Chip layout methods, apparatus, electronic devices and storage media

Abstract

This invention discloses a chip layout method, apparatus, electronic device, and storage medium, relating to the field of integrated circuit technology, which can improve the physical design integration of chips. The method includes: based on the chip's upper-layer design data, specializing a physically reused first instantiated module into two or more instantiated modules; establishing feedthrough connections passing through the two or more instantiated modules; adjusting the positions of the internal feedthrough connections; merging at least two of the instantiated modules into a second instantiated module; determining a first internal feedthrough connection in the second instantiated module to replace at least two adjusted internal feedthrough connections in the second instantiated module; and adjusting the positions of the external feedthrough connections of the second instantiated module to connect them to the first internal feedthrough connection. This invention is applicable to the physical design process of chips.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit technology, and in particular to a chip layout method, apparatus, electronic device, and storage medium. Background Technology

[0002] Currently, in order to improve design efficiency, a hierarchical design approach is often used to design large-scale chips. In the physical design process, a large number of feedthrough connections that pass through the lower-level instantiated modules often appear in the upper-level interconnection relationship.

[0003] If there are multiple physically reused low-level instantiated modules in the physical design, when feedthrough lines pass through these physically reused low-level instantiated modules multiple times, multiple different internal feedthrough lines will be generated within each low-level instantiated module. Of these, only one internal feedthrough line actually plays a functional role, while the others are useless in terms of functional logic but unnecessarily increase the chip area, thus reducing the integration density of the chip physical design. Summary of the Invention

[0004] In view of this, embodiments of the present invention provide a chip layout method, apparatus, electronic device, and storage medium, which can improve the physical design integration of chips.

[0005] In a first aspect, embodiments of the present invention provide a chip layout method, comprising: based on upper-layer design data of the chip, specializing a physically reused first instantiated module into two or more instantiated modules; establishing feedthrough connections passing through the two or more instantiated modules; the feedthrough connections include internal feedthrough connections located within the instantiated modules and external feedthrough connections located outside the instantiated modules; adjusting the position of the internal feedthrough connections so that the position of the internal feedthrough connections is within a preset spatial range; merging at least two of the instantiated modules into a second instantiated module; the second instantiated module having at least two adjusted internal feedthrough connections; based on the at least two adjusted internal feedthrough connections, determining a first internal feedthrough connection in the second instantiated module to replace the at least two adjusted internal feedthrough connections; adjusting the position of the external feedthrough connection of the second instantiated module to connect it to the first internal feedthrough connection.

[0006] Optionally, adjusting the position of the internal feedthrough connection line so that the position of the internal feedthrough connection line is within a preset spatial range includes: adjusting the position of the internal feedthrough connection line so that the internal feedthrough connection line is on the same metal layer; or, adjusting the position of the internal feedthrough connection line so that the internal feedthrough connection line is on the same metal layer at the same physical position; or, adjusting the position of the internal feedthrough connection line so that the internal feedthrough connection line is within a preset spatial range.

[0007] Optionally, determining the first internal feedthrough connection line in the second instantiation module based on the at least two adjusted internal feedthrough connection lines includes: determining whether the at least two adjusted internal feedthrough connection lines meet a preset merging condition; if the preset merging condition is met, then merging the internal feedthrough connection lines that meet the preset merging condition to obtain the first internal feedthrough connection line in the second instantiation module.

[0008] Optionally, the preset merging conditions include: each of the adjusted internal feedthrough connections has the same clock period and clock phase; each of the adjusted internal feedthrough connections has the same relay register planning; the physical location of each of the adjusted internal feedthrough connections is within a preset distance range; and / or the metal layers of each of the adjusted internal feedthrough connections are consistent.

[0009] Optionally, determining the first internal feedthrough connection line in the second instantiation module based on the at least two adjusted internal feedthrough connection lines includes: determining the positions of two connection ports corresponding to the first internal feedthrough connection line based on the positions of the connection ports of the at least two adjusted internal feedthrough connection lines; and determining the first internal feedthrough connection line according to the positions of the two connection ports.

[0010] Optionally, adjusting the position of the external feedthrough connection line of the second instantiation module includes: adjusting the position of the external feedthrough connection line of the second instantiation module according to the positions of the two connection ports.

[0011] Optionally, adjusting the position of the external feedthrough connection line of the second instantiated module includes adjusting the metal layer and physical position of the external feedthrough connection line of the second instantiated module.

[0012] Secondly, embodiments of the present invention provide a chip layout apparatus, comprising: a specialization module, configured to specialize a physically reused first instantiated module into two or more instantiated modules based on upper-layer design data of the chip; an establishment module, configured to establish feedthrough connection lines passing through the two or more instantiated modules; the feedthrough connection lines include internal feedthrough connection lines located within the instantiated modules and external feedthrough connection lines located outside the instantiated modules; a first adjustment module, configured to adjust the position of the internal feedthrough connection lines so that the position of the internal feedthrough connection lines is within a preset spatial range; a fusion module, configured to fuse at least two of the instantiated modules into a second instantiated module; the second instantiated module having at least two adjusted internal feedthrough connection lines; a replacement module, configured to determine a first internal feedthrough connection line in the second instantiated module based on the at least two adjusted internal feedthrough connection lines, to replace the at least two adjusted internal feedthrough connection lines; and a second adjustment module, configured to adjust the position of the external feedthrough connection lines of the second instantiated module so that they are connected to the first internal feedthrough connection lines.

[0013] Optionally, the first adjustment module includes: a first adjustment unit for adjusting the position of the internal feedthrough connection line so that the internal feedthrough connection line is in the same metal layer; or, a second adjustment unit for adjusting the position of the internal feedthrough connection line so that the internal feedthrough connection line is in the same physical position on the same metal layer; or, a third adjustment unit for adjusting the position of the internal feedthrough connection line so that the internal feedthrough connection line is located within a preset spatial range.

[0014] Optionally, the alternative module includes: a judgment unit, which judges whether the at least two adjusted internal feedthrough connection lines meet the preset merging conditions; and a merging unit, which, if the preset merging conditions are met, performs merging processing on the internal feedthrough connection lines that meet the preset merging conditions to obtain the first internal feedthrough connection line in the second instantiation module.

[0015] Optionally, the preset merging conditions include: each of the adjusted internal feedthrough connections has the same clock period and clock phase; each of the adjusted internal feedthrough connections has the same relay register planning; the physical location of each of the adjusted internal feedthrough connections is within a preset distance range; and / or the metal layers of each of the adjusted internal feedthrough connections are consistent.

[0016] Optionally, the alternative module includes: a first determining unit, used to determine the positions of two connection ports corresponding to the first internal feedthrough connection line based on the positions of the connection ports of the at least two adjusted internal feedthrough connection lines;

[0017] The second determining unit is used to determine the first internal feedthrough connection line based on the positions of the two connection ports.

[0018] Optionally, the second adjustment module is specifically used to: adjust the position of the external feedthrough connection line of the second instantiation module according to the position of the two connection ports.

[0019] Optionally, the second adjustment module is specifically used to: adjust the metal layer and physical location of the external feedthrough connection line of the second instantiation module.

[0020] Thirdly, embodiments of the present invention also provide an electronic device, the electronic device comprising: a housing, a processor, a memory, a circuit board, and a power supply circuit, wherein the circuit board is disposed within the space enclosed by the housing, and the processor and the memory are disposed on the circuit board; the power supply circuit is used to supply power to various circuits or devices of the above-mentioned electronic device; the memory is used to store executable program code; the processor runs a program corresponding to the executable program code by reading the executable program code stored in the memory, for executing any chip layout method provided in the embodiments of the present invention.

[0021] Fourthly, embodiments of the present invention also provide a non-transitory computer-readable storage medium storing one or more programs, which can be executed by one or more processors to implement any of the chip layout methods provided in the embodiments of the present invention.

[0022] The chip layout method, apparatus, electronic device, and storage medium provided in the embodiments of the present invention can, after specializing a physically multiplexed first instantiated module into two or more instantiated modules, adjust the positions of the internal feedthrough connections in each instantiated module to make the positions of the internal feedthrough connections as similar as possible. Then, multiple instantiated modules are merged to obtain a second instantiated module, thus each second instantiated module has multiple adjusted internal feedthrough connections. Based on these multiple adjusted internal feedthrough connections, a first internal feedthrough connection can be determined. Replacing multiple internal feedthrough connections in each second instantiated module with the first internal feedthrough connection reduces the number of internal feedthrough connections in each second instantiated module, thereby improving the integration density of the chip physical design. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram illustrating one connection method through a physical multiplexing instantiation module in some implementations;

[0025] Figure 2 A schematic flowchart of a chip layout method provided for an embodiment of the present invention;

[0026] Figure 3 This is a schematic diagram illustrating a physical connection method through an instantiated module in a specialized state, according to an embodiment of the present invention.

[0027] Figure 4 This is a schematic diagram illustrating the position adjustment of the internal feedthrough connection line of an instantiated module in a specialized state according to an embodiment of the present invention;

[0028] Figure 5 This is a schematic diagram illustrating the fusion of instantiation modules in a specialized state according to an embodiment of the present invention;

[0029] Figure 6 This is a schematic diagram illustrating the determination of a first internal feedthrough connection line in an embodiment of the present invention;

[0030] Figure 7 This is a schematic diagram illustrating the position adjustment of the external feedthrough connection line of the instantiated module in a specialized state according to an embodiment of the present invention;

[0031] Figure 8 A schematic diagram of a chip layout apparatus provided for an embodiment of the present invention;

[0032] Figure 9 This is a schematic diagram of the structure of an electronic device provided as an embodiment of the present invention. Detailed Implementation

[0033] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0034] It should be understood that the described embodiments are merely some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0035] To facilitate understanding of the technical solution of this application, a brief introduction to the relevant background knowledge will be given first.

[0036] The chip design process includes a logic design phase and a physical design phase. The logic design phase can be further divided into functional design, simulation design, and logic synthesis sub-phases. In the functional design phase, the chip functions to be implemented by the user are typically described using a hardware description language (e.g., Verilog or VHDL), forming Register Transfer Level (RTL) code. In the simulation verification phase, to ensure the correctness of the circuit function, a Verilog or VHDL circuit simulator can be used to verify the functional design described in the hardware description language. In the logic synthesis phase, for the functional design verified correctly in the simulation verification phase, logic synthesis tools can be used to translate, optimize, and map the functional design described in the hardware description language, generating a process-dependent netlist file. A netlist file is a file that records the connection relationships between logic gates and delay information. Logic synthesis is the bridge connecting the higher levels of the circuit and the physical implementation. The given constraints and the synthesized gate-level netlist are then sent to the back-end tools of the physical design phase for placement and routing.

[0037] The physical design phase includes a placement and routing sub-phase and an output sub-phase. In the placement and routing sub-phase, placement refers to the rational arrangement of the designed functional modules on the chip and the planning of their positions. Routing refers to completing the interconnecting lines between the functional modules. In the output sub-phase, a layout file is output to instruct the foundry on how to etch the silicon wafer, how to connect metals, etc. Of course, various auxiliary steps are involved in this process to ensure the correctness of the circuit.

[0038] In some implementations, such as Figure 1 As shown, if there are four reused instantiated modules B in the physical design, when feedthrough lines AC and DC pass through the four instantiated modules B respectively, since the attributes of the internal feedthrough lines of each instantiated module B (e.g., physical location, clock used, relay register planning, and metal layer) are not the same, four different internal feedthrough lines will be generated within each instantiated module B, such as... Figure 1 Lines 1, 2, 3 and 4 are shown in the diagram.

[0039] For each instantiated module B, only one internal feedthrough connection is truly functionally useful, while the other three internal feedthrough connections are not functionally useful. Specifically, Figure 1In the upper left instantiated module B, line 1 is the one that actually functions logically; in the lower left instantiated module B, line 2 is the one that actually functions logically; in the upper right instantiated module B, line 3 is the one that actually functions logically; and in the lower right instantiated module B, line 4 is the one that actually functions logically. Thus, each instantiated module B includes three redundant internal feedthrough connections. These redundant internal feedthrough connections are not functionally useful but unnecessarily increase the chip area, thereby reducing the integration density of the chip's physical design. In a first aspect, embodiments of the present invention provide a chip layout method that can improve the integration density of the chip's physical design.

[0040] like Figure 2 As shown, an embodiment of the present invention provides a chip layout method, which may include:

[0041] S11, based on the chip's upper-layer design data, specializes the first instanced module of physical reuse into two or more instanced modules;

[0042] Specifically, the first instantiated module can be any instantiated module in the chip. The upper-level design data generated during the hierarchical design of the chip (where "upper-level" refers to the lower-level instantiated modules; in this embodiment, "instantiated module" refers to the lower-level instantiated module) includes information about the number of times the first instantiated module is physically reused. Therefore, when specializing instantiated module B, the names of instantiated modules B that have been physically reused multiple times (e.g., 4 times) can be modified according to the chip's upper-level design data, for example, modified to B1, B2, B3, and B4 respectively, to achieve specialization of instantiated module B. Figure 3 As shown. After specialization, the four instanced modules B with physical reuse relationships are transformed into four independent single instanced modules, namely instanced module B1, instanced module B2, instanced module B3 and instanced module B4.

[0043] S12, establish feedthrough connections passing through the two or more instantiation modules; the feedthrough connections include internal feedthrough connections located in the instantiation modules and external feedthrough connections located outside the instantiation modules;

[0044] During upper-layer physical routing, when a physical connection line passes through an instantiated module, a feedthrough connection is formed. The instantiated module through which the connection line passes is called an intermediate instantiated module. Specifically, such as... Figure 3As shown, after determining the locations of each instantiated module (instantiated modules A, B1, B2, B3, B4, and C) in the physical design environment, physical routing is required between instantiated modules A and C due to the physical connection between them. The physical connection line between them will pass through instantiated modules B1 and B3, forming a feedthrough connection line AC. Similarly, when performing physical routing between instantiated modules D and C, the connection line between them will pass through instantiated modules B2 and B4, forming a feedthrough connection line DC.

[0045] like Figure 3 As shown, when feedthrough line AC passes through instantiation modules B1 and B3, an internal feedthrough line (denoted as line 1) is formed in instantiation module B1, and an internal feedthrough line (denoted as line 3) is also formed in instantiation module B3. Similarly, when feedthrough line DC passes through instantiation modules B2 and B4, an internal feedthrough line (denoted as line 2) is formed in instantiation module B2, and an internal feedthrough line (denoted as line 4) is also formed in instantiation module B4. Similarly, feedthrough lines located outside the instantiation modules are called external feedthrough lines. S13, adjust the position of the internal feedthrough lines so that the position of the internal feedthrough lines is within a preset spatial range;

[0046] The location information of the internal feedthrough connection includes its physical location within the instantiation module and its metal layer information. From Figure 3 As can be seen intuitively, lines 1 and 3 are in the same physical location, and lines 2 and 4 are in the same physical location. However, line 1 is located in the lower half of instantiation module B1, while line 2 is located in the upper half of instantiation module B2; their physical locations are not the same. Furthermore, the metal layers of lines 1, 2, 3, and 4 are arranged according to actual needs, so the metal layers of these four internal feedthrough connection lines may also be different.

[0047] In this embodiment, the purpose of specializing the physical reuse instantiation module is that, among the four independent instantiation modules B1, B2, B3 and B4, lines 1, 2, 3 and 4 are also independent of each other. The position of the internal feedthrough connection line in any one instantiation module can be adjusted individually without affecting the internal feedthrough connection lines in other instantiation modules. For example, when the position of line 1 in instantiation module B1 is adjusted, it will not affect lines 2, 3 and 4.

[0048] More specifically, the physical locations and metal layers of these four internal feedthrough connections can be adjusted to make them more similar, such as... Figure 4As shown. In one example, the positions of these four internal feedthrough connectors can be adjusted to a preset spatial range, thus facilitating the replacement of the adjusted internal feedthrough connectors in subsequent processes.

[0049] S14, at least two of the instantiation modules are merged into a second instantiation module; the second instantiation module has at least two adjusted internal feedthrough connection lines;

[0050] In this step, all or part of the four independent instantiation modules can be merged. Specifically, instantiation modules B1, B2, B3, and B4 can be merged. Alternatively, depending on the actual needs, two or three of instantiation modules B1, B2, B3, and B4 can be merged.

[0051] The following explanation uses the fusion of instantiation modules B1, B2, B3, and B4 as an example. If these four independent instantiation modules were designed separately, it would result in a greater workload and higher computational resource requirements during the physical design phase. To avoid this, instantiation modules B1, B2, B3, and B4 can be fused into a second instantiation module (which can be named Instantiation Module B, or any other name, such as Instantiation Module H; this embodiment does not limit this). This transforms the four independent single instantiation modules into a physically reused Instantiation Module B four times. After fusion, each Instantiation Module B has four internal feedthrough connection lines, namely the adjusted lines 1, 2, 3, and 4, as shown above. Figure 5 As shown.

[0052] S15, based on the at least two adjusted internal feedthrough connection lines, determine the first internal feedthrough connection line in the second instantiation module to replace the at least two adjusted internal feedthrough connection lines;

[0053] Continuing with the previous examples, such as Figure 5As shown, each instantiated module B has four internal feedthrough connection lines. Only one internal feedthrough connection line is needed in each instantiated module B to implement the logical connection function; the other three are redundant. Therefore, based on the adjusted positions of lines 1, 2, 3, and 4, a first internal feedthrough connection line (denoted as line X) can be determined to replace lines 1, 2, 3, and 4. Line X is essentially an internal feedthrough connection line determined after a compromise consideration of the adjusted positions of lines 1, 2, 3, and 4. After determining line X, the previous lines 1, 2, 3, and 4 can be deleted. Thus, as... Figure 6 As shown, each instantiated module B in this embodiment has only one line X. Compared with the prior art, where each instantiated module B has four internal feedthrough connection lines, the number of internal feedthrough connection lines in each instantiated module B is much smaller, thereby effectively reducing redundant internal feedthrough connection lines.

[0054] S16, adjust the position of the external feedthrough connection line of the second instantiation module so that it is connected to the first internal feedthrough connection line.

[0055] like Figure 7 As shown, after adjusting the position of the internal feedthrough connection line in each instantiated module B, it is also necessary to adjust the position of the external feedthrough connection line of each instantiated module B so that each external feedthrough connection line is connected to line X, thereby forming two new feedthrough connection lines ACN and DCN.

[0056] The chip layout method provided by embodiments of the present invention can, after specializing a physically multiplexed first instantiated module into two or more instantiated modules, adjust the positions of the internal feedthrough connections in each instantiated module to make the positions of the internal feedthrough connections as similar as possible. Then, multiple instantiated modules are merged to obtain a second instantiated module, thus each second instantiated module has multiple adjusted internal feedthrough connections. Based on these multiple adjusted internal feedthrough connections, a first internal feedthrough connection can be determined. Replacing multiple internal feedthrough connections in each second instantiated module with the first internal feedthrough connection reduces the number of internal feedthrough connections in each second instantiated module, thereby improving the integration density of the chip physical design.

[0057] Optionally, in one embodiment of the present invention, adjusting the position of the internal feedthrough connection line so that the position of the internal feedthrough connection line is within a preset spatial range (step S13) may include: adjusting the position of the internal feedthrough connection line so that the internal feedthrough connection line is in the same metal layer.

[0058] To facilitate the merging of different internal feedthrough connections, the metal layers where the internal feedthrough connections reside can be adjusted so that, after adjustment, the internal feedthrough connections are located on the same metal layer. For example, in instantiated module B1, line 1 is located on metal layer 1, instantiated module B2 on metal layer 2, instantiated module B3 on metal layer 9, and instantiated module B4 on metal layer 10. After considering the compromise of the metal layers where lines 1, 2, 3, and 4 reside, lines 1, 2, 3, and 4 can all be adjusted to metal layer 5.

[0059] Optionally, in one embodiment of the present invention, adjusting the position of the internal feedthrough connection line so that the position of the internal feedthrough connection line is within a preset spatial range (step S13) may include: adjusting the position of the internal feedthrough connection line so that the internal feedthrough connection line is in the same physical position on the same metal layer.

[0060] To facilitate the merging of different internal feedthrough connections, the metal layers and physical positions of the internal feedthrough connections can be adjusted so that, after adjustment, the internal feedthrough connections are located in the same physical position on the same metal layer. For example, in instantiated module B1, line 1 is located in the upper half of metal layer 1, instantiated module B2 is located in the lower half of metal layer 2, instantiated module B3 is located in the upper half of metal layer 9, and instantiated module B4 is located in the lower half of metal layer 10. After considering the compromise of the metal layers where lines 1, 2, 3, and 4 are located, lines 1, 2, 3, and 4 can all be adjusted to the middle part of metal layer 5.

[0061] Optionally, in one embodiment of the present invention, adjusting the position of the internal feedthrough connection line so that the position of the internal feedthrough connection line is within a preset spatial range (step S13) may include: adjusting the position of the internal feedthrough connection line so that the internal feedthrough connection line is within a preset spatial range.

[0062] When it is impossible to adjust the internal feedthrough connection lines to the same metal layer or the same physical position, in order to facilitate the merging of different internal feedthrough connection lines, the metal layer and physical position of the internal feedthrough connection lines can be adjusted so that after adjustment, the internal feedthrough connection lines are all located within a preset space range, thereby making the metal layer and physical position of each internal feedthrough connection line as close as possible.

[0063] Optionally, in one embodiment of the present invention, the step S15 of determining the first internal feedthrough connection line in the second instantiation module based on the at least two adjusted internal feedthrough connection lines may include: determining whether the at least two adjusted internal feedthrough connection lines meet a preset merging condition; if the preset merging condition is met, then merging the internal feedthrough connection lines that meet the preset merging condition to obtain the first internal feedthrough connection line in the second instantiation module.

[0064] In this embodiment, it can be determined whether multiple internal feedthrough connection lines in the instantiation module B meet the preset merging conditions, and then the internal feedthrough connection lines that meet the preset merging conditions are merged. In one example, if the four internal feedthrough connection lines 1, 2, 3, and 4 meet the merging conditions, they can be merged to obtain line X, so that line X can be used to replace these four internal feedthrough connection lines.

[0065] In another example, if lines 1 and 2 meet the merging condition, but neither meets the merging condition with lines 3 and 4, then lines 1 and 2 can be merged to obtain line Y, which can then be used to replace lines 1 and 2. For other internal feedthrough connections besides lines 1 and 2 (lines 3 and 4), it can be further determined whether lines 3 and 4 meet the merging condition. If so, they can be merged to obtain line Z, which can then be used to replace lines 3 and 4. If not, they are not merged.

[0066] Optionally, in one embodiment of the present invention, the preset merging conditions include: each of the adjusted internal feedthrough connections has the same clock period and clock phase; each of the adjusted internal feedthrough connections has the same relay register planning; the physical location of each of the adjusted internal feedthrough connections is within a preset distance range; and / or the metal layers of each of the adjusted internal feedthrough connections are consistent.

[0067] In this embodiment, each internal feedthrough connection line uses a clock signal, and each clock signal has a specific clock period and a specific clock phase. When lines 1, 2, 3, and 4 (e.g., ...) are connected, the clock signal is applied. Figure 5 When the clock periods and clock phases corresponding to these four internal feedthrough connections (as shown) are all the same, these four internal feedthrough connections can be merged. Depending on the actual design requirements, each internal feedthrough connection may have one or more relay registers, or it may not have any relay registers. When lines 1, 2, 3, and 4 (as shown) Figure 5When the relay register planning (specifically the number and location of relay registers) on these four internal feedthrough lines (as shown) is the same, these four internal feedthrough lines can be merged. The physical locations of each internal feedthrough line may be close together and within a preset distance range, or they may be far apart and not within a preset distance range. When lines 1, 2, 3, and 4 (as shown) are... Figure 5 When these four internal feedthrough connection lines (as shown) are within a preset distance range, they can be merged. The metal layers where each internal feedthrough connection line is located may be the same or different. When lines 1, 2, 3, and 4 (as shown) are within a preset distance range, they can be merged. Figure 5 When the four internal feedthrough connections are located on the same metal layer (e.g., all on the 5th metal layer), these four internal feedthrough connections can be merged. The optimal implementation in this application is to merge the internal feedthrough connections when all four conditions are met, to achieve the best effect.

[0068] Optionally, in one embodiment of the present invention, the step S15 of determining the first internal feedthrough connection line in the second instantiation module based on the at least two adjusted internal feedthrough connection lines may include: determining the positions of two connection ports corresponding to the first internal feedthrough connection line based on the positions of the connection ports of the at least two adjusted internal feedthrough connection lines; and determining the first internal feedthrough connection line according to the positions of the two connection ports.

[0069] like Figure 5 As shown, in instantiated module B, line 1, after being repositioned, has both left and right connection ports, specifically located at the intersections of the repositioned line 1 with the left and right boundaries of instantiated module B. The same applies to repositioned lines 2, 3, and 4. Therefore, instantiated module B has a total of 4 left connection ports and 4 right connection ports. Based on the positions of the 4 left connection ports (including metal layer and physical location), the position of the left connection port corresponding to line X (including metal layer and physical location) can be determined. Similarly, the position of the right connection port corresponding to line X (including metal layer and physical location) can also be determined based on the positions of the 4 right connection ports (including metal layer and physical location). Since line X and the two metal ports must be located on the same metal layer, and line X is the line segment uniquely determined by the two connection ports, the position of the right connection port corresponding to line X can be determined based on the metal layer and physical location of the two connection ports (e.g., Figure 6 The connection ports E and F shown in the diagram determine the metal layer and physical location of line X.

[0070] Optionally, in one embodiment of the present invention, adjusting the position of the external feedthrough connection line of the second instantiation module (step S16) may include: adjusting the position of the external feedthrough connection line of the second instantiation module according to the positions of the two connection ports.

[0071] like Figure 6 As shown, after determining the position of line X, it can be seen that the external feedthrough connection lines of instantiated module B (the parts of feedthrough connection line AC excluding line X and the parts of feedthrough connection line DC excluding line X) remain in their original positions and cannot be physically connected to line X. Therefore, the position of the external feedthrough connection lines of instantiated module B can be adjusted so that they connect to connection ports E and F of line X, thereby further enabling them to form a complete feedthrough connection line with line X, as shown. Figure 7 As shown.

[0072] Optionally, in one embodiment of the present invention, adjusting the position of the external feedthrough connection line of the second instantiation module may include adjusting the metal layer and physical position of the external feedthrough connection line of the second instantiation module.

[0073] In this embodiment, since the external feedthrough connection line of the instantiated module B needs to be on the same metal layer as the connection port E and the connection port F when physically connecting them, the metal layer where the external feedthrough connection line of the instantiated module B is located can be determined based on the metal layer where the connection port E corresponding to line X is located and the metal layer where the connection port F is located. Furthermore, the physical position of the external feedthrough connection line of the instantiated module B can be adjusted based on the physical position of the connection port E corresponding to line X and the physical position of the connection port F, so that it can connect with the connection port E and the connection port F.

[0074] Secondly, embodiments of the present invention provide a chip layout apparatus that can improve the physical design integration of chips.

[0075] like Figure 8As shown, embodiments of the present invention provide a chip layout apparatus, which may include: a specialization module 81, used to specialize a physically reused first instantiated module into two or more instantiated modules based on upper-layer design data of the chip; an establishment module 82, used to establish feedthrough connection lines passing through the two or more instantiated modules; the feedthrough connection lines include internal feedthrough connection lines located in the instantiated modules and external feedthrough connection lines located outside the instantiated modules; a first adjustment module 83, used to adjust the position of the internal feedthrough connection lines so that the position of the internal feedthrough connection lines is within a preset spatial range; a fusion module 84, used to fuse at least two of the instantiated modules into a second instantiated module; the second instantiated module has at least two adjusted internal feedthrough connection lines; a replacement module 85, used to determine a first internal feedthrough connection line in the second instantiated module based on the at least two adjusted internal feedthrough connection lines, to replace the at least two adjusted internal feedthrough connection lines; and a second adjustment module 86, used to adjust the position of the external feedthrough connection line of the second instantiated module so that it is connected to the first internal feedthrough connection line.

[0076] The chip placement apparatus provided in the embodiments of the present invention can, after specializing a physically multiplexed first instantiated module into two or more instantiated modules, adjust the positions of the internal feedthrough connections to make the positions of each internal feedthrough connection as similar as possible. Then, multiple instantiated modules are merged to obtain a second instantiated module, thus each second instantiated module has multiple adjusted internal feedthrough connections. Based on these multiple adjusted internal feedthrough connections, a first internal feedthrough connection can be determined. Replacing multiple internal feedthrough connections in each second instantiated module with the first internal feedthrough connection reduces the number of internal feedthrough connections in each second instantiated module, thereby improving the integration density of the chip physical design.

[0077] Optionally, in one embodiment of the present invention, the first adjustment module 83 includes: a first adjustment unit, configured to adjust the position of the internal feedthrough connection line so that the internal feedthrough connection line is in the same metal layer; or, a second adjustment unit, configured to adjust the position of the internal feedthrough connection line so that the internal feedthrough connection line is in the same physical position on the same metal layer; or, a third adjustment unit, configured to adjust the position of the internal feedthrough connection line so that the internal feedthrough connection line is located within a preset spatial range.

[0078] Optionally, in one embodiment of the present invention, the alternative module 85 includes: a judgment unit, for judging whether the at least two adjusted internal feedthrough connection lines meet the preset merging conditions; and a merging unit, for merging the internal feedthrough connection lines that meet the preset merging conditions if they are met, to obtain the first internal feedthrough connection line in the second instantiation module.

[0079] Optionally, in one embodiment of the present invention, the preset merging conditions include: each of the adjusted internal feedthrough connections has the same clock period and clock phase; each of the adjusted internal feedthrough connections has the same relay register planning; the physical location of each of the adjusted internal feedthrough connections is within a preset distance range; and / or the metal layers of each of the adjusted internal feedthrough connections are consistent.

[0080] Optionally, in one embodiment of the present invention, the alternative module 85 includes: a first determining unit, configured to determine the positions of two connection ports corresponding to the first internal feedthrough connection line based on the positions of the connection ports of the at least two adjusted internal feedthrough connection lines; and a second determining unit, configured to determine the first internal feedthrough connection line according to the positions of the two connection ports.

[0081] Optionally, in one embodiment of the present invention, the second adjustment module 86 is specifically used to: adjust the position of the external feedthrough connection line of the second instantiation module according to the position of the two connection ports.

[0082] Optionally, in one embodiment of the present invention, the second adjustment module 86 is specifically used to: adjust the metal layer and physical position of the external feedthrough connection line of the second instantiation module.

[0083] Thirdly, embodiments of the present invention provide an electronic device that can improve the physical design integration of chips.

[0084] like Figure 9As shown, an embodiment of the present invention provides an electronic device that may include: a housing 100, at least one processor 110, a memory 120, a circuit board 130, and a power supply circuit 140. The circuit board 130 is disposed within the space enclosed by the housing 100, and the processor 110 and the memory 120 are mounted on the circuit board 130. The power supply circuit 140 supplies power to various circuits or devices of the aforementioned server. The memory 120 stores executable program code. The processor 110 reads the executable program code stored in the memory 120 to run a program corresponding to the executable program code, for executing any of the chip layout methods provided in the foregoing embodiments. The specific execution process of the processor 110 of the above steps and the steps further executed by the processor 110 by running the executable program code can be found in the description of the foregoing embodiments, and will not be repeated here.

[0085] Fourthly, embodiments of the present invention also provide a non-transitory computer-readable storage medium, wherein the non-transitory computer-readable storage medium has one or more programs, which can be executed by one or more processors to implement any of the chip layout methods provided in the foregoing embodiments. The specific execution process of the processor on the above steps and the steps further executed by the processor by running executable program code can be found in the description of the foregoing embodiments, and will not be repeated here.

[0086] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0087] The various embodiments in this specification are described in a related manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0088] In particular, the device embodiment is basically similar to the method embodiment, so the description is relatively simple. For relevant details, please refer to the description of the method embodiment.

[0089] For ease of description, the above apparatus is described by dividing it into various functional units / modules. Of course, in implementing this invention, the functions of each unit / module can be implemented in one or more software and / or hardware.

[0090] Those skilled in the art will understand that all or part of the processes in the above embodiments can be implemented by a computer program instructing related hardware. The program can be stored in a computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. The storage medium can be a magnetic disk, optical disk, read-only memory (ROM), or random access memory (RAM), etc.

[0091] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A method of chip layout, characterized by, The chip layout method comprises the following steps: based on the chip-based upper layer design data, the first instantiated module of physical multiplexing is specialized into two or more instantiated modules; a feedthrough connection line is established through the two or more instantiated modules; the feedthrough connection line comprises internal feedthrough connection lines in the instantiated modules and external feedthrough connection lines outside the instantiated modules; the position of the internal feedthrough connection line is adjusted so that the position of the internal feedthrough connection line is within a preset spatial range; at least two of the instantiated modules are fused into a second instantiated module; the second instantiated module has at least two adjusted internal feedthrough connection lines; based on the at least two adjusted internal feedthrough connection lines, a first internal feedthrough connection line in the second instantiated module is determined to replace the at least two adjusted internal feedthrough connection lines; the position of the external feedthrough connection line of the second instantiated module is adjusted so that it is connected with the first internal feedthrough connection line.

2. The chip layout method according to claim 1, wherein the position of the internal feedthrough connection line is adjusted so that the position of the internal feedthrough connection line is within a preset spatial range, comprising: the position of the internal feedthrough connection line is adjusted so that the internal feedthrough connection line is in the same metal layer; or the position of the internal feedthrough connection line is adjusted so that the internal feedthrough connection line is in the same physical position on the same metal layer; or the position of the internal feedthrough connection line is adjusted so that the internal feedthrough connection line is within a preset spatial range.

3. The chip layout method according to claim 1, wherein based on the at least two adjusted internal feedthrough connection lines, the first internal feedthrough connection line in the second instantiated module is determined, comprising: determining whether the at least two adjusted internal feedthrough connection lines meet a preset merging condition; if the preset merging condition is met, the internal feedthrough connection lines meeting the preset merging condition are merged to obtain the first internal feedthrough connection line in the second instantiated module.

4. The chip layout method according to claim 3, wherein the preset merging condition comprises that each of the adjusted internal feedthrough connection lines has the same clock period and clock phase, each of the adjusted internal feedthrough connection lines has the same relay register planning, the physical positions of each of the adjusted internal feedthrough connection lines are within a preset distance range, and / or the metal layers of each of the adjusted internal feedthrough connection lines are consistent.

5. The chip layout method according to claim 1, wherein based on the at least two adjusted internal feedthrough connection lines, the first internal feedthrough connection line in the second instantiated module is determined, comprising: based on the positions of the connection ports of the at least two adjusted internal feedthrough connection lines, the positions of the two connection ports corresponding to the first internal feedthrough connection line are determined; the first internal feedthrough connection line is determined according to the positions of the two connection ports.

6. The chip layout method according to claim 5, wherein ​ ​ ​ ​ The adjusting the position of the external feedthrough connection line of the second instantiated module comprises: adjusting the position of the external feedthrough connection line of the second instantiated module according to the positions of the two connection ports.

7. The chip layout method of claim 6, wherein the adjusting the position of the external feedthrough connection line of the second instantiated module comprises: adjusting the metal layer and the physical position of the external feedthrough connection line of the second instantiated module. comprises:

8. A chip layout apparatus characterized by comprising: a instantiation module, configured to instantiate a first instantiated module into two or more instantiated modules based on upper layer design data of a chip; a establishing module, configured to establish a feedthrough connection line passing through the two or more instantiated modules; the feedthrough connection line comprises an internal feedthrough connection line in the instantiated module and an external feedthrough connection line outside the instantiated module; a first adjusting module, configured to adjust the position of the internal feedthrough connection line so that the position of the internal feedthrough connection line is within a preset spatial range; a fusion module, configured to fuse at least two of the instantiated modules into a second instantiated module; the second instantiated module has at least two adjusted internal feedthrough connection lines; a replacement module, configured to determine a first internal feedthrough connection line in the second instantiated module based on the at least two adjusted internal feedthrough connection lines, to replace the at least two adjusted internal feedthrough connection lines; a second adjusting module, configured to adjust the position of the external feedthrough connection line of the second instantiated module so that the external feedthrough connection line is connected to the first internal feedthrough connection line. The first adjusting module comprises:

9. The chip layout apparatus according to claim 8, wherein a first adjusting unit, configured to adjust the position of the internal feedthrough connection line so that the internal feedthrough connection lines are in the same metal layer; or a second adjusting unit, configured to adjust the position of the internal feedthrough connection line so that the internal feedthrough connection lines are in the same physical position on the same metal layer; or a third adjusting unit, configured to adjust the position of the internal feedthrough connection line so that the internal feedthrough connection lines are within a preset spatial range. The replacement module comprises:

10. The chip layout apparatus according to claim 8, wherein a judging unit, configured to judge whether the at least two adjusted internal feedthrough connection lines satisfy a preset merging condition; a merging unit, configured to, if the preset merging condition is satisfied, merge the internal feedthrough connection lines that satisfy the preset merging condition to obtain the first internal feedthrough connection line in the second instantiated module.

11. The chip layout apparatus of claim 10, wherein the preset merging condition comprises that the adjusted internal feedthrough connection lines have the same clock period and clock phase, the adjusted internal feedthrough connection lines have the same relay register planning, the physical positions of the adjusted internal feedthrough connection lines are within a preset distance range, and / or the metal layers of the adjusted internal feedthrough connection lines are consistent. The replacement module comprises: ​ 12. The chip layout apparatus according to claim 8, wherein ​ The first determining unit is configured to determine positions of two connection ports corresponding to a first internal feedthrough connection line based on positions of connection ports of the at least two adjusted internal feedthrough connection lines. The second determining unit is configured to determine the first internal feedthrough connection line according to the positions of the two connection ports.

13. The chip layout apparatus according to claim 12, wherein The second adjusting module is specifically configured to adjust a position of an external feedthrough connection line of the second instantiation module according to the positions of the two connection ports.

14. The chip layout apparatus according to claim 13, wherein The second adjusting module is specifically configured to adjust a metal layer and a physical position of the external feedthrough connection line of the second instantiation module.

15. An electronic device, comprising: The electronic device comprises a shell, a processor, a memory, a circuit board and a power supply circuit, wherein the circuit board is arranged inside a space enclosed by the shell, the processor and the memory are arranged on the circuit board; the power supply circuit is used for supplying power to each circuit or device of the electronic device; the memory is used for storing executable program codes; the processor runs programs corresponding to the executable program codes by reading the executable program codes stored in the memory, and is used for executing the chip layout method in any one of the preceding claims 1 to 7.

16. A non-transitory computer-readable storage medium, comprising: The non-transitory computer readable storage medium stores computer instructions for causing the computer to execute the chip layout method in any one of claims 1 to 7.

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