Computer cooling device

Abstract

The present invention discloses a computer heat dissipation device, which relates to the field of computer heat dissipation technology and includes a heat dissipation substrate, a heat conduction box, a circulation component, and an adjustment component. The present invention provides a press-fitting mechanism on a rack. When the heat of a computer motherboard is too high, the temperature of the coolant also increases. The high temperature environment causes the airbag to expand rapidly, increasing the contact area between the lifting heat conduction pipe and the outer surface of the connecting seat and the air. The increased heat exchange area can further improve the cooling of the heated coolant flowing through the connecting seat and the lifting heat conduction pipe. At the same time, the hollow piston and the pull rod pull the movable baffle at the opening of the circulation pump, achieving faster heat exchange between the coolant and the flow path within the heat dissipation substrate, thereby achieving the purpose of adjusting the heat dissipation effect in real time as the heat level of the motherboard changes.

Description

Technical Field

[0001] The present invention relates to the technical field of computer parts assembly equipment, in particular to a computer heat dissipation device. Background Art

[0002] The motherboard of a computer case, also known as the computer mainboard, system board or motherboard, is one of the most basic and important components of a computer. The motherboard is installed in the case. When the internal temperature of the computer increases, it is easy to cause the temperature of the motherboard to rise. In the existing technology, the heat generated by the motherboard during operation is only dissipated through the air cooling or water cooling device provided by the case. The heat dissipation effect is certain. When the host is running at high power consumption, the heat dissipation effect cannot be adjusted in real time, and the heat dissipation capacity cannot offset the heat efficiency, which affects the performance of the entire computer system. Summary of the Invention

[0003] The object of the present invention is to provide a computer heat dissipation device to solve the above-mentioned defects caused by the prior art.

[0004] A computer heat dissipation device includes a heat dissipation substrate, a heat conduction box, a circulation component and an adjustment component. The heat dissipation substrate is a hollow structure and can be detachably installed on a computer motherboard. The heat conduction box is connected to the heat dissipation substrate. The circulation component is installed on the heat conduction box and is used to circulate cooling water to the heat dissipation substrate. The adjustment component is also installed on the heat conduction box and is used to adjust the heat exchange area between the heat dissipation substrate and the air, as well as the flow rate of cooling water inside the heat dissipation substrate.

[0005] Preferably, the circulation component includes a circulation pump, a guide ring and a guide pipe. The circulation pump is installed on the heat conduction box. The guide ring is a circular ring structure, and its side end is connected to the circulation pump. The lower end of the guide ring is connected to the heat dissipation substrate through the guide pipe.

[0006] The top end of the piston rod is hinged on the base, is used for the piston rod of the piston rod and the bottom end of the piston rod is hinged on the base, is used for the piston rod of the piston rod and the bottom end of the piston rod is hinged on the base, is used for the piston rod of the piston rod to be connected with the piston rod of the piston rod.

[0007] Preferably, the airbag is placed in the lifting heat conduction pipe.

[0008] Preferably, the connecting piece matches the opening of the opening limiting tube.

[0009] Preferably, the movable baffle cooperates with the opening of the circulation pump.

[0010] The advantages of the present invention are: by arranging a circulation component and an adjustment component on the heat conduction box, when the heat of the computer motherboard is too high, the temperature of the coolant will also increase accordingly, the high temperature environment causes the airbag to expand rapidly, and the buoyancy of the airbag with an increased volume lifts the connecting piece, and simultaneously drives the lifting heat pipe to extend from the connecting seat, and the contact area between the lifting heat pipe and the outer surface of the connecting seat and the air becomes larger. The increase in heat exchange area can further enhance the cooling of the heated coolant flowing through the connecting seat and the lifting heat pipe, and at the same time, the movable baffle at the opening of the circulation pump is pulled by the hollow piston and the pull rod, so that the opening size of the circulation pump becomes larger. Under the condition of a certain pump pressure of the circulation pump, faster heat exchange of the coolant is achieved between the flow path in the guide ring and the heat dissipation substrate, so that the heat dissipation effect can be adjusted in real time as the heat level of the motherboard changes. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a structural schematic diagram of the present invention.

[0012] Figure 2 It is a schematic diagram of the assembly of the internal structure of the circulation component and the adjustment component in the present invention.

[0013] Figure 3 It is a structural schematic diagram of the adjustment component in the present invention.

[0014] Figure 4 Schematic diagram of the internal structure of the present invention (arrows indicate the circulation direction of the coolant).

[0015] Figure 5 for Figure 4 A magnified view of the structure at point A in the middle.

[0016] Among them, 1-heat dissipation substrate, 2-heat conduction box, 3-circulation component, 4-adjustment component, 31-circulation pump, 32-guide ring, 33-guide pipe, 401-connecting seat, 402-guide frame, 403-air bag, 404-lifting heat conduction pipe, 405-connector, 406-sliding hollow ball, 407-slide groove, 408-opening limit tube, 409-spring, 410-hollow piston, 411-pull rod, 412-movable baffle. DETAILED DESCRIPTION

[0017] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.

[0018] like Figures 1 to 5 As shown, a computer heat dissipation device includes a heat dissipation substrate 1, a heat conduction box 2, a circulation component 3 and an adjustment component 4. The heat dissipation substrate 1 is a hollow structure and can be detachably installed on the computer motherboard. The heat conduction box 2 is connected to the heat dissipation substrate 1. The circulation component 3 is installed on the heat conduction box 2 and is used to circulate cooling water to the heat dissipation substrate 1. The adjustment component 4 is also installed on the heat conduction box 2 and is used to adjust the heat exchange area with the air and the flow rate of cooling water inside the heat dissipation substrate 1.

[0019] In this embodiment, the circulation component 3 includes a circulation pump 31, a guide ring 32 and a guide pipe 33. The circulation pump 31 is installed on the heat conduction box 2. The guide ring 32 is a circular ring structure, and its side end is connected to the circulation pump 31. The lower end of the guide ring 32 is connected to the heat dissipation substrate 1 through the guide pipe 33.

[0020] In this embodiment, the adjustment component 4 includes a connecting seat 401, a guide frame 402 and an air bag 403. The connecting seat 401 is installed on the heat conduction box 2. The connecting seat 401 is a hollow structure and is connected to the guide ring 32. The upper end of the connecting seat 401 is slidingly connected with a lifting heat conduction pipe 404. The upper end of the lifting heat conduction pipe 404 is connected with an "I"-shaped connector 405. The air bag 403 is installed at the lower end of the connector 405. The end of the connector 405 is installed with a sliding hollow ball 406. The guide frame 402 is installed on the heat conduction box 2. Two symmetrically arranged slide grooves 404 are provided on the guide frame 402. 07, the connecting member 405 is slidably set in the slide groove 407, and the opening limit tubes 408 are detachably installed on both sides of the connecting member 405, and the sliding hollow ball 406 is slidably set in the opening limit tube 408. Springs 409 are provided on both sides of the sliding hollow ball 406 and both ends of the opening limit tube 408. A hollow piston 410 is slidably set at the lower end of the sliding hollow ball 406 close to the side of the circulation pump 31, and the lower end of the hollow piston 410 is hinged with a pull rod 411, and the other end of the pull rod 411 is slidably set with a movable baffle 412, and the other end of the movable baffle 412 is hinged to the opening of the circulation pump 31.

[0021] In this embodiment, the air bag 403 is placed in the lifting heat conduction pipe 404 , and the connecting member 405 cooperates with the opening of the opening limiting pipe 408 .

[0022] In addition, the movable baffle 412 cooperates with the opening of the circulation pump 31 .

[0023] Working process and principle: During the use of the present invention, first, when the computer is running, the heat of the motherboard increases, and the heat is transferred to the heat dissipation substrate 1. The continuous pumping of 31 causes the coolant to circulate in the circulation pump 32, the guide tube 33 and the heat dissipation substrate 1. The circulation of the coolant takes away some of the heat on the heat dissipation substrate 1. At the same time, when the circulating coolant passes through the connecting seat 401, it also transfers some of the heat to the connecting seat 401, forming a local heat exchange with the external air.

[0024] When the heat of the computer motherboard is too high, the temperature of the coolant will also increase. The high temperature environment in the circulation path causes the air bag 403 to expand rapidly. During the expansion process, the lower end contacts the upper liquid surface of the coolant. The buoyancy of the air bag 403 with an increased volume lifts up the connector 405, and simultaneously drives the lifting heat pipe 404 to extend from the connecting seat 401. The contact area between the lifting heat pipe 404 and the outer surface of the connecting seat 401 and the air becomes larger. The increase in heat exchange area can further increase the heat flowing through the connecting seat 401 and the lifting heat pipe 404. The heat-conducting pipe 404 cools down the cooling liquid. At the same time, during the rising process of the connecting part 405, the spring 409 placed above the sliding hollow ball 406 will be compressed, and the spring 409 placed below the sliding hollow ball 406 will be lengthened, and then the movable baffle 412 at the opening of the circulation pump 31 will be pulled through the hollow piston 410 and the pull rod 411, so that the opening size of the circulation pump 31 becomes larger. Under the condition of a certain pumping pressure of the circulation pump 31, faster heat exchange of the cooling liquid between the guide ring 32 and the flow path in the heat dissipation substrate 1 is achieved.

[0025] Based on the above, the present invention sets a circulation component 3 and an adjustment component 4 on the heat conduction box 2. When the heat of the computer motherboard is too high, the temperature of the coolant will also increase accordingly. The high temperature environment causes the air bag 403 to expand rapidly. The buoyancy of the air bag 403 with an increased volume lifts the connecting piece 405, and simultaneously drives the lifting heat pipe 404 to extend from the connecting seat 401. The contact area between the lifting heat pipe 404 and the outer surface of the connecting seat 401 and the air becomes larger. The increase in heat exchange area can further enhance the cooling of the heated coolant flowing through the connecting seat 401 and the lifting heat pipe 404. At the same time, the hollow piston 410 and the pull rod 411 pull the movable baffle 412 at the opening of the circulation pump 31, so that the opening size of the circulation pump 31 becomes larger. When the pumping pressure of the circulation pump 31 is constant, the coolant can achieve faster heat exchange between the guide ring 32 and the flow path in the heat dissipation substrate 1, so as to achieve the purpose of being able to adjust the heat dissipation effect in real time as the heat level of the motherboard changes.

[0026] It is understood from common technical knowledge that the present invention may be implemented by other embodiments that do not depart from its spirit or essential features. Therefore, the embodiments disclosed above are, in all respects, merely illustrative and not exclusive. All modifications within the scope of the present invention or equivalent to the scope of the present invention are intended to be encompassed by the present invention.

Claims

1. A computer cooling device, characterized in that: The invention comprises a heat dissipation substrate (1), a heat conduction box (2), a circulation component (3) and an adjustment component (4), wherein the heat dissipation substrate (1) is a hollow structure and can be detachably mounted on a computer motherboard, the heat conduction box (2) is connected to the heat dissipation substrate (1), the circulation component (3) is mounted on the heat conduction box (2) and is used to circulate cooling water to the heat dissipation substrate (1), and the adjustment component (4) is also mounted on the heat conduction box (2) and is used to adjust the heat exchange area with the air and the delivery flow rate of the cooling water inside the heat dissipation substrate (1); The regulating assembly (4) comprises a connecting seat (401), a guide frame (402) and an air bag (403). The connecting seat (401) is mounted on the heat-conducting box (2). The connecting seat (401) is a hollow structure and is connected to the guide ring (32). The upper end of the connecting seat (401) is limitedly slidably connected to a lifting heat-conducting pipe (404). The upper end of the lifting heat-conducting pipe (404) is connected to an "I"-shaped connecting piece (405). The air bag (403) is mounted on the lower end of the connecting piece (405). The end of the connecting piece (405) is mounted with a sliding hollow ball (406). The guide frame (402) is mounted on the heat-conducting box (2). Two symmetrically arranged sliding grooves (407) are provided on the guide frame (402). The connecting member (405) is slidably arranged in the slide groove (407), and the opening limit tubes (408) are detachably installed on both sides of the connecting member (405). The sliding hollow ball (406) is slidably arranged in the opening limit tube (408), and springs (409) are provided on both sides of the sliding hollow ball (406) and both ends of the opening limit tube (408). A hollow piston (410) is slidably arranged at the lower end of the sliding hollow ball (406) close to the side of the circulation pump (31), and the lower end of the hollow piston (410) is hinged with a pull rod (411), and the other end of the pull rod (411) is slidably arranged with a movable baffle (412), and the other end of the movable baffle (412) is hinged on the opening of the circulation pump (31).

2. A computer heat dissipation device according to claim 1, characterized in that: The circulation assembly (3) comprises a circulation pump (31), a guide ring (32) and a guide pipe (33); the circulation pump (31) is mounted on the heat conduction box (2); the guide ring (32) is a circular ring structure, and its side end is connected to the circulation pump (31); the lower end of the guide ring (32) is connected to the heat dissipation substrate (1) through the guide pipe (33).

3. The computer heat dissipation device according to claim 1, wherein: The air bag (403) is placed in the lifting heat conduction pipe (404).

4. The computer heat dissipation device according to claim 1, wherein: The connecting piece (405) matches the opening of the opening limiting tube (408).

5. The computer heat dissipation device according to claim 1, wherein: The movable baffle (412) cooperates with the opening of the circulation pump (31).

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