A semiconductor particle mounting device

Abstract

The present invention discloses a semiconductor particle mounting device, comprising: a vibration introduction device, an array conveying device, the array conveying device comprising a conveying device and a flexible array arrangement mechanism, the conveying device comprising a feeding mechanism arranged at the outlet of the vibration introduction device and a magnetic suction conveying mechanism arranged below the outlet of the vibration introduction device, the magnetic suction conveying mechanism is provided with a magnetic suction conveying belt and an array channel for generating magnetic attraction to the nickel cover layer of the semiconductor particles; the flexible array arrangement mechanism is provided with a flexible array component for generating a flipping force to the semiconductor particles; the nickel cover layer on the semiconductor particles is arranged in an upper and lower position under the action of the flipping force and the magnetic attraction force and is arranged and transported in an array; an electromagnetic mounting mechanism, the electromagnetic mounting mechanism comprising a particle clamping mechanism and a mounting mechanism arranged in linkage. The fully automated design of semiconductor particle array preparation, conveying and mounting is realized, the mounting efficiency is improved, the cost is reduced, the operation is convenient, and the mounting quality is high.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor refrigeration manufacturing, and in particular to a semiconductor particle mounting device with an arranging function and capable of mounting regular cubic semiconductor particles. Background Art

[0002] With the increasing demand for miniaturization of semiconductor refrigerators, in the manufacturing process of small semiconductor refrigerators, if cubic semiconductor particles appear, it will be very difficult to arrange them in the tray (TRAY), and they need to be manually identified and placed by hand. The particle size is very small and difficult to identify, and the use of conventional vacuum nozzles will result in insufficient suction. The nozzle touches the surrounding semiconductor particles and is likely to touch the mounted semiconductor particles, affecting the mounting quality.

[0003] In the prior art, there are also automatic placement devices to solve the problems of low efficiency in manual placement of electronic components. However, most of the existing automatic placement devices use vacuum suction nozzles for placement. Since the cubic semiconductor particles have nickel capping on both sides, the nickel capping cannot be identified by vacuum suction. They need to be placed manually in advance and then adsorbed and placed by vacuum suction nozzles. There is still a problem of low efficiency, and it is easy to touch the already placed semiconductor particles, affecting the placement quality. The existing technical solutions cannot meet the automatic placement of cubic semiconductor particles with nickel capping on both sides.

[0004] Therefore, it is urgent to design a mounting device that can realize the orientation correction and arrangement of regular cubic semiconductor particles, and then electromagnetically adsorb and automatically mount them without affecting the already mounted semiconductor particles. Summary of the invention

[0005] The purpose of the present invention is to solve the problems of low efficiency of existing manual mounting and low mounting quality and efficiency of vacuum adsorption mounting, and to provide a semiconductor particle mounting device that can realize fully automatic mounting of regular cubic semiconductors with high mounting quality and high efficiency, and can meet the needs of fast, efficient and high-quality mounting of regular cubic semiconductor particles of different specifications with nickel covering layers on two opposite sides.

[0006] The technical solution adopted by the present invention to achieve the first invention object is: a semiconductor particle mounting device, comprising:

[0007] A vibration introduction device, used to implement vibration-type introduction of semiconductor particles;

[0008] An alignment conveying device is connected to the outlet of the vibration introduction device, and is used to arrange the nickel capping layer on the semiconductor particles in a consistent direction and convey them in sequence after being aligned; the alignment conveying device includes a feeding device and a flexible alignment arrangement mechanism, the feeding device includes a feeding mechanism arranged at the outlet of the vibration introduction device and a magnetic suction conveying mechanism arranged below the outlet of the vibration introduction device, the magnetic suction conveying mechanism is provided with a magnetic suction conveying belt and an alignment channel that generate a magnetic attraction force on the nickel capping layer of the semiconductor particles; the flexible alignment arrangement mechanism is provided with a flexible alignment component that generates a flipping force on the semiconductor particles; under the action of the flipping force and the magnetic attraction force, the nickel capping layer on the semiconductor particles is arranged in an upper and lower position and is arranged and conveyed in an aligned manner;

[0009] The electromagnetic mounting mechanism is arranged at the output end of the whole-row conveying device and is used to realize the electromagnetic mounting of semiconductor particles; the electromagnetic mounting mechanism comprises a particle clamping mechanism and a mounting mechanism which are arranged in linkage.

[0010] The semiconductor particle mounting device is provided with a vibration introduction device. Before mounting, the cubic semiconductor particles are placed in the vibration introduction device and vibrated, so that the cubic semiconductor particles are vibrated and transported downward. At this time, the cubic semiconductor particles are vibrated and arranged one by one and transported downward, but the nickel covering layers on the cubic semiconductor particles are not in the same direction. The array conveying device is provided with a magnetic conveyor belt and a flexible array arrangement mechanism. The cubic semiconductor particles are transported from the vibration introduction device in an orderly manner and fall onto the magnetic conveyor belt at a certain time interval. During the falling process, the magnetism of the magnetic conveyor belt and the nickel covering layer on the cubic semiconductor particles will generate suction. Therefore, most of the cubic semiconductor particles will be adsorbed on the magnetic conveyor belt in an up-and-down state of the nickel covering layer during the falling process, while some of the cubic semiconductor particles that do not show the nickel covering layer in an up-and-down state will generate friction between them and the flexible array arrangement mechanism during the movement with the magnetic conveyor belt, that is, the flexible array arrangement mechanism generates a friction flipping force on the cubic semiconductor particles. At the same time, due to the magnetic suction of the magnetic conveyor belt, the friction flipping force and the magnetic field will cause the magnetic field to be attracted to the inner surface of the semiconductor particles. The suction force together turns over the regular cubic semiconductor particles that are not in the nickel-capped upside-down state, and finally they are all in the nickel-capped upside-down state and adsorbed on the magnetic conveyor belt for transportation. After the regular cubic semiconductor particles are transported to the whole column channel, they are further arranged through the whole column channel to finally form an orderly whole column state and are ballistically transported to the electromagnetic mounting mechanism; and the electromagnetic mounting mechanism is linked with a particle clamping mechanism and a mounting mechanism. When mounting is required, the mounting mechanism moves upward to be in a state to be mounted. At this time, the particle clamping mechanism moves to move the whole column channel The cubic semiconductor particles at the exit are clamped and driven to move directly below the mounting mechanism. When the particles move to the bottom of the mounting mechanism, the particle clamping mechanism stops. At this time, the mounting mechanism moves downward to the nickel cover layer of the cubic semiconductor particles to generate magnetic attraction, and adsorbs the cubic semiconductor particles on the mounting mechanism to drive them to move downward together. When the particles move to the mounting position where the semiconductor refrigeration plate substrate is located, the cubic semiconductor is directly mounted, thereby realizing the one-time automatic operation of conveying, arranging, clamping, and mounting the cubic semiconductor particles. The transport and mounting rates of the cubic semiconductor particles are consistent, and the cycle is repeated, which effectively improves the mounting efficiency and mounting quality. For semiconductor particles of different shapes and sizes, the mounting device of the semiconductor particles can be set with a vibration introduction device and an array conveying device according to the size and model of the semiconductor particles, thereby realizing a universal design for mounting semiconductor particles, greatly reducing the mounting cost.

[0011] Preferably, the vibration introduction device includes a feeding funnel, a vibration motor that drives the feeding funnel to vibrate, a delivery pipe connected to the feeding funnel, and a feeding hose connected to the lower end of the delivery pipe; the caliber of the feeding hose is set in accordance with the semiconductor particles and the semiconductor particles can pass through one by one. The vibration introduction device preferably drives the feeding funnel to vibrate by a vibration motor, and a delivery pipe is arranged below the feeding funnel. After vibration, the regular cubic semiconductor particles are vibrated into the delivery pipe in sequence and fall in order. A feeding hose is connected to the lower end of the delivery pipe, and the regular cubic semiconductor particles enter the feeding hose through the delivery pipe. The purpose of setting the feeding hose is mainly to facilitate the regular cubic semiconductor particles to be sequentially and intermittently extruded through the conveying mechanism arranged at the lower end of the feeding hose, so that they fall onto the magnetic suction conveyor belt.

[0012] Preferably, the feeding mechanism is symmetrically provided with two sets of feeding gears, the rotation directions of the two sets of feeding gears are opposite, the spacing between the tangents of the two sets of feeding gears in the rotation direction matches the width of the semiconductor particles, and the semiconductor particles are driven through by the reverse rotation force; the feeding gears are driven to rotate by the gear power motor and the semiconductor particles are orderly and fall onto the magnetic suction conveyor belt at a certain time interval by controlling the rotation speed. The feeding mechanism is mainly composed of feeding gears symmetrically arranged on both sides of the outlet of the feeding hose, and the two sets of feeding gears turning in opposite directions drive the regular cubic semiconductor particles to be intermittently output from the feeding hose in sequence, thereby realizing the orderly transportation of the regular cubic semiconductor particles, ensuring that the regular cubic semiconductor particles falling on the magnetic suction conveyor belt have enough turning space, so as to finally realize the arrangement of all regular cubic semiconductor particles in the upper and lower states of the nickel cover layer.

[0013] Preferably, the magnetic conveying mechanism further comprises a gear driving mechanism and an array channel, wherein the gear driving mechanism comprises an array gear and an array gear driving mechanism, wherein the array gear is driven to rotate and drive the magnetic conveyor belt to move through the array gear driving mechanism; wherein the array channel comprises an array oblique channel and an array outlet for semiconductor particles to pass through in sequence. The magnetic conveying mechanism is further provided with a gear driving mechanism and an array channel, wherein the array gear driving mechanism drives the array gear to rotate, and the array gear drives the magnetic conveyor belt wound thereon to move, and the array channel is provided at the output end of the magnetic conveyor belt, and the regular cubic semiconductor particles are moved to the array outlet in sequence through an array oblique channel, so that they are arranged in a row in sequence at the array outlet, so as to facilitate the sequential and orderly clamping of the particle clamping mechanism.

[0014] Preferably, the flexible alignment component is arranged above the magnetic conveyor belt, and the flexible alignment component includes a plurality of flexible alignment soft hairs of different lengths that contact with the semiconductor particles and generate a flipping friction force. The flexible alignment component is arranged above the magnetic conveyor belt and the distance between the flexible alignment component and the magnetic conveyor belt is less than the height of the semiconductor particles, so that the flexible alignment component contacts with the semiconductor particles during the movement of the semiconductor particles and generates a friction flipping force on them. The flexible alignment component preferably has flexible alignment soft hairs of different lengths that will not cause damage to the semiconductor particles, and can also contact with the semiconductor particles and generate a flipping friction force, so that the semiconductor particles can be effectively flipped into a state where the nickel cover layer is in an up and down position.

[0015] Preferably, the particle clamping mechanism includes a group of friction drive mechanisms in a clamping structure arranged on both sides of the output end of the magnetic conveyor belt, and a friction clamping channel is formed between the friction drive mechanisms on both sides; the friction drive mechanism includes an active end and a passive end, the passive end is arranged at one end of the magnetic conveyor belt, the active end is arranged away from the magnetic conveyor belt, and the active end rotates relatively outward and inward with the passive end as the center. The particle clamping mechanism is used to realize the clamping movement of semiconductor particles. Therefore, in order to ensure that the semiconductor particles are not damaged during the clamping process, a friction drive mechanism is preferably used. A friction clamping channel is formed by two groups of friction drive mechanisms. When clamping, the semiconductor particles are clamped and kept motionless by the two friction drive mechanisms, and the friction drive mechanism moves, driving the semiconductor particles to move together. Since the particle clamping mechanism needs to be linked with the mounting mechanism, the friction drive mechanism is provided with an active end and a passive end, and the active end can rotate relative to the passive end, thereby realizing the clamping and release of the semiconductor particles.

[0016] Preferably, the friction drive mechanism includes a friction gear drive mechanism and a friction soft belt, the friction gear drive mechanism includes an active drive mechanism and a passive drive mechanism, the active drive mechanism includes a driving gear and a driving gear drive mechanism; the driving gear drive mechanism includes a power module for providing power and a mobile module for realizing movement; the passive drive mechanism includes a passive gear, the friction soft belt is wound around the driving gear and the passive gear and rotates around the driving gear and the passive gear through the driving gear drive, and the driving gear is slidingly arranged in an arc track limit groove. The friction drive mechanism specifically includes a friction gear drive mechanism and a friction soft belt, the friction gear drive mechanism includes an active drive mechanism and a passive drive mechanism, the active drive mechanism is provided with a driving gear, the passive drive mechanism is provided with a passive gear, and the active gear is powered by the power module to rotate, and the active gear is controlled by the mobile module to move as a whole; the power module and the mobile module realize the rotation and movement setting of the active drive mechanism, thereby realizing the gap setting of clamping working state and opening non-working state. The friction soft belt is used to clamp semiconductor particles, and the friction soft belt is driven by the active gear to rotate around the passive gear and the active gear, thereby driving the clamped semiconductor particles to move. A limiting groove is arranged at the moving position of the driving gear, and the limiting groove is an arc-shaped track to limit the moving position of the driving gear.

[0017] As a preference, the power module comprises a power motor, a power gear connected to the power motor, two synchronous gears arranged on the power gear, a direction gear meshing with the synchronous gear and transmitting at the same speed, the direction gear being connected to the driving gear through a connecting shaft; the two synchronous gears being meshing with the two direction gears respectively and transmitting in opposite directions; the moving module comprises a contact block arranged on the connecting shaft and a reset spring connected to the connecting shaft. The power module is to provide rotational power to the driving gear, mainly driven by the power motor to rotate the power gear, and transmit the power to two opposite directions through the meshing synchronous gear and the direction gear, thereby driving the two driving gears to rotate in the opposite direction, and the two driving gears drive the two driven gears to rotate in the opposite direction, thereby driving the friction soft belt to clamp the semiconductor particles. The moving module realizes the outward and inward movement of the driving gear by the contact block and the reset spring on the connecting shaft. When the two friction soft belts are in parallel positions, the semiconductor particles are directly contacted and clamped by the friction soft belts, and are driven to move to the bottom of the electromagnetic mounting mechanism together with the friction soft belt through the friction force of deformation and extrusion. When the two friction soft belts are in an eight-shaped state, the friction soft belts are in a stopped state, which is convenient for the mounting of the electromagnetic mounting mechanism. The contact block can rotate on the horizontal plane driven by the connecting shaft, and the reset spring can control the direction gear and the driving gear to reset.

[0018] Preferably, the electromagnetic mounting mechanism includes a mounting motor, a mounting head assembly and a linkage mechanism. The mounting motor is vertically arranged above the conveying end of the magnetic conveyor belt, the mounting head assembly is vertically connected to the output shaft of the mounting motor, the mounting head assembly moves up and down under the control of the mounting motor, and the linkage mechanism is connected and coordinated with the mounting head assembly. The electromagnetic mounting mechanism mainly includes a mounting motor and a mounting head assembly. The mounting head assembly can move up and down driven by the mounting motor, thereby realizing electromagnetic adsorption and mounting of semiconductor particles. In order to realize the linkage of clamping and mounting, and then realize the consistent transport and mounting rate of the regular cubic semiconductor particles in the whole mounting process, the cycle is repeated, and the fully automatic mounting is realized. Therefore, a linkage mechanism is also provided to realize that when the electromagnetic mounting mechanism is mounted, the particle clamping mechanism does not move, and when the electromagnetic mounting mechanism is mounted, the particle clamping mechanism moves. Such a setting realizes the coordinated linkage between the mechanisms and can effectively improve the work efficiency.

[0019] Preferably, the mounting head assembly includes a mounting head and an inverted trapezoidal head arranged at the lower end of the mounting head, an electromagnetic motor for controlling the power switch and the current is arranged inside the mounting head, an iron core is fixedly connected inside the trapezoidal head, an electric wire is wound around the iron core, and the electromagnetic motor forms an electromagnetic effect through the electric wire wound around the outer ring of the iron core; the linkage mechanism includes a moving block and a pull-down spring connected to the lower end of the moving block, a protrusion is arranged on the moving block, and a toggle block for toggling the protrusion is arranged on the mounting head corresponding to the protrusion, and the moving block contacts the particle clamping mechanism and drives the particle clamping mechanism to open or close. The mounting head assembly mainly includes a mounting head and a trapezoidal head, and the trapezoidal head is arranged to ensure that other already mounted semiconductor particles will not be affected during the mounting process, and to ensure that each mounting can be mounted according to the set position. An iron core with wires wound around it is arranged inside the trapezoidal head, and an electromagnetic motor is arranged inside the placement head. An electromagnetic effect is formed by the electromagnetic motor and the iron core with wires wound around it. When the electromagnetic motor is turned on, an electromagnetic field is generated, which adsorbs the nickel cover layer on the semiconductor particles, thereby realizing the movement and placement of the semiconductor particles. The linkage mechanism mainly includes a moving block with a protrusion, a pull-down spring that generates a downward pulling force on the moving block, and a toggle block is arranged on the mounting head corresponding to the protrusion on the moving block. When the mounting head moves upward to the position of the protrusion on the moving block, it abuts against the moving block, thereby driving the moving block to overcome the pulling force of the pull-down spring and move upward. The moving block contacts the particle clamping mechanism, specifically, contacts the contact block in the particle clamping mechanism. The shape of the moving block matches the abutment block. Since the contact block can rotate in a horizontal plane and the two contact blocks are symmetrically arranged front and back with the moving block as the center, when the front and rear contact blocks rotate horizontally, the moving block is disengaged from the contact block, so that it can move upward driven by the toggle block. At this time, the particle clamping mechanism is actuated, and the mounting head assembly and the moving block are above the friction soft belt, in a state to be mounted.

[0020] The beneficial effects of the present invention are as follows: the semiconductor particle mounting device realizes a fully automated design for the preparation, transportation and mounting of regular cubic semiconductor particles in an array. The device solves the cumbersome process of using a vacuum nozzle to adsorb from a tray to a target position on a substrate for mounting in the prior art, and directly transports semiconductor particles from a ballistic array conveying device, thereby reducing the equipment's transportation and movement process, improving mounting efficiency, reducing costs, being easy to operate, having high mounting quality, having a higher device integration, a smaller volume, and having stronger functional compactness. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is an enlarged view of a regular cubic semiconductor particle in the present invention;

[0022] Figure 2 It is a structural schematic diagram of a semiconductor particle mounting device of the present invention;

[0023] Figure 3 It is a partial cross-sectional view of the semiconductor particle mounting device of the present invention;

[0024] Figure 4 yes Figure 3 Schematic diagram of the AA friction drive mechanism in the stopped working state;

[0025] Figure 5 yes Figure 3 Schematic diagram of the AA friction drive mechanism in working state;

[0026] Figure 6 yes Figure 3 Schematic diagram of the middle BB active gear drive mechanism in a stopped working state;

[0027] Figure 7 yes Figure 3 Schematic diagram of the middle BB active gear drive mechanism in working state

[0028] In the figure: 100, a regular cubic semiconductor particle, 101, a nickel cap layer, 200, a substrate, 201, a target position; 300, a device body, 301, a conveying channel, 302, a preparation chamber, 303, a moving chamber, 304, a linkage chamber, 305, a power chamber;

[0029] 1. Vibration introduction device, 1-1. Vibration introduction device outlet;

[0030] 2. The whole conveying device, 21. The output end;

[0031] 3. Electromagnetic mounting mechanism;

[0032] 4. Feeding mechanism, 41. Feeding gear;

[0033] 5. Magnetic suction conveying mechanism, 51. Gear driving mechanism, 52. Complete gear array;

[0034] 6. Magnetic conveyor belt, 7. Alignment channel, 8. Flexible alignment component, 9. Particle clamping mechanism, 10. Electromagnetic placement mechanism, 11. Friction drive mechanism, 13. Friction soft belt, 14. Active drive mechanism, 15. Passive drive mechanism, 16. Active gear, 17. Power motor, 18. Power gear, 19. Synchronous gear, 20. Direction gear, 22. Coupling shaft, 23. Contact block, 24. Reset spring, 25. Passive gear, 26. Placement motor, 27. Placement head assembly, 28. Placement head, 29. Trapezoidal head, 30. Iron core, 31. Wire, 32. Electromagnetic motor, 33. Linkage mechanism, 34. Moving block, 35. Pull-down spring, 36. Bump, 37. Toggle block, 38. Placement tube, 39. Visual recognition module, 40. Limiting groove. DETAILED DESCRIPTION

[0035] The various aspects of the present invention are described in detail below through specific embodiments in conjunction with the accompanying drawings.

[0036] Embodiment 1:

[0037] exist Figure 1 , Figure 2 In the embodiment shown, Figure 1 As shown, the semiconductor particles in the present invention are regular cubic semiconductor particles 100, and nickel capping layers 101 are electroplated on two opposite surfaces of the semiconductor particles. A semiconductor particle mounting device is used to automatically mount regular cubic semiconductor particles 100 to a target position 201 of a substrate 200 of a semiconductor refrigeration sheet. The semiconductor particle mounting device includes an integrated device body 300. Figure 2 As shown, a semiconductor particle mounting device includes:

[0038] A vibration introduction device 1, used to implement vibration-type material introduction for regular cubic semiconductor particles;

[0039] The alignment conveying device 2 is connected to the outlet 1-1 of the vibration introduction device, and is used to arrange the nickel capping layer 101 on the regular cubic semiconductor particles 100 in a consistent direction and convey them in sequence after being aligned; the alignment conveying device 2 includes a feeding device and a flexible alignment arrangement mechanism, the feeding device includes a feeding mechanism 4 arranged at the outlet 1-1 of the vibration introduction device and a magnetic suction conveying mechanism 5 arranged below the outlet 1-1 of the vibration introduction device, the magnetic suction conveying mechanism 5 is provided with a magnetic suction conveying belt 6 and an alignment channel 7 that generate a magnetic attraction force on the nickel capping layer 101 of the semiconductor particles; the flexible alignment arrangement mechanism is provided with a flexible alignment component 8 that generates a flipping force on the semiconductor particles; under the action of the flipping force and the magnetic attraction force, the nickel capping layer 101 on the semiconductor particles is arranged in an upper and lower position and is arranged in an alignment and conveyed ballistically through the alignment channel;

[0040] The electromagnetic mounting mechanism 3 is arranged at the output end 21 of the entire array conveying device 2, and is used to realize the electromagnetic mounting of semiconductor particles; the electromagnetic mounting mechanism 3 includes a particle clamping mechanism 9 and an electromagnetic mounting mechanism 10 which are arranged in a linked manner.

[0041] The alignment conveying device 2 and the electromagnetic mounting mechanism 3 are integrated in the device body 300. The vibration introduction device 1, the alignment conveying device 2 and the electromagnetic mounting mechanism 3 form a complete device as a whole, thereby realizing full automation of loading, conveying and mounting.

[0042] The vibration introduction device 1 is used to realize the vibration transportation of cubic semiconductor particles, specifically including a feeding funnel 110, a vibration motor 112 driving the feeding funnel 110 to vibrate, a delivery pipe 111 connected to the feeding funnel 110, and a feeding hose 113 connected to the lower end of the delivery pipe 111; the caliber of the feeding hose 113 is set in accordance with the semiconductor particles and the semiconductor particles can pass through one by one. The feeding funnel 110 is connected with a vibration motor 112, which drives the feeding funnel 110 to vibrate, so that the cubic semiconductor particles in the feeding funnel 110 enter the delivery pipe 111 fixedly connected to the lower end of the feeding funnel one by one, thereby realizing the vibration introduction of the cubic semiconductor particles.

[0043] The whole-row conveying device 2 is arranged in a ballistic array module structure as a whole, and is connected to the vibration introduction device 1 through a feed hose 113. It is a device for arranging the nickel capping layer 101 on the regular cubic semiconductor particles in an upper and lower position, and conveying them in a whole-row ballistic manner in sequence; the regular cubic semiconductor particles enter the feed hose 113 from the conveying pipe 111 in sequence, and the regular cubic semiconductor particles entering the feed hose 113 are arranged in sequence, but the orientation of the nickel capping layer 101 on the semiconductor is inconsistent.

[0044] The row conveying device specifically includes a feeding device and a flexible row arrangement mechanism. The feeding device includes a feeding mechanism 4 and a magnetic suction conveying mechanism 5. The feeding mechanism 4 is symmetrically arranged at the lower end outlet of the feed hose 113. The width between the feeding mechanisms 4 is the width of the regular cube semiconductor particles. Specifically, it includes a feeding gear 41 and a gear power motor that drives the feeding gear to rotate. The feeding gear 41 is symmetrically arranged on the left and right sides of the outlet of the feed hose 113. The feeding gear 41 is in close contact with the left and right sides of the lower end outlet of the feed hose 113, and the rotation direction is opposite. When the feeding gear 41 rotates driven by the gear power motor, the regular cube semiconductor particles 100 are driven by the feeding gears 41 on both sides and fall into the magnetic suction conveying mechanism 5 from the outlet of the feed hose 113 in sequence. The feeding gear 41 can control the rotation speed so that the regular cube semiconductor particles 100 fall onto the magnetic suction conveying mechanism 5 in an orderly manner and at a certain time interval.

[0045] The magnetic conveying mechanism 5 is arranged inside the conveying channel 301 arranged in the device body 300. The magnetic conveying mechanism 5 includes a gear driving mechanism 51, a magnetic conveying belt 6 with magnetism and an alignment channel 7. The magnetic conveying belt 6 moves in a clockwise direction in the conveying channel 301 driven by the gear driving mechanism 51. The magnetic conveying belt 6 with magnetism is arranged directly below the outlet of the feed hose 113. The feeding gear 41 controls the rotation speed to make the cubic semiconductor particles fall onto the magnetic conveying belt 6 in an orderly manner and at a certain time interval. Because the magnetism of the magnetic conveying belt 6 and the nickel capping layer 101 on the cubic semiconductor particles will generate attraction, therefore, during the falling process, the nickel capping layer 101 of the cubic semiconductor particles will most likely fall onto the magnetic conveying belt 6 in an up-and-down direction. The magnetic conveying belt 6 moves driven by the gear driving mechanism 51, thereby driving the cubic semiconductor particles to move along the moving direction of the magnetic conveying belt 6. The gear drive mechanism 51 includes an array gear 52 and an array gear drive mechanism. The array gear 52 is driven to rotate by the array gear drive mechanism and drives the magnetic conveyor belt 6 to move; the array channel 7 includes an array inclined channel 71 and a ballistic array outlet 72 for allowing semiconductor particles to pass through in sequence.

[0046] The flexible alignment arrangement mechanism is arranged on the inner wall of the conveying channel 301 above the magnetic conveyor belt 6, and is in flexible contact with the cubic semiconductor particles during the movement of the cubic semiconductor particles, and can drive the cubic semiconductor particles that are not adsorbed by the magnetic conveyor belt 6 to flip. The flexible alignment component 8 is arranged above the magnetic conveyor belt 6, and the flexible alignment component 8 includes a number of flexible alignment soft hairs of different lengths that are in contact with the semiconductor particles and generate flipping friction. The specific flexible alignment component 8 is arranged on the inner wall of the conveying channel 301, and a soft hair flipping mechanism is formed above the magnetic conveyor belt 6. The flexible alignment soft hair is in contact with the cubic semiconductor particles on the magnetic conveyor belt, and flips the cubic semiconductor particles that are not facing up and down in the nickel cover layer 101 through contact friction. Through the combination of suction and friction, all the cubic semiconductor particles on the magnetic conveyor belt 6 are aligned into a state where the nickel cover layer is facing up and down, and then are transported sequentially.

[0047] The alignment channel 7 includes an inclined alignment channel 71 and an alignment outlet 72 with a reduced height that can only allow the regular cubic semiconductor particles to pass through in sequence. The gear drive mechanism 51 is arranged below the alignment outlet 72. The magnetic suction conveyor belt 6 is wound around the gear drive mechanism 51 and driven by the gear drive mechanism 51 to rotate clockwise around the gear drive mechanism 51 to form a horizontally movable magnetic suction conveyor belt. The alignment inclined channel 71 gradually shrinks as the regular cubic semiconductor particles on the magnetic suction conveyor belt 6 are neatly arranged to form a narrow alignment outlet 72.

[0048] The electromagnetic mounting mechanism 3 comprises a particle clamping mechanism 9 and an electromagnetic mounting mechanism 10 , and the particle clamping mechanism 9 and the electromagnetic mounting mechanism 10 are linked.

[0049] The particle clamping mechanism 9 includes a group of friction drive mechanisms 11 in a clamping structure arranged on both sides of the magnetic conveyor belt 6, which are used to clamp the regular cubic semiconductor particles on the magnetic conveyor belt 6 in sequence.

[0050] like Figure 3 As shown, the friction drive mechanism 11 is arranged inside the device body 300 in the same horizontal direction as the conveying channel 301, and is arranged horizontally. The friction drive mechanism 11 is symmetrically arranged at the end of the output end of the magnetic conveyor belt 6. The end of the friction drive mechanism 11 close to the magnetic conveyor belt 6 is the passive end, and the end away from the magnetic conveyor belt is the active end. The active end can rotate outward and inward relative to the passive end, so that the friction drive mechanism 11 on the front and rear sides is in an open and closed state. The friction drive mechanism 11 does not work, that is, when the friction drive mechanisms 11 on the front and rear sides are in the open state, the two active ends move in opposite directions away from each other, and the electromagnetic mounting mechanism 10 works. When the friction drive mechanisms 11 on the front and rear sides are in a parallel state, a friction clamping channel is formed between the friction drive mechanisms 11 on the front and rear sides. Since the friction drive mechanism 11 is in the driving state, the cubic semiconductor particles at the output end of the magnetic conveyor belt 6 are clamped from the magnetic conveyor belt 6 to between the friction drive mechanisms 11, and are clamped by friction and driven to move in the air along the passive ends of the two friction drive mechanisms toward the active ends. When it moves to the bottom of the electromagnetic mounting mechanism 10, the electromagnetic mounting mechanism 10 moves downward to adsorb the nickel cover layer 101 on the cubic semiconductor particles, and drives the adsorbed cubic semiconductor particles to move downward. At this time, the friction drive mechanism 11 is reset and is in the open state. The electromagnetic mounting mechanism 10 mounts the cubic semiconductor particles at the target position 201 on the substrate 200 directly below, achieving one-time mounting without the need for mounting after pallet transport.

[0051] like Figure 4 , Figure 5 As shown, the friction drive mechanism 11 includes a friction gear drive mechanism and a friction soft belt 13, the friction gear drive mechanism includes an active drive mechanism 14 and a passive drive mechanism 15, the active drive mechanism 14 includes a driving gear 16 and a driving gear rotating mechanism, and the driving gear drive mechanism includes a power module for providing power and a moving module for realizing movement; Figure 6 , Figure 7As shown, a power cavity 305 is provided on the device body 300, and the power module includes a power motor 17, a power gear 18 connected to the power motor, two synchronous gears 19 arranged on the power gear, and a direction gear 20 meshing with the synchronous gear and transmitting at the same speed, and the direction gear 20 is connected to the driving gear 16 through a connecting shaft 22; the two synchronous gears 19 are respectively meshed with the two direction gears 20 and the transmission directions are opposite; the moving module includes a contact block 23 arranged on the connecting shaft 22 and a return spring 24 press-connected with the connecting shaft 22. The power gear 18 is arranged inside the power cavity 305. The driving gear 16 is slidably arranged on the lower wall of the activity space of the friction soft belt 13, and a limiting groove 40 is arranged on the lower wall, and the limiting groove 40 is a circular arc track to limit the moving position of the driving gear 16.

[0052] The passive driving mechanism 15 comprises a passive gear 25 , and the friction soft belt 13 is wound around the active gear 16 and the passive gear 25 and is driven by the active gear 16 to rotate around the active gear 16 and the passive gear 25 .

[0053] The passive gear 25 is arranged on the left and right sides of the output end of the magnetic conveyor belt 6, and the distance between the passive gears 25 on the left and right sides is set in accordance with the width of the regular cube semiconductor particles. The power of the active gear 16 is provided by the power module. The friction soft belt 13 will move according to the movement of the active gear 16, and the movement of the active gear 16 is controlled by the moving module. Figure 5 As shown, when the friction soft belt 13 is in a parallel position, the regular cubic semiconductor particles are in direct contact with the friction soft belt 13 , and the regular cubic semiconductor particles are driven by the friction force of deformation and extrusion to move to the bottom of the electromagnetic mounting mechanism 10 .

[0054] A preparation cavity 302 is provided on the device body 300. The preparation cavity 302 is provided above the operating space of the friction soft belt 13. The electromagnetic placement mechanism 10 is arranged inside the preparation cavity 302 in an up-and-down movable manner. The electromagnetic placement mechanism 10 includes a placement motor 26 and a placement head assembly 27. The placement motor 26 is vertically arranged on the top of the preparation cavity 302. The placement head assembly 27 is vertically connected to the output shaft of the placement motor 26. The placement head assembly 27 can move up and down under the control of the placement motor 26.

[0055] The mounting head assembly 27 includes a mounting head 28 and an inverted trapezoidal trapezoidal head 29 arranged at the lower end of the mounting head. An iron core 30 is fixedly connected inside the trapezoidal head 29, and an electric wire 31 is wound around the iron core 30. An electromagnetic motor 32 is arranged inside the mounting head. The electromagnetic motor 32 can control the power switch and the current size. The electromagnetic motor 32 forms an electromagnetic effect through the electric wire 31 wound around the outer circle of the iron core 30.

[0056] The device also includes a linkage mechanism 33, which is disposed inside the device body 300 and is connected to the electromagnetic placement mechanism 10 and the friction drive mechanism 11, respectively, so as to achieve cooperative linkage between the electromagnetic placement mechanism 10 and the friction drive mechanism 11. Specifically, a moving cavity 303 is disposed on the side wall of the preparation cavity 302 above the friction soft belt 13, and the linkage mechanism 33 is disposed inside the moving cavity 303 and can move up and down along the moving cavity 303.

[0057] The linkage mechanism 33 includes a moving block 34 and a pull-down spring 35. The moving block 34 is slidably arranged inside the moving cavity 303, and the moving block 34 can move up and down along the moving cavity 303. One end of the pull-down spring 35 is fixed to the lower end of the moving block 34, and the other end is fixed to the bottom of the moving cavity 303. The upper end of the moving block 34 is fixedly connected with a protrusion 36 extending into the preparatory cavity.

[0058] A toggle block 37 facing the side of the protrusion is fixedly connected to the placement head 28. When the toggle block 37 moves to the position of the protrusion 36 during the upward movement of the placement head 28, the upper surface of the toggle block 37 will abut against the lower surface of the protrusion 36, thereby driving the protrusion 36 to move upward together, and then driving the moving block 34 connected to the protrusion to overcome the pulling force of the pull-down spring 35 to move upward together. When the placement head 28 moves to the top of the preparation cavity 302, that is, the upper limit position, the upper surface of the toggle block 37 will abut against the lower surface of the protrusion, and the upper surface of the protrusion 36 will abut against the upper cavity wall of the moving cavity 303, thereby limiting the movement of the moving block.

[0059] A linkage cavity 304 is provided in the side wall of the moving cavity 303. The contact block 23 on the connecting shaft 22 in the friction drive mechanism 11 is rotatably provided inside the linkage cavity 304 and the contact block 23 is symmetrically provided on both sides of the moving block 34 and contacts the moving block 34. The contact block 23 can rotate in a horizontal plane. The two contact blocks 23 are symmetrical in front and back with the moving block 34 as the symmetry center. When the contact end of the contact block 23 and the moving block 34 rotates horizontally, the two contact blocks 23 are fixed with the same center.

[0060] The mounting head assembly 27 is slidably disposed inside a mounting tube 38 and can extend outward along the mounting tube 38 for mounting. The mounting tube 38 is coaxially disposed with the preparation cavity 302. A visual recognition module 39 is fixedly connected to the outside of the lower end of the mounting tube 38. The visual recognition module 39 performs signal recognition on the mounting process and position, and feeds back visual information to the mounting device, thereby assisting the mounting device to operate, thereby ensuring the mounting position of the regular cubic semiconductor particles on the substrate 200, thereby realizing the mounting of regular cubic semiconductor particles on the entire substrate.

[0061] The semiconductor particle mounting device first pours P-type or N-type cubic semiconductor particles into a feeding funnel, and conveys them to a corresponding size of the array conveying device by means of rotation and vibration according to the size of the cubic semiconductor particles. As the size of the conveying channel decreases, the cubic semiconductor particles are arranged in a single row, but the direction of the nickel cover layer is inconsistent. The semiconductor particles are controlled by a feeding hose and an intermittent feeding gear 41 to fall onto a magnetic conveyor belt 6 in an orderly and spaced manner. The magnetic conveyor belt 6 rotates in a circle in the cavity, and the fine velvet array soft fur flipping mechanism above the magnetic conveyor belt 6 turns the cubic semiconductor particles whose nickel cover layer is not facing upward. The particles form resistance, generating a flipping force on the regular cubic semiconductor particles. At the same time, the magnetic conveyor belt generates an adsorption force on the nickel cover layer. Under the action of the double force, the nickel cover surface on the regular cubic semiconductor particles flips toward the magnetic conveyor belt until the regular cubic semiconductor particles flip and the nickel cover layer is set upside down. Then, the particles are transported to the output port of the magnetic conveyor belt, i.e., the electromagnetic mounting port, by adjusting the current to adjust the suction force and control the power on and off. Then, the square semiconductor particles are mounted through camera recognition and positioning. During the process, the transportation and mounting rates of the regular cubic semiconductor particles are consistent and repeated cyclically. Similarly, for semiconductor particles of different shapes and sizes, different sizes of pipes and transport ports can be used.

[0062] Specifically, a plurality of different sizes of feeding funnels 110 can be provided to match regular cubic semiconductor particles of various sizes, such as Figure 2As shown, the cut cubic semiconductor particles are poured into the corresponding feeding funnel 110, and the vibration motor 112 controls the feeding funnel to vibrate. The cubic semiconductor particles in the feeding funnel will fall into the tiny delivery tube 111. The size of the delivery tube 111 is close to the size of the cubic semiconductor particles, so that the cubic semiconductor particles are arranged and stacked one by one during continuous vibration. After passing through the feeding pipe 111, the cubic semiconductor particles continue to enter the soft feeding hose 113, and are controlled by the feeding gear 41 at the end of the feeding hose 113. The rotation speed of the feeding gear 41 can control the gap for the cubic semiconductor particles to fall. The cubic semiconductor particles fall from the feeding hose 113 onto the magnetic conveyor belt 6, and the magnetic conveyor belt 6 is driven to rotate clockwise due to the clockwise rotation of the entire row of gears 52, thereby realizing the horizontal movement of the magnetic conveyor belt 6. The nickel cover layers 101 above and below the cubic semiconductor particles will be attracted by the magnetic conveyor belt 6 due to the suction force of the magnetic conveyor belt 6, so that most of the cubic semiconductors will be adsorbed on the magnetic conveyor belt 6 with their nickel cover layers facing up and down after falling, and a small number of cubic semiconductor particles will be in an irregular direction. In a fixed state, as the magnetic conveyor belt 6 moves, the cubic semiconductor particles move clockwise to the right along with the magnetic conveyor belt 6. During the movement, the flexible soft hairs above the magnetic conveyor belt 6 generate a flipping force on the cubic semiconductor particles, so that the cubic semiconductor particles that are not adsorbed by the magnetic conveyor belt are in an unstable state. At this time, due to the combined effect of the flipping force and the magnetic attraction force, the nickel cover layer of the cubic semiconductor particles in the unstable state will tend to a stable state due to the attraction of the magnetic strip. Finally, all the cubic semiconductor particles can be flipped at the end of the magnetic conveyor belt 6 to have the nickel cover layer facing up and down, and are stacked in sequence at the output end of the magnetic conveyor belt and the front end of the friction soft belt 13, and are in a state to be clamped and mounted.

[0063] During the mounting process, the mounting motor 26 can control the mounting head 28 to move up and down along the preparation cavity 302 and extend out of the mounting tube 38, such as Figure 3 As shown, before placement, the placement head 28 is controlled by the placement motor 26 to rise to the top of the preparation cavity 302 and is in a state of waiting for placement. Before the placement head 28 moves downward, the friction soft belt 13 will move the cubic semiconductor particles to the bottom of the trapezoidal head 29 at the lower end of the placement head (see Figure 5), at this time, the electromagnetic motor 32 is energized, so that the lower end of the iron core 30 generates suction, and the upper end of the nickel cap layer 101 of the regular cubic semiconductor particles is adsorbed and tightly attached to the lower surface of the trapezoidal head 29, followed by the placement motor 26 controlling the placement head 28 to move downward. During the downward movement of the placement head 28, the toggle block 37 moves with the placement head 28. When the protrusion 36 set on the placement head is separated from the toggle block 37, the upper surface of the toggle block 37 and the lower surface of the protrusion 36 are no longer against each other, and the protrusion 36 and the moving block 34 connected thereto lose support. Under the pull-down spring 35, the Under the action of the rebound force, the moving block moves downward to the lower limit position of the moving cavity. In the process of the moving block 34 moving downward, due to the outer dimensions of the moving block 34 matching the front and rear contact blocks 23 against which it abuts, the front and rear contact blocks 23 move under the drive of the moving block 34, thereby driving the direction gear 20 and the driving gear 16 to move to a position away from the axis of the moving block 34, and presenting an open state. At this time, the direction gear 20 and the driving gear 16 lose power, the friction soft belt 13 stops moving, and the front and rear sets of friction soft belts 13 are in an eight-shaped open state (see Figure 4 ), after the friction soft belt 13 rotates, the passive gear 25 limits the movement of the cubic semiconductor particles at the front end of the friction soft belt 13. With the assistance of the visual recognition module 39, the placement head 28 moves downward to the coordinate height and position, and the cubic semiconductor particles are fixed on the substrate 200. At this time, the electromagnetic motor 32 is powered off, and the trapezoidal head 29 loses the suction force with the cubic semiconductor particles, completing the placement of the cubic semiconductor particles.

[0064] When the placement is completed and the placement head 28 moves upward, the upper surface of the toggle block 37 abuts against the lower surface of the protrusion 36 during the upward movement of the placement head 28, driving the protrusion and the moving block to move upward to the upper limit position. At this time, due to the return of the moving block 34, the contact block 23 also returns to the initial position due to the rebound force of the reset spring 24, and the front and rear direction gears 20 and the synchronous gear 19 are meshed. In this process, the power motor 17 provides power to control the rotation of the power gear 18, and the rotation of the power gear 18 drives the synchronous gear 19 to rotate. The synchronous gear 19 rotates after meshing with the direction gear 20, and the rotation directions of the front and rear direction gears are opposite. Then, the front and rear direction gears respectively drive the driving gear 16 to rotate through the connecting shaft 22, and the driving gear 16 drives the friction soft belt 13 to rotate clockwise. The friction soft belt 13 drives the regular cubic semiconductor particles at its front end to move to the bottom of the placement head 28 due to the friction force. This reciprocating cycle realizes fully automatic placement, which is convenient and fast to operate, efficient, and accurate.

[0065] The semiconductor particle mounting device replaces the conventional TARY for semiconductor particle preparation and mounting, solves the problems of complex and time-consuming mounting operations, and provides a fully automated design for the preparation, transportation, and mounting of regular cubic semiconductor particles. It solves the cumbersome process of using a vacuum nozzle to adsorb from the tray to the target position (substrate) for mounting in the prior art, and directly transports semiconductor particles in a ballistic manner, reducing the equipment's transfer and movement process and improving mounting efficiency. Electromagnetic adsorption is used to replace the vacuum nozzle, and the ultra-micro vacuum nozzle with high process cost is replaced by a low-cost method. The mounting is combined with the characteristics of semiconductor particles, which is easy to operate, improves mounting quality, and improves mounting efficiency. The space of the mounting device is optimized, and the device is more integrated, smaller in size, and more functionally compact.

[0066] The contents described in the embodiments of this specification are merely an enumeration of the implementation forms of the inventive concept. The protection scope of the inventive type should not be regarded as limited to the specific forms described in the embodiments. The protection scope of the inventive type also extends to the equivalent technical means that can be thought of by those skilled in the art based on the inventive type concept.

Claims

1. A semiconductor particle mounting device, characterized in that include: A vibration introduction device (1), used to implement vibration-type introduction of semiconductor particles; An alignment conveying device (2) is connected to the outlet of the vibration introduction device and is used to arrange the nickel cover layers on the semiconductor particles in a consistent direction and to convey them in sequence after being aligned; the alignment conveying device (2) comprises a feeding device and a flexible alignment arrangement mechanism, the feeding device comprises a feeding mechanism (4) arranged at the outlet of the vibration introduction device and a magnetic suction conveying mechanism (5) arranged below the outlet of the vibration introduction device, the magnetic suction conveying mechanism (5) is provided with a magnetic suction conveying belt (6) and an alignment channel (7) for generating a magnetic attraction force on the nickel cover layers of the semiconductor particles; the flexible alignment arrangement mechanism is provided with a flexible alignment component (8) for generating a flipping force on the semiconductor particles; under the action of the flipping force and the magnetic attraction force, the nickel cover layers on the semiconductor particles are arranged in an upper and lower position and are arranged and conveyed in an aligned manner; An electromagnetic mounting mechanism (3) is arranged at the output end of the entire array conveying device (2) and is used to realize electromagnetic mounting of semiconductor particles; the electromagnetic mounting mechanism (3) comprises a particle clamping mechanism (9) and an electromagnetic mounting mechanism (10) which are arranged in a linked manner; The particle clamping mechanism (9) comprises a group of friction drive mechanisms (11) arranged in a clamping structure on both sides of the output end of the magnetic conveyor belt (6), and a friction clamping channel is formed between the friction drive mechanisms (11) on both sides; the friction drive mechanism (11) comprises an active end and a passive end, the passive end is arranged at one end of the magnetic conveyor belt (6), the active end is arranged away from the magnetic conveyor belt (6), and the active end rotates outwardly and inwardly relative to the passive end.

2. The semiconductor particle mounting device according to claim 1, characterized in that: The vibration introduction device (1) comprises a feed hopper (110), a vibration motor (112) for driving the feed hopper to vibrate, a feed pipe (111) connected to the feed hopper, and a feed hose (113) connected to the lower end of the feed pipe; the caliber of the feed hose (113) is set to match the semiconductor particles so that the semiconductor particles can pass through one by one.

3. The semiconductor particle mounting device according to claim 1, characterized in that: The feeding mechanism (4) is symmetrically provided with two sets of feeding gears (41), the rotation directions of the two sets of feeding gears (41) are opposite, the spacing between the tangent lines of the two sets of feeding gears in the rotation directions matches the width of the semiconductor particles, and the semiconductor particles are driven to pass through by the reverse rotation force; the feeding gears (41) are driven to rotate by the gear power motor, and the rotation speed is controlled so that the semiconductor particles fall onto the magnetic suction conveyor belt (6) in an orderly manner and at a certain time interval.

4. The semiconductor particle mounting device according to claim 1, characterized in that: The magnetic suction conveying mechanism (5) further comprises a gear driving mechanism (51), wherein the gear driving mechanism (51) comprises an array of gears (52) and an array of gear driving mechanisms, wherein the array of gears (52) is driven to rotate by the array of gear driving mechanisms and drives the magnetic suction conveying belt (6) to move; and the array of channels (7) comprises an array of inclined channels (71) and an array of outlets (72) for allowing semiconductor particles to pass through in sequence.

5. The semiconductor particle mounting device according to claim 1, characterized in that: The flexible alignment component (8) is arranged above the magnetic conveyor belt (6), and the flexible alignment component (8) comprises a plurality of flexible alignment bristles of varying lengths that are in contact with the semiconductor particles and generate a turning friction force.

6. The semiconductor particle mounting device according to claim 1, characterized in that: The friction drive mechanism (11) comprises a friction gear drive mechanism and a friction soft belt (13), the friction gear drive mechanism comprises an active drive mechanism (14) and a passive drive mechanism (15), the active drive mechanism (14) comprises a driving gear (16) and a driving gear drive mechanism; the driving gear drive mechanism comprises a power module for providing power and a moving module for achieving movement; the passive drive mechanism (15) comprises a passive gear (25), the friction soft belt (13) is wound around the driving gear (16) and the passive gear (25), and is driven by the driving gear to rotate around the driving gear and the passive gear.

7. The semiconductor particle mounting device according to claim 6, characterized in that: The power module comprises a power motor (17), a power gear (18) connected to the power motor, two synchronous gears (19) arranged on the power gear, and a direction gear (20) meshing with the synchronous gear and transmitting at the same speed, wherein the direction gear (20) is connected to the driving gear (16) via a connecting shaft (22); the two synchronous gears (19) respectively mesh with the two direction gears (20) and transmit in opposite directions; and the moving module comprises a contact block (23) arranged on the connecting shaft (22) and a return spring (24) press-connected to the connecting shaft (22).

8. The semiconductor particle mounting device according to any one of claims 1 to 5, characterized in that: The electromagnetic placement mechanism (10) comprises a placement motor (26) and a placement head assembly (27), wherein the placement motor (26) is vertically arranged above the conveying end of the magnetic conveyor belt (6), and the placement head assembly (27) is vertically connected to the output shaft of the placement motor (26), and the placement head assembly (27) moves up and down under the control of the placement motor (26); and further comprises a linkage mechanism (33), wherein the linkage mechanism (33) is connected and cooperated with the placement head assembly (27) and is connected to the particle clamping mechanism (9) to realize linkage.

9. The semiconductor particle mounting device according to claim 8, characterized in that: The placement head assembly (27) comprises a placement head (28) and an inverted trapezoidal head (29) arranged at the lower end of the placement head. An electromagnetic motor (32) for controlling a power switch and a current is arranged inside the placement head (28). An iron core (30) is fixedly connected inside the trapezoidal head (29). An electric wire (31) is wound around the iron core (30). The electromagnetic motor (32) forms an electromagnetic effect through the electric wire wound around the outer ring of the iron core. The linkage mechanism (33) comprises a moving block (34) and a pull-down spring (35) connected to the lower end of the moving block. A protrusion (36) is arranged on the moving block (34). A toggle block (37) for toggling the protrusion is arranged on the placement head (28) corresponding to the protrusion (36). The moving block (34) contacts the particle clamping mechanism (9) and drives the particle clamping mechanism (9) to perform an opening or closing action.

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