A piezoelectric driver forming process, structure, camera device and electronic equipment

Abstract

The present invention provides a piezoelectric driver forming process and structure and an electronic device, comprising the following steps: S1, manufacturing an FPC clip, dividing an A area and a B area on a clamping surface of the FPC clip, and pre-tinning the FPC clip; S2, taking a ceramic sheet A and adhering it to the A area of the FPC clip while ensuring concentricity, and taking a ceramic sheet B and adhering it to the B area of the FPC clip while ensuring concentricity; S3, pre-bending the FPC clip so that the A area and the B area are opposite to each other; S4, adhering a copper sheet between the ceramic sheet A and the ceramic sheet B, ensuring concentricity between the copper sheet and the ceramic sheet, and spot welding the copper sheet to form a convex solder joint; S5, extending a carbon rod into a center hole in the A area of the FPC clip and fixing the A ceramic sheet; S6, extending a connecting wire A through the A area of the FPC clip, extending a connecting wire B through the B area of the FPC clip, and forming a connecting point C through the convex solder joint of the copper sheet. The FPC substrate is directly stacked on the outside of the ceramic sheet assembly and the wiring is extended. The overall assembly improves concentricity, and automatic calibration improves yield.

Description

Technical Field

[0001] The present invention relates to the manufacture of a piezoelectric driver, in particular to a piezoelectric driver molding process, structure, camera device and electronic equipment. Background Art

[0002] Piezoelectric actuators utilize the inverse piezoelectric effect (transverse and longitudinal effects) of piezoelectric materials (polymer bimorphs) to convert electrical energy into mechanical energy or motion. Drivers using polymer bimorphs have been used in display device control and micro-displacement generation systems.

[0003] At present, the assembly process of piezoelectric actuators is as follows:

[0004] 1. Place the copper sheet → Apply glue to the copper sheet → Glue the two ceramic sheets to both sides of the copper sheet and then bond them together;

[0005] 2. After dispensing the glue on the ceramic sheet, insert the carbon rod and solidify it;

[0006] 3. Apply conductive glue to both sides of the ceramic sheet;

[0007] 4. Manually place the two FPC PAD points on the "upper ceramic sheet" and "lower ceramic sheet";

[0008] 5. Hot pressing curing.

[0009] Existing technologies, due to the manual placement of FPCs, suffer from high labor costs, difficulty in calibration, poor concentricity between the FPC and the ceramic sheet, and yield issues affected by the FPC's fit. Furthermore, existing technologies are limited by space, and the integrated cutting of the FPC prevents the pads from being larger, resulting in a small bonding area that can easily lead to desoldering.

[0010] For example, a Chinese patent document once disclosed an FPC bending and forming process [Chinese Patent No.: CN201711261829.7]. The present invention discloses an FPC bending and forming process, which belongs to the technical field of FPC circuit boards. The FPC bending process of the present invention includes the following steps: step one, selecting a substrate material, the substrate including an intermediate base layer and outer layers located on both sides of the intermediate base layer, and wiring on the substrate; step two, laminating a covering film on the substrate after wiring; step three, printing a pressure-sensitive adhesive on the substrate with the covering film; step four, attaching a thermosetting adhesive film; step five, punching a groove on the substrate and laminating a steel sheet on the substrate; step six, using a bending jig to bend the substrate; step seven, pressing the bent product to obtain a formed FPC. The FPC bending and forming process of the present invention designs a process flow for FPC bending and forming, and controls the selection of the substrate and the parameters of pressing, so as to control the overall printing accuracy of the formed FPC and the fluctuation of the pressure-sensitive potential difference due to the secondary printing.

[0011] The above technical solution is not aimed at the manufacturing process of piezoelectric drivers, so its process line is different from the manufacturing of piezoelectric drivers, and cannot achieve the corresponding finished product processing of piezoelectric drivers. It also cannot solve problems such as calibration, poor concentricity between FPC and ceramic sheets, and yield being affected by the bonding of FPC. Summary of the Invention

[0012] The purpose of the present invention is to address the above-mentioned problems in the existing technology and propose a piezoelectric driver molding process, structure, camera device and electronic equipment that adopts a folding structure and method, and further leads out connecting wires to improve assembly efficiency and product yield.

[0013] The object of the present invention can be achieved by the following technical solutions: A piezoelectric driver forming process comprises the following steps:

[0014] S1. Make an FPC clip, divide the clamping surface of the FPC clip into area A and area B, and pre-tin the FPC clip;

[0015] S2. Take a ceramic sheet A and bond it to the A area of the FPC clip while ensuring concentricity. Take a ceramic sheet B and bond it to the B area of the FPC clip while ensuring concentricity.

[0016] S3. Pre-bend the FPC clip so that area A and area B are opposite to each other;

[0017] S4. Bond a copper sheet between ceramic sheet A and ceramic sheet B, ensuring concentricity between the copper sheet and the ceramic sheet, and spot weld the copper sheet to form a convex welding point;

[0018] S5. Insert the carbon rod into the middle hole of the FPC clip A area and fix it to the A ceramic sheet;

[0019] S6. Extend the A connecting wire through the A area of the FPC clip, extend the B connecting wire through the B area of the FPC clip, and form the C connecting point through the external convex solder joint of the copper sheet.

[0020] In the above-mentioned piezoelectric driver molding process, in S1, an FPC substrate is used to make an FPC clip connecting piece A and piece B, wiring is done on piece A and lead-out A connecting wires, and wiring is done on piece B and lead-out B connecting wires.

[0021] In the above-mentioned piezoelectric driver molding process, in S2, the A ceramic sheet is bonded to the A area of the FPC clip by glue; and the B ceramic sheet is bonded to the B area of the FPC clip by glue.

[0022] In the above-mentioned piezoelectric driver molding process, in S2, an FPC tolerance automatic punching machine is used to bond the A ceramic sheet / B ceramic sheet to the A area / B area of the FPC clip.

[0023] In the above-mentioned piezoelectric driver molding process, in S4, one side of the copper sheet is glued to the inner surface of the A ceramic sheet on the A area, and the other side of the copper sheet is glued to the inner surface of the B ceramic sheet on the B area.

[0024] In the above-mentioned piezoelectric actuator molding process, in S5, the end of the carbon rod is glued and inserted into the middle hole of the FPC clip to bond the A ceramic sheet, and the glue spreads around the inner periphery of the middle hole.

[0025] A piezoelectric driver structure includes a structure manufactured by the above-mentioned piezoelectric driver molding process.

[0026] In the above-mentioned piezoelectric driver structure, the FPC clip includes an A piece and a B piece, and the A piece and the B piece are integrally connected through a bending portion. A central hole is opened in the center of the A piece, and a connecting piece is protruding from the outside of the B piece. The clamping surface of the A piece is the A area, and the A connecting line extends from the A area through the bending portion to the connecting piece. The clamping surface of the B piece is the B area, and the B connecting line extends from the B area to the connecting piece.

[0027] In the above-mentioned piezoelectric driver structure, the A ceramic sheet is fixed on the A area, and the B ceramic sheet is fixed on the B area. The bent portion is folded in half so that the copper sheet is clamped between the A ceramic sheet and the B ceramic sheet. A welding point is provided on the edge of the copper sheet, and the carbon rod is inserted into the center hole of the A ceramic sheet to be fixedly connected to the A ceramic sheet.

[0028] The present application also provides a camera device, comprising the above-mentioned piezoelectric driver structure.

[0029] The present application also provides an electronic device comprising the above-mentioned camera device.

[0030] Compared with the existing technology, the piezoelectric driver molding process and structure and electronic equipment have the following beneficial effects:

[0031] 1. The FPC substrate is directly stacked on the outside of the ceramic sheet assembly and the wiring is extended to form an overall automatic assembly, which further improves the concentricity accuracy of the assembly, automatically calibrates to improve the yield rate, and improves work efficiency.

[0032] 2. Automated machine operation reduces scrap rate, reduces labor and material loss costs, and also reduces the amount of glue used.

[0033] 3. The substrate sandwich structure is unlimited, and as much bonding area as possible can prevent FPC from desoldering; and the large area of FPC pads is conducive to automated welding.

[0034] 4. The FPC substrate has a welding port at the welding copper sheet position, and the FPC substrate can be pre-tinned, which is conducive to automation. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 This is a flow chart of the piezoelectric actuator molding process.

[0036] Figure 2 It is a three-dimensional schematic diagram of the piezoelectric driver structure.

[0037] Figure 3 Schematic top view of the piezoelectric actuator structure.

[0038] In the figure, 1, FPC clip; 1a, A sheet; 1a1, A area; 1b, B sheet; 1b1, B area; 1c, bending part; 1d, connecting piece; 1d1, A connecting wire; 1d2, B connecting wire; 2, A ceramic sheet; 3, B ceramic sheet; 4, copper sheet; 5, solder joint; 6, carbon rod. DETAILED DESCRIPTION

[0039] The following are specific embodiments of the present invention and the accompanying drawings to further describe the technical solutions of the present invention, but the present invention is not limited to these embodiments.

[0040] Example 1

[0041] like Figure 1 As shown, the piezoelectric actuator molding process includes the following steps:

[0042] S1, making an FPC clip 1, dividing the clamping surface of the FPC clip 1 into an A area 1a1 and a B area 1b1, and pre-tinning the FPC clip 1;

[0043] S2. Take an A ceramic sheet 2 and adhere it to the A area 1a1 of the FPC clip 1 while ensuring concentricity. Take a B ceramic sheet 3 and adhere it to the B area 1b1 of the FPC clip 1 while ensuring concentricity.

[0044] S3. Pre-bend the FPC clip 1 so that area A 1a1 and area B 1b1 face each other;

[0045] S4: Bond the copper sheet 4 between the ceramic sheet A 2 and the ceramic sheet B 3, ensuring concentricity between the copper sheet 4 and the ceramic sheet, and spot weld the copper sheet 4 to form a convex welding point 5;

[0046] S5, insert the carbon rod 6 into the middle hole of the FPC clip 1A area 1a1 and fix it to the A ceramic sheet 2;

[0047] S6. Extend the A connection line 1d1 through the A area 1a1 of the FPC clip 1, extend the B connection line 1d2 through the B area 1b1 of the FPC clip 1, and form the C connection point through the external protruding solder joint 5 of the copper sheet 4.

[0048] Preferably, in S1, an FPC substrate is used to make an FPC clip 1 connecting piece A 1a and piece B 1b, wiring is done on piece A 1a and A connecting wires 1d1 are led out, and wiring is done on piece B 1b and B connecting wires 1d2 are led out.

[0049] Preferably, in S2, the A ceramic sheet 2 is bonded to the A region 1a1 of the FPC clip 1 by glue; and the B ceramic sheet 3 is bonded to the B region 1b1 of the FPC clip 1 by glue.

[0050] Preferably, in S2, an FPC tolerance automatic punching machine is used to bond ceramic sheet A 2 / ceramic sheet B 3 to area A 1a1 / area B 1b1 of FPC clip 1. The FPC tolerance automatic punching machine reduces manpower participation, improves bonding accuracy, and enhances work efficiency through fully automatic operation.

[0051] Preferably, in S4, one side of the copper sheet 4 is glued to the inner surface of the A ceramic sheet 2 on the A area 1a1, and the other side of the copper sheet 4 is glued to the inner surface of the B ceramic sheet 3 on the B area 1b1.

[0052] Preferably, in S5, the end of the carbon rod 6 is inserted into the center hole of the FPC clip 1 and bonded to the ceramic sheet A 2. The glue spreads around the inner periphery of the center hole. The glue is stored in the center hole and the periphery of the center hole forms a limit constraint for the glue, thereby preventing the glue from flowing out and contaminating the external area.

[0053] Compared with the existing technology, this piezoelectric actuator molding process has the following beneficial effects:

[0054] 1. The FPC substrate is directly stacked on the outside of the ceramic sheet assembly and the wiring is extended to form an overall automatic assembly, which further improves the concentricity accuracy of the assembly, automatically calibrates to improve the yield rate, and improves work efficiency.

[0055] 2. Automated machine operation reduces scrap rate, reduces labor and material loss costs, and also reduces the amount of glue used.

[0056] 3. The substrate sandwich structure is unlimited, and as much bonding area as possible can prevent FPC from desoldering; and the large area of FPC pads is conducive to automated welding.

[0057] 4. The FPC substrate has a welding port at the welding copper sheet position, and the FPC substrate can be pre-tinned, which is conducive to automation.

[0058] Example 2

[0059] Based on the first embodiment, the difference of this embodiment is that:

[0060] like Figure 2 and Figure 3As shown, a piezoelectric driver structure includes a structure manufactured by the above-mentioned piezoelectric driver molding process.

[0061] Preferably, the FPC clip 1 includes a piece A 1a and a piece B 1b, which are integrally connected by a bending portion 1c. A hole is opened in the center of the piece A 1a, and a connecting piece 1d is protruded from the outside of the piece B 1b. The clamping surface of the piece A 1a is the A area 1a1, and the A connecting line 1d1 extends from the A area 1a1 through the bending portion 1c to the connecting piece 1d. The clamping surface of the piece B 1b is the B area 1b1, and the B connecting line 1d2 extends from the B area 1b1 to the connecting piece 1d.

[0062] Both sheet A 1a and sheet B 1b are circular, with specifications matching those of the ceramic sheet, facilitating coaxial mounting. Bend portion 1c is a strip-shaped, flexible piece capable of folding in half. Connecting sheet 1d is rectangular, with connecting wires A 1d1 and B 1d2 arranged parallel to it.

[0063] Preferably, ceramic sheet A 2 is fixed on area A 1a1, ceramic sheet B 3 is fixed on area B 1b1, and the bent portion 1c is folded in half so that a copper sheet 4 is fixed between ceramic sheet A 2 and ceramic sheet B 3. A welding point 5 is provided on the edge of the copper sheet 4, and a carbon rod 6 is inserted into the middle hole of sheet A 1a to fix ceramic sheet A 2.

[0064] Compared with the existing technology, this piezoelectric driver structure has the following advantages:

[0065] 1. The FPC substrate is directly stacked on the outside of the ceramic sheet assembly and the wiring is extended to form an overall automatic assembly, which further improves the concentricity accuracy of the assembly, automatically calibrates to improve the yield rate, and improves work efficiency.

[0066] 2. Automated machine operation reduces scrap rate, reduces labor and material loss costs, and also reduces the amount of glue used.

[0067] 3. The substrate sandwich structure is unlimited, and as much bonding area as possible can prevent FPC from desoldering; and the large area of FPC pads is conducive to automated welding.

[0068] 4. The FPC substrate has a welding port at the welding copper sheet position, and the FPC substrate can be pre-tinned, which is conducive to automation.

[0069] Example 3

[0070] Based on the second embodiment, the difference of this embodiment is that:

[0071] A camera device includes the piezoelectric driver structure of the second embodiment. The camera device is, for example, any one of the periscope motor, AF motor, and OIS motor of the second embodiment.

[0072] Example 4

[0073] Based on the third embodiment, the difference of this embodiment is that:

[0074] An electronic device, including the above-mentioned piezoelectric driver structure, such as a mobile phone.

[0075] Compared with the existing technology, this electronic device has the following advantages:

[0076] 1. The FPC substrate is directly stacked on the outside of the ceramic sheet assembly and the wiring is extended to form an overall automatic assembly, which further improves the concentricity accuracy of the assembly, automatically calibrates to improve the yield rate, and improves work efficiency.

[0077] 2. Automated machine operation reduces scrap rate, reduces labor and material loss costs, and also reduces the amount of glue used.

[0078] 3. The substrate sandwich structure is unlimited, and as much bonding area as possible can prevent FPC from desoldering; and the large area of FPC pads is conducive to automated welding.

[0079] 4. The FPC substrate has a welding port at the welding copper sheet position, and the FPC substrate can be pre-tinned, which is conducive to automation.

[0080] The specific embodiments described herein are merely illustrative of the spirit of the present invention. Persons skilled in the art may make various modifications, additions, or substitutions to the described specific embodiments without departing from the spirit of the present invention or exceeding the scope of the appended claims.

[0081] Although this document frequently uses terms such as FPC clip 1; A sheet 1a; A region 1a1; B sheet 1b; B region 1b1; bent portion 1c; connecting sheet 1d; A connecting wire 1d1; B connecting wire 1d2; A ceramic sheet 2; B ceramic sheet 3; copper sheet 4; solder joint 5; and carbon rod 6, the use of other terms is not excluded. These terms are used solely to more conveniently describe and explain the essence of the present invention; interpreting them as any additional limitations would be contrary to the spirit of the present invention.

[0082] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

Claims

1. A piezoelectric actuator forming process, characterized in that: The following steps are involved: S1. Make an FPC clip, divide the clamping surface of the FPC clip into area A and area B, and pre-tin the FPC clip; S2. Take a ceramic sheet A and bond it to the A area of the FPC clip while ensuring concentricity. Take a ceramic sheet B and bond it to the B area of the FPC clip while ensuring concentricity. S3. Pre-bend the FPC clip so that area A and area B are opposite to each other; S4. Bond a copper sheet between ceramic sheet A and ceramic sheet B, ensuring concentricity between the copper sheet and the ceramic sheet, and spot weld the copper sheet to form a convex welding point; S5. Insert the carbon rod into the middle hole of the FPC clip A area and fix it to the A ceramic sheet; S6. Extend the A connecting wire through the A area of the FPC clip, extend the B connecting wire through the B area of the FPC clip, and form the C connecting point through the external convex solder joint of the copper sheet.

2. The piezoelectric driver molding process according to claim 1, characterized in that: In S1, an FPC substrate is used to make an FPC clip connecting piece A and piece B, wiring is done on piece A and an A connection line is led out, and wiring is done on piece B and a B connection line is led out.

3. The piezoelectric driver molding process according to claim 2, wherein: In S2, ceramic sheet A is bonded to area A of the FPC clip by glue; ceramic sheet B is bonded to area B of the FPC clip by glue.

4. The piezoelectric driver forming process according to claim 2, wherein: In S2, an FPC tolerance automatic punching machine is used to bond ceramic sheet A / ceramic sheet B to area A / area B of the FPC clip.

5. The piezoelectric driver molding process according to claim 2, wherein: In S4 , one side of the copper sheet is bonded to the inner surface of the A ceramic sheet in the A region by applying glue, and the other side of the copper sheet is bonded to the inner surface of the B ceramic sheet in the B region by applying glue.

6. The piezoelectric driver forming process according to claim 2, wherein: In S5, the end of the carbon rod is glued into the middle hole of the FPC clip to bond the A ceramic sheet, and the glue spreads around the inner periphery of the middle hole.

7. A piezoelectric actuator structure, characterized in that: The invention comprises a structure produced by the piezoelectric driver molding process according to any one of claims 2 to 6.

8. The piezoelectric actuator structure according to claim 7, wherein: The FPC clip includes an A piece and a B piece, and the A piece and the B piece are integrally connected by a bending portion. A central hole is opened in the center of the A piece, and a connecting piece is protruding from the outside of the B piece. The clamping surface of the A piece is the A area, and the A connecting line extends from the A area through the bending portion to the connecting piece. The clamping surface of the B piece is the B area, and the B connecting line extends from the B area to the connecting piece.

9. The piezoelectric actuator structure according to claim 8, wherein: The A ceramic sheet is fixed on the A area, and the B ceramic sheet is fixed on the B area. The bent portion is folded in half so that the copper sheet is clamped between the A ceramic sheet and the B ceramic sheet. A welding point is provided on the edge of the copper sheet. The carbon rod is inserted into the middle hole of the A ceramic sheet and is fixed to the A ceramic sheet.

10. A camera device, characterized in that: Comprising the piezoelectric driver structure according to any one of claims 7 to 9.

11. An electronic device, characterized in that: The device comprises the camera as claimed in claim 10.

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