Method for preparing multilayer ceramic capacitor and multilayer ceramic capacitor

Abstract

The present invention relates to a method for preparing a multilayer ceramic capacitor and a multilayer ceramic capacitor. The method and multilayer ceramic capacitor of the present invention provide a capacitance adjustment electrode layer and determine whether to adjust cutting machine parameters and change the cutting position based on the capacitance value obtained after the terminal electrode preparation of a trial-cut multilayer ceramic capacitor sample. Thus, when the capacitance value falls below a predetermined threshold, the capacitance adjustment electrode layer is connected to the capacitance circuit of the multilayer ceramic capacitor to compensate for capacitance loss caused by the printing and lamination processes of the multilayer ceramic capacitor. This overcomes the problem of high rejection rate due to unqualified capacitance values ​​in miniature high-frequency capacitors with a small number of design layers and high capacitance precision requirements, thereby improving the product qualification rate.

Description

Technical Field

[0001] The present invention relates to a manufacturing process for a multilayer ceramic capacitor, and in particular to a preparation method for a multilayer ceramic capacitor and a multilayer ceramic capacitor. Background Art

[0002] Today, ceramic components such as multi-layer ceramic chip capacitors (MLCC) play an important role in fields such as networks, 5G communications, home appliances, automotive electronics, and consumer electronics.

[0003] The manufacturing process of multilayer ceramic capacitors is to stack ceramic dielectric diaphragms with printed inner electrodes in a staggered manner, sinter them at a high temperature once to form a ceramic chip, and then seal the metal layer (outer electrode) at both ends of the chip.

[0004] As ceramic capacitors develop towards smaller sizes, the internal electrode area is getting smaller and smaller. Slight errors caused by the printing process lead to more serious deviations from the designed area. Slight misalignment of the two internal electrode stacks will also seriously affect the facing area between the internal electrodes. This often leads to a high scrap rate for miniature high-frequency capacitors with a small number of design layers and high capacitance accuracy requirements due to unqualified capacitance. Summary of the Invention

[0005] Based on this, the object of the present invention is to provide a method for preparing a multilayer ceramic capacitor and a multilayer ceramic capacitor.

[0006] By setting a capacity adjustment electrode layer and determining whether to adjust the cutting machine parameters to change the cutting position based on the capacitance value obtained after the terminal electrode preparation of the trial-cut multilayer ceramic capacitor sample, the capacity adjustment electrode layer can be connected to the capacity circuit of the multilayer ceramic capacitor when the capacitance value is lower than a predetermined threshold value to compensate for the capacity loss caused by the multilayer ceramic capacitor in the printing and lamination processes.

[0007] The present invention is achieved through the following scheme:

[0008] In a first aspect, the present invention provides a method for preparing a multilayer ceramic capacitor, comprising the following steps:

[0009] S1: providing a plurality of first ceramic diaphragms, a plurality of second ceramic diaphragms and at least one third ceramic diaphragm, wherein a first capacity electrode layer is printed on the first ceramic diaphragm, a second capacity electrode layer is printed on the second ceramic diaphragm, and

[0010] A capacity adjustment electrode layer is printed on the third ceramic diaphragm;

[0011] 5S2: Alternately stacking a plurality of the first ceramic diaphragms and a plurality of the second ceramic diaphragms to obtain a stacked substrate;

[0012] S3: stacking the third ceramic diaphragm on and / or below the stacked substrate and pressing them together to obtain a stacked body;

[0013] S4: cutting one of the stacked bodies in whole or in part along the first cutting line in the longitudinal direction of the inner electrode and in the transverse direction of the inner electrode width, debinding, and sintering to obtain a plurality of ceramic body samples;

[0014] S5: chamfering and grinding the plurality of ceramic body samples;

[0015] S6: separating the plurality of ground ceramic body samples from the grinding media and ceramic debris, and attaching two external electrodes to the left and right ends of each of the ground ceramic body samples to obtain a plurality of multilayer ceramic capacitor samples, wherein the capacitance adjustment electrode layer does not contact the external electrodes;

[0016] S7: Measure the capacitance of the multilayer ceramic capacitor sample to determine whether the capacitance of the multilayer ceramic capacitor sample is lower than a predetermined threshold value. If so, adjust the cutting machine parameters of the other stacked bodies, change the longitudinal cutting position, cut according to the second cutting line, and then remove the glue and sinter. After changing the cutting position, one side of the capacitance adjustment electrode layer of the multilayer ceramic capacitor is exposed to one end of the ceramic body so as to contact one of the external electrodes.

[0017] Furthermore, in step S7, measuring the capacitance of the multilayer ceramic capacitor sample to determine whether the capacitance of the multilayer ceramic capacitor sample is lower than a predetermined threshold value includes the following steps:

[0018] Measuring the capacitance of each of the multilayer ceramic capacitor samples respectively, and obtaining an average capacitance value of the plurality of multilayer ceramic capacitor samples;

[0019] It is determined whether the average value is lower than a predetermined threshold.

[0020] Furthermore, the first cutting line is misaligned with the capacity adjustment electrode layer. In step S7, the capacity adjustment electrode layer is cut along the second cutting line after the cutting position is changed by adjusting cutting machine parameters.

[0021] Furthermore, a first facing area is defined between the capacity adjustment electrode layer and the adjacent first capacity electrode layer or the adjacent second capacity electrode layer, and a second facing area is defined between the first capacity electrode layer and the second capacity electrode layer, and the first facing area is smaller than the second facing area.

[0022] Furthermore, the capacity adjustment electrode layer, the first capacity electrode layer and the second capacity electrode layer are partially opposite to each other in the length direction.

[0023] In a second aspect, the present invention provides a multilayer ceramic capacitor, comprising a ceramic body and two external electrodes respectively disposed at left and right ends of the ceramic body, the ceramic body comprising a capacity-forming layer and a capacity-adjusting layer stacked above and / or below the capacity-forming layer, wherein the capacity-forming layer comprises a plurality of alternately stacked first and second ceramic diaphragms, the capacity-adjusting layer comprises a third ceramic diaphragm, and a first capacity electrode layer is printed on the first ceramic diaphragm, a second capacity electrode layer is printed on the second ceramic diaphragm, and a capacity-adjusting electrode layer is printed on the third ceramic diaphragm;

[0024] The first capacity electrode layer is connected to one of the external electrodes, the second capacity electrode layer is connected to the other external electrode, and the capacity adjustment electrode layer is connected to or disconnected from one of the external electrodes. When connected, the first capacity electrode layer forms a capacity with the adjacent first capacity electrode layer or the adjacent second capacity electrode layer.

[0025] Furthermore, a first facing area is defined between the capacity adjustment electrode layer and the adjacent first capacity electrode layer or the adjacent second capacity electrode layer, and a second facing area is defined between the first capacity electrode layer and the second capacity electrode layer, and the first facing area is smaller than the second facing area.

[0026] Furthermore, the capacity adjustment electrode layer, the first capacity electrode layer and the second capacity electrode layer are partially opposite to each other in the length direction.

[0027] Furthermore, the thickness of the first capacity electrode layer, the second capacity electrode layer and the capacity adjustment electrode layer is 1 to 6 microns.

[0028] Furthermore, the thickness of the first ceramic diaphragm, the second ceramic diaphragm and the third ceramic diaphragm is 1 to 300 microns.

[0029] A method for preparing a multilayer ceramic capacitor described in an embodiment of the present invention comprises stacking a third ceramic diaphragm above or below a stacked substrate obtained by alternately stacking a plurality of first ceramic diaphragms and a plurality of second ceramic diaphragms, and not incorporating a capacity adjustment electrode layer printed on the third ceramic diaphragm into the capacity of the multilayer ceramic capacitor sample when cutting a preliminary sample, and measuring the capacity of the multilayer ceramic capacitor sample obtained after the preliminary cutting. If the capacity is detected to be lower than a predetermined threshold, it indicates that the facing area between the first capacity electrode layer and the second capacity electrode layer printed respectively on the first ceramic diaphragm and the second ceramic diaphragm deviates from a preset value. The present invention provides a capacity adjustment electrode layer and changes the cutting position in the length direction, so that after cutting other products after the cutting position is changed, the capacity adjustment electrode layer printed on the third ceramic diaphragm is incorporated into the capacity of the multilayer ceramic capacitor, thereby increasing the capacity of the multilayer ceramic capacitor, overcoming the problem of a high scrap rate due to unqualified capacitance of micro high-frequency capacitors with a small number of design layers and high capacitance accuracy requirements, and improving the product qualification rate.

[0030] For better understanding and implementation, the present invention is described in detail below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 Flowchart of a method for preparing a multilayer ceramic capacitor according to an embodiment of the present invention;

[0032] Figure 2 is a schematic diagram of a laminated substrate in the length direction of the inner electrode according to an embodiment of the present invention;

[0033] Figure 3 A schematic diagram of a laminate substrate in the width direction of an inner electrode according to an embodiment of the present invention;

[0034] Figure 4 is a schematic diagram of a stacked body according to an embodiment of the present invention in the length direction of the inner electrode;

[0035] Figure 5 Schematic diagram of cutting along a first cutting line 51 in the length direction of the inner electrode according to an embodiment of the present invention;

[0036] Figure 6 Schematic diagram of cutting along the second cutting line 52 in the length direction of the inner electrode according to an embodiment of the present invention;

[0037] Figure 7 Schematic diagram of the structure of a multilayer ceramic capacitor according to an embodiment of the present invention. DETAILED DESCRIPTION

[0038] The following are specific embodiments of the present invention and the accompanying drawings to further describe the technical solutions of the present invention, but the present invention is not limited to these embodiments.

[0039] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0040] It should be noted that when an element is referred to as being “fixed to” another element, it may be directly on the other element or there may be an intermediate element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or there may be an intermediate element at the same time.

[0041] In view of the technical problems in the background technology, the present invention provides a method for preparing a multilayer ceramic capacitor, such as Figure 1 As shown, the method includes the following steps:

[0042] S1: Provide multiple first ceramic diaphragms, multiple second ceramic diaphragms and at least one third ceramic diaphragm, wherein the first ceramic diaphragm is printed with a first capacity electrode layer, the second ceramic diaphragm is printed with a second capacity electrode layer, and the third ceramic diaphragm is printed with a capacity adjustment electrode layer.

[0043] The first, second, and third ceramic diaphragms are dielectric diaphragms that are formed by printing an internal electrode slurry onto the ceramic diaphragms using a printing screen according to a preset internal electrode pattern, thereby printing an internal electrode pattern in the printed area of ​​the ceramic diaphragms. The first capacity electrode layer is the internal electrode printed on the first ceramic diaphragm, the second capacity electrode layer is the internal electrode printed on the second ceramic diaphragm, and the capacity adjustment electrode layer is the internal electrode printed on the third ceramic diaphragm.

[0044] S2: Alternately stacking a plurality of the first ceramic diaphragms and a plurality of the second ceramic diaphragms to obtain a stacked substrate.

[0045] The first ceramic diaphragm and the second ceramic diaphragm are stacked in an alternating manner, such as Figure 2 and Figure 3 As shown, Figure 2 Schematic diagram of a laminated substrate with internal electrodes in the length direction. Figure 3 is a schematic diagram of a laminated substrate with internal electrodes in the width direction, Figure 2 and Figure 3It can be seen that the first ceramic diaphragms 10 and the second ceramic diaphragms 20 are alternately stacked in sequence, and the first capacity electrode layer 11 and the second capacity electrode layer 21 are offset in the length direction. In the length direction, the first capacity electrode layer 11 and the second capacity electrode layer 12 are partially opposite.

[0046] In the present invention, facing refers to the projection covering in the vertical direction. The first ceramic diaphragm and the second ceramic diaphragm can be multiple, Figure 2 and Figure 3 In the example, the number of the first ceramic diaphragm and the number of the second ceramic diaphragm are both three.

[0047] S3: stacking the third ceramic diaphragm on and / or below the stacked substrate and pressing them together to obtain a stacked body.

[0048] The third ceramic diaphragm can be stacked above or below the laminated substrate. In some examples, the third ceramic diaphragm is stacked above and below the laminated substrate. Figure 4 In the example of FIG, the distance is described by taking the third ceramic diaphragm 30 stacked on the laminate substrate as an example.

[0049] like Figure 4 As shown, the capacity adjustment electrode layer 31 is also stacked alternately with the first capacity electrode layer and the second capacity electrode layer. Preferably, the first capacity electrode layer 11 and the second capacity electrode layer 21 have the same length, while the capacity adjustment electrode layer 31 is shorter than the first capacity electrode layer 11 and the second capacity electrode layer 21. Figure 4 As shown, preferably, the projection area of ​​the capacity adjustment electrode layer 31 in the vertical direction completely falls into the first capacity electrode layer 11 it faces, thereby facilitating cutting.

[0050] S4: cutting one of the stacked bodies in whole or in part along the longitudinal direction of the inner electrode and along the first cutting line in the transverse direction of the inner electrode width, and then debinding and sintering to obtain a plurality of ceramic body samples.

[0051] like Figure 5 , which is a schematic diagram of cutting along a first cutting line 51 in one embodiment. When cutting along the first cutting line 51, the first capacity electrode layer 11 and the second capacity electrode layer 21 are severed in the length direction, so that the first capacity electrode layer 11 and the second capacity electrode layer 21 can be exposed at the left and right ends of the ceramic main body sample.

[0052] The general sintering temperature is between 900℃ and 1350℃.

[0053] S5: chamfering and grinding the plurality of ceramic body samples.

[0054] The ceramic body sample, after being sintered into porcelain, has sharp edges and corners, which are not conducive to connection with external electrodes. Therefore, grinding and chamfering are required. The chamfering process involves placing the capacitor, water, and grinding media in a chamfering tank. Through ball milling, planetary milling, etc., the surface burrs of the ceramic body sample are removed, making the surface of the ceramic body sample smooth. At the same time, the internal electrode on the end face is fully exposed for connection with the external electrode.

[0055] S6: sorting out the plurality of ground ceramic main body samples from the grinding media and ceramic debris, and attaching two external electrodes to the left and right ends of each of the ground ceramic main body samples to obtain a plurality of multilayer ceramic capacitor samples, wherein the capacity adjustment electrode layer does not contact the external electrodes.

[0056] In the embodiment of the present application, when cutting along the first cutting line 51, the cutting line does not cut the capacity adjustment electrode layer 31 in the length direction and maintains a certain distance from the capacity adjustment electrode layer 31, so that after chamfering and grinding, the capacity adjustment electrode layer 31 will not be exposed from the left and right ends of the ceramic body, and thus will not be connected to the external electrode.

[0057] S7: Measure the capacitance of the multilayer ceramic capacitor sample to determine whether the capacitance of the multilayer ceramic capacitor sample is lower than a predetermined threshold value. If so, adjust the cutting machine parameters of the other stacked bodies to change the longitudinal cutting position to the second cutting line 52 for cutting, followed by debinding and sintering. The cutting position of the second cutting line 52 is such that the capacitance adjustment electrode layer of the multilayer ceramic capacitor contacts one of the external electrodes.

[0058] In the embodiments of the present application, after a multilayer ceramic capacitor sample with external electrodes is produced during the cutting process, the capacitance of the resulting multilayer ceramic capacitor sample is first measured and compared to a predetermined threshold. If the capacitance is less than the predetermined threshold, this indicates a deviation in the facing area between the first capacitance electrode layer 11 and the second capacitance electrode layer 21. This deviation may be due to the accuracy of the printing screen or jagged edges in the printed image, resulting in the printed area of ​​the two electrodes deviating from the designed area. It may also be caused by a deviation in the stacking alignment accuracy between the first ceramic diaphragm 10 and the second ceramic diaphragm 20.

[0059] Preferably, the capacitance of each multilayer ceramic capacitor sample is measured separately, and an average capacitance value of the plurality of multilayer ceramic capacitor samples is obtained. Then, it is determined whether the average capacitance value is lower than a predetermined threshold value, thereby determining whether there is a large deviation in the facing area between the first capacity electrode layer 11 and the second capacity electrode layer 21.

[0060] For example, assuming that the target center value of the capacitance is 1 pF, the deviation is allowed to be ±0.25 pF; if the average value obtained after the first cutting line 51 is cut in the normal position and is lower than the predetermined threshold value of 0.85 pF, Figure 6 As shown, in the subsequent cutting process of the present invention, by adjusting the cutting machine parameters, the other stacked bodies are cut at the new cutting position along the second cutting line 52, and then the binder is removed and sintered. The second cutting line 52 cuts the first capacity electrode layer 11, the second capacity electrode layer 21, and the capacity adjustment electrode layer 31 in the length direction, so that after chamfering and attaching external electrodes at the left and right ends, the capacity adjustment electrode layer 31 can contact one of the external electrodes, thereby forming capacitance with the adjacent first capacity electrode layer 11 or second capacity electrode layer 21, thereby increasing the capacitance of the multilayer ceramic capacitor.

[0061] In addition, if Figure 6 As shown, although the cutting positions change when cutting along the second cutting lines 52 compared to cutting along the first cutting lines 51 , the areas of the first and second capacitance electrode layers 11 and 21 and the area facing each other in a single multilayer ceramic capacitor do not change.

[0062] A method for preparing a multilayer ceramic capacitor described in an embodiment of the present invention comprises stacking a third ceramic diaphragm above or below a stacked substrate obtained by alternately stacking a plurality of first ceramic diaphragms and a plurality of second ceramic diaphragms, and not incorporating a capacity adjustment electrode layer printed on the third ceramic diaphragm into the capacity of the multilayer ceramic capacitor sample when cutting a preliminary sample, and measuring the capacity of the multilayer ceramic capacitor sample obtained after the preliminary cutting. If the capacity is detected to be lower than a predetermined threshold, it indicates that the facing area between the first capacity electrode layer and the second capacity electrode layer printed respectively on the first ceramic diaphragm and the second ceramic diaphragm deviates from a preset value. The present invention provides a capacity adjustment electrode layer and changes the cutting position in the length direction, so that after cutting other products after the cutting position is changed, the capacity adjustment electrode layer printed on the third ceramic diaphragm is incorporated into the capacity of the multilayer ceramic capacitor, thereby increasing the capacity of the multilayer ceramic capacitor, overcoming the problem of a high scrap rate due to unqualified capacitance of micro high-frequency capacitors with a small number of design layers and high capacitance accuracy requirements, and improving the product qualification rate.

[0063] In an optional embodiment, the capacity adjustment electrode layer has a first facing area with the adjacent first capacity electrode layer or the adjacent second capacity electrode layer, and the first capacity electrode layer has a second facing area with the second capacity electrode layer, and the first facing area is smaller than the second facing area. The capacity adjustment electrode layer, the first capacity electrode layer, and the second capacity electrode layer partially face each other in the length direction.

[0064] Preferably, the thickness of the first capacity electrode layer 11, the second capacity electrode layer 21 and the capacity adjustment electrode layer 31 is 1 to 6 micrometers. The thickness of the first ceramic diaphragm 10, the second ceramic diaphragm 20 and the third ceramic diaphragm 30 is 1 to 300 micrometers.

[0065] Corresponding to the above-mentioned method for preparing a multilayer ceramic capacitor, the present invention further provides a multilayer ceramic capacitor, which can be prepared by the above-mentioned method for preparing a multilayer ceramic capacitor.

[0066] like Figure 7 As shown, in one embodiment, the multilayer ceramic capacitor 600 includes a ceramic body and two external electrodes 640 respectively provided at the left and right ends of the ceramic body. The ceramic body includes a capacity-forming layer and a capacity-adjusting layer stacked above and / or below the capacity-forming layer. The capacity-forming layer includes a plurality of alternately stacked first ceramic diaphragms 611 and second ceramic diaphragms 621. The capacity-adjusting layer includes a third ceramic diaphragm 631. A first capacity electrode layer 612 is printed on the first ceramic diaphragm 611, a second capacity electrode layer 622 is printed on the second ceramic diaphragm 621, and a capacity-adjusting electrode layer 632 is printed on the third ceramic diaphragm 631.

[0067] The first capacity electrode layer 612 is connected to one of the external electrodes 640 , the second capacity electrode layer 622 is connected to the other external electrode 640 , and the capacity adjustment electrode layer 632 is connected to one of the external electrodes. The capacity adjustment electrode layer 632 forms a capacitor with the adjacent first capacity electrode layer 612 or the adjacent second capacity electrode layer 622 .

[0068] In other examples, the capacity adjustment electrode layer 632 may not be connected to any external electrode.

[0069] Preferably, a first facing area exists between the capacity adjustment electrode layer 632 and the adjacent first capacity electrode layer 612 or the adjacent second capacity electrode layer 622 , and a second facing area exists between the first capacity electrode layer 612 and the second capacity electrode layer 622 , and the first facing area is smaller than the second facing area.

[0070] Preferably, the capacity adjustment electrode layer 632 , the first capacity electrode layer 612 , and the second capacity electrode layer 622 are partially opposite to each other in the length direction and completely opposite to each other in the width direction.

[0071] Preferably, the thickness of the first capacity electrode layer 612 , the second capacity electrode layer 622 and the capacity adjustment electrode layer 632 is 1 to 6 microns.

[0072] Preferably, the thickness of the first ceramic diaphragm 611 , the second ceramic diaphragm 621 and the third ceramic diaphragm 631 is 1 to 300 microns.

[0073] In an optional embodiment, protective layers 650 are provided at the upper and lower ends of the ceramic body respectively. Preferably, the protective layer 650 is made of the same material as the first ceramic diaphragm 611 , the second ceramic diaphragm 621 and the third ceramic diaphragm 631 .

[0074] The above-described embodiments merely represent several implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make numerous modifications and improvements without departing from the spirit of the present invention, and the present invention is intended to encompass such modifications and variations.

Claims

1. A method for preparing a multilayer ceramic capacitor, characterized in that: The following steps are involved: S1: Providing a plurality of first ceramic diaphragms, a plurality of second ceramic diaphragms, and at least one third ceramic diaphragm, wherein a first capacity electrode layer is printed on the first ceramic diaphragm, a second capacity electrode layer is printed on the second ceramic diaphragm, and a capacity adjustment electrode layer is printed on the third ceramic diaphragm, wherein the first capacity electrode layer and the second capacity electrode layer have the same length, and the capacity adjustment electrode layer has a shorter length than the first capacity electrode layer and the second capacity electrode layer; S2: alternately stacking a plurality of the first ceramic diaphragms and a plurality of the second ceramic diaphragms to obtain a stacked substrate, wherein the first capacity electrode layer and the second capacity electrode layer in the stacked substrate are staggered so that the first capacity electrode layer is partially opposite to the adjacent second capacity electrode layer; S3: stacking the third ceramic diaphragm above and / or below the stacked substrate and pressing them together to obtain a stacked body, wherein each capacity adjustment electrode layer is partially aligned with an adjacent first capacity electrode layer or an adjacent second capacity electrode layer in a length direction; S4: cutting one of the stacked bodies in whole or in part along the first cutting line in the longitudinal direction of the inner electrode and in the transverse direction of the inner electrode width, debinding, and sintering to obtain a plurality of ceramic body samples; S5: chamfering and grinding the plurality of ceramic body samples; S6: separating the plurality of ground ceramic body samples from the grinding media and ceramic debris, and attaching two external electrodes to the left and right ends of each of the ground ceramic body samples to obtain a plurality of multilayer ceramic capacitor samples, wherein the capacitance adjustment electrode layer does not contact the external electrodes; S7: Measure the capacitance of the multilayer ceramic capacitor sample to determine whether the capacitance of the multilayer ceramic capacitor sample is lower than a predetermined threshold value. If so, adjust the cutting machine parameters of the other stacked bodies, change the longitudinal cutting position, cut according to the second cutting line, and then remove the glue and sinter. After changing the cutting position, one side of the capacitance adjustment electrode layer of the multilayer ceramic capacitor is exposed to one end of the ceramic body so as to contact one of the external electrodes. Compared with cutting according to the first cutting line, after cutting according to the second cutting line, the area of ​​the first capacitance electrode layer and the area of ​​the second capacitance electrode layer, as well as the facing area between the first capacitance electrode layer and the second capacitance electrode layer, do not change.

2. The method for preparing a multilayer ceramic capacitor according to claim 1, wherein: In step S7, the capacitance of the multilayer ceramic capacitor sample is measured to determine whether the capacitance of the multilayer ceramic capacitor sample is lower than a predetermined threshold, including the following steps: Measuring the capacitance of each of the multilayer ceramic capacitor samples respectively, and obtaining an average capacitance value of the plurality of multilayer ceramic capacitor samples; It is determined whether the average value is lower than a predetermined threshold.

3. The method for preparing a multilayer ceramic capacitor according to claim 1, wherein: The first cutting line is misaligned with the capacity adjustment electrode layer. In step S7, the capacity adjustment electrode layer is cut along the second cutting line after the cutting position is changed by adjusting cutting machine parameters.

4. The method for preparing a multilayer ceramic capacitor according to claim 1, wherein: A first facing area is defined between the capacity adjustment electrode layer and the adjacent first capacity electrode layer or the adjacent second capacity electrode layer, and a second facing area is defined between the first capacity electrode layer and the second capacity electrode layer, wherein the first facing area is smaller than the second facing area.

5. A multilayer ceramic capacitor manufactured by the method according to claim 1, comprising a ceramic body and two external electrodes respectively provided at left and right ends of the ceramic body, characterized in that: The ceramic body includes a capacity-forming layer and a capacity-adjusting layer stacked above and / or below the capacity-forming layer, wherein the capacity-forming layer includes a plurality of alternately stacked first and second ceramic diaphragms, and the capacity-adjusting layer includes a third ceramic diaphragm. A first capacity electrode layer is printed on the first ceramic diaphragm, a second capacity electrode layer is printed on the second ceramic diaphragm, and a capacity-adjusting electrode layer is printed on the third ceramic diaphragm. The first capacity electrode layer and the second capacity electrode layer are staggered so that the first capacity electrode layer and the adjacent second capacity electrode layer are partially aligned in the length direction. The first capacity electrode layer is connected to one of the external electrodes, the second capacity electrode layer is connected to the other external electrode, and the capacity adjustment electrode layer is connected to or disconnected from one of the external electrodes. When connected, the first capacity electrode layer and the adjacent second capacity electrode layer form a capacity, and the capacity adjustment electrode layer and the adjacent first capacity electrode layer or the adjacent second capacity electrode layer form a capacity. A first facing area is defined between the capacity adjustment electrode layer and the adjacent first capacity electrode layer or the adjacent second capacity electrode layer, and a second facing area is defined between the first capacity electrode layer and the second capacity electrode layer, and the first facing area is smaller than the second facing area.

6. The multilayer ceramic capacitor according to claim 5, wherein: The capacity adjustment electrode layer, the first capacity electrode layer, and the second capacity electrode layer are partially opposite to each other in the length direction.

7. The multilayer ceramic capacitor according to claim 6, wherein: The thickness of the first capacity electrode layer, the second capacity electrode layer and the capacity adjustment electrode layer is 1 to 6 micrometers.

8. The multilayer ceramic capacitor according to claim 6, wherein: The thickness of the first ceramic diaphragm, the second ceramic diaphragm and the third ceramic diaphragm is 1 to 300 microns.

Images