Acoustic wave attenuator for electronic devices

Abstract

The present disclosure relates to acoustic wave attenuators for electronic devices. The invention provides an acoustic device comprising: a housing defining an acoustic port and an acoustic passageway between the acoustic port and a transducer coupled to the housing; and an array of attenuators acoustically coupled to the acoustic passageway to absorb ultrasonic waves.

Description

[0001] Cross-reference to related applications

[0002] This application is a non-provisional application of co-pending U.S. Provisional Patent Application No. 63 / 245,570, filed on September 17, 2021, and incorporated herein by reference. Technical Field

[0003] One aspect of this disclosure relates to an attenuator array for absorbing ultrasonic waves within an electronic device. Other aspects are also described and protection is claimed for those aspects. Background Technology

[0004] Portable communication or listening devices (e.g., smartphones, headsets, etc.) have one or more transducers that convert an input electro-audio signal into a sound pressure level (SPL) wave output audible to a user, or convert an SPL input into an electro-audio signal. The transducer (e.g., a speaker) can be used to output SPL waves corresponding to the voice of a remote user (such as during a phone call), or to output SPL waves corresponding to sounds associated with a game the user wants to play or music they want to play. Due to the relatively thin form factor of portable devices, the transducers also have a relatively thin form factor, which can make it difficult to maintain optimal sound quality. Furthermore, ultrasonic waves emitted from environmental devices can induce subharmonics within the audio bandwidth of the transducer (e.g., a microphone), which is undesirable for system applications. Additionally, resonances within the device can amplify the amplitude of ultrasonic waves, potentially increasing the amplitude of subharmonics. Summary of the Invention

[0005] One aspect of this disclosure relates to an arrangement of a resonator or attenuator for absorbing ultrasonic waves within an electronic device. Typically, ultrasonic waves emitted from various devices, including occupancy sensors, coffee grinders, automobiles, insect repellents, etc., may induce subharmonics within the audio bandwidth of a transducer (e.g., a microphone), which is undesirable for system applications such as active noise cancellation (ANC). Furthermore, in some cases, the way a transducer (e.g., a microphone) is integrated into a device can cause resonance that amplifies the amplitude of the ultrasonic waves, thereby increasing the amplitude of the subharmonics. Therefore, aspects of this disclosure relate to an arrangement of a resonator or attenuator for attenuating (e.g., absorbing) broadband ultrasonic frequencies and thus suppressing subharmonics in the audio band. Each of the resonators or attenuators may have a specific size, geometry, volume, etc., and may employ a specific arrangement selected for attenuating different broadband ultrasonic frequencies. Typically, in one aspect, the attenuator may be a Helmholtz resonator (HR) that is ten to forty times smaller than the wavelength of the ultrasonic frequency. For example, in the case of an ultrasonic frequency wavelength of about 2 cm or less, the HR may have a length dimension of 0.2 cm or less. In this respect, due to their relatively small size, attenuators may be referred to herein as subwavelength attenuators or micro attenuators. In some aspects, resonators can be arranged in an array, where each resonator is spatially positioned in an asymmetric stepped pattern with complementary anti-resonators. The pattern can be selected to absorb energy most efficiently and to capture acoustic energy with characteristics much smaller than the wavelength. The spatial distribution of the pattern and the number of attenuators can be optimized to maximize attenuation effectiveness. In some aspects, the attenuator pattern can be coupled to at least two surfaces of the acoustic channel or pathway between the transducer and the acoustic port to increase absorption. For example, in some aspects, the attenuator pattern can be arranged around the acoustic port, and in some aspects, the attenuator pattern can be formed within a substrate defining the acoustic port, such as through microelectromechanical (MEMS) fabrication operations. The pattern provides unique spatial spectral control. Furthermore, in other aspects, a controllable valve can be coupled to the attenuator for dynamically adjustable response. Furthermore, compared to other common solutions such as low-pass filters and acoustic meshes, the attenuator arrangement disclosed in this paper introduces a negligible phase delay within the audio frequency band. This aspect is advantageous for audio signal processing algorithms such as those used in ANC applications.

[0006] In some aspects, an acoustic device is provided, comprising: a housing defining an acoustic port and an acoustic path between the acoustic port and a transducer coupled to the housing; and an attenuator array acoustically coupled to the acoustic path to absorb ultrasonic waves. The attenuator array may include a first series of attenuators arranged by volume and a second series of attenuators arranged by volume in the reverse order of the first series of attenuators. The attenuator array may include a first series of attenuators arranged by their dimensions to be suitable for the frequency of the ultrasonic waves absorbed, and a second series of attenuators arranged by their dimensions to be suitable for the frequency of the ultrasonic waves absorbed, in the reverse order of the first series of attenuators. In some aspects, the attenuator array may include a first series of attenuators arranged by size and a second series of attenuators arranged by size in the reverse order of the first series of attenuators. In some aspects, the size is a length dimension, and the first series of attenuators is arranged in a first column by increasing the length, and the second series of attenuators is arranged in a second column adjacent to the first column by decreasing the length. In some aspects, each attenuator in the attenuator array includes a body portion acoustically coupled to the acoustic path via a neck portion, and wherein the length dimension of the body portion of each attenuator differs from the length dimension of the adjacent attenuator. In some aspects, the length dimension is at least ten times smaller than at least one ultrasonic wave. The attenuator array may include a first attenuator column, a second attenuator column arranged in the reverse order of the first attenuator column, and a third attenuator column arranged in the reverse order of the second attenuator column. In some aspects, the attenuator array is a first attenuator array acoustically coupled to a first side of the acoustic path, and the device further includes a second attenuator array acoustically coupled to a second side of the acoustic path. In some aspects, the transducer is a microphone, and the attenuator array absorbs ultrasonic waves in the frequency range of 20 kHz to 100 kHz.

[0007] In another aspect, an acoustic device is provided, comprising: a housing defining an acoustic port and an acoustic path located between the acoustic port and a transducer coupled to the housing; and a first series of attenuators and a second series of attenuators arranged asymmetrically relative to each other along the acoustic path to absorb ultrasonic waves. In some aspects, each of the first and second series of attenuators comprises at least two attenuators sized to absorb ultrasonic waves in different frequency ranges, and the at least two attenuators of the first series of attenuators are arranged in the reverse order of the attenuators of the second series of attenuators. In some aspects, each attenuator in the first series of attenuators is arranged according to a length dimension, and each attenuator in the second series of attenuators is arranged according to a length dimension in the reverse order of the first series of attenuators. In some aspects, the first and second series of attenuators are arranged along a first side of the acoustic path, and the device further comprises a third series of attenuators arranged along the first side of the acoustic path in the reverse order of the second series of attenuators. In some aspects, a fourth series of attenuators and a fifth series of attenuators arranged along a second side of the acoustic path are also provided.

[0008] In some aspects, a method of manufacturing a transducer assembly is also provided, the method comprising: providing a transducer assembly having a substrate having an acoustic path defining an acoustic port; and coupling an arrangement of attenuators to the substrate to absorb ultrasonic waves within the acoustic path. In some aspects, the attenuator arrangement includes a Helmholtz resonator formed within the substrate, wherein the Helmholtz resonator is sized to absorb ultrasonic waves in at least two different frequency ranges. The attenuator arrangement may include an array of attenuators formed in an insert, and the insert is attached to the substrate. In some aspects, the insert is attached to the top or bottom side of the substrate. In other aspects, the insert is embedded within the substrate.

[0009] The above overview does not include an exhaustive list of all aspects of this disclosure. It is contemplated that the invention encompasses all systems and methods that can be implemented by all suitable combinations of the aspects outlined above and the various aspects disclosed in the detailed embodiments below and specifically pointed out in the claims filed with this patent application. Such combinations have specific advantages not specifically described in the above overview. Attached Figure Description

[0010] Several aspects are illustrated in the accompanying drawings by way of example rather than limitation, and similar reference numerals in the drawings indicate similar elements. It should be noted that references to “a” or “an” aspect in this disclosure do not necessarily refer to the same aspect, and that they mean at least one.

[0011] Figure 1 A cross-sectional side view of one aspect of a transducer assembly with attenuator arrangement is shown.

[0012] Figure 2 A perspective view of one aspect of the attenuator arrangement for the transducer assembly is shown.

[0013] Figure 3 A top plan view of one aspect of the attenuator arrangement for the transducer assembly is shown.

[0014] Figure 4 A top plan view of one aspect of the attenuator arrangement for the transducer assembly is shown.

[0015] Figure 5A A cross-sectional side view of one aspect of the attenuator is shown.

[0016] Figure 5B It shows a valve Figure 5A A cross-sectional side view of the attenuator.

[0017] Figure 5C It shows a valve Figure 5A A cross-sectional side view of the attenuator.

[0018] Figure 5D It shows a valve Figure 5A A cross-sectional side view of the attenuator.

[0019] Figure 5E It shows a piston. Figure 5A A cross-sectional side view of the attenuator.

[0020] Figure 6 A cross-sectional side view of one aspect of the attenuator is shown.

[0021] Figure 7 A cross-sectional side view of one aspect of the attenuator is shown.

[0022] Figure 8 A cross-sectional side view of one aspect of the attenuator is shown.

[0023] Figure 9 A cross-sectional side view of one aspect of the attenuator is shown.

[0024] Figure 10 An exploded perspective view shows the process of arranging attenuators for assembling transducer assemblies.

[0025] Figure 11 A cross-sectional side view shows another process for assembling attenuator arrangements for transducer assemblies.

[0026] Figure 12 A cross-sectional side view shows another process for assembling attenuator arrangements for transducer assemblies.

[0027] Figure 13A cross-sectional side view shows another process for assembling attenuator arrangements for transducer assemblies.

[0028] Figure 14 A cross-sectional side view shows another process for assembling attenuator arrangements for transducer assemblies.

[0029] Figure 15 A cross-sectional side view shows another process for assembling attenuator arrangements for transducer assemblies.

[0030] Figure 16 A cross-sectional side view shows another process for assembling attenuator arrangements for transducer assemblies.

[0031] Figure 17 It shows what can be achieved within it. Figures 1 to 16 A block diagram of one aspect of an electronic device with an attenuator array. Detailed Implementation

[0032] In this section, we will explain several preferred aspects of this disclosure with reference to the accompanying drawings. Where the shape, relative position, and other aspects of the described components are not clearly defined, the scope of this disclosure is not limited to the components shown, which are for illustrative purposes only. Furthermore, while many details are set forth, it should be understood that some aspects of this disclosure can be implemented without these details. In other instances, well-known structures and techniques have not been shown in detail so as not to obscure the understanding of this description.

[0033] The terminology used herein is for the purpose of describing particular aspects only and is not intended to limit this disclosure. Spatially related terms, such as “below,” “under,” “down,” “above,” “above,” etc., may be used herein for the convenience of describing the relationship of one element or feature to one or more other elements or features, as illustrated in the accompanying drawings. It should be understood that spatially related terms are intended to cover different orientations of the device during use or operation other than those shown in the drawings. For example, if the device in the figures is flipped, an element described as “below” or “under” other elements or features may then be oriented “above” other elements or features. Thus, the exemplary term “below” can cover both the orientations above and below. The device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatially related descriptors used herein are interpreted accordingly.

[0034] As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context otherwise indicates. It should be further understood that the terms “comprising”, “including”, “emphasize” define the presence of the stated feature, step, operation, element, and / or component, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or collections thereof.

[0035] The terms “or” and “and / or” as used herein should be interpreted as including or referring to any one or any combination thereof. Therefore, “A, B, or C” or “A, B, and / or C” means “any one of the following: A; B; C; A and B; A and C; B and C; A, B, and C.” Exceptions to this definition will only occur if the combination of elements, functions, steps, or actions is inherently mutually exclusive in some way.

[0036] Figure 1A cross-sectional side view of one aspect of a transducer assembly and / or a transducer assembly integrated within a portable electronic device is shown. Typically, the device or assembly 100 may include a housing, enclosure, or shell 102 defining or enclosing a cavity containing constituent electronic components of the transducer assembly or electronic device. The shell 102 may include shell walls that may include a cover 104 and a base 106 or be formed by a cover and a base, which together form an enclosed space or internal cavity within the shell 102 isolated from the surrounding environment. In some cases, the shell 102 completely isolates or seals the internal cavity from the surrounding environment. For example, the shell walls may form a waterproof or soundproof internal cavity that is impermeable to water and / or air. In other aspects, the shell walls may also include a pressure vent (“b vent”) or other types of vents (not shown) that connect the internal cavity to the surrounding environment to help mitigate and / or balance pressure changes within the internal cavity. The internal cavity may have sufficient volume and / or size to accommodate the constituent components of the assembly 100. For example, components of transducer 112 and ASIC 114 may be housed within an internal cavity formed by housing 102. In some aspects, transducer 112 may be, for example, an electroacoustic transducer, such as a microphone, which converts sound into electrical signals for further processing by the device. It should also be understood that while components such as transducer 112 are shown, in other aspects, components may be another type of device or sensor, such as a speaker or pressure sensor. Housing 102 may also include an acoustic port 108 and an acoustic path 110 that acoustically connects transducer 112 to acoustic port 108. Housing acoustic port 108 may be, for example, a sound input or output port that allows sound to propagate between the surrounding environment and transducer 112 positioned within the internal cavity. For example, in the aspect where transducer 112 is a microphone, acoustic port 108 may be a sound input port that allows sound to be input to the microphone. In some aspects, transducer 112 may be a MEMS microphone, and each of the components may be formed using MEMS fabrication operations.

[0037] The housing 102 may also include an arrangement of resonators or attenuators 116, 118. Attenuators 116, 118 may be located between the acoustic port 108 and the transducer 112, and have specific dimensions, geometric volumes, etc., and / or employ a specific arrangement selected for attenuating different broadband ultrasonic frequencies. For example, in some aspects, one or more of attenuators 116, 118 may be Helmholtz resonators (HR) that are ten to forty times smaller than the wavelength of the ultrasonic frequency. Attenuator 116 may be arranged along a first side 110A of the acoustic path 110, and attenuator 118 may be arranged along a second side 110B of the acoustic path 110. Although not shown, any one or more additional attenuators may be arranged along the other side of the acoustic path 110, and subsequently along the acoustic port 108. In some aspects, attenuators 116, 118 may be arranged in any array or other pattern specifically selected for attenuating ultrasonic waves. For example, attenuators 116, 118 may be arranged in an array or pattern selected for attenuating a frequency range of about 20 kHz or higher, or about 25 kHz or higher, or about 20 kHz to about 100 kHz, or about 35 Hz to about 80 kHz. In this respect, attenuators 116, 118 will attenuate frequencies within a range capable of causing subharmonics within the audio bandwidth of transducer 112, while allowing lower, more desirable frequencies (e.g., frequencies less than about 20 kHz, 25 kHz, or 35 kHz) to be delivered to transducer 112. In some aspects, attenuators 116, 118 may be formed within portions of the substrate 106 defining acoustic pathway 110 and / or acoustic port 108. For example, attenuators 116, 118 may be formed in the substrate 106 using MEMS fabrication operations. In other aspects, attenuators 116, 118 may be formed in the substrate 106 by injection molding or reverse molding processes or using three-dimensional (3D) printing processes.

[0038] Figure 2 A perspective enlarged view of a representative arrangement of attenuators for device or component 100 is shown. Typically, from... Figure 2 As can be seen, component 100 may include attenuators 116, 118, which are formed in or otherwise coupled to a portion of the acoustic path 110 between the forming port 108 of the substrate 106 and the transducer 112. Although attenuators 116, 118 are described as being formed in a portion of the substrate 106, it should be understood that they may be formed in or otherwise coupled to any portion of the housing 102 that provides an acoustic path or acoustic port for the transducer 112. Figure 2It can also be seen that attenuator 116 may be arranged along a first side 110A (e.g., the top side) of acoustic path 110, and attenuator 118 may be arranged along a second side 110B (e.g., the bottom side) of acoustic path 110. In the illustrated configuration, the first side 110A may be the opposite side of the second side 110B. Acoustic path 110 may also include a third side 110C and a fourth side 110D (e.g., sidewalls) opposite to each other, and the first side 110A and the second side 110B are connected together to form path 110. Although attenuators 116 and 118 are described as being formed along the first side 110A and the second side 110B, it should be understood that they may be formed along any side 110A to 110D.

[0039] Referring now to the arrangement of attenuator 116 in more detail, attenuator 116 can be understood as being arranged in an array, wherein attenuators are arranged in multiple rows and columns along side 110A. In some aspects, rows can be considered as an arrangement of attenuators extending perpendicular to the path axis 230, while columns can be considered as an arrangement of attenuators extending parallel to the path axis 230. In other aspects, attenuator 116 can be considered as a patterned or repeating pattern, including multiple rows, multiple columns, or other repeating arrangements. Typically, the arrangement of attenuators 116 can form a first column 116A, a second column 116B, and a third column 116C along side 110A. The first column 116A can consist of attenuators 116A-1, 116A-2, 116A-3, and 116A-4. The second column 116B can consist of attenuators 116B-1, 116B-2, 116B-3, 116B-4, and 116B-5. The third column 116C can be composed of attenuators 116C-1, 116C-2, 116C-3, and 116C-4. Furthermore, each of attenuators 116A-1, 116B-1, and 116C-1 can be considered to be arranged in the first row; attenuators 116A-2, 116B-2, and 116C-2 can be considered to be arranged in the second row; attenuators 116A-3, 116B-3, and 116C-3 can be considered to be arranged in the third row; attenuators 116A-4, 116B-4, and 116C-4 can be considered to be arranged in the fourth row; and attenuator 116B-5 can be considered to be arranged in the fifth row. In some respects, each of the attenuators comprising columns 116A, 116B, and 116C can be considered to be arranged in series because they are arranged in a specific order based on specific parameters. For example, attenuators can be arranged in order of volume, geometry, size, shape, or any other parameters that differ within the attenuators or otherwise allow them to absorb different frequency ranges. Typically, in the configuration shown, each attenuator in columns 116A, 116B, and 116C can be understood as having a different length dimension or volume than the other attenuators in the same column, and thus can be considered as arranged in series in order of length dimension or volume. Due to their different parameters, each attenuator in the attenuators can absorb different frequency ranges, and therefore together they can attenuate broadband ultrasonic frequencies, for example, in the range of about 25 kHz to about 80 kHz. Furthermore, in some respects, attenuators in adjacent columns can be considered as arranged asymmetrically or oppositely to each other. This arrangement has been found to absorb energy in the most efficient way and to capture acoustic energy using attenuators much smaller than the wavelength. In addition, this arrangement has been found to introduce negligible phase delay within the audio band, which is advantageous for audio signal processing algorithms such as those used in ANC applications.

[0040] Typically, attenuators 116A-1 to 116A-4 comprising column 116A can be arranged in series in order of decreasing length or volume. In other words, attenuator 116A-1, closest to port 108, has the largest length or volume, while attenuator 116A-4, closest to transducer 112, has the smallest length or volume. On the other hand, attenuators 116B-1 to 116B-5 comprising adjacent column 116B can be arranged in order of increasing length or volume. In other words, attenuator 116B-1, closest to port 108, has the smallest length or volume, while attenuator 116B-5, closest to transducer 112, has the largest length or volume. Finally, attenuators 116C-1 to 116C-4 comprising column 116C, adjacent to column 116B, can be arranged in order of decreasing length or volume. In this respect, attenuator 116C-1, which is closest to port 108, has the largest length or volume, while attenuator 116C-4, which is closest to transducer 112, has the smallest length or volume. Although not shown, the arrangement of attenuators 118 may be a mirror image of the arrangement of attenuators 116.

[0041] Furthermore, in some aspects, the arrangement of attenuators 202 may optionally be positioned along the third side 110C (and / or the fourth side 110D), as shown by the dashed lines. Similar to the arrangement of attenuators 116 and 118, the arrangement of attenuators 202 may be an array comprising at least two columns and two rows of attenuators arranged in series. For example, the arrangement of attenuators 202 may include a first column 202A and a second column 202B. The first column 202A may consist of attenuators 202A-1, 202A-2, 202A-3, and 202A-4 arranged in descending order of length or volume. The second column 202B may consist of attenuators 202B-1, 202B-2, 202B-3, and 202B-4 arranged in ascending order of length or volume. It should also be understood that although only two or three columns and four or five rows are shown in the arrangement of attenuators 116, 118, 202, the array may include more columns and / or rows if more attenuation is required.

[0042] Now refer in more detail to aspects of each attenuator in the attenuator array. Figure 3is a top plan view of attenuator 116 positioned along first side 110A. As can be seen from this figure, the attenuators forming the arrangement of attenuator 116 are arranged according to a length dimension or volume. Additionally, in the illustrated configuration, it can be seen that the length dimension of each attenuator in the attenuator is different from the length dimension of an adjacent attenuator. Typically, now referring to first column 116A, attenuator 116A-1 has length (L1), attenuator 116A-2 has length (L2), attenuator 116A-3 has length (L3), and attenuator 116A-4 has length (L4), where L4 < L3 < L2 < L1. Thus, it can be considered that attenuators 116A-1 to 116A-4 are arranged in series in first column 116A in decreasing length, with the longest attenuator (116A-1) near port 108 and the shortest attenuator (116A-4) near transducer 112. Now referring to second column 116B, attenuator 116B-1 has length (L4), attenuator 116B-2 has length (L2), attenuator 116B-3 has length (L3), attenuator 116A-4 has length (L4), and attenuator 116A-5 has length (L0), where L4 < L3 < L2 < L1 < L0. Thus, it can be considered that attenuators 116B-1 to 116B-5 are arranged in series in second column 116B in increasing length, with the shortest attenuator (116B-1) near port 108 and the longest attenuator (116B-5) near transducer 112. In other words, the series of attenuators 116B-1 to 116B-5 forming column 116B are arranged in an order opposite to the series of attenuators 116A-1 to 116A-4 forming column 116A. Additionally, in some aspects, the arrangements of columns 116A and 116B can be considered asymmetric. For example, column 116A is asymmetric with column 116B. Now referring to third column 116C, attenuator 116C-1 has length (L1), attenuator 116C-2 has length (L2), attenuator 116C-3 has length (L3), and attenuator 116C-4 has length (L4), where L4 < L3 < L2 < L1. Thus, it can be considered that attenuators 116C-1 to 116C-4 are arranged in series in third column 116C in decreasing length, with the longest attenuator (116C-1) near port 108 and the shortest attenuator (116C-4) near transducer 112. In other words, the series of attenuators 116C-1 to 116C-4 forming column 116C are arranged in an order opposite to the series of attenuators 116B-1 to 116B-5 forming column 116B. Additionally, the arrangements of columns 116C and 116B can be considered asymmetric. For example, column 116C is asymmetric with column 116B. It should also be understood that, in some aspects, the length dimensions (L1 to L5) can be ten to forty times smaller than the ultrasonic wavelengths they are configured to absorb.For example, when the wavelength to be absorbed is in the range of 2 cm or less, the length dimension (L1 to L5) can be ten to forty times smaller than the wavelength in that range.

[0043] In addition, it should be understood that although different length dimensions (L0 to L5) are described, each attenuator in the attenuators having different lengths can also be understood as having different volumes (V0 to V5). Thus, the attenuators forming the arrangement of the attenuator 116 can also be understood as being arranged according to volume. Typically, now referring to the first column 116A, the attenuator 116A-1 has a volume (V1), the attenuator 116A-2 has a volume (V2), the attenuator 116A-3 has a volume (V3), and the attenuator 116A-4 has a volume (V4), where V4 < V3 < V2 < V1. Thus, the attenuators 116A-1 to 116A-4 can be considered to be arranged in series in the first column 116A in decreasing volume, with the attenuator having the largest volume (116A-1) being close to the port 108 and the attenuator having the smallest volume (116A-4) being close to the transducer 112. Now referring to the second column 116B, the attenuator 116B-1 has a volume (V4), the attenuator 116B-2 has a volume (V2), the attenuator 116B-3 has a volume (V3), the attenuator 116A-4 has a volume (V4), and the attenuator 116A-5 has a volume (V0), where V4 < V3 < V2 < V1 < V0. Thus, the attenuators 116B-1 to 116B-5 can be considered to be arranged in series in the second column 116B in increasing volume, with the smallest attenuator (116B-1) being close to the port 108 and the largest attenuator (116B-5) being close to the transducer 112. In other words, the series of attenuators 116B-1 to 116B-5 forming the column 116B are arranged in an order opposite to that of the series of attenuators 116A-1 to 116A-4 forming the column 116A. In addition, the arrangements of the columns 116A and 116B can be considered to be asymmetric. For example, the column 116A is asymmetric with respect to the column 116B. Now referring to the third column 116C, the attenuator 116C-1 has a volume (V1), the attenuator 116C-2 has a volume (V2), the attenuator 116C-3 has a volume (V3), and the attenuator 116C-4 has a volume (V4), where V4 < V3 < V2 < V1. Thus, the attenuators 116C-1 to 116C-4 can be considered to be arranged in series in the third column 116C in decreasing volume, with the largest attenuator (116C-1) being close to the port 108 and the smallest attenuator (116C-4) being close to the transducer 112. In other words, the series of attenuators 116C-1 to 116C-4 forming the column 116C are arranged in an order opposite to that of the series of attenuators 116B-1 to 116B-5 forming the column 116B. In addition, the arrangements of the columns 116C and 116B can be considered to be asymmetric. For example, the column 116C is asymmetric with respect to the column 116B.

[0044] Furthermore, it should be understood that each attenuator in an attenuator with different lengths (L0-L5) or volumes (V0-V5) will absorb different frequency ranges, and therefore each attenuator in the attenuator can be considered to be arranged in series according to the frequency range they can absorb. Typically, smaller attenuators (e.g., attenuators 116A-4, 116B-1, and 116C-4) can be tuned to absorb higher frequency ranges (e.g., near 80 kHz or up to 100 kHz or higher), while larger attenuators (e.g., attenuators 116A-1, 116B-5, and 116C-1) can be tuned to absorb lower frequency ranges (e.g., near 20 kHz or 25 kHz). For example, in one aspect, attenuator 116B-5 absorbs sound waves in a frequency range of about 20 kHz or 25 kHz to about 35 kHz; attenuators 116A-1, 116B-4, and 116C-1 absorb sound waves in a frequency range of about 36 kHz to about 46 kHz; attenuators 116A-2, 116B-3, and 116C-2 absorb sound waves in a frequency range of about 47 kHz to about 57 kHz; attenuators 116A-3, 116B-2, and 116C-3 absorb sound waves in a frequency range of about 58 kHz to about 68 kHz; and attenuators 116A-4, 116B-1, and 116C-4 absorb sound waves in a frequency range of about 69 kHz to about 80 kHz. It should also be understood that while the array of attenuators 116 comprises three columns and two rows of attenuators of similar shapes, other arrangements, patterns, shapes, and / or sizes are also contemplated.

[0045] Typically, Figure 4 Another arrangement of the attenuators is shown. In this configuration, the attenuators are arranged in a 2×2 array along the first side 110A of the acoustic path 110 between port 108 and transducer 112. Typically, this array may include a first series or column 116A of attenuators 116A-1 and 116A-2, and a second adjacent series or column 116B of attenuators 116B-3 and 116B-4. Similar to Reference Figure 3The attenuators, attenuators 116A-1 and 116A-2 in column 116A may have different lengths (L1, L2) and / or volumes (V1, V2), and are arranged in series with decreasing length or volume. Attenuators 116B-3 and 116B-4 in column 116B may have different lengths (L2, L1) and / or volumes (V1, V2), and are arranged with increasing length or volume. Therefore, attenuators 116B-3 and 116B-4 constituting column 116B can be considered as being arranged in series in the reverse order of attenuators 116A-1 and 116A-2 constituting column 116A. Although not shown, similar attenuator arrangements or patterns can be found on the second side of passage 110 (e.g., side 110B) or any other side. Furthermore, it should be understood that each side from 110A to 110C may have the same or different arrangements, patterns, or numbers of attenuators, depending on the desired attenuation. It should also be understood that, as mentioned above, due to their different parameters, each attenuator in any of the aforementioned arrangements or patterns can absorb a different frequency range, and therefore together they can attenuate broadband ultrasonic frequencies, for example, in the range of about 20 kHz to about 100 kHz or about 25 kHz to about 80 kHz. These arrangements have been found to absorb energy in the most efficient manner and to capture acoustic energy using attenuators much smaller than the wavelength, while introducing negligible phase delay within the audio band.

[0046] See now Figure 5A , Figure 5B , Figure 5C , Figure 5D , Figure 5E , Figure 6 , Figure 7 , Figure 8 and Figure 9 , Figures 5A to 9 Several different attenuator configurations are shown. Typically, Figure 5A and Figure 5BShows an attenuator 116A-1 including a body portion 502 and a neck portion 504. The neck portion 504 can connect the body portion 502 to an acoustic passage or port that requires attenuation. Typically, the neck portion 504 can be connected to the aforementioned passage 110 or port 108. The body portion 502 and the neck portion 504 can together define a chamber having a volume (V1), which in turn leads to the passage or port to which the attenuator 116A-1 is connected. The body portion 502 and the neck portion 504 can have different shapes and sizes, depending on the desired volume (V1) and / or frequency range that the attenuator 116A-1 is intended to absorb. In some aspects, the body portion 502 is generally larger (or defines a larger volume) than the neck portion 504. In the illustrated configuration, the body portion 502 is a rectangular structure having a length dimension (L1), a height dimension (H1), and may also have a width dimension (although not shown). At least one of the dimensions of the body portion 502 can be selected or adjusted to obtain a volume (V1) that absorbs the desired frequency range. For example, in some aspects, the length dimension (L1) can be selected and / or changed to correspond to any one of the aforementioned lengths (L0 to L5) to obtain a desired volume (V1) for attenuating a specific frequency range. Typically, the length dimension (L1) is approximately ten to forty times smaller than the ultrasonic wavelength. For example, if the ultrasonic wavelength is 2 cm or less, the length dimension (L1) can be 0.2 cm or less, or about 0.05 cm to 0.2 cm. The neck portion 504 can have a height dimension (H2) and a width dimension (W). The neck portion 504 can be narrower than the body portion (e.g., W < L1). In some aspects, the width dimension (W) can be understood to define the size of the neck opening. In some aspects, at least one of the dimensions of the body portion 502 and / or the neck portion 504 can be selected or adjusted to obtain a volume (V1) that absorbs the desired frequency range. For example, in some aspects, the height dimension (H1) or width dimension (W) of the body portion 502, or the height dimension (H2) or width dimension (W) of the neck 504, can be selected and / or changed to obtain a desired volume (V1) for attenuating a specific frequency range. In other cases, other aspects of the attenuator 116A-1 can be selected, adjusted, and / or changed such that the attenuator absorbs the desired frequency range. Typically, in some aspects, the attenuator can have a damper for low-frequency attenuation.

[0047] Figure 5B Shows Figure 5AThe attenuator 116A-1, however, has a valve 506 connected to the neck 504. The valve 506 can be any type of controllable valve operable to open or close the opening of the neck 504. For example, the valve 506 can be a mechanical or electromechanical valve with a dynamically adjustable response to the attenuator 116A-1. In this respect, the valve 506 can be opened or closed according to the desired attenuation level. Typically, when the valve 506 is in the open configuration, the attenuator 116A-1 is open to the acoustic path or port for attenuating the desired frequency range. When the valve 506 is in the closed configuration, the attenuator 116A-1 is isolated from the acoustic path or port. In some aspects, each attenuator in an attenuator arrangement may have a valve 506 that opens or closes the acoustic path or port of the attenuator according to the desired attenuation level. Furthermore, in some aspects, the valve 506 is operable to partially open and / or close the neck 504. In this respect, valve 506 can be used to change the width (W) of neck 504 to fine-tune the frequency of each block within the band-stop bandwidth. Typically, the attenuator band-stop bandwidth can be extended into the audio band to suppress the first resonant peak as well as peaks in ultrasound, thereby obtaining a flat frequency response of the acoustic sensor (e.g., a microphone would have a flat frequency response between 35 Hz and 80 kHz). This increases the operating bandwidth of the acoustic sensor.

[0048] Figure 5C This illustrates another aspect, including the valve. Figure 5A A cross-sectional side view of the attenuator. Typically, it resembles... Figure 5B , Figure 5C A damper 116A-1 with a valve 506 connected to a neck 504 is shown. However, in this configuration, the valve 506 is a sliding mechanism operable to open or close the opening of the neck 504. For example, the valve 506 may be a mechanical or electromechanical sliding mechanism that moves in the direction of arrow 508 to adjust the width of the neck 504. Typically, the sliding mechanism valve 506 may be coupled to an actuator 510 that drives the sliding mechanism valve 506 to move in the direction of arrow 508 to increase the width of the neck 504 (see, for example, width (W)) or decrease the width of the neck (see, for example, width (W1)). For example, when the sliding mechanism valve 506 is in the open configuration, the neck 504 is fully open and has width (W). When the sliding mechanism valve 506 slides to the left as shown by the dashed line, the neck 504 is only partially open and has width (W1). It should also be understood that although two neck widths (W) and (W2) are shown, the sliding mechanism valve 506 is operable to move to any position across the neck 504 to obtain any desired neck width. In this respect, the sliding mechanism valve 506 can be used to fine-tune the frequency of each block within the band stop bandwidth. Furthermore, in some aspects, the sliding mechanism valve 506 may be part of the actuator 510, and the actuator 510 may be, but is not limited to, an electrostatic, electromagnetic, piezoelectric, or thermal actuator.

[0049] Figure 5D This illustrates another aspect, including the valve. Figure 5A A cross-sectional side view of the attenuator. Typically, it resembles... Figure 5C , Figure 5D A damper 116A-1 with a valve 506 connected to a neck 504 is shown. However, in this configuration, the valve 506 is an "L"-shaped sliding mechanism operable to open or close the opening of the neck 504. For example, the valve 506 may be a mechanical or electromechanical "L"-shaped sliding mechanism that moves in the direction of arrow 508 to adjust the width of the neck 504. Typically, the sliding mechanism valve 506 may be coupled to an actuator 510 that drives the sliding mechanism valve 506 to move in the direction of arrow 508 to increase the width of the neck 504 (see, for example, width (W)) or decrease the width of the neck (see, for example, width (W1)). For example, when the "L"-shaped sliding mechanism valve 506 is in the open configuration, the neck 504 is fully open and has width (W). When the "L"-shaped sliding mechanism valve 506 slides to the left as shown by the dashed line, the neck 504 is only partially open and has width (W1). It should also be understood that although two neck widths (W) and (W2) are shown, the sliding mechanism valve 506 is operable to move to any position across the neck 504 to obtain any desired neck width and adjust the frequency of each block within the band stop bandwidth.

[0050] Figure 5E It shows Figure 5A A cross-sectional side view of the attenuator 116A-1 is shown; however, piston 512 is connected to the body portion 502 to adjust the chamber size or volume (V1). Typically, piston 512 can be positioned within the chamber of the body portion 502 and moved in the direction of arrow 514 by actuator 510 to change the chamber size or volume (V1). For example, in one aspect, piston 512 can be considered to be in the uppermost position, such that the body portion 502 has a relative position to the reference... Figure 5AThe same height (H1) (e.g., a configuration without a piston). On the other hand, the actuator 510 can drive the piston 512 in the direction of arrow 514 to the lowest position shown by the dashed line, such that the main body portion 502 has a reduced height (H1-A) and a reduced volume (V1-A). Although two positions of the piston 512 corresponding to the height (H1) and the reduced height (H1-A) are shown, it should be understood that the piston 512 can be driven by the actuator 510 to any position between the height (H1) and the height (H1-A) to obtain any volume within V1-V1-A as needed. In this regard, the attenuator 116A-1 has an adjustable chamber size that can be used to fine-tune the frequency of each block within the band-stop bandwidth as described above. Additionally, it is contemplated that the piston 512 and the valve 506 can be used alone or in combination to adjust the main body portion 502 and / or the neck portion 504 as needed.

[0051] Now referring to Figure 6 , Figure 6 Another attenuator configuration is shown. Figure 6 The attenuator 116 of

[0052] Now referring to Figure 7 , Figure 7 Another attenuator configuration is shown. Figure 7The attenuator 116 can be similar to the aforementioned attenuator 116A-1 in that it includes a body portion 502 and a neck portion 504. However, in this regard, the body portion 502 can have another geometric shape, for example, a polyhedron having any number of sides and / or faces defining a length dimension (L), a height dimension, and a width dimension. The neck portion 504 can be similar to the aforementioned neck portion and have a width dimension (W) and a height dimension (H). The neck portion 504 can also have a tapered shape such that it is wider at the end connected to the body portion 502 than at the end leading to the acoustic passage or port. However, generally, the neck portion 504 can be narrower than the body portion 502 (e.g., W < L). The neck portion 504 and the body portion 502 together can define the volume (V) of the attenuator 116. Similar to the previously discussed configurations, at least one of the dimensions of the body portion 502 and / or the neck portion 504 can be selected or adjusted to obtain a volume (V) that absorbs the desired frequency range. For example, in some aspects, the length dimension (L), the height dimension, or the width dimension of the body portion 502 and / or the width dimension (W) or the height dimension (H) of the neck portion 504 can be selected and / or changed to obtain the desired volume (V) for attenuating a specific frequency range. Additionally, although not shown, a valve (e.g., valve 506) or a piston (e.g., piston 512) can be connected to the neck 504 and / or the body portion 502 to adjust the width or volume as described above.

[0053] Now refer to Figure 8 , Figure 8 Another attenuator configuration is shown. Figure 8 The attenuator 116 can be similar to the aforementioned attenuator 116A-1 in that it includes a body portion 502 and a neck portion 504. However, in this regard, the neck portion 504 is relatively long and can be meandering, curvilinear, or otherwise have bends and thus has a relatively long length dimension (l). Similar to the aforementioned neck portion, the neck portion 504 can also have a width dimension (W). The neck portion 504 can be narrower than the body portion 502 (e.g., W < L). The neck portion 504 and the body portion 502 together can define the volume (V) of the attenuator 116. Similar to the previously discussed configurations, at least one of the dimensions of the body portion 502 and / or the neck portion 504 can be selected or adjusted to obtain a volume (V) that absorbs the desired frequency range. For example, in some aspects, the length dimension (L) of the body portion 502 and / or the width dimension (W) or the length dimension (l) of the neck portion can be selected and / or changed to obtain the desired volume (V) for attenuating a specific frequency range. Additionally, although not shown, a valve (e.g., valve 506) or a piston (e.g., piston 512) can be connected to the neck 504 and / or the body portion 502 to adjust the width or volume as described above.

[0054] Now refer to Figure 9 , Figure 9 shows another attenuator configuration. Figure 9 The attenuator 116 of can be similar to the aforementioned attenuator 116A-1, in that it includes a body portion 502 and a neck portion 504. However, in this regard, the neck portion 504 can be bent or spiraled inwardly and thus have a relatively long length dimension (l) similar to the aforementioned configuration of Figure 8 . Similar to the aforementioned neck portion, the neck portion 504 can also have a width dimension (W). The neck portion 504 can be narrower than the body portion 502 (e.g., W < L). The neck portion 504 and the body portion 502 together can define the volume (V) of the attenuator 116. Similar to the previously discussed configurations, at least one of the dimensions of the body portion 502 and / or the neck portion 504 can be selected or adjusted to obtain a volume (V) that absorbs the desired frequency range. For example, in some aspects, the length dimension (L) of the body portion 502 and / or the width dimension (W) or the length dimension (l) of the neck portion 504 can be selected and / or varied to obtain a desired volume (V) for attenuating a specific frequency range. Additionally, although not shown, a valve (e.g., valve 506) can be connected to the neck 504 to control the opening and closing of the neck, as described previously.

[0055] Furthermore, in some aspects, the number and / or spatial arrangement of attenuators in an array can be adjusted in such a way that a greater number of attenuators 116 can be allocated to attenuate more within a narrower frequency band of the overall attenuator bandwidth. This is useful for suppressing different amplitudes of peaks within different frequency ranges. For example, within 20 kHz to 30 kHz, the attenuation can be targeted at approximately 15 dB, while within 30 kHz to 75 kHz, the attenuation can be targeted at approximately 10 dB, and vice versa.

[0056] Figure 10 shows an exploded perspective view of a representative process for assembling an attenuator arrangement for a transducer assembly. Typically, Figure 10 shows a device or assembly 100 that includes a plurality of preformed components or parts 1002, 1004, 1006, 1008, 1010, 1012 that, once assembled, form the attenuator arrangement as described previously. Any one or more of the preformed components or parts 1002, 1004, 1006, 1008, 1010, 1012 can be made or fabricated from any material suitable for forming an attenuator configured to absorb the desired frequency range. Typically, the preformed components or parts 1002, 1004, 1006, 1008, 1010, 1012 can be made from materials including but not limited to silicon, plastic, glass, or any other material suitable for forming an attenuator configured to absorb the desired frequency range as disclosed herein. Now referring more specifically to each of the components or parts, from Figure 10 As can be seen, component 1002 may be a plate or other similar part including the aforementioned acoustic port 108 formed therein. Component 1012 may be a hollow block or cubic structure with an open end, the structure including attenuator cavities 116A to 116C, 118A to 118C, 202A to 202C formed therein on different sides of the block. Each of the attenuator cavities 116A to 116C, 118A to 118C, 202A to 202C may have the same characteristics as described above. Figure 2 The attenuators 116, 118, and 202 are of the same size and shape, such that when assembled, they form the attenuators 116, 118, and 202 described above. For example, attenuator cavities 116A to 116C may be formed on a first side or top side of the block (e.g., first side 110A), attenuator cavities 118A to 118C may be formed on a second side or bottom side of the block (e.g., second side 110B), and attenuator cavities 202A to 202C may be formed on one or both lateral sides of the block connecting the first and second sides (e.g., third side 110C and fourth side 110D). Attenuator cavities 116A to 116C, 118A to 118C, and 202A to 202C may be formed in component 1012 such that they have a neck portion (e.g., neck portion 504) leading to the inside or interior of the block and a body portion (e.g., body portion 502) leading to the outside or exterior of the block. As described above, the hollow interior of the block may define an acoustic pathway 110 leading to / from acoustic port 108. Components 1004, 1006, 1008, and 1010 may be solid plates or blocks configured to be attached to the outer or external surface of component 1012. Specifically, component 1004 may be considered as a top plate or block attached to the top outer surface of component 1012 (e.g., the side including attenuator cavities 116A to 116C). Component 1006 may be considered as a bottom plate or block attached to the bottom outer surface of component 1012 (e.g., the side including attenuator cavities 118A to 118C). Components 1008 and 1010 may be considered as side plates or blocks attached to the external side surfaces of component 1012 (e.g., the side including attenuator cavity 202A). Components 1004, 1006, 1008, and 1010 can be attached using any suitable attachment mechanism (e.g., chemical adhesive, laser welding, mechanical, MEMS processing, etc.). The attachment sealing attenuator cavities 116A to 116C, 118A to 118C, and 202A to 202C to the side of component 1012, which are open on the outer side of component 1012, form the side described above. Figure 2The enclosed main body portion (e.g., main body portion 502) of the attenuators 116, 118, 202. The assembly 100 in which the attenuators 116, 118, 202 are formed may subsequently be coupled to a transducer, or otherwise form part of a transducer assembly, as referred to above. Figure 2 As stated above.

[0057] Figure 11 A cross-sectional side view is shown of another process for assembling the attenuator assembly. Similar to reference... Figure 10 The attenuator assembly, assembly 1102 includes a preform or component in which an arrangement of attenuators 1116, 1118 is formed. The arrangement of attenuators 1116, 1118 is open to an acoustic path or port 1104 to attenuate desired ultrasonic waves therein. The arrangement of attenuators 1116, 1118 and each of the attenuators comprising the arrangement may be substantially similar to a reference. Figure 2 The attenuators 116 and 118 are arranged as described above. In some aspects, the attenuator can be considered a micro-attenuator due to its small size (e.g., 0.2 cm or less) within the attenuator assembly. Furthermore, assembly 1102 can be manufactured separately from other transducer components and is therefore considered a modular, separate, or insertable part comprising the attenuator or micro-attenuator assembly. Assembly 1102 can be made of materials including, but not limited to, silicon, plastic, glass, or any other material suitable for forming attenuators. The pre-formed assembly 1102 can then be integrated into the transducer assembly port or acoustic path of the transducer in a variety of different ways to attenuate the desired frequency range as described above.

[0058] For example, such as Figure 12As shown, in one aspect, component 1102 may be attached to the top side 1206A of transducer substrate 1206. Transducer substrate 1206 may be any portion of the transducer forming acoustic ports 1208 and / or acoustic pathways 1210 to / from an associated transducer (e.g., transducer 112). Furthermore, it should be understood that although structure 1206 is referred to as substrate, the structure may be any portion of a housing or module wall to which the transducer is attached or integrated. As shown, the attachment of component 1102 to the top side 1206A of substrate 1206 aligns the acoustic pathways or ports 1104 of component 1102 with the acoustic ports 1208 and acoustic pathways 1210 of substrate 1206. This, in turn, acoustically couples the arrangement of attenuators 1116, 1118 formed within component 1102 having port 1208 and / or passage 1210 to the transducer, and allows attenuation of acoustic waves propagating through the port / passage, as described above. Component 1102 can be attached to substrate 1206 using any suitable attachment mechanism (e.g., chemical, laser welding, mechanical, MEMS processing, etc.). Furthermore, it should be understood that although component 1102 is shown attached to the top side 1206A of substrate 1206, it is contemplated that component 1102 can be attached to the bottom side 1206B and aligned with the opposite ends of port 1208 / passage 1210, or attached to any surface of substrate 1206 suitable for acoustically couplering attenuators 1116, 1118 to the transducer port or passage.

[0059] On the other hand, component 1102 can be attached to a cavity formed in the substrate, such as Figure 13 As shown. For example, as Figure 13 As shown, in one aspect, component 1102 may be positioned within a cavity 1320 formed in the bottom side 1206B of transducer substrate 1206. As illustrated, the attachment of component 1102 to the wall of cavity 1320 of substrate 1206 aligns the acoustic path or port 1104 of component 1102 with the acoustic port 1208 and acoustic path 1210 of substrate 1206. This, in turn, acoustically connects the arrangement of attenuators 1116, 1118 formed within component 1102 having port 1208 and / or path 1210 to the transducer and allows attenuation of acoustic waves propagating through the port / path, as described above. Component 1102 may be attached to the wall of cavity 1320 within substrate 1206 using any suitable attachment mechanism (e.g., chemical, laser welding, mechanical, MEMS fabrication, etc.). Furthermore, it should be understood that although cavity 1320 is shown as being formed in the bottom side 1206B of substrate 1206, it is conceivable that component 1102 may be attached to the cavity formed in the top side 1206A and aligned with the opposite end of port 1208 / passage 1210.

[0060] In another aspect, component 1102 can be embedded within the substrate, such as... Figure 14As shown. For example, as Figure 14 As shown, in one aspect, component 1102 may be embedded between a top portion 1206C and a bottom portion 1206D of substrate 1206. For example, substrate 1206 may include a top portion 1206C and a bottom portion 1206D assembled around the top and bottom of component 1102, such that component 1102 is considered to be embedded within substrate 1206. As shown, the attachment of component 1102 within substrate 1206 aligns the acoustic path or port 1104 of component 1102 with the acoustic port 1208 and acoustic path 1210 of substrate 1206. This, in turn, acoustically links the arrangement of attenuators 1116, 1118 formed within component 1102 having port 1208 and / or path 1210 to the transducer and allows attenuation of sound waves propagating through the port / path, as described above. In some aspects, the top portion 1206C and the bottom portion 1206D are attached to each other at the seam 1422 and assembly 1102 using laser welding or any other suitable attachment process. Additionally, in some aspects, the membrane 1424 can be positioned above the port 1208 by attaching it to one side of the substrate 1206. This side can be the side of the substrate 1206 facing the surrounding environment when the transducer is assembled. The membrane 1424 can be an acoustically permeable membrane configured to protect portion 1208 or a tuning membrane configured to enhance the attenuation or sound input / output of the transducer coupled thereto. Typically, the membrane 1424 can be a polytetrafluoroethylene (PTFE) membrane.

[0061] See now Figure 15 , Figure 15 Another possible attenuator arrangement that can be integrated into the preformed assembly 1102 is shown. Typically, Figure 15 A preformed assembly 1102 is shown, in which one or more attenuators 1116 are biased against or otherwise not aligned with ports 1208 of the substrate 1206. For example, one or more attenuators 1116 may be formed within the left or right side of the assembly 1102, thus having a longer path and / or port 1104 that acoustically connects the attenuator 1116 to ports 1208 of the substrate 1206. Furthermore, the path and / or port 1104 may also be formed across opposite sides of the assembly 1102 and biased against ports 1208, such that the attenuator 1116 is located between the two ports 1104.

[0062] See now Figure 16In another aspect, component 1102 may be positioned between the top portion 1206C and the bottom portion 1206D of the substrate 1206, within a relatively long sensing channel 1602 formed between portions 1206C to 1206D and port 1208. For example, component 1102 may be positioned within the relatively long channel 1602, and then the top portion 1206C and the bottom portion 1206D may be attached to each other, as described above. It should be understood that, although not shown for ease of illustration, component 1102 includes an arrangement of attenuators 1116 acoustically coupled to port 1208 to absorb desired sound waves propagating between ports 1208, as described above. Alternatively, it is conceivable that, in some aspects, the attenuators may be formed directly within each mating surface of the top portion 1206C and the bottom portion 1206D, rather than positioning the individual component 1102 within channel 1602.

[0063] Figure 17 A block diagram of one aspect of an electronic device in which the speaker described above can be implemented is shown. Figure 17 As shown, device 1700 may include storage device 1702. Storage device 1702 may include one or more different types of storage devices, such as hard disk drive storage devices, non-volatile memory (e.g., flash memory or other electrically programmable read-only memory), volatile memory (e.g., battery-based static or dynamic random access memory), etc.

[0064] Processing circuitry 1704 can be used to control the operation of device 1700. Processing circuitry 1704 may be based on a processor, such as a microprocessor and other suitable integrated circuits. Using a suitable arrangement, processing circuitry 1704 and storage device 1702 can be used to run software on device 1700, such as internet browsing applications, Voice over Internet Protocol (VoIP) telephone calling applications, email applications, media playback applications, operating system functions, etc. Processing circuitry 1704 and storage device 1702 can be used to implement suitable communication protocols. Communication protocols that can be implemented using processing circuitry 1704 and storage device 1702 include Internet Protocol, wireless LAN protocols (e.g., IEEE 802.11 protocol, sometimes referred to as...). Protocols for other short-range wireless communication links, such as Protocols, protocols used to process 3G or 4G communication services (e.g., using wideband code division multiple access technology), 2G cellular telephone communication protocols, etc.

[0065] To minimize power consumption, processing circuitry 1704 may include power management circuitry to implement power management functions. For example, processing circuitry 1704 may be used to adjust the gain settings of amplifiers (e.g., RF power amplifier circuitry) on device 1700. Processing circuitry 1704 may also be used to regulate the power supply voltage supplied to portions of the circuitry on device 1700. For example, a higher DC power supply voltage may be supplied to active circuitry, and a lower DC power supply voltage may be supplied to less active or inactive circuitry. If desired, processing circuitry 1704 may be used to implement control schemes in which the power amplifier circuitry is adjusted to accommodate transmission power level requests received from the wireless network.

[0066] Input / output device 1706 can be used to allow data to be supplied to device 1700 and data to be provided from device 1700 to external devices. Display screens, microphone acoustic ports, speaker acoustic ports, and docking ports are examples of input / output device 1706. For example, input / output device 1706 may include user input / output device 1708, such as buttons, touchscreens, joysticks, click wheels, scroll wheels, touchpads, keypads, keyboards, microphones, cameras, etc. Users can provide commands through user input / output device 1708 to control the operation of device 1700. Display and audio device 1710 may include a liquid crystal display (LCD) screen or other screen, light-emitting diodes (LEDs), and other components that present visual information and status data. Display and audio device 1710 may also include audio devices, such as speakers, and other devices for creating sound. Display and audio device 1710 may include audio-visual interface devices, such as jacks, and other connectors for external headphones and monitors.

[0067] Wireless communication device 1712 may include communication circuitry, such as radio frequency (RF) transceiver circuitry formed by one or more integrated circuits, power amplifier circuitry, passive RF components, an antenna, and other circuitry for processing RF wireless signals. Light (e.g., infrared communication) may also be used to transmit wireless signals. Typically, in the case of a speaker acoustic port, the speaker may be associated with the port and communicate with an RF antenna for transmitting signals from a remote user to the speaker.

[0068] Back Figure 17 Device 1700 can communicate with external devices such as accessory 1714, computing device 1716, and wireless network 1718, as shown in paths 1720 and 1722. Path 1720 can include wired and wireless paths. Path 1722 can be a wireless path. Accessory 1714 can include headphones (e.g., wireless cellular headphones or audio headsets) and audio-visual equipment (e.g., wireless speakers, game controllers, or other equipment for receiving and playing audio and video content), peripheral devices such as wireless printers or cameras, etc.

[0069] Computing device 1716 can be any suitable computer. Using a suitable arrangement, computing device 1716 can be a computer with an associated wireless access point (router) or an internal or external wireless network card establishing a wireless connection with device 1700. The computer can be a server (e.g., an internet server), a local area network computer with or without internet access, a user's own personal computer, a peer-to-peer device (e.g., another portable electronic device), or any other suitable computing equipment.

[0070] Wireless network 1718 may include any suitable network device, such as cellular phone base stations, cellular towers, wireless data networks, computers associated with the wireless network, etc. For example, wireless network 1718 may include network management equipment that monitors the wireless signal strength of wireless handsets (cellular phones, handheld computing devices, etc.) communicating with network 1718.

[0071] While certain aspects have been described and illustrated in the accompanying drawings, it should be understood that such aspects are merely illustrative of the broad disclosure and not limiting, and that this disclosure is not limited to the specific structures and arrangements shown and described, as various other modifications will be apparent to those skilled in the art. Therefore, the description should be considered exemplary rather than restrictive. For example, although a speaker is specifically disclosed herein, the valve disclosed herein can be used with other types of transducers (e.g., microphones). Furthermore, although portable electronic devices such as mobile communication devices are described herein, any of the valve and transducer configurations previously described can be implemented in tablet computers, personal computers, laptop computers, notebook computers, headphones, etc. In addition, to assist the Patent Office and any reader of any patent granted under this application in interpreting the appended claims, the applicant wishes to indicate that they do not intend any appended claims or claim elements to reference 35U.SC112(f) unless “means for…” or “steps for…” is expressly used in a particular claim.

Claims

1. An acoustic device comprising: a housing defining an acoustic port and an acoustic passageway between the acoustic port and a transducer coupled to the housing; and an attenuator array acoustically coupled to the acoustic passageway, the attenuator array including a first attenuator sized to absorb ultrasonic waves in a first ultrasonic frequency range and a second attenuator sized to absorb ultrasonic waves in a second ultrasonic frequency range different from the first ultrasonic frequency range.

2. The acoustic device of claim 1, wherein the attenuator array includes a first series of attenuators arranged by volume and a second series of attenuators arranged by volume in an order opposite the first series of attenuators, the first series of attenuators including the first attenuator and the second attenuator.

3. The acoustic device of claim 1, wherein the attenuator array includes a first series of attenuators arranged by frequency of ultrasonic waves they are sized to absorb and a second series of attenuators arranged by frequency of ultrasonic waves they are sized to absorb in an order opposite the first series of attenuators, the first series of attenuators including the first attenuator and the second attenuator.

4. The acoustic device of claim 1, wherein the attenuator array includes a first series of attenuators arranged by size and a second series of attenuators arranged by size in an order opposite the first series of attenuators, the first series of attenuators including the first attenuator and the second attenuator.

5. The acoustic device of claim 4, wherein the first series of attenuators is arranged in a first column in an order of increasing length and the second series of attenuators is arranged in a second column adjacent the first column in an order of decreasing length.

6. The acoustic device of claim 1, wherein each attenuator in the attenuator array includes a body portion acoustically coupled to the acoustic passageway by a neck portion, and wherein the body portion of each of the attenuators is a different length dimension than an adjacent attenuator.

7. The acoustic device of claim 6, wherein the length dimension is at least ten times smaller than an ultrasonic frequency wavelength of at least one of the ultrasonic waves.

8. The acoustic device of claim 6, further comprising a piston coupled to the body portion or a valve coupled to the neck portion to adjust a size of the body portion or the neck portion.

9. The acoustic device of claim 1, wherein the attenuator array includes a first attenuator column, a second attenuator column arranged in an order opposite the first attenuator column, and a third attenuator column arranged in an order opposite the second attenuator column, the first attenuator column including the first attenuator and the second attenuator.

10. The acoustic device of claim 1, wherein the attenuator array is a first attenuator array acoustically coupled to a first side of the acoustic passageway, and the device further comprises a second attenuator array acoustically coupled to a second side of the acoustic passageway. ​ 11. The acoustic device of claim 1, wherein the transducer is a microphone and the array of attenuators absorbs ultrasonic waves in a frequency range of 20 kHz to 100 kHz.

12. An acoustic attenuator, comprising: a housing defining an acoustic passageway; and a first series of attenuators and a second series of attenuators arranged asymmetrically relative to one another along the acoustic passageway and having a first attenuator sized to absorb ultrasonic waves in a first ultrasonic frequency range and a second attenuator sized to absorb ultrasonic waves in a second ultrasonic frequency range different from the first ultrasonic frequency range.

13. The acoustic attenuator of claim 12, wherein the first series of attenuators and the second series of attenuators each include a first attenuator sized to absorb ultrasonic waves in a first ultrasonic frequency range and a second attenuator sized to absorb ultrasonic waves in a second ultrasonic frequency range different from the first ultrasonic frequency range, and the first and second attenuators in the first series of attenuators are in an opposite order from the first and second attenuators in the second series of attenuators.

14. The acoustic attenuator of claim 12, wherein the first series of attenuators includes the first and second attenuators arranged according to a length dimension, and each attenuator in the second series of attenuators is arranged according to a length dimension in an opposite order from the first series of attenuators.

15. The acoustic attenuator of claim 14, wherein the first series of attenuators and the second series of attenuators are arranged along a first side of the acoustic passageway, and the attenuators further include a third series of attenuators arranged along the first side of the acoustic passageway in an opposite order from the second series of attenuators.

16. The acoustic attenuator of claim 15, further comprising a fourth series of attenuators and a fifth series of attenuators arranged along a second side of the acoustic passageway.

17. A method of manufacturing a transducer assembly, comprising: providing a transducer assembly having a base defining an acoustic passageway to an acoustic port; and coupling an arrangement of attenuators to the base to absorb ultrasonic waves within the acoustic passageway, wherein the arrangement of attenuators includes an array of attenuators acoustically coupled to the acoustic passageway, the array of attenuators including a first attenuator sized to absorb ultrasonic waves in a first ultrasonic frequency range and a second attenuator sized to absorb ultrasonic waves in a second ultrasonic frequency range different from the first ultrasonic frequency range.

18. The method of claim 17, wherein the array of attenuators includes a Helmholtz resonator formed within the base.

19. The method of claim 17, wherein the array of attenuators is formed in an insert, and the insert is attached to the base.

20. The method of claim 19, wherein the insert is attached to a top side or a bottom side of the base. ​ 21. The method of claim 19, wherein the insert is embedded within the substrate.

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