A multi-position parallel test and sorting device for power management chips

Abstract

The present invention is applicable to the technical field of power management chip testing and sorting, and provides a power management chip multi-position parallel testing and sorting device, comprising a base, two groups of feeding components are symmetrically installed on the top of the base, and locking mechanisms are installed on opposite sides of the two groups of feeding components. A swinging component is installed on the top of the base, and an adjusting mechanism is installed on one side of the swinging component. The adjusting mechanism is located between the two groups of feeding components. Two groups of testing mechanisms are installed on the top of the base, and the two groups of testing mechanisms are located below the two groups of feeding components. The feeding assembly includes a bracket, which is installed on the top of the base, and a main track is evenly installed on the top of the bracket. Chips are arranged inside the main track. The device solves the problem that a drive abnormality causes the entire device to stop and affect efficiency, and achieves the effect that an abnormality of one track does not affect the operation of other tracks, and achieves the purpose of avoiding material piling.

Description

Technical Field

[0001] The present invention relates to the technical field of power management chip testing and sorting, and more particularly to a multi-position parallel testing and sorting device for a power management chip. Background Art

[0002] A power management chip is a chip that is responsible for the conversion, distribution, detection and other power management of electrical energy in electronic equipment systems. It is mainly responsible for identifying the CPU power supply amplitude, generating corresponding short-torque waves, and driving the subsequent circuit to output power. Chips need to be tested after production before they can be shipped, and chips that fail the test will be screened out. When testing and sorting chips, existing devices feed multiple chips at a time, test multiple positions simultaneously, and sort the chips through a sorting mechanism. However, existing devices have multiple drivers. If one driver malfunctions, it will cause a shutdown and affect efficiency. In addition, the measurement time for different types of chips is different. The next chip is fed before the test is completed, which greatly reduces the test and sorting effect of the test and sorting device. Summary of the Invention

[0003] In view of the shortcomings of the prior art, the present invention aims to provide a multi-position parallel testing and sorting device for a power management chip.

[0004] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a multi-position parallel test and sorting device for a power management chip, comprising a base, two groups of feed assemblies are symmetrically installed on the top of the base, and locking mechanisms are installed on opposite sides of the two groups of feed assemblies. A swing assembly is installed on the top of the base, and an adjustment mechanism is installed on one side of the swing assembly, and the adjustment mechanism is located between the two groups of feed assemblies. Two groups of test mechanisms are installed on the top of the base, and the two groups of test mechanisms are located below the two groups of feed assemblies.

[0005] The present invention is further configured as follows: the feeding assembly includes a bracket, the bracket is installed on the top of the base, the top of the bracket is evenly installed with a main track, and the inside of the main track is provided with a chip.

[0006] The present invention is further configured as follows: the swing assembly includes a support plate, the support plate is installed on the top of the base, the front surface of the support plate is slidably connected to a rod body, the outer wall of the rod body is hinged to a plate body, the top of the plate body is evenly provided with a first slide, the first slide is correspondingly arranged in the main track, the two sides of the plate body are evenly connected with connecting blocks, the connecting blocks are correspondingly arranged in the first slide, the top of the connecting block is provided with a second slide, the second slide is connected to the first slide, the main track is hingedly connected to a connecting track on the side close to the adjustment mechanism, and the connecting track is corresponding to the main track.

[0007] The present invention is further configured as follows: a slide groove is provided on the front surface of the support plate, a slider is slidably connected inside the slide groove, a cylinder is installed on the rear surface of the support plate, and one end of the rod body passes through one side of the slider and is connected to the piston rod of the cylinder.

[0008] The present invention is further configured as follows: the locking mechanism includes a baffle, the baffle is fixedly connected to the end of the connecting track away from the chip, an electric valve is installed at the bottom of the connecting track, and a through groove is opened at the bottom of the connecting track.

[0009] The present invention is further configured as follows: the adjustment mechanism includes a support rod, the support rod is fixedly connected to the front surface of the support plate, a pressure rod is provided on the top of the support rod, the bottom of the pressure rod passes through the top of the support rod and extends to the bottom of the support rod, a spring is connected between the top of the pressure rod and the top of the support rod, and the spring is sleeved on the outer wall of the pressure rod.

[0010] The present invention is further configured as follows: the testing mechanism includes a test slot, the test slot is opened at the top of the base, a top plate is provided on the top of the base, the top plate is located on the top of the test slot, and two groups of test heads are provided on the top of the base, and the two groups of test heads are arranged corresponding to the two groups of main rails.

[0011] The present invention is further configured as follows: a discharge component 1 is provided inside the test slot, the discharge component 1 includes a discharge trough, the discharge troughs are symmetrically arranged, and the two discharge troughs are both opened at the bottom of the base, and the inner wall of the test slot is symmetrically provided with two first discharge troughs, and the two first discharge troughs are respectively connected to the two discharge troughs.

[0012] The present invention is further configured as follows: a second discharge component is provided inside the test slot, the second discharge component includes a box body, the box body is symmetrically arranged, the test head is installed on the top of the box body, the top of the box body is evenly connected to an air pump, the air pump is arranged corresponding to the test head, one side of the box body is connected to a pipeline, and two second discharge slots are symmetrically opened inside the test slot.

[0013] The advantage of the present invention is that by setting up two groups of feeding components and placing different main tracks according to different types of chips, multiple different types of chips can be fed and measured synchronously. If the measurement time of the main track corresponding to a chip is long or an abnormality occurs, the electric valve is energized. At the same time, the angle of the connecting track corresponding to this main track will change, thereby controlling the feeding measurement of this track and stopping the feeding operation. At the same time, the chips on other main tracks continue to be fed and measured and are completely unaffected. By adjusting the extension and contraction speed of the cylinder, the measurement efficiency of the entire device can be changed. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1It is a schematic diagram of the overall structure of the present invention;

[0015] Figure 2 for Figure 1 Schematic diagram of the enlarged structure of area A in the middle;

[0016] Figure 3 for Figure 1 Schematic diagram of the enlarged structure of the middle B area;

[0017] Figure 4 It is a rear view structural schematic diagram of the present invention;

[0018] Figure 5 1 is a schematic structural diagram of a discharging assembly in one embodiment;

[0019] Figure 6 This is a schematic diagram of the horizontal state structure of the plate body in the present invention;

[0020] Figure 7 This is a schematic diagram of the structure of the plate in the tilted state in the present invention;

[0021] Figure 8 Schematic diagram of the structure of the discharging component 2 in one embodiment;

[0022] Figure 9 yes Figure 8 Cross-sectional view cut along the BB direction;

[0023] Figure 10 for Figure 8 Schematic diagram of the structure viewed from above;

[0024] In the figure: 1. base; 2. feeding assembly; 21. bracket; 22. main track; 23. chip; 3. swing assembly; 31. support plate; 32. slider; 33. plate body; 34. first slide; 35. rod body; 36. connecting block; 37. second slide; 38. connecting track; 39. cylinder; 391. slide; 4. locking mechanism; 41. baffle; 42. electric valve; 43. through groove; 5. adjustment mechanism; 51. support rod; 52. pressure rod; 53. spring; 6. testing mechanism; 61. test trough; 62. top plate; 63. test head; 7. discharge assembly one; 71. first discharge trough; 72. discharge trough; 8. discharge assembly two; 81. box body; 82. pipeline; 83. air pump; 84. second discharge trough. DETAILED DESCRIPTION

[0025] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0026] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0027] In the present invention, unless otherwise specified, directions such as "up" and "down" are generally used with respect to the directions shown in the drawings, or with respect to the vertical, perpendicular or gravity directions; similarly, for ease of understanding and description, "left" and "right" are generally used with respect to the left and right shown in the drawings; "inside" and "outside" refer to the inside and outside relative to the outline of each component itself, but the above-mentioned directions are not used to limit the present invention.

[0028] Example 1

[0029] See also Figure 1-7 , the present invention provides the following technical solutions:

[0030] A multi-position parallel testing and sorting device for power management chips includes a base 1. Two groups of feed assemblies 2 are symmetrically installed on the top of the base 1. The feed assembly 2 includes a bracket 21. The bracket 21 is installed on the top of the base 1. Main tracks 22 are evenly installed on the top of the bracket 21. Chips 23 are arranged inside the main tracks 22. There are multiple main tracks 22, and the multiple main tracks 22 are used to transport multiple chips 23.

[0031] A swing assembly 3 is installed on the top of the base 1. The swing assembly 3 includes a support plate 31, which is installed on the top of the base 1. The front surface of the support plate 31 is slidably connected to a rod body 35. A slide groove 391 is provided on the front surface of the support plate 31. A slider 32 is slidably connected inside the slide groove 391. A cylinder 39 is installed on the rear surface of the support plate 31. One end of the rod body 35 passes through one side of the slider 32 and is connected to the piston rod of the cylinder 39. The cylinder 39 is used to push the slider 32 to slide inside the slide groove 391, thereby guiding the slider 32. When the slider 32 slides, it is used to drive the rod body 35 to move above the base 1;

[0032] The outer wall of the rod body 35 is hinged with a plate body 33, and the top of the plate body 33 is evenly provided with a first slide 34, and the first slide 34 is correspondingly arranged with the main rail 22. Both sides of the plate body 33 are evenly connected with connecting blocks 36, and the connecting blocks 36 are correspondingly arranged with the first slide 34. The top of the connecting block 36 is provided with a second slide 37, and the second slide 37 is communicated with the first slide 34. When the rod body 35 is displaced, it drives the plate body 33 to slide above the base 1, and the plate body 33 drives the connecting block 36 to slide. The side of the main rail 22 close to the adjustment mechanism 5 is hinged with a connecting rail 38, and the connecting rail 38 is correspondingly arranged with the main rail 22. When the slider 32 slides to the edge of the slide groove 391, the connecting block 36 will slide to the bottom of a group of feeding components 2, that is, the connecting block 36 slides to the bottom of the corresponding connecting rail 38, and the connecting rail 38 is used to carry the product to be measured;

[0033] The two feeding assemblies 2 are both provided with a locking mechanism 4 on opposite sides thereof. The locking mechanism 4 includes a baffle 41 which is fixedly connected to the end of the connecting track 38 away from the chip 23. An electric valve 42 is provided at the bottom of the connecting track 38. A through slot 43 is provided at the bottom of the connecting track 38. When the chip 23 is carried in the connecting track 38, the baffle 41 intercepts the chip 23 and the electric valve 42 is in a power-off state, causing the chip 23 to be carried in the connecting track 38. That is, when the plate body 33 swings and tilts, the connecting block 36 slides into the through slot 43, thereby lifting the chip 23 in the connecting track 38 and causing it to enter the first slide 34 at the top of the plate body 33 and slide in the first slide 34.

[0034] When the electric valve 42 is powered, the electric valve 42 cannot be opened, causing the connecting block 36 to push the connecting track 38 to swing upward, and the chip 23 in the connecting track 38 cannot be lifted out.

[0035] An adjusting mechanism 5 is installed on one side of the swing assembly 3. The adjusting mechanism 5 is located between the two groups of feeding assemblies 2. The adjusting mechanism 5 includes a support rod 51, which is fixedly connected to the front surface of the support plate 31. A pressure rod 52 is provided on the top of the support rod 51. The bottom of the pressure rod 52 passes through the top of the support rod 51 and extends to the bottom of the support rod 51. A spring 53 is connected between the top of the pressure rod 52 and the top of the support rod 51. The spring 53 is sleeved on the outer side wall of the pressure rod 52. The plate body 33 is on the support The support rod 51 slides downward, and the pressure rod 52 is affected by the elastic force of the spring 53, and its bottom will be pressed on the top of the plate body 33. As the plate body 33 continues to slide, when the pressure rod 52 moves relatively to one side of the top of the plate body 33, the elastic force of the spring 53 will push the side of the plate body 33 that contacts the pressure rod 52 to move downward, while the other side of the plate body 33 will move upward, causing the entire plate body 33 to be tilted. Conversely, when the pressure rod 52 moves relatively to the other side of the top of the plate body 33, the plate body 33 is in a reverse tilted state.

[0036] Two groups of testing mechanisms 6 are installed on the top of the base 1. Both groups of testing mechanisms 6 are located below the two groups of feeding assemblies 2. The testing mechanisms 6 include a testing slot 61. The testing slot 61 is opened on the top of the base 1. A top plate 62 is provided on the top of the base 1. The top plate 62 is located on the top of the testing slot 61. Two groups of testing heads 63 are provided on the top of the base 1. The two groups of testing heads 63 are arranged corresponding to the two groups of main rails 22. When the chip 23 moves to the inside of the first slide 34, the chip 23 will continuously slide along the inclined direction of the plate 33 and fall into the inside of the testing slot 61. As the inclined plate 33 continues to move, the chip 23 falling into the testing slot 61 is pushed to the bottom of the testing head 63, and the testing head 63 tests the chip 23 in the testing slot 61.

[0037] When the test head 63 is testing the chip 23 or the chip 23 is defective, the electric valve 42 remains powered on. When the test head 63 completes the test on the chip 23 or the chip 23 is good, the electric valve 42 remains powered off.

[0038] The interior of the test slot 61 is provided with a discharge component 7, and the discharge component 7 includes a discharge trough 72. The discharge troughs 72 are symmetrically arranged, and two groups of discharge troughs 72 are opened at the bottom of the base 1. The inner wall of the test slot 61 is symmetrically provided with two groups of first discharge troughs 71, and the two groups of first discharge troughs 71 are respectively connected to the two groups of discharge troughs 72. The chip 23 will remain in the test slot 61 after the test is completed by the test head 63. When the plate body 33 again discharges the chip 23 to be tested into the test slot 61 at this position, the plate body 33 pushes the chip 23 to be tested to the bottom of the test head 63, and the chip 23 after the test is completed is affected by the pushing force of the chip 23 to be tested and slides. After the test is completed, the chip 23 will fall into the interior of the first discharge trough 71 through the discharge trough 72, and the staff will separate the good and bad products after the test.

[0039] The principle of this embodiment is as follows: there are multiple main rails 22, and workers place different types of chips 23 inside the multiple main rails 22. The multiple main rails 22 are used to transport multiple types of chips 23. When a chip 23 is transported to the connecting rail 38 for placement, when the connecting rail 38 carries the chip 23, the baffle 41 intercepts the chip 23, and the electric valve 42 is in the power-off state, causing the chip 23 to be carried in the connecting rail 38;

[0040] The cylinder 39 is used to push the slider 32 to slide inside the slide groove 391, thereby guiding the slider 32. When the slider 32 slides, it is used to drive the rod body 35 and the plate body 33 to slide between the base 1 and the support rod 51. The pressure rod 52 is affected by the elastic force of the spring 53, and its bottom is pressed on the top of the plate body 33. As the plate body 33 continues to slide, when the pressure rod 52 moves relatively to the center position of the top of the plate body 33, the plate body 33 is horizontal.

[0041] The plate body 33 continues to move. When the slider 32 slides to the edge of the slide groove 391, the elastic force of the spring 53 pushes the side of the plate body 33 in contact with the pressure rod 52 to move downward, and the other side of the plate body 33 moves upward, causing the plate body 33 to be tilted as a whole. At the same time, one side of the plate body 33 and the corresponding connecting block 36 slide under a group of feeding components 2, that is, the connecting block 36 slides under the corresponding connecting track 38. The cylinder 39 drives the slider 32 to move in the opposite direction. The plate body 33 maintains the tilted state and moves in the opposite direction, causing the plate body 33 to lift the chip 23 in the connecting track 38, and the chip 23 enters the first slide 34 at the top of the plate body 33.

[0042] When the chip 23 moves into the first slide 34, it continues to slide along the inclined direction of the plate 33 and falls into the test slot 61. As the inclined plate 33 continues to move, the chip 23 in the test slot 61 is pushed directly under the test head 63. The test head 63 then tests the chip 23 in the test slot 61. At this time, the corresponding electric valve 42 is energized.

[0043] When the plate 33 moves in the opposite direction, the pressing rod 52 moves relatively to the other side of the top of the plate 33, and the plate 33 is tilted in the opposite direction. The higher side of the plate 33 moves below the connecting track 38 corresponding to the other group of feeding components 2, causing the chips 23 in the connecting track 38 to move to the first slide 34 at the top of the plate 33 for sliding feeding.

[0044] After the chip 23 passes the test head 63 and is tested, it will remain in the test slot 61. When the board 33 again discharges the chip 23 to the test slot 61 at this position, the board 33 pushes the chip 23 to be tested directly under the test head 63. The chip 23 that has been tested slides under the pushing force of the chip 23. The qualified chip 23 that has been tested will fall through the discharge chute 72 into the interior of the first discharge chute 71. The corresponding electric valve 42 is powered off, and the staff can separate the qualified chips after testing.

[0045] When the chip 23 is defective, the corresponding electric valve 42 remains energized and the electric valve 42 cannot be opened, causing the connecting block 36 to push the connecting track 38 to swing upward, and the chip 23 in this connecting track 38 cannot be lifted out, the first slide 34 corresponding to this connecting track 38 cannot feed, and the corresponding test head 63 cannot test the chip 23. After the staff removes the defective product, they restore the power-off state of the electric valve 42. At the same time, the chips 23 on other main tracks 22 continue to be fed and measured and are completely unaffected. By adjusting the extension and retraction speed of the cylinder 39, the measurement efficiency of the entire device can be changed.

[0046] Example 2

[0047] according to Figure 8-10As shown, this embodiment makes the following improvements based on the first embodiment:

[0048] Specifically, the interior of the test slot 61 is provided with a second discharge assembly 8, which includes a box body 81 for storing air. The box body 81 is symmetrically arranged, and the test head 63 is installed on the top of the box body 81. The top of the box body 81 is evenly connected to an air pump 83. The air pump 83 is arranged corresponding to the test head 63. The air pump 83 is used to discharge the air in the box body 81. One side of the box body 81 is connected to a pipe 82. The pipe 82 is used to discharge the air into the box body 81 for storage. The interior of the test slot 61 is symmetrically provided with two second discharge slots 84. The measured chips 23 will be discharged through the second discharge slots 84.

[0049] According to the principle of this embodiment, when the chip 23 is moved to the bottom of the test head 63 for testing, the electric valve 42 is energized, one side of the chip 23 is in a suspended state, and the contact area between the chip 23 and the test slot 61 is larger than the suspended area of ​​the chip 23. After the measurement of multiple chips 23 is completed, the air pump 83 corresponding to the good chip 23 will discharge air, and this air pump 83 blows air to the suspended position of the corresponding chip 23, so that the chip 23 falls from the second discharge slot 84, and the air pump 83 corresponding to the inferior chip 23 will inhale air, and this air pump 83 sucks up the chip 23, and the corresponding electric valve 42 remains energized, causing the main track 22 to stop feeding, and the staff removes the inferior chip 23 and restores the electric valve 42 to the power-off state.

[0050] Obviously, the embodiments described above are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0051] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, tasks, devices, components and / or combinations thereof.

[0052] It should be noted that the terms "first," "second," and the like in the specification and claims of this application and the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein.

[0053] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention are intended to be within the scope of protection of the present invention.

[0054] The above description is merely a preferred embodiment of the present invention. The scope of protection of the present invention is not limited to the above embodiment. All technical solutions based on the concept of the present invention are within the scope of protection of the present invention. It should be noted that for those skilled in the art, various improvements and modifications that do not depart from the principles of the present invention should also be considered within the scope of protection of the present invention.

Claims

1. A multi-position parallel test and sorting device for a power management chip, comprising a base (1), characterized in that: Two groups of feeding assemblies (2) are symmetrically mounted on the top of the base (1), and locking mechanisms (4) are mounted on opposite sides of the two groups of feeding assemblies (2). A swing assembly (3) is mounted on the top of the base (1), and an adjustment mechanism (5) is mounted on one side of the swing assembly (3). The adjustment mechanism (5) is located between the two groups of feeding assemblies (2). Two groups of testing mechanisms (6) are mounted on the top of the base (1), and the two groups of testing mechanisms (6) are located below the two groups of feeding assemblies (2). The feed assembly (2) comprises a bracket (21), the bracket (21) is mounted on the top of the base (1), a main track (22) is evenly mounted on the top of the bracket (21), and a chip (23) is arranged inside the main track (22); The swing assembly (3) includes a support plate (31), the support plate (31) is mounted on the top of the base (1), the front surface of the support plate (31) is slidably connected to a rod body (35), the outer wall of the rod body (35) is hinged to a plate body (33), the top of the plate body (33) is evenly provided with a first slideway (34), the first slideway (34) is arranged corresponding to the main track (22), both sides of the plate body (33) are evenly connected with connecting blocks (36), the connecting blocks (36) are arranged corresponding to the first slideway (34), the top of the connecting block (36) is provided with a second slideway (37), the second slideway (37) is connected to the first slideway (34), the main track (22) is hinged to a connecting track (38) on one side close to the adjustment mechanism (5), the connecting track (38) is arranged corresponding to the main track (22); The front surface of the support plate (31) is provided with a slide groove (391), the interior of the slide groove (391) is slidably connected to a slider (32), and the rear surface of the support plate (31) is provided with a cylinder (39), one end of the rod body (35) passes through one side of the slider (32) and is connected to the piston rod of the cylinder (39); The locking mechanism (4) includes a baffle (41), the baffle (41) is fixedly connected to an end of the connecting track (38) away from the chip (23), an electric valve (42) is installed at the bottom of the connecting track (38), and a through slot (43) is opened at the bottom of the connecting track (38); The adjusting mechanism (5) includes a support rod (51), the support rod (51) is fixedly connected to the front surface of the support plate (31), a pressure rod (52) is provided at the top of the support rod (51), the bottom of the pressure rod (52) passes through the top of the support rod (51) and extends to the bottom of the support rod (51), a spring (53) is connected between the top of the pressure rod (52) and the top of the support rod (51), and the spring (53) is sleeved on the outer wall of the pressure rod (52).

2. The multi-position parallel test and sorting device for a power management chip according to claim 1, characterized in that: The testing mechanism (6) comprises a testing slot (61), the testing slot (61) being opened on the top of the base (1), a top plate (62) being provided on the top of the base (1), the top plate (62) being located on the top of the testing slot (61), and two groups of testing heads (63) being provided on the top of the base (1), the two groups of testing heads (63) being provided correspondingly to the two groups of main rails (22).

3. The multi-position parallel test and sorting device for a power management chip according to claim 2, characterized in that: A discharge assembly (7) is provided inside the test slot (61), and the discharge assembly (7) includes a discharge trough (72). The discharge troughs (72) are symmetrically arranged, and two groups of the discharge troughs (72) are both opened at the bottom of the base (1). Two groups of first discharge troughs (71) are symmetrically opened on the inner wall of the test slot (61), and the two groups of the first discharge troughs (71) are respectively connected to the two groups of discharge troughs (72).

4. The multi-position parallel test and sorting device for a power management chip according to claim 3, characterized in that: The test slot (61) is provided with a second discharge assembly (8), the second discharge assembly (8) includes a box body (81), the box body (81) is symmetrically arranged, the test head (63) is installed on the top of the box body (81), the top of the box body (81) is evenly connected to an air pump (83), the air pump (83) and the test head (63) are arranged correspondingly, one side of the box body (81) is connected to a pipeline (82), and two second discharge slots (84) are symmetrically opened inside the test slot (61).

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