Microfluidic chip manufacturing method

Abstract

The present invention provides a method for manufacturing a microfluidic chip, comprising the following steps: placing a switching valve into a valve mounting groove of a chip body; injecting a raw material into the gap between the side of the switching valve and the sidewall of the valve mounting groove; and solidifying the raw material to form a sealing ring. The microfluidic chip manufacturing method provided by the present invention can provide a sealing ring on the chip body of the microfluidic chip, and the sealing ring and the chip body have good dimensional compatibility. This manufacturing method helps reduce the risk of problems such as poor sealing of the sealing ring, difficulty in sealing ring installation, and difficulty in valve movement in microfluidic chips.

Description

Technical Field

[0001] The present invention relates to the technical field of microfluidic chips, and in particular to a method for manufacturing a microfluidic chip. Background Art

[0002] A microfluidic chip typically has several microchannels and chambers. During use, different chambers may need to be interconnected (or different microchannels may need to be interconnected) at different times. To this end, a valve is typically provided in the microfluidic chip. The valve can move relative to the microfluidic chip. When the valve is in different positions or postures, the interconnected chambers in the microfluidic chip are different.

[0003] During valve movement, a sealing ring is installed at the valve to prevent fluid leakage from the chamber or microchannel. However, in existing technologies, the size of the sealing ring and the microfluidic chip is poorly compatible, and the sealing ring is often too small or too large. A sealing ring that is too small may result in poor sealing performance; a sealing ring that is too large may cause excessive friction between the sealing ring and the microfluidic chip, resulting in excessive resistance to valve movement, or it may make assembly of the sealing ring and the chip body too difficult. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a method for manufacturing a microfluidic chip, which can provide a sealing ring on the chip body of the microfluidic chip, and the sealing ring and the chip body have good dimensional adaptability.

[0005] A microfluidic chip manufacturing method according to an embodiment of the present invention is used to install a switching valve and a sealing ring on a chip body, wherein the chip body has a valve mounting groove; the microfluidic chip manufacturing method includes:

[0006] placing the switching valve into the valve mounting groove;

[0007] injecting raw materials into the gap between the side of the switching valve and the side wall of the valve installation groove;

[0008] The raw material is solidified to form the sealing ring.

[0009] The microfluidic chip manufacturing method according to an embodiment of the present invention has at least the following beneficial effects: the manufacturing method is equivalent to directly using the combination of the switching valve and the chip body as a mold for the sealing ring. After molding, the sealing ring can closely fit with both the switching valve and the chip body, and the size compatibility between the sealing ring and the chip body is good. Due to the good size compatibility between the sealing ring and the chip body, problems such as poor sealing of the sealing ring, difficulty in sealing ring installation, and difficulty in valve (switching valve) movement are less likely to occur in the microfluidic chip.

[0010] According to some embodiments of the present invention, the raw material is PDMS.

[0011] According to some embodiments of the present invention, the chip body also has a plurality of microchannels, each of the microchannels has a connecting port, the connecting port is arranged on the side wall of the valve mounting groove, and the interior of the switching valve has a connecting flow channel, and the connecting flow channel can be connected with the connecting port; before injecting the raw material into the gap between the side of the switching valve and the side wall of the valve mounting groove, the microfluidic chip manufacturing method also includes: sealing the connecting flow channel and the connecting port; after the raw material is solidified to form the sealing ring, the microfluidic chip manufacturing method also includes: unblocking the connecting flow channel and the connecting port.

[0012] According to some embodiments of the present invention, blocking the connecting channel and the connecting port includes: injecting blocking fluid into the connecting channel and the microchannel; and unblocking the connecting channel and the connecting port includes: sucking the blocking fluid in the connecting channel and the microchannel out of the chip body.

[0013] According to some embodiments of the present invention, the plugging fluid is silicone oil.

[0014] According to some embodiments of the present invention, the chip body also has a plurality of microchannels, each of the microchannels has a connecting port, the connecting port is arranged on the side wall of the valve mounting groove, and the interior of the switching valve has a connecting flow channel, and the connecting flow channel can be connected with the connecting port; before injecting the raw material into the gap between the side of the switching valve and the side wall of the valve mounting groove, the microfluidic chip manufacturing method also includes: inserting a sealing stick into the connecting flow channel to seal the connecting flow channel; after the raw material is solidified to form the sealing ring, the microfluidic chip manufacturing method also includes: removing the switching valve and the sealing ring from the valve mounting groove; extracting the sealing stick from the connecting flow channel, cleaning the raw material remaining in the microchannel; and reinstalling the switching valve and the sealing ring into the valve mounting groove.

[0015] According to some embodiments of the present invention, the chip body includes a first substrate and a second substrate, the first substrate has a receiving groove body, and the second substrate has an avoidance through hole; reinstalling the switching valve and the sealing ring into the valve mounting groove includes: placing the switching valve and the sealing ring into the receiving groove body; stacking the first substrate and the second substrate on each other, and connecting the receiving groove body and the avoidance through hole to form the valve mounting groove; bonding the first substrate and the second substrate.

[0016] According to some embodiments of the present invention, a portion of the switching valve protrudes out of the valve mounting groove along the thickness direction of the chip body; after the raw material is solidified to form the sealing ring, the microfluidic chip manufacturing method further includes: driving the portion of the switching valve protruding out of the valve mounting groove to move, thereby releasing the bonding between the sealing ring and the side wall of the valve mounting groove.

[0017] According to some embodiments of the present invention, a positioning groove is provided on the bottom wall of the valve mounting groove; before injecting raw materials into the gap between the side of the switching valve and the side wall of the valve mounting groove, the microfluidic chip manufacturing method further includes: accommodating one end of the switching valve in the positioning groove.

[0018] According to some embodiments of the present invention, the switching valve includes a valve body and a protrusion, the protrusion is protruded from the side of the valve body, the interior of the switching valve has a connecting flow channel with both ends passing through, a part of the connecting flow channel is located inside the valve body, and the other part is located inside the protrusion, and the gap is formed between the side of the valve body and the side wall of the mounting groove; the microfluidic chip manufacturing method also includes: in the process of injecting raw materials, making the raw materials wrap the side of the protrusion.

[0019] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments, in which:

[0021] Figure 1 is a schematic diagram of a microfluidic chip in one embodiment of the present invention;

[0022] Figure 2 for Figure 1 Schematic diagram of the exploded microfluidic chip in FIG;

[0023] Figure 3 for Figure 1 Cross-sectional view of the microfluidic chip in FIG (without a sealing ring);

[0024] Figure 4 for Figure 3 Schematic diagram of the microfluidic chip after the sealing ring is set;

[0025] Figure 5 for Figure 2 Schematic diagram of the switching valve in;

[0026] Figure 6 for Figure 1A cross-sectional view of the microfluidic chip from another angle (without a sealing ring);

[0027] Figure 7 Schematic diagram of a method for manufacturing a microfluidic chip according to an embodiment of the present invention;

[0028] Figure 8 is a schematic diagram of a method for manufacturing a microfluidic chip according to another embodiment of the present invention;

[0029] Figure 9 Schematic diagram of a method for manufacturing a microfluidic chip according to another embodiment of the present invention;

[0030] Figure 10 for Figure 9 Specific step diagram of step S53 in .

[0031] Reference numerals:

[0032] 100 - microfluidic chip, 101 - chip body, 102 - first substrate, 103 - second substrate, 104 - switching valve, 105 - sealing ring, 106 - plunger, 107 - first feeding hole, 108 - second feeding hole, 109 - third feeding hole, 110 - fourth feeding hole, 111 - fifth feeding hole, 112 - connecting groove;

[0033] 201-accommodating tank, 202-avoidance through hole;

[0034] 301 - first chamber, 302 - second chamber, 303 - third chamber, 304 - fourth chamber, 305 - fifth chamber, 306 - mixing chamber, 307 - gap, 308 - connecting channel, 309 - valve mounting groove, 310 - microchannel, 311 - communication port;

[0035] 401-valve body, 402-protrusion, 403-positioning groove. DETAILED DESCRIPTION

[0036] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0037] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0038] In the description of the present invention, "several" means more than one, "plurality" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of "first" and "second" in the description is solely for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0039] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0040] To facilitate the introduction of the microfluidic chip manufacturing method of the present invention (hereinafter referred to as the manufacturing method), the basic structure of a microfluidic chip 100 that can be manufactured by the manufacturing method is first introduced below.

[0041] Reference Figure 1 and Figure 2 In one embodiment, the microfluidic chip 100 includes a chip body 101, a switching valve 104, a sealing ring 105 and a plunger 106. Figure 3 The chip body 101 has a valve mounting groove 309, and the switching valve 104 can be movably mounted in the valve mounting groove 309 (compare Figure 3 and Figure 4 ). For example, the switching valve 104 is rotatably accommodated in the valve mounting groove 309. The sealing ring 105 is sleeved on the outside of the switching valve 104 and is arranged between the outer surface of the switching valve 104 and the side wall of the valve mounting groove 309. Figure 3 The chip body 101 further has a plurality of microchannels 310 inside. One end of the microchannel 310 has a communication port 311 , and the communication port 311 is disposed on the side wall of the valve mounting groove 309 . Figure 3 In the embodiment, there are ten microfluidic channels 310, five of which are located above the valve mounting slot 309, and the other five are located below the valve mounting slot 309. The interior of the chip body 101 may further include a first chamber 301, a second chamber 302, a third chamber 303, a fourth chamber 304, a fifth chamber 305, and a mixing chamber 306. The five microfluidic channels 310 located above the valve mounting slot 309 are connected to the first chamber 301, the second chamber 302, the third chamber 303, the fourth chamber 304, and the fifth chamber 305, respectively; the five microfluidic channels 310 located below the valve mounting slot 309 converge and connect to the mixing chamber 306.

[0042] Reference Figure 3The switching valve 104 has a connecting channel 308 inside. When the switching valve 104 moves to different positions, the ends of the connecting channel 308 can respectively communicate with different communication ports 311, thereby connecting one of the microchannels 310 located above the valve mounting slot 309 with one of the microchannels 310 located below the valve mounting slot 309. In other words, the ends of the connecting channel 308 can respectively communicate with different communication ports 311, thereby connecting the mixing chamber 306 with one of the first chamber 301, the second chamber 302, the third chamber 303, the fourth chamber 304, and the fifth chamber 305. The plunger 106 is slidably disposed in the mixing chamber 306.

[0043] Reference Figure 3 The chip body 101 may further include a first feeding hole 107, a second feeding hole 108, a third feeding hole 109, a fourth feeding hole 110, and a fifth feeding hole 111 for feeding materials into the microfluidic chip 100. The first feeding hole 107 is connected to the first chamber 301, the second feeding hole 108 is connected to the second chamber 302, the third feeding hole 109 is connected to the third chamber 303, the fourth feeding hole 110 is connected to the fourth chamber 304, and the fifth feeding hole 111 is connected to the fifth chamber 305.

[0044] Reference Figure 4 When the first chamber 301 is connected to the mixing chamber 306 via the connecting channel 308, the plunger 106 can move (upward) and pump material from the first chamber 301 into the mixing chamber 306. Furthermore, the sealing ring 105 can block the remaining communication ports 311 not connected to the connecting channel 308, preventing the material in the second chamber 302, the third chamber 303, the fourth chamber 304, the fifth chamber 305, and the mixing chamber 306 from leaking into the valve mounting groove 309. The situation when the mixing chamber 306 is connected to the second chamber 302, the third chamber 303, the fourth chamber 304, or the fifth chamber 305 is similar and will not be described in detail here.

[0045] Next, the manufacturing method of the microfluidic chip of the present invention is introduced. The manufacturing method is mainly used to install the switching valve 104 and the sealing ring 105 into the chip body 101. Figure 7 In one embodiment, the manufacturing method includes the following steps:

[0046] S10: Install the switching valve 104 into the valve installation groove 309;

[0047] S20: injecting raw materials into the gap 307 between the side of the switching valve 104 and the side wall of the valve installation groove 309;

[0048] S30: solidifying the raw material to form the sealing ring 105 .

[0049] This manufacturing method is equivalent to directly using the combination of the switching valve 104 and the chip body 101 as a mold for the sealing ring 105. After molding, the sealing ring 105 can fit tightly with both the switching valve 104 and the chip body 101, and the dimensions of the sealing ring 105 and the chip body 101 are well matched. Due to the good dimensional compatibility between the sealing ring 105 and the chip body 101, the microfluidic chip 100 is less likely to suffer from problems such as poor sealing of the sealing ring 105, difficulty in installing the sealing ring 105, and difficulty in valve movement.

[0050] The following is some supplementary explanation of the structure of the microfluidic chip 100 and the above-mentioned manufacturing method.

[0051] In one embodiment, the raw material may be PDMS (polydimethylsiloxane). PDMS has a certain degree of flexibility and is suitable for use as the material of the sealing ring 105; in addition, the conditions required for the curing of PDMS are relatively simple and the operation is relatively convenient. In step S20, the injected raw material is fluid PDMS. In step S30, the curing of the raw material may be achieved by heating. For example, if PDMS material is used as the raw material, the microfluidic chip 100 can be placed in an oven as a whole, and the microfluidic chip 100 can be heated in an environment of 80°C for 30 minutes.

[0052] Reference Figure 8 In one embodiment, before step S20 , the manufacturing method further includes step S12 : blocking the connecting flow channel 308 and the communication port 311 ; after step S30 , the manufacturing method further includes step S40 : unblocking the connecting flow channel 308 and the communication port 311 .

[0053] The advantage of this embodiment is that it can prevent raw materials from entering the microchannels 310 and the connecting channels 308 during the pouring process, thereby preventing the raw materials remaining in the microchannels 310 and the connecting channels 308 from affecting the normal use of the microfluidic chip 100 .

[0054] More specifically, in one embodiment, step S12 may include: injecting blocking fluid into the connecting channel 308 and all microchannels 310 ; and step S40 may include: sucking the blocking fluid in the connecting channel 308 and the microchannel 310 out of the chip body 101 .

[0055] Since the blocking fluid is filled in the connecting flow channel 308 and the micro flow channel 310, the raw material used to form the sealing ring 105 is difficult to enter the connecting flow channel 308 and the micro flow channel 310. By blocking the connecting flow channel 308 and the micro flow channel 310 with the blocking fluid, when it is necessary to remove the blocking, the blocking fluid can be sucked out, which is convenient for removing the blocking.

[0056] In one embodiment, the blocking fluid may be silicone oil. Silicone oil has a high viscosity and is not likely to overflow into the valve mounting groove 309. Silicone oil is also not likely to react with PDMS and is not likely to affect the structure of the sealing ring 105 or the chip body 101.

[0057] One relatively simple method of injecting the plugging fluid is to first connect the mixing chamber 306 with the first chamber 301 (e.g. Figure 3 ), then inject the plugging fluid through the five feeding holes and the mixing chamber 306 (the plunger 106 can be withdrawn from the mixing chamber first) until the plugging fluid flows out of each communication port 311. Next, the pump driving the plugging fluid injection is stopped, and the plugging fluid that has overflowed into the valve installation groove 309 is cleaned. After cleaning is completed, the switching valve 104 can be installed.

[0058] It should be noted that since the size of the microchannel 310 in the microfluidic chip 100 is usually at the micron level (the size of the connecting channel 308 is basically the same as the size of the microchannel 310), after the pump stops running, it is difficult for the blocking fluid to flow along the microchannel 310 and overflow into the valve mounting groove 309; moreover, even if the blocking fluid overflows after the pump stops running, the overflow amount is very small, and the impact on the subsequent pouring of raw materials is relatively small.

[0059] Reference Figure 9 In another embodiment, before step S20, the manufacturing method further includes step S13: inserting a sealing stick (not shown) into the connecting flow channel 308 to seal the connecting flow channel 308. Moreover, after step S30, the manufacturing method further includes the following steps:

[0060] S51: Remove the switching valve 104 and the sealing ring 105 from the valve installation groove 309;

[0061] S52: Remove the sealing stick from the connecting channel 308 and clean the raw materials remaining in the microchannel 310;

[0062] S53 : Reinstall the switching valve 104 and the sealing ring 105 into the valve installation groove 309 .

[0063] Due to the presence of the sealing rod, the raw material used to form the sealing ring 105 is difficult to enter the connecting channel 308. The raw material remaining in the microchannel 310 (mainly remaining at the connecting port 311) is cleaned after the sealing ring 105 is formed. The manufacturing method of this embodiment can also prevent the residual raw material from affecting the normal use of the microfluidic chip 100.

[0064] In one embodiment, before reinstalling the switching valve 104 and the sealing ring 105 into the valve mounting groove 309 (i.e., before step S53), the chip body 101 can be unbonded, so that it is convenient to remove the switching valve 104 and the sealing ring 105 from the valve mounting groove 309 after the sealing ring 105 is formed, and it is convenient to clean up the raw materials remaining in the microchannel 310.

[0065] Specifically, refer to Figure 1 and Figure 2 The chip body 101 includes a first substrate 102 and a second substrate 103, which are stacked. The first chamber 301, the second chamber 302, the third chamber 303, the fourth chamber 304, the fifth chamber 305, the mixing chamber 306, the microchannel 310 and the valve installation groove 309 are all formed by stacking the first substrate 102 and the second substrate 103. Figure 2 Taking the microfluidic channel 310 as an example, the first substrate 102 may have a receiving groove 201, and the second substrate 103 may also have a bypass hole 202. After the first substrate 102 and the second substrate 103 are stacked, the bypass hole 202 and the receiving groove 201 are connected to form a valve mounting groove 309. To ensure the structural stability of the microfluidic chip 100, the first substrate 102 and the second substrate 103 are tightly connected together by bonding. The first substrate 102 and the second substrate 103 can be bonded together by thermal compression bonding, adhesive bonding, laser bonding, ultrasonic bonding, etc.

[0066] If the first substrate 102 and the second substrate 103 are not bonded before step S53, then during step S10, the first substrate 102 and the second substrate 103 may simply be stacked together (but not bonded) to form the valve mounting groove 309; then, before proceeding to step S53, the second substrate 103 may be separated from the first substrate 102. Accordingly, step S53 may include the following steps:

[0067] S531: Place the switching valve 104 and the sealing ring 105 into the receiving tank 201;

[0068] S532: The first substrate 102 and the second substrate 103 are stacked on each other, and the receiving groove 201 and the avoidance through hole 202 are connected to form a valve installation groove 309 (the switching valve 104 and a part of the sealing ring 105 will be accommodated in the avoidance through hole 202);

[0069] S533: Bonding the first substrate 102 and the second substrate 103.

[0070] Combine Figure 9 and Figure 10Since the first substrate 102 and the second substrate 103 are bonded after the raw materials are cleaned, when it is necessary to clean the raw materials remaining in the microchannel 310, the first substrate 102 and the second substrate 103 can be separated, and then the raw materials can be scraped off with a thinner needle, or the residual raw materials can be washed away with a fluid.

[0071] It should be noted that, if the connecting channel 308 and the microchannel 310 are sealed with a sealing fluid before pouring the raw material, then during the above step S10 , the first substrate 102 and the second substrate 103 may have been bonded.

[0072] Since the sealing ring 105 needs to be in close contact with the side wall of the valve mounting groove 309, after the sealing ring 105 is formed, the sealing ring 105 is easy to adhere to the side wall of the valve mounting groove 309. At this time, it is necessary to release this bonding effect so that the switching valve 104 can move normally. Therefore, in one embodiment, along the thickness direction of the chip body 101, a part of the switching valve 104 can protrude out of the valve mounting groove 309. This protruding part makes it convenient for the user to clamp or hold with a tool and drive the switching valve 104 to move. For example, based on Figure 1 , the front end of the switching valve 104 can be set to protrude relative to the front side of the second substrate 103.

[0073] Accordingly, after step S30, the manufacturing method may further include the following steps: driving the portion of the switching valve 104 protruding from the valve mounting groove 309 to move, so that the switching valve 104 and the sealing ring 105 move together relative to the chip body 101, thereby releasing the adhesion between the sealing ring 105 and the sidewall of the valve mounting groove 309. In other words, the user can directly twist the switching valve 104 to release the adhesion between the sealing ring 105 and the chip body 101.

[0074] In other embodiments, if the switching valve 104 does not protrude out of the valve mounting groove 309, a connecting groove 112 (e.g., Figure 1 As shown in FIG, the connection groove 112 can be inserted with a tool such as a screwdriver so that the user can twist the switching valve 104 to release the bonding between the sealing ring 105 and the chip body 101.

[0075] Reference Figure 5 The switching valve 104 includes a valve body 401 and a protrusion 402. The protrusion 402 protrudes from the side of the valve body 401. A portion of the connecting flow channel 308 is located inside the valve body 401, and another portion is located inside the protrusion 402. The "gap 307 between the side of the switching valve 104 and the sidewall of the valve mounting groove 309" mentioned in step S20 above specifically refers to the gap 307 between the side (outer peripheral surface) of the valve body 401 and the sidewall of the valve mounting groove 309.

[0076] During the injection of the raw material, the raw material can be wrapped around the side of the protrusion 402. In this way, when the raw material solidifies, the protrusion 402 is inserted into the sealing ring 105, the connection between the switching valve 104 and the sealing ring 105 is tighter, and the sealing ring 105 can rotate synchronously with the switching valve 104. Figure 5 For example, the side surfaces of the protrusion 402 refer to the upper, lower, left and right side surfaces of the protrusion 402.

[0077] Reference Figure 6 In one embodiment, a positioning groove 403 is provided on the bottom wall of the valve mounting groove 309; accordingly, step S10 further includes: accommodating one end of the switching valve 104 in the positioning groove 403. The advantage of this embodiment is that, due to the provision of the positioning groove 403, after the switching valve 104 is placed in the valve mounting groove 309, the position of the switching valve 104 is basically fixed, and the gap 307 between the side of the valve body 401 and the side wall of the valve mounting groove 309 is relatively stable, which makes it convenient to pour the raw materials and can prevent the switching valve 104 from shaking during the raw material pouring or raw material molding process, thereby avoiding the shaking of the switching valve 104 affecting the dimensional accuracy of the sealing ring 105. It should be noted that the "bottom wall" of the valve mounting groove 309 refers to the deepest wall along the concave direction of the valve mounting groove 309, with Figure 6 For example, the “bottom wall” of the valve installation groove 309 refers to the rear end wall surface of the valve installation groove 309 .

[0078] In the description of the present invention, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the exemplary expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Claims

1. A method for manufacturing a microfluidic chip, characterized in that: Used to install a switching valve and a sealing ring on a chip body, the chip body has a valve mounting groove, the chip body also has a plurality of microchannels, each of the microchannels has a connecting port, the connecting port is arranged on the side wall of the valve mounting groove, the interior of the switching valve has a connecting flow channel, the connecting flow channel can be connected with the connecting port; the switching valve includes a valve body and a protrusion, the protrusion is protruding from the side of the valve body, the interior of the switching valve has a connecting flow channel with two ends passing through, a part of the connecting flow channel is located inside the valve body, and the other part is located inside the protrusion; The microfluidic chip manufacturing method comprises: placing the switching valve into the valve mounting groove; blocking the connecting flow channel and the communicating port; Injecting a raw material into a gap between a side surface of the switching valve and a side wall of the valve mounting groove, wherein the gap is formed between the side surface of the valve body and the side wall of the mounting groove, and during the injection of the raw material, the raw material wraps around the side surface of the protrusion; solidifying the raw material to form the sealing ring; Unblocking the connecting flow channel and the communicating port.

2. The method for manufacturing a microfluidic chip according to claim 1, wherein: The raw material is PDMS.

3. The method for manufacturing a microfluidic chip according to claim 1, wherein: Blocking the connecting flow channel and the communication port includes: injecting a blocking fluid into the connecting flow channel and the micro-channel; Unblocking the connecting flow channel and the communication port includes: sucking out the blocking fluid in the connecting flow channel and the micro-channel to the outside of the chip body.

4. The method for manufacturing a microfluidic chip according to claim 3, wherein: The plugging fluid is silicone oil.

5. The method for manufacturing a microfluidic chip according to claim 1, wherein: Before injecting the raw material into the gap between the side of the switching valve and the side wall of the valve installation groove, the microfluidic chip manufacturing method further includes: inserting a sealing stick into the connecting flow channel to block the connecting flow channel; After solidifying the raw material to form the sealing ring, the microfluidic chip manufacturing method further includes: Remove the switching valve and the sealing ring from the valve installation groove; Pulling out the sealing stick from the connecting flow channel and cleaning the raw materials remaining in the micro flow channel; Reinstall the switching valve and the sealing ring into the valve installation groove.

6. The method for manufacturing a microfluidic chip according to claim 5, wherein: The chip body includes a first substrate and a second substrate, the first substrate has a receiving groove, and the second substrate has an avoidance through hole; Reinstalling the switching valve and the sealing ring into the valve installation groove includes: Place the switching valve and the sealing ring into the receiving tank; stacking the first substrate and the second substrate on each other, and communicating the receiving groove body with the avoidance through hole to form the valve installation groove; The first substrate and the second substrate are bonded together.

7. The method for manufacturing a microfluidic chip according to claim 1, wherein: Along the thickness direction of the chip body, a portion of the switching valve protrudes out of the valve mounting groove; After solidifying the raw material to form the sealing ring, the microfluidic chip manufacturing method further includes: driving the portion of the switching valve protruding outside the valve installation groove to move, thereby releasing the bonding between the sealing ring and the side wall of the valve installation groove.

8. The method for manufacturing a microfluidic chip according to claim 1, wherein: A positioning groove is provided on the bottom wall of the valve installation groove; Before injecting the raw material into the gap between the side of the switching valve and the sidewall of the valve installation groove, the microfluidic chip manufacturing method further includes: accommodating one end of the switching valve in the positioning groove.

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