Liquid metal phase change cold plate low deformation structure for laser heat dissipation and method of use

Abstract

The application discloses a liquid metal phase change cold plate low-deformation structure for heat dissipation of a laser and a use method thereof, and relates to the technical field of laser cooling. The structure comprises a distributed liquid metal heat dissipation unit, which comprises a plurality of built-in phase change material filling cavities arranged in an equidistant array, liquid metal filled in the phase change material filling cavities and used for absorbing heat, and the phase change material filling cavities are arranged behind optical elements and are completely sealed by a cold plate inside the cold plate; a phase change expansion buffer unit, which comprises a sliding cavity, a sealing sliding plate in sliding connection with the sliding cavity and used for dynamically sealing the liquid metal in the phase change material filling cavities, and a buffer spring arranged inside the sliding cavity and used for elastically supporting the sealing sliding plate. The distributed placement of the phase change material filling cavities improves the mechanical strength of the cold plate and the utilization rate of the cold plate; and the characteristics of the phase state transformation of the liquid metal are utilized, so that the technical effects of temperature equalization, temperature control and heat dissipation are achieved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of laser thermal management, and more particularly relates to a liquid metal phase change cold plate low deformation structure for laser heat dissipation and a use method. BACKGROUND

[0002] Laser has great development potential in the future due to its advantages of high brightness, high directionality, high monochromaticity and high coherence. Due to the influence of photoelectric conversion efficiency, a large amount of heat will be generated in the photoelectric device of the laser equipment, and the performance of the photoelectric device will be sharply reduced if the heat is not timely discharged. At present, the heat dissipation modes of the photoelectric device mainly adopt air cooling and water cooling: air cooling is difficult to solve the heat dissipation problem of high-power laser equipment due to its low heat dissipation efficiency; although water cooling has the characteristics of high efficiency and mature technology, the water cooling thermal management system is too large in size, which limits the development of miniaturization and light weight of the laser equipment.

[0003] In order to solve the above technical problems, Chinese Invention Patent CN 113764963 A discloses a fiber laser device thermal control management device and fiber laser, which comprises a uniform temperature plate, a cooling module and a first metal module; the uniform temperature plate is arranged on the first side of the fiber laser device, the uniform temperature plate has a metal module placing groove, the uniform temperature plate has a refrigerant flow channel inside, the refrigerant flow channel is located on at least one side of the metal module placing groove, and the refrigerant flow channel is filled with refrigerant; the first metal module is located in the metal module placing groove, the first metal module comprises a first liquid metal and a first packaging part packaged outside the first liquid metal; the cooling module is arranged on one side of the uniform temperature plate, and the cooling module is used for absorbing the heat conducted by the fiber laser device through the uniform temperature plate; in addition, Chinese Utility Model Patent CN 209625139 U discloses a device for reducing the contact thermal resistance of a chip cold plate, which comprises a cold plate and a heat sink, a square slot is formed in the inside of the cold plate, and the square slot is filled with a liquid metal phase change heat absorption material; the cold plate is fixed on the heat sink.

[0004] In the above patent technical solutions, the liquid metal with high thermal conductivity is used to achieve good heat dissipation effect on the optoelectronic device, but there are still the following technical problems: (1) for the heat dissipation mode of the cold plate combined with the liquid metal, the continuous large-area filling will reduce the heat dissipation efficiency, and the expensive price of the liquid metal will increase the manufacturing cost, and the mechanical strength of the cold plate will be greatly weakened; (2) because the liquid metal has high hardness and strength in solid state, and the cold plate has ductility, when the liquid metal solidifies, a large local stress will be generated, and the expansion of the liquid metal will cause local deformation of the cold plate, which will cause poor contact between the optoelectronic device and the cold plate, the heat transfer performance will decrease sharply, and even the optoelectronic device will be damaged; (3) the cooling method described in the above patent cannot be well adapted to high-power laser equipment with short-time high-heat characteristics. The heat generation is pulse and periodic, and the recovery time of the laser equipment is obviously longer than the working time. If only the above cooling method is used, only the heat of the optical device can be taken away by real-time heat dissipation, and the refrigeration equipment of the high-power laser equipment cannot be miniaturized. SUMMARY

[0005] In view of the above defects or improvement needs of the prior art, the present application provides a liquid metal phase change cold plate low deformation structure for laser heat dissipation, which effectively improves the mechanical strength of the cold plate and the utilization rate of the liquid metal cold plate by distributing the phase change material filling cavity. The cold plate is filled with liquid metal with good thermal conductivity and large latent heat per unit volume at normal temperature, which can effectively control the temperature of the optoelectronic device. By using the large latent heat characteristics of the liquid metal when it changes phase at constant temperature, the liquid metal has good heat absorption, heat storage and temperature uniformity, and does not need external refrigeration and driving equipment. Since the high-power laser equipment has the characteristics of short-time high-heat, the heat generation is pulse and periodic, and the recovery time of the laser equipment is obviously longer than the working time, the phase change heat dissipation technology can absorb the large amount of heat released by the optoelectronic device in the laser equipment in a short time by using the phase change latent heat, and then the heat is discharged through a certain time to restore to the initial state, thereby effectively achieving the technical effects of temperature uniformity, temperature control and heat dissipation. Including:

[0006] According to one aspect of the present application, a liquid metal phase change cold plate low deformation structure for laser heat dissipation is provided, comprising:

[0007] The distributed liquid metal heat dissipation unit comprises a cold plate with a plurality of built-in phase change material filling cavities arranged in an equidistant array, and liquid metal filled in the phase change material filling cavities for absorbing heat. The cold plate is vertically placed, and the phase change material filling cavities are arranged behind the optical element and completely sealed inside the cold plate.

[0008] The phase change expansion buffering unit comprises a sliding cavity connected to a phase change material filling cavity below, a sealing sliding plate in sliding connection with the sliding cavity and serving as a dynamic seal for the liquid metal in the phase change material filling cavity, and a buffering spring arranged inside the sliding cavity and serving as an elastic support for the sealing sliding plate.

[0009] Further, the liquid metal phase change cold plate low deformation structure for laser heat dissipation further comprises:

[0010] A water cooling unit arranged inside the cold plate and behind the phase change material filling cavity, comprising a flow channel arranged in a serpentine shape behind the phase change material filling cavity, a cooling liquid inlet and a cooling liquid outlet arranged on the side surface of the cold plate and respectively used for inputting and outputting the cooling liquid, and the phase change material filling cavity and the flow channel are in a non-communicating state.

[0011] Further, the flow channel horizontally passes behind each phase change material filling cavity and is arranged at the central position in the height direction of each phase change material filling cavity.

[0012] Further, two groups of liquid metal heat dissipation units, phase change expansion buffering units and water cooling units for dissipating heat of the optoelectronic device are symmetrically arranged in front of and behind the middle plane of the cold plate.

[0013] Further, the liquid metal is gallium-tin-indium.

[0014] Further, the volume of the liquid metal filled in the phase change material filling cavity is not more than 95% to 98% of the total volume of the phase change material filling cavity.

[0015] Further, the cold plate material is high-thermal-conductivity copper.

[0016] According to the second aspect of the present application, a use method of a liquid metal phase change cold plate low deformation structure for laser heat dissipation is provided, comprising the following steps:

[0017] S100: When the laser equipment is working, the heat generated by the optical element is indirectly conducted to the phase change material filling cavity inside the cold plate with high thermal conductivity, so that the heat is absorbed by the liquid metal in the phase change material filling cavity, and the liquid metal is phase changed from a solidified state to a liquid state, thereby temporarily storing the heat;

[0018] S200: When the laser equipment stops working, the liquid metal is phase changed from a liquid state to a solidified state and releases the heat therein, thereby effectively dissipating heat of the optical element;

[0019] S300: During the process of liquid metal changing from a liquid phase to a solid state, the liquid metal itself expands, thereby squeezing the inner wall of the phase change material filling cavity. At this time, the liquid metal will squeeze the sealing sliding plate located below the phase change material filling cavity, thereby pushing the sealing sliding plate to move downward along the sliding cavity, and then pushing the built-in multiple buffer springs to be compressed. This achieves the absorption of the expansion of the liquid metal, avoiding the technical problem that the expansion of the liquid metal causes local deformation of the cold plate, resulting in poor contact between the optoelectronic device and the cold plate, a sharp drop in heat transfer performance, or even damage to the optoelectronic device.

[0020] Furthermore, step S300 includes the following steps:

[0021] S301: Based on the characteristics of the periodic working mode of high-power laser equipment, the heat generation is pulsed and periodic. The recovery time of the laser equipment is significantly longer than the working time. When the laser equipment is in standby mode, the water cooling unit is activated, and the coolant is input from the coolant inlet, thus entering the flow channel and being output from the coolant outlet. During the process, the coolant will carry away the heat of the liquid metal, thereby achieving efficient heat dissipation.

[0022] S302: When the laser equipment is in operation, the water cooling unit is turned off, so that the liquid metal temporarily stores the heat generated by the laser equipment. This effectively avoids the obstacle to the miniaturization of high-power laser equipment that would be required if the water cooling unit were to operate in real time.

[0023] In summary, compared with the prior art, the above-described technical solutions conceived by this invention can achieve the following beneficial effects:

[0024] 1. The present invention provides a low-deformation structure for a liquid metal phase change cold plate for laser heat dissipation. By distributing the phase change material filling cavity, and by utilizing the adaptiveness of elastic elements, a dynamically adjustable structure composed of multiple small springs and sealing strips is designed. Specifically, a phase change expansion buffer unit is installed at the bottom of the phase change material filling cavity 101, thereby effectively avoiding local deformation of the cold plate caused by a certain degree of volume expansion when the liquid metal changes from a liquid phase to a solid state. This ensures effective contact between the laser optoelectronic devices and the cold plate, improving the heat dissipation performance of the laser.

[0025] 2.The low-deformation structure of a liquid metal phase change cold plate for heat dissipation of a laser device, which realizes the circulation of heat dissipation of an optoelectronic device by filling liquid metal in the cold plate and combining a heat exchange channel.

[0026] 3.The low-deformation structure of a liquid metal phase change cold plate for heat dissipation of a laser device, which effectively improves the mechanical strength of the cold plate and the utilization rate of the liquid metal cold plate by distributing the phase change material filling cavity. BRIEF DESCRIPTION OF DRAWINGS

[0027] Fig. 1 FIG. 1 is a front view of the overall structure of the low-deformation structure of a liquid metal phase change cold plate for heat dissipation of a laser device according to an embodiment of the present application.

[0028] Fig. 2 FIG. 2 is a side view of the overall structure of the low-deformation structure of a liquid metal phase change cold plate for heat dissipation of a laser device according to an embodiment of the present application.

[0029] Fig. 3 FIG. 3 is a schematic diagram of the overall structure of the phase change expansion buffer unit of the low-deformation structure of a liquid metal phase change cold plate for heat dissipation of a laser device according to an embodiment of the present application.

[0030] Fig. 4 FIG. 4 is a flowchart of the use method of the low-deformation structure of a liquid metal phase change cold plate for heat dissipation of a laser device according to an embodiment of the present application.

[0031] Fig. 5 This is a flowchart illustrating the usage method of step S300 of a liquid metal phase change cold plate low-deformation structure for laser heat dissipation according to an embodiment of the present invention.

[0032] In all the accompanying drawings, the same reference numerals denote the same technical features, specifically: 1-cold plate, 101-phase change material filling cavity, 2-phase change expansion buffer unit, 201-sealed sliding plate, 202-sliding cavity, 203-buffer spring, 3-water cooling unit, 301-flow channel, 302-coolant outlet, 303-coolant inlet, 4-optoelectronic device. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention. Furthermore, the technical features involved in the various embodiments of this invention described below can be combined with each other as long as they do not conflict with each other.

[0034] like Figs. 1-3 As shown in the embodiment of the present invention, the low-deformation structure of the liquid metal phase change cold plate for laser heat dissipation includes:

[0035] A distributed liquid metal heat dissipation unit includes a cold plate 1 with multiple built-in phase change material filling cavities 101 arranged in an equally spaced array, and liquid metal filled inside the phase change material filling cavities 101 for absorbing heat. The cold plate 1 is placed vertically, and the phase change material filling cavities 101 are located behind the optical element and inside the cold plate 1 and are completely sealed by the cold plate 1.

[0036] The phase change expansion buffer unit 2 includes a sliding cavity 202 that is connected to the bottom of the phase change material filling cavity 101, a sealing sliding plate 201 that is slidably connected to the sliding cavity 202 and plays a dynamic sealing role for the liquid metal in the phase change material filling cavity 101, and a buffer spring 203 that is disposed inside the sliding cavity 202 and plays an elastic support role for the sealing sliding plate 201.

[0037] In the embodiment of the present application, by distributing the phase change material filling cavity, the mechanical strength of the cold plate and the utilization rate of the liquid metal cold plate are effectively improved; the liquid metal with good thermal conductivity and large latent heat per unit volume at room temperature is filled in the cold plate, which can effectively control the temperature of the optoelectronic device. By utilizing the large latent heat of the liquid metal when it changes phase at a constant temperature, it has good heat absorption, heat storage and temperature uniformity, and does not need external refrigeration and driving equipment. Since the high-power laser equipment has the characteristics of short-time high heating, the heating is in pulse and periodic, and the recovery time of the laser equipment is significantly longer than the working time. The phase change heat dissipation technology can absorb the large amount of heat released by the optoelectronic device of the laser equipment in a short time through the phase change latent heat, and then the heat is conducted out in a certain time to restore to the initial state, thereby effectively achieving the technical effects of temperature uniformity, temperature control and heat dissipation.

[0038] At the same time, by means of the self-adaptability of the elastic element, a dynamic adjustable structure composed of multiple small springs and sealing slats is designed, that is, a phase change expansion buffer unit is installed at the bottom of the phase change material filling cavity 101, thereby effectively avoiding the local deformation of the cold plate caused by the volume expansion of the liquid metal when it changes from a liquid phase to a solid state, and ensuring the effective contact of the laser optoelectronic device with the cold plate and improving the laser heat dissipation performance.

[0039] The working principle of the embodiment of the present application is as follows: when the laser equipment works, the heat generated by the optical element is indirectly conducted to the phase change material filling cavity in the cold plate through the cold plate with high thermal conductivity, and then absorbed by the liquid metal in the phase change material filling cavity, so that the liquid metal changes from a solid state to a liquid state, thereby temporarily storing heat; then, when the laser equipment stops working, the liquid metal changes from a liquid state to a solid state and releases the heat therein, thereby effectively dissipating heat from the optical element; then, during the process of the liquid metal changing from a liquid state to a solid state, the liquid metal itself expands, thereby extruding the inner wall of the phase change material filling cavity, at this time, the liquid metal extrudes the sealing sliding plate arranged below the phase change material filling cavity, thereby pushing the sealing sliding plate to move downward along the sliding cavity, and then pushing the multiple buffer springs built-in to be compressed, thereby absorbing the expansion amount of the liquid metal, avoiding the local deformation of the cold plate caused by the expansion of the liquid metal, resulting in poor contact between the optoelectronic device and the cold plate, sharp decline in heat transfer performance, and even damage to the optoelectronic device.

[0040] As shown in FIG. Figs. 1-2 The liquid metal phase change cold plate with low deformation structure for laser heat dissipation in the embodiment of the present application further comprises:

[0041] The water-cooling unit 3 is located inside the cold plate 1 and behind the phase change material filling cavity 101. It includes a flow channel 301 arranged in a serpentine manner behind the phase change material filling cavity 101, a coolant inlet 303 and a coolant outlet 302 located on the side of the cold plate 1 for inputting and outputting coolant, respectively. The phase change material filling cavity 101 and the flow channel 301 are not connected.

[0042] like Fig. 2 As shown, in this embodiment of the invention, the flow channel 301 passes horizontally behind each phase change material filling cavity 101 and is located at the center of the height direction of each phase change material filling cavity 101.

[0043] In this embodiment of the invention, by filling a cold plate with liquid metal and combining it with a heat exchange channel, cyclic heat dissipation for the optoelectronic device can be achieved. When the optoelectronic device is working, heat is transferred to the liquid metal through the cold plate, and the liquid metal changes from solid to liquid, storing the heat for a short time. Based on the characteristics of the periodic working mode of high-power laser equipment, filling the cold plate with phase change material achieves short-term heat storage, which is beneficial to the miniaturization of high-power laser equipment. In standby mode, the heat stored in the liquid metal is carried away by low-temperature water, restoring it to its initial state. In addition, by setting the relative position of the flow channel and the phase change material filling cavity 101, the liquid metal expands from the middle to the upper and lower sides and from the side near the flow channel towards the optoelectronic device when it solidifies, which can reduce the amount of liquid metal expansion in the downward confinement space direction.

[0044] The working principle of this invention is as follows: Based on the characteristics of the periodic operation mode of high-power laser equipment, heat generation is pulsed and periodic. The recovery time of the laser equipment is significantly longer than the working time. When the laser equipment is in standby mode, the water-cooling unit is activated, and coolant is input from the coolant inlet 303, entering the flow channel 301 and exiting from the coolant outlet 302. During this process, the coolant carries away the heat from the liquid metal, thus achieving efficient heat dissipation. Then, when the laser equipment is in operation, the water-cooling unit is turned off, allowing the liquid metal to temporarily store the heat generated by the laser equipment. This effectively avoids the need for a more powerful cooling device if the water-cooling unit were to operate continuously, thus preventing any obstacles to the miniaturization of high-power laser equipment.

[0045] like Fig. 2 As shown in this embodiment of the invention, the low-deformation structure of the liquid metal phase change cold plate for laser heat dissipation includes:

[0046] The cold plate 1 has two sets of liquid metal heat dissipation units, phase change expansion buffer units 2 and water cooling units 3, which are symmetrically arranged on the front and back of the middle plane for dissipating heat from the optoelectronic device 4.

[0047] In the embodiment of the present application, the liquid metal is gallium-tin-indium.

[0048] In the embodiment of the present application, the volume of the liquid metal filled in the phase change material filling cavity 101 is not more than 95% to 98% of the total volume of the phase change material filling cavity, preferably 97%.

[0049] In the embodiment of the present application, the material of the cold plate 1 is high-thermal-conductivity copper.

[0050] As shown in the embodiment of the present application, the method for using the low-deformation structure of the liquid metal phase change cold plate for heat dissipation of a laser device comprises the following steps: Fig. 4

[0051] S100: When the laser device is working, the heat generated by the optical element is indirectly conducted to the phase change material filling cavity in the cold plate through the cold plate with high thermal conductivity, so that the heat is absorbed by the liquid metal in the phase change material filling cavity, and the liquid metal is phase changed from a solidified state to a liquid state, thereby temporarily storing the heat;

[0052] S200: When the laser device stops working, the liquid metal is phase changed from a liquid state to a solidified state and releases the heat therein, thereby effectively dissipating heat for the optical element;

[0053] S300: During the phase change of the liquid metal from a liquid state to a solidified state, the liquid metal itself expands, thereby extruding the inner wall of the phase change material filling cavity, at this time, the liquid metal extrudes the sealing sliding plate arranged below the phase change material filling cavity, thereby pushing the sealing sliding plate to move downward along the sliding cavity, and further pushing the plurality of buffer springs built-in to be compressed, thereby absorbing the expansion amount of the liquid metal, avoiding the technical problems that the expansion of the liquid metal causes local deformation of the cold plate, resulting in poor contact between the optoelectronic device and the cold plate, sharp decline in heat transfer performance, and even damage to the optoelectronic device.

[0054] As shown in the embodiment of the present application, the step S300 comprises the following steps: Fig. 5

[0055] S301: According to the characteristics of the periodic working mode of the high-power laser device, the heat generation is in a pulse and periodic manner, and the recovery time of the laser device is obviously longer than the working time, when the laser device is in standby state, the water cooling unit is started, the cooling liquid is input from the cooling liquid inlet 303, thereby entering the flow channel 301, and is output from the cooling liquid outlet 302, in the process, the cooling liquid takes away the heat of the liquid metal, thereby realizing efficient heat dissipation;

[0056] ​​S302: when the laser equipment is in working state, the water cooling unit is closed, so that the liquid metal temporarily stores the heat generated by the laser equipment, thereby effectively avoiding the hindrance to the miniaturization of the high-power laser equipment if the water cooling unit needs a larger power refrigeration device to work in real time.

[0057] Those skilled in the art can understand that the above description is only the preferred embodiment of the present application, and is not intended to limit the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A liquid metal phase change cold plate low deformation structure for heat dissipation of a laser, characterized in that, It comprises: A distributed liquid metal heat dissipation unit, which comprises a cold plate (1) with an equidistant array of a plurality of phase change material filling cavities (101), and liquid metal filled in the phase change material filling cavities (101) for absorbing heat, the cold plate (1) is vertically placed, the phase change material filling cavities (101) are arranged behind the optical element and are completely sealed inside the cold plate (1); A phase change expansion buffer unit (2) comprising a sliding cavity (202) connected to the phase change material filling cavities (101) below, a sealing sliding plate (201) slidingly connected with the sliding cavity (202) and serving as a dynamic seal for the liquid metal in the phase change material filling cavities (101), and a buffer spring (203) arranged inside the sliding cavity (202) and serving as an elastic support for the sealing sliding plate (201); It further comprises: A water cooling unit (3) arranged inside the cold plate (1) and behind the phase change material filling cavities (101), which comprises a flow channel (301) arranged behind the phase change material filling cavities (101) in a serpentine shape, a cooling liquid inlet (303) and a cooling liquid outlet (302) arranged on the side of the cold plate (1) and respectively used for inputting and outputting cooling liquid, and the phase change material filling cavities (101) and the flow channel (301) are in a non-communicating state; It further comprises: The cold plate (1) is symmetrically provided with two groups of liquid metal heat dissipation units, phase change expansion buffer units (2) and water cooling units (3) for dissipating heat from the optoelectronic device (4) on both sides of the middle plane.

2. The liquid metal phase change cold plate low deformation structure for laser heat dissipation according to claim 1, wherein: The flow channel (301) horizontally passes behind each phase change material filling cavity (101) and is arranged at the central position of each phase change material filling cavity (101) in the height direction.

3. The liquid metal phase change cold plate low deformation structure for laser heat dissipation of claim 1, wherein: The liquid metal is gallium-tin-indium.

4. The liquid metal phase change cold plate low deformation structure for heat dissipation of a laser according to claim 1, characterized in that: The volume of the liquid metal filled in the phase change material filling cavity (101) is not more than 95%-98% of the total volume of the phase change material filling cavity.

5. The liquid metal phase change cold plate low deformation structure for heat dissipation of a laser according to claim 1 or 4, characterized in that: The cold plate (1) is made of high thermal conductivity copper.

6. A method for using a liquid metal phase change cold plate low deformation structure for laser heat dissipation, implemented by using a liquid metal phase change cold plate low deformation structure for laser heat dissipation according to any one of claims 1-5, characterized in that, The steps comprise: S100: When the laser equipment is working, the heat generated by the optical element is indirectly conducted to the phase change material filling cavities inside the cold plate through the cold plate with high thermal conductivity, so that the heat is absorbed by the liquid metal in the phase change material filling cavities, the liquid metal is changed from solidification to liquid state, and the heat is temporarily stored; S200: When the laser equipment stops working, the liquid metal changes from liquid state to solidification state and releases the heat therein, thereby effectively dissipating heat from the optical element; S300: Because the liquid metal expands during the process of changing from liquid phase to solidification state, the liquid metal extrudes the inner wall of the phase change material filling cavity, at this time, the liquid metal extrudes the sealing sliding plate arranged below the phase change material filling cavity, thereby pushing the sealing sliding plate to move downward along the sliding cavity, and further pushing the multiple buffer springs built-in to be compressed, thereby absorbing the expansion amount of the liquid metal, avoiding the technical problem that the local deformation of the cold plate caused by the expansion of the liquid metal leads to poor contact between the optoelectronic device and the cold plate, sharp decline of heat transfer performance, and even damage of the optoelectronic device.

7. The method of claim 6, wherein the method further comprises: The step S300 comprises the following steps: S301: According to the characteristics of the periodic working mode of the high-power laser equipment, the heat is in pulse and periodic, and the recovery time of the laser equipment is obviously longer than the working time. When the laser equipment is in standby state, the water cooling unit is started, the cooling liquid is input from the cooling liquid inlet, thereby entering the flow channel, and is output from the cooling liquid outlet. In the process, the cooling liquid takes away the heat of the liquid metal, thereby realizing efficient heat dissipation; S302: When the laser equipment is in working state, the water cooling unit is closed, so that the liquid metal temporarily stores the heat generated by the laser equipment, thereby effectively avoiding the need for larger power refrigeration equipment if the water cooling unit works in real time, thereby hindering the miniaturization of the high-power laser equipment.

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