A device for detecting an improved interlayer burn-in of a PCB

Abstract

A kind of detection device for PCB interlayer burning board, including base, wherein: the base is the box type structure of inside hollow, the detection work device is provided at the right end of the base, circuit board control is installed in the base, the clamping plate clamp is arranged in the base, the clamping plate clamp is conveyed by high pressure by circuit board, the switch is provided at the left end of the base simultaneously, fixed limiting mechanism is further installed above the detection work device, air pump pushing device is provided at the upper end of the detection work device.The detection device is set in the application, can be adapted according to the shape of different splicing PCB board, while detecting whether the glue performance of splicing PCB board under high pressure can meet the shaping requirement of PCB, the shape angle size of splicing PCB board is also detected, multiple performance indexes are simultaneously realized by one device, simple and efficient.

Description

Technical Field

[0001] This invention belongs to the field of circuit board processing, and specifically relates to a detection device for improving interlayer burn-in of PCBs. Background Technology

[0002] The increasingly complex electrical characteristics of modern electronic products, along with the resulting high requirements for power supply and signal transmission, have led to the increasing number of layers in ultra-thick copper PCBs during manufacturing.

[0003] Existing designs for thick copper products:

[0004] 1. Some networks have copper-extraction designs and some do not. After lamination, the copper-extraction area has insufficient adhesive flow and voids.

[0005] 2. Different networks have sharp corner designs, which can cause instantaneous discharge during high-voltage testing, leading to board burnout.

[0006] In actual production, most PCBs are relatively regular rectangular PCBs. The regular shape of rectangular PCBs helps increase processing convenience and thus improves production efficiency. However, in some specialized server boards, a system is assembled from different PCBs. To better accommodate the internal space of the chassis and adapt to other boards, irregularly shaped PCBs are often required. Currently, there are no devices for testing the connection strength of spliced ​​PCBs, and the fixed shape and angle of the spliced ​​PCBs cannot be tested simultaneously. Furthermore, the impact of external high pressure on the bonding adhesive has not been investigated.

[0007] Therefore, there is a need for an improved method for manufacturing interlayer PCBs and a testing device for detecting the shape performance of spliced ​​PCBs. Summary of the Invention

[0008] The above-mentioned objective of this invention is achieved through the following technical solutions:

[0009] A method for improving interlayer burn-in of PCBs, wherein: through design optimization, all the same nets are designed with the same design to achieve consistency, all the same grids adopt a no-copper-cut design, and the sharp corners in different nets are flattened to reduce the risk of discharge.

[0010] An inspection device for interlayer burn-in of PCBs includes a base, wherein: the base is a hollow box-shaped structure, an inspection working device is provided at the right end of the base, a circuit board is installed inside the base for control, a clamping plate is provided inside the base, the clamping plate is subjected to high-pressure transmission through the circuit board, a switch is provided at the left end of the base, a fixing limit mechanism is also installed above the inspection working device, and an air pump is provided at the upper end of the inspection working device.

[0011] Preferably, the fixed limiting mechanism includes a support column, a baffle plate above the support column, a movable plate below the baffle plate, a slide rail on the movable plate, a connecting column mounted on the slide rail, the connecting column matching the slide rail, a contour plate below the connecting column, a pressing finger evenly distributed on the contour plate, a spring between the support column and the movable plate, a fixed seat above the baffle plate, a rotating shaft between the fixed seats, a rack on the rotating shaft, a handle mounted at one end of the rotating shaft, a pressing column matching the rotating shaft, the pressing column being movably arranged on the baffle plate, and the pressing column being able to move up and down with the movement of the rack to slide and control the movable plate.

[0012] Preferably, the detection device includes a modeling base plate, which models the PCB board according to its angle. The modeling base plate is also tilted at 2.5° to the left and right sides and at 2.5° downwards. Additionally, a detection scale strip is added at the mating point between the modeling base plate and the PCB board.

[0013] Preferably, the air pump driving device includes an air pump body, which is controlled by a circuit board. The air pump body is connected to a push rod, and the push rod is also provided with two force-bearing rods. One end of each force-bearing rod is provided with a buffer pad.

[0014] In summary, the present invention has at least one of the following beneficial technical effects:

[0015] This invention improves the design of the splicing PCB process, which can reduce the risk of discharge caused by sharp corners under high voltage and effectively improve the abnormal interlayer burning caused by voids and sharp corner discharge.

[0016] This invention, through the configuration of the detection device, can be adaptively adjusted according to the different shapes of spliced ​​PCB boards. It can simultaneously detect whether the adhesive performance of the spliced ​​PCB board under high pressure can meet the shaping requirements of the PCB, and also detect the external angle dimensions of the spliced ​​PCB board. Multiple performance indicators can be detected simultaneously through one device, which is simple and efficient. Attached Figure Description

[0017] Figure 1This is a schematic diagram of the process improvement method of the present invention;

[0018] Figure 2 This is a schematic diagram of the overall detection device of the present invention;

[0019] Figure 3 This is a top view of the detection device of the present invention;

[0020] Figure 4 This is a cross-sectional schematic diagram of the detection device "AA" of the present invention;

[0021] Figure 5 This is a schematic diagram of the base of the present invention.

[0022] Reference numerals in the attached drawings: 1. Base; 2. Detection working device; 201. Copying base plate; 202. Detection scale bar; 3. Clamping plate; 4. Fixed limiting mechanism; 401. Support column; 402. Baffle; 403. Moving plate; 404. Slide rail; 405. Connecting column; 406. Copying pressure plate; 407. Pressing finger; 408. Spring; 409. Fixed seat; 410. Rotating shaft; 411. Handle; 412. Pressing column; 5. Air pump pushing device; 501. Air pump body; 502. Push rod; 503. Force rod; 504. Buffer pad; 6. Switch. Detailed Implementation

[0023] The above-mentioned objective of this invention is achieved through the following technical solutions:

[0024] A method for improving interlayer burn-in of PCBs, wherein: through design optimization, all the same nets are designed with the same design to achieve consistency, all the same grids adopt a no-copper-cut design, and the sharp corners in different nets are flattened to reduce the risk of discharge.

[0025] An inspection device for interlayer burn-in of PCBs includes a base 1, wherein: the base 1 is a hollow box-shaped structure, an inspection working device 2 is provided at the right end of the base 1, a circuit board is installed inside the base 1 for control, a clamping plate 3 is provided inside the base 1, the clamping plate 3 is subjected to high-pressure transmission through the circuit board, a switch 6 is provided at the left end of the base 1, a fixing and limiting mechanism 4 is also installed above the inspection working device 2, and an air pump driving device 5 is provided at the upper end of the inspection working device 2.

[0026] Specifically, the fixed limiting mechanism 4 includes a support column 401, a baffle 402 above the support column 401, a movable plate 403 below the baffle 402, a slide rail 404 on the movable plate 403, a connecting column 405 mounted on the slide rail 404, the connecting column 405 matching the slide rail 404, a contoured pressure plate 406 below the connecting column 405, and pressing fingers 407 evenly distributed on the contoured pressure plate 406. A spring 408 is provided between 01 and the movable plate 403. A fixed seat 409 is also provided above the baffle 402. A rotating shaft 410 is provided between the fixed seats 409. A rack is provided on the rotating shaft 410. A handle 411 is installed at one end of the rotating shaft 410. A pressing post 412 is matched at the rotating shaft 410. The pressing post 412 is movably arranged on the baffle 402. The pressing post 412 can move up and down with the movement of the rack to slide and control the movable plate 403.

[0027] Specifically, the detection device 2 includes a modeling base plate 201, which models the PCB board according to its angle. The modeling base plate 201 also has a 2.5° tilt angle on the left and right sides and a 2.5° tilt angle downwards. Additionally, a detection scale strip 202 is added in the middle of the modeling base plate 201 at the point where it matches the PCB board.

[0028] Specifically, the air pump driving device 5 includes an air pump body 501, which is controlled by a circuit board. The air pump body 501 is connected to a push rod 502, and the push rod 502 is also provided with two force-bearing rods 503. One end of each force-bearing rod 503 is provided with a buffer pad 504.

[0029] To address the issue of interlayer burnout caused by voids and sharp-corner discharges, this invention employs a uniform design for all networks to achieve consistency (all designed without copper removal). The non-copper-removal design can mitigate voids caused by uneven adhesive flow. Flattening sharp corners can reduce the risk of discharge under high voltage. These design optimizations effectively improve interlayer burnout caused by voids and sharp-corner discharges.

[0030] Furthermore, a high-voltage discharge detection device is designed to adapt to different spliced ​​PCB boards and simultaneously complete multiple testing items.

[0031] When the work begins, the splicing PCB boards are glued together with adhesive. Then, the moving plate is raised using the handle 411. The splicing PCB board to be tested is then placed on the modeling base plate 201. Due to the irregular shape of the PCB board and the vertical and horizontal tilt angles of the modeling base plate 201, the splicing PCB board will adapt to a position that matches its own angle. By checking the position of the detection scale bar 202 that the splicing PCB board contacts, it can be determined whether the splicing PCB board in normal condition meets the splicing angle requirements, and a preliminary external shape inspection can be performed.

[0032] Then, by rotating the handle 411, the pressing column 412 is pressed down. At this time, the moving plate 403 moves downward under the pressure of the pressing column 412. The splicing PCB is fixed on the imitation base plate 201 by the imitation pressure plate 406. At the same time, the high-voltage clamp 3 is clamped on the splicing PCB. At the same time, the switch 6 is turned on to perform a withstand voltage test on the splicing PCB. The splicing PCB is then observed and tested. If interlayer burning occurs, the sample board is unqualified. If no interlayer burning occurs, the sampling result is fine.

[0033] During the pressure resistance test, interlayer discharge may occur, generating current while heating up, which will affect the bonding performance of the adhesive. The testing device of this invention needs to detect whether the bonding strength of the adhesive under pressure resistance conditions meets the product requirements.

[0034] At this time, the air pump pushes the push rod 502 to move the force rod 503, pushing the spliced ​​PCB board downward on the imitation base plate 201. The distance of movement depends on the bonding performance of the adhesive and the pushing force of the air pump. Therefore, a certain pushing force of the air pump is set. When the pushing force under certain conditions is the strength requirement standard of the product, if the adhesive of the spliced ​​PCB board under pressure fails, the spliced ​​PCB board will move downward a large distance. At this time, it can be judged that the splicing has failed. At the same time, if the downward movement distance of the spliced ​​PCB board is within the allowable detection scale bar 202 range under a certain pushing force, then the spliced ​​PCB board is qualified in all the test items on this testing device.

[0035] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A detection device for improving interlayer burn-in in PCBs, characterized in that: The detection device includes a base (1), wherein: the base (1) is a hollow box-shaped structure, a detection working device (2) is provided on the right end of the base (1), a circuit board is installed inside the base (1) for control, a clamp (3) is provided inside the base (1), the clamp (3) is subjected to high-pressure transmission through the circuit board, and a switch (6) is provided on the left end of the base (1). A fixed limiting mechanism (4) is also installed above the detection working device (2), and an air pump pushing device (5) is provided at the upper end of the detection working device (2); the fixed limiting mechanism (4) includes a support column (40) 1) A baffle (402) is provided above the support column (401), and a movable plate (403) is provided below the baffle (402). A slide rail (404) is provided on the movable plate (403), and a connecting column (405) is installed on the slide rail (404). The connecting column (405) matches the slide rail (404). A contoured pressure plate (406) is provided below the connecting column (405), and pressing fingers (407) are evenly provided on the contoured pressure plate (406). A spring (408) is provided between the support column (401) and the movable plate (403). The baffle (402) is provided below the movable plate (402). 2) A fixed base (409) is also provided above, and a rotating shaft (410) is provided between the fixed bases (409). A rack is provided on the rotating shaft (410), and a handle (411) is installed at one end of the rotating shaft (410). A pressing column (412) is matched at the rotating shaft (410). The pressing column (412) is movably arranged on the baffle (402). The pressing column (412) can move up and down with the movement of the rack to slide the moving plate (403). The detection working device (2) includes a modeling base plate (201). The modeling base plate (201) is based on the splicing PC The B board is used for contouring, and the contouring base plate (201) is tilted by 2.5° to the left and right sides respectively, and the contouring base plate is tilted by 2.5° downward. At the same time, a detection scale strip (202) is added in the middle of the contouring base plate (201) to the splicing PCB board. The air pump pushing device (5) includes an air pump body (501), which is controlled by a circuit board. The air pump body (501) is connected to a push rod (502), and two force rods (503) are also provided on the push rod (502). A buffer pad (504) is provided at one end of the force rod (503).

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