SIP module and smart wearable device

Abstract

The application discloses a SIP module and a smart wearable device. The SIP module comprises a test signal access end and a circuit board, the circuit board is provided with a working circuit with multiple to-be-tested terminals, a gating component and a test point; the working circuit is electrically connected with an external test terminal and a controlled end of the gating component respectively, the multiple to-be-tested terminals are connected with multiple input ends of the gating component in one-to-one correspondence, and an output end of the gating component is electrically connected with the test point; and the test point is used for accessing the external test terminal. The application reduces the number of test points on the circuit board in the SIP module and simplifies the structure of the SIP module.

Description

Technical Field

[0001] This invention relates to the field of SIP modules, and particularly to a SIP module and a smart wearable device. Background Technology

[0002] With the continuous development of SIP technology and processes, as well as the continuous improvement of production capacity, SIP module products are becoming smaller and smaller, and the number of integrated functional circuits is increasing. This brings new requirements to the testing of SIP modules. In traditional SIP module design, in order to meet the testing needs of different functional circuits under test, dozens of test points need to be set on the circuit board, and test probes on test fixtures are used to contact the test points to collect voltage data.

[0003] However, during actual testing, the R&D personnel found that due to the large number of test points, the area of ​​each individual test point needed to be relatively small, resulting in higher circuit board processing difficulty and lower yield. At the same time, the large number of test points also occupied a portion of the wiring area on the circuit board, leading to a larger overall circuit board area, which was detrimental to the miniaturization and integration requirements of SIP modules. Summary of the Invention

[0004] The main objective of this invention is to propose a SIP module that aims to reduce the number of test points on the circuit board in the SIP module and simplify the structure of the SIP module.

[0005] Therefore, the present invention proposes a SIP module, comprising:

[0006] The test signal access terminal is used to electrically connect to an external test terminal and to receive test signals sent from the external test terminal.

[0007] The circuit board has a working circuit with multiple terminals under test, a gating component, and test points. The working circuit is electrically connected to the external test terminal and the controlled terminal of the gating component, respectively. The multiple terminals under test are connected one-to-one with the multiple input terminals of the gating component, and the output terminal of the gating component is electrically connected to the test points.

[0008] The test points are used to connect to external test terminals;

[0009] The working circuit is used to execute a corresponding test program according to the test signal, and to control the gating component to open the path between the test terminal corresponding to the test signal and the test point.

[0010] Optionally, the number of test points is multiple; the number of output terminals of the gating component is also multiple, and is consistent with the number of test points; the multiple test points are connected one-to-one with the output terminals of the multiple gating components.

[0011] Optionally, the test point includes a first test point and a second test point, and the gating component includes a first output terminal and a second output terminal; the first test point is connected to the first output terminal, and the second output terminal is connected to the second test point.

[0012] Optionally, the selection component includes a multiplexer, which has multiple input terminals, a first output terminal, a second output terminal, and a controlled terminal; the multiple input terminals of the multiplexer are connected one-to-one with the multiple terminals to be tested, the first output terminal of the multiplexer is electrically connected to the first test point, the second output terminal of the multiplexer is electrically connected to the second test point, and the controlled terminal of the multiplexer is electrically connected to the working circuit.

[0013] Optionally, the test point is an immersion gold pad.

[0014] Optionally, the diameter of the test point is 0.35 mm.

[0015] Optionally, the operating circuit includes:

[0016] A main control circuit, which is electrically connected to the test signal input terminal, and the main control circuit has at least one of the terminals under test;

[0017] Multiple functional modules, each of which has at least one terminal under test; the multiple terminals under test are respectively connected to the multiple input terminals of the gating component in a one-to-one correspondence;

[0018] The main control circuit is used to control the functional module corresponding to the test signal to execute the corresponding test program according to the test signal, and to control the gating component to open the path between the test terminal and the test point corresponding to the test signal.

[0019] Optionally, the test signal includes a sleep test signal and a working test signal;

[0020] The main control circuit is used to control the functional module corresponding to the sleep test signal to enter sleep mode when the sleep test signal is received, and to control the gating component to open the path between the test terminal and the test point corresponding to the test signal.

[0021] The main control circuit is also used to control the functional module corresponding to the working test signal to be in working mode when the working test signal is received, and to control the gating component to open the path between the test terminal and the test point corresponding to the test signal.

[0022] Optionally, the functional module includes at least two of the following: a power management module, a sensor module, a charging and discharging module, a protection circuit module, an audio module, a microphone module, and a radio frequency module.

[0023] The present invention also proposes a smart wearable device, comprising the SIP module described in any of the above claims.

[0024] This invention relates to a SIP module comprising a test signal input terminal and a circuit board. The circuit board has a working circuit with multiple terminals under test (DUTs), a gating component, and test points. The working circuit is electrically connected to an external test terminal and the controlled terminal of the gating component. Each DUT is connected to one of the multiple input terminals of the gating component, and the output terminal of the gating component is electrically connected to a test point. The test points are used to connect to the external test terminal. The working circuit executes a corresponding test program based on the test signal and controls the gating component to open the path between the DUT corresponding to the test signal and the test point. Thus, in practical applications, this invention effectively reduces the number of test points on the circuit board of the SIP module, thereby reducing the wiring area occupied by multiple test points. This allows the SIP module circuit board to be designed with a smaller volume and size, improving the miniaturization capability of the SIP module. Furthermore, the reduced number of test points saves wiring area on the circuit board, which can not only facilitate the layout of other components but also accommodate additional functional circuits, further improving the compatibility and integration of the SIP module with multiple functional circuits. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the circuit structure in one embodiment of the SIP module of the present invention;

[0027] Figure 2 This is a schematic diagram of the circuit structure of another embodiment of the SIP module of the present invention;

[0028] Figure 3This is a schematic diagram of the circuit structure of the SIP module in another embodiment of the present invention.

[0029] Explanation of icon numbers:

[0030]

[0031]

[0032] The objectives, features, and advantages of this invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0033] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0034] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0035] With the continuous development of SIP technology and processes, as well as the continuous improvement of production capacity, SIP module products are becoming smaller and smaller, and the number of integrated functional circuits is increasing. This brings new requirements to the testing of SIP modules. In traditional SIP module design, in order to meet the testing needs of different functional circuits under test, dozens of test points need to be set on the circuit board, and test probes on test fixtures are used to contact the test points to collect voltage data.

[0036] However, during actual testing, the R&D personnel found that because there were a large number of test points 30, the area of ​​each individual test point 30 needed to be relatively small, making the circuit board 00 more difficult to manufacture and resulting in a lower yield rate. At the same time, the large number of test points 30 also occupied a portion of the wiring area on the circuit board 00, leading to a larger overall area of ​​the circuit board 00, which was not conducive to the miniaturization and integration requirements of SIP modules.

[0037] Therefore, the present invention proposes a SIP module. In one embodiment of the present invention, referring to... Figures 1-3 The SIP module includes:

[0038] The test signal input terminal is used to electrically connect to an external test terminal and to receive test signals sent from the external test terminal.

[0039] The circuit board 00 has a working circuit 10 with multiple terminals under test, a gating component 20 and a test point 30. The working circuit 10 is electrically connected to an external test terminal and the controlled terminal of the gating component 20 respectively. The multiple terminals under test are connected to the multiple input terminals of the gating component 20 one by one. The output terminal of the gating component 20 is electrically connected to the test point 30.

[0040] Test point 30 is used to connect to an external test terminal;

[0041] The working circuit 10 is used to execute the corresponding test program according to the test signal, and to control the gating component 20 to open the path between the test terminal corresponding to the test signal and the test point 30.

[0042] It's important to understand that in actual testing of SIP modules, a test fixture is typically used. This fixture has a mounting slot with mounting points corresponding to the various pins of the SIP module. These mounting points contain pads or pins so that when the SIP module is placed in the slot, its pins electrically connect to these mounting points. These mounting points are then electrically connected to an external test terminal. During testing, the user can control the external test terminal to send signals to the SIP module, causing it to execute the appropriate test procedures. In addition, the test fixture is equipped with a pressing mechanism, which has multiple metal probes that are electrically connected to an external test terminal. When the tester places the SIP module into the mounting slot and operates the pressing mechanism, the multiple metal probes on the pressing mechanism will contact the multiple test points 30 on the SIP module one by one to form an electrical connection path. This allows the external test terminal to detect the voltage of more than 10 test terminals of the working circuit on the SIP module through the metal probes and test points 30.

[0043] In this embodiment, the working circuit 10 may include a main control circuit 11 and multiple functional modules 12 electrically connected thereto, such as a power management unit (PMU), radio frequency circuit, audio module, microphone module, LTE module, etc. The terminal under test can be an input terminal, output terminal, controlled terminal, enable terminal, or functional terminal of the above-mentioned circuit, or a terminal of a device in the above-mentioned circuit that needs to be tested. The test signal access terminal can be a pin of the above-mentioned SIP module, such as the pin of the main control circuit 11 in the working circuit 10 that exchanges data with an external terminal.

[0044] In this embodiment, optionally, the test point 30 is an immersion gold pad or the inner wall of the solder hole is immersion gold. This effectively improves the conductivity of the metal probe of the external test terminal and the test point 30 during actual testing, thereby improving the stability and reliability of the test. Optionally, in this embodiment, the diameter of the test point 30 is 0.35 mm. This not only avoids occupying a large wiring area on the circuit board 00, but also simplifies the manufacturing process, ensures a high yield rate, and guarantees the stability of the electrical connection between the test point 30 and the metal probe of the external test terminal.

[0045] In this embodiment, the gating component 20 can be implemented using at least one multiplexer. The specific number can be determined by the R&D personnel based on the number of devices under test and the type of multiplexer selected. For example, a 16-to-1 data selector or two 8-to-1 selectors can be used. The gating component 20 can be electrically connected to the main control circuit 11 in the real-time configuration described above. Thus, in practical applications, when the tester installs the SIP module on the test fixture, they can control the external test terminal to output the corresponding test signal through the test signal input terminal according to the current test requirements. This allows the main control circuit 11 to execute the corresponding test program based on the test signal and control the gating component 20 to connect the device under test corresponding to the test signal to the test point 30. It is understood that the working circuit 10 includes multiple functional circuits, each with multiple test items. When performing each test item, the external test terminal can sequentially output different test signals to switch the device under test currently electrically connected to the test point 30. With the above setup, during the routing process of the SIP module's circuit board 00, it is unnecessary to set up multiple test points. Only one gating component 20 and one test point 30 are needed to complete the testing of the SIP module. This effectively saves the routing area of ​​the circuit board 00 previously occupied by multiple test points 30, allowing the circuit board 00 to be designed with a smaller volume and size. Furthermore, it is understood that the routing area saved on the circuit board 00 can be used to place other components, such as optimizing the component layout of multiple functional circuits in the current working circuit 10, or adding other functional circuits, thereby further improving the compatibility and integration of the SIP module with multiple functional circuits.

[0046] The SIP module of this invention includes a test signal input terminal and a circuit board 00. The circuit board 00 is provided with a working circuit 10 having multiple terminals under test, a gating component 20, and test points 30. The working circuit 10 is electrically connected to an external test terminal and the controlled terminal of the gating component 20, respectively. Each terminal under test is connected to a corresponding input terminal of the gating component 20, and the output terminal of the gating component 20 is electrically connected to the test points 30. The test points 30 are used to connect to an external test terminal. The working circuit 10 executes a corresponding test program based on the test signal and controls the gating component 20 to open the path between the terminal under test corresponding to the test signal and the test point 30. Thus, in practical applications, this invention can effectively reduce the number of test points 30 on the circuit board 00 of the SIP module through the above-mentioned technical means, thereby reducing the wiring area occupied by multiple test points 30 on the circuit board 00. This allows the circuit board 00 of the SIP module to be designed with a smaller volume and size, thereby improving the miniaturization capability of the SIP module. Meanwhile, due to the reduction in the number of test points 30, the saved wiring area of ​​the circuit board 00 can not only facilitate the layout of other components, but also accommodate additional functional circuits, thereby further improving the compatibility and integration of the SIP module with multiple functional circuits.

[0047] It is important to understand that in actual testing, it is not only necessary to detect the voltage of a single terminal under test to ground, but sometimes it is also necessary to detect the voltage of multiple terminals under test to ground in a functional circuit simultaneously when the circuit is operating. Therefore, in one embodiment of the present invention, the number of test points 30 is multiple; the number of output terminals of the gating component 20 is also multiple, and consistent with the number of test points 30; the multiple test points 30 are connected one-to-one with the output terminals of the multiple gating components 20.

[0048] In this embodiment, when the working circuit 10 receives a test signal through the test signal access terminal, it will execute the corresponding test program in the following embodiment according to the test signal, and control the gating component 20 to open the path between at least one test terminal corresponding to the test signal and the test point 30 corresponding to the test terminal.

[0049] Specifically, taking the current working circuit 10 as an example, which includes a main control circuit 11 and a power management module electrically connected to the test signal input terminal, and test points 30 including test points 30A and 30B, and the gating component including a first output terminal connected to test point 30A and a second output terminal connected to test point 30B, the power management module uses its input terminal as the test terminal A and its output terminal as the test terminal B. When the user needs to test the function of the power management module, that is, to detect whether the voltage of its input and output terminals is normal after it starts working, it will control the external test terminal to output the corresponding test signal, so that the main control circuit 11 controls the power management module to start working, and controls the gating component 20 to conduct the path between the test terminal A and the first output terminal, so that the test terminal A and test point 30A are electrically connected, and controls the gating component 20 to conduct the path between the test terminal B and the second output terminal, so that the test terminal B and test point 30B are electrically connected. Then, the external test terminal that is electrically connected to test point 30A and test point 30B can simultaneously collect the voltage values ​​of the input and output terminals of the power management module during the operation of the power management module.

[0050] It's important to understand that in traditional testing processes, typically only a single functional module 12 or a few functional modules 12 are tested. In this case, only the voltage of a few corresponding test points 30 needs to be collected, while the other test points 30 remain idle. Therefore, the above setup not only effectively reduces the number of test points 30 but also enables simultaneous voltage acquisition of multiple terminals under test within the same functional module 12 in the working circuit 10, improving the efficiency and comprehensiveness of SIP module testing.

[0051] Optionally, in this embodiment, reference is made to... Figure 2 Test point 30 includes a first test point 31 and a second test point 32, and the gating component 20 includes a first output terminal and a second output terminal; the first test point 31 is connected to the first output terminal, and the second output terminal is connected to the second test point 32. In this way, not only can the effects of the above embodiments be achieved, but the testing requirements for mutual measurement of SIP modules can also be met, that is, testing the voltage of one test terminal relative to another test terminal, thereby further improving the comprehensiveness and completeness of the SIP module testing.

[0052] Specifically, the gating component 20 includes a multiplexer, which has multiple input terminals, a first output terminal, a second output terminal, and a controlled terminal. The multiple input terminals of the multiplexer are connected one-to-one with the multiple terminals to be tested. The first output terminal of the multiplexer is electrically connected to the first test point 31, the second output terminal of the multiplexer is electrically connected to the second test point 32, and the controlled terminal of the multiplexer is electrically connected to the working circuit 10.

[0053] In this embodiment, the specific model of the multiplexer can be selected by the R&D personnel according to the actual number of terminals under test. For example, if there are 15 terminals under test, the R&D personnel can use a 16-to-2 data selector, and the 15 terminals under test can be electrically connected one-to-one with the first input terminal to the fifteenth input terminal on it; alternatively, two 16-to-1 data selectors can be used, with the output terminals of the two 16-to-1 data selectors connected one-to-one with the first test point 31 and the second test point 32, and the first to sixteenth input terminals of the two 16-to-1 data selectors connected in parallel, and the 15 terminals under test are electrically connected one-to-one with the first input terminal to the fifteenth input terminal on any 16-to-1 data selector. Thus, in the actual testing process, as can be seen from the following embodiment, after receiving the test signal, the working circuit 10 will execute the corresponding test program according to the test signal, and control the multiplexer to open the path between the terminal under test corresponding to the test signal and the first test point 31, and to open the path between the terminal under test corresponding to the test signal and the second test point 32. This enables the external test terminal to acquire voltage data from the two terminals under test via the first test point 31 and the second test point 32.

[0054] In one embodiment of the present invention, reference is made to... Figure 3 The working circuit 10 includes:

[0055] The main control circuit 11 is electrically connected to the test signal input terminal, and the main control circuit 11 has at least one terminal under test;

[0056] Multiple functional modules 12, each functional module 12 having at least one terminal under test; the multiple terminals under test are respectively connected to the multiple input terminals of the gating component 20;

[0057] The main control circuit 11 is used to control the functional module 12 corresponding to the test signal to execute the corresponding test program according to the test signal, and to control the gating component 20 to conduct the path between the test terminal and the test point 30 corresponding to the test signal.

[0058] It is understood that the SIP module integrates the main control circuit 11 and multiple functional modules 12, including at least two of the following: power management module, sensor module, charging and discharging module, protection circuit module, audio module, microphone module, and radio frequency module.

[0059] In this embodiment, the main control circuit 11 can be implemented using a main controller, such as an MCU, DSP (Digital Signal Processor), FPGA (Field Programmable Gate Array), or SOC (System on Chip). The controlled terminal of the gating component 20 is electrically connected to the extra pins on the main control circuit 11. The terminal under test can be the input or output terminal of the functional module 12, or a pin of a chip in the functional module 12, or one end of a device.

[0060] During actual testing, the main control circuit 11 controls the functional module 12 corresponding to the test signal to execute the corresponding test program based on the test signal, and controls the gating component 20 to connect the test terminal (i.e., the terminal under test) corresponding to the test signal to the test point 30. This test program can include multiple test items. It is understood that when performing a specific test item in a particular test program, the test terminal corresponding to the test signal can be the test terminal on the functional module 12 corresponding to the current test signal, or it can be a test terminal on another functional module 12 or the main control circuit 11. For example, during the process of controlling the power management module to perform relevant tests, it is necessary to detect the power supply to the main control circuit 11 when the power management module starts working. In this case, the main control circuit 11 will control the gating component 20 to work, thereby connecting its own power supply terminal (i.e., the test terminal) to the test point 30.

[0061] It is understandable that during the testing process, it is necessary not only to test the operating condition of a certain functional module 12 in the working mode, but also to test the operating condition of the functional module 12 in the sleep mode. Therefore, in another embodiment of the present invention, the test signal includes a sleep test signal and a working test signal;

[0062] The main control circuit 11, upon receiving a sleep test signal, controls the functional module 12 corresponding to the sleep test signal to enter sleep mode, and controls the gating component 20 to open the path between the terminal under test (DUT) corresponding to the test signal and the test point 30. The main control circuit 11 is also used, upon receiving a working test signal, to control the functional module 12 corresponding to the working test signal to enter working mode, and controls the gating component 20 to open the path between the terminal under test (DUT) corresponding to the test signal and the test point 30. Thus, in actual testing, this invention can detect the voltage of the terminal under test of a working module under different operating conditions, further improving the comprehensiveness and completeness of SIP module testing.

[0063] The present invention also proposes a smart wearable device, including a SIP module as described above.

[0064] It is worth noting that, since the smart wearable device of the present invention includes all embodiments of the above-mentioned SIP module, the smart wearable device of the present invention has all the beneficial effects of the above-mentioned SIP module, which will not be repeated here.

[0065] In this embodiment, it is understood that, since the multiple test points in the traditional technical solution are reduced to two test points in the above SIP module embodiment, the wiring area occupied by the test points on the circuit board is effectively reduced. In other words, compared with the traditional SIP module, the circuit board size of the SIP module in this application can be further reduced, or more functional modules can be placed on the wiring area saved, thereby effectively improving the miniaturization and integration of smart wearable devices.

[0066] The above are merely preferred embodiments of the present invention and do not limit the scope of the patent. Any equivalent structural transformations made using the contents of the specification and drawings of the present invention under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the scope of patent protection of the present invention.

Claims

1. A SIP module, characterized in that, The SIP module comprises: a test signal access end, configured to be electrically connected with an external test terminal and to access a test signal sent by the external test terminal; a circuit board, provided with a working circuit having a plurality of to-be-tested terminals, a gating component and a plurality of test points; the working circuit is electrically connected with the external test terminal and a control terminal of the gating component respectively, the plurality of to-be-tested terminals are connected with a plurality of input terminals of the gating component in one-to-one correspondence, an output terminal of the gating component is electrically connected with the test points, and the number of the test points is the same as that of the output terminal of the gating component; the output terminal of the gating component is connected with the test points in one-to-one correspondence; the test points are configured to access the external test terminal; the working circuit is configured to execute a corresponding test program according to the test signal and control the gating component to turn on a path between the to-be-tested terminals corresponding to the test signal and the test points; the working circuit comprises: a master control circuit, electrically connected with the test signal access end, and having at least one to-be-tested terminal; a plurality of functional modules, each having at least one to-be-tested terminal; and the plurality of to-be-tested terminals are connected with the plurality of input terminals of the gating component in one-to-one correspondence; the master control circuit is configured to control a functional module corresponding to the test signal to execute a corresponding test program according to the test signal and control the gating component to turn on a path between the to-be-tested terminals corresponding to the test signal and the test points, and the test program comprises a plurality of test items, and when a certain test item is executed, the to-be-tested terminal corresponding to the test signal is a to-be-tested terminal of the master control module or any functional module.

2. The SIP module of claim 1, wherein, the test points comprise a first test point and a second test point, and the gating component comprises a first output terminal and a second output terminal; the first test point is connected with the first output terminal, and the second output terminal is connected with the second test point.

3. The SIP module of claim 2, wherein, the gating component comprises a multiplexer, which has a plurality of input terminals, a first output terminal, a second output terminal and a control terminal; the plurality of input terminals of the multiplexer are connected with the plurality of to-be-tested terminals in one-to-one correspondence, the first output terminal of the multiplexer is electrically connected with the first test point, the second output terminal of the multiplexer is electrically connected with the second test point, and the control terminal of the multiplexer is electrically connected with the working circuit.

4. The SIP module of claim 1, wherein, the test points are gold pads.

5. The SIP module of claim 4, wherein, the diameter of the test points is 0.35 mm.

6. The SIP module of claim 1, wherein, the test signal comprises a sleep test signal and a working test signal; the master control circuit is configured to control a functional module corresponding to the sleep test signal to be in a sleep mode and control the gating component to turn on a path between the to-be-tested terminals corresponding to the test signal and the test points when the sleep test signal is received. The master control circuit is further configured to, when the working test signal is received, control a function module corresponding to the working test signal to be in a working mode, and control the gating component to turn on a path between the test point and the to-be-tested terminal corresponding to the test signal.

7. The SIP module of claim 1, wherein, The function module includes at least two of a power management module, a sensor module, a charge and discharge module, a protection circuit module, an audio module, a microphone module, and a radio frequency module.

8. An intelligent wearable device, characterized by, A SIP module as claimed in any one of claims 1 to 7.

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