Thermal compression bonding apparatus for semiconductor packaging

Abstract

The application discloses a hot-press bonding equipment for semiconductor packaging, which comprises a shell, wherein the shell mainly comprises a box body and a door body, the door body is installed on the side of the box body, and a heating system is arranged in the shell; a pulling mechanism is connected to the door body, the pulling mechanism is provided in several groups, each group of the pulling mechanism comprises a fixed pulley, a traction rope, a rotating shaft and a winding wheel, the winding wheel is fixedly sleeved on the rotating shaft, and the traction rope is connected to the winding wheel by being wound around the rotating shaft and away from the door body; during the hot-pressing process, the door body and a template always keep synchronous movement, namely, the template is taken out, the door body is opened, the template is reset, and the door body is closed, so that the problem that the hot-pressing temperature is influenced due to the fact that the heat in the box body is leaked out for too long opening time of the door body is avoided, the temperature in the box body is kept in a relatively stable state, good temperature conditions for the hot-pressing are created, and the problem that the hot-pressing temperature is not up to the standard or the temperature needs to be repeatedly adjusted due to heat exchange between the temperature and the outside world is reduced.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more specifically to a thermocompression bonding apparatus for semiconductor packaging. Background Technology

[0002] Bonding refers to the technology of directly combining two homogeneous or heterogeneous semiconductor materials with clean, atomically flat surfaces after surface cleaning and activation treatment, under certain conditions, by using van der Waals forces, molecular forces, or even atomic forces to bond the wafers together.

[0003] Semiconductor thermocompression bonding is a common step in semiconductor manufacturing. For mass production factories, large-scale thermocompression bonding equipment with relatively mature technology can be used. However, for laboratories or technical testing personnel, relatively small thermocompression bonding equipment is required. Existing small thermocompression bonding equipment has the following problems:

[0004] Before hot pressing, the hot pressing environment needs to be preheated. Then the semiconductor is placed in the hot pressing area. During this process, the temperature in the hot pressing environment often exchanges heat with the outside environment, which affects the temperature of the internal environment of the hot pressing. Summary of the Invention

[0005] The purpose of this invention is to provide a thermocompression bonding apparatus for semiconductor packaging, solving the following technical problems:

[0006] During the process of placing semiconductors in the hot pressing area, the heat in the hot pressing environment often exchanges with the outside environment, which affects the temperature of the internal environment of the hot pressing.

[0007] The objective of this invention can be achieved through the following technical solutions:

[0008] A thermocompression bonding apparatus for semiconductor packaging includes a housing, which mainly comprises a box body and a door. The door is mounted on the side of the box body, and a heating system is installed inside the housing. A [device / system] is connected to the door.

[0009] The lifting mechanism consists of several groups, each group including...

[0010] Fixed pulleys are installed on the outside of the box body and above the door body via support rods;

[0011] The tow rope has one end connected to the outer surface of the door.

[0012] A rotating shaft is movably installed inside the housing, with a drive mechanism connected to one end of the shaft.

[0013] A reel is fixedly mounted on a rotating shaft, and the end of the traction rope away from the door body passes around the rotating shaft and is connected to the reel.

[0014] The transmission mechanism has one end connected to the rotating shaft and the other end connected to...

[0015] Push notification providers, including:

[0016] Sleeve,

[0017] Insert rod, the insert rod is movably inserted into the sleeve rod,

[0018] A fixed block is fixedly connected to the transmission mechanism, and a plug rod is fixedly connected to the fixed block.

[0019] The hot pressing mechanism is installed inside the housing.

[0020] The base plate is installed inside the lower part of the enclosure.

[0021] The template is movably connected to the upper side of the base plate, and the end of the sleeve rod away from the insert rod is hinged to the side of the template.

[0022] In a further embodiment: the hot pressing mechanism includes...

[0023] Expansion joint, which is installed on the top wall inside the box;

[0024] The connecting rod is fixedly connected to the extended end of the expansion joint;

[0025] The pressure plate is connected to the lower end of the connecting rod by a buffer mechanism.

[0026] In a further embodiment: the buffer mechanism includes

[0027] The sleeve is movably fitted onto the lower end of the connecting rod, and the pressure plate is connected to the lower side of the sleeve;

[0028] The elastic ring is connected to the lower end of the connecting rod and the inner wall of the lower side of the sleeve.

[0029] In a further embodiment: the transmission mechanism includes...

[0030] One pulley is fixedly sleeved on the rotating shaft;

[0031] The second pulley is fixedly connected to the side of the second pulley by a fixing block, and the insertion rod intersects the center of the second pulley through the extension line of the fixing block.

[0032] A belt, which connects pulley one and pulley two;

[0033] The central shaft is fixed and parallel to the rotating shaft, and the two pulleys are movably sleeved on the central shaft.

[0034] In a further embodiment: a slider is installed on the lower side of the template, and a slide rail is provided on the upper side of the base plate, with the slider embedded in the slide rail.

[0035] In a further design: a semiconductor placement groove is provided inside the template.

[0036] In a further design: several sets of lifting mechanisms are evenly and symmetrically distributed on the door body with respect to the door and the box body.

[0037] The beneficial effects of this invention are:

[0038] (1) During the hot pressing process, the door and the template always move synchronously. That is, when the template comes out, the door opens, when the template resets, the door closes. This avoids the heat leakage inside the box due to the door being open for too long, which would affect the hot pressing temperature. This ensures that the temperature inside the box is in a relatively stable state, creating good temperature conditions for hot pressing and reducing the problem of the hot pressing temperature not meeting the standard or the temperature needing to be repeatedly adjusted due to heat exchange between the temperature and the outside.

[0039] (2) When hot pressing is performed, the telescopic device is activated to drive the connecting rod to move downward. The connecting rod drives the pressure plate to move downward through the sleeve. When the pressure plate contacts the convex key on the upper side of the semiconductor, the connecting rod continues to move downward to compress the elastic ring, thereby driving the pressure plate to buffer and flatten the convex key downward. This avoids the pressure plate from damaging the convex key or causing the convex key to be misaligned on the semiconductor due to the excessively rapid and strong impact force. Attached Figure Description

[0040] The invention will now be further described with reference to the accompanying drawings.

[0041] Figure 1 This is a schematic diagram of the structure of an embodiment of the present invention;

[0042] Figure 2 This is a schematic diagram of the internal structure of an embodiment of the present invention;

[0043] Figure 3 This is a schematic diagram of the internal structure of an embodiment of the present invention in its working state;

[0044] Figure 4 This is what distinguishes the embodiments of the present invention from Figure 2 A schematic diagram of the internal structure.

[0045] The symbols in the image represent:

[0046] 100. Outer shell; 110. Box body; 120. Door body;

[0047] 200. Lifting mechanism; 210. Fixed pulley; 220. Traction rope; 230. Rotating shaft; 240. Cable reel;

[0048] 300. Transmission mechanism; 310. Pulley 1; 320. Pulley 2; 330. Belt; 340. Central shaft;

[0049] 400. Pushing mechanism; 410. Sleeve rod; 420. Insert rod; 430. Fixing block;

[0050] 500. Hot pressing mechanism; 510. Expansion joint; 520. Connecting rod; 530. Sleeve; 540. Elastic ring; 550. Pressure plate;

[0051] 600. Heating system;

[0052] 700, base plate;

[0053] 800, Template;

[0054] 900. Drive mechanism. Detailed Implementation

[0055] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0056] Please see Figure 1-4 As shown, the present invention is a thermocompression bonding device for semiconductor packaging, including a housing 100. The housing 100 mainly includes a box body 110 and a door body 120. The door body 120 is installed on the side of the box body 110. Both the box body 110 and the door body 120 are made of high-temperature resistant, high-strength metal materials, such as high-alumina bricks or magnesia bricks. A heating system 600 is provided in the housing 100. The heating system 600 is used to make the interior of the box body 110 reach the temperature required for thermocompression bonding. The heating system 600 adopts the system used in existing thermocompression bonding devices, so the specific structure of the heating system 600 will not be described further.

[0057] Several sets of traction ropes 220 are connected to the door body 120. Each set of lifting mechanism 200 includes a fixed pulley 210. The fixed pulley 210 is installed on the outside of the box body 110 and above the door body 120. The fixed pulley 210 is installed on one end of a support rod, and the other end of the support rod is fixedly connected to the outer wall of the box body 110.

[0058] The traction rope 220 has one end fixedly connected to the outer surface of the door body 120. The connection between the traction rope 220 and the door body 120 only needs to meet the requirement of fixed connection. The traction rope 220 can be made of steel wire rope or other high-temperature resistant and non-breakable rope.

[0059] A rotating shaft 230 is movably installed inside the housing 110, with one end connected to a drive mechanism 900. The drive mechanism 900 can be any device capable of driving the rotating shaft 230 to rotate. For example, in this embodiment of the invention, the drive mechanism 900 is a motor. One end of the rotating shaft 230 is movably connected to the inner wall of the housing 110 through a bearing seat, and the other end is fixedly connected to the output end of the drive mechanism 900. Therefore, when the drive mechanism 900 is started, it can drive the rotating shaft 230 to rotate.

[0060] A winding wheel 240 is fixedly sleeved on the rotating shaft 230. The winding wheel 240 is connected to the end of the traction rope 220 away from the door body 120. The traction rope 220 must pass through the fixed pulley 210. Therefore, when the rotating shaft 230 rotates, it will drive the winding wheel 240 to rotate, so that the winding wheel 240 can take in or let out the traction rope 220.

[0061] It should be noted that the number of fixed pulleys 210 is not specifically limited. In this embodiment of the invention, there is one fixed pulley 210. However, in practical applications, multiple fixed pulleys 210 can be set according to specific circumstances to provide more flexible traction for the traction rope 220. At the same time, the lifting mechanism 200 can be set into several groups. For example, in this embodiment of the invention, the lifting mechanism 200 is set into two groups. However, the several groups of lifting mechanisms 200 need to be symmetrically and evenly distributed about the door body 120 and the box body 110 to ensure that the door body 120 is subjected to balanced force when it is opened.

[0062] One end of the transmission mechanism 300 is connected to the rotating shaft 230, and the other end of the transmission mechanism 300 is connected to the pushing mechanism 400. The function of the transmission mechanism 300 is to provide driving force to the pushing mechanism 400 through the rotating shaft 230.

[0063] A base plate 700 is provided at the bottom of the interior of the housing 110. A template 800 is movably connected to the upper side of the base plate 700. Here, the connection method between the base plate 700 and the template 800 is not specifically limited, as long as the base plate 700 can make linear movements toward the door 120 on the template 800 without detaching from the surface of the base plate 700. For example, in this embodiment of the invention, a slider is installed on the lower side of the template 800, and a slide rail is provided on the upper side of the base plate 700. The slider is embedded in the slide rail, which achieves the purpose of the template 800 being able to move freely on the base plate 700 without detaching from it.

[0064] The pushing mechanism 400 includes a sleeve rod 410, one end of which is hinged to the side of the template 800, and the other end is movably connected to an insert rod 420. The end of the insert rod 420 is fixedly connected to the transmission mechanism 300 through a fixing block 430. The end of the insert rod 420 can rotate around the connection part connected to the transmission mechanism 300. In order to ensure that the force from the pushing mechanism 400 on the template 800 is more balanced, it is better to set two sets of the pushing mechanism 400 than one set. The two sets of pushing mechanisms 400 are respectively set on both sides of the template 800, which helps to maintain the stability of the template 800 during movement.

[0065] The housing 110 is equipped with a hot pressing mechanism 500 for hot pressing semiconductors.

[0066] During the hot-press bonding operation, the drive mechanism 900 is activated to drive the rotating shaft 230 to rotate for a certain period of time. The rotating shaft 230 drives the winding wheel 240 to rotate, causing the winding wheel 240 to take in the traction rope 220. The traction rope 220 takes in the rope and pulls up the door 120, thus opening the door 120. At the same time, the rotating shaft 230 drives the fixed block 430 to move through the transmission mechanism 300. The fixed block 430 drives the insertion rod 420 to move accordingly. The insertion rod 420 pushes the template 800 on the base plate 700 towards the door 120 through the sleeve rod 410, so that the hot-pressing area of ​​the template 800 moves to the outside of the box 110.

[0067] The hot pressing area of ​​template 800 has a semiconductor placement slot. At this time, the semiconductor is quickly placed in the semiconductor placement slot on template 800, and then the drive mechanism 900 is restarted to make the winding wheel 240 rotate. Then all the above actions are reversed, so that the door 120 is closed and the template 800 returns to its original position. Then the hot pressing mechanism 500 is started to hot press the semiconductor.

[0068] Throughout the process, the door 120 and the template 800 maintain synchronous movement. That is, when the template 800 comes out, the door 120 opens; when the template 800 resets, the door 120 closes. This avoids the door 120 being open for too long, which could cause heat leakage from the inside of the chamber 110 and affect the hot pressing temperature. It ensures that the temperature inside the chamber 110 is in a relatively stable state, creating good temperature conditions for hot pressing and reducing the problem of substandard hot pressing temperature or the need for repeated temperature adjustments caused by heat exchange with the outside environment.

[0069] The hot pressing mechanism 500 includes a telescopic member 510, which is installed on the inner top wall of the housing 110. The extended end, i.e., the lower end, of the telescopic member 510 is connected to a connecting rod 520. The lower end of the connecting rod 520 is connected to a pressure plate 550 through a buffer mechanism. The buffer mechanism can be any structure that can provide a buffering effect. For example, in this embodiment of the invention, the buffer mechanism mainly includes a sleeve 530, which is movably sleeved on the lower end of the connecting rod 520. The pressure plate 550 is connected to the lower side of the sleeve 530. An elastic ring 540 is provided between the lower end of the connecting rod 520 and the lower inner wall of the sleeve 530. The elastic ring 540 can be replaced by other components with elasticity, such as a spring.

[0070] During hot pressing, the telescopic device 510 is activated, which drives the connecting rod 520 to move downward. The connecting rod 520 drives the pressure plate 550 to move downward through the sleeve 530. When the pressure plate 550 contacts the convex key on the upper side of the semiconductor, the connecting rod 520 continues to move downward to compress the elastic ring 540, thereby driving the pressure plate 550 to press the convex key downward in a buffered manner. This avoids damage to the convex key or misalignment of the convex key on the semiconductor due to excessively rapid and strong impact force.

[0071] The transmission mechanism 300 includes a first pulley 310, which is fixedly sleeved on the rotating shaft 230; a second pulley 320, with a fixing block 430 fixedly connected to the side of the second pulley 320, and the insertion rod 420 intersecting the center of the second pulley 320 through the extension line of the fixing block 430; a belt 330, which connects the first pulley 310 and the second pulley 320; and a central shaft 340, which is fixedly set and parallel to the rotating shaft 230, with the second pulley 320 movably sleeved on the central shaft 340.

[0072] When the rotating shaft 230 rotates, the rotating shaft 230 drives the second pulley 320 to rotate. The second pulley 320 drives the first pulley 310 to rotate through the belt 330. The dimensions of the second pulley 320 and the first pulley 310 are customized according to actual usage requirements. The second pulley 320 drives the fixed block 430 to rotate accordingly, which in turn causes the fixed block 430 to move the template 800 through the cooperation of the insertion rod 420 and the sleeve rod 410.

[0073] Working principle of the invention:

[0074] During the hot-press bonding operation, the drive mechanism 900 is activated to rotate the shaft 230 for a certain period of time. The shaft 230 then rotates the winding reel 240, causing it to reel in the traction rope 220. This reeling in pulls up the door 120, opening it. Simultaneously, the shaft 230, through the transmission mechanism 300, drives the fixing block 430 to rotate. The fixing block 430 then moves the insertion rod 420, which, through the sleeve rod 410, pushes the template 800 on the base plate 700 towards the door 120, moving the hot-pressing area of ​​the template 800 to the outside of the housing 110. At this point, the semiconductor is quickly placed into the semiconductor slot on the template 800, and the drive mechanism is restarted. When the winding reel 240 rotates, all the above actions are reversed, causing the door 120 to close and the template 800 to return to its original position. Then, the hot pressing mechanism 500 is activated to hot press the semiconductor. Throughout the process, the door 120 and the template 800 always move synchronously. That is, when the template 800 comes out, the door 120 opens; when the template 800 returns to its original position, the door 120 closes. This avoids the door 120 being open for too long, which could cause heat leakage from the inside of the housing 110 and affect the hot pressing temperature. It ensures that the temperature inside the housing 110 is in a relatively stable state, creating good temperature conditions for hot pressing and reducing the problem of substandard hot pressing temperature or the need for repeated temperature adjustments caused by heat exchange with the outside environment.

[0075] In the description of this invention, it should be understood that the terms "upper," "lower," "left," and "right," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or a specific orientational structure and operation. Therefore, they should not be construed as limitations on the invention. Furthermore, "first" and "second" are only for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "multiple" means two or more.

[0076] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0077] The foregoing has provided a detailed description of one embodiment of the present invention, but this description is merely a preferred embodiment and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the claims of this invention should still fall within the patent coverage of this invention.

Claims

1. A thermocompression bonding apparatus for semiconductor packaging, comprising a housing (100), the housing (100) including a box body (110) and a door (120), the door (120) being mounted on the side of the box body (110), and a heating system (600) disposed therein; characterized in that, The door (120) is connected to A lifting mechanism (200) is provided, wherein the lifting mechanism (200) is provided in several groups, and each group of the lifting mechanism (200) includes A fixed pulley (210) is installed on the outside of the box body (110) and above the door body (120) by a support rod; A traction rope (220), one end of which is connected to the outer surface of the door body (120); A rotating shaft (230) is movably installed inside the housing (110), and one end of the rotating shaft (230) is connected to a drive mechanism (900). A reel (240) is fixedly sleeved on a rotating shaft (230), and the end of the traction rope (220) away from the door body (120) passes around the rotating shaft (230) and is connected to the reel (240); Transmission mechanism (300), one end of which is connected to the rotating shaft (230) and the other end is connected to a... Push mechanism (400), the push mechanism (400) includes: Sleeve (410) Insert rod (420), which is movably inserted through sleeve rod (410). A fixing block (430) is fixedly connected to a transmission mechanism (300), and a plug rod (420) is fixedly connected to the fixing block (430); A hot pressing mechanism (500) is installed inside the housing (110); A base plate (700) is installed inside the lower part of the housing (110); Template (800), the template (800) is movably connected to the upper side of the base plate (700), and the end of the sleeve rod (410) away from the insert rod (420) is hinged to the side of the template (800); The transmission mechanism (300) includes: Belt pulley 1 (310), which is fixedly sleeved on the rotating shaft (230); The second pulley (320) is fixedly connected to the side of the second pulley (320), and the insertion rod (420) passes through the extension line of the fixed block (430) and intersects with the center of the second pulley (320). A belt (330) is connected between a first pulley (310) and a second pulley (320); A central shaft (340) is fixedly set and parallel to the rotating shaft (230), and the second pulley (320) is movably sleeved on the central shaft (340); The hot pressing mechanism (500) includes: Expansion joint (510), said expansion joint (510) is installed on the top wall inside the housing (110); Link (520), which is fixedly connected to the extended end of the telescopic device (510); A pressure plate (550) is connected to a buffer mechanism between the pressure plate (550) and the lower end of the connecting rod (520); The buffer mechanism includes Sleeve (530), the sleeve (530) is movably sleeved on the lower end of the connecting rod (520), and the pressure plate (550) is connected to the lower side of the sleeve (530); Elastic ring (540), the elastic ring (540) is connected to the lower end of the connecting rod (520) and the lower inner wall of the sleeve (530); Throughout the hot pressing process, the door (120) and the template (800) always move synchronously. That is, when the template (800) comes out, the door (120) opens; when the template (800) resets, the door (120) closes. This avoids the door (120) from being open for too long, which would cause heat leakage from the inside of the box (110) and affect the hot pressing temperature.

2. The thermocompression bonding apparatus for semiconductor packaging according to claim 1, characterized in that, A slider is installed on the lower side of the template (800), and a slide rail is provided on the upper side of the base plate (700), with the slider embedded in the slide rail.

3. The thermocompression bonding apparatus for semiconductor packaging according to claim 2, characterized in that, The template (800) has a semiconductor placement slot inside.

4. The thermocompression bonding apparatus for semiconductor packaging according to claim 1, characterized in that, Several sets of lifting mechanisms (200) are evenly and symmetrically distributed on the door (120) with respect to the door (120) and the box (110).

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