Circuit structure and electrical connection box

Abstract

A circuit structure and an electrical connection box are provided. The circuit structure does not need to arrange the test circuit elements and the electronic elements on the control substrate in a one-to-one correspondence. The circuit structure comprises: a plurality of electronic elements, a plurality of control terminals electrically connected to the plurality of electronic elements, a holding component having insulation and holding the plurality of control terminals, and a control substrate that outputs signals to the electronic elements through the control terminals, wherein the control terminal comprises: a first terminal body portion connected to the control substrate; a pad portion electrically connected to the first terminal body portion, arranged along the holding component and exposed from a portion of the holding component; and a second terminal body portion electrically connected to the pad portion and the electronic elements.

Description

Technical Field

[0001] The present disclosure relates to a circuit structure and an electrical connection box. Background Art

[0002] Patent Document 1 discloses a circuit structure having a control substrate, a plurality of switching elements that operate based on signals from the control substrate, and a bus bar that constitutes a power circuit. The switching elements are connected to the bus bar by solder. In the manufacturing process of the circuit structure, an internal circuit test is performed as an electrical inspection to confirm that there is no poor connection of electronic components such as switching elements.

[0003] Prior art literature

[0004] Patent Document 1: Japanese Patent Application Publication No. 2019-96769 Summary of the invention

[0005] Problems to be solved by the invention

[0006] In the past, in order to conduct internal circuit testing, such as Fig. 9 As shown, a test circuit element 99 for individually performing on-off control of the switch element is mounted on a control substrate 91 provided in the circuit structure 90. The test circuit element 99 is electrically connected to the switch element via a control terminal 92. For example, when the circuit structure 90 has eight switch elements, the control substrate 91 is equipped with the same number of test circuit elements 99 as the switch elements. The switch element and the test circuit element 99 are connected via the control terminal 92 in a one-to-one relationship. This is because in the control substrate 91, a plurality of switch elements are in a state where they can be electrically connected to each other, and in contrast, in the electrical inspection, it is necessary to confirm that there is no connection failure for each switch element.

[0007] In the case of the circuit structure 90, the control substrate 91 needs the same number of test circuit elements 99 as the switch elements. The control substrate 91 also needs a control circuit unit 93 that is not used for testing but for actually making the switch elements function. When the number of test circuit elements 99 increases, the dedicated area thereof increases, and the control substrate 91 becomes larger.

[0008] Therefore, an object of the present disclosure is to provide a circuit structure that does not require that test circuit elements and electronic components be provided on a control substrate in a one-to-one correspondence.

[0009] Technical solutions to solve problems

[0010] A circuit structure of one embodiment of the present invention comprises: a plurality of electronic components, a plurality of control terminals electrically connected to the plurality of electronic components, a holding component having insulation properties and holding the plurality of control terminals, and a control substrate that outputs signals to the electronic components through the control terminals, wherein the control terminals comprise: a first terminal body portion connected to the control substrate; a pad portion electrically connected to the first terminal body portion, arranged along the holding component and exposed from a portion of the holding component; and a second terminal body portion electrically connected to the pad portion and the electronic components.

[0011] An electrical junction box according to one aspect of the present disclosure includes the above-mentioned circuit structure and a cover covering the above-mentioned circuit structure.

[0012] Effects of the Invention

[0013] According to the present disclosure, in the circuit structure, it is possible to eliminate the need to provide a test circuit element of a conventional electronic element on a control substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a perspective view of an electrical junction box including the circuit structure according to the present embodiment.

[0015] Figure 2 It is from Figure 1 A perspective view of the circuit structure when viewed from the opposite side.

[0016] Figure 3 This is an exploded view of the circuit structure after the control board is removed.

[0017] Figure 4 It is a cross-sectional view showing a part of the control terminal and the holding member.

[0018] Figure 5 It is a perspective view showing a part of the control terminal and the holding member.

[0019] Figure 6 yes Figure 5 A cross-sectional view taken in the V direction.

[0020] Figure 7 It is a cross-sectional view showing a part of a mold for molding a holding member made of resin.

[0021] Figure 8 This is a cross-sectional view showing a state in which a holding member is molded using a control terminal as an insert product.

[0022] Fig. 9 This is an explanatory diagram of a conventional circuit structure. DETAILED DESCRIPTION

[0023] <Overview of Embodiments of the Present Disclosure>

[0024] Hereinafter, the outline of the embodiments of the present disclosure will be described.

[0025] (1) The circuit structure of this embodiment comprises: a plurality of electronic components, a plurality of control terminals electrically connected to the plurality of electronic components, a holding component having insulation properties and holding the plurality of control terminals, and a control substrate for outputting signals to the electronic components through the control terminals, wherein the control terminals comprise: a first terminal body portion connected to the control substrate; a pad portion electrically connected to the first terminal body portion, arranged along the holding component and exposed from a portion of the holding component; and a second terminal body portion electrically connected to the pad portion and the electronic components.

[0026] According to the circuit structure of this embodiment, the pad portion of the control terminal is arranged along the holding member and exposed from a part of the holding member. Before the control substrate is connected to the first terminal body of the control terminal, the probe of the tester for electrical inspection is brought into contact with each pad portion, so that electrical inspection of each of the plurality of electronic components can be performed. Therefore, it is not necessary to set a circuit element for testing the electronic components as in the past on the control substrate.

[0027] (2) Preferably, the first terminal main body portion comprises: a first surface, exposed from the retaining component; and a second surface, which is a surface on the opposite side of the first surface and exposed from the retaining component, and the pad portion comprises: an exposed surface, exposed from the retaining component; and a contact surface, which is a surface on the opposite side of the exposed surface and contacts with the retaining component.

[0028] The first surface of the first terminal body and the second surface on the opposite side are both exposed from the retaining member, so when the probe of the tester is supposed to contact the first surface or the second surface, the first terminal body may be deformed. When the first terminal body is deformed, the connection with the control substrate may be defective. In contrast, in the pad portion, the surface (contact surface) on the opposite side of the exposed surface contacts the retaining member, so even if the probe of the tester contacts the exposed surface, the pad portion can be prevented from being deformed.

[0029] (3) The first terminal body, the pad portion, and the second terminal body may be different components, and the control terminal is a structure in which the components are joined, for example, by welding. However, it is preferred that the first terminal body, the pad portion, and the second terminal body are made of the same metal component. In this case, the first terminal body, the pad portion, and the second terminal body do not need to be joined.

[0030] (4) Preferably, the pad portion is extended from the base of the first terminal body portion, and the holding member has an embedded portion, and the embedded portion embeds the boundary area between the first terminal body portion and the pad portion in the control terminal. In this case, the pad portion is exposed from the holding member, but the embedded portion can be used to prevent the first terminal body portion from floating from the holding member.

[0031] (5) Preferably, the exposed surface of the pad portion has an elongated shape.

[0032] The probe of the tester can be brought into contact with the target area of ​​the exposed surface of the pad part away from the first terminal body so that the probe does not interfere with the first terminal body. The exposed surface of the pad part is not only the target area, but also has an elongated shape that includes the target area in part.

[0033] This is because the holding component is made of resin and is formed by injection molding using a mold, so that a part of the metal component as the pad portion contacts the mold, and the contacted portion becomes the exposed surface. In other words, when the metal component contacts the mold, the longer the contacted portion is, the more stably the metal component is positioned. In this way, if the exposed surface of the pad portion is set to a slender shape, the contact area between the metal component and the mold is increased, the metal component is stable, and the generation of defective products can be suppressed.

[0034] (6) Preferably, the second terminal main body has: a terminal surface exposed from the holding member and connected to the electronic component; and a second exposed surface which is a surface opposite to the terminal surface and exposed from the holding member.

[0035] When the retaining member is made of resin and is formed by injection molding using a mold, the metal member as the second terminal body can be partially contacted with the mold for positioning, and the mold is contacted with the portion in a manner of clamping from both sides to form the terminal surface and the second exposed surface. In this way, the mold is contacted from both sides, thereby improving the positioning accuracy of the second terminal body, especially the terminal surface. As a result, poor connection between the terminal surface and the electronic component can be suppressed.

[0036] (7) The electrical junction box of the present embodiment includes: the circuit structure described in any one of (1) to (6) above; and a cover covering the circuit structure.

[0037] According to the electrical junction box of this embodiment, the electrical inspection of each of the plurality of electronic components can be performed by bringing the probes of the tester into contact with the pads of the control terminals of the circuit structure. Therefore, it is not necessary to provide a circuit unit for testing the electronic components on the control board as in the past.

[0038] <Details of the embodiments of the present disclosure>

[0039] Hereinafter, the details of the embodiments of the present disclosure will be described with reference to the drawings. In addition, at least a part of the embodiments described below may be arbitrarily combined.

[0040] [About electrical connection box 10]

[0041] Figure 1 It is a three-dimensional view of an electrical connection box 10 having a circuit structure 11 of the present embodiment. The electrical connection box 10 can be mounted on various devices, but the electrical connection box 10 of the present embodiment is mounted on a car. Specifically, the electrical connection box 10 is located in the middle of a wiring path connecting a first vehicle-mounted device and a second vehicle-mounted device not shown in the figure. The electrical connection box 10 has a circuit structure 11 and a cover 12 covering the circuit structure 11. The cover 12 is made of metal (aluminum or aluminum alloy), for example, and has a heat dissipation function for dissipating heat generated in the circuit structure 11. Although the electrical connection box 10 is not shown in the figure, other units installed on the circuit structure 11 may be provided on the opposite side of the cover 12.

[0042] [Regarding circuit structure 11]

[0043] Figure 2 It is from Figure 1 This is a perspective view of the circuit structure 11 when viewed from the opposite side. Figure 2 The state after the cover body 12 is removed is shown. Figure 1 and Figure 2 In the embodiment, the circuit structure 11 includes a plurality of electronic components 15 , a plurality of control terminals 16 , a holding member 14 , and a control substrate 13 . Figure 3 1 is an exploded view of the circuit structure 11 with the control substrate 13 removed. The circuit structure 11 further includes a plurality of conductive plates 17. The plurality of conductive plates 17 and the plurality of control terminals 16 constitute a power circuit of the circuit structure 11.

[0044] In this embodiment, the circuit structure 11 includes three (three) conductive plates 17 (see Figure 1 ), with eight control terminals 16 (refer to Figure 3 ). The number of control terminals 16 is the same as that of electronic components 15, and one control terminal 16 is connected to one electronic component 15 in a one-to-one relationship. In addition, the number of conductive plates 17, control terminals 16, electronic components 15, and control substrates 13 is arbitrary and can be changed freely.

[0045] The electronic component 15 is, for example, a semiconductor relay such as a field effect transistor (FET). In the following description, the electronic component 15 is a field effect transistor, and the field effect transistor is referred to as "FET". The FET 15 has a plurality of terminals. Figure 1 As shown in the enlarged view of , FET 15 has a source terminal (first terminal) 15a, a gate terminal (second terminal) 15b, and a drain terminal (third terminal) 15c as a plurality of terminals. Each terminal is mechanically and electrically connected to the conductive plate 17 or the control terminal 16 by solder or the like.

[0046] The conductive plate 17 is manufactured by stamping a metal plate into a predetermined shape. The conductive plate 17 is a metal plate, also called a bus bar. The conductive plate 17 is preferably a copper member such as pure copper or a copper alloy. The conductive plate 17 is a conductor as a whole, and the wiring pattern of a general printed circuit board is not formed on the conductive plate 17. Figure 1 As shown, the circuit structure 11 includes a first conductive plate 17 - 1 , a second conductive plate 17 - 2 , and a third conductive plate 17 - 3 .

[0047] The control terminal 16 is manufactured by punching a metal wire into a predetermined shape. The control terminal 16 is a metal terminal. The control terminal 16 is preferably a copper member such as pure copper or a copper alloy. Figure 4 1 is a cross-sectional view showing a part of the control terminal 16 and the holding member 14. The control terminal 16 has a bent shape and includes a first terminal body portion 31, a pad portion 33, and a second terminal body portion 32. Details of each part of the control terminal 16 will be described later.

[0048] exist Figure 2 In the embodiment, the control substrate 13 is an insulating substrate of a substantially rectangular shape, and has a control circuit unit 27 on its first surface 13a. The control circuit unit 27 has a function of outputting a signal to the FET 15 through the control terminal 16. The FET 15 operates based on the signal. The control circuit unit 27 is a second electronic component for enabling the FET 15 to function, and has an integrated circuit including a switching element and a diode. The control circuit unit 27 includes a wiring pattern 29 for electrically connecting the second electronic component to the control terminal 16.

[0049] The control substrate 13 is formed with a through hole 18 (see Figure 3 ). By filling the through hole 18 with a conductive material, the control circuit portion 27 is mechanically and electrically connected to a portion of the first terminal main body portion 31 of the control terminal 16. In the state before the control substrate 13 is connected to the control terminal 16 (refer to Figure 3), the plurality of control terminals 16 are not electrically connected to each other (non-energized state).

[0050] The holding member 14 is made of thermoplastic resin and is formed by injection molding. In this embodiment, as will be described later, the holding member 14 is formed by placing the control terminal 16 and the conductive plate 17 in the injection molding mold 60 (see Figure 7 ). Therefore, a part of the control terminal 16 and a part of the conductive plate 17 are embedded in the holding member 14, and the control terminal 16, the conductive plate 17 and the holding member 14 are integrated. The control terminal 16 and the conductive plate 17 are insert products integrated with the holding member 14 made of resin.

[0051] The holding member 14 is made of, for example, PPS (polyphenylene sulfide), PBT (polybutylene terephthalate), nylon, PP (polypropylene), PE (polyethylene), etc., and has insulating properties. The holding member 14 holds eight control terminals 16 and three conductive plates 17, and functions as a housing of the circuit structure 11. Figure 3 As shown, the holding member 14 has a housing space 30 opened toward the control board 13. A first terminal body 31 and a pad 33 of the control terminal 16 are provided in the housing space 30. The control board 13 is mounted on the first terminal body 31 to close the housing space 30.

[0052] The holding member 14 has a plate-shaped central base portion 19 and a surrounding frame portion 20. Figure 1 As shown, the main body 22 of the conductive plate 17 on which the FET 15 is mounted is provided on the base 19. The main bodies 22 of the three conductive plates 17 are arranged in a plane on the base 19 in a non-overlapping state. The three conductive plates 17 are separately provided and are in a non-contact state. The three conductive plates 17 are separately provided and are in a non-contact state from the control terminal 16.

[0053] In this embodiment (see Figure 1 ), the source terminal 15a of the FET 15 is connected to the third conductive plate 17-3 located in the center. The drain terminal 15c of the FET 15 is connected to the first conductive plate 17-1 or the second conductive plate 17-2. Figure 1 As shown in the enlarged view of FIG. 1 , a through hole 28 is provided in the central third conductive plate 17-3, and a portion of the second terminal main body 32 of the control terminal 16 is exposed from the hole 28. The gate terminal 15b of the FET 15 is connected to a portion of the second terminal main body 32 exposed from the hole 28. As a result, the gate terminal 15b of the FET 15 and the control terminal 16 are electrically connected.

[0054] The frame 20 is provided with a mounting hole 39 for fixing the cover 12. The end 21A of the first conductive plate 17-1 and the end 21B of the second conductive plate 17-2 are provided to protrude to the outside from the frame 20. Cables and the like not shown are connected to these ends 21A and 21B.

[0055] [About control terminal 16]

[0056] Figure 5 1 is a three-dimensional diagram showing a part of the control terminal 16 and the holding member 14. The control terminal 16 has a bent shape as described above, and has a first terminal body portion 31, a pad portion 33, and a second terminal body portion 32. In the present embodiment, the first terminal body portion 31, the pad portion 33, and the second terminal body portion 32 are formed by bending the same metal component. That is, the first terminal body portion 31 is formed by a part of a slender plate-shaped metal component, the pad portion 33 is formed by another part of the above-mentioned metal component, and the second terminal body portion 32 is formed by a part of the above-mentioned metal component that is different from the above-mentioned part and the above-mentioned other part.

[0057] The first terminal body portion 31, the pad portion 33, and the second terminal body portion 32 each have a rectangular shape in cross section (see Figure 6 ). Figure 6 yes Figure 5 The cross-sectional view of the V direction. Figure 5 As shown, the first terminal body portion 31 has a straight line shape. The first terminal body portion 31 is bent at a right angle to the pad portion 33. The pad portion 33 is extended from the base 31a of the first terminal body portion 31 and has a straight line shape. The second terminal body portion 32 is bent at a right angle to the pad portion 33. The pad portion 33 is extended from the base 32a of the second terminal body portion 32 and has a straight line shape. The second terminal body portion 32 has a U-shape.

[0058] [First terminal main body 31]

[0059] The first terminal main body 31 is connected to the control substrate 13 (see Figure 2 and Figure 3 ). The front end of the first terminal main body 31 is inserted into the through hole 18 of the control substrate 13 and is electrically connected to the wiring pattern 29 provided on the control substrate 13. As described above, the control circuit unit 27 of the control substrate 13 outputs a signal to the FET 15 through the control terminal 16. The signal is output from the control substrate 13 to the first terminal main body 31. The signal is transmitted from the first terminal main body 31 through the pad 33 and the second terminal main body 32 (see Figure 5 ) and provided to the gate terminal 15b of FET15.

[0060] The first terminal body 31 has an elongated plate shape. The first terminal body 31 protrudes from the first embedded portion 23 which is a part of the holding member 14. The portion of the first terminal body 31 protruding from the first embedded portion 23 is exposed as a whole. Figure 5 As shown, the first terminal body 31 has: a first surface 41, which is exposed from the holding member 14 on one side in the thickness direction of the first terminal body 31; and a second surface 42, which is a surface on the opposite side of the first surface 41 and is exposed from the holding member 14. In addition, the side surfaces 43 located on both sides between the first surface 41 and the second surface 42 are also exposed surfaces. The first terminal body 31 is in a cantilever beam shape extending from the first embedded portion 23 before being connected to the control substrate 13.

[0061] [Pad portion 33]

[0062] The pad portion 33 is provided extending from the base portion 31a of the first terminal body portion 31 and is electrically connected to the first terminal body portion 31 in an integral manner. The pad portion 33 has an elongated plate shape. Figure 5 As shown, the pad portion 33 is provided along the holding member 14 and is exposed from a portion of the holding member 14. The pad portion 33 is provided along the thick wall portion 50 of the holding member 14.

[0063] like Figure 4 and Figure 5 As shown, the pad portion 33 has a first exposed surface 34 exposed from the holding member 14 and a contact surface 35 on the opposite side of the first exposed surface 34. The first exposed surface 34 has an elongated shape. Specifically, for example, the first exposed surface 34 is an elongated rectangular shape, having a first side 34a and a second side 34b that is more than twice as long as the first side 34a. The contact surface 35 is in contact with the holding member 14 as a whole and is a non-exposed surface that is not exposed from the holding member 14. As described above, the holding member 14 is formed by setting the control terminal 16 in the injection molding mold 60 (refer to Figure 7 Therefore, the pad portion 33 is in a state of being joined to a part of the holding member 14 at the contact surface 35.

[0064] like Figure 6 As shown, the pad portion 33 has a first side surface 36 and a second side surface 37 in addition to the first exposed surface 34 and the contact surface 35. The first side surface 36 is a surface located between the first exposed surface 34 and the contact surface 35. The second side surface 37 is a surface on the opposite side of the first side surface 36 and is located between the first exposed surface 34 and the contact surface 35.

[0065] In the present embodiment, the first side surface 36 is covered by a first thin film portion 51 made of resin, and the second side surface 37 is covered by a second thin film portion 52 made of resin. The first thin film portion 51 and the second thin film portion 52 are each a part of the holding member 14. The first thin film portion 51 and the second thin film portion 52 are each a film-like resin portion, which is thinner than the thick wall portion 50 that the contact surface 35 contacts. A first space portion K1 is formed on the side of the first side surface 36 covered by the first thin film portion 51. A second space portion K2 is formed on the side of the second side surface 37 covered by the second thin film portion 52.

[0066] The side surface 51a of the first thin film portion 51 is exposed in the first space portion K1. The side surface 52a of the second thin film portion 52 is exposed in the second space portion K2. The holding member 14 has a first convex portion 57 protruding from the thick wall portion 50. The first convex portion 57 is provided separately from the pad portion 33. The space formed between the first convex portion 57 and the pad portion 33 (the first thin meat portion 51) is the first space portion K1. The holding member 14 has a second convex portion 58 protruding from the thick wall portion 50. The second convex portion 58 is provided separately from the pad portion 33. The space formed between the second convex portion 58 and the pad portion 33 (the second thin meat portion 52) is the second space portion K2.

[0067] [Second terminal main body 32]

[0068] like Figure 5 As shown, the second terminal body 32 is continuously provided with the pad portion 33. The second terminal body 32 has a shape (U-shape) formed by bending a long and narrow plate. The base 32a of the second terminal body 32 is connected to the pad portion 33, and the second terminal body 32 is electrically connected with the pad portion 33. The second terminal body 32 has: a first sheet 46, which is continuous with the pad portion 33; a second sheet 47, which is spaced apart from the first sheet 46 and provided in parallel; and an intermediate sheet 48, which connects the first sheet 46 and the second sheet 47. The second sheet 47 is exposed from the retaining member 14, and the intermediate sheet 48 has a surface exposed from the retaining member 14.

[0069] The gate terminal 15b of the FET 15 is connected to the intermediate piece 48 by solder or the like. Thus, the second terminal main body 32 is mechanically and electrically connected to the FET 15. The second terminal main body 32 has a terminal surface 45 exposed from the holding member 14 in the intermediate piece 48 thereof, and a second exposed surface 44, which is a surface on the opposite side of the terminal surface 45 and is exposed from the holding member 14. The FET 15 (gate terminal 15b) is connected to the terminal surface 45.

[0070] [Regarding the holding member 14]

[0071] Figure 7 1 is a cross-sectional view showing a portion of a mold 60 for molding a resin holding member 14. Figure 7 The part shown can be obtained Figure 6 1. The cross-sectional structure of the circuit structure 11 shown in FIG. 1. In the circuit structure 11 of the present embodiment, the control terminal 16 and the conductive plate 17 are inserts integrated with the resin holding member 14. When the holding member 14 is formed, the molten resin is filled into the cavity 60a formed in the mold 60. The molten resin is also filled near the control terminal 16. Through this forming, the contact surface 35 of the pad portion 33 of the control terminal 16 becomes in contact with the holding member 14 (see FIG. 1). Figure 6 ) contact state, the pad portion 33 and the holding member 14 are integrated. In the cavity 60a, the resin in the molten state is also filled near the conductive plate 17. As a result, the conductive plate 17 becomes in contact with the holding member 14 (refer to Figure 6 ) contact state and is integrated with the retaining component 14.

[0072] like Figure 7 As shown in FIG. 1 , the exposed surface 34 of the pad portion 33 is formed by contacting with the mold 60 during molding and separating from the mold 60 during demolding. In the mold 60, protrusions 61, 61 are provided on both sides of the pad portion 33. By these protrusions 61, 61, after molding (refer to FIG. 1 ), Figure 6 ), a first space portion K1 is formed on the side of the first side surface 36 of the pad portion 33, and a second space portion K2 is formed on the side of the second side surface 37. The protrusion 61 is a portion constituting a part of the mold 60.

[0073] The cross-sectional shapes of the first space portion K1 and the second space portion K2 are consistent with the cross-sectional shapes of the protrusions 61, 61. In this way, in the mold 60, the protrusions 61 are provided on both sides of the pad portion 33, so that the resin in a molten state is not easy to penetrate between the portion as the exposed surface 34 and the mold 60. In other words, the molten resin flows through the cavity 60a to fill it, and at this time, the protrusion 61 functions as a barrier wall that covers the pad portion 33, and it is not easy to affect the flow of the resin on the pad portion 33.

[0074] Therefore, the control terminal 16 including the pad portion 33 can be prevented from moving or deforming in the cavity 60a due to the injection pressure of the molten resin when the holding member 14 is formed. As a result, the control terminal 16 (pad portion 33) can be prevented from contacting (shorting) with the conductive plate 17.

[0075] like Figure 6As shown in FIG. 1 , after molding, the holding member 14 includes a thick wall portion 50 made of resin in contact with the contact surface 35 of the pad portion 33, a first thin film portion 51 made of resin covering the first side surface 36, and a second thin film portion 52 made of resin covering the second side surface 37. The first thin film portion 51 and the second thin film portion 52 are sufficiently thinner than the thick wall portion 50. The side surface 51a of the first thin film portion 51 is exposed in the first space portion K1. The side surface 52a of the second thin film portion 52 is exposed in the second space portion K2. The pad portion 33 is a structure that is bonded to the resin holding member 14 at the first side surface 36 and the second side surface 37 in addition to the contact surface 35. As a result, the control terminal 16 including the pad portion 33 is not easily detached from the holding member 14.

[0076] As mentioned above (refer to Figure 7 ), in order to maintain the molding of the component 14, a pair of protrusions 61, 61 are provided in the mold 60. A portion of the control terminal 16 (the pad portion 33) is interposed between these protrusions 61, 61. It is conceivable that there are manufacturing errors in the first dimension L1 between the pair of protrusions 61 and the second dimension L2 between the first side 36 and the second side 37 of the control terminal 16. In order to make the pad portion 33 interposed between the pair of protrusions 61, 61, it is preferred to set the first dimension L1 to be slightly larger than the second dimension L2. Thus, a small gap e is formed between the protrusion 61 and the pad portion 33. The resin in a molten state may flow into the small gap e.

[0077] However, the minute gap e is thin, and the molten resin does not easily enter the minute gap e. Therefore, the molten resin does not easily penetrate into between the mold 60 and the first exposed surface 34 of the pad portion 33 through the minute gap e. In addition, when the molten resin entering the minute gap e is hardened, the hardened portion becomes the first thin film portion 51 and the second thin film portion 52.

[0078] The gap size of the micro gap e is preferably set to a value that is not easy for the resin in the molten state to enter. As a result, in the pad portion 33, the corner (edge) 38 formed between the first exposed surface 34 and the first side surface 36 (or the second side surface 37) is exposed. The corner 38 is preferably not covered by the first thin film portion 51 or the second thin film portion 52. When the thick wall portion 50 is used as a reference, the first thin film portion 51 and the second thin film portion 52 are respectively lower than the first exposed surface 34.

[0079] like Figure 4 and Figure 5As shown, the first bent portion 25 between the first terminal body portion 31 and the pad portion 33 is entirely buried by the first buried portion 23 made of resin. The first buried portion 23 is a part of the holding member 14. That is, the holding member 14 has the first buried portion 23 that buries the first boundary area J1 between the first terminal body portion 31 and the pad portion 33 in the control terminal 16. A part of the pad portion 33 and most of the first terminal body portion 31 are exposed from the holding member 14, but the first buried portion 23 can prevent the first terminal body portion 31 from floating from the holding member 14.

[0080] The second bent portion 26 between the second terminal body portion 32 and the pad portion 33 is buried by a second buried portion 24 made of resin. The second buried portion 24 is another part of the holding member 14. That is, the holding member 14 has a second buried portion 24 that buries the second boundary area J2 between the pad portion 33 and the second terminal body portion 32 in the control terminal 16. The second buried portion 24 can prevent the second terminal body portion 32 and the pad portion 33 from floating from the holding member 14.

[0081] In the direction perpendicular to the longitudinal direction of the pad portion 33, as described above (see Figure 6 ), a first space portion K1 and a second space portion K2 are formed on both sides of the pad portion 33, separated by the first film portion 51 and the second film portion 52. That is, the holding member 14 is missing on both sides of the pad portion 33. Figure 5 As shown, in the length direction of the pad portion 33, a first embedded portion 23 is provided on the first terminal body portion 31 side of the pad portion 33 and is embedded in resin. In the length direction of the pad portion 33, a second embedded portion 24 is provided on the second terminal body portion 32 side of the pad portion 33 and is embedded in resin.

[0082] The second bent portion 26 between the pad portion 33 and the second terminal body portion 32 is buried in the second buried portion 24. The second buried portion 24 has a resin surface 54 that is flush with the first exposed surface 34 of the pad portion 33 (same plane). Since the first exposed surface 34 of the pad portion 33 and the resin surface 54 of the second buried portion 24 are flush with each other, the portion of the holding member 14 that covers the portion between the pad portion 33 and the second terminal body portion 32 (base portion 32a) can be easily molded using the mold 60 (see FIG. 1 ). Figure 8 ) forming. In addition, the structure of the mold 60 is simplified.

[0083] The two sides of the intermediate piece 48, which is the middle part of the second terminal main body 32, are exposed from the holding member 14. That is, the second terminal main body 32 has, in the intermediate piece 48: a terminal surface 45, which is exposed from the holding member 14 and connected to the FET 15; and a second exposed surface 44, which is a surface on the opposite side of the terminal surface 45 and is exposed from the holding member 14.

[0084] Figure 8 It is a cross-sectional view showing a state where the holding member 14 is molded using the control terminal 16 as an insert product. Figure 8 The second terminal main body 32 and its surroundings in the control terminal 16 are shown together with the mold 60. As described above, the holding member 14 is made of resin and is formed by injection molding using the mold 60. The metal member serving as the second terminal main body 32 is partially in contact with the mold 60 for positioning. Figure 8 As shown, the mold 60 contacts a portion 32b of the second terminal body portion 32 so as to sandwich the portion 32b from both sides. The portion of the second terminal body portion 32 contacted by the mold 60 forms the terminal surface 45 and the second exposed surface 44.

[0085] Thus, the first portion 60b and the second portion 60c of the mold 60 are brought into contact with the portion 32b of the second terminal main body 32 from both sides, thereby improving the positioning accuracy of the second terminal main body 32, especially the terminal surface 45. As a result, poor connection between the terminal surface 45 and the FET 15 (gate terminal 15b) can be suppressed.

[0086] [Electrical inspection of electronic component (FET) 15]

[0087] In the manufacturing process of the circuit structure 11, an electrical inspection is performed to confirm that there is no connection failure in the FET 15. Figure 3 As shown in the figure, each pad portion 33 of the control terminal 16 is accommodated in the accommodation space 30 of the holding member 14, but each pad portion 33 is exposed to the outside in a state before the control substrate 13 is connected to the control terminal 16. Therefore, before the control substrate 13 is connected to the control terminal 16, the probe of the tester (not shown) is brought into contact with each pad portion 33 to perform electrical inspection of each of the plurality of FETs 15.

[0088] For this purpose, the control terminal 16 includes a pad portion 33 and a second terminal main body portion 32 electrically connected to the pad portion 33 and the FET 15. The pad portion 33 is provided along the resin holding member 14 and is exposed from a portion of the holding member 14. By bringing the probe of the tester into contact with each pad portion 33, electrical inspection of each of the plurality of FETs 15 can be performed. Therefore, it is not necessary to provide a conventional test circuit element 99 (see FIG. 1 ) on the control substrate 13. Fig. 9 ) By omitting the test circuit element 99, the cost of the circuit structure 11 can be reduced, and the control substrate 13 can be miniaturized.

[0089] In this embodiment, the first terminal main body 31 (see Figure 4) has: a first surface 41, which is exposed from the holding member 14; and a second surface 42, which is a surface on the opposite side of the first surface 41 and is exposed from the holding member 14. The first terminal body 31 is a thin and elongated plate, and both the first surface 41 and the second surface 42 are exposed from the holding member 14. Therefore, if the probe of the tester is brought into contact with the first surface 41 or the second surface 42, the first terminal body 31 may be deformed. When the first terminal body 31 is deformed, the connection with the control substrate 13 may be defective.

[0090] In contrast, the pad portion 33 includes: a first exposed surface 34, which is partially exposed from the holding member 14; and a contact surface 35, which is a surface on the opposite side of the first exposed surface 34 and contacts the holding member 14. In the pad portion 33, the surface on the opposite side of the first exposed surface 34 (contact surface 35) contacts the holding member 14, so even if the probe of the tester contacts the first exposed surface 34, the force due to the contact is supported by the holding member 14, and deformation of the pad portion 33 can be prevented.

[0091] The probe of the tester is aligned with the target area Q (see FIG. 1 ) of the first exposed surface 34 of the pad portion 33 away from the first terminal body portion 31 so that the probe does not interfere with the first terminal body portion 31. Figure 5 ) is sufficient. The first exposed surface 34 of the pad portion 33 is not only the target area Q, but also has an elongated shape that includes a portion of the target area Q. For example, the first exposed surface 34 of the pad portion 33 has a second side 34b that is more than three times longer than the first side 34a.

[0092] This is because the holding member 14 is made of resin. Figure 7 As described above, by injection molding using the mold 60, a part of the metal component as the pad portion 33 is brought into contact with the mold 60, and the contacted portion becomes the first exposed surface 34. That is, this is because when the metal component is brought into contact with the mold 60, the longer the contacted portion is, the more stably the metal component is positioned. In this way, if the first exposed surface 34 of the pad portion 33 is set to a slender shape, the contact area between the metal component and the mold 60 is increased, the metal component is stable, and the generation of defective products can be suppressed.

[0093] 〔Other structures〕

[0094] In the present embodiment, regarding the control terminal 16, the first terminal body portion 31, the pad portion 33, and the second terminal body portion 32 are formed by bending the same metal component, and therefore, there is no need to join the first terminal body portion 31, the pad portion 33, and the second terminal body portion 32. In addition, one or all of the first terminal body portion 31, the pad portion 33, and the second terminal body portion 32 may be different components, and the control terminal 16 is a structure in which the various parts are joined, for example, by welding.

[0095] like Figure 4 As shown, the pad portion 33 is provided along the holding member 14, and its contact surface 35 is in contact with the holding member 14 over the entire pad portion 33. As another configuration, a part of the contact surface 35 may be exposed from the holding member 14.

[0096] Although the description has been given of the case where the first exposed surface 34 of the pad portion 33 is in an elongated rectangular shape, it may be in another shape such as a circle or an oval.

[0097] In this embodiment (see Figure 6 ), the first side surface 36 of the pad portion 33 is covered by a first thin film portion 51 made of resin, and the second side surface 37 is covered by a second thin film portion 52 made of resin. As a modified example, one or both of the first thin film portion 51 and the second thin film portion 52 may be omitted.

[0098] The first space portion K1 and the second space portion K2 formed on the sides of the first side surface 36 and the second side surface 37 of the pad portion 33 may have shapes (cross-sectional shapes) other than those shown in the drawings.

[0099] The electronic component 15 (first electronic component 15) may be another component other than a field effect transistor, for example, a mechanical relay, etc. Even in this case, in the completed state of the circuit structure 11, the electronic component 15 is electrically connected to the control substrate 13, and a signal is provided from the control substrate 13 to the electronic component 15 through the control terminal 16, so that the electronic component 15 operates. In addition, an electrical inspection is performed before the control substrate 13 is connected.

[0100] The above-described embodiments are illustrative in all aspects and are not restrictive. The scope of rights of the present invention is indicated by the patent claims rather than the above-described embodiments, and includes all modifications within the scope of equivalence to the structures described in the patent claims.

[0101] Description of Reference Numerals

[0102] 10 Electrical connection box

[0103] 11 Circuit structure

[0104] 12. Cover

[0105] 13 Control board

[0106] 13a Page 1

[0107] 14. Retaining parts

[0108] 15 Electronic components

[0109] 15a source terminal

[0110] 15c Drain terminal

[0111] 15b Gate terminal

[0112] 16 Control terminals

[0113] 17 Conductive plate

[0114] 17-1 First conductive plate

[0115] 17-2 Second conductive plate

[0116] 17-3 The third conductive plate

[0117] 18 Through holes

[0118] 19 base

[0119] 20 Frame

[0120] 21A Terminal

[0121] 21B End

[0122] 22 Main body

[0123] 23 The first buried part

[0124] 24 Second buried part

[0125] 25 First bend

[0126] 26 Second bend

[0127] 27 Control circuit part

[0128] 28 holes

[0129] 29 Wiring pattern

[0130] 30 Containment Space

[0131] 31 first terminal main body

[0132] 31a Base

[0133] 32 Second terminal main body

[0134] 32a Base

[0135] 32b Part

[0136] 33 pad part

[0137] 34 First appearance

[0138] 34a First side

[0139] 34b Second side

[0140] 35 Contact surface

[0141] 36 First side

[0142] 37 Second side

[0143] 38 corners

[0144] 39 Mounting holes

[0145] 41 Page 1

[0146] 42 Side 2

[0147] 43 Side

[0148] 44 Second appearance

[0149] 45 Terminal surface

[0150] 46 The first film

[0151] 47 The second film

[0152] 50 Thick wall part

[0153] 51 First Film Department

[0154] 51a Side

[0155] 52 Second Film Department

[0156] 52a Side

[0157] 54 Resin surface

[0158] 57 First convex part

[0159] 58 Second convex part

[0160] 60 Mould

[0161] 60a Cavity

[0162] 60b Part 1

[0163] 60c Part 2

[0164] 61 protrusion

[0165] J1 First boundary area

[0166] J2 Second boundary area

[0167] K1 First Space Department

[0168] K2 Second Space Department

[0169] L1 First size

[0170] L2 Second size.

Claims

1. A circuit structure comprising: Multiple electronic components; a plurality of control terminals electrically connected to the plurality of electronic components; a holding member having insulating properties and holding the plurality of control terminals; and A control substrate that outputs a signal to the electronic element through the control terminal, The control terminal has: A first terminal main body connected to the control substrate; a pad portion electrically connected to the first terminal main body portion, provided along the holding member, and exposed from a portion of the holding member; and A second terminal body portion is electrically connected to the pad portion and the electronic component, When the direction in which the first terminal main body extends from the pad portion toward the control substrate is defined as a first direction and the direction opposite to the first direction is defined as a second direction, The pad portion has: an exposed surface, which is exposed from the holding member on the first direction side; and a contact surface, which is a surface on the opposite side of the exposed surface and is in contact with the holding member on the second direction side and as a whole. The second terminal main body portion and the pad portion are continuously provided in a U-shape, and the electronic component is electrically connected to the second terminal main body portion on the second direction side.

2. The circuit structure according to claim 1, wherein: The first terminal body has: A first surface exposed from the retaining member; and The second surface is a surface opposite to the first surface and is exposed from the holding member.

3. The circuit structure according to claim 1, wherein: The first terminal body portion, the pad portion, and the second terminal body portion are formed of the same metal member.

4. The circuit structure according to claim 2, wherein: The first terminal body portion, the pad portion, and the second terminal body portion are formed of the same metal member.

5. The circuit structure according to any one of claims 1 to 4, wherein: The pad portion is extended from the base of the first terminal body portion. The holding member has an embedded portion that embeds a boundary region between the first terminal main body portion and the pad portion in the control terminal.

6. The circuit structure according to any one of claims 1 to 4, wherein: The exposed surface of the pad portion has an elongated shape.

7. The circuit structure according to any one of claims 1 to 4, wherein: The second terminal body has: A terminal surface, exposed from the holding member and connected to the electronic component; and The second exposed surface is a surface opposite to the terminal surface, and is exposed from the holding member.

8. An electrical connection box, comprising: The circuit structure according to any one of claims 1 to 7; and The cover body covers the circuit structure.

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