a plurality of ventilation holes, which are arranged in an array. Two adjacent ventilation holes on the same layer are connected; two adjacent ventilation holes on different layers are connected.

[0023] In one embodiment, the dustproof net has a plurality of hydrophobic protrusions on the side facing away from the vibrating membrane, and the plurality of hydrophobic protrusions are arranged at intervals.

[0024] In one embodiment, the dustproof net has an arched longitudinal cross-sectional shape, and the dustproof net is bent away from the vibrating diaphragm.

[0025] The method for fabricating a condenser microphone according to the present invention includes: using a polymer substrate as a substrate, sequentially forming a microphone body and a dustproof mesh on the polymer substrate using three-dimensional printing technology; separating the polymer substrate from the side of the microphone body away from the dustproof mesh; flipping and transferring the microphone body and the dustproof mesh to peel the polymer substrate off from the microphone body and the dustproof mesh; depositing electrodes on the side of the microphone body away from the dustproof mesh to form a complete condenser microphone; by sequentially forming the microphone body and the dustproof mesh on the polymer substrate using three-dimensional printing technology, the sacrificial layer process is eliminated, thus avoiding the use of a dustproof mesh film while keeping the chip size of the condenser microphone unchanged, simplifying the packaging process of the condenser microphone; the microphone body and the dustproof mesh do not need to be assembled, and therefore there is no need to consider whether the thickness of the dustproof mesh matches the back opening of the shell, thereby easily completing the fabrication of the condenser microphone. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0027] Figure 1 This is a flowchart illustrating the first embodiment of the capacitive microphone manufacturing method of the present invention.

[0028] Figure 2 This is a detailed flowchart of step S10 of the capacitive microphone manufacturing method of the present invention.

[0029] Figure 3 This is a schematic diagram of the structure corresponding to the fabrication steps of the capacitive microphone fabrication method of the present invention.

[0030] Figure 4 This is a structural schematic diagram corresponding to the S10 refinement step of the capacitive microphone manufacturing method of the present invention.

[0031] Figure 5 This is a schematic diagram of the structure of the first embodiment of the capacitive microphone of the present invention;

[0032] Figure 6 This is a schematic diagram of the structure of the third embodiment of the capacitive microphone of the present invention;

[0033] Figure 7 This is a schematic diagram of the structure of the fourth embodiment of the capacitive microphone of the present invention;

[0034] Figure 8 This is a partial perspective view of the dustproof mesh of the first embodiment of the condenser microphone of the present invention;

[0035] Figure 9 This is a partial cross-sectional view of the dustproof mesh of the first embodiment of the condenser microphone of the present invention;

[0036] Figure 10 This is a partial perspective view of the dustproof mesh of the second embodiment of the condenser microphone of the present invention.

[0037] Explanation of icon numbers:

[0038] label name label name 1 microphone body 13 Vibrating diaphragm 2 Dustproof netting 11a Back of the cave entrance 11 Shell structure 11b air chamber 111 micropillar structure 2a Microchannel 112 Gas layer shell 2b ventilation 113 Back cavity shell 20b Vent 12 Back pole layer 2c Hydrophobic protrusions

[0039] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0040] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0041] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0042] Furthermore, the use of terms such as "first" and "second" in this invention is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this invention.

[0043] This invention proposes a method for manufacturing a condenser microphone.

[0044] In this embodiment of the invention, the method for manufacturing the capacitive microphone includes the following steps:

[0045] Reference Figure 1 , Figure 3 and Figure 5 S10: Using a polymer substrate as a base, the microphone body 1 and the dustproof mesh 2 are sequentially formed on the polymer substrate using 3D printing technology;

[0046] In traditional condenser microphone manufacturing methods, the backplate, housing, and diaphragm are first fabricated separately. Then, the backplate and diaphragm are sequentially installed inside the housing, and finally, the dustproof mesh 2 film is installed in the back hole of the housing. However, the dustproof mesh 2 film has a certain thickness. When installed in the back hole of the housing, the size difference between the dustproof mesh 2 film and the back hole makes it difficult to install the dustproof mesh 2 film properly, limiting the package size of the condenser microphone. To solve the problem of the dustproof mesh 2 film not fitting the condenser microphone, and given the relatively large overall depth of the back hole of the housing, directly manufacturing an integrated dustproof mesh 2 film within the back hole of the housing typically requires a sacrificial layer process. This makes the overall manufacturing process of the condenser microphone too difficult, resulting in inconsistent quality of the finished product.

[0047] The manufacturing method in this case directly uses 3D printing technology to sequentially form the microphone body 1 and the dustproof mesh 2 on the polymer substrate, without the need for a sacrificial layer process. This allows the chip size of the condenser microphone to remain unchanged while avoiding the use of a dustproof mesh. Moreover, during the manufacturing process of the condenser microphone, the 3D printing technology directly forms the dustproof mesh 2, so that the microphone body 1 and the dustproof mesh 2 do not need to be assembled. Consequently, there is no need to consider whether the thickness of the dustproof mesh 2 matches the back opening 11a of the shell, thus easily completing the manufacturing of the condenser microphone.

[0048] The dustproof mesh 2 is formed using two-photon polymerization 3D printing technology, which not only speeds up the forming process but also improves the structural strength of the dustproof mesh 2. Furthermore, the two-photon polymerization 3D printing technology offers higher printing precision, making it easier to print dustproof mesh 2 with a microporous structure, thus significantly reducing the manufacturing difficulty of the microphone.

[0049] S20: Separate the polymer substrate from the side of the microphone body 1 away from the dustproof mesh 2;

[0050] S30: Flip and transfer the microphone body and the dustproof mesh to peel the polymer substrate off the microphone body and the dustproof mesh;

[0051] The polymer substrate, microphone body 1, and dustproof mesh 2 are formed using 3D printing technology, making them an integral structure and improving the structural strength of the condenser microphone. However, the polymer substrate is not part of the condenser microphone. Therefore, after the microphone body 1 and dustproof mesh 2 are printed, the polymer substrate needs to be separated from the side of the microphone body 1 away from the dustproof mesh 2. There are several ways to separate the polymer substrate from the side of the microphone body 1 away from the dustproof mesh 2, which will not be listed here.

[0052] Then, the microphone body 1 and the dustproof mesh 2 are flipped 180 degrees using a flipping device, so that the polymer substrate remains stationary under the action of gravity, thereby achieving the separation of the polymer substrate from the microphone body 1 and the dustproof mesh 2.

[0053] S40: Deposit electrodes on the side of the microphone body 1 away from the dustproof mesh 2 to form a complete condenser microphone.

[0054] After the polymer substrate is peeled off from the microphone body 1, an electrode is deposited on the side of the back electrode layer 12 of the microphone body 1 that faces away from the dustproof mesh 2, thereby completing the entire manufacturing process of the condenser microphone.

[0055] In this embodiment, S20: the step of separating the microphone body 1 from the side away from the dustproof net 2 includes:

[0056] The microphone body 1 and the dustproof mesh 2 are subjected to acid pickling treatment. Specifically, the polymer substrate, the microphone body 1, and the dustproof mesh 2 are simultaneously placed in the pickling tank of the pickling device. The acid solution in the pickling tank is used to pickle and corrode the metal layer between the microphone body 1 and the polymer substrate. After the acid pickling treatment, the microphone body 1 and the polymer substrate are no longer connected as a whole, thereby realizing the separation of the polymer substrate from the microphone body 1.

[0057] In this embodiment, refer to Figures 1 to 5 S10: The step of using a polymer substrate as a base and employing 3D printing technology to sequentially form the microphone body 1 and the dustproof mesh 2 on the polymer substrate is further subdivided into the following steps:

[0058] S11: Print the back electrode layer 12 and the micropillar structure 111 onto the polymer substrate;

[0059] A back electrode layer 12 is formed on a polymer substrate using 3D printing technology. The back electrode plate includes a back electrode insulating layer and a back electrode conductive layer. First, a back electrode insulating layer and a micropillar structure 111 are formed on the polymer substrate. Then, a back electrode conductive layer is formed on the side of the back electrode insulating layer facing away from the polymer substrate, so that the back electrode insulating layer and the back electrode conductive layer are combined to form a back electrode plate.

[0060] The microphone body 1 in this embodiment includes a shell structure 11, a back electrode layer 12 and a diaphragm 13, wherein the shell structure 11 includes a micro-pillar structure 111, an air layer shell 112 and a back hole shell 113.

[0061] S12: Print the gas outlet shell 112 on the side of the back electrode layer 12 facing away from the polymer substrate;

[0062] The air layer shell 112 is formed on the side of the back electrode conductive layer of the back electrode layer 12 that is opposite to the back electrode insulating layer. The air layer shell 112 is used to connect the diaphragm 13, so that the diaphragm 13 and the back electrode layer 12 can form an air chamber 11b at intervals, thereby forming a complete condenser microphone.

[0063] S13: A vibrating diaphragm 13 is formed on the side of the gas layer shell 112 opposite to the back pole layer 12;

[0064] The diaphragm 13 is directly formed on the back electrode layer 12 using 3D printing technology. This not only eliminates the need to consider the installation space required for the diaphragm 13, but also further simplifies the fabrication process of the condenser microphone. At the same time, the diaphragm 13 and the back electrode layer 12 form an integral structure, improving the tightness of the connection between the diaphragm 13 and the back electrode layer 12.

[0065] S14: A back cavity shell 113 is formed on the side of the vibrating diaphragm 13 facing away from the air layer shell 112;

[0066] By forming a back cavity shell 113 on the side of the diaphragm 13 facing away from the air layer shell 112, the connection between the diaphragm 13 and the back cavity shell 113 is made more stable. Since the diaphragm 13 does not cover the entire air layer shell 112, the back cavity shell 113 can be connected to the periphery of the air layer shell 112 during the forming process, further improving the structural strength of the entire condenser microphone.

[0067] S15: The dustproof net 2 is formed on the side of the back hole housing 113 opposite to the vibrating diaphragm 13.

[0068] Finally, by forming the dustproof mesh 2 in the back hole housing 113, the dustproof mesh 2 is more tightly connected to the back hole housing 113, and there is no need to consider the thickness of the dustproof mesh 2. It can be formed directly according to the actual product requirements, without the need to assemble and package the dustproof mesh 2 with the microphone body 1, which greatly reduces the processing difficulty of the condenser microphone.

[0069] The present invention also proposes a condenser microphone, referring to... Figure 5The condenser microphone is manufactured using the aforementioned condenser microphone manufacturing method. The condenser microphone includes a microphone body 1 and a dustproof mesh 2. The microphone body 1 includes a structure 11, a back electrode layer 12, and a diaphragm 13. The shell structure 11 has an inner cavity and a back opening 11a communicating with the inner cavity. The back electrode layer 12 and the diaphragm 13 are both located within the inner cavity, with the back electrode layer 12 and the diaphragm 13 spaced apart to form an air chamber 11b. The dustproof mesh 2 is located on the shell structure 11 at the back opening 11a, and on the side of the diaphragm 13 facing away from the back electrode layer 12. The specific structure of this condenser microphone manufacturing method is described in the above embodiments. Since this condenser microphone adopts all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated further here.

[0070] Specifically, a dustproof mesh 2 is formed at the back opening 11a of the shell structure 11. This mesh allows air to enter the air chamber 11b, preventing excessive flow of particles within the back opening 11a and air chamber 11b, which could affect the deformation of the diaphragm 13 and the low-frequency performance of the condenser microphone. The dustproof mesh 2 is formed using two-photon polymerization 3D printing technology, which not only accelerates the forming speed and improves the structural strength of the mesh 2, but also offers higher printing precision, making it easier to print a dustproof mesh 2 with a microporous structure, thus significantly reducing the difficulty of microphone manufacturing.

[0071] The dustproof net 2 structure mentioned above can also be used in micro-acoustic sensors, pressure sensors or airflow sensors with an air intake cavity structure; the dustproof net 2 material can be composite material, including polymer materials, ceramic materials, etc.; the shell structure 11 can be composite material, including polymer materials, ceramic materials, etc.; the vibrating diaphragm 13 can be composite material, including conductive polymer materials, conductive ceramic materials, piezoelectric materials, semiconductor materials, etc.

[0072] In the first embodiment, referring to Figure 5 , Figure 8 and Figure 9 The dustproof net 2 is provided with multiple microchannels 2a, which are arranged at intervals. Each microchannel 2a is used to allow airflow from the outside.

[0073] When the condenser microphone is working, a capacitor structure is formed between the diaphragm 13 and the back electrode layer 12. When there is sound from the outside, the sound will exert a force on the diaphragm 13, and the surface of the diaphragm 13 will deform accordingly. When the diaphragm 13 deforms, the capacitor structure formed between the diaphragm 13 and the back electrode layer 12 will also change accordingly. The corresponding sound signal can be detected by an external ASIC or IC chip signal amplification circuit.

[0074] The dustproof mesh 2 is equipped with multiple spaced microchannels 2a. When external sound travels through the air, it first passes through these microchannels 2a, allowing tiny air particles to be absorbed or blocked as they flow through them. This purifies the air and prevents sound from being affected by these fine particles, thus improving the propagation quality of the condenser microphone. Furthermore, the microchannel 2a structure in this embodiment ensures the strength of the dustproof mesh 2, resulting in a high porosity.

[0075] Optionally, the microchannel 2a can be any one of a sinusoidal surface, a helical surface, or a combination of sinusoidal and helical surfaces. Thus, the inner wall of the microchannel 2a has recessed or raised sections, making it easier to block or adsorb fine particles, thereby improving the dustproof effect of the dustproof net 2.

[0076] In the second embodiment, refer to Figure 5 and Figure 10 The dustproof net 2 is provided with multiple layers of ventilation channels 2b, which are stacked vertically and adjacent layers of ventilation channels 2b are connected. In this way, the multiple layers of ventilation channels 2b stacked vertically increase the complexity of the filter pores of the dustproof net 2, so that the multiple layers of ventilation channels 2b can form more barriers to prevent fine particles from entering the inner wall of the air chamber 11b.

[0077] Furthermore, each layer of the ventilation channel 2b includes a plurality of ventilation holes 20b, which are arranged in an array. Two adjacent ventilation holes 20b located on the same layer are connected; two adjacent ventilation holes 20b located on different layers are connected.

[0078] Specifically, multiple vents 20b located on the same layer are adjacent and interconnected, and multiple vents 20b located on adjacent layers are also adjacent and interconnected. This arrangement creates crisscrossing internal flow channels on the inner wall of the vent duct 2b, further increasing the complexity of the filtration pores in the vent duct 2b, thereby blocking more fine particles from entering the inner wall of the air chamber 11b. The array of multiple vents 20b can be arranged regularly or irregularly, and the pore size of the vents 20b can be different to achieve the collection and blocking of particles of different sizes.

[0079] Optionally, each of the vent holes 20b is a spherical hole. In this way, the spherical vent hole 20b has a smoothly curved wall, and the ventilation channel 2b formed by the interconnection of multiple vent holes 20b acts like the pores inside a sponge. This allows fine particles in the air to come into contact with the large surface area, porous and rough vent hole walls of the vent holes 20b, causing harmful components in the exhaust gas to accumulate or condense on the surface of the vent hole walls 20b, thus purifying the air entering the air chamber 11b and improving the low-frequency performance of the condenser microphone. In other embodiments, the shape of the vent hole 20b can also be a regular tetrahedron, a regular hexahedron, etc.

[0080] In the third embodiment, reference is made to... Figure 5 and Figure 6 The dustproof net 2 has multiple hydrophobic protrusions 2c on the side facing away from the diaphragm 13, and these protrusions 2c are arranged at intervals. With this arrangement, the hydrophobic protrusions 2c are located at the lowest point of the dustproof net 2. When airflow enters the condenser microphone through the back opening 11a, the hydrophobic protrusions 2c can block water vapor droplets in the airflow, thus providing a waterproof function and protecting the internal electronic components of the condenser microphone.

[0081] In the fourth embodiment, reference is made to... Figure 5 and Figure 7 The dustproof net 2 has an arched longitudinal cross-sectional shape, and it is bent away from the diaphragm 13. This design, with the dustproof net 2 adopting an arched structure convex in the direction of airflow inflow, improves its resistance to high-speed airflow impact and protects the condenser microphone.

[0082] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A method for manufacturing a condenser microphone, characterized in that, The method for manufacturing the capacitive microphone includes: Using a polymer substrate as a base, the microphone body and dustproof mesh are sequentially formed on the polymer substrate using 3D printing technology. Separate the polymer substrate from the side of the microphone body away from the dustproof mesh; The microphone body and the dustproof mesh are flipped and transferred to allow the polymer substrate to peel off from the microphone body and the dustproof mesh; Electrodes are deposited on the side of the microphone body away from the dustproof mesh to form a complete condenser microphone; The step of sequentially forming the microphone body and dustproof mesh on the polymer substrate using 3D printing technology, with the polymer substrate as the substrate, includes: A back electrode layer and a micropillar structure are printed onto the polymer substrate. An outlet layer shell is printed on the side of the back electrode layer facing away from the polymer substrate; A vibrating diaphragm is formed on the side of the gas layer shell opposite to the back electrode layer; A back cavity shell is formed on the side of the vibrating diaphragm facing away from the gas layer shell; The dustproof net is formed on the side of the back cavity shell facing away from the vibrating diaphragm.

2. The method for manufacturing a condenser microphone as described in claim 1, characterized in that, The step of separating the polymer substrate from the side of the microphone body away from the dustproof mesh includes: The microphone body and the dustproof mesh are subjected to acid washing to separate the polymer substrate from the microphone body.

3. A condenser microphone, characterized in that, The condenser microphone is manufactured using the condenser microphone manufacturing method as described in claim 1 or 2; the condenser microphone includes a microphone body and a dustproof mesh, wherein the microphone body includes a shell structure, a back electrode layer and a diaphragm, the shell structure has an inner cavity and a back opening communicating with the inner cavity, the back electrode layer and the diaphragm are both disposed in the inner cavity, and the back electrode layer and the diaphragm are spaced apart to form an air chamber; the dustproof mesh is disposed in the shell structure and located at the back opening, and the dustproof mesh is located on the side of the diaphragm facing away from the back electrode layer.

4. The condenser microphone as described in claim 3, characterized in that, The dustproof net is provided with multiple microchannels, which are arranged at intervals, and each microchannel is used to allow external airflow.

5. The condenser microphone as described in claim 4, characterized in that, The microchannel is any one of the following: a sinusoidal surface, a spiral, or a combination of a sinusoidal surface and a spiral.

6. The condenser microphone as described in claim 3, characterized in that, The dustproof net has multiple layers of ventilation channels, which are stacked vertically and connected to each other.

7. The condenser microphone as described in claim 6, characterized in that, Each layer of the ventilation channel includes multiple ventilation holes, which are arranged in an array. Two adjacent ventilation holes on the same layer are connected; two adjacent ventilation holes on different layers are connected.

8. The condenser microphone as described in claim 3, characterized in that, The dustproof net has multiple hydrophobic protrusions on the side facing away from the vibrating membrane, and the multiple hydrophobic protrusions are arranged at intervals.

9. The condenser microphone as described in claim 3, characterized in that, The dustproof net has an arched longitudinal cross-sectional shape, and the dustproof net is bent away from the vibrating membrane.

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