A method for manufacturing circuit boards for smart home devices

Abstract

This invention discloses a manufacturing method for circuit boards used in smart home devices, relating to the field of circuit board technology. The manufacturing method is implemented using equipment for manufacturing circuit boards in smart home devices. This equipment includes a conveyor belt for transporting a substrate after adhesive application. The conveyor belt has positioning grooves for positioning the substrate in a front-to-back direction. A frame is arranged on the outer side of the conveyor belt, and a drive mechanism is fixedly installed at the bottom inner side of the frame. This invention can complete the bonding and forming of the substrate and reinforcing plate in one step. During the bonding and forming process, the substrate and reinforcing plate can be accurately positioned, thus avoiding the problems of inaccurate positioning affecting the production efficiency and increasing the production cost of the finished circuit board, making it more suitable for industrial production.

Description

Technical Field

[0001] This invention relates to the field of circuit board technology, and in particular to a method for manufacturing circuit boards for smart home devices. Background Technology

[0002] Smart home devices are increasingly being used in people's lives. Sensor circuit boards are commonly used as the electrical connection body for electronic components in smart home devices. They enable some of the functions of the sensors to be realized, and at the same time, they can also serve as the support body for electronic components, so that the sensors can operate normally.

[0003] The invention patent with authorization announcement number CN109936917B discloses a circuit board for a smart home sensor and a method for preparing the circuit board for a smart home sensor. The preparation method includes material cutting, drilling, electroplating, resin plugging and grinding, pattern transfer, first solder resist, second solder resist, attaching a reinforcing plate and first molding, and pressing the reinforcing plate and second molding.

[0004] In the above method, when attaching the reinforcing plate and performing the first molding, as well as pressing the reinforcing plate and performing the second molding, a pure adhesive layer needs to be brushed onto the substrate. The reinforcing plate is then fixed to the upper surface of the substrate by the adhesive force of the pure adhesive to obtain a semi-finished circuit board. The semi-finished circuit board is then extruded to obtain the finished circuit board.

[0005] However, after practical application by those skilled in the art, it was found that when fixing the reinforcing plate to the upper surface of the substrate, due to the lack of effective positioning, it is difficult to easily align the substrate and the reinforcing plate, which easily leads to uneven edges of the semi-finished circuit board. Although alignment can be achieved by cutting and grinding later, it affects the manufacturing efficiency of the finished circuit board and increases the manufacturing cost of the finished circuit board, making it unsuitable for industrial production.

[0006] Therefore, it is necessary to invent a manufacturing method for circuit boards used in smart home devices to solve the above problems. Summary of the Invention

[0007] The purpose of this invention is to provide a manufacturing method for circuit boards used in smart home devices, in order to solve the problems mentioned in the background art.

[0008] To achieve the above objectives, the present invention provides the following technical solution: a manufacturing method for a circuit board for smart home devices, wherein the manufacturing method for a circuit board for smart home devices is implemented by a manufacturing equipment for a circuit board for smart home devices, the manufacturing equipment for a circuit board for smart home devices includes a conveyor belt for conveying a substrate after applying adhesive, and the conveyor belt is provided with positioning grooves for positioning the substrate in the front-back direction.

[0009] A frame is provided on the outside of the conveyor belt. A drive mechanism is fixedly provided on the bottom of the inner side of the frame. A substrate lifting and positioning mechanism is fixedly provided on the top of the drive mechanism. A reinforcing plate positioning and unloading mechanism is fixedly nested on the top of the frame. A first trigger mechanism and a second trigger mechanism are provided on both sides inside the reinforcing plate positioning and unloading mechanism. The second trigger mechanism is located above the first trigger mechanism.

[0010] The drive mechanism includes a mounting plate, a drive motor, a drive shaft, a first spring, an intermediate push plate, a threaded sleeve, a guide plate, and two guide rods;

[0011] The mounting plate is fixedly installed on the bottom inner side of the frame, the drive motor is fixedly installed on the bottom of the mounting plate, the drive shaft is located on the top of the mounting plate and is connected to the drive motor for transmission, the first spring is rotatably connected to the top of the drive shaft through a bearing, the intermediate push plate is fixedly installed on the top of the first spring, the threaded sleeve is sleeved on the outside of the drive shaft and threadedly connected to the drive shaft, the guide plate is fixedly sleeved on the bottom of the outside of the threaded sleeve, and the two guide rods are slidably installed on both sides of the top of the guide plate and are fixedly connected to the mounting plate.

[0012] The substrate lifting and positioning mechanism includes a lifting plate and two sets of positioning components. The two positioning components are respectively disposed on both sides inside the lifting plate. The positioning components include a guide groove, a positioning slider, a trigger rod, a side push plate, a second spring, and a fixing block.

[0013] The lifting plate is fixedly sleeved on the top of the outer side of the threaded sleeve. The intermediate push plate is along the top of the inner side of the lifting plate. The guide groove is opened at the top side of the lifting plate. The positioning slider is slidably disposed inside the guide groove. The trigger rod is fixedly disposed on the outer side of the positioning slider. The side push plate is fixedly disposed on the top of the inner side of the positioning slider and slides in contact with the intermediate push plate. The second spring is fixedly connected to the bottom of the inner side of the positioning slider. The fixing block is fixedly connected to the end of the second spring and is fixedly connected to the inner wall of the lifting plate.

[0014] Preferably, the reinforcing plate positioning and unloading mechanism includes an unloading seat, a positioning channel, a triggering channel, and an avoidance groove.

[0015] Preferably, the feeding seat is fixedly nested on the top of the frame, the positioning channel is through the center of the top of the feeding seat, and there are two trigger channels and two clearance slots. The two trigger channels and two clearance slots are respectively opened on both sides of the bottom of the feeding seat, and the clearance slots are located inside the trigger channels.

[0016] Preferably, the first triggering mechanism includes a limiting plate, a first triggering groove, and a third spring.

[0017] Preferably, the limiting plate is slidably nested at the bottom of the inner wall of the positioning channel, the first trigger groove is opened at the bottom of the limiting plate, and the third spring is fixedly connected to the outer end of the limiting plate and fixedly connected to the unloading seat.

[0018] Preferably, the second triggering mechanism includes a trigger push plate, a second trigger groove, a fourth spring, a receiving groove, and a pressure plate.

[0019] Preferably, the receiving groove is opened at the top of the inner wall of the positioning channel, the pressure plate is rotatably set inside the receiving groove by a pin, a torsion spring is provided between the pressure plate and the inner wall of the receiving groove, the trigger push plate is slidably nested on the inner wall of the receiving groove, the second trigger groove is opened at the bottom of the trigger push plate, and the fourth spring is fixedly connected to the outer end of the trigger push plate and fixedly connected to the unloading seat.

[0020] Preferably, the method specifically includes the following steps:

[0021] S1. Cut the board into the substrate to be processed. First, drill holes and electroplate the substrate. Then, fill the substrate with resin under vacuum to ensure that the resin fills the vias. Then, grind the surface of the filled holes flat. After transferring the specific circuit pattern to the substrate surface, apply green oil to the substrate surface twice.

[0022] S2. Apply a pure adhesive layer to the substrate surface, then place the reinforcing plate inside the positioning channel, and place the substrate on the top of the conveyor belt. During the placement of the reinforcing plate, the inner wall of the positioning channel positions the reinforcing plate, while the limiting plate blocks the reinforcing plate from the bottom. During the placement of the substrate, the positioning groove on the conveyor belt pre-positions the substrate from the front and back direction. When the substrate moves to the top of the substrate lifting and positioning mechanism under the drive of the conveyor belt, start the drive motor.

[0023] S3. After the drive motor starts, it drives the threaded sleeve to rise through the drive shaft. When the threaded sleeve rises, it drives the lifting plate to rise synchronously. At the same time, during the process of the lifting plate rising, the middle push plate is pulled down relatively due to the pull of the first spring. When the lifting plate rises to the first threshold, the lifting plate contacts the bottom of the base plate. Subsequently, as the lifting plate continues to rise, it lifts the base plate, thereby making the base plate rise synchronously.

[0024] S4. When the lifting plate rises to the second threshold, the middle push plate releases the obstruction of the opposite push plate. At this time, under the pull of the second spring, the positioning slider moves inward along the guide groove, and the left and right sides push and position the substrate, thereby completing the final positioning of the substrate.

[0025] S5. When the lifting plate rises to the third threshold, the trigger rod enters the inner side of the trigger channel and begins to push the limiting plate through the first trigger groove. When the lifting plate rises to the fourth threshold, the limiting plate moves outward under the push of the trigger rod, thereby releasing the obstruction of the reinforcing plate. At this time, the reinforcing plate automatically falls and finally adheres to the top of the substrate that has entered the positioning channel. Subsequently, as the lifting plate continues to rise, the substrate and the reinforcing plate are pushed to rise synchronously.

[0026] S6. When the lifting plate rises to the fifth threshold, the trigger rod enters the inner side of the second trigger groove and begins to push the trigger push plate. When the lifting plate rises to the sixth threshold, the trigger push plate moves inward and pushes the pressure plate located inside the receiving groove to a horizontal state. The pressure plate in the horizontal state blocks the reinforcing plate from above, while the lifting plate below continues to push the substrate and the reinforcing plate, thereby completing the extrusion molding of the substrate and the reinforcing plate to obtain the finished circuit board.

[0027] S7. The drive motor drives the drive shaft to rotate in the opposite direction, which in turn causes the substrate lifting and positioning mechanism to continuously lower the finished circuit board. As the substrate lifting and positioning mechanism continues to descend, the finished circuit board falls onto the top of the conveyor belt and is output by the conveyor belt.

[0028] The technical effects and advantages of this invention are as follows:

[0029] This invention comprises a driving mechanism, a substrate lifting and positioning mechanism, a reinforcing plate positioning and unloading mechanism, a first triggering mechanism, and a second triggering mechanism. The driving mechanism drives the substrate lifting and positioning mechanism, causing it to continuously lift and move the substrate pre-positioned by the conveyor belt, completing the final positioning during the lifting process. Furthermore, as the substrate lifting and positioning mechanism moves, it successively triggers the first and second triggering mechanisms. The first triggering mechanism releases the constraint on the reinforcing plate, allowing it to fall and adhere to the substrate. The second triggering mechanism blocks the reinforcing plate from above, facilitating the subsequent extrusion molding of the reinforcing plate and substrate by the substrate lifting and positioning mechanism. Compared to similar devices or methods in the prior art, this invention can complete the bonding and molding of the substrate and reinforcing plate in one step. Simultaneously, during the bonding and molding process, it can accurately position the substrate and reinforcing plate, avoiding the problems of inaccurate positioning affecting the manufacturing efficiency and increasing the manufacturing cost of the finished circuit board, making it more suitable for industrial production. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the overall front view of the frame of the present invention after it has been cut open.

[0031] Figure 2This is a schematic diagram of the overall front cross-sectional structure of the present invention.

[0032] Figure 3 This is a front cross-sectional view of the drive mechanism of the present invention.

[0033] Figure 4 This is a front cross-sectional view of the substrate lifting and positioning mechanism of the present invention.

[0034] Figure 5 This is a front cross-sectional view of the reinforcing plate positioning and feeding mechanism, the first triggering mechanism, and the second triggering mechanism of the present invention.

[0035] In the diagram: 1. Conveyor belt; 2. Frame; 3. Drive mechanism; 31. Mounting plate; 32. Drive motor; 33. Drive shaft; 34. First spring; 35. Intermediate push plate; 36. Threaded sleeve; 37. Guide plate; 38. Guide rod; 4. Base plate lifting and positioning mechanism; 41. Lifting plate; 42. Guide groove; 43. Positioning slider; 44. Trigger rod; 45. Side push plate; 46. Second spring; 47. Fixing block; 5. Reinforcing plate positioning and unloading mechanism; 51. Unloading seat; 52. Positioning channel; 53. Trigger channel; 54. Clearance groove; 6. First trigger mechanism; 61. Limiting plate; 62. First trigger groove; 63. Third spring; 7. Second trigger mechanism; 71. Trigger push plate; 72. Second trigger groove; 73. Fourth spring; 74. Receiving groove; 75. Pressure plate. Detailed Implementation

[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0037] Example 1

[0038] This invention provides, for example Figure 1-5 The invention illustrates a method for manufacturing a circuit board for a smart home device. The method is implemented using a manufacturing equipment for a smart home device circuit board. The manufacturing equipment includes a conveyor belt 1 for conveying a substrate after applying adhesive. The conveyor belt 1 has positioning grooves for positioning the substrate in the front-back direction.

[0039] A frame 2 is provided on the outer side of the conveyor belt 1. A drive mechanism 3 is fixedly provided on the bottom inner side of the frame 2. A substrate lifting and positioning mechanism 4 is fixedly provided on the top of the drive mechanism 3. A reinforcing plate positioning and unloading mechanism 5 is fixedly nested on the top of the frame 2. A first triggering mechanism 6 and a second triggering mechanism 7 are provided on both sides inside the reinforcing plate positioning and unloading mechanism 5. The second triggering mechanism 7 is located above the first triggering mechanism 6.

[0040] like Figure 3 As shown, the drive mechanism 3 includes a mounting plate 31, a drive motor 32, a drive shaft 33, a first spring 34, an intermediate push plate 35, a threaded sleeve 36, a guide plate 37, and two guide rods 38. The mounting plate 31 is fixedly disposed on the bottom inner side of the frame 2. The drive motor 32 is fixedly disposed on the bottom of the mounting plate 31. The drive shaft 33 is located on the top of the mounting plate 31 and is connected to the drive motor 32. The first spring 34 is rotatably connected to the top of the drive shaft 33 through a bearing. The intermediate push plate 35 is fixedly disposed on the top of the first spring 34. The threaded sleeve 36 is sleeved on the outside of the drive shaft 33 and threadedly connected to the drive shaft 33. The guide plate 37 is fixedly sleeved on the bottom outer side of the threaded sleeve 36. The two guide rods 38 are slidably disposed on both sides of the top of the guide plate 37 and are fixedly connected to the mounting plate 31.

[0041] like Figure 4 As shown, the substrate lifting and positioning mechanism 4 includes a lifting plate 41 and two sets of positioning components. The two positioning components are respectively disposed on the inner sides of the lifting plate 41. Each positioning component includes a guide groove 42, a positioning slider 43, a trigger rod 44, a side push plate 45, a second spring 46, and a fixing block 47. The lifting plate 41 is fixedly sleeved on the top of the outer side of the threaded sleeve 36. The middle push plate 35 is along the top of the inner side of the lifting plate 41. The guide groove 42 is opened at the top side of the lifting plate 41. The positioning slider 43 is slidably disposed inside the guide groove 42. The trigger rod 44 is fixedly disposed outside the positioning slider 43. The side push plate 45 is fixedly disposed on the top of the inner side of the positioning slider 43 and slidably fits against the middle push plate 35. The second spring 46 is fixedly connected to the bottom of the inner side of the positioning slider 43. The fixing block 47 is fixedly connected to the end of the second spring 46 and fixedly connected to the inner wall of the lifting plate 41.

[0042] By setting up the aforementioned drive mechanism 3 and substrate lifting and positioning mechanism 4, the drive motor 32 can drive the threaded sleeve 36 to rise through the drive shaft 33 after starting. When the threaded sleeve 36 rises, it drives the lifting plate 41 to rise synchronously. At the same time, during the rising process of the lifting plate 41, the intermediate push plate 35 is pulled down relatively due to the pull of the first spring 34. When the rising distance of the lifting plate 41 reaches the first threshold, the lifting plate 41 contacts the bottom of the substrate. Subsequently, as the lifting plate 41 continues to rise, the lifting plate 41 lifts the substrate, thereby causing the substrate to rise synchronously.

[0043] When the lifting plate 41 rises to the second threshold, the middle push plate 35 releases the obstruction of the opposite push plate 45. At this time, under the pull of the second spring 46, the positioning slider 43 moves inward along the guide groove 42, and the substrate is pushed and positioned by the left and right sides, thereby completing the final positioning of the substrate.

[0044] like Figure 5 As shown, the reinforcing plate positioning and unloading mechanism 5 includes an unloading base 51, a positioning channel 52, a triggering channel 53, and a clearance groove 54. The unloading base 51 is fixedly nested on the top of the frame 2. The positioning channel 52 is disposed through the center of the top of the unloading base 51. There are two triggering channels 53 and two clearance grooves 54. The two triggering channels 53 and the two clearance grooves 54 are respectively opened on both sides of the bottom of the unloading base 51. The clearance groove 54 is located inside the triggering channel 53.

[0045] By setting the above structure, the reinforcing plate can be placed inside the positioning channel 52 through the top opening of the positioning channel 52. During the placement of the reinforcing plate, the inner wall of the positioning channel 52 positions the reinforcing plate.

[0046] like Figure 5 As shown, the first triggering mechanism 6 includes a limiting plate 61, a first triggering groove 62, and a third spring 63. The limiting plate 61 is slidably nested at the bottom of the inner wall of the positioning channel 52, the first triggering groove 62 is opened at the bottom of the limiting plate 61, and the third spring 63 is fixedly connected to the outer end of the limiting plate 61 and fixedly connected to the unloading seat 51.

[0047] By setting the above structure, the trigger rod 44 can push the limiting plate 61 through the first trigger groove 62, thereby causing the limiting plate 61 to move outward, thereby releasing the lower positioning of the reinforcing plate, allowing the reinforcing plate to fall to the top of the substrate. Subsequently, when the limiting plate 61 is no longer pushed, the third spring 63 will drive the limiting plate 61 to reset.

[0048] like Figure 5As shown, the second triggering mechanism 7 includes a trigger push plate 71, a second trigger groove 72, a fourth spring 73, a receiving groove 74, and a pressure plate 75. The receiving groove 74 is opened at the top of the inner wall of the positioning channel 52. The pressure plate 75 is rotatably disposed inside the receiving groove 74 via a pin. A torsion spring is disposed between the pressure plate 75 and the inner wall of the receiving groove 74. The trigger push plate 71 is slidably nested on the inner wall of the receiving groove 74. The second trigger groove 72 is opened at the bottom 1 of the trigger push plate 71. The fourth spring 73 is fixedly connected to the outer end of the trigger push plate 71 and fixedly connected to the unloading seat 51.

[0049] By setting the above structure, the trigger rod 44 can push the trigger push plate 71 through the second trigger groove 72, thereby causing the trigger push plate 71 to move inward. The inward movement of the trigger push plate 71 pushes the vertical pressure plate 75, thereby causing the pressure plate 75 to rotate to a horizontal state. At this time, the pressure plate 75 can limit the reinforcing plate from above, thereby providing conditions for the subsequent extrusion molding of the substrate and the reinforcing plate. In addition, when the trigger push plate 71 is no longer pushed, the fourth spring 73 drives the trigger push plate 71 to reset, and the torsion spring between the pressure plate 75 and the inner wall of the receiving groove 74 drives the pressure plate 75 to reset.

[0050] Example 2

[0051] The method specifically includes the following steps:

[0052] S1. Cut the board into the substrate to be processed. First, drill holes and electroplate the substrate. Then, fill the substrate with resin under vacuum to ensure that the resin fills the vias. Then, grind the surface of the filled holes flat. After transferring the specific circuit pattern to the substrate surface, apply green oil to the substrate surface twice.

[0053] S2. Apply a pure adhesive layer to the substrate surface, then place the reinforcing plate inside the positioning channel 52, and place the substrate on top of the conveyor belt 1. During the placement of the reinforcing plate, the inner wall of the positioning channel 52 positions the reinforcing plate, while the limiting plate 61 blocks the reinforcing plate from the bottom. During the placement of the substrate, the positioning groove on the conveyor belt 1 pre-positions the substrate from the front and back direction. When the substrate moves above the substrate lifting and positioning mechanism 4 under the drive of the conveyor belt 1, the drive motor 32 is started.

[0054] S3. After the drive motor 32 starts, it drives the threaded sleeve 36 to rise through the drive shaft 33. When the threaded sleeve 36 rises, it drives the lifting plate 41 to rise synchronously. At the same time, during the rise of the lifting plate 41, the intermediate push plate 35 is pulled down relatively due to the pull of the first spring 34. When the lifting plate 41 rises to the first threshold, the lifting plate 41 contacts the bottom of the base plate. Subsequently, as the lifting plate 41 continues to rise, the lifting plate 41 lifts the base plate, thereby causing the base plate to rise synchronously.

[0055] S4. When the lifting plate 41 rises to the second threshold, the middle push plate 35 releases the obstruction of the opposite push plate 45. At this time, under the pull of the second spring 46, the positioning slider 43 moves inward along the guide groove 42, and pushes and positions the substrate from the left and right sides, thereby completing the final positioning of the substrate.

[0056] S5. When the lifting plate 41 rises to the third threshold, the trigger rod 44 enters the inner side of the trigger channel 53 and begins to push the limiting plate 61 through the first trigger groove 62. When the lifting plate 41 rises to the fourth threshold, the limiting plate 61 moves outward under the push of the trigger rod 44, thereby releasing the obstruction of the reinforcing plate. At this time, the reinforcing plate automatically falls and finally adheres to the top of the substrate that has entered the positioning channel 52. Subsequently, as the lifting plate 41 continues to rise, the substrate and the reinforcing plate are pushed to rise synchronously.

[0057] S6. When the lifting plate 41 rises to the fifth threshold, the trigger rod 44 enters the inner side of the second trigger groove 72 and begins to push the trigger push plate 71. When the lifting plate 41 rises to the sixth threshold, the trigger push plate 71 moves inward and pushes the pressure plate 75 located inside the receiving groove 74 to a horizontal state. The pressure plate 75 in the horizontal state blocks the reinforcing plate from above, while the lifting plate 41 located below continues to push the substrate and the reinforcing plate, thereby completing the extrusion molding of the substrate and the reinforcing plate to obtain the finished circuit board.

[0058] S7. Drive motor 32 drives drive shaft 33 to rotate in the opposite direction, thereby causing substrate lifting and positioning mechanism 4 to continuously lower the finished circuit board. As substrate lifting and positioning mechanism 4 continues to lower, the finished circuit board falls on top of conveyor belt 1 and is output by conveyor belt 1.

[0059] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A manufacturing method applied to a smart home device circuit board, characterized by: The manufacturing method of the circuit board for smart home devices is implemented by manufacturing equipment for the circuit board for smart home devices. The manufacturing equipment for the circuit board for smart home devices includes a conveyor belt (1) for conveying the substrate after applying glue. The conveyor belt (1) is provided with a positioning groove for positioning the substrate in the front-back direction. A frame (2) is provided on the outside of the conveyor belt (1). A drive mechanism (3) is fixedly provided on the bottom inside the frame (2). A substrate lifting and positioning mechanism (4) is fixedly provided on the top of the drive mechanism (3). A reinforcing plate positioning and unloading mechanism (5) is fixedly nested on the top of the frame (2). A first trigger mechanism (6) and a second trigger mechanism (7) are provided on both sides inside the reinforcing plate positioning and unloading mechanism (5). The second trigger mechanism (7) is located above the first trigger mechanism (6). The drive mechanism (3) includes a mounting plate (31), a drive motor (32), a drive shaft (33), a first spring (34), an intermediate push plate (35), a threaded sleeve (36), a guide plate (37), and two guide rods (38); The mounting plate (31) is fixedly installed on the bottom inner side of the frame (2), the drive motor (32) is fixedly installed on the bottom of the mounting plate (31), the drive shaft (33) is located on the top of the mounting plate (31) and is connected to the drive motor (32) in a transmission manner, the first spring (34) is rotatably connected to the top of the drive shaft (33) through a bearing, the intermediate push plate (35) is fixedly installed on the top of the first spring (34), the threaded sleeve (36) is sleeved on the outside of the drive shaft (33) and threadedly connected to the drive shaft (33), the guide plate (37) is fixedly sleeved on the bottom outside of the threaded sleeve (36), and the two guide rods (38) are respectively slidably installed on both sides of the top of the guide plate (37) and are fixedly connected to the mounting plate (31); The substrate lifting and positioning mechanism (4) includes a lifting plate (41) and two sets of positioning components. The two positioning components are respectively disposed on both sides inside the lifting plate (41). The positioning components include a guide groove (42), a positioning slider (43), a trigger rod (44), a side push plate (45), a second spring (46), and a fixing block (47). The lifting plate (41) is fixedly sleeved on the top of the outer side of the threaded sleeve (36). The intermediate push plate (35) is along the top of the inner side of the lifting plate (41). The guide groove (42) is opened on the top side of the lifting plate (41). The positioning slider (43) is slidably disposed on the inner side of the guide groove (42). The trigger rod (44) is fixedly disposed on the outer side of the positioning slider (43). The side push plate (45) is fixedly disposed on the top of the inner side of the positioning slider (43) and slidably attached to the intermediate push plate (35). The second spring (46) is fixedly connected to the bottom of the inner side of the positioning slider (43). The fixing block (47) is fixedly connected to the end of the second spring (46) and fixedly connected to the inner wall of the lifting plate (41).

2. The method for manufacturing a circuit board for a smart home device according to claim 1, wherein: The reinforcing plate positioning and unloading mechanism (5) includes an unloading seat (51), a positioning channel (52), a triggering channel (53), and a clearance groove (54).

3. The method for manufacturing a circuit board for a smart home device according to claim 2, wherein: The feeding seat (51) is fixedly nested on the top of the frame (2). The positioning channel (52) is disposed through the center of the top of the feeding seat (51). There are two trigger channels (53) and two clearance slots (54). The two trigger channels (53) and the two clearance slots (54) are respectively opened on both sides of the bottom of the feeding seat (51). The clearance slots (54) are located inside the trigger channels (53).

4. The method for manufacturing a circuit board for a smart home device according to claim 3, wherein: The first triggering mechanism (6) includes a limiting plate (61), a first triggering groove (62), and a third spring (63).

5. The manufacturing method of a circuit board for smart home devices according to claim 4, characterized in that: The limiting plate (61) is slidably nested at the bottom of the inner wall of the positioning channel (52), the first trigger groove (62) is opened at the bottom of the limiting plate (61), and the third spring (63) is fixedly connected to the outer end of the limiting plate (61) and fixedly connected to the unloading seat (51).

6. The manufacturing method of a circuit board for smart home devices according to claim 5, characterized in that: The second triggering mechanism (7) includes a trigger push plate (71), a second trigger groove (72), a fourth spring (73), a receiving groove (74), and a pressure plate (75).

7. A method for manufacturing a circuit board for smart home devices according to claim 6, characterized in that: The receiving groove (74) is opened at the top of the inner wall of the positioning channel (52). The pressure plate (75) is rotatably set inside the receiving groove (74) by a pin. A torsion spring is provided between the pressure plate (75) and the inner wall of the receiving groove (74). The trigger push plate (71) is slidably nested on the inner wall of the receiving groove (74). The second trigger groove (72) is opened at the bottom (1) of the trigger push plate (71). The fourth spring (73) is fixedly connected to the outer end of the trigger push plate (71) and fixedly connected to the unloading seat (51).

8. A method for manufacturing a circuit board for smart home devices according to claim 7, characterized in that, The method specifically includes the following steps: S1. Cut the board into the substrate to be processed. First, drill holes and electroplate the substrate. Then, fill the substrate with resin under vacuum to ensure that the resin fills the vias. Then, grind the surface of the filled holes flat. After transferring the specific circuit pattern to the substrate surface, apply green oil to the substrate surface twice. S2. Apply a pure adhesive layer to the surface of the substrate, then place the reinforcing plate inside the positioning channel (52), place the substrate on the top of the conveyor belt (1), during the placement of the reinforcing plate, the inner wall of the positioning channel (52) positions the reinforcing plate, and the limiting plate (61) blocks the reinforcing plate from the bottom. During the placement of the substrate, the positioning groove on the conveyor belt (1) pre-positions the substrate from the front and back direction. When the substrate moves to the substrate lifting and positioning mechanism (4) under the drive of the conveyor belt (1), start the drive motor (32). S3. After the drive motor (32) starts, it drives the threaded sleeve (36) to rise through the drive shaft (33). When the threaded sleeve (36) rises, it drives the lifting plate (41) to rise synchronously. At the same time, during the rise of the lifting plate (41), the intermediate push plate (35) is pulled down relatively due to the pull of the first spring (34). When the lifting plate (41) rises to the first threshold, the lifting plate (41) contacts the bottom of the base plate. Subsequently, as the lifting plate (41) continues to rise, the lifting plate (41) lifts the base, thereby making the base rise synchronously. S4. When the lifting plate (41) rises to the second threshold, the middle push plate (35) releases the obstruction of the opposite push plate (45). At this time, under the pull of the second spring (46), the positioning slider (43) moves inward along the guide groove (42) and pushes the substrate from the left and right sides to position it, thereby completing the final positioning of the substrate. S5. When the lifting plate (41) rises to the third threshold, the trigger rod (44) enters the inside of the trigger channel (53) and begins to push the limiting plate (61) through the first trigger groove (62). When the lifting plate (41) rises to the fourth threshold, the limiting plate (61) moves outward under the push of the trigger rod (44), thereby removing the obstruction to the reinforcing plate. At this time, the reinforcing plate falls automatically and finally adheres to the top of the substrate that has entered the positioning channel (52). Subsequently, as the lifting plate (41) continues to rise, the substrate and the reinforcing plate are pushed to rise synchronously. S6. When the lifting plate (41) rises to the fifth threshold, the trigger rod (44) enters the inner side of the second trigger groove (72) and begins to push the trigger push plate (71). When the lifting plate (41) rises to the sixth threshold, the trigger push plate (71) moves inward and pushes the pressure plate (75) located inside the receiving groove (74) to a horizontal state. The pressure plate (75) in the horizontal state blocks the reinforcing plate from above, while the lifting plate (41) located below continues to push the base plate and the reinforcing plate, thereby completing the extrusion molding of the base plate and the reinforcing plate to obtain the finished circuit board. S7. Drive the drive motor (32) to drive the drive shaft (33) to rotate in the opposite direction, thereby causing the substrate lifting and positioning mechanism (4) to continuously lower the finished circuit board. As the substrate lifting and positioning mechanism (4) continues to lower, the finished circuit board falls on the top of the conveyor belt (1) and is output by the conveyor belt (1).

Images