A large-size thin plate mini LED circuit board anti-soldering processing method

Abstract

The application discloses a large-size thin-plate mini LED circuit board anti-soldering processing method, which comprises the following steps: adjusting the distance of the clamp according to the specification of the circuit board, clamping the circuit board by the clamp, and supporting the circuit board by contacting the needle tip of the silk screen top pin with the substrate area of the circuit board; conveying the circuit board to the lower side of the alignment mechanism by the conveying runway; grabbing the circuit board by the mechanical hand and stretching the circuit board to make the circuit board flat and free of bending; performing alignment on the mark point on the circuit board by the CCD alignment device of the alignment mechanism; conveying the circuit board to the silk screen platform by the conveying runway after alignment; loosening the circuit board by the clamp; adjusting the distance between the two ends of the clamp to be greater than the length of the circuit board by the distance adjusting device; driving the track to move downward by the jacking device; and driving the conveying runway to return by the driving device. The large-size thin-plate mini LED circuit board anti-soldering processing method provided by the application solves the problems of the failure of the CCD to align, the smearing of the ink, the deviation, the bruising of the circuit by the nail bed and the like, improves the production efficiency, and guarantees the product quality.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board manufacturing technology, specifically to a method for solder resist processing of large-size thin-plate mini LED circuit boards. Background Technology

[0002] With the development of mini LED backlighting, the technological prospects and direction of direct-view displays are the same as those of backlighting. They are widely used in large-screen TVs, monitors, and laptops, creating new incremental market opportunities. Currently, the thickness of mini LED substrates in the PCB industry is 0.5mm. Due to this thinness, fully automated production lines for solder resist printing face certain challenges. Small panels (<400*500mm) can be produced, but during the production of large-size thin boards, the 0.5mm thin board is prone to bending downwards in the middle during the conical wheel conveyor process, causing scratches on the solder resist layer. Furthermore, the downward bending of the middle section causes the mark points to shift out of position, making it difficult for the CCD to accurately align the points. Therefore, fully automated mass production of solder resist for large-size mini LEDs cannot be achieved.

[0003] Therefore, it is necessary to provide a new process to solve the above-mentioned technical problems. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a solder resist processing method for large-size thin-plate mini LED circuit boards, which solves problems such as CCD misalignment, ink scratches, misalignment, and damage to the circuit by the nail bed, thereby improving production efficiency and ensuring product quality.

[0005] To solve the above problems, the technical solution of the present invention is as follows:

[0006] A method for solder resist processing of large-size thin-plate mini LED circuit boards includes the following steps:

[0007] Step S1, providing solder resist production equipment, including an alignment mechanism, a screen printing mechanism, and a conveyor runner for reciprocatingly conveying circuit boards between the alignment mechanism and the screen printing mechanism; the conveyor runner is located below the alignment mechanism and includes a lifting device, a track connected to the lifting device, a slide plate slidably connected to the track, a driving device for driving the slide plate to slide along the track, clamps for holding circuit boards located at both ends of the slide plate and slidable along the slide plate axis, a distance adjustment device for adjusting the distance between the clamps, and screen printing pins located on the slide plate and corresponding to the circuit board substrate area;

[0008] Step S2: Adjust the spacing of the clamps according to the circuit board specifications, and make the clamps hold the circuit board, with the tip of the silkscreen pin contacting the substrate area of ​​the circuit board to support the circuit board.

[0009] Step S3, start the driving device, and the conveying runway transports the circuit board to the positioner below;

[0010] Step S4, provide at least one set of mechanical hands, which are distributed on opposite sides of the conveying runway, the mechanical hands grab the circuit board and stretch it to make the circuit board flat, and the CCD alignment device of the positioner captures the mark point on the circuit board to perform alignment;

[0011] Step S5, after alignment, the conveying runway transports the circuit board to the silk screen platform, the clamp releases the circuit board, the distance adjusting device adjusts the distance between the two clamps to be greater than the length of the circuit board, the jacking device drives the track to move downward, and the driving device drives the conveying runway to return.

[0012] Further, the size of the mini LED circuit board is greater than 500mm*500mm, and the thickness of the board is 0.5mm.

[0013] Further, the anti-soldering production equipment is a full-automatic three-machine connected silk screen printer.

[0014] Further, the mechanical hands are three sets and are distributed on the two sides of the conveying runway.

[0015] Compared with the prior art, the large-size thin plate mini LED circuit board anti-soldering processing method has the beneficial effects that:

[0016] 1. The large-size thin plate mini LED circuit board anti-soldering processing method provided by the application transports the circuit board through the conveying runway after printing, the conveying runway slide plate is provided with clamps for clamping the circuit board at both ends, and a silk screen thimble is arranged on the slide plate, the needle tip of the thimble contacts the base material area of the circuit board to support the circuit board, the circuit board does not deviate and loosen during conveying, and the middle position of the large-size thin plate is prevented from bending, so that the first printed ink is prevented from being scratched.

[0017] 2. The large-size thin plate mini LED circuit board anti-soldering processing method provided by the application increases mechanical hands at the position of the alignment mechanism, which are used for grabbing and stretching the long side of the large-size thin plate, further ensures that the circuit board is not bent, the board surface is straight and flat without depression, ensures that the mark point on the circuit board is in the normal position, so that the mark point can be normally captured during CCD alignment, improves the alignment accuracy, and improves the product quality and the qualification rate. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.

[0019] Figure 1 Figure 1 is a structural schematic diagram of the anti-soldering production equipment in the present application. DETAILED DESCRIPTION

[0020] In order to better understand the technical solutions in the embodiments of the present application by those skilled in the art, and to make the above-mentioned purposes, features and advantages of the present application more apparent and easy to understand, the specific embodiments of the present application are further described below.

[0021] It should be noted that the description of the embodiments is used to help understand the present application, but does not constitute a limitation of the present application. In addition, the technical features involved in each embodiment of the present application described below can be combined with each other as long as they do not conflict with each other.

[0022] The large-size thin plate mini LED circuit board anti-soldering processing method of the present application uses a full-automatic three-machine continuous silk screen printing machine as the anti-soldering production equipment, wherein the conveying process of the circuit board adopts a running track conveying.

[0023] Please refer to Figure 1 Figure 1 is a structural schematic diagram of the anti-soldering production equipment in the present application. Specifically, the anti-soldering production equipment includes an alignment mechanism 1, a silk screen printing mechanism 2, and a conveying running track 3 for conveying the circuit board back and forth between the alignment mechanism and the silk screen printing mechanism.

[0024] In the present application, the conveying running track 3 is arranged below the alignment mechanism 1 and extends to the silk screen printing mechanism 2, which includes a jacking device (not shown), a track 32 connected with the jacking device, a sliding plate 33 slidingly connected with the track 32, a driving device (not shown) for driving the sliding plate to slide along the track, clamps 35 arranged at both ends of the sliding plate 33 and capable of sliding axially along the sliding plate for clamping the circuit board, a distance adjusting device 36 for adjusting the distance between the clamps, and silk screen printing needles 37 arranged on the sliding plate 33 and corresponding to the substrate area of the circuit board.

[0025] The jacking device can be a hydraulic oil cylinder, one end of which is fixed to the rack of the anti-soldering production equipment, and the other end supports the track 32 for driving the connected track 32 to make lifting movement; the sliding plate 33 moves along the extension direction of the track for supporting and conveying the circuit board; and the driving device can be a linear driving module.

[0026] The clamps 35 are distributed at both ends of the sliding plate 33 and are used to clamp the two sides of the circuit board. Preferably, the number of clamps 35 is four, which clamp the four corners of the circuit board respectively. In order to facilitate the clamping of circuit boards of different sizes, the clamps arranged at both ends of the sliding plate are arranged in a structure with adjustable spacing. Correspondingly, the distance adjusting device 36 includes four sliding rails 361 arranged on the sliding plate 33, sliding blocks 362 connected with the sliding rails 361, and a power device (not shown) for driving the sliding blocks 362 to slide, which is a linear driving module. The clamps 35 are arranged on the sliding blocks 362. When the power device drives the sliding blocks to slide, the clamps 35 are driven to slide.

[0027] The screen printing thimble 37 corresponds to the base material area of the circuit board. During operation, the thimble needle tip thereof is in contact with the base material area of the circuit board to support the circuit board and prevent the circuit board from being bent during transmission.

[0028] In the present application, in order to improve the alignment accuracy, at least one set of mechanical hands 11 is arranged at the alignment mechanism 1. The mechanical hands are distributed at opposite sides of the conveying runway and are used to grab and stretch the aligned circuit board to make the circuit board flat and free of bending. Preferably, the mechanical hands are three sets, which stretch the circuit board from multiple positions in the length direction of the circuit board to ensure that the circuit board is flat and free of bending.

[0029] The alignment mechanism 1 uses a CCD to grab the mark points on the circuit board to achieve alignment. The structures of the alignment mechanism 1 and the screen printing mechanism 2 can refer to the corresponding structures of a full-automatic three-machine continuous screen printing machine in the prior art, which will not be described herein.

[0030] In combination with the structure of the above-mentioned anti-welding production equipment, the anti-welding processing method for a large-size thin-plate mini LED circuit board of the present application includes the following steps:

[0031] Step S1: Adjust the spacing of the clamps according to the specifications of the circuit board, and make the clamps clamp the circuit board, and the needle tip of the screen printing thimble is in contact with the base material area of the circuit board to support the circuit board;

[0032] Step S2: Start the driving device, and the conveying runway conveys the circuit board to below the alignment mechanism;

[0033] Step S3: The mechanical hands grab the circuit board and stretch it to make the circuit board flat and free of bending. The CCD alignment device of the alignment mechanism grabs the mark points on the circuit board to perform alignment;

[0034] Step S4: After alignment, the conveying runway conveys the circuit board to the screen printing platform, the clamps release the circuit board, the distance adjusting device adjusts the distance between the clamps at both ends to be greater than the length of the circuit board, the jacking device drives the track to move downward, and the driving device drives the conveying runway to return.

[0035] In the application, the size of the mini LED circuit board is greater than 500mm*500mm, and the thickness of the board is 0.5mm.

[0036] In the application, the conveying track 3 is a circuit board conveying mechanism between the first side silk screen printing and the second side silk screen printing, the circuit board does not deviate and loosen during the conveying process, and the middle position of the large-size thin plate is prevented from bending, so that the first printed ink is prevented from being scratched;

[0037] The mechanical hand is added to the alignment mechanism position, which is used for clamping and stretching the long side of the large-size thin plate, further ensures that the circuit board does not bend, the board surface is straight and flat without depression, ensures that the mark point on the circuit board is in the normal position, so that the mark point can be normally captured during the CCD alignment, the alignment accuracy is improved, and the product quality and the qualified rate are improved.

[0038] The above detailed description is made to the embodiments of the application, but the application is not limited to the described embodiments. Various changes, modifications, replacements and variations made to the embodiments without departing from the principles and spirits of the application still fall within the protection scope of the application.

Claims

1. A mini LED circuit board anti-soldering processing method, characterized in that, Comprising the following steps: Step S1, providing a anti-weld production equipment, including a positioning mechanism, a silk screen mechanism, a conveying runway for conveying the circuit board back and forth between the positioning mechanism and the silk screen mechanism; the conveying runway is arranged below the positioning mechanism, and comprises a jacking device, a track connected with the jacking device, a sliding plate in sliding connection with the track, a driving device for driving the sliding plate to slide along the track, clamps arranged at both ends of the sliding plate and capable of sliding axially along the sliding plate for clamping the circuit board, a distance adjusting device for adjusting the distance between the clamps, and silk screen thimbles arranged on the sliding plate and corresponding to the substrate area of the circuit board; Step S2, adjusting the distance between the clamps according to the specification of the circuit board, clamping the circuit board by the clamps, and supporting the circuit board by the needle tip of the silk screen thimble in contact with the substrate area of the circuit board; Step S3, starting the driving device, and conveying the circuit board to below the positioning mechanism by the conveying runway; Step S4, providing at least one set of mechanical hands, which are distributed on opposite sides of the conveying runway, the mechanical hands grab the circuit board and stretch it to make the circuit board flat and free of bending, and the CCD positioning device of the positioning mechanism captures the mark points on the circuit board to perform positioning; Step S5, after positioning, conveying the circuit board to the silk screen platform by the conveying runway, loosening the circuit board by the clamps, adjusting the distance between the clamps at both ends to be greater than the length of the circuit board by the distance adjusting device, lowering the track by the jacking device, and returning the conveying runway by the driving device.

2. The mini LED circuit board anti-soldering processing method according to claim 1, characterized in that, The size of the mini LED circuit board is greater than 500mm*500mm, and the thickness of the board is 0.5mm.

3. The mini LED circuit board anti-soldering processing method according to claim 1, characterized in that, The anti-weld production equipment is a full-automatic three-machine connected silk screen printer.

4. The mini LED circuit board anti-soldering processing method according to claim 1, characterized in that, The mechanical hands are three sets, which are distributed on both sides of the conveying runway.

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