Plasma discharge structure unit for air disinfection based on multilayer mica insulating plate

Abstract

The application provides a plasma discharge structure unit based on a multi-layer mica insulating plate for air disinfection, which is symmetrical in up-down and left-right directions and in a multi-layer stacking shape; from top to bottom, the structure unit comprises a front high-voltage electrode (10), an upper layer mica plate (20), a left grounding electrode (301), a right grounding electrode (302), a high-temperature-resistant insulating adhesive layer (40), a lower layer mica plate (50) and a back high-voltage electrode (60). The working process of the structure unit is also provided. The application proposes a sandwich type discharge structure, which can solve the manufacturing problem of a complex configuration plasma discharge device.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of air sterilization and disinfection and harmful gas purification, and in particular to a plasma discharge structure unit for air sterilization and disinfection based on a multi-layer composite mica insulation plate. BACKGROUND

[0002] Plasma is the fourth state of matter, which is composed of excited state molecules, ground state molecules, active radicals, ions and free electrons. Because the low-temperature plasma at atmospheric pressure contains strong oxidizing active substances such as OH radicals and O atoms, it can quickly destroy the proteins in bacteria and viruses and decompose harmful gases (such as formaldehyde), so it is widely used in the field of air sterilization and disinfection. At present, the commonly used low-temperature plasma is mainly dielectric barrier discharge plasma. In terms of structure, the dielectric barrier discharge plasma generating device is mainly composed of an insulating medium, a high-voltage electrode and a grounded electrode, and the insulating medium is located between the high-voltage electrode and the grounded electrode. By applying a high-voltage sine wave or a high-voltage pulse between the two electrodes, the gas near the electrode can be ionized to produce diffuse plasma. The presence of the insulating medium is mainly to limit the growth of current and avoid the transition of diffuse glow discharge near the electrode to arc. In industrial applications, the insulating medium not only needs to withstand high voltage, but also needs to withstand plasma corrosion and have a long service life. The high-voltage insulating materials that meet these two points are mainly inorganic materials: ceramics and quartz. Because these two materials have extremely high hardness and cannot be directly used for traditional mechanical processing, the dielectric barrier discharge plasma generators widely used in industry are mainly simple ceramic plate configurations or quartz pipe configurations. In these two configurations, the generated plasma is only concentrated on the surface of the insulating medium and cannot fully contact the air, resulting in low sterilization efficiency. Most plasma sterilization products mainly rely on high-concentration ozone to diffuse into the air for sterilization. This scheme obviously cannot be used for real-time sterilization in an environment with people, and cannot meet the one-time sterilization needs of central air conditioning systems.

[0003] In order to meet the growing demand for air sterilization and disinfection applications and improve sterilization efficiency, it is necessary to develop plasma discharge devices with complex configurations (such as gas-permeable features such as grooves and round holes) to ensure full contact between air and plasma. If ceramic or quartz is continued to be used to manufacture the insulating medium plate, it will face many shortcomings such as difficulty in processing, long processing time, high cost, and low yield (for example: it takes about 10-20 hours and costs more than 1000 yuan to process ten 2mm-wide slits on a 2mm-thick, 200mm*150mm ceramic plate using a CNC machine). SUMMARY

[0004] In view of the problems in the prior art, the application provides a plasma discharge structure unit for air disinfection based on a multilayer mica insulation plate, which is symmetrical in up-down and left-right directions and in a multilayer stacking shape; from top to bottom, the structure unit comprises a front high-voltage electrode 10, an upper mica plate 20, a left grounding electrode 301, a right grounding electrode 302, a high-temperature-resistant insulation layer 40, a lower mica plate 50 and a back high-voltage electrode 60.

[0005] The upper mica plate 20 is a rectangular sheet.

[0006] The front high-voltage electrode 10 is fixed to the upper surface of the upper mica plate; the projection shape of the front high-voltage electrode 10 is a rectangle, which is located at the central position of the upper mica plate 20, and the four edges of the front high-voltage electrode 10 are parallel to the four edges of the upper mica plate 20 and maintain a certain distance.

[0007] The left grounding electrode 301 and the right grounding electrode 302 are fixed to the lower surface of the upper mica plate 20; the left grounding electrode 301 and the right grounding electrode 302 are rectangular strips with the same shape, and the four edges thereof are parallel to the four edges of the upper mica plate 20; the left grounding electrode 301 and the right grounding electrode 302 are placed symmetrically on the lower surface of the upper mica plate 20 and the upper surface of the lower mica plate 50, and the left grounding electrode 301 is equidistant from the left edge of the upper mica plate 20 and the right grounding electrode 302 is equidistant from the right edge of the lower mica plate 50; the left edge of the front high-voltage electrode 10 is directly above the left grounding electrode 301, and is aligned with the center line of the left grounding electrode 301 or the right edge of the left grounding electrode 301, preferably the center line of the left grounding electrode 301.

[0008] The lower mica plate 50 is completely the same as the upper mica plate 20; the lower surface of the upper mica plate 20 and the upper surface of the lower mica plate 50 are bonded together through the high-temperature-resistant insulation layer, and the grounding electrodes 301 and 302 are sealed inside the high-temperature-resistant insulation layer and are completely isolated from air; the high-temperature-resistant insulation layer completely covers the lower surface of the upper mica plate 20 and the upper surface of the lower mica plate 50.

[0009] Similarly, the back high-voltage electrode 60 is completely the same as the front high-voltage electrode 10 and is fixed to the lower surface of the lower mica plate 50, and the projection of the back high-voltage electrode 60 on the horizontal plane coincides with the projection of the front high-voltage electrode 10.

[0010] In an embodiment of the application, the thickness of the upper mica plate 20 and the lower mica plate 50 is 0.5mm-1.5mm; the width of the upper mica plate 20 is 10mm-20mm.

[0011] In a specific embodiment of the application, the thickness of the upper mica plate 20 and the lower mica plate 50 is 1mm.

[0012] In another embodiment of the present application, the four edges of the front high-voltage electrode 10 are kept 1-2 mm apart from the four edges of the upper mica plate 20; the thickness of the front high-voltage electrode 10 ranges from 5 μm to 50 μm; and the width of the front high-voltage electrode 10 is 7-17 mm.

[0013] In another specific embodiment of the present application, the thickness of the front high-voltage electrode 10 is 10 μm.

[0014] In yet another embodiment of the present application, the thickness of the left and right ground electrodes 301 and 302 ranges from 5 μm to 10 μm; and the width of the left and right ground electrodes 301 and 302 is 1-2.5 mm.

[0015] In yet another specific embodiment of the present application, the thickness of the left and right ground electrodes 301 and 302 is 5 μm; and the width of the left and right ground electrodes 301 and 302 is 2 mm. The left edge of the left ground electrode 301 is kept more than 1 mm apart from the left edge of the upper mica plate 20; and the right edge of the right ground electrode 302 is kept more than 1 mm apart from the right edge of the upper mica plate 20.

[0016] In yet another specific embodiment of the present application, the high-temperature-resistant insulation layer is a high-temperature-resistant insulation glue layer 40, and the thickness of the high-temperature-resistant insulation glue layer 40 is 0.1 mm.

[0017] Also provided is a working process of a plasma discharge structure unit for air sterilization based on a multi-layer mica insulation plate, which is based on the plasma discharge structure unit for air sterilization based on a multi-layer mica insulation plate, and is characterized in that: the front high-voltage electrode 10 and the back high-voltage electrode 60 are connected to the output end of a high-voltage power supply, such as a high-voltage high-frequency sine wave power supply; the ground electrodes 301 and 302 are connected to the ground end of the high-voltage high-frequency sine wave power supply; the power supply is turned on, the peak-to-peak value of the output voltage is adjusted to range from 5 kV to 10 kV, and the working frequency ranges from 5 kV to 20 kV, so that the dielectric barrier discharge plasma 70 can be generated at the edges of the front high-voltage electrode 10 and the back high-voltage electrode 60; and since the ground electrodes 301 and 302 are sealed inside the high-temperature-resistant insulation glue layer and there is no air, no plasma is generated in the interlayer.

[0018] The present application uses a multi-layer mica composite plate as the insulation medium of the dielectric barrier discharge plasma, proposes a sandwich type discharge structure, and can solve the manufacturing difficulty of a complex configuration plasma discharge device; compared with the existing ceramic plate and quartz tube discharge device, the present application has the characteristics of low cost, high production efficiency, and easy realization of large-area discharge; in addition, the mica plate is a flexible material with good toughness, and the mica insulation plate will not have the problem of brittle fracture of ceramic materials during long-distance transportation. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 A "sandwich" dielectric barrier discharge plasma structure unit is shown;

[0020] Figure 2 An embodiment of the present application is shown: a slit mica plate dielectric barrier discharge plasma array; where (a) shows a cross-sectional view, (b) shows a top view.

[0021] BRIEF DESCRIPTION OF DRAWINGS

[0022] 10 front high voltage electrode 20 upper mica plate 301 left ground electrode 302 right ground electrode 40 high temperature resistant insulation layer 50 lower mica plate 60 back high voltage electrode 70 plasma column 801 wall bifurcated airflow 802 slit straight airflow 90 slit structure DETAILED DESCRIPTION

[0023] Figure 1 A plasma discharge structure unit for air disinfection based on a multi-layer mica insulation plate is shown. The structure unit is symmetrical up and down, left and right, and is stacked in multiple layers, similar to a "sandwich". From top to bottom, there are front high voltage electrode 10, upper mica plate 20, left ground electrode 301, right ground electrode 302, high temperature resistant insulation layer 40, lower mica plate 50, and back high voltage electrode 60.

[0024] The upper mica plate 20 is a rectangular sheet with a thickness of 0.5mm-1.5mm, preferably 1mm. The mica plate is laminated by multiple layers of insulation mica paper, and the lamination process is well known to those skilled in the art and will not be described in detail here. The thickness of the upper mica plate 20 mainly affects the discharge voltage of the atmospheric pressure plasma, and at a thickness of 1mm, the typical plasma discharge voltage is 6-8kV peak to peak.

[0025] The front high voltage electrode 10 is coated with conductive metal paste (such as silver paste, copper paste, etc.) on the upper surface of the upper mica plate by screen printing, magnetron sputtering or electrochemical deposition surface plating process, and then dried in a constant temperature oven to remove the organic components in the paste and achieve firm adhesion of the front high voltage electrode 10 on the upper surface of the upper mica plate 20. As shown in the top view Figure 2(b) As shown, the projection shape of the front high voltage electrode 10 is rectangular, and is located in the central position of the upper mica plate 20. The four edges of the front high voltage electrode 10 are parallel to the four edges of the upper mica plate 20, respectively, and maintain a certain distance (the distances are not necessarily the same, and a typical value is 1-2 mm, preferably 2 mm). The thickness of the front high voltage electrode 10 ranges between 5 μm and 50 μm, preferably 10 μm. If the electrode thickness is too thin, it will not be resistant to plasma corrosion and will have a short service life. If the electrode thickness is too thick, the electric field strength at the edge will be small, and the plasma generation concentration will be low. Therefore, 10 μm is a preferred value that takes into account both the discharge strength and the service life.

[0026] On the lower surface of the upper mica plate 20, the left ground electrode 301 and the right ground electrode 302 can be firmly and uniformly coated on the lower surface of the upper mica plate 20 using a similar surface coating process (screen printing / magnetron sputtering / electrochemical deposition) as the front electrode 10. The left ground electrode 301 and the right ground electrode 302 are rectangular strips with the same shape, and the four edges are parallel to the four edges of the upper mica plate 20. The left ground electrode 301 and the right ground electrode 302 are placed symmetrically on the lower surface of the upper mica plate 20 and the upper surface of the lower mica plate 50, and the left ground electrode 301 is equidistant from the left edge of the upper mica plate 20 and the right ground electrode 302 is equidistant from the right edge of the lower mica plate 50. The coating thickness of the left ground electrode 301 and the right ground electrode 302 ranges between 5 μm and 10 μm, preferably 5 μm. The lower limit value of 5 μm is chosen for the thickness of the ground electrode because the left ground electrode 301 and the right ground electrode 302 do not directly contact the plasma, and there is no need to consider the problem of reduced service life due to electrode corrosion. The width of the left and right ground electrodes 301 and 302 (i.e. Figure 1The length of the middle along the horizontal direction) is 1-2.5mm (preferably 2mm). The left edge of the left grounding electrode 301 is left of the left edge of the upper mica plate 20, and the distance between the left edge of the left grounding electrode 301 and the left edge of the upper mica plate 20 is kept above 1mm, mainly to avoid the plasma generated by the front high-voltage electrode 10 from bypassing the left edge of the upper mica plate 20 and forming a discharge arc between the left grounding electrode 301 (the "creep" phenomenon). The left edge of the front high-voltage electrode 10 needs to be directly above the left grounding electrode 301, and can be aligned with the middle line of the left grounding electrode 301 or with the right edge of the left grounding electrode 301, preferably aligned with the middle line of the left grounding electrode 301 (the left edge of the front high-voltage electrode 10 must be between the left and right edges of the left grounding electrode 301, and there needs to be some overlap or complete abutment, and the left edge of the front high-voltage electrode 10 cannot be to the right of the right edge of the left grounding electrode 301). Similarly, the right edge of the right grounding electrode 302 needs to be above 1mm from the right edge of the upper mica plate 20, and the projection of the right edge of the front high-voltage electrode 10 in the vertical direction needs to be above the right grounding electrode 302, preferably aligned with the middle line of the right grounding electrode 302.

[0027] Therefore, the width of the upper mica plate 20 affects the width of the front high-voltage electrode 10 (i.e. Figure 1 the length of the middle along the horizontal direction), and the typical width of the upper mica plate 20 is 10-20mm, and the typical width of the front high-voltage electrode 10 is 7-17mm.

[0028] Since the invented discharge structure is symmetrical up and down, the geometric configuration and manufacturing process of the lower mica plate 50 are completely the same as those of the upper mica plate 20. The lower surface of the upper mica plate 20 and the upper surface of the lower mica plate 50 are bonded together by the high-temperature-resistant insulating adhesive layer 40, and the grounding electrodes 301 and 302 are sealed inside the insulating adhesive layer and completely isolated from the air. The high-temperature-resistant insulating adhesive layer 40 completely covers the lower surface of the upper mica plate 20 and the upper surface of the lower mica plate 50, and its thickness is controlled at about 0.1mm, and the inside is dense and cannot have micro-bubbles; the specific type of adhesive is not limited, as long as it has good sealing performance, high insulation strength, and high temperature resistance, and preferably the commonly used insulating and heat-conducting silicone in electrical engineering. In terms of technology, in order to ensure that there are no micro-bubbles inside the high-temperature-resistant insulating adhesive layer during the curing process, a pressing device is used to squeeze the air bubbles between the upper mica plate 20 and the lower mica plate by external force, or the curing of the high-temperature-resistant insulating adhesive layer can be carried out in a micro-vacuum environment. The presence of micro-bubbles can greatly weaken the sealing effect of the high-temperature-resistant insulating adhesive layer 40 on the grounding electrodes 301 and 302, leading to an increase in the "creep" probability between the high-voltage electrodes 10 and 60 and the grounding electrodes 301 and 302, and a decrease in safety.

[0029] Similarly, the reverse high-voltage electrode 60 has the same geometry, material and manufacturing process as the front high-voltage electrode, and is reliably and uniformly coated on the lower surface of the lower mica plate 50.

[0030] The working principle of this invention is as follows: The front high-voltage electrode 10 and the back high-voltage electrode 60 are connected to the output terminal of a high-voltage power supply, such as a high-voltage high-frequency sinusoidal power supply; grounding electrodes 301 and 302 are connected to the grounding terminal of the high-voltage high-frequency sinusoidal power supply; the power is turned on, and the peak-to-peak value range of the output voltage is adjusted to 5-10kV, and the operating frequency range to 5-20kV. This generates dielectric barrier discharge plasma 70 at the edges of the front high-voltage electrode 10 and the back high-voltage electrode 60. Figure 1 As shown. Since the grounding electrodes 301 and 302 are sealed inside the high-temperature insulating adhesive layer and there is no air, no plasma will be generated in the interlayer.

[0031] Implementation Case:

[0032] Figure 2 This is a typical implementation case of applying the invented multilayer mica plate dielectric barrier discharge plasma structure unit to the field of air purification. In this case, as... Figure 2 As shown, the upper mica plate 20 is a rectangular thin sheet with an outer contour dimension of 100mm * 80mm. Four parallel front high-voltage electrodes 10 (16mm wide) are coated on the surface of the upper mica plate 20. A 4mm wide ventilation slit is formed between two adjacent front high-voltage electrodes 10. There are three slits in total, with a length (i.e.,...) Figure 2 (b) The vertical length is 70 mm. The slit plasma array is cut open along a plane perpendicular to the slit centerline to obtain... Figure 2 (a) shows a cross-sectional view. This view is actually composed of four... Figure 1 An array of plasma discharge units. A top view of the embodiment is obtained from above the front high-voltage electrode 10. Figure 2 (b) In practical applications, it is necessary to... Figure 2The slit mica plate medium resistance discharge plasma array in (b) is placed along the direction perpendicular to the air flow, i.e. the upper surface of the front high-voltage electrode 10 directly faces the air flow. The air to be treated flowing through the plasma array is divided into two types, the first type is the wall bifurcated air flow 801, which is converted into wall flow after being blocked by the front high-voltage electrode 10, and the air flow is fully mixed with the plasma generated at the edge of the front high-voltage electrode and then flows into the slit structure 90 after treatment; the second type is the slit straight-through air flow, which directly enters the slit and is fully mixed with the wall bifurcated air flow 801 after entering the slit, and the active substances carried by the wall bifurcated air flow 801 are used to kill bacteria, viruses and harmful gas substances. The wall bifurcated air flow 801 directly flows through the plasma area, and the air purification and disinfection treatment effect is more sufficient than the slit straight-through air flow 802. Therefore, in order to ensure high disinfection treatment efficiency, the width of the slit needs to be controlled to be less than 2 times the thickness of the plasma wall, and the typical value of the thickness is 1-2 mm, therefore, the preferred value of the width of the slit is 2-4 mm.

[0033] According to the above working principle and structure introduction, it is not difficult to conclude that the advantage of the present application is:

[0034] 1. Good mechanical properties. Compared with the traditional ceramic flat plate medium resistance discharge plasma generator, the "sandwich" medium resistance discharge plasma unit based on multiple mica sheets belongs to a flexible exciter (the base material mica sheet is flexible), and has bending ability, strong anti-impact and impact performance.

[0035] 2. Good electrical properties. The new "sandwich" medium resistance discharge plasma unit has a small overlap area between the ground electrode (301, 302) and the high-voltage electrode (10, 60), so the parasitic capacitance is small, the power factor is high in the normal discharge process, and the load matching with the plasma power supply is easier to achieve. To some extent, it can solve the problem of high reactive power, low power efficiency and bulky size of the capacitive plasma discharge power supply.

[0036] 3. High safety factor. The ground electrode is completely encapsulated inside the multiple mica sheets, so even in high humidity and with liquid droplets on the surface, the ground electrode (301, 302) and the high-voltage electrode (10, 60) will not be directly conductive, and there will be no short circuit and thus plasma power damage.

[0037] 4. High plasma generation efficiency. Due to the use of double-sided high-voltage electrode design, the plasma generation area is doubled, and the generation range is larger and the concentration is higher.

[0038] 5. Air purification is more efficient. The multi-layer mica plate has excellent cutting performance and can be easily processed into air-permeable structures such as grooves, slits and round holes. By placing a complex dielectric barrier discharge plasma exciter with air-permeable features in an air conditioning duct or fan flow channel (such as Case 1), the plasma generated at the edge of the high-voltage electrode (10, 60) can be fully contacted and mixed with the incoming air, and by adjusting the plasma intensity, the harmful gases such as bacteria, viruses and formaldehyde in the air can be eliminated at one time.

[0039] Compared with ceramic plates, multi-layer mica plates are also inorganic materials with high insulation and resistance to plasma corrosion. Mica plates are easy to process into groove features, and the raw materials and processing prices are much lower than ceramic materials (for example, ten slits with a width of 2mm can be processed on a mica plate with a thickness of 2mm and an area of 200mm*150mm using laser cutting technology, and the processing cost is less than 10 yuan), and industrialization is easier to achieve.

Claims

1. A plasma discharge structure unit for air decontamination based on a multilayer mica insulating plate, characterized in that, The structure unit is symmetrical up and down and left and right, and is in a multi-layer stack; from top to bottom, it is a front high-voltage electrode (10), an upper mica plate (20), a left grounding electrode (301), a right grounding electrode (302), a high-temperature-resistant insulation layer (40), a lower mica plate (50), and a back high-voltage electrode (60); The upper mica plate (20) is a rectangular sheet. The front high-voltage electrode (10) is fixed on the upper surface of the upper mica plate; the projection shape of the front high-voltage electrode (10) is a rectangle, which is located at the central position of the upper mica plate (20), and the four edges of the front high-voltage electrode (10) are parallel to the four edges of the upper mica plate (20) and maintain a certain distance. The left grounding electrode (301) and the right grounding electrode (302) are fixed on the lower surface of the upper mica plate (20); the left grounding electrode (301) and the right grounding electrode (302) are rectangular strips with the same shape, and the four edges are parallel to the four edges of the upper mica plate (20); the left grounding electrode (301) and the right grounding electrode (302) are placed symmetrically on the lower surface of the upper mica plate (20) and the upper surface of the lower mica plate (50); the left edge of the front high-voltage electrode (10) is directly above the left grounding electrode (301) and is aligned with the center line of the left grounding electrode (301) or the right edge of the left grounding electrode (301). The lower mica plate (50) is completely the same as the upper mica plate (20); the lower surface of the upper mica plate (20) and the upper surface of the lower mica plate (50) are bonded together by a high-temperature-resistant insulation layer; the left grounding electrode (301) and the right grounding electrode (302) are sealed inside the high-temperature-resistant insulation layer and are completely isolated from the air; the high-temperature-resistant insulation layer completely covers the lower surface of the upper mica plate (20) and the upper surface of the lower mica plate (50). Similarly, the back high-voltage electrode (60) is completely the same as the front high-voltage electrode (10) and is fixed on the lower surface of the lower mica plate (50); the projection of the back high-voltage electrode (60) on the horizontal plane coincides with the projection of the front high-voltage electrode (10).

2. The multi-layer mica-based insulating plate based air decontamination plasma discharge structure unit according to claim 1, characterized in that, The thickness of the upper mica plate (20) and the lower mica plate (50) is 0.5mm-1.5mm; the width of the upper mica plate (20) is 10mm-20mm.

3. The multi-layer mica-based dielectric plate based air decontamination plasma discharge structure unit according to claim 2, wherein The thickness of the upper mica plate (20) and the lower mica plate (50) is 1mm.

4. The multi-layer mica-based dielectric plate based air decontamination plasma discharge structure unit of claim 1, wherein, The distance between the four edges of the front high-voltage electrode (10) and the four edges of the upper mica plate (20) is 1-2mm; the thickness of the front high-voltage electrode (10) is 5μm-50μm; the width of the front high-voltage electrode (10) is 7-17mm.

5. The multi-layer mica-based dielectric plate based air decontamination plasma discharge structure unit according to claim 4, wherein The thickness of the front high-voltage electrode (10) is 10μm.

6. The multi-layer mica-based dielectric plate based air decontamination plasma discharge structure unit according to claim 1, wherein The thickness of the left grounding electrode (301) and the right grounding electrode (302) is 5μm-10μm; the width of the left grounding electrode (301) and the right grounding electrode (302) is 1-2.5mm.

7. The multi-layer mica-based dielectric plate based air decontamination plasma discharge structure unit according to claim 1, wherein The thickness of the left grounding electrode (301) and the right grounding electrode (302) is 5 μm; the width of the left grounding electrode (301) and the right grounding electrode (302) is 2 mm; the distance between the left edge of the left grounding electrode (301) and the left edge of the upper mica plate (20) is kept above 1 mm; the distance between the right edge of the right grounding electrode (302) and the right edge of the upper mica plate (20) is kept above 1 mm.

8. The multi-layer mica-based dielectric plate based air decontamination plasma discharge structure unit of claim 1, wherein, The high-temperature-resistant insulating layer is a high-temperature-resistant insulating adhesive layer (40) with a thickness of 0.1 mm.

9. Method of operation of a plasma discharge structure unit for air decontamination based on a multilayer mica insulating plate, based on a plasma discharge structure unit for air decontamination based on a multilayer mica insulating plate according to any one of claims 1 to 8, characterized in that, Specifically, the front high-voltage electrode (10) and the back high-voltage electrode (60) are connected to the output end of the high-voltage power supply of the high-voltage high-frequency sinusoidal wave power supply; the left grounding electrode (301) and the right grounding electrode (302) are connected to the grounding end of the high-voltage high-frequency sinusoidal wave power supply; the power supply is turned on, and the peak-to-peak value of the output voltage is adjusted to the range of 5-10 kV, and the working frequency is adjusted to the range of 5-20 kV, so that the dielectric barrier discharge plasma (70) can be generated at the edges of the front high-voltage electrode (10) and the back high-voltage electrode (60); since the left grounding electrode (301) and the right grounding electrode (302) are sealed inside the high-temperature-resistant insulating adhesive layer and there is no air, no plasma is generated in the interlayer.

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