A semiconductor dispensing device and its usage method

Abstract

This invention relates to a semiconductor dispensing equipment and its usage method, belonging to the technical field of dispensing equipment. The dispensing equipment includes a lower frame, a magazine, a first loading machine, a first conveyor line, a dam dispensing machine, a 3D line scan inspection machine, a first unloading machine, a second loading machine, a second conveyor line, a dual-mold dispensing machine, a second unloading machine, and four adsorption heating blocks. The first loading machine, the first conveyor line, the dam dispensing machine, and the 3D line scan inspection machine are all mounted on the lower frame. The first unloading machine is mounted on the first conveyor line, the second loading machine, the second conveyor line, and the dual-mold dispensing machine are all mounted on the lower frame, located downstream of the second loading machine. This dispensing equipment realizes chip fixing and reinforcement, dam dispensing, adhesive path detection, adhesive path plugging and filling, and dam filling dispensing processes, exhibiting high integration and strong practicality.

Description

Technical Field

[0001] This invention belongs to the field of dispensing equipment technology, and specifically relates to a semiconductor dispensing device and its usage method. Background Technology

[0002] In the process of semiconductor dispensing to achieve chip packaging on the board, it is usually necessary to perform processes such as die bonding, wire bonding, damming, glue path inspection, dispensing, and drying on the pre-assembled PCB board semi-finished products. After the chips are assembled, the semi-finished products need to be placed in other equipment for heating and baking. After the semi-finished products are dammed, the glue path size needs to be inspected manually. The automation level is low, the labor cost is high, and the integration level of semiconductor dispensing process is low. Summary of the Invention

[0003] This invention provides a semiconductor dispensing device and its usage method, which solves the technical problem of low integration in existing semiconductor dispensing processes.

[0004] This invention is achieved through the following technical solution: a semiconductor dispensing device, comprising:

[0005] The lower frame has support legs at the bottom.

[0006] A magazine for holding a PCB board;

[0007] The first feeder is installed on the lower frame, and the magazine is placed on the first feeder;

[0008] A first conveyor line is installed on the lower frame. The first conveyor line is located on one side of the first feeder. The first conveyor line is used to convey PCB boards in the magazines on the first feeder.

[0009] A dam-type dispensing machine is installed on the lower frame. The dam-type dispensing machine is located downstream of the first feeder. The dam-type dispensing machine is used to apply dam-type dispensing to the PCB board on the first conveyor line.

[0010] A 3D line scan inspection machine is installed on the lower frame. The 3D line scan inspection machine is located downstream of the dam dispensing machine. The 3D line scan inspection machine is used to detect the diameter and height of the dispensing on the PCB board on the first conveyor line.

[0011] The first unloading machine is installed on the side of the first conveyor line away from the first loading machine. The first unloading machine is equipped with the magazine and is used to receive PCB boards on the first conveyor line.

[0012] The second feeding machine is installed on the lower frame. The second feeding machine is located on one side of the first feeding machine. The PCB board to be glued is placed on the second feeding machine.

[0013] The second conveyor line is installed on the lower frame and is located on one side of the second feeder. The second conveyor line is used to convey PCB boards on the second feeder.

[0014] A dual-mode dispensing machine is installed on the lower frame and is located downstream of the second feeder. The dual-mode dispensing machine is used to dispense adhesive onto PCB boards on the second conveyor line.

[0015] The second unloading machine is installed on the lower frame. The second unloading machine is located on the side of the second conveyor line away from the second loading machine. The second unloading machine is used to receive PCB boards on the second conveyor line.

[0016] Four adsorption heating blocks are installed on the lower frame. The four adsorption heating blocks are located below the dam dispensing machine, the 3D line scanning inspection machine and the dual-mode dispensing machine, respectively. The adsorption heating blocks are used to adsorb and heat the PCB board.

[0017] Optionally, to better implement the present invention, the dam dispensing machine includes:

[0018] The first support is installed on the lower frame and is erected on the conveyor line. The first support is located between the first feeder and the first unfeeder.

[0019] The first slide rod is slidably mounted on the first support, and the first slide rod slides in a direction perpendicular to the first conveyor line;

[0020] The second slide bar is slidably mounted on the first slide bar, and the second slide bar slides along the setting direction of the first conveyor line;

[0021] The first lifting cylinder includes a fixed end and a telescopic end, and the fixed end of the first lifting cylinder is mounted on the second slide rod;

[0022] The first mounting plate is installed on the telescopic end of the first lifting cylinder;

[0023] The first dispensing head is installed on the first mounting plate and is used to apply adhesive to the chip dam on the PCB board.

[0024] Optionally, to better implement the present invention, the 3D line scanning inspection machine includes:

[0025] Mounting base, mounted on the first support, the mounting base is located above the first conveyor line, and the mounting base is located downstream of the first dispensing head;

[0026] The second lifting cylinder includes a fixed end and a telescopic end, wherein the fixed end of the second lifting cylinder is mounted on the mounting base;

[0027] The second mounting plate is installed on the telescopic end of the second lifting cylinder;

[0028] A rotary cylinder is mounted on the second mounting plate;

[0029] A camera is mounted on the second mounting plate, and the camera is used to capture images of the adhesive traces on the PCB board;

[0030] A laser measuring instrument is mounted on the rotary cylinder and is used to measure the adhesive path on the PCB board.

[0031] Optionally, to better implement the present invention, the dual-mold dispensing machine includes:

[0032] The second support is installed on the lower frame, the second support is located above the second conveyor line, and the second support is located between the second feeder and the second unfeeder;

[0033] Two third slide rods are slidably installed on the second support, and the two third slide rods slide perpendicular to the direction of the second conveyor line. The two third slide rods are respectively set close to the second feeder and the second unfeeder.

[0034] Two fourth slide rods are slidably mounted on the two third slide rods respectively, and the two fourth slide rods are arranged along the installation direction of the second conveyor line;

[0035] Two third lifting cylinders are respectively installed on the two fourth sliding rods;

[0036] Two third mounting plates are respectively mounted on the two third lifting cylinders;

[0037] Two second adhesive tips are respectively installed on the two third mounting plates, and the two second adhesive tips are used for filling holes and damming the PCB board, respectively.

[0038] Optionally, to better implement the present invention, the first feeding machine includes:

[0039] The first lifting seat includes a fixed end and a lifting end, wherein the fixed end of the first lifting seat is installed on the lower frame;

[0040] A first clamp is installed at the lifting end of the first lifting seat. The first clamp is used to clamp the magazine and is located at the front end of the first conveyor belt.

[0041] A first conveyor is installed on the lower frame, and a first lifting seat is located at the end of the first conveyor. The first conveyor is used to transfer the magazine containing the PCB board.

[0042] Optionally, to better implement the present invention, the first feeding machine includes:

[0043] The second lifting seat includes a fixed end and a lifting end, wherein the fixed end of the second lifting seat is installed on the lower frame;

[0044] The second clamp is installed at the lifting end of the second lifting seat. The second clamp is used to clamp the magazine. The second clamp is located at the end of the first conveyor belt.

[0045] A second conveyor is mounted on the lower frame, and a second lifting seat is located at the end of the second conveyor. The second conveyor is used to transfer empty magazines.

[0046] Optionally, to better implement the present invention, the second feeding machine includes:

[0047] The third lifting seat includes a fixed end and a lifting end, wherein the fixed end of the third lifting seat is installed on the lower frame;

[0048] The third clamp is installed at the lifting end of the third lifting seat. The third clamp is used to clamp the magazine and is located at the front end of the second conveyor belt.

[0049] The third conveyor is installed on the lower frame, and the third lifting seat is located at the end of the third conveyor. The first conveyor is used to transfer the magazine containing the PCB board.

[0050] Optionally, to better implement the present invention, the second feeding machine includes:

[0051] The fourth lifting seat includes a fixed end and a lifting end, wherein the fixed end of the fourth lifting seat is installed on the lower frame;

[0052] A fourth clamp is installed at the lifting end of the fourth lifting seat. The fourth clamp is used to clamp the magazine and is located at the end of the second conveyor belt.

[0053] A fourth conveyor is installed on the lower frame, and a fourth lifting seat is located at the end of the fourth conveyor. The fourth conveyor is used to transfer empty magazines.

[0054] Optionally, to better implement the present invention, the adsorption heating block includes:

[0055] A fixing plate is installed on the lower frame;

[0056] Support blocks are mounted on the fixed plate;

[0057] A heating block is installed at the end of the support block away from the fixing plate, and the heating block is used to heat the PCB board;

[0058] An adsorption cylinder is mounted on the support block. The heating block has air holes. The adsorption cylinder is connected to the air holes through the support block. The adsorption cylinder is used to adsorb and fix the PCB board.

[0059] Optionally, to better implement the present invention, the following steps are included:

[0060] A. The first conveyor transmits the magazine containing the PCB board to the first clamp. After the height of the first magazine is adjusted at the first lifting seat and the height of the PCB board inside the magazine is equal to the height of the first conveyor line, the external telescopic device pushes the PCB board to push the PCB board onto the first conveyor line.

[0061] B. The first conveyor line transports the PCB board to the heating block below the first dispensing head. The heating block heats the PCB board, and the die bond adhesive on the PCB board cures to fix the chip. The first dispensing head performs dam dispensing around the chip under the action of the first slide rod, the second slide rod and the first lifting cylinder.

[0062] C. The first conveyor line transports the PCB board to the area below the camera, where it is fixed by the heating block. The camera captures and saves images of the adhesive path on the PCB board, and a laser measuring instrument measures the height and dimensions of the adhesive path.

[0063] D. The second conveyor conveys the empty magazine to the second clamp, and the first conveyor line transmits the tested PCB board to the magazine held by the second clamp;

[0064] E. After the PCB board filled with the test PCB board is placed in other baking equipment for processing, it is returned to the third conveyor.

[0065] F. The third conveyor conveys the magazine to the third clamp, and the external telescopic device pushes the PCB board in the magazine to the second conveyor line;

[0066] G. The second transmission line transmits the PCB board to the two heating blocks below the two second glue dots, and the two second glue dots perform hole filling and dam filling glue dispensing on the PCB board.

[0067] H. The fourth conveyor conveys the empty magazine to the fourth clamp. The second conveyor line transfers the PCB board with the adhesive applied to the magazine held by the fourth clamp. After the magazine is filled, it is sent to other oven equipment for drying and curing.

[0068] Compared with the prior art, the present invention has the following advantages:

[0069] The semiconductor dispensing equipment provided by this invention includes a lower frame, a magazine, a first loading machine, a first conveyor line, a damming dispensing machine, a 3D line scan inspection machine, a first unloading machine, a second loading machine, a second conveyor line, a dual-mold dispensing machine, a second unloading machine, and four adsorption heating blocks. The lower frame has legs at its bottom. The magazine is used to hold PCB boards. The first loading machine is mounted on the lower frame, and the magazine is placed on the first loading machine. The first conveyor line is mounted on the lower frame and located to one side of the first loading machine. The first conveyor line is used to transport the PCB boards from the magazine on the first loading machine. The damming dispensing machine is mounted on the lower frame and located downstream of the first loading machine. The damming dispensing machine is used to perform damming dispensing on the PCB boards on the first conveyor line. The 3D line scan inspection machine is mounted on the lower frame and located downstream of the damming dispensing machine. The 3D line scan inspection machine is used to detect the diameter and height of the dispensing on the PCB boards on the first conveyor line. The first unloading machine is mounted on the first conveyor line... The first unloading machine, located on the side away from the first feeder, holds a magazine and is used to receive PCBs from the first conveyor line. The second feeder, mounted on the lower frame and located to the side of the first unloading machine, holds PCBs to be dispensed. A second conveyor line, also mounted on the lower frame and located to the side of the second feeder, is used to transport the PCBs from the second feeder. A dual-mode dispensing machine, located downstream of the second feeder, is used to dispense adhesive onto the PCBs on the second conveyor line. The second unloading machine, also mounted on the lower frame and located on the side of the second conveyor line away from the second feeder, receives the PCBs from the second conveyor line. Four adsorption heating blocks, located on the lower frame and positioned below the dam dispensing machine, the 3D line scanning inspection machine, and the dual-mode dispensing machine, are used to adsorb and heat the PCBs. Thus, the first conveyor line is located between the first feeder and the first unfeeder, the second conveyor line is located between the second feeder and the second unfeeder, the dam dispensing machine and the 3D line scanning inspection machine are located on the first conveyor line, and both the dam dispensing machine and the 3D line scanning inspection machine are equipped with adsorption heating blocks below them. The dual-mode dispensing machine is located on the second unfeeder, and two adsorption heating blocks are installed below the dual-mode dispensing machine.

[0070] Through the above structure, the semiconductor dispensing equipment and its usage method provided by this invention solve the technical problem of low integration in existing semiconductor dispensing processes. Specifically, the PCB board in the magazine is fed to the first conveyor line by the first loading machine. After the dam dispensing machine dispenses adhesive onto the PCB board, a 3D line scan inspection machine detects the adhesive path and chip installation. Subsequently, the first unloading machine collects the inspected PCB board. The PCB board is dried in an external oven and then placed into the second loading machine. The first conveyor line sends the PCB board to the dual-mode dispensing machine for adhesive path filling and dam filling dispensing. After dispensing, the second unloading machine collects the PCB board and places it in a drying device for further drying. An adsorption heating block fixes the PCB board during the dispensing process and heats the die-attach adhesive below the dam dispensing machine to reinforce the chip. Therefore, the dispensing equipment provided by this invention realizes the processes of chip fixing and reinforcement, dam dispensing, adhesive path detection, adhesive path plugging and filling, and dam filling dispensing, with high integration and strong practicality. Attached Figure Description

[0071] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0072] Figure 1 This is a schematic diagram of the semiconductor dispensing equipment provided in an embodiment of the present invention;

[0073] Figure 2 This is another structural schematic diagram of the semiconductor dispensing equipment provided in an embodiment of the present invention;

[0074] Figure 3 This is a schematic diagram of the structure of the 3D line scanning inspection machine in an embodiment of the present invention;

[0075] Figure 4 This is a schematic diagram of the structure of the adsorption heating block in an embodiment of the present invention;

[0076] Figure 5 This is a schematic diagram of the structure of the dual-mode dispensing machine in an embodiment of the present invention;

[0077] Figure 6 This is a schematic diagram of the structure of the dam dispensing machine in an embodiment of the present invention.

[0078] In the diagram: 1-Lower frame; 2-Clip; 3-First feeder; 31-First lifting seat; 32-First clamp; 33-First conveyor table; 4-First conveyor line; 5-Dam dispensing machine; 51-First support; 52-First slide bar; 53-Second slide bar; 54-First lifting cylinder; 55-First mounting plate; 56-First dispensing head; 6-3D line scan inspection machine; 61-Mounting seat; 62-Second lifting cylinder; 63-Second mounting plate; 64-Rotating cylinder 65-Cylinder; 66-Camera; 7-Laser Measuring Instrument; 8-First Unloading Machine; 9-Second Loading Machine; 10-Second Conveyor Line; 10-Dual-Mold Dispensing Machine; 101-Second Support; 102-Third Slide Rod; 103-Fourth Slide Rod; 104-Third Lifting Cylinder; 105-Third Mounting Plate; 106-Second Dispensing Head; 11-Second Unloading Machine; 12-Adsorption Heating Block; 121-Fixing Plate; 122-Support Block; 123-Heating Block; 124-Adsorption Cylinder. Detailed Implementation

[0079] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be described in detail below. Obviously, the described embodiments are merely some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other implementation methods obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0080] Example

[0081] This embodiment provides a semiconductor dispensing device and its usage method to solve the technical problem of low integration in existing semiconductor dispensing processes. The dispensing device includes a lower frame 1, a magazine 2, a first loading machine 3, a first conveyor line 4, a dam-type dispensing machine 5, a 3D line scanning inspection machine 6, a first unloading machine 7, a second loading machine 8, a second conveyor line 9, a dual-mold dispensing machine 10, a second unloading machine 11, and four adsorption heating blocks 12312, wherein:

[0082] The bottom of the lower frame 1 is provided with support legs, and the lower frame 1 is provided with a housing.

[0083] The magazine 2 is used to place the PCB board. The magazine 2 is a square tube with openings at both ends. The inner side wall of the magazine 2 is provided with multiple placement slots, and one PCB board is inserted into each placement slot.

[0084] The first feeder 3 is installed on the lower frame 1. The magazine 2 is placed on the first feeder 3. The magazines 2 containing PCB boards are stacked on the first feeder 3 and fed to the rear by the first feeder 3.

[0085] The first conveyor line 4 is installed on the lower frame 1. The first conveyor line 4 is located on one side of the first feeder 3. The first conveyor line 4 is used to convey the PCB board in the magazine 2 on the first feeder 3. The first conveyor line 4 receives the PCB board in the magazine 2 on the first feeder 3 so that the PCB board can be glued during the conveying process.

[0086] The dam dispensing machine 5 is installed on the lower frame 1. The dam dispensing machine 5 is located downstream of the first feeder 3. The dam dispensing machine 5 is used to apply dam dispensing to the PCB board on the first conveyor line 4.

[0087] The 3D line scan inspection machine 6 is installed on the lower frame 1. The 3D line scan inspection machine 6 is located downstream of the dam dispensing machine 5. The 3D line scan inspection machine 6 is used to detect the diameter and height of the dispensing on the PCB board on the first conveyor line 4.

[0088] The first unloading machine 7 is installed on the side of the first conveyor line 4 away from the first loading machine 3. The first unloading machine 7 is equipped with a magazine 2 and is used to receive PCB boards from the first conveyor line 4.

[0089] The second feeder 8 is installed on the lower frame 1. The second feeder 8 is located on one side of the first feeder 7. The PCB board to be glued is placed on the second feeder 8.

[0090] The second conveyor line 9 is installed on the lower frame 1. The second conveyor line 9 is located on one side of the second feeder 8. The second conveyor line 9 is used to convey the PCB board on the second feeder 8.

[0091] The dual-mode dispensing machine 10 is installed on the lower frame 1. The dual-mode dispensing machine 10 is located downstream of the second feeder 8. The dual-mode dispensing machine 10 is used to dispense glue onto the PCB board on the second conveyor line 9.

[0092] The second unloading machine 11 is installed on the lower frame 1. The second unloading machine 11 is located on the side of the second conveyor line 9 away from the second loading machine 8. The second unloading machine 11 is used to receive PCB boards on the second conveyor line 9.

[0093] Four adsorption heating blocks 12312 are installed on the lower frame 1. The four adsorption heating blocks 12312 are located below the dam dispensing machine 5, the 3D line scanning inspection machine 6 and the dual-mode dispensing machine 10, respectively. The adsorption heating blocks 12312 are used to adsorb and heat the PCB board.

[0094] Through the above structure, the semiconductor dispensing equipment and its usage method provided in this embodiment solve the technical problem of low integration in existing semiconductor dispensing processes. Specifically, the PCB board in the magazine 2 is fed to the first conveyor line 4 by the first loading machine 3. After the dam dispensing machine 5 dispenses adhesive to the PCB board, the 3D line scanning inspection machine 6 detects the dispensing path and chip installation. Subsequently, the first unloading machine 7 collects the inspected PCB board. The PCB board is dried in an external oven and then placed into the second loading machine 8. The first conveyor line 4 sends the PCB board to the dual-mode dispensing machine 10 for adhesive path filling and dam filling dispensing. After dispensing, it is collected by the second unloading machine 11 and then placed in a drying device for drying. The adsorption heating block 12312 fixes the PCB board during the dispensing process and heats the die-bonding adhesive below the dam dispensing machine 5 to reinforce the chip. Therefore, the dispensing equipment provided in this embodiment realizes the processes of chip fixing and reinforcement, dam dispensing, adhesive path detection, adhesive path plugging and filling, and dam filling dispensing, with high integration and strong practicality.

[0095] An optional implementation of this embodiment is as follows: The dam dispensing machine 5 includes a first support 51, a first slide rod 52, a second slide rod 53, a first lifting cylinder 54, a first mounting plate 55, and a first dispensing head 56. The first support 51 is mounted on the lower frame 1 and is erected on the conveyor line. The first support 51 is located between the first loading machine 3 and the first unloading machine 7. The first slide rod 52 is slidably mounted on the first support 51 and slides along a direction perpendicular to the first conveyor line 4. The second slide rod 53 is slidably mounted on the first slide rod 52 and slides along the direction perpendicular to the first conveyor line 4. The first lifting cylinder 54 includes a fixed end and a telescopic end. The fixed end of the first lifting cylinder 54 is mounted on the second slide rod 53. The first mounting plate 55 is mounted on the telescopic end of the first lifting cylinder 54. The first dispensing head 56 is mounted on the first mounting plate 55. The first dispensing head 56 is used to apply adhesive to the chips on the PCB board. After the adsorption heating block 12312 adsorbs the PCB board, the first slide rod 52 and the second slide rod 53 control the first dispensing head 56 to move in the horizontal direction. The first lifting cylinder 54 controls the first dispensing head 56 to move closer to or further away from the PCB board below the first dispensing head 56.

[0096] An optional implementation of this embodiment is as follows: The 3D line scanning inspection machine 6 includes a mounting base 61, a second lifting cylinder 62, a second mounting plate 63, a rotary cylinder 64, a camera 65, and a laser measuring instrument 66. The mounting base 61 is mounted on the first support 51, located above the first conveyor line 4 and downstream of the first adhesive dispensing head 56. The second lifting cylinder 62 includes a fixed end and a telescopic end. The fixed end of the second lifting cylinder 62 is mounted on the mounting base 61. The second mounting plate 63 is mounted on the telescopic end of the second lifting cylinder 62. The rotary cylinder 64 is mounted on the second mounting plate 63. The camera 65 is mounted on the second mounting plate 63 and is used to capture images of the adhesive path on the PCB board. The laser measuring instrument 66 is a Keyence LJ-X8000 series 3D line laser measuring instrument 66, mounted on the rotary cylinder 64, and is used to measure the adhesive path on the PCB board.

[0097] An optional implementation of this embodiment is as follows: The dual-mode dispensing machine 10 includes a second support 101, two third slide rods 102, two fourth slide rods 103, two third lifting cylinders 104, two third mounting plates 105, and two second dispensing heads 106. The second support 101 is mounted on the lower frame 1 and is located above the second conveyor line 9. The second support 101 is located between the second loading machine 8 and the second unloading machine 11. The two third slide rods 102 are slidably mounted on the second support 101 and are perpendicular to the direction of the second conveyor line 9. The sliding mechanism includes two third sliding rods 102 positioned close to the second feeder 8 and the second unfeeder 11, respectively. Two fourth sliding rods 103 are slidably mounted on the two third sliding rods 102, with the two fourth sliding rods 103 positioned along the installation direction of the second conveyor line 9. Two third lifting cylinders 104 are mounted on the two fourth sliding rods 103, and two third mounting plates 105 are mounted on the two third lifting cylinders 104. Two second adhesive dots 106 are mounted on the two third mounting plates 105, and the two second adhesive dots 106 are used for filling and blocking holes in the PCB board, respectively.

[0098] An optional implementation of this embodiment is as follows: The first feeding machine 3 includes a first lifting seat 31, a first clamp 32, and a first conveyor 33. The first lifting seat 31 includes a fixed end and a lifting end. The fixed end of the first lifting seat 31 is installed on the lower frame 1. The first clamp 32 is installed on the lifting end of the first lifting seat 31. The first clamp 32 is used to clamp the magazine 2. The first clamp 32 is located at the front end of the first conveyor belt. The first conveyor 33 is installed on the lower frame 1. The first lifting seat 31 is located at the end of the first conveyor 33. The first conveyor 33 is used to transfer the magazine 2 containing the PCB board. After the first clamp 32 clamps the magazine 2, the PCB board in the magazine 2 is aligned with the first conveyor line 4. An external telescopic device pushes the PCB board onto the first conveyor line 4. A placement area is provided below the first conveyor 33. Empty magazines 2 are stacked in the placement area. Obviously, the external device can be a telescopic rod or a manual pusher.

[0099] An optional implementation of this embodiment is as follows: The first unloading machine 7 includes a second lifting seat, a second clamp, and a second conveyor table. The second lifting seat includes a fixed end and a lifting end. The fixed end of the second lifting seat is installed on the lower frame 1. The second clamp is installed on the lifting end of the second lifting seat. The second clamp is used to clamp the magazine 2. The second clamp is located at the end of the first conveyor belt. The second conveyor table is installed on the lower frame 1. The second lifting seat is located at the end of the second conveyor table. The second conveyor table is used to transport empty magazines 2. The inspected PCB board is directly sent to the magazine 2 on the second clamp by the first conveyor line 4. A placement area is provided below the second conveyor table. Magazines 2 filled with PCB boards are stacked in the placement area for the operator to take out and dry.

[0100] An optional implementation of this embodiment is as follows: The second feeding machine 8 includes a third lifting seat, a third clamp, and a third conveyor. The third lifting seat includes a fixed end and a lifting end. The fixed end of the third lifting seat is installed on the lower frame 1. The third clamp is installed on the lifting end of the third lifting seat. The third clamp is used to clamp the magazine 2. The third clamp is located at the front end of the second conveyor belt. The third conveyor is installed on the lower frame 1. The third lifting seat is located at the end of the third conveyor. The first conveyor 33 is used to transfer the magazine 2 containing the PCB board. The dried PCB board is transferred to the third clamp and pushed into the second conveyor line 9 for filling with glue.

[0101] An optional implementation of this embodiment is as follows: The second feeding machine 11 includes a fourth lifting seat, a fourth clamp, and a fourth conveyor. The fourth lifting seat includes a fixed end and a lifting end. The fixed end of the fourth lifting seat is installed on the lower frame 1. The fourth clamp is installed on the lifting end of the fourth lifting seat. The fourth clamp is used to clamp the magazine 2. The fourth clamp is located at the end of the second conveyor belt. The fourth conveyor is installed on the lower frame 1. The fourth lifting seat is located at the end of the fourth conveyor. The fourth conveyor is used to transport empty magazines 2.

[0102] An optional implementation of this embodiment is as follows: The adsorption heating block 12312 includes a fixing block, a support block 122, a heating block 123, and an adsorption cylinder 124. The fixing plate 121 is installed on the lower frame 1, the support block 122 is installed on the fixing plate 121, and the heating block 123 is installed at the end of the support block 122 away from the fixing plate 121. The heating block 123 is used to heat the PCB board. The adsorption cylinder 124 is installed on the support block 122. The heating block 123 has air holes. The adsorption cylinder 124 is connected to the air holes through the support block 122. The adsorption cylinder 124 is used to adsorb and fix the PCB board. When below the first glue head 56, the heating block 123 heats the PCB board to dry the die bond adhesive on the PCB board, making the chip installation more stable.

[0103] The method of using this semiconductor dispensing equipment includes the following steps: A. The first conveyor 33 transfers the cartridge 2 containing the PCB board to the first clamp 32. After the height of the first cartridge 2 is adjusted by the first lifting seat 31 and the height of the PCB board in the cartridge 2 is level with the height of the first conveyor line 4, the external telescopic device pushes the PCB board to push it onto the first conveyor line 4. B. The first conveyor line 4 transfers the PCB board to the heating block 123 below the first dispensing head 56. The heating block 123 heats the PCB board, and the die bond adhesive on the PCB board cures to fix the chip. The first dispensing head 56 performs perimeter dispensing around the chip under the action of the first slide bar 52, the second slide bar 53, and the first lifting cylinder 54. C. The first conveyor line 4 transfers the PCB board to the area below the camera 65, where it is fixed by the heating block 123. The camera 65 captures the adhesive path on the PCB board and... Save the image. Laser measuring instrument 66 measures the height and dimensions of the adhesive path. D. The second conveyor conveys the empty cartridge 2 to the second fixture. The first conveyor line 4 transfers the inspected PCB board to the cartridge 2 held by the second fixture. E. The cartridge 2 filled with the inspected PCB board is placed in other baking equipment for processing and then returned to the third conveyor. F. The third conveyor conveys the cartridge 2 to the third fixture. An external telescopic device pushes the PCB board in the cartridge 2 to the second conveyor line 9. G. The second conveyor line transfers the PCB board to the two heating blocks 123 below the two second dispensing heads 106. The two second dispensing heads 106 perform hole filling and dam filling dispensing on the PCB board. H. The fourth conveyor conveys the empty cartridge 2 to the fourth fixture. The second conveyor line 9 transfers the dispensed PCB board to the cartridge 2 held by the fourth fixture. After the cartridge 2 is filled, it is sent to other baking equipment for drying and curing.

[0104] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope described in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A semiconductor dispensing device, characterized in that, The utility model relates to a kind of PCB automatic filling and filling machine, including: Lower rack, bottom is equipped with support leg; Clip, the clip is used to place PCB board; First feeding machine, installed on the lower rack, the clip is placed on the first feeding machine; First conveying line, installed on the lower rack, the first conveying line is located in the side of the first feeding machine, the first conveying line is used to convey the PCB board in the clip on the first feeding machine; Dam dispensing machine, installed on the lower rack, the dam dispensing machine is located downstream of the first feeding machine, the dam dispensing machine is used to the PCB board on the first conveying line is dammed and dispensed; 3D line scanning detection machine, installed on the lower rack, the 3D line scanning detection machine is located downstream of the dam dispensing machine, the 3D line scanning detection machine is used to detect the diameter and the height of dispensing on the PCB board on the first conveying line; First discharging machine, installed on the side of the first conveying line away from the first feeding machine, the first discharging machine is placed with the clip, the first discharging machine is used to receive the PCB board on first conveying line; Second feeding machine, installed on the lower rack, the second feeding machine is located in the side of the first discharging machine, the second feeding machine is placed with the PCB board to be dispensed and filled; Second conveying line, installed on the lower rack, the second conveying line is located in the side of the second feeding machine, the second conveying line is used to convey the PCB board on the second feeding machine; Double-mode dispensing machine, installed on the lower rack, the double-mode dispensing machine is located downstream of the second feeding machine, the double-mode dispensing machine is used to the PCB board on the second conveying line is dispensed and filled; Second discharging machine, installed on the lower rack, the second discharging machine is located on the side of the second conveying line away from the second feeding machine, the second discharging machine is used to receive the PCB board on the second conveying line; Four adsorption heating blocks, installed on the lower rack, four the adsorption heating blocks are located below the dam dispensing machine, the 3D line scanning detection machine and the double-mode dispensing machine respectively, and the adsorption heating block is used to adsorb and heat PCB board; The double-mode dispensing machine includes: Second support, installed on the lower rack, the second support is located above the second conveying line, and the second support is located between the second feeding machine and the second discharging machine; Two third sliding rods are slidably installed on the second support respectively, and the two third sliding rods slide perpendicular to the direction of the second conveying line, and the two third sliding rods are arranged close to the second feeding machine and the second discharging machine respectively; Two fourth sliding rods are slidably installed on the two third sliding rods respectively, and the two fourth sliding rods are arranged along the installation direction of the second conveying line; Two third lifting cylinders are installed on the two fourth sliding rods respectively; Two third mounting plates are installed on the two third lifting cylinders respectively; Two second dispensing heads are installed on the two third mounting plates respectively, and the two second dispensing heads are used for hole filling and dam filling of the PCB board respectively.

2. The semiconductor dispensing apparatus according to claim 1, wherein The dam dispensing machine includes: A first support is mounted on the lower frame, the first support is arranged on the first conveying line, and the first support is located between the first feeding machine and the first discharging machine; A first sliding rod is slidably mounted on the first support, and the first sliding rod slides in a direction perpendicular to the first conveying line; A second sliding rod is slidably mounted on the first sliding rod, and the second sliding rod slides in a direction along the first conveying line; A first lifting cylinder includes a fixed end and a telescopic end, and the fixed end of the first lifting cylinder is mounted on the second sliding rod; A first mounting plate is mounted on the telescopic end of the first lifting cylinder; A first dispensing head is mounted on the first mounting plate, and the first dispensing head is used for dispensing glue around a chip on a PCB.

3. The semiconductor dispensing apparatus of claim 2, wherein The 3D line scanning detector includes: A mounting seat is mounted on the first support, the mounting seat is located above the first conveying line, and the mounting seat is located downstream of the first dispensing head; A second lifting cylinder includes a fixed end and a telescopic end, and the fixed end of the second lifting cylinder is mounted on the mounting seat; A second mounting plate is mounted on the telescopic end of the second lifting cylinder; A rotary cylinder is mounted on the second mounting plate; A camera is mounted on the second mounting plate, and the camera is used for shooting an image of a glue path on a PCB; A laser measuring instrument is mounted on the rotary cylinder, and the laser measuring instrument is used for measuring a glue path on a PCB.

4. The semiconductor dispensing apparatus according to claim 3, wherein The first feeding machine includes: A first lifting seat includes a fixed end and a lifting end, and the fixed end of the first lifting seat is mounted on the lower frame; A first clamp is mounted on the lifting end of the first lifting seat, the first clamp is used for clamping the magazine, and the first clamp is located at a front end of the first conveying line; A first conveying table is mounted on the lower frame, the first lifting seat is located at an end of the first conveying table, and the first conveying table is used for conveying the magazine loaded with the PCB.

5. The semiconductor dispensing apparatus of claim 4, wherein The first discharging machine includes: A second lifting seat includes a fixed end and a lifting end, and the fixed end of the second lifting seat is mounted on the lower frame; A second clamp is mounted on the lifting end of the second lifting seat, the second clamp is used for clamping the magazine, and the second clamp is located at an end of the first conveying line; A second conveying table is mounted on the lower frame, the second lifting seat is located at an end of the second conveying table, and the second conveying table is used for conveying the empty magazine.

6. The semiconductor dispensing apparatus of claim 5, wherein The second feeding machine includes: A third lifting seat includes a fixed end and a lifting end, and the fixed end of the third lifting seat is mounted on the lower frame; A third clamp is mounted on the lifting end of the third lifting seat, the third clamp is used for clamping the magazine, and the third clamp is located at a front end of the second conveying line; A third conveying table is mounted on the lower frame, the third lifting seat is located at an end of the third conveying table, and the first conveying table is used for conveying the magazine loaded with the PCB.

7. The semiconductor dispensing apparatus of claim 6, wherein The second discharging machine includes: A fourth lifting seat includes a fixed end and a lifting end, and the fixed end of the fourth lifting seat is mounted on the lower frame; A fourth clamp is installed on the lifting end of the fourth lifting seat, and the fourth clamp is used to clamp the magazine, and the fourth clamp is located at the end of the second conveying line; A fourth conveying table is installed on the lower rack, and the fourth lifting seat is located at the end of the fourth conveying table, and the fourth conveying table is used to convey the empty magazine.

8. The semiconductor dispensing apparatus according to claim 7, wherein The adsorption heating block comprises: A fixed plate is installed on the lower rack; A supporting block is installed on the fixed plate; A heating block is installed on the end of the supporting block away from the fixed plate, and the heating block is used to heat the PCB board; An adsorption air cylinder is installed on the supporting block, and a gas hole is formed on the heating block, the adsorption air cylinder is in communication with the gas hole through the supporting block, and the adsorption air cylinder is used to adsorb and fix the PCB board.

9. A method of using a semiconductor dispensing apparatus as claimed in claim 8, wherein, The method comprises the following steps: A, the first conveying table transmits the magazine with the PCB board to the first clamp, the height of the magazine is adjusted in the first lifting seat, the height of the PCB board in the magazine is leveled with the height of the first conveying line, and the telescopic device pushes the PCB board to the first conveying line; B, the first conveying line transmits the PCB board to the heating block below the first dispensing head, the heating block heats the PCB board, the die bonding glue on the PCB board is solidified to fix the chip, and the first dispensing head performs dam dispensing around the chip under the action of the first slide rod, the second slide rod and the first lifting cylinder; C, the first conveying line transmits the PCB board to the camera below, and the camera adsorbs and fixes the PCB board, the camera takes pictures of the glue road on the PCB board and saves the images, and the laser measuring instrument measures the height and size of the glue road; D, the second conveying table conveys the empty magazine to the second clamp, and the first conveying line transmits the detected PCB board to the magazine clamped by the second clamp; E, after the magazine filled with the detected PCB board is put into other baking equipment for processing, it is put back into the third conveying table; F, the third conveying table conveys the magazine to the third clamp, and the telescopic device pushes the PCB board in the magazine to the second conveying line; G, the second conveying line respectively transmits the PCB board to two heating blocks below two second dispensing heads, and the two second dispensing heads perform hole blocking filling and dam filling dispensing on the PCB board; H, the fourth conveying table conveys the empty magazine to the fourth clamp, the second conveying line transmits the PCB board after dispensing to the magazine clamped by the fourth clamp, and the magazine is filled, and then the magazine is sent to other oven equipment for drying and curing.

Images