Nozzle and device for cleaning contaminants on substrate surface

Abstract

The present invention provides a nozzle and a device for cleaning contaminants on the surface of a substrate, comprising a nozzle body, a mounting channel extending through the nozzle body, a front end of the mounting channel being an output channel, a first air distribution slot being provided on the outside of the output channel, a nozzle core having a liquid inlet channel extending through an embedded portion, a front end of the liquid inlet channel corresponding to the output channel, a second air distribution slot being provided on the front end of the liquid inlet channel, an embedded portion being cooperatively connected with the mounting channel to form a primary air cavity, the primary air cavity being in communication with the second air distribution slot, a shell being sleeved on the nozzle body, the shell having an output port being provided, the shell being cooperatively connected with the nozzle body to form a secondary air cavity, the secondary air cavity being in communication with the first air distribution slot, and the first air distribution slot being in communication with the output port. The present invention uses gas in the primary and secondary air cavities to disperse the outflowing droplets, reducing the size of the outflowing droplets and making their shape more uniform, thereby efficiently and non-damagingly cleaning the surface of the substrate and improving the yield rate of processing semiconductor substrates.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and in particular to a nozzle and a device for cleaning contaminants on the surface of a substrate. Background Art

[0002] With the rapid development of the semiconductor industry and the continuous improvement of semiconductor process technology, the impact of particles on the substrate surface on the substrate yield is becoming increasingly greater, and the allowable particle size on the substrate surface is getting smaller and smaller; at the same time, due to the improvement of process technology, the substrate surface structure is becoming more and more delicate and fragile.

[0003] Therefore, in order to remove particle contamination from the substrate surface, the substrate surface usually needs to be cleaned during the semiconductor manufacturing process. Currently, nozzles are commonly used to clean the substrate surface. The ability of the nozzle to clean particles on the substrate surface is closely related to the size and speed of the droplets ejected by the nozzle. Existing nozzles are less effective at cleaning small particle contaminants. To improve the cleaning effect of small particles, it is necessary to increase the gas flow rate to form droplets of appropriate size. However, if the gas flow rate is too high, the droplet flow rate will be too high, which can easily damage the substrate surface structure. Summary of the Invention

[0004] The object of the present invention is to provide a nozzle and a device for cleaning contaminants on the surface of a substrate, which can efficiently clean the surface of the substrate and reduce structural damage to the substrate during cleaning.

[0005] To achieve the above-mentioned objectives, in the first aspect, the present invention provides a nozzle, comprising: a nozzle body, a mounting channel passing through the nozzle body, the front end of the mounting channel being an output channel, a first air distribution groove being provided on the outside of the output channel, a nozzle inner core, comprising an embedded portion, a liquid inlet channel passing through the embedded portion being provided in the nozzle inner core, the front end of the liquid inlet channel corresponding to the output channel, a second air distribution groove being provided at the front end of the liquid inlet channel, the nozzle inner core comprising an embedded portion, the embedded portion being cooperatively connected with the mounting channel to form a primary air cavity, the primary air cavity being communicated with the second air distribution groove, a shell being sleeved on the nozzle body, the shell being provided with an output port corresponding to the output channel, and the shell being cooperatively connected with the nozzle body to form a secondary air cavity, the secondary air cavity being communicated with the first air distribution groove, and the first air distribution groove being communicated with the output port.

[0006] The beneficial effects of the present invention are that the front end of the liquid inlet channel corresponds to the output channel, and a second air distribution groove is provided at the front end of the liquid inlet channel, so when the liquid flows from the liquid inlet channel to the output channel, the gas in the primary air cavity will disperse the liquid flowing into the output channel through the second air distribution groove, forming smaller droplets with uniform shape, and when the droplets flow out through the output channel and pass through the output port, the gas in the secondary air cavity disperses the outflowing droplets through the first air distribution groove, further making the size of the outflowing droplets smaller and the shape more uniform, which can efficiently and damage-free clean the surface of the substrate, thereby improving the yield rate of processing semiconductor substrates.

[0007] In one possible implementation, the nozzle also includes a flow regulator. The nozzle body includes an air inlet passage connecting the primary and secondary air cavities. The flow regulator is also located within the air inlet passage to adjust the gas distribution between the primary and secondary cavities. This advantageously facilitates the regulation and distribution of gas within the primary and secondary cavities, making it suitable for treating particulate pollutants of varying sizes and improving the nozzle's applicability.

[0008] In one possible implementation, the nozzle further includes a first sealing ring. The end of the mounting channel away from the output channel forms a first sealing hole. The end of the embedded portion away from the second air distribution slot forms a first sealing axis. The first sealing ring is sleeved around the first sealing axis and abuts the first sealing hole. This advantageously reduces the possibility of gas leakage and improves product reliability by providing the first sealing ring, first sealing axis, and first sealing hole.

[0009] In one possible implementation, the first sealing hole and the first sealing shaft are configured as a first stepped structure that cooperate with each other. A first annular accommodating cavity is formed between the first stepped structures, and the first sealing ring is disposed within the first annular accommodating cavity. This advantageously ensures sealing performance while simplifying the overall structure by configuring the first sealing hole and the first sealing shaft as a first stepped structure that cooperates with each other to form the first annular accommodating cavity.

[0010] In one possible implementation, an air inlet is formed between the first sealing hole and the output channel. An air inlet slot is provided between the first sealing shaft and the second air distribution slot. The air inlet slot and the air inlet slot cooperate to form a primary air cavity, and the air inlet channel leads to the air inlet hole. This advantageous effect is that the formation of the primary air cavity through structural coordination further simplifies the overall structure and reduces its overall size.

[0011] In one possible implementation, the nozzle also includes a second sealing ring. The outer surface of the nozzle body serves as a second sealing axis, and the housing defines a second sealing hole. The second sealing ring is sleeved over the second sealing axis and abuts the second sealing hole. This advantageously further ensures the tightness of the connection between the nozzle body and the housing, prevents gas leakage within the secondary air cavity, and increases product reliability.

[0012] In one possible implementation, the second sealing hole and the second sealing shaft are configured as a second stepped structure that cooperates with each other. The second stepped structures form a second annular accommodating cavity, and the second sealing ring is disposed within the second annular accommodating cavity. This advantageously ensures sealing while simplifying the overall structure and facilitating the placement of the second sealing ring.

[0013] In one possible implementation, a first groove is defined at the front end of the nozzle body, the air inlet channel leads to the first groove, and a second groove is defined within the housing corresponding to the first groove. The first and second grooves cooperate to form a secondary air cavity. This advantageously simplifies the overall structure and reduces overall dimensions by forming the secondary air cavity through the cooperation of the first and second grooves.

[0014] In a possible implementation, an air duct is further included, which is connected to the air inlet channel. The beneficial effect is that it facilitates the delivery of gas.

[0015] In a second aspect, an embodiment of the present invention provides a device for cleaning contaminants on a substrate surface, comprising a gas delivery device, a liquid delivery device, and the above-mentioned nozzle, wherein the gas delivery device is connected to an air duct, and the liquid delivery device is connected to a liquid inlet channel.

[0016] The beneficial effect of the present invention is that by connecting the gas delivery device to the air guide tube of the above-mentioned nozzle and connecting the liquid delivery device to the liquid inlet channel of the above-mentioned nozzle, the size of the outflowing droplets becomes smaller and the shape becomes more uniform, forming an atomized liquid, which can efficiently and damage the surface of the substrate without damage, thereby improving the yield of processing semiconductor substrates. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A cross-sectional view of a nozzle structure according to an embodiment of the present invention;

[0018] Figure 2 A cross-sectional view of another nozzle structure according to an embodiment of the present invention;

[0019] Figure 3 A cross-sectional view of another nozzle structure according to an embodiment of the present invention;

[0020] Figure 4 for Figure 1 In the AA section;

[0021] Figure 5 for Figure 1 In the BB cross-section.

[0022] Reference numerals:

[0023] Nozzle body 100, output channel 101, first air distribution slot 102, first sealing hole 103, air inlet hole 104, second sealing shaft 105, air inlet channel 106, first groove 107, first air guide hole 108; first sealing ring 200, second sealing ring 300;

[0024] Nozzle inner core 400, embedded portion 401, liquid inlet channel 402, second air distribution slot 403, first sealing shaft 404, air inlet slot 405, second air guide hole 406;

[0025] Housing 500, output port 501, second sealing hole 502, second groove 503;

[0026] Air guide tube 600 , primary air cavity 601 , secondary air cavity 602 ; flow regulator 700 . DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be the common meanings understood by people with ordinary skills in the field to which the present invention belongs. The words "including" and similar words used in this article mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0028] In view of the existing problems, the embodiment of the present invention provides a nozzle, referring to Figure 1 As shown, the nozzle includes a nozzle body 100 , a nozzle core 400 and a housing 500 .

[0029] The nozzle body 100 is provided with a through-mounting channel, and the front end of the mounting channel is configured as an output channel 101 for discharging liquid. A first air distribution slot 102 is provided along the outer structure of the output channel 101. The first air distribution slot 102 is annular. One end of the nozzle core 400 is configured as an embedded portion 401. A liquid inlet channel 402 is provided on the nozzle core 400. The liquid inlet channel 402 runs through the embedded portion 401, and a second annular air distribution slot 403 is provided at the front end of the liquid inlet channel 402. The nozzle core 400 has an embedded portion 401. The embedded portion 401 is inserted into the mounting channel and connected with the mounting channel to form a primary air cavity 601. The primary air cavity 601 is in communication with the second air distribution slot 403. When the embedded portion 401 is inserted into the mounting channel, the front end of the liquid inlet channel 402 corresponds to the output channel 101.

[0030] The shell 500 is mounted on one end of the output channel 101 of the nozzle body 100. The shell 500 is provided with an output port 501 corresponding to the output channel 101, and the shell 500 and the nozzle body 100 are connected to form a secondary air cavity 602. The secondary air cavity 602 is connected to the first air distribution groove 102, and the first air distribution groove 102 is connected to the output port 501. When air is guided in the secondary air cavity 602, the air flow flows out through the first air distribution groove 102 and the output port 501 in turn, which can break up the liquid discharged from the output channel 101.

[0031] In this embodiment, the front end of the liquid inlet channel 402 corresponds to the output channel 101. Since the front end of the liquid inlet channel 402 is provided with a second air distribution groove 403, when the liquid flows from the liquid inlet channel 402 to the output channel 101, the gas in the primary air cavity 601 will pass through the second air distribution groove 403 to disperse the liquid flowing into the output channel 101, forming smaller droplets with uniform shape. When the droplets flow out through the output channel 101 and pass through the output port 501, the gas in the secondary air cavity 602 passes through the first air distribution groove 102 to disperse the outflowing droplets, further making the size of the outflowing droplets smaller and the shape more uniform, which can efficiently and damage the surface of the substrate, thereby improving the yield of the semiconductor substrate.

[0032] Combine Figure 4 and Figure 5 As shown, the first air distribution slot 102 is provided with a first air guide hole 108 connected to the primary air cavity 601 to achieve gas circulation. Similarly, the second air distribution slot 403 is provided with a second air guide hole 406 connected to the secondary air cavity 602.

[0033] In another possible implementation, combined with Figure 2 As shown, the nozzle further includes a flow regulator 700. The nozzle body 100 is provided with an air inlet channel 106 that connects the primary air cavity 601 and the secondary air cavity 602. The flow regulator 700 is disposed within the air inlet channel 106 and is used to adjust the gas distribution between the primary air cavity 601 and the secondary air cavity 602. Providing the flow regulator 700 on the air inlet channel 106 facilitates the regulation and distribution of gas within the primary air cavity 601 and the secondary air cavity 602, making it suitable for processing particulate pollutants of different sizes and improving the applicability of the nozzle.

[0034] Combine Figure 3 As shown, the air inlet channel 106 provided on the nozzle body 100 can be two separate air inlet channels 106, each connected to the primary air cavity 601 and the secondary air cavity 602. Alternatively, a single air inlet channel 106 can connect the primary air cavity 601 and the secondary air cavity 602. It should be noted that when two separate air inlet channels 106 are provided, two air guide tubes 600 are required to connect the two air inlet channels 106, respectively. This prevents the gases in the primary air cavity 601 and the secondary air cavity 602 from interfering with each other, facilitating airflow control. However, when a single air inlet channel 106 connects the primary air cavity 601 and the secondary air cavity 602, a single air guide tube 600 can be used to connect the air inlet channel 106, reducing costs.

[0035] It should be noted that Figure 1 、 Figure 2 and Figure 3The nozzle disclosed in the embodiment of the present invention differs in whether there are two independent air inlet channels 106 or one shared air inlet channel 106, and whether a flow regulator 700 is provided in the air inlet channel 106. The other features are the same.

[0036] In another embodiment disclosed herein, based on the above embodiment, the nozzle further comprises a first sealing ring 200. The end of the mounting channel away from the output channel 101 is a first sealing hole 103, and the end of the embedded portion 401 away from the second air distribution slot 403 is a first sealing shaft 404. The first sealing ring 200 is sleeved on the first sealing shaft 404. When the embedded portion 401 is inserted into the mounting channel, the first sealing hole 103 and the first sealing shaft 404 are mated and connected, and the first sealing ring 200 abuts against the first sealing hole 103 and the first sealing shaft 404, respectively, to achieve sealing.

[0037] In this embodiment, by providing the first sealing ring 200, the first sealing shaft 404 and the first sealing hole 103, the possibility of gas leakage is avoided and the reliability of the product is improved.

[0038] In a possible implementation, the first sealing hole 103 and the first sealing shaft 404 are mutually matched first stepped structures, a first annular accommodating cavity is formed between the mutually matched first stepped structures, and the first sealing ring 200 is disposed in the first annular accommodating cavity.

[0039] Specifically, the first sealing hole 103 is a stepped structure formed by stacking two sealing holes of different diameters, and the diameter of the sealing hole near the output channel 101 is smaller than the diameter of the sealing hole away from the output pipe. The first sealing shaft 404 is a convex structure that cooperates with the first sealing hole 103. In order to form a first annular accommodating cavity, the protruding portion of the first sealing shaft 404 is deeper and longer than the sealing hole near the output channel 101, thereby forming a first annular accommodating cavity for installing the first sealing ring 200 without affecting the mating connection between the first sealing hole 103 and the first sealing shaft 404, ensuring sealing performance while simplifying the overall structure. It should be noted that at both ends of the first annular accommodating cavity, the first sealing hole 103 and the first sealing shaft 404 are provided with mutually mating threaded connection structures to achieve a threaded connection between the nozzle core 400 and the nozzle body 100.

[0040] In another possible implementation, an air inlet hole 104 is located within the installation channel of the nozzle body 100, between the first sealing hole 103 and the output channel 101. An annular air inlet groove 405 is provided on the outer side of the nozzle core 400, between the first sealing axis 404 and the second air distribution groove 403. When the nozzle core 400 is connected to the nozzle body 100, the air inlet groove 405 and the air inlet hole 104 cooperate to form a primary air cavity 601, and the air inlet channel 106 is connected to the air inlet hole 104.

[0041] The primary air cavity 601 is formed by structural coordination, which further simplifies the overall structure and reduces the overall structure size.

[0042] In another embodiment disclosed herein, based on the above-described embodiment, the nozzle structure further includes a second sealing ring 300. Located at one end of the output channel 101, the outer surface of the nozzle body 100 serves as a second sealing axis 105. The housing 500 defines a second sealing hole 502 corresponding to the second sealing axis 105. The second sealing ring 300 is sleeved onto the second sealing axis 105, which is mated and connected to the second sealing hole 502. The second sealing ring 300 abuts against the second sealing axis 105 and the second sealing hole 502. This structural arrangement further ensures the tightness of the connection between the nozzle body 100 and the housing 500, preventing leakage of gas within the secondary air cavity 602 and increasing product reliability.

[0043] In a possible implementation, the second sealing hole 502 and the second sealing shaft 105 are second stepped structures that cooperate with each other, forming a second annular accommodating cavity between the second stepped structures, and the second sealing ring 300 is disposed in the second annular accommodating cavity.

[0044] Specifically, similar to the formation of the first stepped structure, the second sealing hole 502 is a stepped structure formed by stacking two sealing holes of different diameters, and the diameter of the sealing hole near the output channel 101 is smaller than the diameter of the sealing hole away from the output pipe. The second sealing shaft 105 is a convex structure that cooperates with the second sealing hole 502. In order to form a second annular accommodating cavity, the protruding portion of the second sealing shaft 105 is deeper and longer than the sealing hole near the output channel 101, thereby forming a second annular accommodating cavity for installing the second sealing ring 300 without affecting the mating connection between the second sealing hole 502 and the second sealing shaft 105, further ensuring sealing performance while simplifying the overall structure. It should be noted that the second sealing hole 502 and the second sealing shaft 105 are provided with mutually mating threaded connection structures at both ends of the second annular accommodating cavity, thereby achieving a threaded connection between the nozzle core 400 and the nozzle body 100.

[0045] In another possible implementation, a first groove 107 is defined at the front end of the nozzle body 100, around the first air distribution slot 102. The air inlet channel 106 leads to the first groove 107. A second groove 503 is defined within the housing 500, corresponding to the first groove 107. The first groove 107 and the second groove 503 cooperate to form a secondary air cavity 602. The cooperation between the first groove 107 and the second groove 503 to form the secondary air cavity 602 further simplifies the overall structure and reduces its overall size.

[0046] It is understandable that, according to the above solution, multiple air cavities can be provided in the nozzle body 100 , and multiple shells 500 can be combined to form a multi-stage spray effect, which will not be elaborated here one by one.

[0047] In another embodiment disclosed in the present invention, a device for cleaning contaminants on the surface of a substrate includes a gas delivery device, a liquid delivery device, and the nozzle disclosed in the above embodiment. The gas delivery device is connected to the air guide tube 600 and is used to deliver inert gas. The liquid delivery device is connected to the liquid inlet channel 402 and is used to deliver cleaning liquid.

[0048] In this embodiment, by connecting the gas delivery device to the air duct 600 and the liquid delivery device to the liquid inlet channel 402 of the nozzle, the size of the outflowing droplets is reduced and the shape is more uniform, forming an atomized liquid, which can efficiently and damage the surface of the substrate without damage, thereby improving the yield of processing semiconductor substrates.

[0049] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A nozzle, characterized in that: include: The nozzle body (100) is provided with a mounting channel running through the nozzle body (100), the front end of the mounting channel is an output channel (101), and the outer side of the output channel (101) is provided with a first air distribution slot (102); The nozzle inner core (400) has an embedded portion (401), the nozzle inner core (400) is provided with a liquid inlet channel (402) that passes through the embedded portion (401), the front end of the liquid inlet channel (402) corresponds to the output channel (101), the front end of the liquid inlet channel (402) is provided with a second air distribution slot (403), the embedded portion (401) is connected to the installation channel and forms a primary air cavity (601), and the primary air cavity (601) is connected to the second air distribution slot (403); The shell (500) is sleeved on the nozzle body (100), and the shell (500) is provided with an output port (501) corresponding to the output channel (101), and the shell (500) and the nozzle body (100) are connected to form a secondary air cavity (602), and the secondary air cavity (602) is connected to the first air distribution slot (102), and the first air distribution slot (102) is connected to the output port (501).

2. The nozzle according to claim 1, characterized in that Also included is a flow regulator (700); The nozzle body (100) is provided with an air inlet channel (106) for connecting the primary air cavity (601) and the secondary air cavity (602), and the air inlet channel (106) is provided with the flow regulator (700) for regulating the gas distribution between the primary air cavity (601) and the secondary air cavity (602).

3. The nozzle according to claim 1 or 2, characterized in that Also includes a first sealing ring (200); The end of the installation channel away from the output channel (101) is a first sealing hole (103), the end of the embedded part (401) away from the second air distribution groove (403) is a first sealing shaft (404), and the first sealing ring (200) is sleeved on the first sealing shaft (404) and abuts against the first sealing hole (103).

4. The nozzle according to claim 3, characterized in that The first sealing hole (103) and the first sealing shaft (404) are mutually matched first stepped structures, a first annular accommodating cavity is formed between the mutually matched first stepped structures, and the first sealing ring (200) is arranged in the first annular accommodating cavity.

5. The nozzle according to claim 4, characterized in that An air inlet hole (104) is provided between the first sealing hole (103) and the output channel (101); an air inlet groove (405) is provided between the first sealing shaft (404) and the second air distribution groove (403); the air inlet groove (405) and the air inlet hole (104) cooperate to form the first-level air cavity (601); and the air inlet channel (106) is connected to the air inlet hole (104).

6. The nozzle according to claim 5, characterized in that Also includes a second sealing ring 300; The outer side surface of the nozzle body (100) is a second sealing shaft, the housing (500) is provided with a second sealing hole (502), and the second sealing ring (300) is sleeved on the second sealing shaft and abuts against the second sealing hole (502).

7. The nozzle according to claim 6, characterized in that The second sealing hole (502) and the second sealing shaft are second stepped structures that cooperate with each other, and a second annular accommodating cavity is formed between the second stepped structures that cooperate with each other. The second sealing ring (300) is arranged in the second annular accommodating cavity.

8. The nozzle according to claim 7, characterized in that A first groove (107) is provided at the front end of the nozzle body (100), the air inlet channel (106) is connected to the first groove (107), a second groove (503) is provided in the shell (500) corresponding to the first groove (107), and the first groove (107) and the second groove (503) cooperate to form the secondary air cavity (602).

9. The nozzle according to claim 8, characterized in that It also includes an air guide pipe (600), and the air guide pipe (600) is connected to the air intake channel (106).

10. A device for cleaning contaminants on a substrate surface, characterized in that: It comprises an air delivery device, a liquid delivery device and the nozzle according to any one of claims 1 to 9; the air delivery device is connected to the air guide tube (600), and the liquid delivery device is connected to the liquid inlet channel (402).

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