Chip soldering detection method, device and related equipment

Abstract

The application discloses a chip welding detection method and device and related equipment, and relates to the technical field of electronic chips. The method is applied to an electronic device and comprises the following steps: obtaining the measured impedance values of welding points between a chip of a workpiece to be detected and a printed circuit board, wherein the measured impedance value is the impedance value between a metal electrode of a sensing unit and a welding point under the condition that the sensing unit is pressed on the chip of the workpiece to be detected; determining the detection results of the welding points according to the measured impedance values of the welding points and a preset impedance value range, wherein the detection result indicates that the welding point has a welding defect when the measured impedance value exceeds the preset impedance value range; and the detection result indicates that the welding point does not have a welding defect when the measured impedance value is within the preset impedance value range. According to the embodiment of the application, the welding quality between the chip and the printed circuit board can be detected without damaging the chip and the printed circuit board of the workpiece to be detected.

Description

Technical Field

[0001] The present application belongs to the field of electronic chip technology, and in particular relates to a chip welding detection method, device and related equipment. Background Art

[0002] With the development of automotive electronics, electronic products are continuously moving towards higher density, miniaturization, and enhanced functionality. After several generations of upgrades, the Ball Grid Array (BGA), a high-density chip packaging technology, has become widely used in the production of high-speed, complex computing chips. This technology allows for the fabrication of arrays of solder balls on the bottom of the package substrate, serving as the I / O terminals for interconnection with printed circuit boards (PCBs).

[0003] To ensure the process quality of chip production, it is also necessary to inspect the chip welding quality. However, existing chip welding analysis methods, although they can locate and analyze the poor welding points of the chip, will cause irreversible damage to the chip. Summary of the Invention

[0004] The embodiments of the present application provide a chip welding detection method, device and related equipment, which can realize the welding quality detection between the chip and the printed circuit board without damaging the chip and printed circuit board of the workpiece to be detected.

[0005] In a first aspect, an embodiment of the present application provides a chip welding detection method, which is applied to electronic equipment, and the method includes:

[0006] Obtaining a measured impedance value of each soldering point between a chip of the workpiece to be inspected and a printed circuit board, wherein the measured impedance value is: an impedance value between a metal electrode of the sensing unit and the soldering point when the sensing unit is pressed against the chip of the workpiece to be inspected;

[0007] Determine the detection result of each welding point according to the measured impedance value of each welding point and the preset impedance value range,

[0008] Wherein, when the measured impedance value exceeds the preset impedance value range, the detection result indicates that there is a welding defect at the welding point;

[0009] When the measured impedance value is within the preset impedance value range, the detection result indicates that there is no welding defect at the welding point.

[0010] In a second aspect, an embodiment of the present application provides a chip welding detection device, which is applied to electronic equipment, and the device includes:

[0011] a first acquisition module, configured to acquire a measured impedance value of each soldering point between a chip of a workpiece to be inspected and a printed circuit board, wherein the measured impedance value is an impedance value between a metal electrode of the sensing unit and the soldering point when the sensing unit is pressed against the chip of the workpiece to be inspected;

[0012] The first determining module is configured to determine the detection result of each welding point according to the measured impedance value of each welding point and a preset impedance value range.

[0013] Wherein, when the measured impedance value exceeds the preset impedance value range, the detection result indicates that there is a welding defect at the welding point;

[0014] When the measured impedance value is within the preset impedance value range, the detection result indicates that there is no welding defect at the welding point.

[0015] In a third aspect, an embodiment of the present application provides a chip welding detection system, the system comprising:

[0016] A sensing unit, wherein a metal electrode is provided on one side of the sensing unit;

[0017] a signal acquisition module, the signal acquisition module being electrically connected to the sensing unit, and being configured to acquire a measured impedance value between the metal electrode and a welding point, the welding point being located between the chip of the workpiece to be inspected and the printed circuit board, when the sensing unit is disposed on a side of the chip of the workpiece to be inspected that is away from the printed circuit board;

[0018] A host computer is electrically connected to the signal acquisition module and is used to obtain the measured impedance value of each welding point between the chip of the workpiece to be inspected and the printed circuit board, the measured impedance value being: the impedance value between the metal electrode of the sensing unit and the welding point when the sensing unit is pressed on the chip of the workpiece to be inspected; and a detection result of each welding point is determined based on the measured impedance value of each welding point and a preset impedance value range, wherein, when the measured impedance value exceeds the preset impedance value range, the detection result indicates that the welding point has a welding defect; when the measured impedance value is within the preset impedance value range, the detection result indicates that the welding point does not have a welding defect.

[0019] In a fourth aspect, an embodiment of the present application provides an electronic device, comprising: a processor and a memory storing computer program instructions; when the processor executes the computer program instructions, the chip welding detection method as described in any one of the above items is implemented.

[0020] In a fifth aspect, an embodiment of the present application provides a computer-readable storage medium, on which computer program instructions are stored. When the computer program instructions are executed by a processor, the chip welding detection method as described in any one of the above items is implemented.

[0021] In a sixth aspect, an embodiment of the present application provides a computer program product. When the instructions in the computer program product are executed by a processor of an electronic device, the electronic device executes the chip welding detection method as described in any one of the above.

[0022] The chip welding detection method, device and related equipment of the embodiment of the present application are applied to electronic equipment to obtain the measured impedance value of each welding point between the chip of the workpiece to be inspected and the printed circuit board, and compare the measured impedance value of each welding point with the preset impedance value range to determine the detection result of whether each welding point has a welding defect. In this way, in the embodiment of the present application, when the sensing unit is pressed on the chip, a certain impedance can be generated in the detection area formed between the metal electrode and the welding point. By measuring the impedance value of each welding point between the chip of the workpiece to be inspected and the printed circuit board, it is analyzed whether there is a defect in the welding between the chip and the printed circuit board. Because the observed value is an electrical signal, it is not necessary to damage the chip and the printed circuit board of the workpiece to be inspected to achieve the welding quality detection between the chip and the printed circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0024] Figure 1 This is a chip welding 3D X-ray detection result diagram provided in an embodiment of the present application;

[0025] Figure 2 This is a diagram showing the chip welding red ink experiment results provided in an embodiment of the present application;

[0026] Figure 3 Schematic diagram of the structure of the chip welding detection system provided in the embodiment of the present application;

[0027] Figure 4 Schematic diagram of the chip welding detection method provided in the embodiment of the present application;

[0028] Figure 5 Schematic diagram of the chip welding detection method provided in the embodiment of the present application;

[0029] Figure 6 Schematic diagram of the structure of the chip welding detection device provided in an embodiment of the present application;

[0030] Figure 7 It is a structural diagram of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0031] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present application by illustrating the examples of the present application.

[0032] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, the elements defined by the phrase "comprising..." do not exclude the presence of other identical elements in the process, method, article, or device comprising the elements.

[0033] With the advancement of automotive electronics, electronic products are continuously moving towards higher density, miniaturization, and enhanced functionality. After several generations of upgrades, Ball Grid Array (BGA), a high-density chip packaging technology, has become widely used in the production of high-speed, complex computing chips. Therefore, identifying BGA chip solder defects is crucial to ensuring the quality of BGA surface mount technology. Inspection methods commonly used include electrical testing, boundary scan, and X-ray inspection.

[0034] Traditional electrical testing scans for opens and shorts. Boundary scan technology relies on inspection ports designed for boundary scan, allowing access to every solder joint on the connector, thereby detecting opens and shorts on components. Although boundary scan can detect a wider range of invisible solder joints than electrical testing, both methods only test electrical performance, not solder quality. To ensure and improve production process quality, solder quality inspection requires 3D X-ray inspection equipment. 3D X-ray inspection effectively resolves these issues, providing real-time imaging, automated software analysis and judgment, and data storage and recording, ensuring quality control during production and providing real-time data feedback.

[0035] However, 3D X-ray cannot detect soldering defects caused by solder rejection on PCB pads, such as Figure 1 As shown. This welding defect cannot be identified by 3D X-ray inspection, and the result is all passed. The red ink test can be used to locate and analyze it. The solder joints where the welding is abnormal will be dyed with ink. The solder joints shown in the circle are the cold solder joints. Figure 2 However, the red ink test is a destructive test that can cause irreversible damage to the PCB and chip. Furthermore, the red ink test takes a very long time to detect, making it unsuitable for efficiently intercepting defective solder products on the production line. Therefore, an efficient and non-destructive online solder inspection method for BGA packaged chips is urgently needed.

[0036] In order to solve the problems in the prior art, the embodiments of the present application provide a chip welding detection method, apparatus and related equipment. The following first introduces the chip welding detection system provided by the embodiments of the present application.

[0037] Figure 3 The figure shows an architecture diagram of a chip welding detection system applicable to an embodiment of the present application.

[0038] like Figure 3 As shown, the chip welding detection system 300 may include:

[0039] A sensing unit 310, with a metal electrode 311 provided on one side of the sensing unit 310;

[0040] A signal acquisition module 320 is electrically connected to the sensing unit 310. When the sensing unit 310 is located on a side of the chip of the workpiece to be inspected that is away from the printed circuit board, the signal acquisition module 320 is configured to acquire a measured impedance value between the metal electrode 311 and a welding point located between the chip of the workpiece to be inspected and the printed circuit board.

[0041] The host computer 330 is electrically connected to the signal acquisition module 320 and is used to obtain the measured impedance value of each welding point between the chip of the workpiece to be inspected and the printed circuit board, where the measured impedance value is: the impedance value between the metal electrode of the sensing unit and the welding point when the sensing unit is pressed on the chip of the workpiece to be inspected; the inspection result of each welding point is determined based on the measured impedance value of each welding point and the preset impedance value range, wherein when the measured impedance value exceeds the preset impedance value range, the inspection result indicates that the welding point has a welding defect; when the measured impedance value is within the preset impedance value range, the inspection result indicates that the welding point does not have a welding defect.

[0042] The chip can be specifically a BGA chip, which consists of a core strip, a base layer, and an external package. The solder balls under the base layer serve as the I / O terminals of the circuit and can be interconnected with a printed circuit board via solder. Of course, the chip is not limited to BGA chips; any chip that can be interconnected with a printed circuit board via solder balls can be used, and this embodiment of the application is not limited here.

[0043] The size and position of the metal electrodes of the above-mentioned sensing unit are set in a one-to-one correspondence with the size and position of the solder balls of the workpiece to be measured, and remain consistent.

[0044] The printed circuit board (PCB), also known as a printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connections between electronic components.

[0045] When the sensing unit is pressed on the BGA chip, a certain impedance will be generated in the detection area formed between the metal electrode and the welding point. This impedance value can be collected by an external signal acquisition module and uploaded to the host computer for analysis to obtain the chip welding detection result.

[0046] In some embodiments, there are N welding points between the chip of the workpiece to be detected and the printed circuit board, and N metal electrodes 311 are provided on one side of the sensing unit 310 , where N is an integer greater than 1.

[0047] The signal acquisition module 320 is used to collect the measured impedance values ​​of N welding points when the sensing unit 311 is arranged on the side of the chip of the workpiece to be detected away from the printed circuit board and the N metal electrodes 311 are arranged in a one-to-one correspondence with the N welding points.

[0048] Figure 4 The flow chart of the chip welding detection method provided by an embodiment of the present application is shown. Figure 3 The chip bonding inspection system shown.

[0049] like Figure 4 As shown, a chip welding detection method is applied to electronic equipment and may include the following steps S401 to S402.

[0050] S401 : Obtaining the measured impedance value of each welding point between the chip of the workpiece to be inspected and the printed circuit board.

[0051] S402 : Determine the detection result of each welding point according to the measured impedance value of each welding point and the preset impedance value range.

[0052] In the embodiment of the present application, the measured impedance value of each welding point between the chip of the workpiece to be inspected and the printed circuit board is obtained, and the measured impedance value of each welding point is compared with a preset impedance value range to determine the detection result of whether each welding point has a welding defect. In this way, in the embodiment of the present application, when the sensing unit is pressed on the chip, a certain impedance can be generated in the detection area formed between the metal electrode and the welding point. By measuring the impedance value of each welding point between the chip of the workpiece to be inspected and the printed circuit board, it is analyzed whether there is a defect in the welding between the chip and the printed circuit board. Because the observed impedance value is an electrical signal, it is not necessary to damage the chip of the workpiece to be inspected and the printed circuit board to achieve the welding quality detection between the chip and the printed circuit board.

[0053] In S401 , the measured impedance value is: the impedance value between the metal electrode of the sensing unit and the welding point when the sensing unit is pressed on the chip of the workpiece to be detected.

[0054] For example, the chip welding detection method is based on the impedance value to analyze the welding situation, and the corresponding calculation formula (1) is as follows:

[0055] Z=R 2 +(XL-XC) 2 (1)

[0056] Where Z is the measured impedance value from the solder joint to the metal electrode on the top of the chip, R is the equivalent resistance value from the solder joint to the metal electrode on the top of the chip, XL is the equivalent inductance value from the solder joint to the metal electrode on the top of the chip, and XC is the equivalent capacitance value from the solder joint to the metal electrode on the top of the chip.

[0057] In some embodiments, there are N welding points between the chip of the workpiece to be detected and the printed circuit board, and N metal electrodes are provided on one side of the sensing unit, where N is an integer greater than 1;

[0058] The above S401 may specifically include:

[0059] When the sensing unit is arranged on a side of the chip of the workpiece to be detected away from the printed circuit board, and N metal electrodes are arranged in a one-to-one correspondence with N welding points, measured impedance values ​​of the N welding points are obtained.

[0060] In this embodiment, N metal electrodes are provided in one-to-one correspondence with N welding points, and the measured impedance values ​​of the N welding points can be obtained simultaneously, thereby improving the welding inspection efficiency of multiple welding points between the chip of the workpiece to be inspected and the printed circuit board.

[0061] In S402 , when the measured impedance value exceeds the preset impedance value range, the detection result indicates that there is a welding defect at the welding point.

[0062] When the measured impedance value is within the preset impedance value range, the detection result indicates that there is no welding defect at the welding point.

[0063] After the chip is soldered to the PCB, the impedance value of the detection area between the soldering point and the metal electrode on the top of the chip is detected. The impedance value is used to analyze whether there are defects in the soldering of the workpiece to be inspected.

[0064] As an implementation of the present application, in order to obtain an accurate preset impedance value range, before the above S402, the following steps may be further included:

[0065] Obtaining measured impedance values ​​of each soldering point between a chip and a printed circuit board of at least one standard workpiece;

[0066] The measured impedance values ​​of each soldering point between the chip of the standard workpiece and the printed circuit board are converged to obtain a preset impedance value range.

[0067] The above-mentioned standard workpiece is a workpiece in which the inspection results of each welding point indicate that there are no welding defects at the welding point.

[0068] For example, the bare PCB needs to be calibrated first, such as Figure 5 As shown in the figure, the chip soldering inspection system performs the first inspection on an empty pad on a PCB. Pad A1 corresponding to the BGA chip on the PCB serves as the positive electrode, while point TP1, where the pad leads to the PCB trace, serves as the negative electrode. The measured impedance value Z1 is obtained. This operation is primarily intended to eliminate interference from parasitic parameters of the PCB and pad itself.

[0069] After PCB bare board calibration is complete, a secondary impedance calibration of the standard workpiece is required. Standard workpieces are samples produced in small batches, such as batches of 10-15. These samples, which have passed functional testing and have been verified as having no soldering issues using methods such as X-rays or red ink, are considered standard workpieces. Once a sample is identified as a standard workpiece, its test impedance value can be considered the measured impedance value of the standard workpiece.

[0070] The specific operation process can be as follows: After obtaining a small batch of sample parts, the chip soldering inspection system described above is used to obtain the corresponding measured impedance value Z2. Verification methods such as X-rays and red ink are then used to verify that the soldering is flawless. The measured impedance value Z2 then serves as the trusted calibration data for the soldering impedance value of this type of sample. The same inspection pattern is repeated for multiple samples to obtain multiple measured impedance values ​​Z2. The measured impedance value Z of each solder joint between the chip and the PCB of the standard workpiece is then calculated as Z2 - Z1. The measured impedance values ​​of a large number of standard workpieces are collected and converged to obtain a convergence result. This convergence result is a range, specifically the maximum and minimum measured impedance values ​​of the batch of certified standard workpieces, expressed as (Rmin, Rmax). The larger the number of test batches, the more accurate the convergence of the range, but the higher the cost. Therefore, 10-15 samples are typically selected, but this number is not limited and can also be used. The measured impedance value can be verified with the calculated result obtained from formula (1). However, in reality, since the accurate process parameters of the chip cannot be obtained, the calculated result can only be compared with the measured result in terms of trend. Therefore, it is mainly necessary to conduct learning convergence through a large amount of measured data to obtain the corresponding result (i.e., the preset impedance value range).

[0071] In this embodiment, by converging the measured impedance value of the standard workpiece, the preset impedance value range is accurately obtained, thereby improving the accuracy of the chip welding detection result.

[0072] As another implementation of the present application, in order to accurately analyze welding defects of a workpiece to be inspected, there are N welding points between the chip of the workpiece to be inspected and the printed circuit board, where N is an integer greater than 1. After the above S402, the following steps may be further included:

[0073] If at least one detection result among the detection results of the N welding points indicates that the welding point has a welding defect, determining that the workpiece to be inspected is a defective workpiece;

[0074] According to the measured impedance value of each welding point in the defective workpiece, the defect cause of each welding point is determined in the relationship between the preset impedance value and the defect cause.

[0075] The causes of the above defects include: patch misalignment, loose soldering, open circuits, bridges, short circuits and solder cavities.

[0076] Due to different welding defect situations, the measured impedance values ​​of corresponding welding points will be different. By statistically analyzing the measured impedance values ​​of multiple historical welding points and the defect causes of each historical welding point, the relationship between the preset impedance value and the defect cause can be obtained.

[0077] The preset relationship between impedance values ​​and defect causes can be constructed based on the measured impedance values ​​of multiple historical welds and the defect causes of each weld. Alternatively, a defect cause analysis model can be obtained by performing machine learning on the measured impedance values ​​of multiple historical welds and the defect causes of each weld. The defect cause analysis model includes the preset relationship between impedance values ​​and defect causes.

[0078] Determining the defect cause of each weld point based on the measured impedance value of each weld point in the defective workpiece and the relationship between the predetermined impedance value and the defect cause may involve searching a predetermined database for the defect cause corresponding to the measured impedance value of each weld point, wherein the predetermined database records the relationship between the predetermined impedance value and the defect cause. Alternatively, the measured impedance value of each weld point may be input into a defect cause analysis model to obtain the defect cause corresponding to the measured impedance value of each weld point, wherein the defect cause analysis model is obtained through machine learning training based on the measured impedance values ​​of multiple historical weld points and the defect causes of each historical weld point.

[0079] In addition, when the inspection results of the N welding points all indicate that there are no welding defects in the welding points, it can be determined that the workpiece to be inspected is a standard workpiece.

[0080] In this embodiment, defective workpieces are identified based on the inspection results of N welding points, and the defect cause of each welding point in the defective workpiece is accurately analyzed based on the relationship between the preset impedance value and the defect cause.

[0081] In some embodiments, before determining the defect cause of each weld point based on the measured impedance value of each weld point in the defective workpiece and the relationship between the preset impedance value and the defect cause, the following steps may be further included:

[0082] Obtain measured impedance values ​​of multiple historical welding points;

[0083] Obtain the defect causes of each historical welding point;

[0084] Based on the measured impedance values ​​of multiple historical solder joints and the defect causes of each historical solder joint, a relationship between the impedance values ​​and the defect causes is constructed.

[0085] The above-mentioned historical welding points are welding points where historical inspection results indicate that welding defects exist.

[0086] The measured impedance values ​​of the above-mentioned multiple historical welding points can be obtained by the above-mentioned chip welding detection system.

[0087] The defect causes of the above-mentioned historical solder joints can be obtained by performing 3D X-ray inspection and red ink testing on the defective chips identified and confirmed by the above-mentioned chip solder joint inspection system, and obtaining and recording the defect cause of at least one solder joint.

[0088] In this embodiment, by measuring the impedance values ​​of multiple historical welding points and the defect causes of each historical welding point, a mapping relationship between each impedance value and the corresponding defect cause is constructed to achieve accurate analysis of welding defects.

[0089] Based on the chip soldering detection method provided in the above embodiment, the present application also provides a specific implementation of a chip soldering detection device. Please refer to the following embodiment.

[0090] See Figure 6 The chip welding detection device 600 provided in the embodiment of the present application is applied to electronic devices and may include the following modules:

[0091] The first acquisition module 601 is configured to acquire a measured impedance value of each soldering point between the chip of the workpiece to be inspected and the printed circuit board, wherein the measured impedance value is the impedance value between the metal electrode of the sensing unit and the soldering point when the sensing unit is pressed against the chip of the workpiece to be inspected;

[0092] The first determination module 602 is used to determine the detection result of each welding point according to the measured impedance value of each welding point and the preset impedance value range.

[0093] Wherein, when the measured impedance value exceeds the preset impedance value range, the detection result indicates that there is a welding defect in the welding point;

[0094] When the measured impedance value is within the preset impedance value range, the detection result indicates that there is no welding defect at the welding point.

[0095] In the embodiment of the present application, the measured impedance value of each soldering point between the chip of the workpiece to be inspected and the printed circuit board is obtained, and the measured impedance value of each soldering point is compared with a preset impedance value range to determine the detection result of whether each soldering point has a soldering defect. In this way, in the embodiment of the present application, when the sensing unit is pressed against the chip, a certain impedance can be generated in the detection area formed between the metal electrode and the soldering point. By measuring the impedance value of each soldering point between the chip of the workpiece to be inspected and the printed circuit board, it is analyzed whether there is a defect in the soldering between the chip and the printed circuit board. Because the observed value is an electrical signal, it is not necessary to damage the chip of the workpiece to be inspected and the printed circuit board to achieve the soldering quality detection between the chip and the printed circuit board.

[0096] As an implementation of the present application, in order to obtain an accurate preset impedance value range, the apparatus 600 may further include:

[0097] a second acquisition module, configured to acquire measured impedance values ​​of each soldering point between a chip and a printed circuit board of at least one standard workpiece, wherein the standard workpiece is a workpiece for which the inspection results of each soldering point all indicate that there are no soldering defects;

[0098] The first processing module is used to converge the measured impedance values ​​of each welding point between the chip of the standard workpiece and the printed circuit board to obtain a preset impedance value range.

[0099] As another implementation of the present application, in order to accurately analyze the welding defects of the workpiece to be inspected, there are N welding points between the chip of the workpiece to be inspected and the printed circuit board;

[0100] The above-mentioned apparatus 600 may further include:

[0101] a second determining module, configured to determine that the workpiece to be inspected is a defective workpiece when at least one inspection result among the inspection results of the N welding points indicates that the welding point has a welding defect;

[0102] The third determining module is used to determine the defect cause of each welding point in the defective workpiece based on the measured impedance value of each welding point and the relationship between the preset impedance value and the defect cause.

[0103] In some embodiments, the apparatus 600 may further include:

[0104] a third acquisition module, configured to acquire measured impedance values ​​of a plurality of historical welding points, wherein the historical welding points are welding points where historical inspection results indicate welding defects;

[0105] The fourth acquisition module is used to obtain the defect cause of each historical welding point;

[0106] The second processing module is configured to construct a relationship between the impedance value and the defect cause based on the measured impedance values ​​of the plurality of historical welding points and the defect cause of each historical welding point.

[0107] In some embodiments, there are N welding points between the chip of the workpiece to be detected and the printed circuit board, and N metal electrodes are provided on one side of the sensing unit, where N is an integer greater than 1;

[0108] The first acquisition module 601 is specifically configured to acquire measured impedance values ​​of N welding points when the sensing unit is disposed on a side of the chip of the workpiece to be detected away from the printed circuit board and N metal electrodes are disposed in one-to-one correspondence with N welding points.

[0109] Figure 7 A schematic diagram of the hardware structure of an electronic device provided in an embodiment of the present application is shown.

[0110] The electronic device may include a processor 701 and a memory 702 storing computer program instructions.

[0111] Specifically, the processor 701 may include a central processing unit (CPU), or an application-specific integrated circuit (ASIC), or may be configured to implement one or more integrated circuits of the embodiments of the present application.

[0112] The memory 702 may include a large capacity memory for data or instructions. By way of example and not limitation, the memory 702 may include a hard disk drive (HDD), a floppy disk drive, a flash memory, an optical disk, a magneto-optical disk, a magnetic tape, or a universal serial bus (USB) drive, or a combination of two or more of these. Where appropriate, the memory 702 may include removable or non-removable (or fixed) media. Where appropriate, the memory 702 may be inside or outside the integrated gateway disaster recovery device. In a specific embodiment, the memory 702 is a non-volatile solid-state memory.

[0113] In certain embodiments, the memory 702 may include read-only memory (ROM), random access memory (RAM), magnetic disk storage media devices, optical storage media devices, flash memory devices, electrical, optical, or other physical / tangible memory storage devices. Thus, in general, the memory includes one or more tangible (non-transitory) computer-readable storage media (e.g., memory devices) encoded with software including computer-executable instructions, and when the software is executed (e.g., by one or more processors), it is operable to perform the operations described with reference to the method according to an aspect of the present disclosure.

[0114] The processor 701 reads and executes computer program instructions stored in the memory 702 to implement any one of the chip bonding detection methods in the above embodiments.

[0115] In one example, the electronic device may further include a communication interface 703 and a bus 710. Figure 7 As shown, the processor 701, the memory 702, and the communication interface 703 are connected via a bus 710 and communicate with each other.

[0116] The communication interface 703 is mainly used to implement communication between various modules, devices, units and / or equipment in the embodiments of the present application.

[0117] Bus 710 comprises hardware, software or both, couples the parts of electronic equipment to each other.For example, and not limitation, bus can comprise accelerated graphics port (AGP) or other graphics bus, enhanced industry standard architecture (EISA) bus, front side bus (FSB), hypertransport (HT) interconnection, industry standard architecture (ISA) bus, infinite bandwidth interconnection, low pin count (LPC) bus, memory bus, micro channel architecture (MCA) bus, peripheral component interconnection (PCI) bus, PCI-Express (PCI-X) bus, serial advanced technology attachment (SATA) bus, video electronics standard association local (VLB) bus or other suitable bus or two or more of these combinations.In suitable cases, bus 710 can comprise one or more buses.Although the present application embodiment describes and shows specific bus, the application considers any suitable bus or interconnection.

[0118] The electronic device can execute the chip welding detection method in the embodiment of the present application, thereby realizing the combination Figure 4 and Figure 6 Described is a chip welding detection method and device.

[0119] In addition, in conjunction with the chip solder joint detection method in the above embodiments, embodiments of the present application may provide a computer-readable storage medium for implementation. The computer-readable storage medium stores computer program instructions; when the computer program instructions are executed by a processor, any of the chip solder joint detection methods in the above embodiments is implemented.

[0120] In combination with the chip welding detection method in the above embodiment, an embodiment of the present application also provides a computer program product. When the instructions in the computer program product are executed by the processor of an electronic device, the electronic device executes any one of the chip welding detection methods in the above embodiment.

[0121] It should be understood that the present application is not limited to the specific configurations and processes described above and illustrated in the figures. For the sake of brevity, a detailed description of known methods is omitted here. In the above embodiments, several specific steps are described and illustrated as examples. However, the method process of the present application is not limited to the specific steps described and illustrated. Those skilled in the art can make various changes, modifications, and additions, or change the order of the steps after understanding the spirit of the present application.

[0122] The functional blocks shown in the above-described block diagram can be implemented as hardware, software, firmware or a combination thereof. When implemented in hardware, they can be, for example, electronic circuits, application specific integrated circuits (ASICs), appropriate firmware, plug-ins, function cards, etc. When implemented in software, the elements of the present application are programs or code segments that are used to perform the required tasks. The program or code segment can be stored in a machine-readable medium, or transmitted on a transmission medium or a communication link by a data signal carried in a carrier wave. "Machine-readable medium" can include any medium that can store or transmit information. Examples of machine-readable media include electronic circuits, semiconductor memory devices, ROMs, flash memories, erasable ROMs (EROMs), floppy disks, CD-ROMs, optical disks, hard disks, optical fiber media, radio frequency (RF) links, etc. The code segment can be downloaded via a computer network such as the Internet, an intranet, etc.

[0123] It should also be noted that the exemplary embodiments mentioned in this application describe some methods or systems based on a series of steps or devices. However, this application is not limited to the order of the above steps. In other words, the steps can be performed in the order mentioned in the embodiments, or in a different order, or several steps can be performed simultaneously.

[0124] Aspects of the present disclosure have been described above with reference to the flowcharts and / or block diagrams of the methods, devices (systems) and computer program products according to the embodiments of the present disclosure. It should be understood that each box in the flowchart and / or block diagram and the combination of each box in the flowchart and / or block diagram can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer or other programmable data processing device to produce a machine so that these instructions executed by the processor of the computer or other programmable data processing device enable the implementation of the function / action specified in one or more boxes of the flowchart and / or block diagram. Such a processor can be, but is not limited to, a general-purpose processor, a special-purpose processor, a special application processor or a field programmable logic circuit. It is also understood that each box in the block diagram and / or flowchart and the combination of the boxes in the block diagram and / or flowchart can also be implemented by dedicated hardware that performs the specified function or action, or can be implemented by a combination of dedicated hardware and computer instructions.

[0125] The above description is only a specific embodiment of the present application. Those skilled in the art will clearly understand that for the convenience and brevity of description, the specific working processes of the systems, modules and units described above can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the scope of protection of the present application is not limited thereto. Any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be included in the scope of protection of the present application.

Claims

1. A chip welding detection method, applied to electronic equipment, characterized in that: The method comprises: Obtaining a measured impedance value of each soldering point between a chip of the workpiece to be inspected and a printed circuit board, wherein the measured impedance value is: an impedance value between a metal electrode of the sensing unit and the soldering point when the sensing unit is pressed against the chip of the workpiece to be inspected; Determine the detection result of each welding point according to the measured impedance value of each welding point and the preset impedance value range, Wherein, when the measured impedance value exceeds the preset impedance value range, the detection result indicates that there is a welding defect at the welding point; When the measured impedance value is within the preset impedance value range, the detection result indicates that there is no welding defect at the welding point; Before determining the detection result of each welding point according to the measured impedance value of each welding point and the preset impedance value range, the method further includes: Obtaining a measured impedance value of each solder joint between a chip and a printed circuit board of at least one standard workpiece, the standard workpiece being a workpiece where inspection results for each solder joint indicate that the solder joint has no solder defects, the measured impedance value of each solder joint being a difference between a second impedance value and a first impedance value of each solder joint, the second impedance value of each solder joint being obtained by measuring each solder joint on the chip of the standard workpiece, and the first impedance value being obtained by measuring an empty solder pad on the printed circuit board; The measured impedance values ​​of each welding point between the chip of the standard workpiece and the printed circuit board are converged to obtain a preset impedance value range.

2. The method according to claim 1, characterized in that There are N welding points between the chip of the workpiece to be inspected and the printed circuit board, where N is an integer greater than 1; After determining the detection result of each welding point according to the measured impedance value of each welding point and the preset impedance value range, the method further includes: If at least one detection result among the detection results of the N welding points indicates that the welding point has a welding defect, determining that the workpiece to be inspected is a defective workpiece; According to the measured impedance value of each welding point in the defective workpiece, the defect cause of each welding point is determined in the relationship between the preset impedance value and the defect cause.

3. The method according to claim 2, characterized in that Before determining the defect cause of each welding point based on the measured impedance value of each welding point in the defective workpiece and the relationship between the preset impedance value and the defect cause, the method further includes: Obtaining measured impedance values ​​of a plurality of historical welding points, wherein the historical welding points are welding points where historical inspection results indicate that the welding points have welding defects; Obtaining the defect cause of each of the historical welding points; Based on the measured impedance values ​​of the plurality of historical welding points and the defect causes of the historical welding points, a relationship between the impedance values ​​and the defect causes is constructed.

4. The method according to claim 1, wherein There are N welding points between the chip of the workpiece to be detected and the printed circuit board, and N metal electrodes are provided on one side of the sensing unit, where N is an integer greater than 1; The step of obtaining the measured impedance value of each welding point between the chip of the workpiece to be inspected and the printed circuit board includes: When the sensing unit is arranged on a side of the chip of the workpiece to be detected away from the printed circuit board, and the N metal electrodes are arranged in a one-to-one correspondence with the N welding points, measured impedance values ​​of the N welding points are obtained.

5. A chip welding detection device, applied to electronic equipment, characterized in that: The device comprises: a first acquisition module, configured to acquire a measured impedance value of each soldering point between a chip of a workpiece to be inspected and a printed circuit board, wherein the measured impedance value is an impedance value between a metal electrode of the sensing unit and the soldering point when the sensing unit is pressed against the chip of the workpiece to be inspected; The first determining module is configured to determine the detection result of each welding point according to the measured impedance value of each welding point and a preset impedance value range. Wherein, when the measured impedance value exceeds the preset impedance value range, the detection result indicates that there is a welding defect at the welding point; When the measured impedance value is within the preset impedance value range, the detection result indicates that there is no welding defect at the welding point; The device further comprises: a second acquisition module, configured to acquire a measured impedance value of each soldering point between a chip and a printed circuit board of at least one standard workpiece, wherein the standard workpiece is a workpiece in which the inspection results of each soldering point indicate that the soldering point has no soldering defects, the measured impedance value of each soldering point being a difference between a second impedance value and a first impedance value of each soldering point, the second impedance value of each soldering point being obtained by measuring each soldering point on the chip of the standard workpiece, and the first impedance value being obtained by measuring an empty solder pad on the printed circuit board; The first processing module is used to converge the measured impedance values ​​of each welding point between the chip of the standard workpiece and the printed circuit board to obtain a preset impedance value range.

6. A chip welding detection system, characterized in that: The system comprises: A sensing unit, wherein a metal electrode is provided on one side of the sensing unit; a signal acquisition module, the signal acquisition module being electrically connected to the sensing unit, and being configured to acquire a measured impedance value between the metal electrode and a welding point, the welding point being located between the chip of the workpiece to be inspected and the printed circuit board, when the sensing unit is disposed on a side of the chip of the workpiece to be inspected that is away from the printed circuit board; A host computer, the host computer is electrically connected to the signal acquisition module, and is used to obtain the measured impedance value of each welding point between the chip of the workpiece to be detected and the printed circuit board, the measured impedance value being: the impedance value between the metal electrode of the sensing unit and the welding point when the sensing unit is pressed on the chip of the workpiece to be detected; determining the detection result of each welding point according to the measured impedance value of each welding point and a preset impedance value range, wherein, when the measured impedance value exceeds the preset impedance value range, the detection result indicates that the welding point has a welding defect; when the measured impedance value is within the preset impedance value range, the detection result indicates that the welding point does not have a welding defect; Before determining the inspection results of each welding point based on the measured impedance value of each welding point and the preset impedance value range, the method further includes: obtaining the measured impedance value of each welding point between the chip of at least one standard workpiece and the printed circuit board, the standard workpiece being a workpiece whose inspection results of each welding point indicate that there are no welding defects at the welding point, the measured impedance value of each welding point being the difference between the second impedance value and the first impedance value of each welding point, the second impedance value of each welding point being obtained by measuring each welding point on the chip of the standard workpiece, and the first impedance value being obtained by measuring an empty pad on the printed circuit board; converging the measured impedance values ​​of each welding point between the chip of the standard workpiece and the printed circuit board to obtain a preset impedance value range.

7. The system according to claim 6, characterized in that There are N welding points between the chip of the workpiece to be detected and the printed circuit board, and N metal electrodes are provided on one side of the sensing unit, where N is an integer greater than 1; The signal acquisition module is used to collect the measured impedance values ​​of the N welding points when the sensing unit is arranged on the side of the chip of the workpiece to be detected away from the printed circuit board, and the N metal electrodes are arranged in a one-to-one correspondence with the N welding points.

8. An electronic device, characterized in that: The device includes: a processor and a memory storing computer program instructions; when the processor executes the computer program instructions, the chip welding detection method according to any one of claims 1 to 4 is implemented.

9. A computer-readable storage medium, characterized in that The computer-readable storage medium stores computer program instructions, and when the computer program instructions are executed by a processor, the chip welding detection method according to any one of claims 1 to 4 is implemented.

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